Version 3 - hewtech.co.jp · 2019. 3. 26. · e.g. EN ISO 11885:1998 (2) Atomic Absorption...
Transcript of Version 3 - hewtech.co.jp · 2019. 3. 26. · e.g. EN ISO 11885:1998 (2) Atomic Absorption...
Appendix-1: HS-803-03000
Management Standards for the
Environment-related Substances
Version 3.0
Hirakawa Hewtech Corp.
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
2/15
1. Purpose
2. Operation of management standards
involved in environmental-protection activities aggressively.
3. Scope of management standard
(1) Survey on environmental-conservation activities to all suppliers.
(2)
(3) Survey on procurement of environment-related substances and limits.
(4) Management of the environment-related substance on the processing process.
4. Survey on environmental-conservation activities to all suppliers
5. Survey on procurement of environment-related substances and limits
(1) Functional units, modules, board assemblies and other assembly parts.
(2)
(3) Screws
(4)
used).
(5)
(6)
(7)
(8)
Table 9.1.
6. Management of the environment-related substances on the processing process
7. Definition of Banned substances and Effective date of ban
In this Standard, terms are defined as following;(1) Environment-related Substances to be Controlled ('Controlled Substances')"
(2) Controlled level
① Banned Substances
② Reduced Substances (with a period limitation of banned substance)
exemption from laws.
and materials.
used for products.
the separately issued notice.
Among the substances contained in parts and devices, "Environment-related Substances to be Controlled ('Controlled
Substances')" are those which, according to the company's judgment, have significant environmental-impact on
Applicable to the company's products to configure by the following as raw materials, parts, device, packaging
components and materials, also survey on procurement concerning environment-related substances.
be operating appropriately, according to the provisions of each department.
Measurement and inspection of chemical substances by the X-ray fluorescence analyzer to those purchased parts
All suppliers that supply procurement to the company are the target to be surveyed and to be ensured that the
and products.
substances regulations separately.
Definition of Banned substances and Effective date of ban.
has been acting properly according to the related-regulations.
to establish. Also, the "effective date of the banned" shall be reviewed, if the unavailability of adequate
alternative parts and materials that satisfy the intended uses, depending on substances are not regulated by or
prevent the substances from being used (filled up) into products, the company also comply with relevant laws and
regulations, contributing to the preservation of global environment and aim to establish a recycling-oriented society.
Printed materials (e.g. instruction manual, warranty cards, additional product/parts information) .
Switching to alternative materials and to advance the policy be abolished as soon as possible.
With to promoting the green procurement actively, the company procure the products and services that contained
less environment-related substance from the suppliers which are acting with environmental-conservation activities
The Packaging components and materials which used by suppliers for delivery and protection are definited in
on JGPSSI standard, besides, some of the substances are to be requested according to the company's Controlled
This standard is made by Hirakawa Hewtech Corp. (hereafter called "the company"), with regard to the "Environ-
Accessories (remote command controllers, mice, AC adaptors and other accessories with which are for apparatus
Electrical parts, mechanical parts, semiconductor devices, PWBs, recording media, and the packaging components
ment-related Substances to be controlled ("Controlled Substances)" contained in the raw materials, parts, devices,
and the Packaging Components and Materials of which are employed in the product that the company manufactures
and sells. With clarifies the Banned substance, Substance to be phased out, and Exempted substances, in order to
environmental-conservation activities (e.g. ISO14001 approval / Self-environmental-conservation activities) which
also considered in light-weight, long-life-use, easy recycling, easy-degrading, easy-treatment and energy-saving
of environment-conscious products. Accordingly, the company is required to obtain ISO14001 certification and
Regarding the survey on environment-related substances contained in parts and production, it shall be based
the use in parts and materials.
The substances and their applications classified into "Banned Substances" are substances that are banned from
However, the substances shall be banned immediately if the alternative materials technology has become possible
Materials constituting subsidiary parts and materials (e.g. adhesive tape, soldering materials, adhesives etc. )
Repair parts (The application of some repair parts for products on the market shall be followed the instruction on
Regarding the management to the procurement and the control of through the processing process to delivery, to
both humans and the global environment. (part of the substances are comply with the provisions of JGPSS) .
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
3/15③ Controlled Substances (the substances which are aim to be reduced)
④ Exemption
(3) Contained
(4) Impurity
(5) Effective date of ban on use
(6) Packaging Components and Materials
(7) Materials
8. Environment-related Substances to be controlled (The Controlled Substances) ,defined in this Standard.
With the specific purpose of a particular position and composite materials that can be considered to be a
indivisible uniform materials or homogenous material in achieving for use purpose.
the product.
pletely remove by technical means, if the substance which mingles with or adheres to parts, devices
and packaging components and materials as an impurity substance purchased by the company must
not exceed its allowable concentration specified in this standard.
The Packaging Components and Materials means which are used by the company for packaging and
delivery of goods such as carton, instructions, tape, vinyl-tie, raps, labels, and other parts of the printed
material (e.g. plastics, paper, inks, adhesives and paints, etc.).
