with regard to SRF Technology
Transcript of with regard to SRF Technology
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Fundamentals of Cryogenicand Module Engineering
Bernd PetersenDESY Cryogenic Group MKS
Hamburg, Germany
Some
with regard to SRF Technology
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Overview
• First part: Some theory• Second part: More practical aspects
(cryomodule design considerations)
TooToo muchmuch itemsitems…….. and still .. and still incompleteincomplete……....
ButBut letlet‘‘ss seesee howhow far far wewe cancan proceedproceed………………
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My sources:
• LINDEKRYOTECHNIK AG Switzerland, H.Herzog• AERZEN Compressors Germany• AIR LIQUIDE France• WEKA Valves Switzerland• VDI-Seminars Germany• AD-Pressure-Vessel-Code• ASME Code• My colleagues from INFN, FNAL, Cornell-University, J-
LAB, KEK, BESSY, DESY and Steve van Sciver• others
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First part: tutorial objectivesafter this part, we should remember:
• The meaning of ‚cryogeniccryogenic‘• Carnot refrigerator efficiency• ‚COPCOP‘ of a refrigerator• Some Helium refrigerator cycles• Some ‚quantum properties‘ of matter at low
temperatures• Some useful Helium II properties• Some typical cooling cycles• Some fundamentals of thermal insulation
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Cryogenic FundamentalsWhy is ‚Cryogenic‘ separated from ‚usual‘ cooling engineering ?
Use of ‚conventional‘ superconductors like Nb requires cooling
at liquid helium temperatures
Due to basic thermodynamic laws, the efficiency of refrigerators is quite low at these temperatures (‚Carnot cycle‘) – the cooling is very expensive !
-> excellent thermal insulation is required
-> refrigerators should work very efficient to come closer to the Carnot cycle
-> we have to deal with ‚quantum properties‘ of matter at these temperatures:
decrease of specific heat, heat transfer, superconductivity, superfluidity……
-> helium is the only coolant ( low heat of vaporization, leak tightness, purification techniques….)
-> careful engineering is needed: choice of materials, welding procedures, quality control, pressure vessel code requirements……..
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Definition: ‚CRYOGENIC‘
Traditional (you can find in textbooks) : T < 120 K
[My personal view: T < 77 K ( LN2 cooling is no ‚real‘ cryogenic)]
Physicist view : temperatures were characteristic quantum states of matter dominate ( Cp -> 0, Helium II, conventional superconductivity…..)
HERE: The engineering, which is required to specify, design, construct and operate cooling systems and cryostats for superconducting RF cavities at liquid Helium temperatures.
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Basic laws of thermodynamics
1. Energy conservation
2. Entropy can never decrease spontaneously in a closed system: 0 ≤ Δ S - corresponds to
‚‚TheThe CarnotCarnot CycleCycle isis thethe mostmost efficientefficient cyclecycle thatthatexistexist‘‘
3. S -> 0 for T -> 0 for an ideal crystal
correspondscorresponds to to CpCp --> 0> 0(Engineers forget zero-point energy)
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Carnot Refrigeration Cycle
Q LOW = T 1 ( S 2 – S 1 )
Q HIGH =T 2 ( S 2 – S 1 )
Cryo LoadW IN
W OUT
1
23
4 Q LOW
W = W IN – W OUT
Entropy S
T
1
23
4
COP = Coefficient of Performance = 1/ η Carnot
η Carnot =Useful Refrigeration
Work Input=
Q LOW
Q HIGH - Q LOW =
T 1
T 2 – T 1
HEX T2
T1
S2S1
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Sources of Irreversibility
Carnot Cycle(B.Ziegler, LINDE)
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Some Refrigerator COPs
3320740 K
36220795 K
178701492 K
% CarnotXFEL-SpecREAL WORLD
Carnot 1/ηIDEAL
WORLD
RefrigerationTemperature
1 W useful refrigeration at 2 K = 870 W Primary Power !!!
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Coefficient of PerformanceCOP vs T
0200400600800
10001200
0 10 20 30 40
Temperature [K]
CO
P
COP at Low T
0200400600800
10001200
1.5 1.7 1.9 2.1
Temperature [K]
CO
P
measured LHC value at 1.8 K
COPreal=1/( K * η CARNOT)
η CARNOT = T/(300 -T)
K= 0.176 ( from latest LHC measurements at 1.8 K)
TMR
JLab
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Why do we care about COPs ?
