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Low Dropout Linear Regulators

To view specifications, select product from the table below.

Part Number Standard Voltages ON/OFF Control NoiseReduction

µ ProcessorReset

Package

TK112xxBM 1.3V to 5.0/5.5/8.0V High Yes No SOT-23L

TK112xxBU 2.0V to 5.0/5.5/8.0V High Yes No SOT-89-5

TK113xxBM 2.0V to 5.0/5.5/8.0V Low Yes No SOT-23L

TK113xxBU 2.0V to 5.0/5.5/8.0V Low Yes No SOT-89-5

TK116xxU 3.0V to 9.0V No No No SOT-89

TK11900M 1.5V to 15V(Adjustable)

Low Yes No SOT-23L

TK119xxM 2.2 to 5.0V Low Yes Yes SOT-23L

TK70403M 1.03V High No No SOT-26

TK711xxN 2.0V to 5.0V No No No TO-92

TK712xxM 2.0V to 5.0V No Yes No SOT-25

TK713xxM 1.5V to 5.0V Low Yes No SOT-25

TK715xx 2..0V to 5.0V Low Yes No SOT-23-3

TK716xxSCL 2.0V to 5.0V Low Yes No SOT-23-5

TK716xxSCLH 2.0 to 5.0 V High No SOT-23-5

TK716xxSIL 2.0 to 5.0V High No SOT-23-5

TK732xxMCL 2.0 to 11.0 VCMOS/TTL

CommpatibleSwitch

SOT-23L-8

TK732xxMCLH 4.1 to 4.2CMOS/TTL

CommpatibleSwitch

SOT-23L-8

TK732xxMIL 2.4 to 11.0CMOS/TTL

CommpatibleSwitch

SOT-23L-8

January 1999 TOKO, Inc. Page 1

TK112xxB

FEATURES High Voltage Precision at ± 2.0%

Active High On/Off Control

Very Low Dropout Voltage 80 mV at 30 mA

Very Low Noise

Very Small SOT-23L or SOT-89 Surface Mount

Packages

Internal Thermal Shutdown

Short Circuit Protection

APPLICATIONS Battery Powered Systems

Cellular Telephones

Pagers

Personal Communications Equipment

Portable Instrumentation

Portable Consumer Equipment

Radio Control Systems

Toys

Low Voltage Systems

BLOCK DIAGRAM

TK112xxB

GND

CONTROL

VOUT

VIN

NOISE BYPASS

GND

VOUT

GND

NOISE BYPASS

GND

CONTROL VIN

DESCRIPTIONThe TK112xxB is a low dropout linear regulator with a built-in electronic switch. The internal switch can be controlledby TTL or CMOS logic levels. The device is in the “on” statewhen the control pin is pulled to a logic high level. Anexternal capacitor can be connected to the noise bypasspin to lower the output noise level to 30 µVrms.

An internal PNP pass transistor is used to achieve a lowdropout voltage of 80 mV (typ.) at 30 mA load current. TheTK112xxB has a very low quiescent current of 170 µA atno load and 1 mA with a 30 mA load. The standby currentis typically 100 nA. The internal thermal shut down circuitrylimits the junction temperature to below 150 °C. The loadcurrent is internally monitored and the device will shutdown in the presence of a short circuit or overcurrentcondition at the output.

The TK112xxB is available in either a 6-pin SOT-23L or a5-pin SOT-89 surface mount packages.

ORDERING INFORMATION

TAPE/REEL CODEL: Tape Left (SOT-23L)B: Tape Left (SOT-89)

TEMP. CODE:C: -30 to +80 CI: -40 to +85 C

Tape/Reel Code

TK112 B

Voltage Code

Package Code

PACKAGE CODE:M: SOT-23LU: SOT-89

NOTE 1:1.3 V to 1.9 V availablein SOT-23L package only.

NOTE 2:1.3 V to 2.4 V availablein C temperature code(-30 to +80 C) only.

VOLTAGE CODE13 = 1.3 V 33 = 3.3 V14 = 1.4 V 34 = 3.4 V15 = 1.5 V 35 = 3.5 V16 = 1.6 V 36 = 3.6 V17 = 1.7 V 37 = 3.7 V18 = 1.8 V 38 = 3.8 V19 = 1.9 V 39 = 3.9 V20 = 2.0 V 40 = 4.0 V21 = 2.1 V 41 = 4.1 V22 = 2.2 V 42 = 4.2 V23 = 2.3 V 43 = 4.3 V24 = 2.4 V 44 = 4.4 V25 = 2.5 V 45 = 4.5 V26 = 2.6 V 46 = 4.6 V27 = 2.7 V 47 = 4.7 V28 = 2.8 V 48 = 4.8 V29 = 2.9 V 49 = 4.9 V30 = 3.0 V 50 = 5.0 V31 = 3.1 V 55 = 5.5 V32 = 3.2 V 80 = 8.0 V

Temp. Code

20P

NOISEBYPASS

VIN VOUT

THERMALPROTECTION

BANDGAPREFERENCE

CONTROL

GND

SOT-23L

SOT-89

VOLTAGE REGULATOR WITH ON/OFF SWITCH

January 1999 TOKO, Inc.

TK112xxB

Supply Voltage ......................................................... 16 VPower Dissipation SOT-23L (Note1) .................. 600 mWPower Dissipation SOT-89 (Note1) .................... 900 mWReverse Bias ............................................................ 10 V

Storage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -30 to +80 °COperating Voltage Range............................ 1.8 to 14.5 VJunction Temperature ........................................... 150 °C

ABSOLUTE MAXIMUM RATINGS TK112xxBC (V OUT ≥ 2.0 V)

TK112xxBC ELECTRICAL CHARACTERISTICS (V OUT ≥ 2.0 V)Test conditions: TA = 25 °C, unless otherwise specified.

Note 1: When mounted as recommended. Derate at 4.8 mW/°C for SOT-23L and 6.4 mW/°C for SOT-89 packages for operation above 25°C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: Output noise voltage can be reduced by connecting a capacitor to a noise pass terminal.Gen. Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.

LOBMYS RETEMARAP SNOITIDNOCTSET NIM PYT XAM STINU

IQ tnerruCtnecseiuQ I TUO IgnidulcxE,Am0= TNOC 071 052 Aµ

I YBTS tnerruCybdnatS V NI FFOtuptuO,V8= 1.0 Aµ

V TUO egatloVtuptuO I TUO Am03= 1elbaTeeS V

geReniL noitalugeReniLV TUO ≤ )2etoN(,V5.5 0.3 02 Vm

V TUO ≥ )2etoN(,V6.5 51 04 Vm

geRdaoL noitalugeRdaoL

I TUO )2etoN(,Am06ot1= 6 03 Vm



V PORD egatloVtuoporDI TUO )2etoN(,Am06= 21.0 02.0 V

I TUO )2etoN(,Am051= 62.0 93.0 V

I TUO tnerruCtuptuOsuounitnoC )2etoN( 051 Am

I )ESLUP(TUO tnerruCtuptuOesluP elcycytud%5.21,eslupsm5 081 Am

RR noitcejeRelppiRC,zH004=f L C,Fµ01= N ,Fµ1.0=

V NI V= TUO I,V5.1+ TUO ,Am03=V ELPPIR )3etoN(,smrVm001=

06 Bd

V ON egatloVesioNtuptuOzH01 ≤ f ≤ C,zHk08 L ,Fµ01=

CN V,Fµ1.0= NC V= TUO ,V5.1+I TUO )4,3setoN(,Am06=

03 smrVµ

V fer

lanimreTssapyBesioNegatloV

52.1 V

∆V TUO /∆T tneiciffeoCerutarepmeT I TUO Am01= 04 C°/mpp

SNOITACIFICEPSLANIMRETLORTNOC

I TNOC tnerruClortnoC V TNOC NOtuptuO,V8.1= 21 53 Aµ

V )NO(TNOC NOegatloVlortnoC NOtuptuO 8.1 V

V )FFO(TNOC FFOegatloVlortnoC FFOtuptuO 6.0 V


TK112xxB

Supply Voltage ......................................................... 16 VPower Dissipation SOT-23L (Note1) .................. 600 mWPower Dissipation SOT-89 (Note1) .................... 900 mWReverse Bias .............................................................. 7 V


ABSOLUTE MAXIMUM RATINGS TK1121xBC (V OUT ≤ 1.9 V)

TK1121xBC ELECTRICAL CHARACTERISTICS (V OUT ≤ 1.9 V)Test conditions: TA = 25 °C, unless otherwise specified.

Note 1: When mounted as recommended. Derate at 4.8 mw/°C for SOT-23L and 6.4 mw/°C for SOT-89 packages for operation above 25 °C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: Output noise voltage can be reduced by connecting a capacitor to a noise pass terminal.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.





geReniL noitalugeReniL )2etoN( 0.3 02 Vm

geRdaoL noitalugeRdaoLI TUO )2etoN(,Am06ot1= 6 03 Vm


I TUO tnerruCtuptuOsuounitnoCV4.2 ≤ V NI ≤ )2etoN(,V6.2 031 Am

V NI ≥ )2etoN(,V6.2 051 Am

I )ESLUP(TUO tnerruCtuptuOesluPV,eslupsm5 NI ≥ ,V6.2

elcycytud%5.21081 Am



55 Bd



03 smrVµ

V fer


52.1 V







TK112xxB

TK112xxBI ELECTRICAL CHARACTERISTICS (V OUT ≥ 2.5 V)Test conditions: TA = -40 to 85 °C, unless otherwise specified.



ABSOLUTE MAXIMUM RATINGS TK112xxBI (V OUT ≥ 2.5 V)






V TUO )2etoN(,V6.5 51 04 Vm






I TUO )2etoN(,Am051= 62.0 04.0 V





06 Bd



03 smrVµ

V fer


52.1 V






Note 1: When mounted as recommended. Derate at 4.8 mw/°C for SOT-23L and 6.4 mw/°C for SOT-89 packages for operation above 25 °C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: Output noise voltage can be reduced by connecting a capacitor to a noise pass terminal.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.Gen Note: For Line Regulation, typ. and max. is changed to VOUT > 5.6 V.


TK112xxB

Output Voltage VOUT(MIN) VOUT(MAX) TestVoltage Code Voltage1.3 V 13 1.240 V 1.36 V 2.4 V1.4 V 14 1.340 V 1.46 V 2.4 V1.5 V 15 1.440 V 1.560 V 2.4 V1.6 V 16 1.540 V 1.660 V 2.4 V1.7 V 17 1.640 V 1.760 V 2.4 V1.8 V 18 1.740 V 1.860 V 2.4 V1.9 V 19 1.804 V 1.960 V 2.4 V

Output Voltage VOUT(MIN) VOUT(MAX) TestVoltage Code Voltage2.0 V 20 1.940 V 2.060 V 3.0 V2.1 V 21 2.040 V 2.160 V 3.1 V2.2 V 22 2.140 V 2.260 V 3.2 V2.3 V 23 2.240 V 2.360 V 3.3 V2.4 V 24 2.340 V 2.460 V 3.4 V2.5 V 25 2.440 V 2.560 V 3.5 V2.6 V 26 2.540 V 2.660 V 3.6 V2.7 V 27 2.640 V 2.760 V 3.7 V2.8 V 28 2.740 V 2.860 V 3.8 V2.9 V 29 2.840 V 2.960 V 3.9 V3.0 V 30 2.940 V 3.060 V 4.0 V3.1 V 31 3.040 V 3.160 V 4.1 V3.2 V 32 3.140 V 3.260 V 4.2 V3.3 V 33 3.240 V 3.360 V 4.3 V3.4 V 34 3.335 V 3.465 V 4.4 V3.5 V 35 3.435 V 3.565 V 4.5 V3.6 V 36 3.535 V 3.665 V 4.6 V

Output Voltage VOUT(MIN) VOUT(MAX) TestVoltage Code Voltage3.7 V 37 3.630 V 3.770 V 4.7 V3.8 V 38 3.725 V 3.875 V 4.8 V3.9 V 39 3.825 V 3.975 V 4.9 V4.0 V 40 3.920 V 4.080 V 5.0 V4.1 V 41 4.020 V 4.180 V 5.1 V4.2 V 42 4.120 V 4.280 V 5.2 V4.3 V 43 4.215 V 4.385 V 5.3 V4.4 V 44 4.315 V 4.485 V 5.4 V4.5 V 45 4.410 V 4.590 V 5.5 V4.6 V 46 4.510 V 4.690 V 5.6 V4.7 V 47 4.605 V 4.795 V 5.7 V4.8 V 48 4.705 V 4.895 V 5.8 V4.9 V 49 4.800 V 5.000 V 5.9 V5.0 V 50 4.900 V 5.100 V 6.0 V5.5 V 55 5.390 V 5.610 V 6.5 V8.0 V 80 7.840 V 8.160 V 9.0 V

TK112xxBMC ELECTRICAL CHARACTERISTICS TABLE 1Test conditions: TA = 25 °C, IOUT = 30 mA, unless otherwise specified.

TK112xxBC ELECTRICAL CHARACTERISTICS TABLE 2Test conditions: TA = 25 °C, IOUT = 30 mA, unless otherwise specified.


TK112xxB

TK112xxBI ELECTRICAL CHARACTERISTICS TABLE 3Test Conditions: V

IN = V

OUT(TYP) + 1 V, I

OUT = 30 mA, unless otherwise specified.

Room Temp. Range (TA = 25 °C) Full Temp. Range (TA = -40 to +85 °C)Output Voltage VOUT(MIN) VOUT(MAX) VOUT(MIN) VOUT(MAX)

Voltage Code

2.5 V 25 2.440 V 2.560 V 2.400 V 2.600 V2.6 V 26 2.540 V 2.660 V 2.500 V 2.700 V2.7 V 27 2.640 V 2.760 V 2.600 V 2.800 V2.8 V 28 2.750 V 2.860 V 2.700 V 2.900 V2.9 V 29 2.840 V 2.960 V 2.800 V 3.000 V3.0 V 30 2.940 V 3.060 V 2.900 V 3.100 V3.1 V 31 3.040 V 3.160 V 3.000 V 3.200 V3.2 V 32 3.140 V 3.260 V 3.095 V 3.305 V3.3 V 33 3.240 V 3.360 V 3.190 V 3.410 V3.4 V 34 3.335 V 3.465 V 3.290 V 3.510 V3.5 V 35 3.435 V 3.565 V 3.385 V 3.615 V3.6 V 36 3.535 V 3.665 V 3.485 V 3.720 V3.7 V 37 3.630 V 3.770 V 3.580 V 3.820 V3.8 V 38 3.725 V 3.875 V 3.675 V 3.925 V3.9 V 39 3.825 V 3.975 V 3.770 V 4.030 V4.0 V 40 3.920 V 4.080 V 3.870 V 4.130 V4.1 V 41 4.020 V 4.180 V 3.965 V 4.235 V4.2 V 42 4.120 V 4.280 V 4.060 V 4.335 V4.3 V 43 4.215 V 4.385 V 4.160 V 4.440 V4.4 V 44 4.315 V 4.485 V 4.255 V 4.545 V4.5 V 45 4.410 V 4.590 V 4.350 V 4.645 V4.6 V 46 4.510 V 4.690 V 4.450 V 4.750 V4.7 V 47 4.605 V 4.795 V 4.545 V 4.850 V4.8 V 48 4.705 V 4.895 V 4.640 V 4.955 V4.9 V 49 4.800 V 5.000 V 4.740 V 5.060 V5.0 V 50 4.900 V 5.100 V 4.835 V 5.165 V5.5 V 55 5.390 V 5.610 V 5.320 V 5.680 V8.0 V 80 7.840 V 8.160 V 7.745 V 8.265 V


TK112xxB

CONTNOISE

BYPASS

VCONT 1

IIN

IOUT

CN0.1 µF

VOUT

VIN1.0 µF2.2 µF

ICONT

VIN+ +

+

+VOUTIOUT

ICONT

CN0.1 µF

CONT

VCONT

1 µF

VIN

VIN

IIN

VOUT+

NOISEBYPASS

+

+

VOUT

2.2 µF

TYPICAL PERFORMANCE CHARACTERISTICSTA = 25 °C, unless otherwise specified.

