WAFER LEVEL ENCAPSULATION - dm.henkel-dam.com
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KEY BENEFITS OF HENKEL LCM • Low viscosity for easy flow and better fill • Better handling, no dust • Ultra-low warpage, low CTE & low modulus for water handling & processing • Low temperature and fast in-mold cure for increased UPH • EU REACH compliant anhydride-free WAFER LEVEL ENCAPSULATION LIQUID COMPRESSION MOLD (LCM) AND PRINTABLE ENCAPSULANT As the geometry of electronic devices gets thinner and smaller, the processing requirements for semiconductor packaging become more and more challenging. For Wafer Level Packaging (WLP), there is a strong demand for overall warpage reduction in order to improve wafer handling, increase process UPH and achieve higher yields. The warpage issue is driven by the reduced package dimensions and the nature of CTE mismatch between thermoset encapsulant and silicon wafer. Henkel recently developed a new platform of anhydride-free encapsulant materials that can be used for molding or printing applications. Non-Conductive Film (NCF) Capilary Underfill (CUF) Liquid Compression Mold (LCM) Non-Conductive Paste (NCP) KEY APPLICATIONS Chip-on-Wafer (CoW) • 2.5D • 3D TSV WL-CSP (Fan-in) • 5 or 6-side protection • Molding or Printing Through-Silicon Via (TSV)
Transcript of WAFER LEVEL ENCAPSULATION - dm.henkel-dam.com
KEY BENEFITS OF HENKEL LCM
• Low viscosity for easy flow and better fill
• Better handling, no dust
• Ultra-low warpage, low CTE & low modulus for water handling & processing
• Low temperature and fast in-mold cure for increased UPH
• EU REACH compliant anhydride-free
WAFER LEVEL ENCAPSULATION LIQUID COMPRESSION MOLD (LCM) AND PRINTABLE ENCAPSULANTAs the geometry of electronic devices gets thinner and smaller, the processing requirements for semiconductor packaging
become more and more challenging. For Wafer Level Packaging (WLP), there is a strong demand for overall warpage
reduction in order to improve wafer handling, increase process UPH and achieve higher yields. The warpage issue is driven
by the reduced package dimensions and the nature of CTE mismatch between thermoset encapsulant and silicon wafer.
Henkel recently developed a new platform of anhydride-free encapsulant materials that can be used for molding or printing
applications.
Non-Conductive Film (NCF)
CapilaryUnderfill (CUF)
Liquid Compression Mold (LCM)
Non-ConductivePaste (NCP)
KEY APPLICATIONS
Chip-on-Wafer (CoW)
• 2.5D
• 3D TSV
WL-CSP (Fan-in)
• 5 or 6-side protection
• Molding or Printing
Through-Silicon Via (TSV)
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PRODUCT PROPERTIES HENKEL’S LCM OTHER LCM
REACH Compliance Resin Anhydride-Free System(EU REACH compliant)
Contains Anhydride (EU REACH SVHC list)
Warpage > 70% reduction(feedback from LCM customers)
Higher warpage observed (feedback from LCM customers)
Gap Fill and Trench Fill Excellent for narrow gap filling and thin mold cap Lower trench filling performance
Solvent-Free (Printable EN) No solvent; Intrinsically no voids
Solvent-based;Voids difficult to remove
Higher UPH 4 min. at 120°C (LCM)1 hr. at 150°C (Printable EN)
6 – 10 min. at 125°C (LCM)2 – 3 hr. at 175°C (Printable EN)
Chemical Resistance Survive (8% TMAH/DMSO at 1 hr. /80°C) Decomposed
Viscosity Stability > 24 hr. ~ 8 – 12 hr.
Product Comparison
Printable Encapsulant for 5 or 6-Side Protection
Wafer after finish fab. Copper pillar pad Finish trench (half cut)
Trench filling with printed method/compression mold
Top side grinding for pad exposure
5-side protection 6-side protection
Back side grinding Print to back-side for protection
Cut to single unit Cut to single unit
Molding Approach – Process Map