Substances
Table 8.1 (The Controlled Substances)
"Contained" is a situation in which a substance is added to, is blended with, fills up, or adheres to the
parts or devices employed in products, or the materials used for the parts or device, regardless if the
situation is intentionally created or not. (including this situation in which a substance is unintentionally
contained in, or added to a product in a processing process)
The date of the adaptation products to be shipped. It means the "Controlled substances" is not contained
in raw materials, parts, devices, and the Packaging Components and Materials etc. that compose in
An "Impurity" is a substances contained in a natural material, which cannot be completely removed in
a refining process by technical means, or in the generated in synthesis process, which cannot be com-
Brominated organic
compounds
Chlorinated organic
compounds
Heavy metals
Cadmium and cadmium compounds
Lead and lead compounds
Mercury and mercury compounds
Hexavalent chromium compounds
Polychlorinated biphenyls (PCB)
Polychlorinated naphthalenes (PCN)
Polychlorinated terphenyls (PCT)
Short-chain chlorinated paraffins (SCCP)
Other chlorinated organic compounds
Polybrominated biphenyls (PBB)
Decabromodiphenyl (DecaBDE)
Polybrominated diphenylethers PBDE)
Other brominated organic compounds
Tributyltin compounds (TBT)
Triphenyltin compounds (TPT)
Asbestos
Ozone-depleting substance
Specific azo compounds
Formaldehyde
Polyvinyl chloride and PVC blends
Beryllium oxide
Beryllium copper
Specific phthalates (DEHP 、DBP、BBP、DINP、DIDP、DNOP、DNHP)Perfluorooctane sulfonates (PFOS)
Specific benzotriazole
The substances and their applications classified as "Exemption" are those substances not regulated
or exempted from laws, due to the unavailability of adequate alternative parts and materials that
No effective date for banning the use is currently set for the substances and their applications
classified into "Controlled Substances" are to be reduce the concentration in raw materials, parts,
devices, and the Packaging Components and Materials for uses.
satisfies the intended uses.
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
4/15
No.1
・ Packaging components and materials ( see 9.1)
・ Paints, inks
・ Surface treatment (e.g. electroplating, electro less plating etc.), coating
・ Photographic films
・ Fluorescent lights (small type ones, straight-tube ones)
All purposes except those specified in "Exemption"
・ DC motors, switches, relays, breaker and other electrical contact points
・ Fuse elements of temperature fuses
・ Glass, and the pigments as well as dyes of glass paints
・ Solder (cadmium content over 20ppm)
・ CdS-photocells and the phosphors contained in fluorescent display device.
・ Resistor elements (glass frit)
・ Cadmium in optical glass, filter glass
Test objects: plastics (including rubber), paint and inks
Allowable concentration: Less than 5ppm
Standards for measurement:
1. Pretreatment
Main Pretreatment methods are as follow 4 kinds:
(1) Incineration under the existence of sulfuric acid;
(2)
(3)
(4)
Note:
2. Measurement methods
Main Measurement methods are as follow three kinds:
(1) Inductively Coupled Plasma-Atomic (Optical) Emission Spectroscopy (ICP-AES [ICP-OES])
e.g. EN ISO 11885:1998
(2) Atomic Absorption Spectroscopy (AAS) (e.g. EN ISO 5961:1995)
(3) Inductively Coupled Plasma-Mass Spectroscopy (ICP-MS)
Note:
determination limit of cadmium is less than 5 ppm, the combination is also applicable.
Also, both cadmium and lead can be simultaneously analyzed by each of the measurement methods.
(except for AAS) mentioned above.
In the process of above pretreatment, precipitates must be completely dissolved by some technical
means (e.g. alkali dissolution).
phono record etc.)
The section 55 of "Testing methods for industrial wastewater," (JIS K0102) is only to measurement
A pressurized acid decomposition method done in a sealed container (a microwave decomposition
method such as [EN 13346:2000 or EPA3052:1996])
An acid decomposition method under the existence of nitric acid, hydrogen-peroxide water and
hydrochloric acid (e.g. EPA 3050B Rev.2:1996).
A wet decomposition method under the existence of sulfuric acid, nitric acid, and hydrogen-peroxide
peroxide water (e.g. BS EN 1122:2001).
The represented extraction methods of EN 71-3:1994, ASTM F963-96a, ASTM F963-03, ASTM D 5517,
and ISO 8124-3 are not applicable for the Pretreatment methods.
If a combination of a Pretratment method and a measurement method can guarantee that the lower
Table 8.2 Main Targets and Effective date of the ban on the delivery regarding "Controlled Substances"
Banned
・ Cadmium plating of electrical contacts, for which high reliability is required
and which has no alternative materials.
・ Parts composed of metals containing zinc (e.g. brass, hot dip galvanizing,
etc.) whose cadmium concentration is more than 75 ppm
Banned since October
1, 2005
Banned
Substances
Exemption
Banned since January
1, 2005
All metals, alloys inorganic compounds, organic compounds, inorganic salts, organic salts and other substances
contained cadmium.
Targets Effective Ban Date
Substance: Cadmium and cadmium compounds
・ The stabilizers, pigments, or dye used for plastic (including rubber)
materials (e.g. insulators of electrical wiring, remote command controllers,
keys, vinyl ties, the outer plastic resins of electrical parts, cabinets, label,
method performing, therefore, the pretreatment methods must be described along with JIS standard.