TEST CIRCUITSSOT-23L SOT-89

VIN

CONT

VOUT

RS

1 µF

CNCL = 10 µF to 0.22 µF0.1 µF

112XXB

OUTPUT VOLTAGE RESPONSE(OFF→ON)

0 200 600

TIME (µs)

400 800

CN = 0.01 µF

CN = 0.1 µF

CL = 2.2 µF

ILOAD = 30 mA

VC

ON

TV

OU

T

LOAD REGULATION

0 50 100

IOUT (mA)

VO

UT

(5

mV

/DIV

)

VOUT(TYP)

SHORT CIRCUIT CURRENT

0 150 300

IOUT (mA)

VO

UT

(V

)

5

4

3

2

1

0

OUTPUT VOLTAGE VS. INPUTVOLTAGE

0 VIN = VOUT

VIN (V) (50 mV/DIV)

IOUT = 30 mA

IOUT = 50 mA

IOUT = 90 mA

IOUT = 0 mA

VO

UT

(25

mV

/DIV

)

VOUT(TYP)

LINE REGULATION

0 10 20

VIN (V)

VO

UT

(50

mV

/DIV

)

VOUT(TYP)

DROPOUT VOLTAGE VS.OUTPUT CURRENT

0 200

IOUT (mA)

VD

RO

P (

mV

)

-400

-300

-200

0

100

-100

TRANSIENT RESPONSE

Note: Connect pin 5 toground for heat sink


TK112xxB

GROUND CURRENT VS. OUTPUTCURRENT

0 100 200

IOUT (mA)

I GN

D (

mA

)

10

8

6

4

2

0

REVERSE BIAS CURRENT(VIN = 0 V)

0 20

VREV (V)

0

I RE

V (

µA)

100

200

300

400

500

10

1.9 V

2.0 V

VOUT = 1.3 V

UPPER

QUIESCENT CURRENT (OFFMODE) VS. INPUT VOLTAGE

0 20

VIN (V)

0

I Q (

pA)

50

100

10

QUIESCENT CURRENT (ONMODE) vs. INPUT VOLTAGE

0 50

I Q (

mA

)

0.5

1.0

2.5

VIN (V)

IOUT = 0 mA

VOUT = 1.3 to 1.8 V

VOUT = 1.9 V

VOUT

GROUND CURRENT

-50 1000

I GN

D (

mA

)

2

1

0 50

TA (°C)

IOUT = 60 mA

IOUT = 30 mA

DROPOUT VOLTAGE

-50 1000

VD

RO

P (

mV

)

100

0 50

200

300

400

500

TA (°C)

IOUT = 150 mA

IOUT = 60 mA

IOUT = 30 mA

CONTROL CURRENT

-50 1000

I CO

NT

(µ

A)

10

0 50

30

40

50

TA (°C)

20

VCONT = 5 V

VCONT = 1.8 V

VCONT (VOUT, ON POINT)

-50 1000

VC

ON

T (

V)

50

1.0

2.0

TA (°C)

0

RCONT = 0 Ω

QUIESCENT CURRENT (ONMODE) VS. INPUT VOLTAGE

0 100

I Q (

mA

)

1

2

5

VIN (V)

IOUT = 0 mA

VOUT =

3 V 5 V

2 V 4 V

VOUT = 1.3 to 1.8 V

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)TA = 25 °C, unless otherwise specified.


TK112xxB

OUTPUT VOLTAGE VARIATION

-50 100

∆VO

UT

(m

V)

0 50

TA (°C)

-20

-10

0

10

-30

VOUT = 2 V4 V

5 V

3 V

LINE VOLTAGE STEP RESPONSE

VIN

VO

UT CN = 0.001 µF, CL = .22 µF

CN = 0.01 µF, CL = 2.2 µF

VOUT +2 V

VOUT +1 V

VO

UT

TIME (50 µs/DIV)

VO

UT

(10

mV

/DIV

)

LOAD CURRENT STEP RESPONSE

I OU

TV

OU

T

CN = 0.01 F, CL = 2.2 µF

100 mA

50 mA

CN = 0.1 F, CL = 10 µF

VO

UT

TIME (50 µs/DIV)

VO

UT

(50

mV

/DIV

)

NOISE LEVEL VS. CN

1 PF 10

CN

50

NO

ISE

(µ

V)

200

100

150

250

10000

100 .01 µF .1

CL = 2.2 µF

VOUT = 3 VIOUT = 60 mA

CL = 10 µF

CL = 3.3µF

NOISE SPECTRUM

0 1 M

-100

dB

0

-50

500 k

f (Hz)

CL = 3.3 µF, CN = NONE

CL = 3.3 µF, CN = 0.1 µF

SPECTRUM ANALYZER BACK-GROUND NOISE

-50 100

I OU

T (

mA

)

0 50

280

TA (°C)

240

250

260

270

VOUT = 1.9 V

VOUT = 2 to 2.6 V

VOUT = 2.7 V

VOUT = 1.3 V

MAXIMUM OUTPUT CURRENT

UPPER

UNDER

RIPPLE REJECTION

0.01 0.1

f (kHz)

-80

RR

(dB

)

-20

-60

-40

0

1-100

10 100

CN = 0.1 µF

CN = 0.01 µF

I OUT = 30 mA



TK112xxB

OUTPUT VOLTAGE vs. OUTPUTCURRENT

0 300

VO

UT

(V

)

1.1100 200

1.2

1.3

IOUT (mA)

2.4 V

2.1 V

2.0 V

1.9 V

VIN = 1.8 V

OUTPUT VOLTAGE vs. INPUTVOLTAGE

1.6 2.1

VO

UT

(V

)

1.1

1.3

1.7

1.2

1.8 1.9 2.0

VIN (V)

150 mA

120 mA

90 mA

60 mA

30 mA

IOUT = 0 mA


0 300

VO

UT

(V

)

1.2100 200

1.3

1.4

IOUT (mA)

2.4 V

2.0 V

2.1 V

1.9 V

VIN = 1.8 V


1.6 2.1

VO

UT

(V

)

1.2

1.4

1.7

1.3

1.8 1.9 2.0

VIN (V)

IOUT = 0 mA

30 mA

60 mA

150 mA

120 mA

90 mA


0 300

VO

UT

(V

)

1.3100 200

1.4

1.5

IOUT (mA)

VIN = 1.8 V

1.9 V

2.4 V

2.1 V

2.0 V


1.6 2.1

VO

UT

(V

)

1.3

1.5

1.7

1.4

1.8 1.9 2.0

VIN (V)

IOUT = 0 mA

30 mA

60 mA

150 mA

120 mA

90 mA

TK11213B

TK11214B

TK11215B



TK112xxB


1.6 2.1

VO

UT

(V

)

1.5

1.7

1.7

1.6

1.8 1.9 2.0

VIN (V)

IOUT = 0 mA

30 mA

60 mA

150 mA

120 mA

90 mA


1.6 2.1

VO

UT

(V

)

1.4

1.6

1.7

1.5

1.8 1.9 2.0

VIN (V)

IOUT = 0 mA

30 mA

60 mA

150 mA

90 mA

120 mA

TK11216B

TK11217B

TK11218B


0 300

VO

UT

(V

)

1.4100 200

1.5

1.6

IOUT (mA)

VIN = 1.8 V

1.9 V

2.0 V

2.1 V

2.4 V


0 300

VO

UT

(V

)

1.5100 200

1.6

1.7

IOUT (mA)

VIN = 1.8 V

1.9 V

2.4 V2.0 V

2.1 V


0 300

VO

UT

(V

)

1.6100 200

1.7

1.8

IOUT (mA)

1.9 V

2.0 V

2.1 V

2.4 V

VIN = 1.8 V


1.7 2.2

VO

UT

(V

)

1.6

1.8

1.8

1.7

1.9 2.0 2.1

VIN (V)

IOUT = 0 mA

150 mA

120 mA

90 mA

60 mA

30 mA



TK112xxB


1.7 2.2

VO

UT

(V

)

1.7

1.9

1.8

1.8

1.9 2.0 2.1

VIN (V)

150 mA

120 mA

30 mA

60 mA

90 mA

IOUT = 0 mA

TK11219BOUTPUT VOLTAGE vs. OUTPUT

CURRENT

0 300

VO

UT

(V

)

1.7100 200

1.8

1.9

IOUT (mA)

2.2 V

2.1 V2.0 V

VIN = 1.9 V

2.4 V



TK112xxB

DEFINITION AND EXPLANATION OF TECHNICAL TERMS

OUTPUT VOLTAGE (VOUT)

The output voltage is specified with VIN = (VOUT(TYP) + 1 V)and IOUT = 30 mA.

DROPOUT VOLTAGE (VDROP)

The dropout voltage is the difference between the inputvoltage and the output voltage at which point the regulatorstarts to fall out of regulation. Below this value, the outputvoltage will fall as the input voltage is reduced. It isdependent upon the load current and the junctiontemperature.

OUTPUT CURRENT (IOUT(MAX))

This is the maximum continuous output current specifiedunder the condition where the output voltage drops 0.3 Vbelow the value specified with IOUT = 30 mA. The inputvoltage is set to VOUT +1 V, and the current is pulsed tominimize temperature effect.

CONTINUOUS OUTPUT CURRENT (IOUT)

Normal operating output current. This is limited by packagepower dissipation.

PULSE OUTPUT CURRENT (IOUT(PULSE))

Maximum pulse width 5 ms at VOUT upper 2.0 V; 7 ms. atVOUT under 1.9 V; duty cycle 12.5%: pulse load only.

LINE REGULATION (Line Reg)

Line regulation is the ability of the regulator to maintain aconstant output voltage as the input voltage changes. Theline regulation is specified as the input voltage is changedfrom VIN = VOUT(TYP) + 1 V to VIN = VOUT(TYP) + 6 V.

LOAD REGULATION (Load Reg)

Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It isa pulsed measurement to minimize temperature effectswith the input voltage set to VIN = VOUT +1 V. The loadregulation is specified under two output current stepconditions of 1 mA to 60 mA and 1 mA to 100 mA.

QUIESCENT CURRENT (IQ)

The quiescent current is the current which flows throughthe ground terminal under no load conditions (IOUT = 0 mA).

GROUND CURRENT (IGND)

Ground current is the current which flows through theground pin(s). It is defined as IIN - IOUT, excluding ICONT.

RIPPLE REJECTION RATIO (RR)

Ripple rejection is the ability of the regulator to attenuatethe ripple content of the input voltage at the output. It isspecified with 100 mVrms, 400 Hz superimposed on theinput voltage, where VIN = VOUT + 1.5 V. The outputdecoupling capacitor is set to 10 µF, the noise bypasscapacitor is set to 0.1 µF, and the load current is set to 30mA. Ripple rejection is the ratio of the ripple content of theoutput vs. the input and is expressed in dB.

STANDBY CURRENT (ISTBY)

Standby current is the current which flows into the regulatorwhen the output is turned off by the control function(VCONT = 0 V). It is measured with VIN = 8 V (9 V for the 8V output device).

SENSOR CIRCUITS

Overcurrent Sensor

The overcurrent sensor protects the device in the eventthat the output is shorted to ground.

Thermal Sensor

The thermal sensor protects the device in the event thatthe junction temperature exceeds the safe value (TJ = 150°C). This temperature rise can be caused by external heat,excessive power dissipation caused by large input tooutput voltage drops, or excessive output current. Theregulator will shut off when the temperature exceeds thesafe value. As the junction temperatures decrease, theregulator will begin to operate again. Under sustained faultconditions, the regulator output will oscillate as the deviceturns off then resets. Damage may occur to the deviceunder extreme fault conditions.


TK112xxB

Reverse Voltage Protection

Reverse voltage protection prevents damage due to theoutput voltage being higher than the input voltage. Thisfault condition can occur when the output capacitor remainscharged and the input is reduced to zero, or when anexternal voltage higher than the input voltage is applied tothe output side.

CONTROL FUNCTION

DEFINITION AND EXPLANATION OF TECHNICAL TERMS (CONT.)

CN

VIN

SW

RC

SOT-23L

CN

VIN

SW

RC

SOT-89

CONTROL PIN CURRENT VS.VOLTAGE

0 1 2 3

VCONT (V)

0

I CO

NT

(µA

)10

20

30

40

50

4 5

VOUT

RCONT =100K

RCONT = 0

If the control function is not used, connect the controlterminal to VIN. When the control function is used, thecontrol current can be reduced by inserting a seriesresistor (RCONT) between the control terminal and VIN. Thevalue of this resistor should be determined from the graphbelow.


TK112xxB

ON/OFF RESPONSE WITH CONTROL AND LOAD TRANSIENT RESPONSE

The turn-on time depends upon the value of the output capacitor and the noise bypass capacitor. The turn-on time willincrease with the value of either capacitor. The graphs below show the relationship between turn-on time and loadcapacitance. If the value of these capacitors is reduced, the load and line regulation will suffer and the noise voltage willincrease. If the value of these capacitors is increased, the turn-on time will increase.



-5 5 2515 35

CL = 0.33 µF

45

CL = 1.0 µF

CL = 1.5 µF

CL = 0.47 µF

TIME (µs)

ILOAD = 10 mA, CN = 1000 pF

VO

UT

VC

ON

T


-5 5 15 3525 45

TIME( µs)

CL = 0.33 µF

VO

UT

(20

0 m

V/D

IV)

I LO

AD

ILOAD = 5 to 35 mA

30 to 60 mA

0 to 30 mA

REDUCTION OF OUTPUT NOISE

Although the architecture of the Toko regulators is designed to minimize semiconductor noise, further reduction can beachieved by the selection of external components. The obvious solution is to increase the size of the output capacitor.A more effective solution would be to add a capacitor to the noise bypass terminal. The value of this capacitor shouldbe 0.1 µf or higher (higher values provide greater noise reduction). Although stable operation is possible without the noisebypass capacitor, this terminal has a high impedance and care should be taken to avoid a large circuit area on the printedcircuit board when the capacitor is not used. Please note that several parameters are affected by the value of thecapacitors and bench testing is recommended when deviating from standard values.


