VCSELs: Technologie, Industry and Market Trends · 2019-04-03 · in the fields of LED, OLED and...

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From Technologies to Market VCSELs Technology, Industry and Market Trends 2018 Report Sample July 2018

Transcript of VCSELs: Technologie, Industry and Market Trends · 2019-04-03 · in the fields of LED, OLED and...

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From Technologies to Market

VCSELs

Technology, Industry and Market Trends

2018 Report

Sample

July 2018

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Biographies and contacts

ABOUT THE AUTHORS

Pierrick BOULAY -Technology & Market Analyst, Solid-state Lighting

As part of the Photonics, Sensing & Display division at Yole Développement (Yole), Pierrick Boulay works as Market and Technology Analyst

in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED

lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting

applications. Pierrick holds a master degree in Electronics (ESEO - France).

Contact: [email protected]

Pars MUKISH - Business Unit Manager,Solid-State Lighting& Display

Pars Mukish holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology

Management (EM Lyon - France). Since 2015, Pars has taken on responsibility for developing SSL and Display activities activities as Business

Unit Manager at Yole Développement (Yole). Pars is part of the Photonics, Sensing & Display division at Yole. Previously, he has worked as

Marketing Analyst andTechno-Economic Analyst for several years at the CEA (French Research Center).

Contact: [email protected]

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o About the Authors P6

o Report Objectives P7

o Glossary P8

o Companies cited P9

o Executive Summary P10

o Preliminary Definitions and Principles P33

• Laser diodes - Definitions used in the report

• Incoherent light vs. Coherent light

• Time-of-flight (ToF)

• Single mode vs. multi mode

o VCSEL Overview P39

• Definitions

• Applications as a function of the electromagnetic spectrum

• VCSEL in the semiconductor light source environment

• History of VCSELs

• VCSEL structure

• VCSELs in the electromagnetic spectrum

• IR spectrum

• Visible spectrum

• UV spectrum

• Timeline of main applications for VCSELs

o VCSEL Landscape P51

• Classification of VCSEL applications by wavelength

• Classification of VCSEL applications by market segment

• Classification of VCSEL applications by function

• Introduction

• Segmentation matrix

• Mapping of applications

• Focus on detection

o VCSEL Market P59

• 2017-2023 market volume (Munits)

• Split by application

• Split by segment

• Relative market share by application

• Relative market share by segment

• 2017-2023 market revenue ($M)

• Split by application

• Split by segment

• Relative market share by application

• Relative market share by segment

• 2017-2023 growth trends by application

• Market growth relays

• VCSEL ASP

• Trend related to VCSEL surface

• Trend related to VCSEL power

• MOCVD reactor opportunity

TABLE OF CONTENT (1/4)

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o VCSEL Applications P75

• Datacom

• Active optical cable

• Plastic Optical Fibre (POF) in automotive

• Laser printer

• Industrial heating system

• Proximity sensors

• Autofocus systems

• Gas sensors

• Computer mice

• Pulse oximeters

• LIDAR

• Surveillance cameras

• Eye tracking systems

• Face recognition

• Gesture recognition

• Optical Coherence Tomography (OCT)

o VCSEL Manufacturing (1/2) P123

• VCSEL vs EEL

• Basic properties of VCSELs

• VCSEL specifications vs. Application requirements

• Epitaxy

• Molecular Beam Epitaxy (MBE) technique

• Metalorganic Chemical Vapor Deposition (MOCVD) technique

• Main challenge

• MBE vs. MOCVD

• Trends - Toward 6” manufacturing

o VCSEL Manufacturing (2/2) P123

• Key front-end process steps

• Distributed Bragg Reflector (DBR)

• Confinement

• Main methods

• Focus on selective lateral oxidation

• Oxide aperture diameter

• Reliability aspects

• Failure modes

• Use of ESD protection

• The case of array manufacturing

• Overview

• Process example

• Front-end manufacturing control

• Overview

• Epitaxy

• MESA etching

• Oxidation

• Packaging

• Overview

• Focus on bonding

o VCSEL Industry (1/3) P153

• Overview

• Device players - Mapping by country and application

• Epiwafer suppliers

• Players mapping by position on the supply chain and business models

TABLE OF CONTENT (2/4)

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o VCSEL Industry (2/3) P153

• Trends

• From datacom to 3D sensing

• Evolution of players positioning

• A new wave of investment / M&A has already started!

• Datacom vs. consumer ecosystem

• Focus on datacom ecosystem

• Focus on consumer ecosystem

• New entrants

• Apple vs. Android ecosystem - Status & Trends

• Apple’s IPhone X supply chain (tentative)

• VCSELs in iPhones - 2017 vs. 2023

• Android smartphone makers supply chain (tentative)

• Discussion on supply chains

• Other supply chain examples (tentative)

• Capacity of main VCSEL device players

• Key players

• 2017 market shares (tentative)

• Company profile

• Lumentum

• Finisar

• II-VI

• ams and Princeton Optronics

• Philips Photonics

• Capacity of main VCSEL device players

o VCSEL Industry (3/3) P153

• Consumer and mobile Landscape

• Status of the 3D imaging industry

• Recent key moves in the 3D imaging industry

• Current companies’ positioning within the industry

• 3D sensing could be the magic bullet for mobile user interface

• Use cases and opportunities of the rear 3D camera

• 3D camera adoption scenarios

• Automotive landscape

• Status of the 3D imaging industry

• Recent key moves in the 3D imaging industry

• Overview of potential applications

• Automotive LiDAR ecosystem

• Growing Interest of Tier-1s for LIDAR

o VCSEL Intellectual Property Landscape (1/2) P207

• Overview

• Timeline of IP activity related to VCSELs

• Geographic map of patent applications and corresponding current legal status

• Focus on China

• Ranking of patent applicants according to the number of their patent families

• Current legal status of patents filed by the main patent applicants

• Ranking of patent assignees according the number of their enforceable patents

• Ranking of patent applicants according the number of their pending patent

applications

• Focus on historical IP players - Time evolution of patent publications

• Focus on IP newcomers - Time evolution of patent publications

TABLE OF CONTENT (3/4)