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
5/15
No.2
・ Packaging components and materials (see 9.1)
・ The paints, and inks containing lead, which are used for PWBs
・ Surface coatings (Plating) for the external electrodes and lead wires of parts
(e.g. electrical parts, semiconductor devices, and heat sinks)
・ The paints and inks used for outer and exposed part of devices.
All purposes except those specified in "Controlled Substances" and "Exemption"
e.g.
etc.
Banned since
January 1, 2005
・ The surface coatings for the external electrodes, lead wires, etc. of the parts
・ The stabilizers, pigments, and dyes contained in the plastic (including rubber)
(Printed wiring board)
materials that are used for outer and exposed part of AC adaptors, power
contained in AC adaptors, remote command controllers, semiconductor devices,
is more than 1000 ppm.
・ The stabilizers, pigments, and dyes contained in the plastic (including rubber)
materials that are used for outer and exposed part of AC adaptors, power supply
Substances: Lead and lead compounds
All metals, alloys inorganic compounds, organic compounds, inorganic salts, organic salts and other substances
contained lead.
Targets Effective Ban Date
Banned since April
1, 2004Banned
Substances
Banned
supply cords, connection cords, remote command controllers, mice.
Banned
Substances ・ All kinds of alloys (including solder materials) whose lead concentration
exceed specified in the table (*1) below,
・ Leaded solder that contents less than 85wt% of lead; and lead concentration
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
・ The paints and inks used for outer and exposed part of devices.
・ Electronic ceramic parts
・ Optical glass, filter glass
Steel less than 0.35 wt%
Aluminum alloy less than 0.4 wt%
Solder (*2) less than 500 ppm
Banned since
February 1, 2006
Type of alloys Allowable lead concentration
(including brass and phosphor bronze)
(i.e. leaded solder containing more than 85wt%)
・ High melting point solder for internal connections used for parts and devices
Copper alloys
Exemption
(*1) Allowable lead concentration
Controlled
Substances plating whose lead concentration is less than 1000 ppm.
・ The glass materials which are used for cathode-ray tubes, electronic
cords, connecting cord, remote command controllers and mice.
materials that are used for outer and exposed part of AC adaptors, power supply
・ Electro less plating films such as electro less nickel plating and electro less gold
・ Solder to complete a electrical connection between semiconductor tip and board
within integrated circuit Flip Chip packages. (including paste under C4 bump)
plating whose lead concentration is more than 1000 ppm.
・ Electro less plating films such as electro less nickel plating and electro less gold
(*2) Allowable concentration of lead contained in conductive materials of solder for
anisotropic conductive film (ACF) and anisotropic conductive paste (ACP)
less than 4 wt%
80wt% and less than 85% by weight.
(piezoelectric ones, dielectric ones, and magnetic ones [ferrites])
・ Solder consisting of more than two elements for the connection between the
components, and fluorescent tubes include resistor elements, conductive pastes
(silver or copper), adhesives, glass frit and sealing materials.
terminals and the package of microprocessors with a lead content of more than
anisotropic conductive film (ACF) and anisotropic conductive paste (ACP)
should be less than solder (*2)
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
6/15
Test objects: Plastic (including rubber), paints and inks.
Allowable concentration : Less than 100 ppm.
Standards for measurements:
1. Pretreatment
Main Pretreatment methods are as follow four kinds:(1) Incineration under the existence of sulfuric acid;
(2)
(3)
(4) A wet decomposition method under the existence of sulfuric acid, nitric acid, and hydrogen-peroxide water
Note:
2. Measurement methods
Main Measurement methods are as follow three kinds:
(1)
(2) Atomic Absorption Spectroscopy (AAS) (e.g. EN ISO 5961:1995)(3) Inductively Coupled-Plasma-Mass Spectroscopy (ICP-MS)
Note:
No.3
・ Packaging components and materials (see 9.1)
・ Paints and inks ・ Hour meters
・ The relays, switches and sensor whose contacts contain mercury.
・ Mercury or its compounds used for mixed in plastics
・ Small-sized fluorescent lights (e.g. for LCD backlight) whose mercury contents is more than 5 mg.
・ Straight-tube fluorescent lights whose mercury contents is more than 5 mg.
・ All purposes except those specified in "Exemption".
・ Lights other than small-sized fluorescent and straight-tube ones. (e.g. high-pressure mercury lamps)
・ Small-sized fluorescent light whose mercury content (per light) is less than 5 mg
・ Straight-tube fluorescent light whose mercury content (per light) is less than 5 mg
No.4
・ Packaging components and materials (see 9.1)
・ Paints, inks and additives etc. as constituents of parts or materials.
A pressurized acid decomposition method done in a sealed container [including microwave decomposition
method: e.g. (EN13346: 2000 or EPA3052:1996)]
An acid decomposition method under the existence of nitric acid, hydrogen-peroxide water and
Inductively Coupled Plasma-Atomic (Optical) Emission Spectroscopy (ICP-AES [ICP-OES])
methods performing, therefore, the Pretreatment methods must be described along with that JIS standard.