0 200 600

TIME (µs)

400 800

CN = 0.01 µF

CN = 0.1 µF

CL = 2.2 µF

ILOAD = 30 mA

VC

ON

TV

OU

T


TK112xxB

the output side is shorted. Input current gradually falls astemperature rises. You should use the value when thermalequilibrium is reached.

The range of usable currents can also be found from thegraph below.

Procedure:

1) Find PD2) PD1 is taken to be PD x (~0.8 - 0.9)3) Plot PD1 against 25 °C4) Connect PD1 to the point corresponding to the 150 °C

with a straight line.5) In design, take a vertical line from the maximum

operating temperature (e.g., 75 °C) to the deratingcurve.

6) Read off the value of PD against the point at which thevertical line intersects the derating curve. This is takenas the maximum power dissipation, DPD.

The maximum operating current is:

IOUT = (DPD / (VIN(MAX) - VOUT)

PACKAGE POWER DISSIPATION (P D)

This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23L is increased to 600 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23L device should be derated at 4.8 mW/°C. Thepower dissipation of the SOT-89 package is 900 mW whenmounted as recommended. Derate the power dissipationat 7.2 mW/°C for operation above 25 °C. To determine thepower dissipation for shutdown when mounted, attach thedevice on the actual PCB and deliberately increase theoutput current (or raise the input voltage) until the thermalprotection circuit is activated. Calculate the powerdissipation of the device by subtracting the output powerfrom the input power. These measurements should allowfor the ambient temperature of the PCB. The value obtainedfrom PD /(150 °C - TA) is the derating factor. The PCBmounting pad should provide maximum thermalconductivity in order to maintain low device temperatures.As a general rule, the lower the temperature, the better thereliability of the device. The thermal resistance whenmounted is expressed as follows:

Tj = 0jA x PD + TA

For Toko ICs, the internal limit for junction temperature is150 °C. If the ambient temperature (TA) is 25 °C, then:

150 °C = 0jA x PD + 25 °C0jA = 125 °C/ PD

PD is the value when the thermal sensor is activated. Asimple way to determine PD is to calculate VIN x IIN when


PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4


TK112xxB

SOT-23L POWER DISSIPATION CURVE SOT-89 POWER DISSIPATION CURVE

0 50 100TA (°C)

PD

(m

W)

1500

450

750

150

300

600 MOUNTED ASSHOWN

FREE AIR

0 50 100TA (°C)

PD

(m

W)

1500

600

1000

200

400

800

MOUNTED ASSHOWN

FREE AIR

APPLICATION NOTE

Copper pattern should be as large as possible. Power dissipation is 600 mW for SOT-23L and 900 mV for SOT-89. Alow Equivalent Series Resistance (ESR) capacitor is recommended. For low temperature operation, select a capacitorwith a low ESR at the lowest operating temperature to prevent oscillation, degradation of ripple rejection and increasein noise. The minimum recommended capacitance is 2.2 µF.

SOT-89 BOARD LAYOUTSOT-23L BOARD LAYOUT


++

GND

VCONT

VIN VOUT

+ +

VCONT

VINVOUT


TK112xxB

1 0 0 0

1 0 0

1 0

1

0.1

0.01

1 5 0 1 0 0 1 5 0

IOUT (mA)

STABLE

OPERATION

AREA

ES

R (

Ω)

1000

100

10

1

0.1

0 .01

1 50 100 150

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

1 0 0 0

1 0 0

1 0

1

0.1

0.01

1 5 0 1 0 0 1 5 0

IOUT (mA)

STABLE

OPERATION

AREA

ES

R (

Ω)

1000

100

10

1

0.1

0.01

1 50 100 150

IOUT (mA)

STABLEOPERATION

AREA

ES

R (

Ω)

APPLICATION INFORMATION

In general, the capacitor should be at least 1 µF (aluminum electrolytic) and be rated for the actual ambient operatingtemperature range. The table below shows typical characteristics for several types and values of capacitance. Pleasenote that the ESR varies widely depending upon manufacturer, type, size, and material.

CL = 1 µF CL = 2.2 µF CL = 3.3 µF CL = 10 µF

Note: ESR is measured at 10 kHz.

INPUT-OUTPUT CAPACITORS

Linear regulators require an output capacitor in order to maintain regulator loop stability. This capacitor should be selectedto ensure stable operation over the desired temperature and load range. The graphs below show the effects ofcapacitance value and ESR on the stable operation area.

2.0 V

3.0 V

5.0 V

112xxB

CL

ESR

VOUT =

ESRCapacitance

AluminumCapacitor

TantalumCapacitor

CeramicCapacitor

1.0 µF 2.4 Ω 2.3 Ω 0.140 Ω

2.2 µF 2.0 Ω 1.9 Ω 0.059 Ω

3.3 µF 4.6 Ω 1.0 Ω 0.049 Ω

10 µF 1.4 Ω 0.5 Ω 0.025 Ω


TK112xxB

Marking InformationProduct Code P

Voltage CodeTK11213B 13TK11214B 14TK11215B 15TK11216B 16TK11217B 17TK11218B 18TK11219B 19TK11220B 20TK11221B 21TK11222B 22TK11223B 23TK11224B 24TK11225B 25TK11226B 26TK11227B 27TK11228B 28TK11229B 29TK11230B 30TK11231B 31TK11232B 32TK11233B 33TK11234B 34TK11235B 35TK11236B 36TK11237B 37TK11238B 38TK11239B 39TK11240B 40TK11241B 41TK11242B 42TK11243B 43TK11244B 44TK11245B 45TK11246B 46TK11247B 47TK11248B 48TK11249B 49TK11250B 50TK11255B 55TK11280B 80

0.49 max 0.54 max 0.49 max

1.5

3.0

2.5

1.0

4.5

e

e'

0.49 max 0.49 max

1.6

4.5

0.4

0.44 max

0.44 max

+0

.5-0

.3

6 4

321

1.5

0.7 max 1.0 0.7 max

1.5

0.7

0.8

0.7

1.5

2.0

1.5

Recommended Mount Pad

45 °

1.5

1.5

e

ee

5

Product Code

0.49 max

Voltage CodeLot Number

Dimensions are shown in millimetersTolerance: x.x = ± 0.2 mm (unless otherwise specified)

1.0

Note: Pin 2 and Pin 5 should begrounded for heat dissipation

0.95 0.95

0.32

e eM0.1

(3.4)

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

0.4M0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.15- 0.05

+ 0.3


Voltage CodeProduct Code

5 PL

3.5+0.3- 0.1

+0.

15-

0.05

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE

Printed in the USA© 1999 Toko, Inc.All Rights Reserved

TOKO AMERICA REGIONAL OFFICES

Toko America, Inc. Headquarters1250 Feehanville Drive, Mount Prospect, Illinois 60056Tel: (847) 297-0070 Fax: (847) 699-7864

IC-215-TK112B0798O0.0K

Visit our Internet site at http://www.tokoam.com

The information furnished by TOKO, Inc. is believed to be accurate and reliable. However, TOKO reserves the right to make changes or improvements in the design, specification or manufacture of itsproducts without further notice. TOKO does not assume any liability arising from the application or use of any product or circuit described herein, nor for any infringements of patents or other rights ofthird parties which may result from the use of its products. No license is granted by implication or otherwise under any patent or patent rights of TOKO, Inc.

SOT-89 (SOT 89-5)

Western Regional OfficeToko America, Inc.2480 North First Street , Suite 260San Jose, CA 95131Tel: (408) 432-8281Fax: (408) 943-9790

Midwest Regional OfficeToko America, Inc.1250 Feehanville DriveMount Prospect, IL 60056Tel: (847) 297-0070Fax: (847) 699-7864

Eastern Regional OfficeToko America, Inc.107 Mill Plain RoadDanbury, CT 06811Tel: (203) 748-6871Fax: (203) 797-1223

Semiconductor Technical SupportToko Design Center4755 Forge RoadColorado Springs, CO 80907Tel: (719) 528-2200Fax: (719) 528-2375


TK113xxB


TAPE/REEL CODEL: Tape Left (SOT-23L)B: Tape Left (SOT-89)

TEMP. CODE:C: -30 to +80 CI: -40 to +85 C

Tape/Reel Code

TK113 B

Voltage Code

Package Code

PACKAGE CODE:M: SOT-23LU: SOT-89

Temp. Code

VOLTAGE CODE20 = 2.0 V 37 = 3.7 V21 = 2.1 V 38 = 3.8 V22 = 2.2 V 39 = 3.9 V23 = 2.3 V 40 = 4.0 V24 = 2.4 V 41 = 4.1 V25 = 2.5 V 42 = 4.2 V26 = 2.6 V 43 = 4.3 V27 = 2.7 V 44 = 4.4 V28 = 2.8 V 45 = 4.5 V29 = 2.9 V 46 = 4.6 V30 = 3.0 V 47 = 4.7 V31 = 3.1 V 48 = 4.8 V32 = 3.2 V 49 = 4.9 V33 = 3.3 V 50 = 5.0 V34 = 3.4 V 55 = 5.5 V35 = 3.5 V 60 = 6.0 V36 = 3.6 V 80 = 8.0 V

NOISEBYPASS

VIN VOUT

THERMALPROTECTION

BANDGAPREFERENCE

CONTROL

GND

FEATURES High Voltage Precision at ± 2.0%

Active Low On/Off Control

Very Low Dropout Voltage 80 mV at 30 mA

Very Low Noise

Very Small SOT-23L or SOT-89 Surface Mount

Packages




Cellular Telephones

Pagers





Toys

Low Voltage Systems

BLOCK DIAGRAM

TK113xxB

20P

GND

CONTROL

VOUT

VIN

NOISE BYPASS

GND

VOUT

GND

NOISE BYPASS

GND

CONTROL VIN

DESCRIPTIONThe TK113xxB is a low dropout linear regulator with a built-in electronic switch. The device is in the “on” state whenthe control pin is pulled to a low level. An external capacitorcan be connected to the noise bypass pin to lower theoutput noise level to 30 µVrms.

An internal PNP pass transistor is used to achieve a lowdropout voltage of 80 mV (typ.) at 30 mA load current. TheTK113xxB has a very low quiescent current of 170 µA at noload and 1 mA with a 30 mA load. The standby current istypically 100 nA. The internal thermal shut down circuitrylimits the junction temperature to below 150 °C. The loadcurrent is internally monitored and the device will shutdown in the presence of a short circuit or overcurrentcondition at the output.

The TK113xxB is available in either 6-pin SOT-23L or5-pin SOT-89 surface mount packages.

SOT-23L

SOT-89

VOLTAGE REGULATOR WITH ON/OFF SWITCH


TK113xxB

ABSOLUTE MAXIMUM RATINGS (V OUT ≥ 2.0 V)Supply Voltage ......................................................... 16 VOutput Current .................................................... 260 mAPower Dissipation SOT-23L (Note 1) ............... 600 mWPower Dissipation SOT-23L (Note 1) ............... 900 mWReverse Bias............................................................ 10 V

Storage Temperature Range ................... -55 to +150 °COperating Temperature Range .................. -30 to +80 °CVoltage Range ............................................ 1.8 to 14.5 VOperating Junction Temperature .......................... 150 °C

TK113xxBC ELECTRICAL CHARACTERISTICS (V OUT ≥ 2.0 V)Test conditions: TA = 25 °C, unless otherwise specified.

Note 1: When mounted as recommended. Derate at 4.8 mW/°C for SOT-23L and 6.4 mW/°C for SOT-89 packages for operation above 25°C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: Output noise voltage can be reduced by connecting a capacitor to a noise pass terminal.Gen. Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.






V TUO ≥ )2etoN(,V6.5 51 04 Vm






I TUO )2etoN(,Am051= 62.0 93.0 V





06 Bd



03 smrVµ

V fer


52.1 V




V )NO(TNOC NOegatloVlortnoC NOtuptuO V CC 8.1- V

V )FFO(TNOC FFOegatloVlortnoC FFOtuptuO V CC 6.0- V


TK113xxB

TK113xxBI ELECTRICAL CHARACTERISTICS (V OUT ≥ 2.5 V)Test conditions: TA = -40 to 85 °C, unless otherwise specified.



ABSOLUTE MAXIMUM RATINGS TK113xxBI (V OUT ≥ 2.5 V)






V TUO )2etoN(,V6.5 51 04 Vm






I TUO )2etoN(,Am051= 62.0 04.0 V





06 Bd



03 smrVµ

V fer


52.1 V




V )NO(TNOC NOegatloVlortnoC NOtuptuO V CC 0.2- V

V )FFO(TNOC FFOegatloVlortnoC FFOtuptuO V CC 5.0- V

Note 1: When mounted as recommended. Derate at 4.8 mw/°C for SOT-23L and 6.4 mw/°C for SOT-89 packages for operation above 25 °C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: Output noise voltage can be reduced by connecting a capacitor to a noise pass terminal.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.Gen Note: For Line Regulation, typ. and max. is changed to VOUT > 5.6 V.


TK113xxB

TK113xxBC ELECTRICAL CHARACTERISTICS TABLE 1Test conditions: TA = 25 °C, IOUT = 30 mA, unless otherwise specified.




TK113xxB

TK113xxBI ELECTRICAL CHARACTERISTICS TABLE 2Test Conditions: V

IN = V

OUT(TYP) + 1 V, I

OUT = 30 mA, unless otherwise specified.