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o VCSEL Intellectual Property Landscape (2/2) P207

• Patent segmentation

• Main patent applicants per applications

• Time evolution of patent publications by applications mentioned in the patents

• Promising segments analysis - 2/3D imaging, LIDAR and consumer applications

• Main patent applicants per application segment according to the number ofpatent families

• Main IP players

o Conclusion P226

TABLE OF CONTENT (4/4)

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COMPANIES CITED IN THIS REPORT (NON-EXHAUSTIVE)

Accelink, Aixtron, Alight, ams, Anadigics, Apple, Arima Lasers Corporation, Asus, Audi, Avago, AWSC, Beam Express, Blackmore, Bosch, Broadcom, Cable solutions, Canon, Changelight, Continental, Device Innovation, Egismos Technology Corporation, Emcore,

Epistar, Epiworks, Excelitas, Finetech, Finisar, FLIR, Foxconn, Fuji Xerox, Fujitsu, Global Communication Semiconductor, Google, Hamamatsu, Hella, Heptagon, Himax, HLJ, Honeywell, Honor, HTC, Huawei, Ibeo, iHealth, II-VI, Infineon, Infinera, Inneos, Innoluce,

Innoviz, Intel, IntelliEpi, IQE, JDSU, Journal of semiconductors, Kaiam, Koito, Landmark Opto, Lasermate, Lasertel, Laytec, LeddarTech, Lenovo, LG, Lumentum, Luminar, Luxnet, Magneti Marelli, Mantis Vision, Masimo, Namuga, Oclaro, Oculus, Omnivision, OnePlus, Oppo, Optek Technology, Optical Society of America, Optovue, Optowell, Orbbec, Osram, Oxford Instruments, Palomar

Technologies, Philips Photonics, Picolight, pmd, POET Technologies, Primesense, Princeton Optronics, QSI, Quanergy, Rasirc, Raycan, Realsense, Riber, Ricoh, Robosense, Samsung, Sanan, Santec Corporation, SCAT, Seiko Epson, Seminex, SensL, Shiraz University, Sick, SinoSemic, SoftKinetic, Sony Corporation, Stanley, STMicroelectronics, Sumitomo Chemicals, Sunny optical technology, Suoer, Taiyo

Nippon Sanso, Tetravue, Texas Advanced Optoelectronic Solutions, Thorlabs, Trilumina, Truelight Corporation, Tyson Technology, Ulm Photonics, Ultra Communication, US Lasers Inc., Ushio, Valeo, Varroc, Veeco, Velodyne, Vertically Integrated Systems, Vertilas,

Vertilite, Viavi, Vivo, Vixar, VPEC, Wavetek, Win Semiconductor, Xiaomi, Zephyr Photonics, ZF, and more.

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This report aims to give a comprehensive picture of the forces driving the VCSEL light source market, technologyand industry in the short,middle and long term.

• Allow readers to understand the global landscape related toVCSELs.

• Review main applications of VCSELs, giving insights on principles, technology, technical requirements, trends,key players and more.

• Analyse the technology and industry behind VCSEL light sources and their integration into sensors andmodules.

• Provide and analyze market forecasts forVCSEL light sources from 2017 - 2023.

• Also, an Intellectual Property (IP) analysis is presented in order for the reader to better understand the patentlandscape related to VCSEL device, system and applications.

REPORT OBJECTIVES

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ToF camera history:

• According to different measurement methods of flight time, ToF technology can be classified into pulse/flash, continuous wave, pseudo-random number and compressed sensing.The continuous wave flight time system is also called the ToF camera.

• ToF cameras were invented at the Stanford Research Institute in 1977. Limited by the detector technology of the time, thetechnique wasn’t widely used.Fast sampling of received light didn’t appear until the lock-in CCD technique was invented in the 1990s.

• In1997, Dr. R Schwarte (of the University of Siegen, Germany) put forward a method of measuring the phases and/ormagnitudes of electromagnetic waves based on the lock-in CCD technique. With this technique, his team invented the firstCCD-basedToF camera prototype. Afterwards,ToF cameras began to develop rapidly.

Time-of-flight (ToF)

PRELIMINARY DEFINITIONS AND PRINCIPLES

Time-of-flight principle

Source: TeraRanger

Principle:

• The ToF principle is a method for measuring the distance between a sensor and an object, based on thetime difference between the emission of a signal and its return to the sensor after being reflectedby an object. The ToF principle can be used to measure a distance in 2D but can also be used in camerasfor 3D applications.

Development history of ToF

cameras

Source: Depth Errors Analysis

and Correction for Time-of-

Flight (ToF) Cameras; Ying He,

Bin Liang, Yu Zou, Jin He and

Jun Yang

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• The laser diode family falls into two basic structures:

• Edge Emitting Lasers (EEL) which emit from the edge of their structure.

• Surface Emitting Lasers (SEL) which emit from the top (or bottom in some cases) of their structure.

• VCSEL is the acronym for Vertical Cavity Surface Emitting Laser and is considered as a surface emitting laser.

• Regarding the structure of SEL, they are more complex than EELs as the resonant cavity must be built using up to 40 epitaxiallayers of p-type and n-type material and various optical materials to create a Bragg reflector that uses the different refractivityof material layers to create full mirrors at the bottom and partial mirrors at the top.

