Webinar: Wirebonding...Wirebonding in a LASERCAVITY® 1.4 mm Depth 10/04/2013 Page 11 1+6b+1 Stackup...
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10/04/2013 www.we-online.com Page 1 Webinar: Wirebonding Würth Elektronik Circuit Board Technology
Transcript of Webinar: Wirebonding...Wirebonding in a LASERCAVITY® 1.4 mm Depth 10/04/2013 Page 11 1+6b+1 Stackup...
10/04/2013 www.we-online.com Page 1
Webinar: Wirebonding
Würth Elektronik Circuit Board Technology
Agenda
• Overview
• Design Rules Technology
• LED
• Sensors
• Branches
Applications
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Wirebonding
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Pad
Bare Die
Substrate
Globtop Ball Loop
Glue Wedge
Goldwire Wirebonding
Substrate
Globtop Wedge Loop
Glue
Pad
Wedge
Bare Die
Aluminium Wirebonding
ENEPIG
Galvanic Gold ENIG
Standard Design Rules Wirebonding
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Chip Pad Size
≥ 80 µm
min. chip pitch
≥ 150 µm
Substrate Pad
Length ≥ 2500 µm
Chip to Substrate Pad
1,5 x chip thickness
substrate
pad width
≥ 125 µm
space
≥ 75 µm
min. Substrate Pitch
≥ 200 µm
chip pad to substrate pad
orientation is parallel
Al wires can be bonded
under angle between chip
pad to substrate pad
Final Surface
- immersion Ni Au
- chem. Ag
Solder Mask
Aluminium Wirebonding
substrate
pad width
≥ 125 µm
space
≥ 75 µm
Chip Pad Size
≥ 80 µm
min. Substrate Pitch
≥ 200 µm
min. chip pitch
≥ 100 µm
Substrate Pad
Length ≥ 2500 µm
Important!
Chip Pad to Substrate Pad
Orientation in a Line
Chip to Substrate Pad
1,5 x chip thickness
Solder Mask
Final Surface
- plated Ni Au
- chem. Ag
Gold Wirebonding
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Precision Die Bonding, Encapsulation
We will have a…
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Which technology is the most suitable solution for high temperature applications?
Wirebonding + Thermal Management +LASERCAVITY®
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400µm ~ 12000 LEDs / 1dm²
Wirebonding extended: LED with Wirebonding
Individual Bare Die
Assembly in Cavity
Reduction of Height
Individual Heatsink
Optimization of
Thermal Management
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Bare Die
Heatsink
Substrate
Wirebonding on Two Steps - LASERCAVITY®
with separated Potentials
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Microvias for Thermal Connection to
the Heatsink
Cross Section
Al Heatsink
Two Steps
Wirebonding in a LASERCAVITY® 0,8 mm Depth
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0.8 mm
2.4 mm
Die bonding, Wirebonding,
Molding in one assembly line
Wirebonding in a LASERCAVITY® 1.4 mm Depth
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1+6b+1 Stackup
LC – Lasercavity on Layer 6, with ENIG Surface for Aluminum Wirebonding
250 µm LC
1400 µm
Complex Wirebonding on LASERCAVITY® with
Two Steps
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65 µm
step depth
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Goldwirebonding for Gold Stud Bumps
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200 µm
Gold Stud Bumps
Ø 60 µm
50 µm high
For single ICs possible
Small Quantities
We will have a…
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What is the diameter of the wire?
Industries for Wirebonding
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Sensor Technology
Measurement Technology
Medical Technology
Industrial Electronics
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Applications
Sensor Technology Security Products
Textile Electronics
Gas Sensors
Hall Sensors
Intelligent light barriers
Infrared and Ultraviolet
Detectors
Measurement Digital Caliper
Flow Measurement
Medical Technology Endoscope Camera
Keyboard for Braille
Sticks for DNA analysis
Online measurement of blood
parameters
Industrial Electronics LCD Driver
Linear Displacement Sensor
Memory cells for HDTV
Advantages of Wirebonding
Low Process Temperature
High Reliability
Huge Space Savings
High Design Flexibility
Repair Option
Variable Substrate
Component Combination
Simplification of Complex
Circuits
Different Technolgies
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Thank you for your attention!
Philipp Conrad
Dipl.-Ing.(FH), MBA
WÜRTH ELEKTRONIK GmbH & Co. KG
Product Manager Wirebonding
Circuit Board Technology
T.: +49 7940 946 469
M.:+49 175 22 71 600
W. www.we-online.de