Cooling at liquid helium temperatures T < 5 K is veryexpensive !
Large SRF facilities (JLAB,SNS, ERLs, XFEL,ILC…..) need Megawatts of primary power supply.
Excellent thermal insulation is mandatory !
Already at about T> 40 K the situation is muchmore relaxed !
-> Direct heat loads as much as possible to temperature levels above 40 K ( Radiation, HOM-loads, solid state thermal conduction…..)
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Simple LINDE cycle
load
HEX
JT
IdealIdeal Joule-Thomson Expansion = Isenthalpic Expansion Δ H=0 Joule-Thomson
Valve
Heat Exchanger
Compressor
S
H
Some Helium Refrigerator Cycles
Will Will thisthis workworkforfor Helium ?Helium ?
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Joule-Thomson Expansion: Inversion Curve
= 40 K for HELIUM
cooling
H = const
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Simple Claudet Cycle
load
HEX
HEX
HEX
JT
Expansion
Machine
(Turbine)
S
H
IdealIdeal Turbine Expansion = Isentropic Expansion Δ S=0
Some Helium Refrigerator Cycles
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Simple Collins Cycle
load
HEX
HEX
HEX
JT
Expansion
Machine
(Turbine)
LN2
Some Helium Refrigerator Cycles
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Simplified 4.5 K Helium Refrigerator + Shield Cooling
4.5 K load
HEX
HEX
HEX
JT
40/80 K load
Some Helium Refrigerator Cycles
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EXAMPLE:
HERA Cryo Plant
T-s Diagramm
of cryogenic processSource:
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Example: HERA Cryo Plant
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Inside HERA Cold Boxes
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Cryogenic Turboexpander
Source: LINDEKRYOTECHNIK AG
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Screw-Compressors
Source:
AERZEN
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HERA-Screw Compressors
LP + MP HP
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‚Choice of operation temperaturefor a sc cavity‘
Module 6 CMTBMeas Qo/Eacc average gradient 10Hz 500/800us
Status:13-Mar-07 Esch/Kos/Lil/Lan MKS
1.00E+10
1.50E+10
2.00E+10
2.50E+10
3.00E+10
0 5 10 15 20 25 30 35Eacc [MV/m]
Qo
2.0 K
1.8 K
1.6 K
Eacc[MV/m]
Qo
Qo versus Eacc measurement for a complete TTF-cryomodule type III
(similar to XFEL-prototype)
(Courtesy of R.Lange et al. DESY MKS)
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Simplified 2 K Helium Refrigerator + Shield Cooling
4.5 K load
HEX
HEX
HEX
JT
40/80 K load
P cc out T cc out
Cold Compressors
P cc in T cc in
T bath = f ( P bath )
P bath
PrimaryPrimary PowerPower
HEXJT
JTsubcooler
2 K load
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The 20-year old HERA cryogenic plant will be up-gradedto the 2 K- XFEL-cryogenic plant
2 HERA –Cold-Boxes modifiedand operated in parallel
2K Box incl. Cold compressors added
Source: LINDE KRYOTECHNIK AG
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Options to Produce Temperatures below 4.4 K, i. e. Evaporation of Helium at Reduced Pressures
A B C DOnly the heat of evaporation of thehelium is utilized.
The low pressure streamis warmed up in a heatexchanger inside the
refrigerator cold box.
The cold low pressurestream is precompressedby a coldcompressor.
The precompression isrealized by severalstages of coldcompression.