• VCSELs can be packaged in SMD like LEDs or in TO-46 package. A VCSEL array is usually hermetically sealed in a package withan optical element.

Definitions

VCSEL OVERVIEW

VCSEL in TO-46 package VCSEL in SMD package

Source: Philips Photonic

Source: The Optical Society of America

Surface emitting laser

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Applications as a function of the electromagnetic spectrum

VCSEL OVERVIEW

Visible Light

380 to 750 nm

Ultraviolet Light

100 to 380nm

Infrared Light

750 to 1,000 nm

General lighting

Horticultural

lighting

Automotive

lighting

Remotes

850nm Fiber telecom

Up to 1,400nm

Security camera

850 to 940nm

Ink curing

380nm

Water disinfection

285nm

There are plenty of applications, each using a dedicated part of the electromagnetic spectrum. In these applications,

traditional light sources can be used but also Solid State Lighting (SSL) sources like LED, lasers or VCSELs.

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VCSELs in the electromagnetic spectrum - IR spectrum (1/2)

VCSEL OVERVIEW

VCSEL in the infrared (IR) spectrum:

• The VCSEL is a new class of semiconductor laser that can be monolithically fabricated. The first device that came out in 1979,was manufactured using GaInAsP/InP materials for the active region and emitted at a wavelength of 1,300nm.

• The first room-temperature continuous-wave (CW) device using GaAs material was demonstrated in 1988 and emitted at awavelength of 850nm.

• Since 1992,devices at wavelengthof 980,850 and 780nm were commercialized.

• To emit at a longer wavelength (i.e.: 1,300 or 1,500nm) in the infrared range,materials like GaInAsP/InP have to be used.

• InfraredVCSELs are used in a wide variety of applications:

• Optical communications.

• Optoelectronicequipment.

• Optical sensing.

• 3D sensing.

• (…).

• Up to now,VCSELs at 850nm or 940nm are mainly used in optical communications or optical sensing applications.

Most of current applications use VCSELs in the infrared spectrum.

A GaAs-based VCSEL structure

Source: "Etch damage and deposition repair of vertical-cavity surface-emitting lasers" article

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Classification of VCSEL applications by wavelength

VCSEL LANDSCAPE

Most of today’s VCSEL applications are in the red or near-infrared (NIR) ranges.

RED AND IR VCSEL SOURCES

RED650nm – 750nm

NIR750nm – 1,400nm

SWIR1,400nm – 3,000nm

XX

Computer Mice

XX

XX

Datacom

XX

XX

Proximity sensors

XX

XX

XX

XX

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2017-2023 market volume (Munits) - Split by application

VCSEL MARKET

The VCSEL market is expected to grow from 652M units in 2017 to 3.3Bunits in 2023.

CAGR 2017-2023 = 31%

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VCSEL ASP -Trend related to VCSEL power

VCSEL MARKET

Regarding ASP trend, consumer applications are the first able to implement VCSELs at low price. Automotive applications will implement VCSELs at longer term due to their high ASP.

Legend:

Consumer

Automotive

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• Description:

• Laser printing is an electrostatic digital printing process. It produces moderate to high-quality text and by repeatedly passing a laser beam back and forth over a negativelycharged cylinder called a "drum" to define a differentially charged image.

• Principle:

• A laser beam projects the required image to be printed onto an electrically chargedcylinder known as a "Drum Unit". The Drum Unit is a rotating selenium cylinder withphotoconductive properties.

• The drum then selectively collects electrically charged powdered ink (toner), andtransfers the image to paper, which is then heated in order to permanently fuse the text,imagery, or both.

• Characteristics:

• Lasers are used because they are able to form highly focused, precise, and intense beamsof light, especially over the short distances inside of a printer.

• The typical laser for this application is the aluminum-gallium-arsenide (AlGaAs) laser at760 nm.

• Since 1995, Fuji Xerox has investigated in replacing the laser diode by a VCSEL array anda laser printer based onVCSEL was launched in 2003.

Overview

LASER PRINTER

Focus on laser diode application

Laser printing principle

Emission

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A device with multiple applications

PROXIMITY SENSORS

And enabling gesture recognition capabilities with the implementation of a single or multiple sensors…

XX

Range Applications

XX m

XX m

10 cm

Smart lighting / smart buildingDronesVacuum cleanersLaptops

Laptops Vacuum cleaners

Smartphones

Tablets

Tablets

Automatic faucet Automatic soap dispenser

• Optical 3D gestures can complement

existing systems.

• It can reduce XX with more

information on order and position.

• More XX can be recognized enabling

more functions.

DETECTION /

SENSING

PHOTODIODE

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• The human vision has two components:Foveal and peripheral.

• The small foveal region is densely packed with cones providing sharp and detailed vision over an approximately 15° FOV.

• Peripheral vision covers a much wider FOV but lacks acuity.

• Tracking the user’s gaze allows the improvement of graphics performance in the foveal area and a reduction in rendered imagequality in the periphery.

• Foveated rendering is an area of active development in VR. Current limitations include speed and accuracy of eye tracking andthe high sensitivity of the peripheral vision to flickering.

Focus on virtual reality (VR) (2/2)

EYE TRACKING SYSTEMS

The eye tracking system detects that the user is focusing on the clock above the blackboard.

In the left image, the system renders the whole scene at high resolution.

In the right image, the system uses foveated rendering to render an extremely high level of detail in an approximately 15° area around the point where the eye is looking, and a much lower level of

detail in the periphery.