Voltage Code

2.5 V 25 2.440 V 2.560 V 2.400 V 2.600 V2.6 V 26 2.540 V 2.660 V 2.500 V 2.700 V2.7 V 27 2.640 V 2.760 V 2.600 V 2.800 V2.8 V 28 2.750 V 2.860 V 2.700 V 2.900 V2.9 V 29 2.840 V 2.960 V 2.800 V 3.000 V3.0 V 30 2.940 V 3.060 V 2.900 V 3.100 V3.1 V 31 3.040 V 3.160 V 3.000 V 3.200 V3.2 V 32 3.140 V 3.260 V 3.095 V 3.305 V3.3 V 33 3.240 V 3.360 V 3.190 V 3.410 V3.4 V 34 3.335 V 3.465 V 3.290 V 3.510 V3.5 V 35 3.435 V 3.565 V 3.385 V 3.615 V3.6 V 36 3.535 V 3.665 V 3.485 V 3.720 V3.7 V 37 3.630 V 3.770 V 3.580 V 3.820 V3.8 V 38 3.725 V 3.875 V 3.675 V 3.925 V3.9 V 39 3.825 V 3.975 V 3.770 V 4.030 V4.0 V 40 3.920 V 4.080 V 3.870 V 4.130 V4.1 V 41 4.020 V 4.180 V 3.965 V 4.235 V4.2 V 42 4.120 V 4.280 V 4.060 V 4.335 V4.3 V 43 4.215 V 4.385 V 4.160 V 4.440 V4.4 V 44 4.315 V 4.485 V 4.255 V 4.545 V4.5 V 45 4.410 V 4.590 V 4.350 V 4.645 V4.6 V 46 4.510 V 4.690 V 4.450 V 4.750 V4.7 V 47 4.605 V 4.795 V 4.545 V 4.850 V4.8 V 48 4.705 V 4.895 V 4.640 V 4.955 V4.9 V 49 4.800 V 5.000 V 4.740 V 5.060 V5.0 V 50 4.900 V 5.100 V 4.835 V 5.165 V5.5 V 55 5.390 V 5.610 V 5.320 V 5.680 V6.0 V 60 5.880 V 6.120 V 5.805 V 6.195 V8.0 V 80 7.840 V 8.160 V 7.745 V 8.265 V


TK113xxB

CONTNOISE

BYPASS

VCONT 1

IIN

IOUT

CN0.1 µF

VOUT

VIN1.0 µF2.2 µF

ICONT

VIN+ +

+

+VOUT


TEST CIRCUITS

IOUT

ICONT

CN0.1 µF

CONT

VCONT

1 µF

VIN

VIN

IIN

VOUT+

NOISEBYPASS

+

+

VOUT

2.2 µF


0 200 600

TIME (µs)

400 800

CN = 0.01 µF

CN = 0.1 µF

CL = 2.2 µF

ILOAD = 30 mA

VC

ON

TV

OU

T

LOAD REGULATION

0 50 100

IOUT (mA)

VO

UT

(5

mV

/DIV

)

VOUT(TYP)


0 150 300

IOUT (mA)

VO

UT

(V

)

5

4

3

2

1

0


0 VIN = VOUT

VIN (V) (50 mV/DIV)

IOUT = 30 mA

IOUT = 50 mA

IOUT = 90 mA

IOUT = 0 mA

VO

UT

(25

mV

/DIV

)

VOUT(TYP)

LINE REGULATION

0 10 20

VIN (V)

VO

UT

(50

mV

/DIV

)

VOUT(TYP)

DROPOUT VOLTAGE VS. OUTPUTCURRENT

0 200

IOUT (mA)

VD

RO

P (

mV

)

-400

-300

-200

0

100

-100

VIN

CONT

VOUT

RS

1 µF

CNCL = 10 µF to 0.22 µF0.1 µF

113XXB

TRANSIENT RESPONSE

SOT-23L SOT-89

Note: Connect pin 5 toground for heat sink


TK113xxB

GROUND CURRENT VS. OUTPUTCURRENT

0 100 200

IOUT (mA)

I GN

D (

mA

)

10

8

6

4

2

0

QUIESCENT CURRENT (OFFMODE) VS. INPUT VOLTAGE

0 20

VIN (V)

0

I Q (

pA)

50

100

10

QUIESCENT CURRENT

-50 1000

I Q (

mA

)

2

1

0 50

TA (°C)

IOUT = 60 mA

IOUT = 30 mA

DROPOUT VOLTAGE

-50 1000

VD

RO

P (

mV

)

100

0 50

200

300

400

500

TA (°C)

IOUT = 150 mA

IOUT = 60 mA

IOUT = 30 mA

CONTROL CURRENT

-50 1000

I CO

NT

(µ

A)

10

0 50

30

40

50

TA (°C)

20

VCONT = 5 V

VCONT = 1.8 V

VCONT (VOUT, ON POINT)

-50 1000

VC

ON

T (

V)

50

1.0

2.0

TA (°C)

0

RCONT = 0 Ω


0 20

VREV (V)

0

I RE

V (

µA)

100

200

300

400

500

10

QUIESCENT CURRENT (ONMODE) VS. INPUT VOLTAGE

0 100

I Q (

mA

)

1

2

5

VIN (V )

IOUT = 0 mA

VOUT =

3 V 5 V

2 V 4 V

-50 100

I OU

T (

mA

)

0 50

280

TA (°C)

240

250

260

270

VOUT = 2 to 2.6 V

VOUT = 2.7 V




TK113xxB

OUTPUT VOLTAGE VARIATION

-50 100

∆VO

UT

(m

V)

0 50

TA (°C)

-20

-10

0

10

-30

VOUT = 2 V4 V

5 V

3 V


VIN

VO

UT CN = 0.001 µF, CL = .22 µF

CN = 0.01 µF, CL = 2.2 µF

VOUT +2 V

VOUT +1 V

VO

UT

TIME (50 µs/DIV)

VO

UT

(10

mV

/DIV

)


I OU

TV

OU

T

CN = 0.01 F, CL = 2.2 µF

100 mA

50 mA

CN = 0.1 F, CL = 10 µF

VO

UT

TIME (50 µs/DIV)

VO

UT

(50

mV

/DIV

)

NOISE SPECTRUM

0 1 M

-100

dB

0

-50

500 k

f (Hz)

CL = 3.3 µF, CN = NONE

CL = 3.3 µF, CN = 0.1 µF


NOISE LEVEL VS. CN

1 PF 10

CN

50

NO

ISE

(µ

V)

200

100

150

250

10000

100 .01 µF .1

CL = 2.2 µF

VOUT = 3 VIOUT = 60 mA

CL = 10 µF

CL = 3.3µF

RIPPLE REJECTION

0.01 0.1

f (kHz)

-80

RR

(dB

)

-20

-60

-40

0

1-100

10 100

CN = 0.1 µF

CN = 0.01 µF

I OUT = 30 mA



TK113xxB







This is the maximum continuous output current as specifiedunder the condition where the output voltage drops 0.3 Vbelow the value specified with IOUT = 30 mA. The inputvoltage is set to VOUT +1 V, and the current is pulsed tominimize temperature effect.




Max pulse width 5 ms, Duty cycle 12.5%: pulse load only.




Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It isa pulsed measurement to minimize temperature effectswith the input voltage set to VIN = VOUT +1 V. The loadregulation is specified under two output current stepconditions of 1 mA to 60 mA and 1 mA to 100 mA.




Ground current is the current which flows through theground pin(s). It is defined as IIN - IOUT, excluding controlcurrent.


Ripple rejection is the ability of the regulator to attenuatethe ripple content of the input voltage at the output. It isspecified with 100 mVrms, 400 Hz superimposed on theinput voltage, where VIN = VOUT + 1.5 V. The outputdecoupling capacitor is set to 10 µF, the noise bypasscapacitor is set to 0.1 µF, and the load current is set to 30mA. Ripple rejection is the ratio of the ripple content of theoutput vs. the input and is expressed in dB.


Standby current is the current which flows into the regulatorwhen the output is turned off by the control function(VCONT = VIN). It is measured with VIN = 8 V (9 V for the8 V output device).

SENSOR CIRCUITS

Overcurrent Sensor

The overcurrent sensor protects the device in the eventthat the output is shorted to ground.

Thermal Sensor

The thermal sensor protects the device in the event thatthe junction temperature exceeds the safe value (Tj = 150°C). This temperature rise can be caused by external heat,excessive power dissipation caused by large input tooutput voltage drops, or excessive output current. Theregulator will shut off when the temperature exceeds thesafe value. As the junction temperatures decrease, theregulator will begin to operate again. Under sustained faultconditions, the regulator output will oscillate as the deviceturns off then resets. Damage may occur to the deviceunder extreme fault conditions.


TK113xxB



CONTROL CURRENT


CN

VIN

SW RC

SOT-23L

CN

VIN

SWRC

SOT-89


0 1 2 3

VCONT (V)

0

I CO

NT

(µA

)10

20

30

40

50

4 5

VOUT

RCONT = 0

RCONT =100K

Note: VCONT = differential voltage from VIN pin to VCONT pin.

If the control function is not used, connect the controlterminal to VIN. When the control function is used, thecontrol current can be reduced by inserting a seriesresistor (RCONT) between the control terminal and VIN. Thevalue of this resistor should be determined from the graphbelow.


TK113xxB


ON/OFF RESPONSE WITH CONTROL AND LOAD TRANSIENT RESPONSE

The turn-on time depends upon the value of the output capacitor and the noise bypass capacitor. The turn-on time willincrease with the value of either capacitor. The graphs below shows the relationship between turn-on time and loadcapacitance. If the value of these capacitors is reduced, the load and line regulation will suffer and the noise voltage willincrease. If the value of these capacitors is increased, the turn-on time will increase.


-5 5 2515 35

CL = 0.33 µF

45

CL = 1.0 µF

CL = 1.5 µF

CL = 0.47 µF

TIME (µs)


VO

UT

VC

ON

T


-5 5 15 3525 45

TIME( µs)

CL = 0.33 µF

VO

UT

(20

0 m

V/D

IV)

I LO

AD

ILOAD = 5 to 35 mA

30 to 60 mA

0 to 30 mA


Although the architecture of the Toko regulators is designed to minimize semiconductor noise, further reduction can beachieved by the selection of external components. The obvious solution is to increase the size of the output capacitor.A more effective solution would be to add a capacitor to the noise bypass terminal. The value of this capacitor shouldbe 0.1 µf or higher (higher values provide greater noise reduction). Although stable operation is possible without the noisebypass capacitor, this terminal has a high impedance and care should be taken to avoid a large circuit area on the printedcircuit board when the capacitor is not used. Please note that several parameters are affected by the value of thecapacitors and bench testing is recommended when deviating from standard values.


0 200 600

TIME (µs)

400 800

CN = 0.01 µF

CN = 0.1 µF

CL = 2.2 µF

ILOAD = 30 mA

VC

ON

TV

OU

T


TK113xxB

the output side is shorted. Input current gradually falls astemperature rises. You should use the value when thermalequilibrium is reached.


Procedure:

1) Find PD2) PD1 is taken to be PD x (~ 0.8 - 0.9)3) Plot PD1 against 25 °C4) Connect PD1 to the point corresponding to the 150 °C







This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23L is increased to 600 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23L device should be derated at 4.8 mW/°C. Thepower dissipation of the SOT-89 package is 900 mW whenmounted as recommended. Derate the power dissipationat 7.2 mW/°C for operation above 25 °C. To determine thepower dissipation for shutdown when mounted, attach thedevice on the actual PCB and deliberately increase theoutput current (or raise the input voltage) until the thermalprotection circuit is activated. Calculate the powerdissipation of the device by subtracting the output powerfrom the input power. These measurements should allowfor the ambient temperature of the PCB. The value obtainedfrom PD /(150 °C - TA) is the derating factor. The PCBmounting pad should provide maximum thermalconductivity in order to maintain low device temperatures.As a general rule, the lower the temperature, the better thereliability of the device. The thermal resistance whenmounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA x PD = 125 °C0jA = 125 °C/ PD

PD is the value when the thermal sensor is activated. Asimple way to determine PD is to calculate VIN x IIN when


PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4


TK113xxB

SOT-89 POWER DISSIPATION CURVE

0 50 100TA (°C)

PD

(m

W)

1500

600

1000

200

400

800

MOUNTED ASSHOWN

FREE AIR

0 50 100TA (°C)

PD

(m

W)

1500

450

750

150

300

600 MOUNTED ASSHOWN

FREE AIR

SOT-23L POWER DISSIPATION CURVE

APPLICATION NOTE

Copper pattern should be as large as possible. Power dissipation is 600 mW for SOT-23L and 900 mV for SOT-89. Alow Equivalent Series Resistance (ESR) capacitor is recommended. For low temperature operation, select a capacitorwith a low ESR at the lowest operating temperature to prevent oscillation, degradation of ripple rejection and increasein noise. The minimum recommended capacitance is 2.2 µF.


++

GND

VCONT

VIN VOUT

SOT-23L BOARD LAYOUT

+ +

VCONT

VINVOUT

SOT-89 BOARD LAYOUT


TK113xxB

1 0 0 0

1 0 0

1 0

1

0.1

0.01

1 5 0 1 0 0 1 5 0

IOUT (mA)

STABLE

OPERATION

AREA

ES

R (

Ω)

1000

100

10

1

0.1

0 .01

1 50 100 150

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

1 0 0 0

1 0 0

1 0

1

0.1

0.01

1 5 0 1 0 0 1 5 0

IOUT (mA)

STABLE

OPERATION

AREA

ES

R (

Ω)

1000

100

10

1

0.1

0.01

1 50 100 150

IOUT (mA)

STABLEOPERATION

AREA

ES

R (

Ω)






Linear regulators require an output capacitor in order to maintain regulator loop stability. This capacitor should be selectedto ensure stable operation over the desired temperature and load range. The graphs below show the effects ofcapacitance value and ESR on the stable operation area.

2.0 V

3.0 V

5.0 V

113xxB

CL

ESR

VOUT =

ESRCapacitance

AluminumCapacitor

TantalumCapacitor

CeramicCapacitor

1.0 µF 2.4 Ω 2.3 Ω 0.140 Ω

2.2 µF 2.0 Ω 1.9 Ω 0.059 Ω

3.3 µF 4.6 Ω 1.0 Ω 0.049 Ω

10 µF 1.4 Ω 0.5 Ω 0.025 Ω


TK113xxB

Marking InformationProduct Code Q

Voltage CodeTK11320B 20TK11321B 21TK11322B 22TK11323B 23TK11324B 24TK11325B 25TK11326B 26TK11326B 27TK11327B 28TK11328B 29TK11329B 30TK11330B 31TK11331B 32TK11332B 33TK11333B 34TK11334B 35TK11335B 36TK11336B 37TK11337B 37TK11338B 38TK11339B 39TK11340B 40TK11341B 41TK11342B 42TK11343B 43TK11344B 44TK11345B 45TK11346B 46TK11347B 47TK11348B 48TK11349B 49TK11350B 50TK11355B 55TK11360B 60TK11380B 80

0.49 max 0.54 max 0.49 max

1.5

3.0

2.5

1.0

4.5

e

e'

0.49 max 0.49 max

1.6

4.5

0.4

0.44 max

0.44 max

+0

.5-0

.3

6 4

321

1.5

0.7 max 1.0 0.7 max

1.5

0.7

0.8

0.7

1.5

2.0

1.5


45 °

1.5

1.5

e

ee

5

Product Code

0.49 max

Voltage CodeLot Number


1.0

Note: Pin 2 and Pin 5 should begrounded for heat dissipation

0.95 0.95

0.32

e eM0.1

(3.4)

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

0.4M0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.15- 0.05

+ 0.3



5 PL

3.5+0.3- 0.1

+0.

15-

0.05

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-214-TK113B0798O0.0K



SOT-89 (SOT 89-5)






TK116xxU

GND

VIN VOUT

THERMALPROTECTION

BANDGAPREFERENCE



Cordless Telephones




Toys

Low Voltage Systems

FEATURES Low Dropout Voltage

Very Low Standby Current (No Load)

Good Load Regulation



3% Output Voltage Accuracy

Customized Versions Are Available

GND

VIN

VOUT

GND

TK116 U


TAPE/REEL CODETL: Tape Left

Tape/Reel CodeVoltage Code

VOLTAGE CODE30 = 3.0 V33 = 3.3 V50 = 5.0 V90 = 9.0 V

BLOCK DIAGRAM

DESCRIPTION

The TK116xxU series devices are low dropout, linear 3-terminal regulators.

An internal PNP pass-transistor is used in order to achievelow dropout voltage (typically 160 mV at 80 mA loadcurrent).

The regulated output voltages of 3, 3.3, 5 and 9 V areavailable. The device has very low (400 µA) quiescentcurrent with no load and 2 mA with 60 mA load.

An internal thermal shutdown circuit limits the junctiontemperature to below 150 °C. The load current is internallymonitored and the device will shut down in the presenceof a short circuit at the output.

The TK116xxU is available in the SOT-89 surface mountpackage.

TK116xxU

THREE-TERMINAL VOLTAGE REGULATOR

December 1998 TOKO, Inc.