EfficiencyEfficiency --> > --> > -->>
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Option A example:warm helium compressors for FLASH-
linac/TTF supply at DESY4 rotary vane pumps + 3 stages of roots blowers10 g/s helium flow compression: 10 mbar -> 1.05 bar( two identical sets of compressors for linac and TTF)
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Option B: use of heat exchangerExample: FLASH linac at DESY
External low pressure heat exchanger ( IHEP,Russia)counter-flow heat exchanger:
3,5 K / 31 mbar -> 280 K / 29 mbar7,5 K / 12 bar <- 300 K / 12 bar
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Option C/DExample: TESLA Model Refrigerator
• layout by TU-Dresden
• advice from CERN
• discussion with industry
– component number and size, flow rates, power consumption
• flow scheme
• 8 screw compressors
• 9 turbines
• 3 cold compressors
5 - 8 KShield
40 - 80 KShield
2 K Load
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Example of a cold compressorwith active magnetic bearingsused at Tore Supra, CEBAF and Oak Ridge
Source: Air Liquide
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The four-stage LHC cold compressors1st stage
Cold Compressor Cartridges of 2.4 kW @ 1.8 K Refrigeration Units
IHI-LindeCold compressor impeller
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Development of the Efficiency of Cold Compressors
0
10
20
30
40
50
60
70
80
1985 1993 2000Year of construction
Isen
trop
ic e
ffici
ency
[%]
Tore Supra
CEBAF
LHC
12
12'is HH
HHη−−=
Tem
pera
ture
(T)
Entropy (s)
P1
P2
1
2
2'
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‚Quantum Properties‘ of Matter at low T
Many physical effects can be characterized by a typical ExcitationEnergy ΔE
The probability of excitation is about ~ EXP ( - ΔE / kB T)
For T -> ∞ all states are excited.
For T -> 0 condensation in the ground state
ΔE = binding energy -> condensation of matter , liquifaction of gases
ΔE = h ω phonons in solids -> specific heat, thermal conductivity
ΔE = superconducting energy gap -> superconductivity
ΔE = band gap of semiconductors -> electrical resistance
Other effects are not disturbed by thermal energy at low T like:
Helium II phenomena (Bose condensation), Kapitza-Effect,…
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Measurement of the superconducting surface resistance at 3 GHz
Nb/Cu : reduction of Rsby nearly 6 orders of magnitude
That‘s why we have this SRF workshop…..
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Quantum Properties of Matter at Low TemperaturesSpecific Heat of Solids
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Thermal conductivity of copperThermal conductivity
Glas fiber re-inforced epoxid
Thermal Conductivity of Solids at Cryogenic Temperatures
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Thermal contraction of solids
Thermal Stress
77K
Steel 0,3%
Plastics > 2%
Δ L/L
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Other View: H-S-Diagramm of Helium (Source: HEPAK)
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Quantum Properties of Matter at low TSpecific Heat of liquid HELIUM
Much larger than specificheat of solids at thesetemperatures !
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Quantum Properties of Matter at low TLatent Heat and Entropy of liquid HELIUM
Phase Transition HE I -> HE II ‚second kind‘ phase transition
( no latent heat )
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Helium II parameters = f(T) Helium Parameters vs. Temperature
0
5
10
15
20
25
1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2
Temperature [K]
Hea
t o
f V
apo
risa
tio
n [
J/g
]
/ JT
Qu
al %
0.00
0.01
0.02
0.03
0.04
0.05
0.06
Vap
or
Pre
ssu
re [
bar
]
Heat of vaporisation
JT-Quality %
Vapor pressure
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Definition of Lambda max in a HEII bath
Heat conductivity in HeII q**m = f(T) * dT/dxT-Temperature, x-lengthm ≈ 3
f(T) Germany = f**(-1) (T) USAT2
q max * L** 1/3 = [ ∫ f(T) dT ]**1/3 T1
T1 = F ( P1 ) Temperature function of vapour pressureT2 = F ( P1 + Δ P ) Δ P = ρ*L*g ρ= density of liquid g=9.81 m/s2
L= depth in bath
T1, P1 at liquid surface
T2, P2 at depth L in the bath
LT2 must not beexceeded to avoidbubbles !
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Lambda, Cp,Diffusivity,Density of HEII
0
2000
4000
6000
8000
10000
12000
14000
16000
1 1.2 1.4 1.6 1.8 2 2.2
Temperature [K]
Lam
bd
a [W
/m2]
, Cp
[J/
kg]
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
Dif
fusi
vity
[m
/s]
Lambda max in a saturated bath
Cp of liquid
'Diffusivity' = Lambda/(RHO*Cp) [m/s]
Liquid density=RHO [kg/m3]
Helium II parameters = f(T) (cont.)
