VLSI-SEMINARS2

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    MANUFACTURINGTEST

    PRINCIPLES(VLSI UNIT-5)

    Prepared byTamilarasu T

    [email protected] ECE(2010 batch)

    SSM College Of Engineering

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    INTRODUCTION Faults should be detected during

    manufacturing level itself.

    Digital circuits classification:

    1. Combinational circuits

    2. Sequential circuits

    Here we are going to discuss differentmethods of testing.

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    TESTING COMBINATIONAL

    CIRCUITS

    Present output depends on present

    input only. For testing of n input circuits, 2^n

    combinations are needed.

    For large values of n it seems to bedifficult.

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    COMBINATIONAL LOGIC:

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    TESTING SEQUENTIALCIRCUITS:

    Present output not only depends on

    present input but also depends on pastinput & output.

    Due to feedback paths, testing is some

    what complicated.

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    SEQUENTIAL LOGIC:

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    FAULT MODEL:

    Models bridge the gap between the physicalreality and mathematical abstraction.

    DEFECTS:

    Unintended differences between theimplemented hardware & its intended design

    ERROR:

    A wrong output signal produced by adefective system is called errorFAULTS A representation of defects is called faults.

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    TYPICAL DEFECTS IN VLSI:

    Age defects Material defects

    Surface impurities

    Dielectric breakdown

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    STUCK AT FAULTS

    This fault is modeled by assigningvalues (0 or 1) to a signal line in thecircuit

    These faults can be simultaneouslypresents in the circuits

    A circuit with n combinations will have(3^n)-1 possible stuck linecombinations

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    TYPES OF STUCK AT FAULTS

    1.

    Stuck-at-1 (s-a-1)2. Stuck-at-0 (s-a-0)

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    S-A-0

    This fault is modeled by assigning 0 toa signal line in the circuit.

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    S-A-1

    This fault is modeled by assigning 1 to asignal line in the circuit.

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    O.C & S.C FAULTS

    These faults are due to physical faultswhich in turn cause physical change inthe circuit

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    REASONS FOR S.C FAULTS:

    Under etching

    Spiking Diffusion shorts

    Contact opens

    Gate to source/drain short Mask misalignment

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    REASONS FOR O.C FAULTS:

    A bad contact

    Metal missing Poor wire bonding

    Metal migration

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    ILLUSTRATION FOR O.C CMOS-NOR

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    QUESTIONS: A circuit with n combinations will

    have .. possible stuck linecombinations.

    Define faults.

    Reasons for o.c faults.

    Define stuck at faults.

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    CONT. & OBS.:CONTROLABILITY Difficulty of setting particular logic signal to a

    zero or one. RANGE: one to infinite

    OBSERVABILITY Difficulty of observing particular logic signal to a

    zero or one.

    RANGE: zero to infinite

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    SCOAP algorithm Sandia Controllability/Observability AnalysisProgram.

    Proposed by Goldstein. The 1-Controllability is the probability of a

    signal value on line being set to 1 by arandom vector.

    The 0-Controllability is the probability of asignal value on line being set to 0 by arandom vector.

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    NUMERICAL MEASURES for

    SCOAP:1. CC0(n)

    2.

    CC1(n)3. CO(n)

    4. SC0(n)

    5. SC1(n)6. SO(n)

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    Different Cases of

    controllabilityOutput is controlled by OUTPUT COTROLLABILITY

    Setting one value Min(input controllabilities) +1

    Setting all values sum(input controllabilities) +1

    Multiple inputs min(all input controllabilities) +1

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    SCOAP controllability AND gate

    a b Z

    0 0 0

    0 1 0

    1 0 0

    1 1 1

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    SCOAP controllability OR gate

    a b Z

    0 0 0

    0 1 1

    1 0 1

    1 1 1

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    SCOAP

    controllability NOR gate

    a b Z

    0 0 1

    0 1 0

    1 0 0

    1 1 0

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    SCOAP

    controllability NAND gate

    a b Z

    0 0 1

    0 1 1

    1 0 1

    1 1 0

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    SCOAP controllability XOR gate

    a b Z

    0 0 0

    0 1 1

    1 0 1

    1 1 0

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    SCOAP controllability X-NOR gate

    a b Z

    0 0 1

    0 1 0

    1 0 0

    1 1 1

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    SCOAP controllability NOT gate

    a Z

    1 0

    0 1

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    OBSVERABILITYLOGIC GATES OBSERVABILITY CALCULATION

    OR co(a)=co(z)+cc0(b)+1

    co(b)=co(z)+cc0(a)+1 AND co(a)=co(z)+cc1(b)+1

    co(b)=co(z)+cc1(a)+1

    XOR co(a)=co(z)+min(cc0(b),cc1(b))+1

    co(a)=co(z)+min(cc0(b),cc1(b))+1

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    OBSVERABILITY

    LOGIC GATES OBSERVABILITY CALCULATION

    NOR co(a)=co(z)+cc0(b)+1

    co(b)=co(z)+cc0(a)+1

    NAND co(a)=co(z)+cc1(b)+1

    co(b)=co(z)+cc1(a)+1

    XOR co(a)=co(z)+min(cc0(b),cc1(b))+1

    co(a)=co(z)+min(cc0(b),cc1(b))+1

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    OBSVERABILITY

    LOGIC GATE OBSERVABILITY CALCULATION

    NOT co(a)=co(z)+1

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    QUESTIONS Define observability & controllability.

