Trigger A front end chip for SLHC CMS strip tracker IN2P3 microelectronic Summer School 2011...

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Trigger Pipeline FIFO MUX Serial interface (slow control) mask Cluster ID Cut on width mask Cluster ID Cut on width Coincidence finder (Stub ID) FIFO Communication controler DAC Output link SCL SDA 64 ampli. 64 ampli. 64 discri. 64 discri. Strip data Strip data FULL CHIP FEAFS chip 128 strip data A front end chip for SLHC CMS strip A front end chip for SLHC CMS strip tracker tracker IN2P3 microelectronic Summer School 2011 -Frejus, 16-19 June 2011 Concept of Silicon strip Pt-module for trigger purpose in sCMS CMS: One of the 4 major experiment of the LHC Run smoothly with 7Tev pp collision since 2010 Upgrade : LHC luminosity to 5x10 34 cm - 2 s -1 Preserve the performance by including the tracker in the level 1 trigger Local measurement of the particle bending ~ 1-2 mm Δx Top Silicon sensor Bottom Silicon sensor ~ 0.3 mm Cluster Width 0.1 mm Position offset Track stub Track bending in the B-field is inversely proportional to transverse momentum Cluster Width and Offset selection in 2 sensors connected to same Front End ASICs (Pt-module) allows to reject low Pt tracks, reducing band width for read-out of proper trigger information at the LHC clock frequency Architecture of a pure digital cluster research chip named FEAFS Cluster Researc h Threshol d cut Priorit y encoder Overlap finding Priorit y encoder Cluster Researc h Threshol d cut Priorit y encoder Up to 12 cluster s Up to 6 cluster s Up to 6 cluster s Up to 32 clusters Up to 32 clusters Up to 32 clusters Up to 32 clusters Wake up Wake up Wake up 64 inputs from the comparators 64 inputs from the comparators Up to 4 cluster s FIFO full Slow control mask threshold s threshold s 2 flows up to the overlap finding Bus size reduction at each step by priority encoder Wake up to reduce the power consumption LUT Merger Up to 2 clusters LUT Merger Up to 2 clusters LUT Merger Up to 2 clusters Merger Up to 2 clusters Up to 2 clusters Up to 2 clusters Up to 2 clusters 4 inputs from comparators 4 inputs from comparators 4 inputs from comparators Algorithm based on a Look Up Table (LUT) 32 LUTs processes the 128 input strips within one clock cycle Mergers re-assemble clusters eventually shared by several LUTs Received from foundry in march 2011. Mounted in JLCC 68 pins First prototype developed in 130nm from IBM with approximately 60k VCAD Standard cells Only 32 inputs : internal demux to regenerate the 128 strips Size: 4mm² Sent 31th May 2010 to the foundry Test bench and results FEAFS first version, was developed to test 130 nm IBM technology with adapted architecture including main digital functionalities and blocks for Strip Pt-modules read-out (Cluster ID and selection, Stub selection, pipeline, FIFO, multiplexer, serial line) but with no specific features to interface to GigaBit Ttansceiver (GBT) system from CERN. Test results of the chip are in perfect adequacy with simulations. A new FEAFS version and a “Concentrator” ASIC are now proposed with proper data format and adaptation to the GBT. Zero suppression and asynchronous read-out can bring a large reduction in number of GBTs, OLs and FEDs. The FEAFS is the digital part of the front end ASIC, it has to be coupled with an analog part (preamplifier + comparator). Analog part of the CMS Binary Chip (CBC from Imperial College of London) could be a good candidate, but also other developments presented by the pole MICRHAU in the R&D 130nm poster. More simulation are needed to consolidate evaluation of rates and margins with respect to adaptable parameters and other variables. Summary and Perspectives Test setup: ASIC test is done by a cyclone IV ALTERA FPGA (on a DE2-115 development board from Terasic) test control is done either by USB, RS232 or JTAG. 2 different FPGA firmware : A random strip generation (with an adjustable probability) is applied on the FEAFS chip. The output bus is compared with an emulated FEAFS design in the FPGA. This firmware is used to test the chip at full speed on a long run period. A specific pattern written in FPGA ram is applied to the chip. The FEAFS output is recorded for a software analysis. This firmware is used to test the chip at reduce speed on a specific relatively short sequence of strips activity. Results: Power consumption at 40MHz : 34mA @1.8V = 61.2 mW (60mW expected) Internal logic is working as expected for a 40 MHz frequency. A Pt module for the sCMS silicon tracker H. Chanal (1-2) , Y. Zoccarato (2-3) (1) LPC Clermont Ferrand, Université Blaise Pascal, CNRS/IN2P3 (2) MICRHAU: pole de MIcroélectronique Rhone, AUvergne (3) Institut de physque nucléaire de Lyon (IPNL), Université de Lyon, Université Lyon 1, CNRS/IN2P3 http://micrhau.in2p3.fr/

Transcript of Trigger A front end chip for SLHC CMS strip tracker IN2P3 microelectronic Summer School 2011...

Page 1: Trigger A front end chip for SLHC CMS strip tracker IN2P3 microelectronic Summer School 2011 -Frejus, 16-19 June 2011  Concept of Silicon strip Pt-module.

Trigger

Pipeline FIFO

MUX

Serial interface (slow control)

mas

k

Clu

ster

ID

Cut

on

wid

th

mas

k

Clu

ster

ID

Cut

on

wid

th

Coincidence finder (Stub ID)

FIFO

Communication controler

DAC

Output link

SCL

SDA

64 ampli.

64 ampli. 64 discri.

64 discri.