Design
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Kapitza Heat TransferSolid Surface to Helium II
Heat transfer at the surface of oneTESLA cavity ∆ T = 100 mK
0
50
100
150
200
250
300
350
400
1.5 1.7 1.9 2.1
Temperature [K]
Dis
sip
ated
Hea
t [W
]
0
0.1
0.2
0.3
0.4
0.5
0.6
Kap
itza
Res
ista
nce
[W
/K*c
m2]
Hk=0.043*T**3.18W/K*cm2
For
Niobium
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Some Cooling-Cycles:
Forced 1-phase Helium I Cooling
HERA Accelerator SC Dipoles
HERA Accelerator Lumi-up-Grade SC Magnets
SC Quadrupoles in
TTF-Cryomodules
+ = simple
-= large mass flow
excess liquid
++ = homogeneouscooling of sc coils at constant temperature
+ = no excess liquid
-= large mass flows
extra pump
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Some Cooling cycles: Bath cooling
T bath = f ( P bath )
JT
liquid
vapor
Advantages: very simple
Δ P/ P = 0.5 mbar/ 31 mbar = 0.016
pressure regulation easy
(pressure stability required for TESLA cavities)
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Film-boilingBubble-boiling
Free convection
1 W / cm2
Over-Heating
Heat Transfer to a Bath of Helium IRemember: Helium II bath 1 W/cm2 maximum heat flow density
INSIDE the bath !
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2.2 K forward
5 K forward
40 K forward
2 K 2-phase
cavity
2 K return
80 K return
8 K return
cool down/warmup
support
coupler
300 mm
Layout of XFEL-linac cryogenic: Helium II bath cooling
About 1000 1.3 GHz sc cavities will becooled in a 2K Helium II bath
TwoTwo phasephase He II He II flowflow involvedinvolvedGRT
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Disadvantage:Complex 2-phase flow conditions
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
-2.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00
Module length [m]
Vap
or
velo
city
[m
/s] Module 1
Module 2
Module 3
Module 4
Module 5
Module 6
Module 7
Module 8
Module 9
Module 10
Module 11
Module 12
JTVapourLiquid
Gas returntube
Two phasetubeBeam tube
Strings 5 - 11
Vapor flow large
Example: Situation at the start of the XFEL-linac(refrigerator side)
ΔP ≠ 0
Vapor flow velocity in 2-phase tube
String 10
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1660 1561978 540442 354 208 141 66
BeamBeamdirectiondirection
LaserLaser--straightstraight XFELXFEL--linaclinac
BC BC
Liquid Helium II supply
Length[m]
Deviation from gravity equipotential [mm]
String 1String 11 String 10 String 9
72,7 61,5 52,3 34,7 26,0 17,7 0,04 26,3 36,3
5 String 4
JT JT JT JT JT JT3.9 GHzCavities 8 Modules
Gravity equipotential surface
Disadvantage: 2-phase flow affected bygravitational forces
One ‚String‘ = 12 cryomodules each of 12 m length
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Two phase Helium II flow: for the XFEL-linac we want stratified-smooth flow
Flow PatternString 11
1.00
10.00
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00
He II level / Tube diameter
K-P
aram
eter
Flow Pattern String 10
1.00
10.00
0.00 0.20 0.40 0.60 0.80 1.00He II level / Tube diameter
K-P
aram
eter
Flow PatternString 1
1.00
10.00
0.00 0.20 0.40 0.60 0.80 1.00He II level / Tube diameter
K-P
aram
eter
Flow Pattern String 5
1.00
10.00
0.00 0.20 0.40 0.60 0.80 1.00
He II level / Tube diameter
K-P
aram
eter
K = [ (ρl * ρg * VGS2 * VLS ) / ( (ρl ––– ρg) * g * μ * cos (β) )]1/2
K
He level /tube diameter
smooth
wavy
Design operation of XFEL: 2 K, 20 GeV, 23.6 MV/m 15 W/cryomodule
String 11 String 10
String 5 String 1
3.9 GHz
2-ph-flow conditions for cryomodules in different sections of the XFEL-linac
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Some Fundamentals of Thermal Insulation
rest gas heatconduction/convection
solid stateheatconduction
heatradiation
remove rest gas
absorb radiation on a thermal shield
reduce heatconduction bydesign and material
Multi LayerInsulation
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Some Fundamentals of Thermal Insulation: vacuum
viscous
Knudsen
molecular
heatconductivity
Λ = mean free path of gas molecules
S = cryostat dimension
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Some Fundamentals of Thermal Insulation: MLI
Multi Layer Insulation = ‚ Superinsulation‘
MLI-materials:
Aluminum foil
Plastic foil : Mylar Al – coated ( one or both sides)
vacuum pumping may be enhanced by small holes in foil
space between foils required to limit heat conduction:
use of ‚wrinkled‘ foils or spacer layers
spacer materials: glas-paper, glas fiber net, paper,……
