Uncooled IR Imaging Market Perspectives€¦ · · 2016-10-07Infrared Detectors Sensor price 4x4...
Transcript of Uncooled IR Imaging Market Perspectives€¦ · · 2016-10-07Infrared Detectors Sensor price 4x4...
From Technologies to Market
Uncooled IR Imaging Market Perspectives
Dr. Eric Mounier, Senior Analyst, Yole Développement
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MEMS &
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy
Management
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s teams of analysts operate in the following areas
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A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
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DATA SOURCES
And more to come (« Uncooled IR Patents
Landscape » …)
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DETECTORS OR IMAGERS? SIGNAL OR IMAGE?
$1
$10
$100
$1000
Infrared
Detectors
Sensor price
4x4 16x168x8 64x6432x32 80x80 160x120
Sensor
Resolution
Uncooled Thermal
ImagersWhich
technolog(ies)
for which
application(s)?
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NUMEROUS UNCOOLED INFRARED TECHNOLOGIES FROM SENSING TO IMAGING
Small ThermopileSmall Pyroelectrics(crystal or ceramic)
A pyroelectric sensor is a sensor that uses natural or artificial pyroelectric
material. Most common
pyroelectric sensors use a few pixels (1 to 4).
Application: widely used in low-end motion
detection or gas & fire detection
Key players: Excelitas, Nicera, Murata
2014 market: $123M
Thermopiles use dominantly silicon
material and are used to measure
temperature level or gas concentration
Applications: thermometer and
pyrometer, gas and flame detection
Key players: ExcelitasHeimann, Nicera, Melexis, Dexter
Research 2014 market: $58M
Microbolometer imagers
Microbolometers today are IR imagers and not
detectors. Several manufacturers plan to
develop microbolometer detectors to open new
applications. ULIS introduced the first
80x80 sensor
Applications: smart building
Key players: ULIS, FLIR
2014 market: $250M
New pyroelectric technologies have been
developed by specific companies with a strong
focus on the development of arrays (1x8 to 64x64 or 1x510
pixels)
Applications: People counting, gas & flame
detection, spectroscopy
Key players: Irisys, Pyreos, IRLYNX
2014 market: $5M
Pyroelectric arrays (ceramic, thin film or
CMOS based)Thermopile arrays
Thermopile arrays have been introduced initially by Heimann
and Excelitas and are available from 1x8 to
64x80 pixels
Applications: HVAC, appliances,
automotive, smart building
Key players: Excelitas, Heimann, Melexis,
OMRON
2014 market: $23M
Silicon Thermodiode
Silicon thermodiodeshave been developed by Bosch for imaging purposes and could
be used for detection in the future.
Applications: smart building
Key players: Bosch
2014 market:emerging
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SENSOR ACTIVE PIXEL AREA COMPARISON – NOT INCLUDING ROIC – DIFFERENT TECHNOLOGIES, DIFFERENT SIZES
Microbolometers have much smaller chips thanks to
their smallpixel pitch
FLIR Lepton Gen 1
• Pixel area: 1.56mm²
• 84x64 pixels
• 17µ pixel size
FLIR Lepton Gen-2
• Pixel area: 2.76mm²
• 160x120 pixels
• 12µ pixel size
Raytheon for SEEK Thermal
• Pixel area: 4.91mm²
• 206x156 pixels
• 12µ pixel size
ULIS
• Pixel area: 7.4mm²
• 80x80 pixels
• 34µ pixel size
IRISYS Pyroelectric
• Pixel area: 31.47mm²
• 33x33 pixels
• 170µ pixel size
1 2 3 4 5 6 7
1
2
3
4
5
mm
mm
With pixel pitch reduction to 90
microns, thermopile is coming
close to microbolometers
regarding sensor size.