Source: NVIDIA

DETECTION /

IMAGING

CIS + IMAGE

PROCESSING

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IPHONE X –TRUEDEPTH MODULE ANALYSIS

FACE RECOGNITION

High-contrast IR dot projector

30K density (200x150) (Min. for FR 160x120)VCSEL XXnm

VCSEL + ToF detector

VCSEL + XX XXMp XX CIS camera

1.4Mp IR CIS camera

DETECTION /

IMAGING

CIS + IMAGE

PROCESSING

• VCSELs are used for several applications in the iPhone X:

• In the proximity sensor module: XXnm VCSEL with XX cavities packaged near a XX array

• In the flood illuminator module: 850nmVCSEL made of XX cavities (XXxXX matrix).

• In the dot projector module: XXnm VCSEL made of XX cavities in a random pattern

• The dot projector module is used to project a 30,000 dots pattern on the user's face.

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VCSEL specifications vs. Application requirements (2/2)

VCSEL MANUFACTURING

High power VCSELs will need a high power output and high number of cavities.

Die Size:

0.02 to 0.06mm²

Power:

XX to XXmW

Applications:

XX, proximity sensor

Die Size:

0.06 to XXmm²

Power:

10 to XXmW

Applications:

XX, XX, iris scan, XX

Die Size:

0.4 to XXmm²

Power:

200 to XXmW

Applications:

XX

Die Size:

XX to XXmm²

Power:

XX to XXW

Applications:

ADAS LIDAR, XX

Source: Daiwa, System Plus Consulting, Yole Développement

Number of cavity:

1 to 8

Number of cavity:

3 to XX

Number of cavity:

XX to 200

Number of cavity:

XX to > 5,000

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Key front-end process steps - Confinement - Main methods

VCSEL MANUFACTURING

• Several methods have been used to achieve current confinement to a pre-defined active area:

• Simple mesa etching of the top mirror.

• XX to create highly resistive semiconductor regions.

• XX.

• Mesa etching incurs scattering losses of the optical field and may cause reliability problems if the active region is exposed toair.

• XX has been the first method employed to fabricate commercialVCSELs of outstanding producibility and reliability.

• XX, introduces less optical losses in the cavity and has led to a leap ofVCSEL performance.

• Nowadays, the vast majority of commercialVCSELs relies on XX.

The XX will force the current to flow through a small aperture.

Major methods for current confinement in VCSELs

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Device players - Mapping by country (i.e.: design and manufacturing activities)

VCSEL INDUSTRY - OVERVIEW

More than 50 VCSEL manufacturers have been identified with more than third of located (i.e.: HQ) in the US.

US (21):

• II-VI

• XX

• Finisar

• XX

• XX

• XX

• XX

• XX

• Lasertel

• Lumentum

• XX

• XX

• XX

• XX

• XX (part of ams)

• XX

• XX

• XX

• XX

• XX

• Vixar (part of

Osram)

EUROPE (10):

• XX

• Beam Express (CH)

(part of NeoPhotonics)

• XX

• XX

• XX

• XX

• Philips Photonic

(NL/DE)

• XX

• XX

• XX

JAPAN (6):

• XX

• XX

• XX

• XX

• XX

• Sony Semi.

TAIWAN (9):

• XX

• XX

• XX

• Epistar (from pilot mass production)

• HLJ

• XX (under qualification)

• XX

• XX

• XX

CHINA (7):

• XX

• XX (under

qualification)

• XX (under

qualification)

• San’an (from pilot to

mass production)

• XX

• XX

• XX

SOUTH KOREA (2):

• XX

• Raycan

CANADA (1):

• XX

NOTE:

• Pure epiwafer manufacturer are not listed on this map

• Only players involved in die, array or package design /

manufacturing are listed.

• Only players having IR VCSEL products are listed. VCSELs: Technology, Industry and Market Trends | Sample | www.yole.fr | ©2018

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Players mapping by position on the supply chain and business models (1/2)

VCSEL INDUSTRY - OVERVIEW

• 2 different supply chain starting from packaging level and depending on final applications:

• Consumer applications supply chain (smartphone,automotive…).

• VCSEL light source need to be integrated into a complex module assembly (i.e.: VCSEL Tx Module (…) Camera Module System OEM).

• In order to meet system OEM requirements, no “standard” package can be developed and VCSEL manufacturer supply “chipon submount” only to easier integration by the rest of the supply chain.

• Other applications supply chain (datacom/telecom,industry…).

• Those applications can integrate much more standard VCSEL package (e.g.:TO can,TOSA, SMD…).

• 7 different typologies of actors with different business models can be highlighted on theVCSEL-centric supply chain:

From epiwafer to package / chip-on-submount, 7 categories of actors can be distinguished depending on their business models.

Chip-on -

Submount

Package

Epiwafer

(Front End L0)

Die / Array

(Front End L1

+ Back End

L0)

Consumer Applications Supply Chain (smartphone,

automotive…)

Other Applications Supply Chain (datacom/telecom, industry…

VCSEL-CENTRIC SUPPLY CHAIN

Pure VCSEL Epiwafer Manufacturer

VCSEL Epiwafer Manufacturer and Foundry Service Supplier

Pure VCSEL Foundry Service Supplier

VCSEL Device Manufacturer and Foundry Service Supplier

VCSEL Device Manufacturer - XX

VCSEL Device Manufacturer - XX

VCSEL-CENTRIC SUPPLY

CHAIN

VCSEL Device Manufacturer - XX

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From datacom to 3D sensing

VCSEL INDUSTRY - TRENDS

Historically involved in datacom applications, VCSEL industry is now entering the consumer 3D sensing era.

• Datacom has been the first industrial application for VCSELs that are favoured in datacentres due to

their low power consumption and competitive price compared to EELs. However, VCSELs are limited

to short distance communication applications.

• Volume of VCSEL production boomed with the explosion of Internet in the 2000's and generate a

steady growth since then.

• VCSELs appeared first in

smartphone with their

integration in the autofocus

and proximity sensing

applications.