TK116xxU

ABSOLUTE MAXIMUM RATINGSSupply Voltage ......................................................... 18 VOperating Voltage Range............................... 2.5 to 16 VLoad Current ....................................................... 250 mAPower Dissipation (Note 1) .............................. 1000 mW

Storage Temperature Range ................... -55 to +150 °COperating Temp. Range (Standard) ............ -30 to +80 °CLead Soldering Temperature (10 s) ...................... 235 °CJunction Temperature ........................................... 150 °C

TK11630U ELECTRICAL CHARACTERISTICSTest Conditions: TA = 25°C, VIN = 4.0 V, unless otherwise specified.

Note 1: Power dissipation is 600 mW in free air. Derate at 4.8 mW/°C for operation above 25°C. Power dissipation is 1 W when mounted asrecommended. Derate at 8 mW/°C for operation above 25 °C.

Note 2: IOUT (Load Current) is current when VOUT drops down 0.4 V from VOUT at IOUT = 10 mA.Note 3: Refer to “Definition of Terms.”


IQ tnerruCtnecseiuQV NI I,V0.4= TUO Am0= 004 008 Aµ

V NI I,V5.2= TUO Am0= 8.0 0.2 Am

V TUO egatloVtuptuO V NI I,V0.4= TUO Am01= 9.2 0.3 1.3 V

V PORD egatloVtuoporDI TUO Am03= 08 051 Am

I TUO Am001= 071 033 Vm

I TUO tnerruCtuptuO V NI )2etoN(,V0.4= 091 Am

I RO tnerruCtuptuOdednemmoceR V NI V0.4= 051 Am

I DNG )3etoN(tnerruCdnuorG V NI I,V0.4= TUO Am06= 0.2 5.4 Am

geReniL noitalugeReniL V NI V0.9ot0.4= 0.2 03 Vm


V NI I,V0.4= TUO Am03ot0= 51 06 Vm

V NI I,V0.4= TUO Am001ot0= 04 041 Vm

V NI I,V0.4= TUO Am051ot0= 021 022 Vm

RR noitcejeRelppiRV NI I,V5.4= TUO ,Am01=

smrVm001,zH004=f55 Bd

∆V TUO /∆T tneiciffeoCerutarepmeTV NI I,V5.4= TUO ,Am01=

C°03- ≤ TA ≤ C°08+53.0± C°/Vm


TK116xxU





V NI I,V0.3= TUO Am0= 8.0 0.2 Am



I TUO Am001= 071 033 Vm







V NI I,V3.4= TUO Am001ot0= 04 041 Vm

V NI I,V3.4= TUO Am051ot0= 021 022 Vm




C°03- ≤ TA ≤ C°08+53.0± C°/Vm


TK116xxU





V NI I,V0.4= TUO Am0= 8.0 0.2 Am



I TUO Am001= 071 033 Vm







V NI I,V0.6= TUO Am001ot0= 04 041 Vm

V NI I,V0.6= TUO Am051ot0= 021 022 Vm




C°03- ≤ TA ≤ C°08+53.0± C°/Vm


TK116xxU





V NI I,V0.8= TUO Am0= 8.0 0.2 Am



I TUO Am001= 071 033 Vm







V NI I,V0.01= TUO Am001ot0= 04 041 Vm

V NI I,V0.01= TUO Am051ot0= 021 022 Vm




C°03- ≤ TA ≤ C°08+7.0± C°/Vm


TK116xxU


TEST CIRCUIT

10 F

VIN

+ ++

IIN

CIN0.1 F

CL

VOUT

IOUT


-5 5 2515 35

CL = 0.33 µF

45

CL = 1.0 µF

CL = 1.5 µF

CL = 0.47 µF

TIME (µs)


VO

UT

VC

ON

T


0 200 600

TIME (µs)

400 800

CN = 0.01 µF

CN = 0.1 µF

CL = 2.2 µF

ILOAD = 30 mA

VC

ON

TV

OU

T


-5 5 15 3525 45

TIME( µs)

CL = 0.33 µF

VO

UT

(20

0 m

V/D

IV)

I LO

AD

ILOAD = 5 to 35 mA

30 to 60 mA

0 to 30 mA


0 1 2 3

VCONT (V)

0

I CO

NT

(µA

)

10

20

30

40

50

4 5

VOUT

RCONT = 0

RCONT =100K

LOAD REGULATION

0 50 100

IOUT (mA)

VO

UT

(5

mV

/DIV

)

VOUT(TYP)


0 150 300

IOUT (mA)

VO

UT

(V

)

5

4

3

2

1

0


TK116xxU


DROPOUT VOLTAGE VS.TEMPERATURE

400

200VD

RO

P (

mV

)

500

300

100

TA(°C)

0

IOUT = 80 mA

IOUT = 30 mA

-50 0 50 100

MAXIMUM OUTPUT CURRENT VS. TEMPERATURE

I OU

T (

mA

)

250

200

150

TA(°C)

TK11650

TK11630

-50 0 50 100

OUTPUT VOLTAGE VS.OUTPUT CURRENT

IOUT (mA)

VO

UT

(V

)

3.1

3.0

2.9

0 50 100

GROUND CURRENT VS.OUTPUT CURRENT

IOUT (mA)

I GN

D (

mA

)

10

5

00 50 100

OUTPUT VOLTAGE VS.INPUT VOLTAGE (1)

VIN (V)

VO

UT

(V

)

3.1

3.0

2.90 10 20

QUIESCENT CURRENT VS.INPUT VOLTAGE

VIN (V)

I Q (

mA

)

2

1

00 10 20


VIN (V)

VO

UT

(V

)

3.0

2.5

2.0

IOUT = 0 mA

IOUT = 30 mA

IOUT = 60 mA

IOUT = 90 mA

2.5 3.0 3.5

OUTPUT VOLTAGE VS.TEMPERATURE

TA (°C)

VO

UT

(V

)

3.1

3.0

2.9-50 0 50 100

11630


TK116xxU

11633OUTPUT VOLTAGE VS.

OUTPUT CURRENT

IOUT (mA)

VO

UT

(V

)

3.4

3.3

3.2

0 50 100

GROUND CURRENT VS. OUTPUT CURRENT

IOUT (mA)

I GN

D (

mA

)

10

5

00 50 100


VIN (V)

VO

UT

(V

)

3.4

3.3

3.20 10 20


VIN (V)

I Q (

mA

)

2

1

00 10 20


VIN (V)

VO

UT

(V

)

3.3

2.8

2.32.8 3.3 3.8

IOUT = 0 mA

IOUT = 30 mA

IOUT = 60 mA

IOUT = 90 mA


TA (°C)

VO

UT

(V

)

3.4

3.3

3.2-50 0 50 100


IOUT (mA)

VO

UT

(V

)

5.1

5.0

4.9

0 50 100


IOUT (mA)

I GN

D (

mA

)

10

5

00 50 100


VIN (V)

VO

UT

(V

)

5.1

5.0

4.90 10 20

11650



TK116xxU

11650 (CONT.)QUIESCENT CURRENT VS.

INPUT VOLTAGE

VIN (V)

I Q (

mA

)

2

1

00 10 20


VIN (V)

VO

UT

(V

)

5.0

4.5

4.0

IOUT = 0 mA

IOUT = 30 mA

IOUT = 60 mA

IOUT = 90 mA

4.5 5.0 5.5


TA (°C)

VO

UT

(V

)

5.1

5.0

4.9-50 0 50 100


IOUT (mA)

VO

UT

(V

)

9.1

9.0

8.9

0 50 100


IOUT (mA)

I GN

D (

mA

)

10

5

00 50 100


VIN (V)

VO

UT

(V

)

9.1

9.0

8.90 10 20


VIN (V)

VO

UT

(V

)

9.0

8.5

8.0

IOUT = 0 mA

IOUT = 30 mA

IOUT = 60 mA

IOUT = 90 mA

8.5 9.0 9.5


TA (°C)

VO

UT

(V

)

9.1

9.0

8.9-50 0 50 100

11690


VIN (V)

I Q (

mA

)

2

1

00 10 20



TK116xxU


This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. Whenthe junction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature is greatly affected by the mounting padconfiguration on the PCB, the board material and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be low,even if the power dissipation is great. When the radiationof heat is good, the device temperature will be low, even ifthe power loss is great. When mounted on therecommended mounting pad, the power dissipation of theSOT-89 package is 1000 mW. Derate the power dissipationat 8 mW/°C for operation above 25 °C. To determine thepower dissipation for shutdown when mounted, attach thedevice on the actual PCB and deliberately increase theoutput current (or raise the input voltage) until the thermalprotection circuit is activated. Calculate the powerdissipation of the device by subtracting the output powerfrom the input power. The measurements should allow forthe ambient temperature of the PCB. The value obtainedfrom PD /(150 °C - TA) is the derating factor. The PCBmounting pad should provide maximum thermalconductivity in order to maintain low device temperatures.As a general rule, the lower the temperature, the better thereliability of the device. The thermal resistance whenmounted is expressed as follows:

Tj = ΘjA x PD + TA


150 °C = ΘjA x PD + 25 °CΘjA = 125 °C/PD

PD is the value when the thermal sensor is activated. Asimple way to determine PD is to calculate VIN x IIN whenthe output side is shorted. Input current gradually falls astemperature rises. You should use the value when the





Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It isa pulsed measurement to minimize temperature effectswith the input voltage set to VIN = VOUT(TYP) +1 V. The loadregulation is specified under three output current stepconditions of 0 mA to 30 mA, 0 mA to 100 mA and 0 mA to150 mA.


This is a measure of how well the regulator performs as theinput voltage decreases. The smaller the number, thefurther the input voltage can decrease before regulationproblems occur. Nominal output voltage is first measuredwhen VIN = VOUT(TYP) + 1 V at a chosen load current. Whenthe output voltage has dropped 100 mV from the nominal,VIN - VOUT is the dropout voltage. This voltage is affectedby load current and junction temperature.



OUTPUT NOISE VOLTAGE

This is the effective AC voltage that occurs on the outputvoltage under the condition where the input noise is lowand with a given load, filter capacitor, and frequencyrange.

THERMAL PROTECTION

This is an internal feature which turns the regulator offwhen the junction temperature rises above 150 °C. Afterthe regulator turns off, the temperature drops and theregulator output turns back on. Under certain conditions,the output waveform may appear to be an oscillation as theoutput turns off and on and back again in succession.


TK116xxU

PD

Dpd

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100 150

TA (°C)

PD

(m

W)

0

600

1000

200

400

800

MOUNTED ASSHOWN

FREE AIR



thermal equilibrium is reached. The range of usable currentscan also be found from the graph below:

Procedure:1) Find PD2) PD1 is taken to be PD x (~ 0.8 - 0.9)3) Plot PD1 against 25 °C.4) Connect PD1 to the point corresponding to the 150 °C

with a straight line.5) In design, take a vertical line from the maximum operating

temperature (e.g., 75 °C.) to the derating curve.6) Read off the value of PD against the point at which the




TK116xxU

BOARD LAYOUT

Copper pattern should be as large as possible. Powerdissipation is 1000 mW for SOT-89. A low ESR capacitoris recommended. For low temperature operation, select acapacitor with a low ESR at the lowest operatingtemperature to prevent oscillation, degradation of ripplerejection and increase in noise. The minimumrecommended capacitance is 2.2 µF.

SOT-89 BOARD LAYOUT


INPUT/OUTPUT DECOUPLING CAPACITORCONSIDERATIONS

Voltage regulators require input and output decouplingcapacitors. The required value of these capacitors varywith application. Capacitors made by differentmanufacturers can have different characteristics,particularly with regard to high frequencies and EquivalentSeries Resistance (ESR) over temperature. The type ofcapacitor is also important. For example, a 4.7 µF aluminumelectrolytic may be required for a certain application. If atantalum capacitor is used, a lower value of 2.2 µF wouldbe adequate. It is important to consider the temperaturecharacteristics of the decoupling capacitors. While Tokoregulators are designed to operate as low as -30 °C, manycapacitors will not operate properly at this temperature.The capacitance of aluminum electrolytic capacitors maydecrease to 0 at low temperatures. This may causeoscillation on the output of the regulator since somecapacitance is required to guarantee stability. Thus, it isimportant to consider the characteristics of the capacitorover temperature when selection decoupling capacitors.

The ESR is another important parameter. The ESR willincrease with temperature but low ESR capacitors areoften larger and more costly. In general, tantalum capacitorsoffer lower ESR than aluminum electrolytic, but new lowESR aluminum electrolytic capacitors are now availablefrom several manufacturers. Usually a bench test issufficient to determine the minimum capacitance requiredfor a particular application. After taking thermalcharacteristics and tolerance into account, the minimumcapacitance value should be approximately two times thisvalue. Please note that linear regulators with a low dropoutvoltage have high internal loop gains which require care inguarding against oscillation caused by insufficientdecoupling capacitance. The use of high quality decouplingcapacitors suited for your application will guarantee properoperation of the circuit.

+

VOUT

+

VIN

GND


TK116xxU

4.7 µF

VIN

+ +

IN

1 µF

OUTOUT

VOUT

R

IOUT = + IQVOUT

R

GND

IQ

IOUT

VOLTAGE REGULATOR CIRCUIT VOLTAGE BOOST CIRCUIT

CURRENT BOOST CIRCUIT CURRENT REGULATOR CIRCUIT

APPLICATION NOTES

Maximize copper foil area connecting to all IC pins for optimum heat conduction. Place input and output bypass capacitorsclose to the GND pin.

For best transient behavior and lowest output impedance, use as large a capacitor value as possible. The temperaturecoefficient of the capacitance and Equivalent Series Resistance (ESR) should be taken into account. These parameterscan influence power supply noise and ripple rejection. In extreme cases, oscillation may occur. In order to maintainstability, the output bypass capacitor value should be minimum 1 µF for tantalum electrolytic or 4.7 µF for aluminumelectrolytic at TA = 25 °C.

TYPICAL APPLICATIONS

10 F

VIN

+ ++

IIN

CIN0.1 F

CL

VOUT

IOUT

4.7 µF

VIN

+

+

IN

1 µF

VOOUT

VOUT

IQ R

VO = VOUT + IQ X R

GND

GND

4.7 µF

VIN

+ +

IN

10 µF

VOUT

OUT

100


TK116xxU

0.48 max 0.53 max 0.48 max

1.5 1.5

3.0e'

4.5

1.8 max

0.4

2.5

0.8

max

4.25

max

1 2 3

ee

Product Code

Marking

+ 0.1

+ 0

.1

0.44 max

0.44 max

1.5

1.0 1.0 1.0

3.0

0.7

1.5

1.51.5

45 °


2.0

e e


+ 0

.1

Marking InformationProduct Code A

Voltage CodeTK11630U 30TK11633U 33TK11650U 50TK11690U 90

SOT-89 (SOT-89-3)

PACKAGE OUTLINE




IC-115-TK116U0798O0.0K








TK11900

VIN VOUT

THERMALPROTECTION

BANDGAPREFERENCE

CONTROL

GND

SHUTDOWN

NOISEBYPASS

FEEDBACK

CONTROL

NOISEBYPASS

VOUT

VIN

FEEDBACK

GND

FEATURES Low Supply Current

Low Power Shutdown Mode

Low Noise Output

Low Dropout Voltage

Extremely High Stability

High Speed On/Off Transient (50 µs typ.)