Heimann thermopile
• Pixel area: 8.3mm²
• 32x32 pixels
• 90µ pixel size
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Excelitas thermopile
• Pixel area: 40 mm²
• 32x32 pixels
• 200µ pixel size
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Bosch thermodiode
• Pixel area: 50.1 mm²
• 82x62 pixels
• 100µ pixel size
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TECHNOLOGIES VERSUS APPLICATIONS
TechnologiesPyroelectric
Thermopiles ThermodiodesMicro
bolometersBulk Bulk, thin film Thin film CMOS
Pixels count 1 2x2 1x8 – 16x16 32x32 1x510 80x80 1 1x8 – 16x16 80x80 82x62
80x80 to
1024x768
(XVGA)
Pitch 170µ 100µ 90-200µ 60µ trend 100µ 17µ 12µ
Sensitivity ++ (crystal) / - (ceramic, tin film, CMOS) + + ++
Motion detection
Gas/fire detection
People counting
(retail, HVAC)
Spectroscopy
Temperature measure
Automotive
Smart building (light,
detection, HVAC …)
Surveillance, security
Thermography
Maritime
Fire fighting
PVS
Smartphones
Defence
Cost (with lens) $1 $3$10 (HVAC) / $15 (Smart Buildings)
/ $30 (people counting retail) to $50$1500 $10 $1 $5 $30 $10s-$100 $10s to $100s
Micro bolometers are challenged by thermopiles
Pyroelectric, thermopiles & thermodiodes are challenged by Micro bolometers
Micro bolometers are challenged by pyroelectric, thermopiles & thermodiodes
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EXAMPLE OF NEW KEY PRODUCTS IR DETECTORS INTRODUCED SINCE TWO YEARS
Incumbent IR detector technologies have been dynamic & a new pyroelectric CMOS sensor is about to enter on the market (IRLYNX)
Irisys Gazelle 2 for People Counting
(wireless, new 90° lens, higher resolution)
Heimann 32x32,
90°x90° FOVFLIR Lepton 80x60
(3 generations)
Pyreos Handheld Spectrometer (MEMS pyro for Mid-IR)
Excelitas 32x32
New design, lower cost
Bosch 82x62 thermopiles
Systems
Sensors
IRLYNX 64x64
(copolymer on CMOS)
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SMART BUILDINGS: A COST/RESOLUTION TRADE-OFF
New technologies are entering the market (thermodiode, Pyro CMOS). Pyro CMOS is well positioned in terms of price/resolution
Log module price(with silicon lenses)
Yole Développement – June 2015
$1
$10
$100
$1000
10010 10,00016x16
=25660x60
3600
32x32
= 102480x60
4800
Log detector resolution (pixels Nb)
$50
80x80
6400
• Cost target : Below $10.
• Resolution target : High resolution
will enable wider surface covered
and more available functions.
• Thermopiles focus on 32x32.• IR imaging technologies focus on
80x60 because they originally
were present on much higher
resolution.Smart building applications
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INDUSTRIAL INFRARED DETECTOR PLAYERS FOR THERMOPILE AND PYROELECTRIC IR DETECTORS
Player HQ location
Excelitas
(DE)
Irisys
(UK)
Murata
(JP)
(JP)
Pyreos
(UK)
(DE)
Dias Infrared
(DE)
Heimann
(DE)
(CN)
WinSen
(CN)
(JP)
(JP)
Thermopile sensor players
(US)
(B)
(CN)
(JP)
(JP)
(FR)
Small pyroelectric sensor players
Pyroelectric array sensor playersMulti-technology players
v
v
v
Europe: more pyro-oriented & multi technologies
Asia: more small pyro/thermopile oriented
USA: pyro & thermopile
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IR IMAGERS NEW PRODUCTS
• FLIR Boson core:
• 640x512 or 320x256 (with or without shutter, 7 or 8 lensoption)
• 12µ pitch
• REVEAL from SEEK
• 206x156, 12µ, chalcogenide lens
• New WLP 320x240
• FLIR CAT S60:
• Thermal imaging smartphone (planned 2016)
• < $600
• ULIS Pico384 Gen2 SMT
• FLIR Scout TK (Lepton-based)
• Teledyne Dalsa Calibir core
• I3systems 384x288 17µ for Android (2016)
• FLIR VUE/PRO for commercial UAS
• FLIR TG-130 (Lepton-based)
• FLIR DJI Zenmuse XT (planned Dec 2016) for UAS
• Low cost QVGA from SEEK (<70mK sensitivity)
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THERMOGRAPHY: PYRO/THERMOPILES/DIODES AND/OR MICROBOLOMETERS?
4 technologies are competing on ultra-low-end camera segment: pyroelectric, thermopile, thermodiode and microbolometer
Log Sensor Price
Yole Développement – June 2015
$1
$10
$100
$1000
Spot
thermometer
Visual
thermometer
• With the recent arrival of thermopiles and
thermodiodes in 2015, the battle is intense and
focused on the 80x60 resolution for both thermal
cameras and visual thermometers.
Thermal imaging
camera
10010 10,00016x16
=25660x60
3600
3 2x32
= 102480x60
4800
1
Log number ofSensor pixels
Thermodiode
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UNCOOLED THERMAL IMAGING
Smartphone market
• This scenario is based on aggressive price by 2021 with an ASP of <$10 for the IR camera module
thanks to
• New technologies (WLP, WLO, low cost optics << $10, 8’’ wafer manufacturing).
• Partnering of smartphone manufacturers with IR camera manufacturers to support IR module sales development.
• Entrance of new imager players from the semiconductor business who focus on smartphones and who possess the know-how and mindset to drastically reduce product cost, similar to some MEMS devices already introduced to consumermarkets (accelerometers, gyroscopes, microphones, etc.)