Strip data

Strip data

FULL CHIP

FEAFS chip

128 strip data

A front end chip for SLHC CMS strip trackerA front end chip for SLHC CMS strip tracker

IN2P3 microelectronic Summer School 2011 -Frejus, 16-19 June 2011

Concept of Silicon strip Pt-module for trigger purpose in sCMS Concept of Silicon strip Pt-module for trigger purpose in sCMS

CMS: One of the 4 major experiment of the LHC Run smoothly with 7Tev pp collision since 2010

Upgrade : LHC luminosity to 5x1034cm-

2s-1

Preserve the performance by including the tracker in the level 1 trigger Local measurement of the particle bending

~ 1

-2 m

m

Δx

Top Silicon sensor

Bottom Silicon sensor~ 0.3 mm

Cluster Width

0.1 mmPosition offset

Track stub

Track bending in the B-field is inversely proportional to transverse momentumCluster Width and Offset selection in 2 sensors connected to same Front End ASICs (Pt-module) allows to reject low Pt tracks, reducing band width for read-out of proper trigger information at the LHC clock frequency

Architecture of a pure digital cluster research chip named FEAFS Architecture of a pure digital cluster research chip named FEAFS

Cluster Research

Threshold cut

Priority encoder

Overlap finding

Priority encoder

Cluster Research

Threshold cut

Priority encoder

Up to 12 clusters

Up to 6 clusters

Up to 6 clusters

Up to 32 clusters

Up to 32 clusters

Up to 32 clusters

Up to 32 clusters

Wake up Wake up Wake up

64 inputs from the comparators

64 inputs from the comparators

Up to 4 clusters

FIFO full

Slow control

mask thresholds thresholds

2 flows up to the overlap finding

Bus size reduction at each step by priority encoder

Wake up to reduce the power consumption

2 flows up to the overlap finding

Bus size reduction at each step by priority encoder

Wake up to reduce the power consumption

LUT

Merger

Up to 2 clusters

LUT

Merger

Up to 2 clusters

LUT

Merger

Up to 2 clusters

Merger

Up to 2 clusters

Up to 2 clusters

Up to 2 clusters

Up to 2 clusters

4 inputs from comparators

4 inputs from comparators

4 inputs from comparators Algorithm based on a Look Up Table (LUT)

32 LUTs processes the 128 input strips within one clock cycle

Mergers re-assemble clusters eventually shared by several LUTs

Algorithm based on a Look Up Table (LUT)

32 LUTs processes the 128 input strips within one clock cycle

Mergers re-assemble clusters eventually shared by several LUTs

Received from foundry in march 2011. Mounted in JLCC 68 pins

Received from foundry in march 2011. Mounted in JLCC 68 pins

First prototype developed in 130nm from IBM with approximately 60k VCAD Standard cells

Only 32 inputs : internal demux to regenerate the 128 strips

Size: 4mm² Sent 31th May 2010 to the foundry

First prototype developed in 130nm from IBM with approximately 60k VCAD Standard cells

Only 32 inputs : internal demux to regenerate the 128 strips

Size: 4mm² Sent 31th May 2010 to the foundry

Test bench and resultsTest bench and results

FEAFS first version, was developed to test 130 nm IBM technology with adapted architecture including main digital functionalities and blocks for Strip Pt-modules read-out (Cluster ID and selection, Stub selection, pipeline, FIFO, multiplexer, serial line) but with no specific features to interface to GigaBit Ttansceiver (GBT) system from CERN. Test results of the chip are in perfect adequacy with simulations. A new FEAFS version and a “Concentrator” ASIC are now proposed with proper data format and adaptation to the GBT. Zero suppression and asynchronous read-out can bring a large reduction in number of GBTs, OLs and FEDs. The FEAFS is the digital part of the front end ASIC, it has to be coupled with an analog part (preamplifier + comparator). Analog part of the CMS Binary Chip (CBC from Imperial College of London) could be a good candidate, but also other developments presented by the pole MICRHAU in the R&D 130nm poster. More simulation are needed to consolidate evaluation of rates and margins with respect to adaptable parameters and other variables.

Summary and PerspectivesSummary and Perspectives

Test setup: ASIC test is done by a cyclone IV ALTERA FPGA (on a DE2-115 development board from Terasic) test control is done either by USB, RS232 or JTAG. 2 different FPGA firmware :

A random strip generation (with an adjustable probability) is applied on the FEAFS chip. The output bus is compared with an emulated FEAFS design in the FPGA. This firmware is used to test the chip at full speed on a long run period. A specific pattern written in FPGA ram is applied to the chip. The FEAFS output is recorded for a software analysis. This firmware is used to test the chip at reduce speed on a specific relatively short sequence of strips activity.

Results: Power consumption at 40MHz : 34mA @1.8V = 61.2 mW (60mW expected) Internal logic is working as expected for a 40 MHz frequency.

A Pt module for the sCMS silicon trackerA Pt module for the sCMS silicon tracker

H. Chanal(1-2), Y. Zoccarato(2-3)

(1) LPC Clermont Ferrand, Université Blaise Pascal, CNRS/IN2P3(2) MICRHAU: pole de MIcroélectronique Rhone, AUvergne

(3) Institut de physque nucléaire de Lyon (IPNL), Université de Lyon, Université Lyon 1, CNRS/IN2P3

H. Chanal(1-2), Y. Zoccarato(2-3)

(1) LPC Clermont Ferrand, Université Blaise Pascal, CNRS/IN2P3(2) MICRHAU: pole de MIcroélectronique Rhone, AUvergne

(3) Institut de physque nucléaire de Lyon (IPNL), Université de Lyon, Université Lyon 1, CNRS/IN2P3

http://micrhau.in2p3.fr/