Miniature Package (SOT-23L)

BLOCK DIAGRAM

TK11900

DESCRIPTION

The TK11900 is a low dropout voltage regulator withexternal voltage adjustment. The output can be set between1.5 V and 15 V by an external pair of resistors in a dividerconfiguration. The device has a bypass pin for an externalcapacitor to reduce output noise to a typical 50 µV(rms). Inaddition, a control pin is provided that is active low (a lowlevel turns on the output). In the “off” mode (control pinhigh) the device draws only 65 µA of quiescent current.

The TK11900 is available in a miniature SOT-23L surfacemount package.

APPLICATIONS Portable Instrumentation

Cordless Telephones

Pagers

Toys

Cellular Telephones

Test Equipment



Tape/Reel Code

TK11900M

Temperature Code

TEMP. CODE (OPTIONAL)I: -40 to +85 C

01S

ADJUSTABLE LOW DROPOUT REGULATOR


TK11900


IQ tnerruCtnecseiuQV NI V= )PYT(TUO I,V1+ TUO Am0= 041 003 Aµ

V NI V= )PYT(TUO I,V1- TUO Am0= 083 009 Aµ

I YBTS tnerruCybdnatS FFOtuptuO 56 041 Aµ

V TUO egatloVtuptuO )2etoN( 5.1 51 V

V PORD egatloVtuoporD I TUO Am03= 061 053 Vm

I TUO tnerruCtuptuO 001 Am

geReniL noitalugeReniL V )PYT(TUO V1+ ≤ V NI ≤ V )PYT(TUO V01+ 5 05 Vm

geRdaoL noitalugeRdaoL Am1 ≤ I TUO ≤ Am08 02 001 Vm

∆V TUO /∆T tneiciffeoCerutarepmeT V NI V= )PYT(TUO V1- 51.0± C°/Vm

RR noitcejeRelppiR CL zH004=f,Fµ01= 86 Bd


CN Fµ10.0=05 smrVµ

V fer egatloVecnerefeRTA C°52= 522.1 052.1 572.1 V

TA C°08ot03-= 012.1 052.1 092.1 V


I TNOC tnerruClanimreTlortnoCV TNOC V5= 52 001 Aµ

V TNOC V61= 54 051 Aµ

V )NO(TNOC )NO(egatloVlortnoC NOtuptuO 6.0 V

V )FFO(TNOC )FFO(egatloVlortnoC FFOtuptuO 2.2 V

TR emiTesiRtuptuO )NOotFFO(I TUO C,Am03= L ,Fµ1.0=CN Fµ1.0=

05 sµ

ABSOLUTE MAXIMUM RATINGSOperating Temperature Range ................... -30 to +80 °CExtended Temperature Range ................... -40 to +85 °CJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C

TK11900M ELECTRICAL CHARACTERISTICSTest conditions: VIN = VOUT(TYP) + 1 V, TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 400 mW when mounted as recommended. Derate at 3.2 mW/°C for operation above 25°C.Note 2: The output voltage can be set from 1.5 to 15 V by two external resistors. “Refer to Definition of Terms.”

Supply Voltage ......................................................... 17 VOperating Voltage Range............................... 1.8 to 16 VPower Dissipation (Note 1) ................................ 400 mWStorage Temperature Range ................... -55 to +150 °C


TK11900


IQ tnerruCtnecseiuQV NI V= )PYT(TUO I,V1+ TUO Am0= 041 053 Aµ

V NI V= )PYT(TUO I,V1- TUO Am0= 083 059 Aµ


V TUO egatloVtuptuO TA )1etoN(,C°52= 5.1 51 V



geReniL noitalugeReniL V )PYT(TUO V1+ ≤ V NI ≤ V )PYT(TUO V01+ 5± 05± Vm

geRdaoL noitalugeRdaoL Am1 ≤ I TUO ≤ Am08 02 001 Vm

∆V fer /∆T tneiciffeoCerutarepmeT 50.0± C°/Vm

RR noitcejeRelppiR CL zH004=f,Fµ01= 86 Bd



V fer egatloVecnerefeRTA C°52= 522.1 052.1 572.1 V

TA C°58ot04-= 002.1 052.1 003.1 V



V TNOC V61= 54 051 Aµ




05 sµ

TK11900MI ELECTRICAL CHARACTERISTICSTest conditions: VIN = VOUT(TYP) + 1 V, TA = -40 to 85 °C, unless otherwise specified.

Note 1: The output voltage can be set from 1.5 to 15 V by two external resistors. Refer to “Definition of Terms.”


TK11900

TYPICAL PERFORMANCE CHARACTERISTICSVOUT = 5 V, TA = 25 °C, unless otherwise specified.

TEST CIRCUIT

IOUT

CONT

NOISE BYPASS

VCONT

VIN

VOUT

+

FEEDBACK

R1

R2

CL10 µF

+

1 µF

CN0.01 µF

ICONT

IIN

Note: CL is a tantalum capacitor

VO

UT

(V

)

5.1


IOUT (mA)

0 50 1004.9

5.0

VO

UT

(V

)

5.1

OUTPUT VOLTAGE VS.INPUT VOLTAGE

VIN (V)

0 10 20

4.8

5.0

4.9

4.7

4.6

I Q (

mA

)

500


VIN (V)

0 10 200

250

VO

UT

(V

)

5.5

OUTPUT VOLTAGE CHARACTERISTICSVS. INPUT VOLTAGE

VIN (V)

4.5 5.0 5.54.5

5.0

IOUT = 0 mA

30 mA

60 mA

Vre

f (V

)

REFERENCE VOLTAGE(FEEDBACK PIN) VS. TEMPERATURE

TA (°C)

-50 0 50 100

1.26

1.23

1.24

1.25

1.27

1.28

I GN

D (

mA

)

10


IOUT (mA)

0 50 1000

5

Note: VOUT = 1.25 [(R1 + R2) / R2] 10 k ≤ R2 ≤ 60 k Connect Pin 5 to ground


TK11900

I IN (

µA

)

200

INPUT CURRENT AND CONTROLCURRENT VS. CONTROL VOLTAGE

VCONT (V)

0 2.5 5.00

100 SHUTDOWN POINT

IIN

ICONT

I CO

NT

(µ

A)

100

50

0

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

NO

ISE

(µ

V)

300

NOISE VS. BYPASSCAPACITOR VALUE

CN

1 pF 10 pF 100 pF1000 pF 0.01 µF0.1 µF0

100

200

150

50

NO

ISE

(dB

)

-50NOISE VS. SPECTRUM

f (Hz)

0 500 k 1 M-150

-100

IOUT = 25 mACL = 0.1 µFCN = 0.1 µF

CL = 3.3 µFCN = 0.1 µF

SPECTRUM ANALYZER BACKGROUND NOISE


VIN 7 V

6 V

VO

UT

TIME (50 µs/DIV)

VO

UT

(20

mV

/ D

IV)


I OU

T

50 mA

0 mA

VO

UT

TIME (50 µs/DIV)

VO

UT

(10

0 m

V /

DIV

)

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)VOUT = 5 V, TA = 25 °C, unless otherwise specified.

VO

UT

(V

)

5


IOUT (mA)

0 100 2000

3

4

2

1

RR

(dB

)

0

RIPPLE REJECTION VS.FREQUENCY

f (Hz)

10 100 1 k 10 k 100 k-100

-50

CL = 0.1 µF

CL = 10 µF

11900

CL10 F

VOUTVIN

0.1 F

RIPPLE REJECTION CIRCUIT

CN0.01 F

SW


TK11900

TURN-ON TIME VS. OUTPUTCAPACITOR

1 µF

TIME (50 µs/DIV)

VO

UT

(1

V /

DIV

)

CL = .1 µF

4.7 µF

15 µF

10 µF

2.4 V

0 V

VC

ON

TV

OU

T I GN

D (

mA

)

GROUND CURRENT (ON MODE)VS. TEMPERATURE

TA (°C)

-50 0 50 100

5

0

10

IOUT = 60 mA

IOUT = 30 mA

I ST

BY

(µA

)

STANDBY CURRENT (OFF MODE) VS. TEMPERATURE

TA (°C)

-50 0 50 100

50

0

100

I CO

NT

(µA

)

CONTROL CURRENTVS. TEMPERATURE

TA (°C)

-50 0 50 1000

50

VCONT = 5 V

40

30

20

10 VCONT = 2.5 V

VC

ON

T (

V)

CONTROL VOLTAGE (OFF POINT)VS. TEMPERATURE

TA (°C)

-50 0 50 1000

2.0

1.0

VD

RO

P (

mV

)

DROPOUT VOLTAGEVS. TEMPERATURE

TA (°C)

-50 0 50 1000

500

IOUT = 30 mA

400

300

200

100

IOUT = 60 mA

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)VOUT = 5 V, TA = 25 °C, unless otherwise specified.


TK11900


This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. Whenthe junction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23L is increased to 400 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23L device should be derated at 3.2 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C / PD

PD is the value when the thermal sensor is activated. Asimple way to determine PD is to calculate VIN x IIN whenthe output side is shorted. Input current gradually falls astemperature rises. You should use the value when thermalequilibrium is reached.



The quiescent current is the current which flows throughthe ground terminal under no load (IOUT = 0 mA).


Ground current is the current which flows through thecurrent pin(s). It is defined as IIN - IOUT, excluding controlcurrent.

LINE REGULATION (LINE REG)

Line regulation is the relationship between change inoutput voltage due to a change in input voltage.

LOAD REGULATION (LOAD REG)

Load regulation is the relationship between change inoutput voltage due to a change in load current.

DROP OUT VOLTAGE (VDROP)

This is a measure of how well the regulator performs as theinput voltage decreases. The smaller the number, thefurther the input voltage can decrease before regulationproblems occur. Nominal output voltage is first measuredwhen VIN = VOUT(TYP) + 1 at a chosen load current. Whenthe output voltage has dropped 100 mV from the nominal,VIN - VOUT is the dropout voltage. This voltage is affectedby load current and junction temperature.



THERMAL PROTECTION



TK11900


SOT-23L POWER DISSIPATION


Procedure:







PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100TA (°C)

PD

(m

W)

1500

300

500

100

200

400 MOUNTED

FREE AIR


TK11900

BOARD LAYOUT

Copper pattern should be as large as possible. Powerdissipation is 400 mW for the SOT-23L package. A lowEquivalent Series Resistance (ESR) capacitor isrecommended. For low temperature operation, select acapacitor with a low ESR at the lowest operatingtemperature to prevent oscillation, degradation of ripplerejection and increase in noise. The minimumrecommended capacitance is 2.2 µF.



Voltage regulators require input and output decouplingcapacitors. The required values of these capacitors varywith application. Capacitors made by differentmanufacturers can have different characteristics,particularly with regard to high frequencies and ESR overtemperature. The type of capacitor is also important. Forexample, a 4.7 µF aluminum electrolytic may be requiredfor a certain application. If a tantalum capacitor is used, alower value of 2.2 µF would be adequate. It is important toconsider the temperature characteristics of the decouplingcapacitors. While Toko regulators are designed to operateas low as -30 °C, many capacitors will not operate properlyat this temperature. The capacitance of aluminumelectrolytic capacitors may decrease to 0 at lowtemperatures. This may cause oscillation on the output ofthe regulator since some capacitance is required toguarantee stability. Thus, it is important to consider the

GND

VIN VOUT

CONTROL

NOISE BYPASS

++

GND

FEEDBACK

characteristics of the capacitor over temperature whenselecting decoupling capacitors.

The ESR is another important parameter. The ESR willincrease with temperature but low ESR capacitors areoften larger and more costly. In general, tantalum capacitorsoffer lower ESR than aluminum electrolytic, but new lowESR aluminum electrolytic capacitors are now availablefrom several manufacturers. Usually a bench test issufficient to determine the minimum capacitance requiredfor a particular application. After taking thermalcharacteristics and tolerance into account, the minimumcapacitance value should capacitor or 3.3 µF for analuminum electrolytic. Please note that linear regulatorswith a low dropout voltage have high internal loop gainswhich require care in guarding against oscillation causedby insufficient decoupling capacitance. The use of highquality decoupling capacitors suited for your applicationwill guarantee proper operation of the circuit.

NOISE BYPASS CAPACITOR SECTION

The noise bypass capacitor (CN) should be connected asclose as possible to pin 1 and ground. The recommendedvalue for CN is 0.01 µF. The noise bypass terminal has ahigh impedance and care should be taken if the noisebypass capacitor is not used. This terminal is susceptibleto external noise, and oscillation can occur when CN is notused and the solder pad for this pin is too large.

OUTPUT VOLTAGE SETTING

The output voltage can be set from 1.5 to 15 V by twoexternal resistors according to the following equation:

VOUT = 1.25 V x [(R1 + R2) / R2]

where 10 kΩ ≤ R2 ≤ 60 k


VOUT

R2

R1

FEEDBACK


TK11900

APPLICATION INFORMATION (CONT.)

CURRENT BOOST

The output current can be increased by connecting an external NPN transistor as shown above.

The output current capability depends on the Hfe of the external transistor.

Note: The TK11900 internal short circuit protection and the thermal sensor do not protect the external transistor.

CONT

NOISE BYPASS

VIN VOUT

FEEDBACK

R1

R2

CL10 µF

+

1 µF

CN0.1 µF

CONTROL

RE

Note: VOUT = 1.25 [(R1 + R2) / R2] 10 k ≤ R2 ≤ 60 k


TK11900

0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1

Marking Information

MarkingTK11900 G0

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-118-TK119000798O0.0K








TK119xx

VIN VOUT

THERMALPROTECTION

BANDGAPREFERENCE

CONTROL

GND

SHUTDOWN

NOISEBYPASS

RESETOUTPUTERROR

DETECTION

FEATURES Very Low Dropout Voltage Reset Output for Microprocessor Very Low Quiescent Current (No Load) Internal Thermal/Overload Shutdown Low Noise Voltage Input and Output Voltage Sense ± 2.5 % Output Voltage Accuracy CMOS or TTL On/Off Control High Speed On/Off Transient (50 µs typ.)

BLOCK DIAGRAM

TK119xx

DESCRIPTION

The TK119xx series are low power, linear regulators withbuilt-in electronic switches. Built-in voltage comparatorsprovide a reset logic ”low” level whenever the input oroutput voltage falls outside internally preset limits. Theinternal electronic switch can be controlled by CMOS orTLL levels. The device is in the “off” state when the controlpin is biased “high”.

An internal PNP pass-transistor is used in order to achievelow dropout voltage (typically 200 mV at 50 mA loadcurrent). The device has very low quiescent current(130 µA) in the “on” mode with no load and 2 mA with 30mA load. The quiescent current is typically 4 mA at 60 mAload. The current consumption in the “off” mode is 65 µA.An internal thermal shutdown circuit limits the junctiontemperature to below 150 oC. The load current is internallymonitored and the device will shut down (no load current)in the presence of a short circuit at the output. The outputnoise is very low at 100 dB down from VOUT when anexternal noise bypass capacitor is used. The TK119xx isavailable in a miniature SOT-23L surface mount package.