• But the boom really

occurred when Apple

released its iPhone X in

2017 integrating VCSELs for

the Face ID module,

generating high volume

production, high investment

from Apple to secure its

supply chain and creating a

strong interest from new

VCSEL suppliers and from

Android-based OEMs.

VCSELs: Technology, Industry and Market Trends | Sample | www.yole.fr | ©2018

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25

Apple’s IPhone X supply chain (tentative)

VCSEL INDUSTRY - TRENDS

Epi wafer growth Die/array fabrication Module Customer

Dot

Projector

Proximity

Sensor

Flood

Illuminator

Main source

Alternative source

Main source

Alternative source

3D

sen

sin

g

VCSELs: Technology, Industry and Market Trends | Sample | www.yole.fr | ©2018

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26

Use cases and opportunities of the rear 3D camera

VCSEL INDUSTRY - CONSUMER AND MOBILE LANDSCAPE

Augmented Reality

Use cases for mobile is a

hard call :

• Augmented sales pitch

• Augmented gaming

As far as 2018 the

attraction of the use

cases are not market

proven and could remain

a niche feature.

Is it worth

an added

3D sensing

hardware ?

VCSELs: Technology, Industry and Market Trends | Sample | www.yole.fr | ©2018

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27

Automotive LiDAR Ecosystem

VCSEL INDUSTRY - AUTOMOTIVE LANDSCAPE

FPGA: Field-Programmable Gate Array

SiPM: Silicon Photomultiplier

SPAD: Single-Photon Avalanche Diode

VCSEL: Vertical Cavity Surface-Emitting Laser

LiDAR systems Laser sourcesPhotodetectors

Active players

R&D players

VCSELXXXX SPAD/SiPM

FPGA XX

Amplifier

Optical elementsIC

XX Optical filters

Optical systems

VCSELs: Technology, Industry and Market Trends | Sample | www.yole.fr | ©2018

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28

• IP activity related to VCSEL started in the 90’s with the development of laser for datacom applications (i.e.: fiber optic). Shortly after,IP players have started to file patents related to XX applications.

• These two applications have driven the development of IP activity related toVCSEL until 2006-2007.

• From 1995 to 2003 the IP landscape experienced a strong increase of the number of patent publications that also corresponds to theincrease of the geographic expansion of datacom/telecom and laser printing players IP activity.

• Since 2010, many newcomers have entered the IP landscape. The most noticeable newcomers are players from the consumer andautomotive markets.

Timeline of IP activity related to VCSELs

VCSEL INTELLECTUAL PROPERTY LANDSCAPE

VCSELs: Technology, Industry and Market Trends | Sample | www.yole.fr | ©2018

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Data communications (datacoms) was the first industrial application to start integrating Vertical Cavity Surface Emitting Lasers (VCSELs). Their sweet spot has been in short-distance data communication due to their low power consumption and competitive price compared to Edge Emitting Lasers (EELs). Driven by the development of datacenters, the VCSEL market and production boomed in the 2000s with the internet’s popularity, and then grew steadily. Some new applications for VCSEL emerged, like laser printers and optical mice, but weren’t strong growth drivers.

Only in 2014, almost 20 years since the first use of the technology in datacom, VCSELs started to make their way into high volume consumer smartphones. But this coupling with sensors for proximity sensing and autofocus functions was only the beginning of the VCSEL success story. In 2017 Apple released the iPhone X, with a 3D sensing function based on this technology. The iPhone X integrates three different VCSEL dies for the proximity sensor and the Face ID module, and made the VCSEL market explode in 2017, propelling overall revenue to ~$330M.

Good iPhone X sales have now triggered the interest of other smartphone brands in this breakthrough

3D sensing function. Less than one year after the release of Apple’s flagship, its competitors are now following the same trend and starting to integrate 3D sensing technologies. Xiaomi and Oppo were the quickest on the draw, with the Xiaomi Mi8 and the Oppo Find X models presented in the second quarter of 2018. Other leading smartphone players like Huawei, Vivo or Samsung are also expected to integrate VCSELs into their flagship models by 2019. In this context, the explosion of VCSEL demand initiated in 2017 will persist for the next five years, potentially multiplying the business opportunity more than tenfold. During that time, the technology might also find some new growth drivers into some other high volume applications such as automotive Light Detection and Ranging (LiDAR) or gas sensors.

This trend will likely cause rapid evolution in the VCSEL industry in coming years in the form of investment, new entrants and mergers and acquisitions.

This report presents a comprehensive review of the main VCSEL applications including in-depth analysis of the consumer and automotive landscapes, including 3D sensing, LiDAR and gas sensing.

VCSELS - TECHNOLOGY, INDUSTRY AND MARKET TRENDSMarket & Technology report - July 2018

AFTER 20 YEARS, THE VCSEL BUSINESS HAS FOUND ITS KILLER APPLICATION – AND IS LIKELY TO EXPLODE

3D sensing – and more – in smartphones will drive the VCSEL market for the next five years.

