Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate...

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Ventec International Group 12/12/2018 Option Technologies

Transcript of Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate...

Page 1: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

Ventec International Group

12/12/2018

Option Technologies

Page 2: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

12/12/2018

Manufacturing Capabilities

Item Capability1 layers 4, 6, 8,10,12 (layers)

2 Cu 1/3 OZ 、 HOZ、1OZ、 2OZ 、3OZ

3 maximum (PNL) size 20” x 30”

4 minimum (PNL) size 10” x 12”

5 minimum core thickness 3 mil H/H

6 minimum L/S 3/ 3mil

7 minimum thickness of different layers 11 mil (4L) 、49mil(12L)

8 inter-layer alignment ± 3 mil

9 tolerance of forming size ± 1mm

10 warp <0.75%

11 minimum hole size 0.15mm / 6mil

12 maximum hole size Up to 10mm / 0.254”

• working to IPC Standards

Page 3: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Quality and Approvals

• ISO-9001• ISO-14001• QA reports generated with all jobs• All inner-layers are 100% AOI• Individual processes demonstrate detailed QA procedures• A detailed “Skills Matrix” is displayed in all departments

Page 4: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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CAM Department

• Genesis software • 24/7 operation • average throughputs: 10 new parts

per day

Page 5: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Photography

• Orbotech LP-7008 photoplotter • maximum size of photographic film: 26*32” • minimum line width and line spacing 2/2mil• cleanroom garments are worn in this

department

Page 6: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Cutting

• diamond cutting saws• maximum cutting size: 1092*1245

Page 7: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Chemical Clean

• sulfuric peroxide based cleaning process.

• four stage cascade rinsing, followed by drying

• etching rate is controlled to 0.6um• Process control etch rate sampling is

carried out on a per shift basis.• Loading and unloading is fully

automated.

Page 8: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Photomech - Dry Film Lamination

• automatic cut sheet laminator with thin core capability

• pre-heat & hold station• eternal dry film 20um

thickness• class 10000 cleanroom

Page 9: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Photomech - lmaging

• fully automated exposure units• throughput: 100 panels per hour• camera alignment accuracy: <15um

Page 10: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Develop Etch Strip

• Cupric based etch media• minimum line width: 3.0mil• minimum line spacing: 3.5mil • minimum panel thickness: 3.0mil

(excluding copper)• maximum size: 21.5” x 24.5”

Page 11: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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AOl Process - Orbotech

• two AOI machines• three offline verification stations• the inner layer is scanned, barcoded,

interlaced, and then sent to fault verification

Page 12: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Alternative Oxide

• line speed: 3.5 meters/min• Etch rate: 1.5 +/- 0.3 um• maximum size: 21.5” x 24.5”

Page 13: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Build Up

• all inner-layers are visually inspected at build up

• layers are built up with small rivets and flattened

• all multilayers are then 100% inspected by X-Ray

• any panels showing mis-registration will be rejected

• all operators wear cleanroom garments

Page 14: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Lay Up Stations

• all panels are built on large format stainless steel panels

• panels are built free with oversize foil -for example, a 24” x 21” panel would be built four panels per page

Page 15: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Presses & Press Capacity

• large format presses with auto-load &unload facility

• four presses all with 8-openings• capacity: 5000 panels per day based on

a 24*18” 1.6mm panel• 320 panels per press load

Page 16: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Press Control

• all presses have chart recorders for each individual press and platen

• the data is available from each press cycle recording both platen & product temperature

• buffering is 160gsm Kraft Paper• kraft paper is not reused

Page 17: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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X-ray Drilling

• four ADT-900 X-ray drill machines• all four machines optimised in both X & Y• all panels are interleaved before and after

drilling

Page 18: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Routing

• two route machines with four spindles each• programs all ensure radius corners • typical height is 5 high for a 1.6 mm panel

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Edge Milling

• all panels are edge milled• four individual “v” blades for cutting each

edge • maximum panel thickness for edge milling

is 3.2mm

Page 20: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Bonding Inspection

• all panels are checked for 100% surface defects, including pits, dents, resin spots or creases

• a thickness check is also performed using deep throat micrometer

• tooling hole diameters are verified using a plug gauge

• outer copper is verified using a copper scope

Page 21: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Drilling

• 240 drill spindles• capacity: 8000 panels per day• process runs 24/7 • mechanical drilling • minimum hole size 0.15 mm

Page 22: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Drilling

• a first off x-ray inspection is carried out prior to batch processing

• for batch inspection the bottom panel of each stack is x-ray inspected

Page 23: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Spindle Accuracy

• all spindles are checked for accuracy twice per week

• reports are available for drill accuracy• hole positional checks are verified by AOI

inspection

Page 24: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

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Hole Checking

• after drilling all panels are processed through a high pressure rinse and then inspected through the automatic hole for missing/blocked holes

Page 25: Ventec International Group...• etching rate is controlled to 0.6um • Process control etch rate sampling is carried out on a per shift basis. • Loading and unloading is fully

Ventec International Group

12/12/2018