    SCOAP controllability of NAND gate.

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    AUTOMATIC TEST PATTERN

    GENERATION ATPG algorithms inject a fault into a ckt.

    Uses a variety of mechanisms to activate the

    fault. Non controlling values is given for other

    inputs

    Its to view the fault propagation. Finally detect the fault by comparing with

    expected output.

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    DD--calculuscalculusATPG algorithm.

    Developed by Rother.

    The symbol D(detect) indicates thevalue of fault.

    The node values are defined by1,0,X,D,Dbar,

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    Rouths algebra:SYMBOL MEANING GOOD MACHINE FAILING

    MACHINE

    D (1/0) 1 0

    Dbar (1/0) 0 1

    0 (0/0) 0 0

    1 (1/1) 1 1

    X (X/X) X X

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    DD--calculus for AND gatecalculus for AND gate AND 0 1 X D Dbar

    0 0 0 0 0 0

    1 0 1 X D Dbar

    X 0 X X X X

    D 0 D X D 0

    Dbar 0 Dbar X 0 Dbar

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    DD--calculus for OR gatecalculus for OR gateOR 1 0 X D Dbar

    1 1 1 1 1 1

    0 1 0 X D Dbar

    X 1 X X X X

    D 1 D X D 1

    Dbar 1 Dbar X 1 Dbar

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    DD--calculus for NOT gatecalculus for NOT gateA Abar

    0 1

    1 0

    X X

    D Dbar

    Dbar D

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    PODEM algorithm Path oriented decision making algorithm. Solves the problem of reconvergent. Allows multipath sensitization. Similar to D-calculus major difference is it is

    reversible during incorrect decision.

    BASIC STEPS1. Objective2. Back trace3. Implication4. D-frontier

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    Find using Rouths algebra:

    SYMBOL MEANING GOOD MACHINE FAILING

    MACHINE

    D

    0

    X

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    QUESTIONS:EXPAND THE FOLLOWING:

    1. PODEM

    2. ATPG

    3. D-calculus.

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    FAULT SIMULATION

    To verify the correctness of the design

    It verifies the test

    TYPES

    1. Serial fault simulation

    2. Parallel fault simulation3. Concurrent fault simulation

    4. Non deterministic fault simulation

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    SERIAL FAULT

    SIMULATION

    Simulate circuit using true value mode for all

    vectors. Primary output values are saved is a file.

    Faulty circuits are simulated one by one.

    This can be done by inserting faults at line or

    node Then output of former & latter are compared

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    No. of simulation cycles (Sy)

    are given by

    Sy = (2N/2)Y+N

    = NY+N

    =N(Y+1)

    =NY (app)N -no.of test vectorsY-no. of nodes

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    PARALLEL FAULT

    SIMULATION

    It uses the bit parallelism of logical operations in adigital computer

    It allows simultaneous simulation with identicalconnectivity, but possibly different values

    Performance: (W-1) times faster than former one.

    W-bits in the machine word size

    Here,Sy = (Yn /M)

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    CONCURRENT FAULT

    SIMULATION

    Here simulating whole circuit with faultmodels are avoided

    First simulate the good circuit

    Then inject fault and re simulate partof circuit that behaves differently

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    NON-DETERMINISTICSIMULATION

    Previous models are deterministic faultsimulation

    Here simulation is done by usingprobabilistic fault simulation

    We simulate a subset or sample offaults and extrapolate fault coveragefrom the sample

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    DELAY FAULT TESTING

    Due to combinational delay in the circuit

    Specific delay faults are:

    1. Transition faults

    2. Gate delay faults

    3. Line delay faults4. Path delay faults.

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    STASTICAL FAULT ANALYSIS Technique that statistically determines

    1. controllabilities,

    2. observabilities,

    3. detection probabilities &

    4.

    fault converge from true value ofsimulation.

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    FAULT SAMPLING

    Subset of faults is randomly picked from theset of all faults

    This subset is usually a small fraction of thecomplete faulty set

    Faults in sample are simulated & the samplecoverage is used as an estimate of the fault

    coverage in the complete fault set Increasing sample value decreases the error

    bound

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    CONCLUSIONFinding defects at manufacturing level

    itself will give us a better result. Using

    above techniques faults free circuits canbe obtained at manufacturing level.

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    REFERENCEVLSI design by R.Uma.

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    QUERIES