(e.g. EN ISO 11885:1998)
In the process of above pretreatment, if any precipitates occurred, must be completely dissolved by taking
some technical means (e.g. alkaline fusion).
hydrochloric acid (e.g. EPA 3050B Rev.2:1996).
The represented extraction methods (including EN 71-3:1994, ASTM F963-96a, ASTM F963-03, ASTM
D 5517, and ISO 8124-3) are not applicable for the Pretreatment. Also EN1122 is not applicable to the
determination limit of lead is less than 30 ppm, the combination is also applicable. Also, both cadmium
and lead can be simultaneously analyzed by each of the measurement methods (except for AAS)
mentioned above.
The section 54 of "Testing methods for industrial wastewater," (JIS K0102), which is only to measurement
Pretreatment methods for lead.
Substances: Hexavalent chromium compounds
Substances: Mercury and mercury compounds
Targets Effective Ban Date
Banned since
January 1, 2005
Banned since
January 1, 2005
Banned
Banned
Substances
If a combination of a Pretratment method and a measurement method can guarantee that the lower
Exemption
Banned
plating or conversion coating.
All inorganic compounds, organic compounds, inorganic slats, organic salts and other substances that contain hexavalent
chromium
Targets Effective Ban Date
Banned
Substances
All metals, alloys, inorganic compounds, organic compounds, inorganic slats, organic salts, and other substances that
contain mercury
・ Residues in the surface of screws, steel sheet etc. that are processed with
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
7/15
No.5
No.6
・ The cabinets of products including accessories and PWBs
No.7
Controlled
Substances ・ All purposes as the flame retardants and plasticizer for plastics, or used for PWBs
No.8
・ All purposes except those classified above.
Effective Ban Date
Substances: Short-chain chlorinated paraffins (SCCP)
Substances: Other brominated organic compounds
Substances: Polybrominated biphenyls (PBB)
Banned
Short-chain chlorinated paraffins with carbon chain length: 10-13
Targets Effective Ban Date
Banned
Substances Banned since
February 1, 2006
Targets Effective Ban Date
Targets
Banned ・ All purposes for oil-filled transformers, capacitors, insulating oils, lubricants,
and flame retardants in plastics.
Substances: Polychlorinated biphenyls (PCB), polychlorinated naphthalenes (PCN), polychlorinated terphenyls (PCT)
Targets
Banned
Substances
Effective Ban Date
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Banned
Substances ・ All purposes for flame retardants contained in plastics
No.9
・ All purposes for flame retardants contained in plastics.
No.10
No.11
Banned
Substances ・ All purposes for paints, inks, preservatives, and fungicides.
No.12
Banned
Substances: Other chlorinated organic compounds
Substances: Asbestos
Targets Effective Ban Date
Banned
Effective Ban Date
Targets Effective Ban Date
Substances: Tributyltin compounds (TBT) and triphenyltin compounds (TPT)
Effective Ban Date
Targets
Banned
Substances
・ The plasticizers or flame retardants contained in plastics, and the flame retardant
Targets
used for PWBs.
Controlled
Substances
Banned
The parts of molding dies which made since January 2003 is banned on use.
Substances: Polybrominated diphenylethers (PBDE) (including decabromodiphenyl ether (DecaBDE)
Targets
Banned since
January 1, 2005
・ The parts made by the molding dies, which were made in or before December
2002 (Applicable only to the bodies of the displyas and TV sets shipped to counties
and regions other then European ones)
Banned
Effective Ban Date
Banned
Substances ・ All purposes for insulators and fillers Banned
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
8/15
CFC-11 Trichlorofluoromethane Bromochloromethane
CFC-12 Dichlorodifluoremethane Bromomethane
CFC-113 Trichlorotrifluoroethane HCFC-21 Dichlorofluoromethane
CFC-114 Dichlorotetrafluoroethane HCFC-22 Chlorodifluoromethane
CFC-115 Monochloropentafluoroethane HCFC-31 Chlorofluoromethane
Halon1211 Bromochlorodifluoromethane HCFC-121 Tetrachlorofluoroethane
Halon1301 Bromotrifluoromethane HCFC-122 Trichlorodifluoroethane
Halon2402 Dibromotetrafluoroethane HCFC-123 Dichlorotrifluoroethane
CFC-13 Chlorotrifluoromethane HCFC-123*
CFC-111 Pentachlorofluoroethane HCFC-124 Chlorotetrafluoroethane
CFC-112 Trichlorotrifluoroethane HCFC-124*
CFC-211 Heptachlorofluoropropane HCFC-131 Trichlorofluoroethane
CFC-212 Hexachlorodifluoropropane HCFC-132 Dichlorodifluoroethane
CFC-213 Pentachlorotrifluoropropane HCFC-133 Chlorotrifluoroethane
CFC-214 Tetrachlorotetrafluoropropane HCFC-141 Dichlorofluoroethane
CFC-215 Trichloropentafluoropropane HCFC-141b* 1,1-dichlore-1-fluoroethane
CFC-216 Dichlorohexafluoropropane HCFC-142 Chlorodifluoroethane
CFC-217 Monochloroheptafluoroethane HCFC-142b* 1-chloro-1,1-difluoroethane
Carbontetrachloride HCFC-151 Chlorofluoroethane
Trichloroethane HCFC-221 Hexachlorofluoropropane
Dibromofluoromethane HCFC-222 Pentachlorodifluoropropane