KEY FEATURES• VCSEL market revenue and

volume: 2017-2023• Detailed technical and market

analysis of VCSEL applications, with in-depth analysis of the consumer and automotive landscapes

• VCSEL industry analysis: from epiwafer to system

•VCSELspecificationsandpriceanalysis

• VCSEL manufacturing analysis• VCSEL IP analysis

(Yole Développement, July 2018)

The variety of applications using VCSELs involves a variety of specifications at the device level, mostly in size, output power and number of laser cavities. As a result, the surface of a VCSEL chip or array

can range from less than 0.1mm² for datacom and proximity sensing applications to more than 70mm² for LiDAR application. As the VCSEL surface increases with the needed output power,

VCSEL market forecast by segment

NOT ALL VCSELS ARE CREATED EQUAL! APPLICATIONS DRIVE DEVICE SPECIFICATIONS

2017$330M

2023$3,500M

Consumer Datacom Industry Automotive

Courtesy of Apple

CAGR +48%

$86M

$80M

$165M

$3,100M

$105M

$205M

$46M

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VCSELS - TECHNOLOGY, INDUSTRY AND MARKET TRENDS

A NEW WAVE OF INVESTMENT AND M&A HAS STARTED

VCSEL market volume is expected to grow from 652M units in 2017 to more than 3.3B units in 2023 at a 31% compound annual growth rate for this period (CAGR2017-2023). This booming trend is likely to trigger interest in VCSEL technology at many industry levels, including OEMs, integrators, device manufacturers, epi houses, foundries, equipment and material suppliers. To be able to follow this booming demand, more than 100 MOCVD reactors will be needed, which is likely to please companies that supply this equipment, such as Aixtron, Veeco and Taiyo Nippon Sanso.

Yole Développement (Yole) expects therefore strong investment and proliferation in the VCSEL industry with the entry of several new players, mostly from the LED industry, whose technology is similar. Since 2016, Yole analysts’ have already seen some M&A, like ams’ acquisition of Princeton Optronics and Osram’s deal for Vixar and investment in manufacturing expansion or supply chain reinforcement, like Apple

investing $390M in Finisar. Yole expects the bulk of these investments to occur in the coming years.

And once VCSEL hype reaches its peak, Yole also expects a necessary consolidation phase with more M&A occurring at all level of the supply chain and to support different strategies:• Vertical integration - from system to module and/or

from module to component• Application diversification - from datacom to

sensing• Business diversification - from LED or EEL devices

to VCSELs

This report presents an in-depth analysis of the VCSEL industry, which highlights supply chain trends and key players. The reports also analyze VCSEL device market size, broken down by application and segment, and the related MOCVD reactor market. In addition, it details an overview of the VCSEL IP landscape.

so do the number of cavities and the complexity of the manufacturing process, mostly in ‘front-end’ chip fabrication.

The current shift from the datacom industrial era to the 3D sensing consumer era is likely to have a

strong impact on manufacturing expertise related to VCSELs. Typically, whereas datacom uses 3” or 4” diameter wafer manufacturing processes, consumer applications requires 6” wafer processing to hit their cost targets and also larger VCSEL arrays. This evolution has a direct impact on manufacturing yield, which is still low today for 6” processes. This is mostly related to epiwafer manufacturing, for which the epitaxy uniformity is still a major challenge, compared to 3” or 4” wafer epitaxy. Typically, a difference of 1% in the layer thickness will result in a wavelength deviation of 10nm. And knowing that epitaxy yield will drive overall VCSEL manufacturing yield, it is now at the heart of VCSEL industry investments in key equipment for MOCVD and metrology.

This report present a detailed analysis of VCSEL manufacturing processes, associated challenges, recent trends and player positioning. This report also presents main specifications for VCSELs in leading applications.

VCSEL specifications vs. Application requirements

(Yole Développement, July 2018)

• Datacom• Proximity sensor

• Gesture recognition• Laser autofocus• Iris scan• Optical mice

• 3D sensing• Depth camera• Medical

• ADAS LiDAR • Industrial cutting

Increase of diesize, numberof cavities,

power output and so

manufacturingcomplexity.

Also, differentpackage, single chip

vs. array to beconsidered.

0.02 to 0.06mm2

3 to 40mW

0.06 to 0.4mm2

10 to 350mW

0.4 to 1.3mm2

200 to 1,000mW

10 to 75mm2

5 to 40W

VCSEL players* ecosystem

(Yole Développement, July 2018)

Epiwafer Foundry IDM Fabless Internal use

VCSEL device manufacturers

*Non-exhaustive list of companies

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MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)Accelink, Aixtron, Alight, ams, Anadigics, Apple, Arima Lasers Corporation, Asus, Audi, Avago, AWSC, Beam Express, Blackmore, Bosch, Broadcom, Cable solutions, Canon, Changelight, Continental, Device Innovation, Egismos Technology Corporation, Emcore, Epistar, Epiworks, Excelitas, Finetech, Finisar, FLIR, Foxconn, Fuji Xerox, Fujitsu, Global Communication Semiconductor, Google, Hamamatsu, Hella, Heptagon, Himax, HLJ, Honeywell, Honor, HTC, Huawei, Ibeo, iHealth, II-VI, Infineon, Infinera, Inneos, Innoluce, Innoviz, Intel, IntelliEpi, IQE, JDSU, Journal of semiconductors, Kaiam, Koito, Landmark Opto, Lasermate, Lasertel, Laytec, LeddarTech, Lenovo, LG, Lumentum, Luminar, Luxnet, Magneti Marelli, Mantis Vision, Masimo, Namuga, Oclaro, Oculus, Omnivision, OnePlus, Oppo, Optek Technology, Optical Society of America, Optovue, Optowell, Orbbec, Osram, Oxford Instruments, Palomar Technologies, Philips Photonics, Picolight, pmd, POET Technologies, Primesense, Princeton Optronics, QSI, Quanergy, Rasirc, Raycan, Realsense, Riber, Ricoh, Robosense, Samsung, Sanan, Santec Corporation, SCAT, Seiko Epson, Seminex, SensL, Shiraz University, Sick, SinoSemic, SoftKinetic, Sony Corporation, Stanley, STMicroelectronics, Sumitomo Chemicals, Sunny optical technology, Suoer, Taiyo Nippon Sanso, Tetravue, Texas Advanced Optoelectronic Solutions, Thorlabs, Trilumina, Truelight Corporation, Tyson Technology, Ulm Photonics, Ultra Communication, US Lasers Inc., Ushio, Valeo, Varroc, Veeco, Velodyne, Vertically Integrated Systems, Vertilas, Vertilite, Viavi, Vivo, Vixar, VPEC, Wavetek, Win Semiconductor, Xiaomi, Zephyr Photonics, ZF (…)