FEATURES Battery Powered Systems Cellular Telephones Pagers Personal Communications Equipment Portable Instrumentation Portable Consumer Equipment Radio Control Systems Toys Low Voltage Systems



Tape/Reel Code

TK119 M

Voltage Code

VOLTAGE CODE22 = 2.25 V 35 = 2.5 V27 = 2.75 V 40 = 4.0 V30 = 3.00 V 48 = 4.8 V32 = 3.25 V 50 = 5.0 V

CONTROL

NOISEBYPASS

VOUT

VIN

RESETOUTPUT

GND01S

VOLTAGE REGULATOR WITH RESET OUTPUT


TK119xx


IQ tnerruCtnecseiuQI TUO Am0= 041 003 Aµ

V NI I,V52.1= TUO Am0= 083 009 Aµ

I DNG tnerruCdnuorG I TUO Am06= 5.2 01 Am


V TUO egatloVtuptuOI TUO T,Am1= A C°52= 71.2 52.2 33.2 V

I TUO 03-,Am1= ≤ TA ≤ C°08 31.2 52.2 73.2 V



geReniL noitalugeReniL V NI V52.21ot52.3= 5 05 Vm

geRdaoL noitalugeRdaoL I TUO Am08ot1= 02 001 Vm

∆V TUO /∆T tneiciffeoCerutarepmeT 2.0± C°/Vm

RR noitcejeRelppiR C,zH004=f L Fµ01= 86 Bd



V TED dlohserhTrotceteDegatloVwoL V TUO 59.0x V

V )RRE(TED

dlohserhTrotceteDegatloVecnareloT

4- V TED 4+ %

V TESER egatloVnoitarutaS I GALF Aµ001= 2.0 4.0 V



V TNOC V61= 54 051 Aµ




05 sµ

ABSOLUTE MAXIMUM RATINGSOperating Temperature Range ................... -30 to +80 °CJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C

TK11922 ELECTRICAL CHARACTERISTICSTest conditions: VIN = 3.25 V, CL = 10 µF, CN = 0.01 µF, TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 400 mW when mounted as recommended. Derate at 3.2 mW/°C for operation above 25°C.

Supply Voltage ......................................................... 17 VOperating Voltage Range............................... 1.8 to 16 VPower Dissipation (Note 1) ................................ 400 mWStorage Temperature Range ................... -55 to +150 °C


TK119xx




V NI I,V57.1= TUO Am0= 083 009 Aµ




I TUO 03-,Am1= ≤ TA ≤ C°08 36.2 57.2 78.2 V










V )RRE(TED


4- V TED 4+ %




V TNOC V61= 54 051 Aµ




05 sµ


TK119xx




V NI I,V0.2= TUO Am0= 083 009 Aµ




I TUO 03-,Am1= ≤ TA ≤ C°08 88.2 0.3 21.3 V










V )RRE(TED


4- V TED 4+ %




V TNOC V61= 54 051 Aµ




05 sµ


TK119xx




V NI I,V52.2= TUO Am0= 083 009 Aµ




I TUO 03-,Am1= ≤ TA ≤ C°08 31.3 52.3 73.3 V










V )RRE(TED


4- V TED 4+ %




V TNOC V61= 54 051 Aµ




05 sµ


TK119xx




V NI I,V5.2= TUO Am0= 083 009 Aµ




I TUO 03-,Am1= ≤ TA ≤ C°08 73.3 05.3 36.3 V










V )RRE(TED


4- V TED 4+ %




V TNOC V61= 54 051 Aµ




05 sµ


TK119xx




V NI I,V0.3= TUO Am0= 083 009 Aµ




I TUO 03-,Am1= ≤ TA ≤ C°08 68.3 00.4 41.4 V










V )RRE(TED


4- V TED 4+ %




V TNOC V61= 54 051 Aµ




05 sµ


TK119xx




V NI I,V8.3= TUO Am0= 083 009 Aµ




I TUO 03-,Am1= ≤ TA ≤ C°08 36.4 08.4 79.4 V










V )RRE(TED


4- V TED 4+ %




V TNOC V61= 54 051 Aµ




05 sµ


TK119xx




V NI I,V0.4= TUO Am0= 083 009 Aµ




I TUO 03-,Am1= ≤ TA ≤ C°08 528.4 000.5 571.5 V










V )RRE(TED


4- V TED 4+ %




V TNOC V61= 54 051 Aµ




05 sµ


TK119xx

TEST CIRCUIT

IOUT

CONT

NOISE BYPASS

VCONT

VIN

VOUT

+CL

10 µF

+

1 µF

CN0.01 µF

RESET OUTPUT

220 k

ICONT

+

VOUT+

+

TIMING DIAGRAMPRINCIPLE OF OPERATION

OUTPUT VOLTAGE 5 V

INPUT VOLTAGE

RESET OUTPUT

~5 V ~5 V

NOTVALID

NOTVALID

GLITCH

GLITCH

t


TK119xx


I GN

D (

mA

)

10


IOUT (mA)

0 50 1000

5

I IN (

µA

)

200

INPUT CURRENT AND CONTROLCURRENT VS. CONTROL VOLTAGE

VCONT (V)

0 2.5 5.00

100 SHUTDOWN POINT

IIN

ICONT

I CO

NT

(µ

A)

100

50

0

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VS

AT

(m

V)

250

SATURATION VOLTAGE VS.RESET OUTPUT CURRENT

IFLAG (mA)

0 0.5 1.00

100

200

150

50

2 V

3 V

VIN = 1 V

6 V

5 V

VO

UT

(V

)

5


IOUT (mA)

0 100 2000

3

4

2

1


VIN 7 V

6 V

VO

UT

TIME (50 µs/DIV)

VO

UT

(20

mV

/ D

IV)


I OU

T

50 mA

0 mA

VO

UT

TIME (50 µs/DIV)

VO

UT

(10

0 m

V /

DIV

)

TURN-ON TIME VS. OUTPUTCAPACITOR

1 µF

TIME (50 µs/DIV)

VO

UT

(1

V /

DIV

)

CL = .1 µF

4.7 µF

15 µF

10 µF

2.4 V

0 V

VC

ON

TV

OU

T

IOUT = 30 mA

NO

ISE

(dB

)

-50

NOISE LEVEL VS.FREQUENCY (TK11950)

f (Hz)

0 500 k 1 M

-100

IOUT = 25 mACL = 0.1 µFCN = 0.1 µF

CL = 3.3 µFCN = 0.1 µF


TK119xx


NO

ISE

(µ

Vrm

s)

300

NOISE VS. BYPASSCAPACITOR VALUE

CN

1 pF 10 pF 100 pF1000 pF 0.01 µF0.1 µF0

100

200

150

50

I GN

D (

mA

)

GROUND CURRENT (ON MODE)VS. TEMPERATURE

TA (°C)

-50 0 50 100

5

0

10

IOUT = 60 mA

IOUT = 30 mA

I ST

BY

(µA

)

STANDBY CURRENT (OFF MODE) VS. TEMPERATURE

TA (°C)

-50 0 50 100

50

0

100

I CO

NT

(µA

)

CONTROL CURRENTVS. TEMPERATURE

TA (°C)

-50 0 50 1000

50

VCONT = 5 V

40

30

20

10 VCONT = 2.5 V

VC

ON

T (

V)

CONTROL VOLTAGE (OFF POINT)VS. TEMPERATURE

TA (°C)

-50 0 50 1000

2.0

1.0

VD

ET

(V

)

VOLTAGE DETECTORVS. TEMPERATURE

TA (°C)

-50 0 50 1004.65

4.85

4.75

VD

RO

P (

mV

)

DROPOUT VOLTAGEVS. TEMPERATURE

TA (°C)

-50 0 50 1000

500

IOUT = 30 mA

400

300

200

100

IOUT = 60 mA

RR

(dB

)

0

RIPPLE REJECTION VS.FREQUENCY

f (Hz)

100 1 k 10 k 100 k-100

-50

CL = 0.1 µF

CL = 10 µF

119xx

CL10 F

VOUTVIN

0.1 F


CN0.01 F

SW+


TK119xx


VO

UT

(V

)

2.45


IOUT (mA)

0 50 100

2.05

2.25

VD

ET

(V

)

5.0

LOW VOLTAGE DETECTOR VS.INPUT VOLTAGE

VIN (V)

0 2.5 5.00

2.5

VOUT

VO

UT

(V

)

VO

UT

(V

)

2.35


VIN (V)

0 10 201.85

2.05

2.25

2.15

1.95

I Q (

mA

)

500


VIN (V)

0 10 200

250

VO

UT

(V

)

2.75


VIN (V)

1.75 2.25 3.751.75

2.25IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

2.25

OUTPUT VOLTAGE VS.AMBIENT TEMPERATURE

TA (°C)

-50 0 50 1002.15

2.20

VO

UT

(V

)

2.95


IOUT (mA)

0 50 100

2.55

2.75

VD

ET

(V

)

5.0


VIN (V)

0 2.5 5.00

2.5

VOUT

VO

UT

(V

)

VO

UT

(V

)

2.85


VIN (V)

0 10 202.35

2.55

2.75

2.65

2.45

TK11922

TK11927


TK119xx


I Q (

mA

)

500


VIN (V)

0 10 200

250V

OU

T (

V)

3.25


VIN (V)

2.25 2.75 3.252.25

2.75IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

2.80


TA (°C)

-50 0 50 1002.70

2.75

VO

UT

(V

)

3.45


IOUT (mA)

0 50 100

3.05

3.25

VO

UT

(V

)

3.35


VIN (V)

0 10 202.85

3.05

3.25

3.15

2.95

VD

ET

(V

)

5.0


VIN (V)

0 2.5 5.00

2.5

VOUT

VO

UT

(V

)

I Q (

mA

)

500


VIN (V)

0 10 200

250

VO

UT

(V

)

3.75


VIN (V)

2.75 3.25 3 .752.75

3.25IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

3.30


TA (°C)

-50 0 50 1003.20

3.25

TK11927 (CONT.)

TK11930


TK119xx

VO

UT

(V

)

3.45


IOUT (mA)

0 50 100

3.05

3.25V

OU

T (

V)

3.35


VIN (V)

0 10 202.85

3.05

3.25

3.15

2.95

VD

ET

(V

)

5.0


VIN (V)

0 2.5 5.00

2.5

VOUT

VO

UT

(V

)

I Q (

mA

)

500


VIN (V)

0 10 200

250

VO

UT

(V

)

3.75


VIN (V)

2.75 3.25 3 .752.75

3.25IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

3.30


TA (°C)

-50 0 50 1003.20

3.25

TK11932


TK11935

VO

UT

(V

)

3.7


IOUT (mA)

0 50 100

3.3

3.5

VD

ET

(V

)

5.0


VIN (V)

0 2.5 5.00

2.5

VOUT

VO

UT

(V

)

VO

UT

(V

)

3.6


VIN (V)

0 10 203.1

3.3

3.5

3.4

3.2


TK119xx

I Q (

mA

)

500


VIN (V)

0 10 200

250

VO

UT

(V

)

4.5


VIN (V)

3.5 4.0 4.53.5

4.0IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

4.05


TA (°C)

-50 0 50 1003.95

4.00


I Q (

mA

)

500


VIN (V)

0 10 200

250V

OU

T (

V)

4.0


VIN (V)

3.0 3.5 4.03.0

3.5IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

3.55


TA (°C)

-50 0 50 1003.45

3.50

TK11935 (CONT.)

VO

UT

(V

)

4.2


IOUT (mA)

0 50 100

3.8

4.0

VD

ET

(V

)

5.0


VIN (V)

0 2.5 5.00

2.5

VOUT

VO

UT

(V

)

VO

UT

(V

)

4.1


VIN (V)

0 10 203.6

3.8

4.0

3.9

3.7

TK11940


TK119xx


VO

UT

(V

)

5.0


IOUT (mA)

0 50 100

4.6

4.8

VD

ET

(V

)

5.0


VIN (V)

0 2.5 5.00

2.5 VOUT

VO

UT

(V

)

VO

UT

(V

)

4.9


VIN (V)

0 10 204.4

4.6

4.8

4.7

4.5

I Q (

mA

)

500


VIN (V)

0 10 200

250

VO

UT

(V

)

5.3


VIN (V)

4.3 4.8 5.34.3

4.8IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

4.85


TA (°C)

-50 0 50 1004.75

4.80

TK11948

TK11950

VO

UT

(V

)

5.2


IOUT (mA)

0 50 100

4.8

5.0

VD

ET

(V

)

5.0


VIN (V)

0 2.5 5.00

2.5 VOUT

VO

UT

(V

)

VO

UT

(V

)

5.1


VIN (V)

0 10 204.6

4.8

5.0

4.9

4.7


TK119xx


I Q (

mA

)

500


VIN (V)

0 10 200

250V

OU

T (

V)

5.5


VIN (V)

4.5 5.0 5.54.5

5.0IOUT = 0 mA

60 mA

30 mA

VO

UT

(V

)

5.05


TA (°C)

-50 0 50 1004.95

5.00

TK11950 (CONT.)


TK119xx


This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. Whenthe junction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23L is increased to 400 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23L device should be derated at 3.2 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C/ PD








Line regulation is the relationship between change inoutput voltage due to a change in input voltage.


Load regulation is the relationship between change inoutput voltage due to a change in load current.


This is a measure of how well the regulator performs as theinput voltage decreases. The smaller the number, thefurther the input voltage can decrease before regulationproblems occur. Nominal output voltage is first measuredwhen VIN = VOUT(TYP) + 1 at a chosen load current. Whenthe output voltage has dropped 100 mV from the nominal,VIN - VOUT is the dropout voltage. This voltage is affectedby load current and junction temperature.



THERMAL PROTECTION



TK119xx


SOT-23L POWER DISSIPATION


Procedure:







PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100TA (°C)

PD

(m

W)

1500

300

500

100

200

400 MOUNTED

FREE AIR


TK119xx

VMAX

VMIN

RMAX

RMIN


NOISE BYPASS CAPACITOR SECTION

The noise bypass capacitor (CN) should be connected asclose as possible to pin 1 and ground. The recommendedvalue for CN is 0.01 µF. The noise bypass terminal has ahigh impedance and care should be taken if the noisebypass capacitor is not used. This terminal is susceptibleto external noise, and oscillation can occur when CN is notused and the solder pad for this pin is too large.

RESET OUTPUT CONSIDERATIONS

It is important to note the accuracy of the regulator andvoltage detector functions when they are combined withinone IC. The figure below illustrates the voltage regulatorand voltage detector implemented with individual referencevoltages.

NON-TOKO APPROACH


Voltage regulators require input and output decouplingcapacitors. The required values of these capacitors varywith application. Capacitors made by differentmanufacturers can have different characteristics,particularly with regard to high frequencies and EquivalentSeries Resistance (ESR) over temperature. The type ofcapacitor is also important. For example, a 4.7 µF aluminumelectrolytic may be required for a certain application. If atantalum capacitor is used, a lower value of 2.2 µF wouldbe adequate. It is important to consider the temperaturecharacteristics of the decoupling capacitors. While Tokoregulators are designed to operate as low as -30 °C, manycapacitors will not operate properly at this temperature.The capacitance of aluminum electrolytic capacitors maydecrease to 0 at low temperatures. This may causeoscillation on the output of the regulator since somecapacitance is required to guarantee stability. Thus, it isimportant to consider the characteristics of the capacitorover temperature when selecting decoupling capacitors.