Bromodifluoromethane HCFC-223 Tetrachlorotrifluoroporpane
Bromofluoromethane HCFC-224 Trichlorotetrafluoropropane
Tetrabromofluroethane HCFC-225 Dichloropentafluoropropane
Tribromodifluoroethane HCFC-225ca* 3,3-dichloro-1,1,1,2,2-pentafluoropropane
Dibromotrifluoroethane HCFC-225cb* 1,3-dichloro-1,1,2,2,3-pentafluoropropane
Bromotetrafluoroethane HCFC-226 Chlorohexafluoropropane
Tribromofluoroethane HCFC-231 Pentachlorofluoropropane
Dibromodifluoroethane HCFC-232 Tetrachlorodifluoropropane
Bromotrifluoroethane HCFC-233 Trichlorotrifluoropropane
Dibromofluoroethane HCFC-234 Dichlorotetrafluoropropane
Bromodifluoroethane HCFC-235 Chloropentafluoropropane
Bromofluoroethane HCFC-241 Tetrachloropentafluoropropane
Hexabromofluoropropane HCFC-242 Trichlorodifluoropropane
Pentabromodifluoropropane HCFC-243 Dichlorotrifluoropropane
Tetrabromotrifluoropropane HCFC-244 Chlorotetrafluoropropane
Tribromotetrafluoropropane HCFC-251 Trichlorofluoropropane
Dibromopentafluoropropane HCFC-252 Dichlorodifluoropropane
Bromohexafluoropropane HCFC-253 Chlorotrifluoropropane
Pentabromofluoropropane HCFC-261 Dichlorofluoropropane
Tetrabromodifluoropropane HCFC-262 Chlorodifluoropropane
Tribromotrifluoropropane HCFC-271 Chlorofluoropropane
Dibromotetrafluoropropane HFC Hydrofluorocarbon
Bromopentafluoropropane PFC Perfluorocarbon
Tetrabromofluoropropane
Tribromodifluoropropane
Dibromotrifluoropropane
Bromotetrafluoropropane
Tribromofluoropropane
Dibromodifluoropropane
Bromotrifluoropropane
Dibromofluoropropane
Bromodifluoropropane
Bromofluoropropane* means substances which are High possibility to be used in the trademark .
Substances Substances
Table 8.2a List of ozone layer destruction materials
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
9/15
No.13
Banned
Substances ・ All purposes for refrigerants, foaming agents, fire extinguishing agents, cleaner.
cleaning agents.
No.14
Test methods (for reference)
The methods for decomposing azo compounds and then extracting amines are as follows,
1.
-Part 1: Detection of the use of certain azo colorants accessible without extraction”
Substances: Specific azo compounds
Targets Effective Ban Date
Azodyes that from any of the amine compounds listed in Table 8.2b through the decomposition methods cited in the EU
Directive 76/769/EEC and amine compounds in Table 8.2a
EN 14362-1:2003,“Textiles-methods for the determination of certain aromatic amines derived from azo
・ The parts or articles that do not come into continuous contact with the human skin.
(e.g. remote command controllers, cushions, and carrying pouches, mice etc)
Banned
Substances
Controlled
Substances
Banned
・ The substances which are used in parts or articles that as a function of
(e.g. ear phones, head phones, shoulder pads for bags, belts, straps)
continuously contact with the human skin.
colorants
Banned
・ HCFC-141B used for refrigerants, foaming agents, fire extinguishing agents and
Substances: Ozone layer depleting substances
Targets
Controlled
Substances
Effective Ban Date
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
-Part 1: Detection of the use of certain azo colorants accessible without extraction”
2. CEN ISO/TS 17234:2003, “Leather-Chemical tests-Determination of certain azo colorants in Dyed leathers”
3.
colorants
-Part 2: Detection of the use of certain azo colorants accessible by extracting the fibers.”
4-aminodiphenyl
Benzidine
4-chloro-o-toluidine
2-naphthylamine
o-aminoazotoluene
2-amino-4-nitrotoluene
p-chloroaniline
2,4-diaminoanisole
4,4’-diaminodiphenylmethane
3,3’-dichlorobenzidine
3,3’-dimethoxybenzidine
3,3’-dimethylbenzidine
3,3’-dimethyl-4,4’-diaminodiphenylmethane
p-cresidine
4,4’-methylene-bis-(2-chloroanilene)
4,4’-oxideaniline
4,4’-thiodianiline
o-toluidine
2,4-toluylenediamine
2,4,5-trimethylaniline
o-anisidine
4-aminoazobenzene
EN 14362-2:2003,“Textiles-methods for the determination of certain aromatic amines derived from azo
92-67-1
92-87-5
Table 8.2b List of specific amine compounds
CAS No. Amine compounds
95-69-2
91-59-8
97-56-3
99-55-8
106-47-8
615-05-4
101-77-9
91-94-1
119-90-4
119-93-7
95-80-7
137-17-7
90-04-0
60-09-3
838-88-0
120-71-8
101-14-4
101-80-4
139-65-1
95-53-4
4-aminoazobenzene60-09-3
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
10/15
No.15
Standard value (emission content) : Obtain the value by any of the following methods:
1. [Champers method]
(the average value during six months)
3. [Desiccators method]
Measurement methods:
1. [Champers method]
3. [Desiccators method] JIS A 5905 (Fiberboards)、JIS A 5908 (Particleboards)
No.16
・ Flexible flat cables (FFC)
・ Sheets and laminates used for the exterior of wooden speakers
・ Insulating plates, decorative panels, labels, sheets and laminates
Banned
・ The wooden products made from fiberboard, particleboard, or plywood,
(e.g. speakers and racks)
Effective Ban Date
Banned since April 1,
2005
blister packs which are used for the accessories that packed with products.
