TSV: Via lining & filling [email protected].
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Transcript of TSV: Via lining & filling [email protected].
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TSV degree of difficulty
www.yole.fr, 2010
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Basic via structure
Benfield
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Process flow
Benfield
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Profile & filling options
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Profile & step coverage
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Dielectric requirements
IEEE 2009 3D system integration conference
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Resistance
Thickness (um)
Radius (um)
Resistivity (uOhmcm)
Calculated resistance (mOhm)
Poly-Si 100 10 1000 (BCl3) 3200
W 100 3 5.4 191
Cu (full) 100 W_bot =30W=60
2.65 2.1
Cu (hollow)
100 W_bot =30W=60
2.65 3.8
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Why is thinning needed?• Step coverage of sputter?
– Maximum aspect ratio ~ 5– Tapering makes sure the seed is continuous– W_bottom=20um, t=650um wafer -> w = 134um -> pitch ~ 200um
• Pitch < 100– > wafer has to be thinned down
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Silicon vias
Silex
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Silicon vias
Silex
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Epoxy-lining
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Filling with sacrificial support
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Packaging with TSV cap wafer
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Wire bonding via metal
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Via electrical results
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Nickel wire magnetic assembly
Fischer, Roxhed:
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Ni wire process flow
Fischer, Roxhed:
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Solder filling
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Copper ball filling
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TSV filled by CNTs
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CNT growth
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