Preliminary Definitions and Principles 33

VCSEL Overview 39

> Definitions> Applications as a function of the

electromagnetic spectrum> VCSEL in the semiconductor light source

environment> History of VCSELs> VCSEL structure> VCSELs in the electromagnetic spectrum> Timeline of main applications for VCSELs

VCSEL Landscape 51

> Classification of VCSEL applications bywavelength

> Classification of VCSEL applications by marketsegment

> Classification of VCSEL applications by functionVCSEL Market 59

> 2017-2023 market volume (Munits) - Byapplication

> 2017-2023 market revenue ($M) - By application> 2017-2023 growth trends by application> Market growth relays> VCSEL ASP> MOCVD reactor opportunity

VCSEL Applications 75

> Datacom> Active optical cable> Plastic Optical Fibre (POF) in automotive> Laser printer> Industrial heating system

> Proximity sensors> Autofocus systems> Gas sensors> Computer mice> Pulse oximeters> LIDAR> Surveillance cameras> Eye tracking systems> Face recognition> Gesture recognition> Optical Coherence Tomography (OCT)

VCSEL Manufacturing 123

> VCSEL vs EEL> Basic properties of VCSELs> VCSEL specifications vs. Application requirements> Epitaxy - Technologies and trends> Key front-end process steps> Reliability aspects> The case of array manufacturing> Front-end manufacturing control> Packaging

VCSEL Industry 153

> Overview> Trends> Key players> Consumer and mobile landscape> Automotive landscape

VCSEL Intellectual Property Landscape 207

> Overview> Patent segmentation

Conclusion 226

TABLE OF CONTENTS (complete content on i-Micronews.com)

OBJECTIVES OF THE REPORT• Give a comprehensive picture of the forces driving the VCSEL light source market, technology and

industry in the short, middle and long term• Allow readers to understand the global landscape related to VCSELs• Review main applications of VCSELs, giving insights on principles, technology, technical requirements,

trends, key players and more• Analyse the technology and industry behind VCSEL light sources and their integration into sensors

and modules• Provide and analyze market forecasts for VCSEL light sources from 2017 - 2023• Present an Intellectual Property (IP) analysis in order for the reader to better understand the

patent landscape related to VCSEL device, system and applications

AUTHORSPierrick Boulay works as Market and Technology Analyst in the fields of LED,OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick holds a master degree in Electronics (ESEO - France).

Find more details about

this report here:

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Pars Mukish holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM Lyon - France). Since 2015, Pars has taken on responsibility for developing SSL and Display activities as Business Unit Manager at Yole. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).

Pierrick Boulay and Pars Mukish, all part of the Photonics, Sensing & Display division at Yole Développement (Yole) co-authored the VCSEL - Technology, Industry and market Trends report:

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

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© 2018

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From Technologies to Market

Source: Wikimedia Commons

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2©2018 | www.yole.fr | About Yole Développement

YOLE DEVELOPPEMENT – 4 DIVISIONS

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& Software o Package &Assembly & Substrates

o SemiconductorManufacturing

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Sensing & Display

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o MEMS,Sensors & Actuators

o Imaging

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& Software

Power & Wireless

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Sensing

& Display

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Healthcare

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3©2018 | www.yole.fr | About Yole Développement

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4©2018 | www.yole.fr | About Yole Développement

6 COMPANIES TO SERVE YOUR BUSINESS

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OUR GLOBAL ACTIVITY

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of our business

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ANALYSIS SERVICES - CONTENT COMPARISON

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and Market

Report

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adth

of th

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Analyst

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7©2018 | www.yole.fr | About Yole Développement

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

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users and software

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Suppliers: material, equipment,

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SERVING MULTIPLE INDUSTRIAL FIELDS

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Moore technologies from deviceto system

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9©2018 | www.yole.fr | About Yole Développement

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

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OUR 2018 REPORTS COLLECTION (1/4)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 – Update

− Silicon Photonics 2018 – Update

− Consumer Biometrics: Hardware & Software 2018 – Update

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− RF Standards and Technologies for Connected Objects 2018

− RF & Photonic Components & Technologies for 5G Infrastructure 2018

o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting

− Automotive Radar Comparison 2018

o PATENT ANALYSES – by KnowMade

− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market

& Technology Report – Update

− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report

− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report – Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 Market & Technology Report – Update

− RF GaN Comparison 2018* – Structure, Process & Cost Report

− RF GaN 2018 – Patent Landscape Analysis

SOFTWAREo MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Consumer Biometrics: Sensors & Software 2018 – Update

− Processing Hardware and Software for AI 2018 - Vol. 1 & 2

− From Image Processing to Deep Learning, Introduction to Hardware and Software

Update : 2017 version still available / *To be confirmed

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11©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (2/4)

IMAGING & OPTOELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the Compact Camera Module and Wafer Level Optics

− Industry 2018 – Update

− 3D Imaging and Sensing 2018 – Update

− Sensors for Robotic Vehicles 2018

− Machine Vision for Industry and Automation 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− Uncooled Infrared Imagers 2017

o PATENT ANALYSES – by KnowMade

− iPhone X Dot Projector – Patent-to-Product Mapping

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -Update

− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report

− CMOS Image Sensors Monitor 2018* – Quaterly Update**

− Camera Module 2017 – Market & Technology Report

− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report

− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology

Report

− LiDAR for Automotive 2018 – Patent Landscape Analysis

ADVANCED PACKAGING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Advanced Packaging Industry 2018 – Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends

− 3D TSV and Monolithic Business Update 2018 – Update

− Power Modules Packaging 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Status of Panel Level Packaging 2018