Maximum content: Less than 0.7 mg/1
(Use N=2 to check the average and maximum values)
Aerial density: Less than 0.1ppm (0.124mg/㎥) in an airtight chamber under the
・ Packaging components and materials (e.g. bags, adhesive tape, carton,
are used for personal computers, digital cameras, portable audio
Banned since July 1,
2002
Nonuse since the
beginning
(the value derived from the one-time measurement based on EN120)
Substances: Formaldehyde
2. [Perforator method]
2. [Perforator method]
Substances: Polyvinyl chloride (PVC) and PVC blends
Banned
Substances
(the average value during six months)
(2) Less than 7.0mg in 100 g of a particle board without a surface treatment.
(3) Less than 8.0 mg in 100 g of particleboard without a surface treatment
Banned since January
1, 2005
Targets
・ The wooden products made from fiberboard, particleboard, or plywood,
Banned
Substances
EN 717-1:2004 (Wood based panels; determination of formaldehyde release;
formaldehyde emission by the chamber method)
EN 120 (Wood based panels; determination of formaldehyde content; extraction method
called perforator method; German version EN 120:1992)
Targets Effective Ban Date
Banned since January
1, 2005
(1) Less than 6.5mg in 100g of a particleboard without a surface treatment.
Average content : Less than 0.5 mg/1
terms of volume is 12㎥, 1㎥ or 0.0225㎥
Banned
・ Heat shrink tubes
Banned since April 1,
2007
・ Cable ties used for accessories and connecting cords
which are employed in products for Europe. (e.g. speaker and racks etc)
which are employed in products for the areas other than Europe.
・ Substances for Felica contactless IC board
(excluding for professional use)
・ Coatings agents and fabrics for carrying bags carrying case, pouches, which
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
11/15
・ Harnesses and processing wires (e.g. coaxial cable, flat-cable, double insulation
wires, and shielded wires)
・ Photographic paper
・ Insulation caps for capacitors, power supply switches, and fuses.
・ Suction cups for mounting in-vehicle products.
・ Wiring clip used for the inside of devices (polyvinyl chloride coated metal)
Other parts except those classified into "Banned Substances" and "Exemption".
・ Coating agents and fabrics for carrying bags, carrying cases, and carrying
・ Connecting cord (2): connecting cords for USB, i.LINK, video cords, AC adaptors
secondary leads, flat cable, multi core cables, speaker cords etc.
・ Coating for insulation and protection used for the inside or outside of devices,
insulating tubes, carrying belts, spacers, holders, covers, ducts, etc.
・ Power supply cords (including plugs, connectors, or cord bushes ) for use in
Japan, the U.S., and Canada: [2P/3P]
parts packaging.
Substances: Polyvinyl chloride (PVC) and PVC blends
Effective Ban DateTargets
・ Used the parts of the wires consisting connector and motor leads for internal
wiring of machine.
(e.g. cables for earphones, head phones, and earphone mics).
Controlled
Substances
・ Connecting cord (1): for wearable equipment
pouches of electronics products for industrial.
・ Tray, magazine stick, reels, embossed carrier, tapes used by parts suppliers for
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Other parts except those classified into "Banned Substances" and "Exemption".
・ Binder for resins.
・ High-voltage polyvinyl electrical wires.
・ Insulating tapes.
・ Speaker grilles.
・ Power supply cords designed (except for use in countries and regions other than
specified in "Controlled Substances")
・ The part of transformer leads (which is fixed by varnish impregnation).
・ Curl cords
・ Extra fine cable that are AWG36 or more
No.17
Controlled
Substances ・ Specific uses which have no alternative materials
No.18
Controlled
Substances ・ All purposes.
Substances" and are composed of vinyl chloride copolymers or blends of PVC and
other polymers.
Substances: Beryllium oxide
(e.g. cables for broadcast cameras and microphone)
・ Professional-use cables for which general-purpose ones cannot be substituted
Exemption
Substances: Beryllium copper
・ All purposes except those specified in "Controlled Substances".Banned
Substances
・ Parts that are not classified into "Banned Substances" and "Controlled
Targets Effective Ban Date
Targets Effective Ban Date
Banned Since April 1,
2008
Substances
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
12/15
No.19
DEHP 117-81-7 Di (2-ethylhexyl) phthalate
DBP 84-74-2 Di-n-butyl phthalate
BBP 85-68-7 Butyl benzyl phthalate
28553-12-0
68515-48-0
26761-40-0
68515-49-1
DNOP 117-84-0 Di-n-octyl phthalate
DNHP 84-75-3 Di-n-hexyl phthalate
化学名
No.20
・ Materials used for parts whose PFOS concentration is more than 0.1wt%
e.g.
leather), fluoropolymer coating, adhesive, and sealant etc.