STEP 1 (2014): plug-in STEP I1 (2016):
Professional smartphone
STEP III : Consumer
smartphone with integrated IR
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ULIS (FR)Grenoble
FLIR/ON Semi/TowerJazz (US)Santa Barbara/Pocatello/ New port beach
L-3Com
(US)Dallas
Raytheon
/NX-Freescale (US)Santa Barbara / Austin
UNCOOLED THERMAL IMAGERS MANUFACTURERS GEOGRAPHICAL DISTRIBUTION
DRS technologies /Cypress (US)Dallas
BAE IRIS (US)
Lexington
NEC (JP)Fukushima
Microbolometer technologies: a-Si, Vox, Other technologies. In bold and Italics are new entrants in the market over the last 4 years
Bosch
(DE)
SCD(IS)
Haifa
Teledyne DALSA
(CA)
Fraunhofer
(DE- R&D)
Mikrosens
(TU)
Magnity
(CN)Shanghai
Irisys
(UK)
GWIC (CN)
Beijing
I3 system
(KR)Uelectronic
(KR-R&D)
Dali (CN)Hangzhou
GST (CN)
Wuhan
17© 2016 All rights reserved | www.knowmade.com
Uncooled Infrared Imaging – Patent Landscape Analysis | September 2016
PATENT LANDSCAPE OVERVIEWTime evolution of patent applications for uncooled infrared imaging technology
1 1 1 1 1 2 1 3 2 3 3 4 4 6 2 5 1 5 3 5 4 4 11 614 15 18 14
2617
32 38 45 4937
54 60 62 6374 69
77
98111
103
133137
171
206
285
252
232
32
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Nu
mb
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of
ap
plicati
on
s
Year of 1rst application
Patent Applications
Patent Families
IP Dynamics for Uncooled Infrared Imaging2,600+ patent families comprising 6,000+ patents
A patent family is a set of patents filed in multiple countries to protect a single invention by a common inventor(s). A first application is made in one
country – the priority country – and is then extended to other countries.
Note: The data
corresponding to
the year 2015 and
2016 may not be
complete since most
patents filed during
these years are not
published yet.
28%CAGR
2010-2013
Newcomers
Bosch, Dali, Raytron,
GWIC, Magnity, Axis, Seek
Thermal, UESTC China …
FLIR Systems
increases patenting
activity
Honeywell, L-3 Com, NEC,
Panasonic, Mitsubishi Electric,
Raytheon…
CEA, Toshiba,
Sumitomo
Electric…
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UNCOOLED IR IMAGERS TECHNICAL TRENDS
Camera trends turn into core/sensor trends
CORE TRENDS
SENSOR TRENDS
COST +
SWaP*
reduction
*SWaP: Size, Weight and Power
Wafer level processes (WLP, WLO)
8’’ wafer fabs
New materials, CMOS p-n junction, thermopiles, pyroelectric materials.
3D integration through TSV
PLP
Pixel pitch reduction: from 17µ being a standard to 12µ (with 10µ planned)
Increased number of pixels
NETD reduction
Increased fps
High Dynamic Range
Using smartphone
CPU
Shutter-less
TEC-less
Image Processor
ASIC
PERF.
Ready-
to-use
CAMERA
TRENDS
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PIXEL PITCH REDUCTION TREND: 12MICRONS ROADMAP
12µ is more common now than in previous years
• 12µ pitch is becoming more common with BAE (2013 for US Defense), Raytheon for SEEK Thermal (2014), FLIR forFLIR One Gen-2 QVGA (2015), L3Com (2016), NEC for VGA (2016), SCD (2018), ULIS (R&D).
• In the future, it is unlikely to see 10µ pitch for defense applications as major trend is not cost reduction butresolution.
2013 2014 2015 2016 2017 2018
10µm
First shipments
12µm pixel pitch roadmap
R&D
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WLP ROADMAP
WLP is becoming common
• The majority of players are working on WLP which is interesting for commercial applications wherevolumes are high and imager size small (QVGA and below). WLP is less attractive for militaryapplications where volumes are low and imager size high (VGA and higher).
2013 2014 2015 2016 2017 2018
Since 2002
UElectronic
WLP roadmap
PLP
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8’’ WAFER SIZE PRODUCTION
Pixel pitch reduction and larger volumes drive 8’’ wafers production
(2015)
i3systems
Foundry partner
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GENERAL CONCLUSIONS
• Initially focused on the Military market, uncooled thermal camera sales have grown significantly during
the last 10 years due to the substantial cost reduction IR sensors and growing
adoption in commercial markets.
• The three “historic” major segments still drive market growth with 1Munit in 2021:
Thermography,Automotive, Surveillance & Security.
• But new applications will add volume:
• Smart buildigs
• Smart phones & consumer
• PortableVision Systems
• Drones …