− Trends in Automotive Packaging 2018

− Hardware and Software for AI 2018 - Vol. 1 & 2

− Integrated Passive Devices (IPD) 2018

− Thin-Film Integrated Passive Devices 2018

− Memory Packaging Market and Technology Report 2018 – Update*

o PATENT ANALYSES – by KnowMade

− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

o LINKED REPORTS– by Yole Développement and System Plus Consulting

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− Fan-Out Packaging 2018 – Market & Technology Report – Update*

− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report

MANUFACTURING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Wafer Starts for More Than Moore Applications 2018

− Equipment for More than Moore: Technology & Market Trends for Lithography & Bonding/Debonding 2018

− Polymeric Materials for wafer-level Advanced Packaging 2018

− Laser Technologies for Semiconductor Manufacturing 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Equipment and Materials for 3D TSV Applications 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− Equipment for More than Moore: Technology & Market Trends for

Lithography & Bonding/Debonding 2018 – Market & Technology Report

− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report

Update : 2017 version still available / *To be confirmed

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12©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (3/4)MEMORY

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update*

o QUARTERLY UPDATE – by Yole Développement**

− Memory Market Monitor 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement**

− Memory Pricing Monitor 2018 (NAND & DRAM)

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018

o PATENT ANALYSES – by KnowMade

− 3D Non-Volatile Memories – Patent Landscape

COMPOUND SEMICONDUCTORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018*

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018

− Bulk GaN Substrate Market 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Power SiC 2018: Materials, Devices, and Applications – Market & Technology

Report – Update

− SiC Transistor Comparison 2018 – Structure, Process & Cost Report

− Power SiC 2018 – Patent Landscape Analysis

− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report – Update

− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report

− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023

– Market & Technology Report – Update

− RF GaN – Patent Landscape Analysis

POWER ELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Power Electronics for Electric Vehicles 2018 – Update

− Integrated Passive Devices (IPD) 2018

− Wireless Charging Market Expectations and Technology Trends 2018

− Thermal Management Technology and Market Perspectives in Power

− Electronics and LEDs 2017

− Gate Driver 2017

− Power MOSFET 2017

− IGBT 2017

− Market Opportunities for Thermal Management Components in Smartphones 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting

and KnowMade

− Power Modules Packaging 2018 – Market & Technology Report – Update

− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report

− Power ICs Market Monitor 2018 – Quaterly Update**

− Power ICs Market Comparison 2018* – Structure, Process & Cost Report

BATTERY AND ENERGY MANAGEMENTo MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update

o PATENT ANALYSES – by KnowMade

− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017

o LINKED REPORTS – by Yole Développement and KnowMade

− Solid State Electrolyte Battery 2018 – Market & Technology Report

− Solid-State Batteries 2018 – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

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13©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (4/4)

SOLID STATE LIGHTING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update

− Automotive Lighting 2018: Technology, Industry and Market Trends – Update

− UV LEDs 2018: Technology, Industry and Market Trends – Update

− LiFi: Technology, Industry and Market Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− CSP LED Lighting Modules

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Horticultural Lighting 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology Report

− VCSELs Comparison 2018 – Structure, Process & Cost Report

DISPLAYS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update

− Displays and Optical Vision Systems for VR/AR/MR 2018

− MicroLED Displays 2018 – Market & Technology Report – Update

o PATENT ANALYSES – by KnowMade

− MicroLED Display – Patent Landscape Analysis

MEDTECH

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical

− Applications 2018 – Update

− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update

− Neurotechnologies and Brain Computer Interface 2018

− CRISPR-Cas9 Technology: From Lab to Industries 2018

− Ultrasound technologies for Medical, Industrial and Consumer 2018

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Liquid Biopsy: from Isolation to Downstream Applications 2018

− Chinese Microfluidics Industry 2018

− Scientific Cameras for the Life Sciences & Analytical Instrumentation

Laboratory Markets 2018*

− Artificial Organ Technology and Market 2017

− Connected Medical Devices Market and Business Models 2017

− Status of the Microfluidics Industry 2017

− Organs-On-Chips 2017

− Solid-State Medical Imaging 2017

− Medical Robotics Market & Technology Analysis 2017

o PATENT ANALYSES – by KnowMade

− Microfluidic IC Cooling – Patent Landscape

− Circulating Tumor Cell Isolation – Patent Landscape

− OCT Medical Imaging – Patent Landscape

− Pumps for Microfluidic Devices – Patent Landscape 2017

− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017

− FLUIDIGM – Patent Portfolio Analysis 2017

− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Organs-On-Chips 2017 – Market & Technology Report

− Organ-on-a-Chip – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed

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14©2018 | www.yole.fr | About Yole Développement

OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

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15©2018 | www.yole.fr | About Yole Développement

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ON L I N E ON S I T E I N PE R S ON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person.Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 11,200+

monthly unique visitors, the

10,500+ weekly readers of

@Micronew se-newsletter

Several key events planned for

2018 on different topics to

attract 120 attendees on average

Gain new leads for your business

from an average of 340

registrants per webcast

Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager

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16©2018 | www.yole.fr | About Yole Développement

CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT

BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US &

Canada

Email: [email protected] – + 1 310 600-8267

• Troy Blanchette, Senior Sales Director for Eastern US &

Canada

Email: [email protected] – +1 704 859-0453

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business

Development (Korea, Singapore, India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan)

Email: [email protected] - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business

Development

Email: [email protected] - +886 979 336 809

• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnershipwith Woodside

Capital Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development

Email: [email protected] - +1 208 850 3914

o GENERAL

• Public Relations: [email protected] - +33 4 72 83 01 89

• Email: [email protected] - +33 4 72 83 01 80

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