watEr cooLing for powEr ELEctronicsHigh performance at heat source, high reliability in cooling solutions

thErMaLManagEMEnt

Computational Thermo and Fluid Dynamic Simulation

Water Cooler Plates for IGBT modules

Micro Pin Base Plates for IGBTs

Water Cooling Stations – HX, pump, controls, HMI

02 Water Cooling for Power Electronics

Power electronics applications require new topologies that

demand higher power densities, thus design engineers

request new and custom mechanical and thermal

solutions. Water cooling of power electronics can be

defined as a science of its own. The thermal path must be

considered from the heat source – IGBT chips and diodes

– to the final heat sink (usually ambient air).

EvEr incrEasing powEr dEnsitiEs

cooling for power semiconductors and batteries in electric vehiclesPower semiconductors require maximum cooling at moderate flow rate and pressure

drop. Directly cooled chips offer the best performance, however they require proper

packaging. Micro deformed in line pin fins offer a solution with unrivalled performance.

Battery cooling presents a difficult challenge as it requires equal temperatures for all cells

with minimal pumping energy. Counter-current snake designs offer the design engineer a

suitable option to overcome these conflicting design goals.

Large cooler plates with counter-current enhanced surface extrusion fluid channels These cooler plates offer uniform temperature across and between components, i.e.

typically a temperature difference of 0,5 K/kW /component. The counter current flow

configuration offers two advantages over a diagonal (parallel flow) configuration: it

requires only half the flow (comparing at same fluid velocity) and still it achieves lower

thermal resistance.

Water Cooling for Power Electronics 03

reliable water cooling stations for heat loads from 20 kw to 2 Mw

Cooling station models are available for low and high voltage applications, in cabinets or

frame mount, with water or air cooled heat exchangers. All units feature high reliability

with long maintenance intervals of over 5 years. Other high-lights are automatic de-

aeration, small footprint, removable pump unit, leakage control, clean water, i.e. inherent

corrosion inhibition, de-ionisation to below 1 µS/cm , PLC controls, touchscreen HMI, fully

redundant systems and others.

These systems are typically employed as the core of a power electronics water cooling

system in energy transmission, marine, heavy duty industry and renewable energy

applications.

turnkey water cooling system – example solar inverter

Transporting equipment in a standard container is a must, however installation in harsh

environments favor a rooftop installation with sand trap. There is no need for air filters

and electronics can be hermetically sealed from dusty environment. Our turnkey solution

includes a prefilled cooling system, water cooler plates for IGBT modules of 140x190,

PrimePack* or EconoDUAL* format and piping. The system features automatic de-aeration,

easy installation on site and long maintenance intervals.

*Primepack and EconoDUAL are trademarks of Infineon Technologies

thermo and fluid dynamic simulation tool

A cooling system for power electronics is limited by two temperatures: maximum junction

temperature and ambient air temperature. Where the maximum junction temperature is

fixed, the heat load and sometimes allowable ambient temperature need to be optimized

for a given size or budget. Our design tool for cooler plates and heat exchangers gives

quick answers to thermo and fluid dynamic behavior of a cooling system.

Our team is looking forward to put our expertise to work for your application.

what can wE do for you?

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Optical Technologies

Power Technologies

Thermal Management www.amstechnologies.com

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