to limit heat conduction between the MLI-layers:
avoid direct contact of layers, make vacuum pumping possible
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Some Fundamentals of Thermal Insulation: MLI impressions
spacerglas fibernet
(vitrolan)
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Some Fundamentals of Thermal Insulation: TESLA Cryomodule MLI impressions
Module connection to end-cap
MLI covered Cu shield of end-cap
80K shield 8K
shield
spacernet
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Some Fundamentals of Thermal Insulation: MLI
heatconduction
W/m2
0.4
0.5
0.6
0.7
0.8
20 30 40
number of layers
Heat conductionof different MLI types
For design:
1 W/m2
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Some Fundamentals of Thermal Insulation: MLI
Heat conductivityof different MLIsvs.
Density of layers
A: AL coated plastic foil
B: AL glas-fiber spacer
C: AL glas-fiber spacertissue
D: AL glas-fiber paperspacer
MLI Layers / cm
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Some Fundamentals of Thermal Insulation: MLI
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Some Fundamentals of Thermal Insulation: MLI
2 K Helium Vessel of TESLA Cavity
Note:
All helium process areasinside the cryostat shouldbe covered with about 5-10 layers of MLI to limit theimpact of insulationvacuum loss !
Heat input caused bythe break down ofInsulation vacuum:
40kW / m2 without MLI6kW/ m2 with MLI
(see safety section)
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… in addition the Helium vessel get their magnetic shielding
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Some Fundamentals of Thermal Insulation: cryogenic valves
Thermal intercept
Desy ‚philosophy‘: NO metal/metal sealings !!!
Use of plastic seals likeVespel SP1 (polyimid)
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Definition of Kv-value:
volume flow of water
[m3/h] at Δ P = 1bar
and T 278 K -313 K
(Cv= 1,17 Kv USA)
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First part: tutorial objectivesafter this part, we should remember:
• The meaning of ‚cryogeniccryogenic‘• Carnot refrigerator efficiency• ‚COPCOP‘ of a refrigerator• Some Helium refrigerator cycles• Some ‚quantum properties‘ of matter at low
temperatures• Some useful Helium II properties• Some typical cooling cycles• Some fundamentals of thermal insulation
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Second part: tutorial objectivesafter this part, we should remember:
• Measures to increase refrigerator availability
• Helium management considerations• Suited materials for cryogenic temperatures
• Cryogenic safety aspects• Basic cryomodule design considerations
• Pressure vessel regulations• Quality control measures
• Example: TESLA style cryomodule design
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HERA Cryo Plant: Availability 1994 - 2003
9596979899
100101102103104105
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
year
%
average:MTBF = 33 days
HERA Cryo Plant: Interruptions over 10 years of operation 1994 - 2003
0
5
10
15
20
25
Compressors Computer Control Main Power Water Air
kind of interruption
Num
ber
020406080100120140160180200
Downtim
e (h
)
average:6,2 interruptions/year0,16 interruptions/week1,04 h / week
HERA Cryo Plant: Interruptions 1992 - 2003
02468
1012141618
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
year
Num
ber
External Supply
Computer Control
Coldbox
Compressors
average:MTBF = 33 days
Availability
99.6 %
(utilities
excluded)
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Rating
1
2
3
4
5
Source of unavailability
External utility failures
Blockage by frozen out gaseous impurities
Operational problems
Single component failure not leading to total plant shutdown
Catastrophic component failure leading to plant shutdown
Example
Electrical power, cooling water, instrument air failure
Air and/or water vapor
Controls, instrumentation, operators
Electrical motor burnout, compressor bearings, leaking oil pump seal, turbine
bearing troubleLoss of insulation vacuum, rupture of heat
exchanger, oil spill into cold process piping
Multiple refrigerators ...?
would bring no advantage
provide somewhat larger tolerance
would be detrimental, because of higher complexity of the system
would bring no advantage over component redundancy within a single
refrigeratorwould have a positive effect
Availability increase by redundant refrigerators?
