ALH系列金屬芯銅箔層壓板ALH系列金屬芯銅箔層壓板ALH Series Metal Core CCLALH Series Metal Core CCL

岱稜科技股份有限公司

UNIVACCO TECHNOLOGY

PCB OverviewPCB Overview

Classification• By layer

• Single-layer• Multi-layer

• By shape• Rigid• Rigid• Flexible• Rigid-flexRigid flex

• By forming• Cordwood (堆積式)

複線板• Multiwire (複線板)• SMT (表面黏著技術)

Classification• By base

• FR-4• Metal Core (金屬芯)• Ceramics (陶瓷)

PI (聚醘亞胺)• PI (聚醘亞胺)• PET

Metal-core PCB

• 傳統線路板Conventional PCB

Copper 銅箔FR-4

• 傳統鋁基板Metal-core PCB

Copper 銅箔FR-4PP sheet 接著片Metal-core 金屬板Metal core PCB

• 金屬芯基板 Copper 銅箔Thermal epoxy 導熱膠

Metal core 金屬板

Metal-core PCB Thermal-epoxy 導熱膠Metal-core 金屬板

Why Metal-core?

• Excellent thermal conductivity best• Excellent thermal conductivity, bestfor heat dissipation

• Extending life-span of electronic • Extending life-span of electronic device

• Space saving• Space saving• Reduce the high frequency

interferenceinterference• Increase mechanical strength

Univacco Position

Copperpp

Diele t i MC CCL MC PCB M d l (OEM)Dielectric MC-CCL MC-PCB Module (OEM)

AluminumEnd customerConsumers

U i ALH S iUnivacco ALH Series

Overview

銅箔 Copper Clad Circuit,pp ,Heat conductance

d導熱膠 Adhesive Heat conductance,

Dielectric, Adhesive

鋁板 AluminumHeat dissipation,Support ReinforceSupport, Reinforce

Structure• 單面鋁基板

Aluminum base CCL銅箔 Copper Clad

導熱膠 AdhesiveAluminum base CCL

單面銅基板

鋁板 Aluminum

• 單面銅基板Copper base CCL

銅箔 Copper Clad

導熱膠 Adhesive

銅板 Copper Plate

• 雙面銅箔基板 銅箔 Copper Clad• 雙面銅箔基板Double side CCL

導熱膠 Adhesive

銅箔 Copper Clad

Combination原材料 類別 厚度原材料

Material類別

Type厚度

Thickness銅箔

Copper Clad 電解 1oz, 2oz, 3ozCopper Clad , ,

絕緣導熱膠Dielectric 改良型環氧樹脂 60um, 120um, 180um

鋁板鋁板Aluminum Plate 5052 1.0mm, 1.5mm, 2.0mm

銅板C Pl t 壓延 1.0mmCopper Plate 壓延 0

Standard size600mm x 480mm520mm x 340mm480mm x 300mm

Standard packing 20pcs/box

Product Code

RecommendedRecommendedMaterial

應用Application

需求Requirement

建議選用Recommended

高亮度 LED 照明 Hi h th l d t 1 C 60 Ad 高亮度 LED 照明HB LED Illumination

High thermal conductance,Moderate breakdown voltage

1oz Cu, 60um Ad, 1.5mm AL or 1.0mm Cu

LED 路燈HB LED Street Lamp

High thermal conductance,Excellent reliability

1oz Cu, 超高導熱 60um Ad, 2 0mm ALHB LED Street Lamp Excellent reliability 2.0mm AL

LED 背光模組LED Backlight Module

High thermal conductance,Light & small shape

1oz Cu, 60um Ad, 0.8~1.0mm AL

電源供應模組 High heat capacitance 1 3oz Cu; 120 180um Ad 電源供應模組Power Module

High heat capacitance,High breakdown voltage

1~3oz Cu; 120~180um Ad, 2.0mm AL

太陽能板Solar Panel

High heat capacitance,Large conductivity area

1oz Cu, 60um Ad,2 0~3 0mm ALLarge conductivity area 2.0~3.0mm AL

中功率 LED 模組Medium Power LED

Low cost,Performance above PP

1oz Cu, 一般導熱 60um Ad, 1.0mm AL

Th l dh i i d d f U i lf

Thermal Adhesive• Thermal adhesive is produced of Univacco self-

developed formula to be distinguished from conventional PP containing glass-fiber

• Chemical formula and precision coating is core-technology of Univacco

調配 收捲調配 收捲

攪拌 塗佈

• For the best quality standard adhesive

攪拌 塗佈

• For the best quality standard, adhesivecoating to be done in clean room

Process FlowAdhesive Adhesive cutting

Pre-laminate

Aluminumcutting

Surfacetreatment

laminate

Piling Pressing Coldpressing

Coppercutting

Coldpressing Trimming

Protectionfilm

Finalcutting

FinalProduct Packing

Characteristic自有配方 單價低• 自有配方、單價低Competitive price

• 絕佳熱傳導表現絕佳熱傳導表現Low thermal impedance

• 無塵室塗佈Processed in cleaning room

• 精密塗佈技術、厚度均勻Hi h i i thi kHigh precision thickness

• 良好信賴性Good reliabilityGood reliability

• 符合 RoHSRoHS Compliance

Specification測試項目

Test Item單位Unit ALH-SAG-100615

測試規範Test Method

總厚度Total thickness mm 1.6±10% Univacco Method

絕緣層厚度 um 60±3 Univacco MethodDielectric thickness um 60±3 Univacco Method

拉力Peeling strength kgf/cm ≧2.0 IPC TM-650 2.4.9

耐熱測試Solder float ℃

300, passed after 60sec IPC TM-650 2.4.13

耐燃測試 V0 UL94Flammability V0 UL94

熱阻抗Thermal resistance ℃/W 0.20 ASTM D 5470

S ifi tiSpecification測試項目 單位 測試規範測試項目

Test Item單位Unit ALH-SAG-100615

測試規範Test Method

熱傳導率Heat transfer rate W/m.K 2.0 ASTM D 5470Heat transfer rate玻璃轉換溫度Tg point ℃ 105 TMA Method