・ Photographic coatings applied to films, paper, or printing plates
・ Photoresists or anti reflective coating for photolithography processes
No.21
Ultraviolet protectants and ultraviolet absorbers applied to following:
・ Decorative laminate
・ Photographic paper
・ Molded plastic parts
DIDP
plugs and connectors
Banned
Substances
Banned since April 1,
2008
Targets Effective Ban Date
Diisodecyl phthalate
Diisononyl phthalate
・ Textiles or other coated materials whose value of PFOS is 1µg/㎡ or
Banned
Substances
Effective Ban Date
Substances: Specific benzotriazole
Substances: Specific phthalates (DEHP、、、、DBP、、、、BBP、、、、DINP、、、、DIDP、、、、DNOP、、、、DNHP)
Controlled
Substances
Targets Effective Ban Date
All specific phthalates in Table 8.2
DINP
Chemical
・ Plasticizer in polyvinyl chloride resin used for cable coating, cord sheath,
Table 8.2c List of specific phthalates (phthalates esters)
Abbreviation CAS No.
2-(3'5'-Di-tert-butyl-2'hydroxyphenyl)-benzotriazole) (CAS No.3846-71-7)
Targets
agent, oil repellent agent, antifouling agent (e.g. textile, film, paper,
more of the coated material.
Banned since April 1,
2008
Exemption
Substances: Perfluorooctane sulfonates (PFOS)
Electroplating, paint, colorant, dye, materials coated with water repellent
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
13/159. Regarding the Packaging Components and Materials matters
(1) Definition of "packaging components and materials".
Note:
In addition to Table 8.1, based on the provisions of laws, the following conditions must be satisfied :
Banned
Substances ・ All packaging components and material as of Table 9.1a
Exemption ・ Cartons for returnable boxes owned by carriers or parts suppliers
Allowable concentrations:
Measurement standards:1. Pretreatment
For cadmium and lead, follow the methods respectively specified in cadmium (*3), lead (*4) .
For total chromium, follow the methods which specified in (*3 ) cadmium.
For mercury, typical test methods are as follow three kinds:
(1) A pressurized acid decomposition method done in a sealed container
[including microwave decomposition method (EPA 3052:1996)]
(2) A heating evaporation-cold-vapor mercury-atomic-absorption method
(3)
Note:
2. Measurement methods
Standard methods for detecting hexavalent chromium:
Detecting methods:
1. Pretreatment Extraction methods [Boiling water extraction and alkaline extraction (e.g. EPA 3060A)]
2. Measurement methods Ultraviolet-Visible Spectroscopy (e.g. EPA 7196A)
and total chromium in packaging components and materials is more than 100 ppm.)
(Standard methods for detecting the total concentration of the four elements of cadmium, lead, mercury,
(*4) Refer to test objects: plastics (including rubber), paints and inks " Substances: Lead and lead compounds" in Table 8.2
"Targets" and "Effective Ban Date" regarding "Controlled Substances".
quantification as less than 5 ppm for mercury, less than 5 ppm for cadmium, less than 5 ppm for the total chromium,
If a combination of a pretreatment method and a measurement method can guarantee the lower detection limits of
and less than 30 ppm for lead, the combination is also available. Also cadmium, lead, and total chromium can be
simultaneously analyzed by each of the measurement methods (except for AAS) .
in table 8.2 "Targets" and "Effective Ban Date" regarding "Controlled Substances.".
(*3) Refer to "Test objects: plastics (including rubber), paints, inks," "Substances: Cadmium and cadmium compounds,"
1. First analyze total chromium content and verify that the total concentration of 4 metals: cadmium, lead, mercury and
total chromium is less than 100 ppm. In this case, analyzing the same Pretreatement methods as those used for cadmium
and lead are applicable.
2. If this total concentration is more than 100 ppm , verify that the sum of the cadmium, lead and mercury concentration
in (*3) and (*4). When the mercury concentration is predicated to be low, use a reduction-evaporation atom-
a hydride-generation apparatus will be more suitable.
absorption method or ICP-AES (ICP-OES) method with a hydride-generation apparatus and ICP-MS method with
and precipitates if occurred, must be completely dissolved by some technical means.
specified as below (*3) cadmium and (*4) lead.
Regarding the measurement of mercury concentrations, follow the same methods as cadmium and lead specified
Table 9.1 Regarding the Packaging components and materials matters
Regarding the measurement of cadmium; lead; and total-chromium concentrations, follow the methods
contained in plastics (including rubber) , paints, and inks, however, regulations of "Cadmium and cadmium compounds"
and "Lead and lead compounds" must also be satisfied.
(Typical plastic parts: handles, polyvinyl bags, cushions, films, trays, reels, adhesive tapes, magazine sticks [including
stoppers] and bands)
is used to decompose mercury by sulfuric acid or nitric acid.
