Welsh Centre for Printing and Coating Plastic electronics for Smart Packaging Dr. Davide Deganello...

Welsh Centre for Printing and Coating

Plastic electronics for Smart Packaging

Dr. Davide DeganelloContact email: [email protected]

College of Engineering

Bridging Borders, 26th Sept 2013, Belfast

mailto:[email protected]

What is printing today?

One of the World’s largest industries

An advanced, precision volume manufacturing process

Industrial Graphic Printing

Industrial printing presses:

Web widths up to 4.5m, speeds up to 1000m/min

Printing challenges

Graphic Printing Eye “compensates”

Printed Electronics New level of

accuracy / understanding required


Fundamental research

Graphics &

Packaging

Printed

Electronics

Medical &

Biotechnology

Solutions for Industry

Centre of excellence for R&D in Industrial Printing Funded in 1994, based at Swansea University, UK

Comprehensive Facilities

R2R, sheet fed and small scale printing

Ink development and manufacture

Analysis of materials and prints

WCPC

SME

Large

Multinational

RO

Academic

NFP

UK

EU

US

GlobalTR1 TR2 TR4 TR6 TR7

Act

ivity Industry

Academia

WCPC

Converting ideas into volume products

WCPC: working with Industry

Packaging & Smart Packaging

Packaging market

Estimates: > 820B$ by 2016

Higher growth sectors: Healthcare, cosmetic, food (source:rexam)

Source: Smithers Pira

Printing Packaging technology

Substrate

Impression cylinder

Plate cylinder

Plate

Anilox rollEnclosed ink chamber

Ink feed

Ink drains

Substrate

Impression cylinder

Plate cylinder

Plate


Ink feed

Ink drains

Substrate

Impression cylinder

Plate cylinder

Plate


Ink feed

Ink drains

Flexography:

Ink transfer through a raised imaged photopolymer plate

Packaging

Current trends in Packaging: Premiumisation of every-day products Increased communication to the consumer Environmental considerations Cost reduction

Smart Packaging

Smart Packaging

Smart packaging:

Packaging moves from an “inert” to an active role Packaging monitors the product

Product condition, lifespan, logistic, authenticity

Packaging interacts with consumer: Increased flow of information, consumer confidence

Cost must be feasible

Smart Packaging

Current Smart Packaging:

Some Examples

Smart Packaging: RFID Labels

RFID Labels: Radio frequency identification labels

Monitoring expensive/dangerous products

Reduce logistic costs: Wall-Mart mandate (2006)

Current limit to wide use: cost per RFID label ( 0.10 $)

Fully printed RFID (PolyIC) Future: roll2roll inline integration

From http://www.polyic.com/

Smart Packaging: Thermo-chromic

Thermo-chromic labels: color-changing labels which respond

to cumulative exposure to temperature.

Monitor individual item handling

Possible Issue: Subjectivity Food decay chromic sensors under development

From http://www.freshcheck.com/

Electronics & Smart Packaging

Smart Packaging:

What is its next future?


Integration of Printed electronics into packaging: Next development of smart packaging

New level of interaction between consumer and product

Improved Security of the product

A “revolution in packaging”


Electronic & Packaging integration: Example 1

Adaptive displays

integrated in the

packaging

Courtesy of Faraday packaging


Electronic & Packaging integration: Example 2

Active monitoring: Display information Sensors Data logging

Clear statement of quality: Objective

Courtesy of Faraday packaging


Why Printed electronics instead than “silicon”? Printing is affordability, larger-area, flexible substrates

But lower performance (micron-features not nano)

Easy integration with current packaging production

Electronic components to be printed Displays Sensors Power sources CPU ? Touch screens (available)

Display/Lighting Technologies

Flexible OLEDs: Efficient lighting at low DC voltage Major research area Limit: Humidity & cost of vapour barriers

General Electric

Fast2Light: FP7 IP on large area OLEDs technologies R2R Flexo Printing for accurate conductive micro-networks

70±3μm

Printed Electronics

ACCUFLEX: Advancing Flexo for Printed Electronics TSB Funded project Improved registration, uniformity

Plate resistance to solvents

Partners: Innovia Films Asahi Photoproducts UK (Ltd) Tectonic International Gwent Electronic materials Millenium lasers Timsons Ltd


Electroluminescence Lighting: Commercial reality Flexible, thin, lasting... Continuous progress Current limit: High AC Voltage

http://www.youtube.com/user/Swanseaprinting



Novel solution: Printable micro silicon-LEDs

Micro LED printed between 2 conductive layers Low DC voltage & lasting NthDegree patented technology


Printed display: e-inks, bi-stable inks on flexible substrate

Energy required only to change status

Complex image, complex driver electronics

From http://www.ntera.com/

From http://www.plasticlogic.com

http://www.plasticlogic.com/

Active sensors

R2R printed ZnNW sensors (P)

Large area high sensitivity

Potassium sensing (P)

(P): patented

Printed sensors: Quantitative, affordable Humidity, temperature Gas and biological compounds

Pharmaceutical market, Food market Integrated in packaging would allow a continuous

monitoring throughout the chain

From http://www.arkray.co.jp/

Power

Printed Batteries: flexible and thin Adapt to required shape/space

Collaborative project with HDM Stuttgart &

Power

Printed photovoltaic: flexible and thin, several manufacturers Efficiency vs. Lifespan

Large area solar cells on steel

cladding

Partnership Swansea Uni, TATA

Printed micro-networks

Packaging Applications of printed micro-networks on flexible films

R2R printed see-through RFID R2R printed micro-heaters

R2R Strain gauges

Magnetic coils (energy transfer)

What about Intelligence?

Creating devices require a control unit: CPU

Printed CPU: CIKC forefront Complex construction (not easy integration) Limited performance vs silicon

Lifespan issues micron-features not nano

Integrating silicon with high speed Printing•Basic chips are economic (<1 p)•Issue : connecting silicon to plastic • R2R Pick&Place machines

What about Intelligence?

Fine lines <10um

Not for mass-production

Research in advanced microcircuits

New equipment at WCPC:

Aereosol printer

Improving security

Counterfeiting: key issue for suppliers & manufacturers Not only high-end, pharmaceutical products

Memory circuits for brand protection

From

Improving security

Antibodies for brand protection R2R Printing of antibodies on plastic developed for bio-sensing

Issues solved: adhesion on plastic and lifespan (patent)

Antibodies are invisible until specific reagent introduced Highly safe counterfeiting system

New technologies: 3D Bioplotter

Creation of 3D bio-scaffolds (e.g. bones) through a

computer controlled filament deposition of bio-polymers

GRAPHENEX: Digital printing pristine graphene polymer inks

Graphene RFID

3D Bioplotter

And ......... 3D Chocolate ...........www.youtube.com/user/Swanseaprinting


Conclusions

Introduction to WCPC Providing solutions for Industry

How smart will be our packaging? New technologies/demonstrators are now reality Manufacturing integrations under development


College of Engineering

Thank You

Dr. Davide Deganello

[email protected]

European RegionalDevelopment Fund

Funded and supported by:-

HEFCW

Welsh Centre for Printing and CoatingCanolfan Argraffu a Chaenu Cymru

Welsh Centre for Printing and Coating Plastic electronics for Smart Packaging Dr. Davide Deganello...

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