Is there an availability increase by the installation of a complete redundant refrigerator ?
Redundant compressors and low temperature adsorbers
Easy exchange of turbines and cold compressors
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Helium Process Gas Management
Helium gas storage tanks
Liquid Helium storage dewar
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gravitationseparation
coalescencefilter I
coalescencefilter II
dryer
adsorber
Low temperaturepurifier
oildroplets
oil fog
oil fog
H2O vapor
oil vapor
oxygennitrogenhydrogen
Removal of:
Helium processgas purification
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HD Coalescence Filter
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Helium Dryer
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Suited materials for lowtemperatures
Low temperature embrittlement
Causes overloaded components to fracture spontaneously rather thanaccommodating the stress by plastic deformation
Appropriate steels for low temperature use are listed in the Technical Rules forPressure Vessels AD-Merkblatt W10 /European harmonized technical rules/ASME-code (USA) . (In general, materials with face-centered cubic (fcc) crystalstructure as copper, nickel, certain copper nickel alloys, zircon and titanium aresuitable for cryogenic applications.)
.
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304 L1.4306X2CrNi 19-11
316 L1.4435X2CrNiMo 18-14-3
304 LN1.4311X2CrNiN 18-10
317 L1.4438X2CrNiMo 18-15-4
1.4434X2CrNiMoN 18-12-4
1.4406X2CrNiMoN 17-11-2
316 LN1.4429X2CrNiMoN 17-13-3
310 L1.4335X1CrNi 25-21
1.4466X1CrNiMoN 25-22-2
-2701.4563X1NiCrMoCu 31-27-4
TM (in °C)ASTM typeAISI
DIN EN number
Material spec
European Harmonized RulesStainless steels for the use at low temperaturesDIN EN 13445-2B.2.2.4 Lowest material temperature for austenitic stainless steels Apply also for 2K !(material spec corresponding to ASTM type AISI may differ ! )
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Cryogenic safety aspects:
Preventive Measures
Against Pressure Build-up
Redundancy
i.e. more safety devices than
required
double safety devices
and
Diversity
i.e. safety devices based on different
mechanisms
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Cryogenic safety aspects
Pressure Build-up by Evaporation
Large air leak into the wave guide of an insert-> Evaporation of about 2.6 kg/s mass flow through safety valve
Heat input caused bythe break down ofInsulation vacuum:
40kW / m2 without MLI6kW/ m2 with MLI
Bernd Petersen DESY –MKS1
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Cryogenic safety aspects
Preventive Measures against PressureBuild-up
Release Flap + Safety Valve
Caution in the
Vicinity
Of
Release devices !
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Safety aspects: Calculation of venting conditions
According to ASME Code CGA S.1.3-1995
Q sqrt ( v )
m = = f(T)
v * sqrt ( dh / d v) P v * sqrt ( dh / d v) P
T/TkritMaximum at T=T flow
Q – heat input
m – mass flow
V – specific volume
H – specific enthalpy
T=T flow
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Safety aspects: Spec of safety valves
Source: AD pressure vessel code
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Safety aspects: procedure
Calculate heat input Q
Find T flow (by ASME code)
Calculate mass flow at T flow (by ASME code)
Calculate sv dimensions ( by AD code)
Method used by DESY MKS:
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SafetyValve in action……….
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Basic cryomodule design considerations (1)
• Operation mode : pulsed or cw ???
• Fraction of dynamic and static loads ?
• RF operation frequency -> choice of operation temperature
• beta = ??? -> general cavity and cryostat design
• RF main coupler loads -> thermal intercepts
• HOM loads -> design of couplers and absorbers
• ERL machines -> active cooling of HOM absorbers may be required
• Tuners -> warm or cold ( extra feedtroughs required ?)
