Total solution of LED packaging · Total solution of LED packaging. Dimensions (Units:mm) 0.3 LED...

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Infrared control Automotives Signs/Displays Signals Illumination/Lighting Mobile Devices Since first LED (Light Emitting Diode) was invented in 1960s, LED has been going through a rapid period of development in revolutionizing the lighting technology and energy saving effort. Its applications become more widespread in numerous product segments in last decade. Total solution of LED packaging

Transcript of Total solution of LED packaging · Total solution of LED packaging. Dimensions (Units:mm) 0.3 LED...

Page 1: Total solution of LED packaging · Total solution of LED packaging. Dimensions (Units:mm) 0.3 LED 0.2 0.25 0.6 0.17 0.17 0.17 There are 2 trends which affect size and shape of LED:

Infrared control

AutomotivesSigns/Displays

Signals

Illumination/Lighting

Mobile Devices

Since first LED (Light Emitting Diode) was invented in 1960s, LED has been going through a rapid period of

development in revolutionizing the lighting technology and energy saving effort. Its applications become

more widespread in numerous product segments in last decade.

Total solution of LED packaging

Page 2: Total solution of LED packaging · Total solution of LED packaging. Dimensions (Units:mm) 0.3 LED 0.2 0.25 0.6 0.17 0.17 0.17 There are 2 trends which affect size and shape of LED:

Dimensions (Units:mm)

0.3

LED

0.2 0.25

0.6

0.17

0.17

0.17

There are 2 trends which affect size and shape of LED:

In order to get stronger emitting light, certain amounts LED chips are concentrate into integrated lighting source. This leads to larger

size of unit package of single LED.

Need relatively deep pocket and high volume / productivity support with 3M unique technology.

2 Thanks to smart phone and portable devices technology

development, requirement of components size, on the other hand,

is getting dwindled.

To serve the increasingly small LED sizes and the necessity of

production efficiency at packaging as well as pick and place levels,

the market demands a higher precision standard and ESD protection

of component carrier tape, simple and easy processing requirements.

Those trends call for much precise and high requirement solution.

3M, being a pioneer in supplying carrier and cover tapes, provides

the best option in managing LED component transportation.

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Not only the volume demand for LED components has grown significantly, the requirements on LED has also

raised associated with the end products development.

Page 3: Total solution of LED packaging · Total solution of LED packaging. Dimensions (Units:mm) 0.3 LED 0.2 0.25 0.6 0.17 0.17 0.17 There are 2 trends which affect size and shape of LED:

Main featuresLow cost

Less machine compact

Good tear resistanceLow sealing temperature

Cover tape

HAA

PSA

UCT

Main featuresStandard

Clean

High precision

Clean + High precision

Carrier tape3000

3000BD

3000UP

3000UB

Standard solution: Cost effectiveHAA + 3000 series2671A + 3000 series2675 + 3000 series2678 + 3000 series

Upper-graded solution:Better peeling-force and sealing requirementPSA + 3000 series2666 + 3000 series2668 + 3000 series 

Niche solution:High peeling-force requirementUCT + 3000 series2688A + 3000 series

3M Component Transport System Solution Recommendations

Features and Benefits of 3M Component Transport Products to fulfill requirements for LED component packaging

Wide Range of Offerings – Carrier Tape 3000 is available in various specifications including Standard, Precision, Ultra Precision

and for clean room applications.

Highly Precision – very precise pocket dimension with our unique manufacturing process that allows tolerance as low as

± 0.03mm. Components are assured of secure fit and free from migration and flipping issues.

Long Length Roll – typically in 500m to as long as 2000m depend on pocket depth and pitch. Our long meter per roll offering

is distinctive in market that helps reducing your changeover time and delivering you competitiveness via speed.

Stable Peel Force – 3M cover tapes are specifically designed to ensure good compatibility with 3M carriers. Desirable

adhesion and stable peel force can be easily achieved with appropriate pressure and/or heat and maintain in aging tests at

different environments in supporting various customers’ locations.

Bakable – our PC can withstand high temperature up to 125oC (257oF) which is appropriate for most

baking after component packaging is done to remove moisture in LED application.

Pocket depth – PC characteristic allows better forming result and relatively deep pocket which fits

LED perfectly compare to other material.

Depends on specific needs, we divide the solutions into 3 basic categories differentiating by the use of different adhesive based or design of

cover tapes. Each category represents a distinctive experience in sealing and peeling performance.

Why 3M?

Less machine compact

Good peeling forceLow sealing temperature

Page 4: Total solution of LED packaging · Total solution of LED packaging. Dimensions (Units:mm) 0.3 LED 0.2 0.25 0.6 0.17 0.17 0.17 There are 2 trends which affect size and shape of LED:

What is UPC? (Ultra Precision Carrier)

Ultra Precision Pocket:

Tighter (Ao, Bo, Ko) dimensional tolerances of ± 0.03mm

Small pocket hole diameter of 0.20 mm

Draft angle of < 2˚

Advantage of PC material based carrier tape compare to traditional PS, PET and PVC.

Features of 3M unique solution – UPC + UCT

What is UCT? (Universal Cover Tape)

UCT advantages:

Peeling force – Best in market

Room temp sealing High transmission

Good resistivity performance

Peel force:

UCT vs HAA

3M commits to provide our customers the valuable quality to provide our customers the first class services

worldwide, supporting via our global logistic, sales and technical networks. You will receive a fast response

wherever you are to sustain your business growth.

Electronic Solutions DivisionTransport Products6801 River Place Blvd.Austin, Texas(1) 800-666-8273www.3Mtapeandreel.com

Parameters

Shrinkage%

Heat Deflection Temp°C

Max Usage Temp°C

IZOD Impact Resistance

Tensile Strength psi

Ionic Contamination

Scratch Resistance

PC

<0.1

135

125

16

9.5E3

Low

Strong

PS

<0.5

100

80

1

7.0E3

Medium

Weak

PET

<0.5

80

65

4

7.0E3

High

Weak

PC

>1.0

90

65

2

9.0E3

High

Weak

1Dimension Precision

2Dimension Stability

3 Protect Capabilityfor Components

4 Antl-ContamlnateCapability