In the process of above Pretreatment method, particular attention is required to avoid mercury sublimation,
A wet decomposition method (Kjeldahl method) in which a decomposition flask with a reflux condenser
・ The allowable total concentration of cadmium, lead, mercury, and hexavalent chromium contained in each parts, ink, or
paint that constitutes a package shall less than 100 ppm. Regarding allowable concentrations of cadmium and lead
is less than 100 ppm limit. When the sum of the cadmium, lead and mercury concentration is less than the 100 ppm
limits, analyze and confirm that no hexavalent chromium is present eventually.
Packaging components and materials are defined as products made from any materials and components
to be used for the "containment", "protection", "handling", "delivery" and "presentation" of good, from
raw materials to process goods, and from the producer to the user or consumer.
The definition excludes the components and materials for the returnable boxes, which are reused or
recycled under the control of carriers or suppliers, and are not disposed of by end-users or the
Substances: Heavy metals (Cadmium, mercury, hexavalent chromium and lead)
Targets Effective Ban Date
Banned
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
14/15
Note: Following are not include all kind of packaging components and materials
1 Carton (Box) Single carton, sub-master carton and master carton made from any materials.
2 Cushion
3 Protection bag (sheet) Foamed plastic or nonwoven fabric.
4 Poly bag
5 Envelope Envelope for Warranty card.
6 Blister pack
7 Film Including protection films for the LCD displays.
8 Clam shell
9 Separator/spacer
10 Printing ink Use for painting packing components and materials .
11 Adhesive tape Use for carton packing, poly bag, or, fixing or protecting for removable components.
12 Staple
13 Label Sticked on the packing components under control of the company such as bar-code label.
14 Joint Carton joint etc.
15 Binding band Such as PP band etc.
16 Handing tab
17 Carrying handle Handle and its related components.
18 Crate Wooden frame.
19 Shrink film
20 Bottle
21 Sleeve
Table 9.1a Specific examples of Packaging Components and Materials
PACKAGINGFor Consumer and Industrial products ((((used for transporting company products)
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
21 Sleeve
22 Packaging case Such as box, case for fountain pen and cosmetics.
23 Skid
3 Used for Headphones, camera etc. which are defined as a part of product.
4 Label
5 Label Pasted by third-parties such as cargo label, invoice etc.
1 Magazine stick Used for IC transportation purpose.
2 Stopper
3 Tray
4 Reel
1 Pallet
2 Crate Such as wooden container.
3 Stretch film Wrap around cargo for prevent from collapse.
4 Wooden container
5 For over packing Carton, cushion, and adhesive tape used for component delivery.
6 Band or string Such as PP band etc.
Carrying case/Pouch
Label pasted to products and others except those pasted to packaging components and
materials
Made from wood, plastic, paper etc. which is used in one-way transportation including
slip sheet.
NOT PACKAGING
PACKAGING
PACKAGING
NOT PACKAGING
For transportation and distribution items
For Devices, Semiconductors, and any other components
CD case/Bag1Cases, bags and spindle case which are defined as part of product such as Video tape,
CD, MO, MD、DVD etc.
Index-card, label for CD and other recording media which are defined as a part of
product.Index card/Label2
1 Such as 40 ft vessel container and air cargo containerVessel container/air
container
NOT PACKAGING
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.
Appendix-1: HS-803-03000
15/15
Revise resume
Establishment Established on May 29, 2002
Revision
Added A footnote to Table 1 chlorinated paraffin class.
Deleted Table.2 and raising the number of table.
Added 4-aminoazobenzene to Table.2
Modified Table 4 "The main purpose of reducing substance and targets of total eradication".
Added /Pb into "Environment-related substances (Cd) content measured Table".
added " within the range of the observance of the law, with the customer
demand is not limited".
Overall review.
Reviewed *Banned substances and banned substances time limit policy.
Reviewed as below
Added *Limit, allowance value, purpose and target to "Impurity".
Added *Concerning the test methods of Pretreatment and test methods.
Changed Management method (from company to QMS-office ).
*Changed title.
*As an appendix of "Management Standards for the Environment-related Substances".
Overall *Environment-related substances.
Reviewed *Written guarantee concerning material contained in product.
Added The allowance concentration and analysis methods of four heavy-metal which are
contained in Lead and packaging materials.
" Cadmium and cadmium compound".
Changed "The time limit of the banned target" to "effective ban date"
and time limitation of lead contained in an external exposed portion of plastic to
"the end of February in 2004". also, as the terms and condition of lead and PVC,
to product.
Ver.3.0 April 24, 2008
Ver.2-0 February 12, 2003
Ver.2-4 March 1, 2006
Ver.2-4 March 6, 2007
Ver.2-3 September 1, 2005
Ver.2-2 September 1, 2004
Ver.2-1 September 17, 2003
Added Allowance concentration of cadmium and lead in the footnote of Table.1
Added *The measurement control with the fluorescent, X-ray analysis devices.
Reviewed *Targets substances and investigation method of used in production process
Management Standards for the Environment-related Substances
Hirakawa Hewtech Corp.