Trigger A front end chip for SLHC CMS strip tracker IN2P3 microelectronic Summer School 2011...
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Transcript of Trigger A front end chip for SLHC CMS strip tracker IN2P3 microelectronic Summer School 2011...
Trigger
Pipeline FIFO
MUX
Serial interface (slow control)
mas
k
Clu
ster
ID
Cut
on
wid
th
mas
k
Clu
ster
ID
Cut
on
wid
th
Coincidence finder (Stub ID)
FIFO
Communication controler
DAC
Output link
SCL
SDA
64 ampli.
64 ampli. 64 discri.
64 discri.
Strip data
Strip data
FULL CHIP
FEAFS chip
128 strip data
A front end chip for SLHC CMS strip trackerA front end chip for SLHC CMS strip tracker
IN2P3 microelectronic Summer School 2011 -Frejus, 16-19 June 2011
Concept of Silicon strip Pt-module for trigger purpose in sCMS Concept of Silicon strip Pt-module for trigger purpose in sCMS
CMS: One of the 4 major experiment of the LHC Run smoothly with 7Tev pp collision since 2010
Upgrade : LHC luminosity to 5x1034cm-
2s-1
Preserve the performance by including the tracker in the level 1 trigger Local measurement of the particle bending
~ 1
-2 m
m
Δx
Top Silicon sensor
Bottom Silicon sensor~ 0.3 mm
Cluster Width
0.1 mmPosition offset
Track stub
Track bending in the B-field is inversely proportional to transverse momentumCluster Width and Offset selection in 2 sensors connected to same Front End ASICs (Pt-module) allows to reject low Pt tracks, reducing band width for read-out of proper trigger information at the LHC clock frequency
Architecture of a pure digital cluster research chip named FEAFS Architecture of a pure digital cluster research chip named FEAFS
Cluster Research
Threshold cut
Priority encoder
Overlap finding
Priority encoder
Cluster Research
Threshold cut
Priority encoder
Up to 12 clusters
Up to 6 clusters
Up to 6 clusters
Up to 32 clusters
Up to 32 clusters
Up to 32 clusters
Up to 32 clusters
Wake up Wake up Wake up
64 inputs from the comparators
64 inputs from the comparators
Up to 4 clusters
FIFO full
Slow control
mask thresholds thresholds
2 flows up to the overlap finding
Bus size reduction at each step by priority encoder
Wake up to reduce the power consumption
2 flows up to the overlap finding
Bus size reduction at each step by priority encoder
Wake up to reduce the power consumption
LUT
Merger
Up to 2 clusters
LUT
Merger
Up to 2 clusters
LUT
Merger
Up to 2 clusters
Merger
Up to 2 clusters
Up to 2 clusters
Up to 2 clusters
Up to 2 clusters
4 inputs from comparators
4 inputs from comparators
4 inputs from comparators Algorithm based on a Look Up Table (LUT)
32 LUTs processes the 128 input strips within one clock cycle
Mergers re-assemble clusters eventually shared by several LUTs
Algorithm based on a Look Up Table (LUT)
32 LUTs processes the 128 input strips within one clock cycle
Mergers re-assemble clusters eventually shared by several LUTs
Received from foundry in march 2011. Mounted in JLCC 68 pins
Received from foundry in march 2011. Mounted in JLCC 68 pins
First prototype developed in 130nm from IBM with approximately 60k VCAD Standard cells
Only 32 inputs : internal demux to regenerate the 128 strips
Size: 4mm² Sent 31th May 2010 to the foundry
First prototype developed in 130nm from IBM with approximately 60k VCAD Standard cells
Only 32 inputs : internal demux to regenerate the 128 strips
Size: 4mm² Sent 31th May 2010 to the foundry
Test bench and resultsTest bench and results
FEAFS first version, was developed to test 130 nm IBM technology with adapted architecture including main digital functionalities and blocks for Strip Pt-modules read-out (Cluster ID and selection, Stub selection, pipeline, FIFO, multiplexer, serial line) but with no specific features to interface to GigaBit Ttansceiver (GBT) system from CERN. Test results of the chip are in perfect adequacy with simulations. A new FEAFS version and a “Concentrator” ASIC are now proposed with proper data format and adaptation to the GBT. Zero suppression and asynchronous read-out can bring a large reduction in number of GBTs, OLs and FEDs. The FEAFS is the digital part of the front end ASIC, it has to be coupled with an analog part (preamplifier + comparator). Analog part of the CMS Binary Chip (CBC from Imperial College of London) could be a good candidate, but also other developments presented by the pole MICRHAU in the R&D 130nm poster. More simulation are needed to consolidate evaluation of rates and margins with respect to adaptable parameters and other variables.
Summary and PerspectivesSummary and Perspectives
Test setup: ASIC test is done by a cyclone IV ALTERA FPGA (on a DE2-115 development board from Terasic) test control is done either by USB, RS232 or JTAG. 2 different FPGA firmware :
A random strip generation (with an adjustable probability) is applied on the FEAFS chip. The output bus is compared with an emulated FEAFS design in the FPGA. This firmware is used to test the chip at full speed on a long run period. A specific pattern written in FPGA ram is applied to the chip. The FEAFS output is recorded for a software analysis. This firmware is used to test the chip at reduce speed on a specific relatively short sequence of strips activity.
Results: Power consumption at 40MHz : 34mA @1.8V = 61.2 mW (60mW expected) Internal logic is working as expected for a 40 MHz frequency.
A Pt module for the sCMS silicon trackerA Pt module for the sCMS silicon tracker
H. Chanal(1-2), Y. Zoccarato(2-3)
(1) LPC Clermont Ferrand, Université Blaise Pascal, CNRS/IN2P3(2) MICRHAU: pole de MIcroélectronique Rhone, AUvergne
(3) Institut de physque nucléaire de Lyon (IPNL), Université de Lyon, Université Lyon 1, CNRS/IN2P3
H. Chanal(1-2), Y. Zoccarato(2-3)
(1) LPC Clermont Ferrand, Université Blaise Pascal, CNRS/IN2P3(2) MICRHAU: pole de MIcroélectronique Rhone, AUvergne
(3) Institut de physque nucléaire de Lyon (IPNL), Université de Lyon, Université Lyon 1, CNRS/IN2P3
http://micrhau.in2p3.fr/