• Magnetic shielding of cavities
• Focusing sc magnets included ? Current leads design….
• Alignment requirements
• Environment -> expected radiation level, tunnel ?...........
• Single individual cryostat or serial production for large accelerator ?
Task : design a cryomodule for SRF accelerator operation
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Basic cryomodule design considerations (2)
• Generate a design concept
• Concept for cooling and heat load estimate
• Risk analysis -> choice of technical rules & pressure vessel classification
• Risk analysis -> safety concept & equipment
• Pressure vessel code -> design & construction rules
• Pressure vessel code -> choice and control of materials
• Pressure vessel code -> welding procedures & management
• Pressure vessel code -> third party inspection & test procedures
• Quality control plan ( in addition to pressure vessel code )
• Design, construction & prototyping
• Testing, testing,testing……………
• Transfer to industrial construction
• Testing, testing,testing….-> pre-series -> serial production
Task : design a cryomodule for SRF accelerator operation
Some ‚formal‘ aspects:
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- European Pressure Equipment Directive (Richtlinie 97/23/EG für Druckgeräte)- Richtlinie über elektrische Betriebsmittel (73/23EWG)- Geräte- und Produktsicherheitsgesetz (GPSG)- Betriebssicherheitsverordnung (BetrSichV)- Qualitätsmanagementsysteme DIN EN ISO 9001, August 1994- European Harmonized Standards like Europäische Norm EN 13445, etc.
Basic cryomodule design considerations (3)Task : design a cryomodule for SRF accelerator operation
Some formal Rules, laws, regulations which have to be obeyed in the EU
INCOMPLETE !
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Basic cryomodule design considerations (4)
• By the way: the cavities have to work -> include clean room requirementsfrom the start for all related components
• Quality insurance procedures: helium leak tests of each and every heliumprocess components required (before, during and after assembly )
• Helium leak testing at a rate of 10-8 mbar/l*sec (or better) for the individualcomponets at ambient temperatures will avoid ‚cold-leaks‘ in the order of better than 99%
• DESY ‚philosophy‘: no direct feedthroughs from helium process areas to insulation vacuum for accelerator cryostats !!!!
• Structural tests (like X-raying of welds) can NOT replace helium leak checks ( and vice versa) !!!!!
• Welding additives must be qualified for low temperatures -> strict certificationof welding procedures & welders; strict quality control organization and management
Task : design a cryomodule for SRF accelerator operation
Some ‚technical‘ aspects:
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Example: TESLA-style cryomodule design(INFN Milano/Italy)
Designed for large accelerators -> low costs per length accelerator
-> ‚easy‘ and cheap assembly
-> serves as a ‚generic design‘ for other projects:ERLs,XFEL,ILC…..
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longitudinal movement posts during cool down XFEL module type
-->sliding fixed sliding
C1 C2 C3 C4 C5 C6 C7 C8 Mag/BPM
Fixpoint Invar rod
HOM-Absorber
Between Modules
Sc magnetpackage also fixed at invar rod
Example: TESLA-style cryomodule design
Positions of cavities and Couplers are fixed
X-ray of coupler positionat 300 K and 2K
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TESLA-style module design: 3 design steps
In use for FLASH-linac user facility at DESY
Prototype for XFEL-linac cryomodules ( only minor modifications )
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(courtesy of N. Ohuchi et. al KEK)
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T4CM Design. The Master Spreadsheet(courtesy of Don Mitchell and Youri Orlov FNAL)
Hyperlinked to a detailed
PDF drawing
Values which can
be modified
Shrinkage Calculations
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Cornell University ERL InjectorCryostat(courtesy of Eric Chojnacki) Design changes for for
ERL use (cw-operation, large HOM loads)
HOM absorber
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Second part: tutorial objectivesafter this part, we should remember:
• Measures to increase refrigerator availability
• Helium management considerations• Suited materials for cryogenic temperatures
• Cryogenic safety aspects• Basic cryomodule design considerations
• Pressure vessel regulations• Quality control measures
• Example: TESLA style cryomodule design
![Page 95: with regard to SRF Technology](https://reader031.fdocuments.in/reader031/viewer/2022013009/61ce645fe7efaf2657158264/html5/thumbnails/95.jpg)
Thank You !