耐化性耐化性Chemical resistance Passed IPC TM-650 2.3.2

表面阻抗Surface resistance Ω ≧1.0x10

14Surface resistance體積阻抗Volume resistance Ω.cm ≧1.0x10

15

破壞強度破壞強度Dielectric voltage kV ≧3 IPC TM-650 2.5.6

The above specification is based on testing result, not a guaranteed specification

Reliability Test

• Peeling strength maintained above 80% fromthe initial value after 240hrs under 85℃/85%RHthe initial value after 240hrs under 85℃/85%RH

• 300℃, 30sec solder float testing result is OK after a period of 240hrs

Technical Comparison

測試項目Test Item Unit Univacco NRK Bergquist LairdTest Item gq

Dielectric thickness um 60~120 80~200 75~150 100~300

Peeling Peeling strength kgf/cm 2.05 1.60~2.10 1.78 0.80~1.20

Thermal Conductivity W/m.K 1.5~3.0 1.8~6.5 2.2 1.0~3.0

Thermal Resistance ℃/W 0.20 0.24 0.45 0.35

Tg Point ℃ 105 100~180 90~150 105

Solder float 300, passed after 30sec300, passed after 30sec

300, passed after 30sec

300, passed after 30sec

Technical Comparison

測試項目Test Item Unit Univacco NRK Bergquist LairdTest Item gq

Dielectric Strength kV/mil 2.0 2.1 2.0 0.8

Dielectric Dielectric Constant 5.2 7.0 7.0 4.1

Surface Resistivity Ω 1.0x10

15 3.5x1014 1.0x1013 1.0x1013

Volume Resistivity Ω.cm 1.0x10

16 2.5x1015 1.0x1013 1.2x1014

Flame Resistance UL94 V0 V0 V0 V0Resistance

Note: Laird acquired Thermagon on April 2004

Thermal ConductivityThermal conductivity is capability of a material that indicates its ability to conduct heat.

It is defined as the quantity of heat (Q), transmitted during time Δt through a thickness L, in a direction normal to a surface of area A, due to a temperature difference ΔT, under steady state conditions

Q

T1 T2A

Q

A

L

Thermal ConductivityMaterial 材料 k Value

熱傳導率 (W/m.K)Copper 銅 400

Metal 金屬

Copper 銅 400Aluminum 鋁 150 ~ 237

Silver 銀 429Silver 銀 429Iron 鐵 71

Thermal-epoxy 導熱膠 0.8 ~ 6.0Resin 樹指 FR-4 0.36

PP 0.22Ai 空氣 0 025

Others 其他Air 空氣 0.025

Pure Water 純水 0.6

Thermal Resistance

Thermal resistance is temperature diff t t h it difference across a structure when a unit of heat energy flows through it in unit time.

Q

T1 T2A

L

Thermal Resistance Test

• Based on ASTM D 5470• Sample dimension 31mm x 31mm• Specimen placed at the centre• Stress force 30kgf• Stress force 30kgf• Cooling by air/water with

1500cc/min volume• Measure for 200 minutes average

result

Test Result Comparison

測試產品 單位測試產品Test Item

單位Unit

Univacco TCP 60um NXX-8

Univacco TCP 120um

Q (Heat) Watt 84 9 85 0 85 1Q (Heat) Watt 84.9 85.0 85.1

ΔT (Temp Difference)

℃ 17.0 20.7 41.7

R (Thermal Resistance)

℃/W 0.20 0.24 0.49

General Application

• 高亮度 LED 模組High brightness LED moduleHigh brightness LED module

• 電源供應器 (轉換器)Power module (conversion device)Power module (conversion device)

• 汽車電器系統、ABS系統Automobile electrical system ABS systemAutomobile electrical system, ABS system

• 馬達控制模組 (變頻器)M t t l d l (i t )Motor control module (inverter)

• 電腦伺服器C t Computer server

General Application

LED Application

• 建築照明，藝術照明Architecture and decorative illuminationArchitecture and decorative illumination

• 車頭燈Vehicle head-lightinge c e ead g t g

• 路燈，街燈Street lamp平面顯示器背光模組• 平面顯示器背光模組FPD Backlight module

• 一般照明 (家用照明)• 一般照明 (家用照明)General lighting (home appliance)

Production Capacity

Potential Competitor

Item Unit FR-4 MC-CCL CeramicsItem Unit FR 4 MC CCL Ceramics

Price Low Moderate High

Process Ability OK OK BadProcess Ability OK OK Bad

Thermal Conductivity W/m.K 0.36 1.5~12.0 70~200

Thermal Resistance ℃/W 3.2 0.2~0.5 0.03

Dielectric um 75~160 60~300 800umThickness um 75 160 60 300 800um

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