The ESR is another important parameter. The ESR willincrease with temperature but low ESR capacitors areoften larger and more costly. In general, tantalum capacitorsoffer lower ESR than aluminum electrolytic, but new lowESR aluminum electrolytic capacitors are now availablefrom several manufacturers. Usually a bench test issufficient to determine the minimum capacitance requiredfor a particular application. After taking thermalcharacteristics and tolerance into account, the minimumcapacitance value should be approximately two times thevalue. The recommended minimum capacitance for theTK119xx is 2.2 µF for a tantalum capacitor or 3.3 µF for analuminum electrolytic. Please note that linear regulatorswith a low dropout voltage have high internal loop gainswhich require care in guarding against oscillation causedby insufficient decoupling capacitance. The use of highquality decoupling capacitors suited for your applicationwill guarantee proper operation of the circuit.

BOARD LAYOUT

Copper pattern should be as large as possible. Powerdissipation is 400 mW for the SOT-23L package. A lowESR capacitor is recommended. For low temperatureoperation, select a capacitor with a low ESR at the lowestoperating temperature to prevent oscillation, degradationof ripple rejection and increase in noise. The minimumrecommended capacitance is 2.2 µF.

GND

VIN VOUT

CONTROL

RESET

++

GND



TK119xx

VMAX

VMIN

RMAX

RMIN

Note: VMIN - RMAX ≤ 0 is possible, meaning the two rangesmay overlap.

The figure below illustrates the TK119xx. The TK119xxutilizes the same reference voltage for both the voltageregulator and the voltage detector functions. As a result,the detector voltage is always constant (VOUT x 0.95 %)from the output voltage. With this approach, the tworanges do not overlap.

TOKO APPROACH


HANDLING MOLDED RESIN PACKAGES

All plastic molded packages absorb some moisture fromthe air. If moisture absorption occurs prior to soldering thedevice into the printed circuit board, increased separationof the lead from the plastic molding may occur, degradingthe moisture barrier characteristics of the device. Thisproperty of plastic molding compounds should not beoverlooked, particularly in the case of very small packages,where the plastic is very thin.

In order to preserve the original moisture barrier propertiesof the package, devices are stored and shipped in moistureproof bags filled with dry air. The bags should not beopened or damaged prior to the actual use of the devices.If this is unavoidable, the devices should be stored in a lowrelative humidity environment (40 to 65%) or in an enclosedenvironment with desiccant.

CONTROL FUNCTION UTILIZED

TYPICAL APPLICATIONS

RESET OUTPUT

VIN

1 µF

CN0.01 µF

+

LOW = ON

CMOS ORTTL GATE

RRESET

4.7 µF+

VOUT

RESET OUTPUT

VIN

1 µF

CN0.01 µF

+

RRESET

+4.7 µF

VOUT

VIN

1 µF

CN0.01 µF

+

RESETSW

4.7 µF

+

VOUT

Note: Parallel connectionof control pins is allowedif all devices use identicalinput voltages.

39 K ≤ RRESET ≤ 220 KChoose for correct HighLogic level.

CONTROL FUNCTION NOT UTILIZED

LOW VOLTAGE SHUTDOWN


TK119xx

0.95 0.95

0.32

e eM0.1

(3.4)

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

0.4M0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.15- 0.05

+ 0.3



5 PL

3.5+0.3- 0.1

+0.

15-

0.05

Marking Information

MarkingTK11922 G22TK11927 G27TK11930 G30TK11932 G3TK11935 G35TK11940 G40TK11948 G4TK11950 G5

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-119-TK119xx0798O0.0K








TK70403

GND

VOUT

CONTROL

NOISEBYPASS

VIN

GND

DESCRIPTION

TK70403 is a low dropout, linear regulator with a built-inelectronic switch. A pin for a bypass capacitor is provided,which connects to the internal circuitry to lower the overalloutput noise level.

An internal PNP pass-transistor is used in order to achievelow dropout voltage (typically 30 mV at 2 mA load current).This makes it possible to maintain a stable output voltageas the battery voltage decreases, extending the usefulbattery life.

The TK70403 is available in a miniature SOT-26 surfacemount package.

APPLICATIONS Pagers

Personal Communication Equipment



Single Battery Cell Systems

FEATURES Low Input Voltage Operation (Single Battery Cell)

Internal PNP Transistor

Internal Shutdown Control (Off Current, 0.1 µA max)

Low Dropout Voltage [30 mV (typ.) at 2 mA]

Miniature Package (SOT-26)

Very Low Noise

BLOCK DIAGRAMORDERING INFORMATION

TAPE/REEL CODETB: Tape Left

Tape/Reel Code

TK70403MTB

NOISEBYPASS

VIN VOUT

BANDGAPREFERENCE

CONTROL

GND

TK70403

20P

1.03 V REGULATOR WITH ON/OFF SWITCH


TK70403

TK70403 ELECTRICAL CHARACTERISTICSTest Conditions: VIN = 1.4 V, TA = 25 °C, RCONT = 820 KΩ, unless otherwise specified.

ABSOLUTE MAXIMUM RATINGSSupply Voltage ........................................................... 6 VPower Dissipation (Note 1) ................................ 350 mWJunction Temperature ........................................... 150 °CStorage Temperature Range ................... -55 to +150 °C

Operating Temperature Range ................... -10 to +60 °COperating Voltage Range.............................. 0.9 to 5.0 VLead Soldering Temperature (10 s) ...................... 235 °C

Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25 °C.Note 2: IOUT when VOUT drops 0.4 V from VOUT(TYP).Gen Note: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used. Example: Ripple rejection is 48

dB at CL = 1 µF, CN = 0.1 µF, IOUT = 2 mA, f = 400 Hz.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.


I YBTS tnerruCybdnatS V NI FFOtuptuO,V4.1= 1.0 Aµ

V TUO egatloVtuptuO I TUO Am2= 89.0 30.1 560.1 V

V PORD egatloVtuoporD I TUO Am2= 60.0 V

I TUO tnerruCtuptuO )2etoN( 01 05 Am

IQ tnerruCtnecseiuQ I TUO IgnidulcxE,Am0= TNOC 051 Aµ

geReniL noitalugeReniL V NI V7.1ot34.1= 02 Vm

geRdaoL noitalugeRdaoL I TUO Am0.5ot1.0= 02 Vm

∆V TUO /∆T tneiciffeoCerutarepmeT I TUO Am2= 52.0 C°/Vm

V fer egatloVecnerefeR 4.0 V

R:SNOITACIFICEPSLANIMRETLORTNOC TNOC K028= ΩΩΩΩΩ

I TNOC tnerruClanimreTlortnoC V TNOC NOtuptuO,V0.1= 0.1 Aµ


V )FFO(TNOC )FFO(egatloVlortnoC FFOtuptuO 0 3.0 V


TK70403

IOUT

ICONT

CN0.1 µF

CONT

VCONT

1 µF

VIN

VIN

IIN

VOUT

NOISEBYPASS

VOUT 1 µF

RCONT820 kΩ

GND

GND


IOUT (mA)

VO

UT

(V

)

1.01

1.05

0 5 10

1.04

1.03

1.02


IOUT (mA)

VO

UT

(V

)

0.3

1.5

0 50 100

1.2

0.9

0.6

0

VIN = 1.1 V

1.4 V

1.2 V

1.6 V


VIN (V)

VO

UT

(V

)

0.92

1.08

0.8 1.0 1.2 1.4 1.6 1.8

1.04

1.00

0.96

IOUT = 0 mA

5.0 mA

7.5 mA

2.5 mA


IOUT (mA)

I GN

D (

mA

)

0.5

2.5

0 10 20 30 40 50

2.0

1.5

1.0

0


IOUT (mA)

VD

RO

P (

mV

)

20

100

0 2 4 6 8 10

80

60

40

0


IOUT (mA)

VD

RO

P (

mV

)

200

0 10 20 30 40 50

100

0


TEST CIRCUIT


TK70403

INPUT CURRENT VS. INPUTVOLTAGE (CONTROL ON)

VIN (V)

I IN (

µA

)

500

0 1 2

100

0

400

300

200TA = 25 °CTA = 60 °C

IOUT = 0 mA

INPUT CURRENT VS. INPUTVOLTAGE (CONTROL OFF)

VIN (V)

I IN (

pA)

200

0 1 2

100

0


TIME (50 µS/DIV)

VIN

VO

UT

1.5 V

1.4 V

CN = 0 µF

CN = 0.1 µFVO

UT

(10

mV

/ DIV

)

OUTPUT CURRENT VS.TEMPERATURE

TA (°C)

-20 0 20 40 60 80

I OU

T (

mA

)

60

50

40

30

CONTROL CURRENT VS.TEMPERATURE

TA (°C)

-20 0 20 40 60 80

I CO

NT

(µ

A)

2.0

1.5

1.0

0.5

0

IOUT = 2 mA

DROPOUT VOLTAGE VS.TEMPERATURE

TA (°C)

-20 0 20 40 60 80

VD

RO

P (

mV

)

40

30

20

10

0

IOUT = 2 mA


TK70403

CL1 F

VOUTVIN

CN0.1 FVCONT

RIPPLE REJECTION CIRUIT


TK70403

CONTROL VOLTAGE (ON) VS.TEMPERATURE

TA (°C)

-20 0 20 40 60 80

VC

ON

T(O

N)

(mV

)

1000

800

600

400

0

200

GROUND CURRENT VS.TEMPERATURE

TA (°C)

-20 0 20 40 60 80

I GN

D (

µA

)

300

250

200

150

0

100

50

IOUT = 10 mA

IOUT = 5 mA



TK70403



The output voltage is specified with VIN = VOUT(TYP) + 0.4and IOUT = 2 mA.


The dropout voltage is the difference between the inputvoltage and the output voltage, at which point the regulatorstarts to fall out of regulation. Below this value, the outputvoltage will fall as the input value is reduced. It is dependentupon the load current and the temperature.


The rated output current is specified under the conditionwhere the output voltage drops 0.4 V when the outputcurrent is loaded. The input voltage is set to VOUT + 0.4 V.


Line regulation is the ability of the regulator to maintain aconstant output voltage as the input voltage changes. Thevoltage is pulsed to minimize temperature effects.


Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It ispulsed to minimize temperature effects. The load regulationis specified to 0.1 mA to 5.0 mA.





RIPPLE REJECTION (RR)

Ripple rejection is the ability of the regulator to attenuatethe ripple content of the input voltage at the output. It isspecified with 50 mVp-p, 400 Hz, IOUT = 2 mA superimposedon the input voltage, where VIN = VOUT(TYP) + 0.4 V. Theripple rejection is the ratio of the output vs. input and isexpressed in dB.

ON/OFF CONTROL

High is “on” (referenced to ground). When the on/offfunction is not used, connect the control terminal to VIN.The control current can be reduced by inserting a seriesresistor (RCONT) between the control terminal and VIN.Changes in the on/off level, due to this connection, areshown below.

ON/OFF RESPONSE WITH CONTROL (SPEED)

The turn-on time depends upon the value of the outputcapacitor and the noise bypass capacitor. The turn-on timewill decrease with smaller value of either capacitor. Thegraph below shows the relationship between turn-on timeand load capacitance. However, when the capacitance issmall, load transient and line transient will worsen and thenoise will increase. CL = 0.68 µF, CN = 1000 pF will be thebest for fastest operation.

VCONT (V)

I CO

NT

(µ

A)

2

0 1 2

1

0

VOUT = 1 M

RCONT = 820 k

VOUT = 680 k

RISE TIME (µs)

CN

.1 µ

0 100 1000

.01 µ

0

CL = 2.2 µF

1000 pF

100 pF

10 pF

CL = 0.45 µF

CL = 4.7 µF

CL = 0.68 µF


TK70403V

CO

NT

TIME (µs)

VO

UT

0 50

CL = 0.47 µF

CL = 2.2 µFCL = 4.7 µF

CL = 0.68 µF


Although the architecture of the Toko regulators is designedto minimize semiconductor noise, further reduction can beachieved by increasing the size of the output capacitor. Amore effective solution would be to add a capacitor to thenoise bypass terminal. The value of the capacitor shouldbe at least 0.1 µF or higher (higher values provide greaternoise reduction). Although stable operation is possiblewithout the noise bypass capacitor, this terminal has a highimpedance and care should be taken to avoid a largecircuit area on the printed circuit board when the capacitoris not used. Please note that several parameters areaffected by the value of the capacitors and bench testingis recommended when deviating from standard values.

INPUT AND OUTPUT CAPACITORS

Toko regulators require an output capacitor in order tomaintain regulator loop stability. The capacitor value shouldbe at least 0.68 µF over actual ambient operatingtemperature.


This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. Whenthe junction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has good


thermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-26 is increased to 350 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-26 device should be derated at 2.8 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C/ PD



TK70403


Procedure:







0 50 100 150

TA (°C)

PD

(m

W)

0

250

450

50

150

350 MOUNTED ASSHOWN

FREE AIR


PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4



TK70403

++

VIN VOUTGND

CONTROL

SOT-26 BOARD LAYOUT

BOARD LAYOUT



TK70403

0.95 0.95

0.950.95e

M0.1

2.9

2.8

1.90

2.4

e

e1


1 2 3

46

1.0

0.7

0 ~

0.1

(0.6

)(0

.6)

1.4

max

(1.9)

e

e e

5

Marking

0.3+

0.15

0.1

+

0.3

1.1

0.1+

1.6

0-13

Dimensions are shown in millimetersTolerance: x.x = 0.2 mm (unless otherwise specified)

0.1

Marking Information

MarkingTK70403 03J

SOT-26 (SOT-23-6)

PACKAGE OUTLINE




IC-216-TK700010798O0.0K








TK711xx

VIN VOUT

THERMALPROTECTION

GND

BANDGAPREFERENCE



Cordless Telephones



Toys

Low Voltage Systems


Low Quiescent Current

Very Stable Output

Short Circuit Protected

Thermal Overload Protected

Standard TO-92 Package

TK711xx

BLOCK DIAGRAM

PIN 1. OUTPUT2. GROUND3. INPUT

1 2 3

DESCRIPTION

The TK711xx is a low dropout, linear regulator housed ina standard TO-92 package, rated at 500 mW. An internalPNP transistor is used to achieve a low dropout voltage of100 mV (typ.) at 30 mA load current. The TK711xx has alow quiescent current of 130 µA (typ.) at no load. The lowquiescent current and dropout voltage make this part idealfor battery powered applications.


TAPE/REEL CODENT: Tape Left

Tape/Reel Code

TK711

VoltageCode

VOLTAGE CODE20 = 2.0 V 35 = 3.5 V25 = 2.5 V 40 = 4.0 V30 = 3.0 V 45 = 4.5 V33 = 3.3 V 50 = 5.0 V

15

0

LOW DROPOUT REGULATOR


TK711xx

TK71120 ELECTRICAL CHARACTERISTICSTest Conditions: VIN = 3 V, TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 500 mW when mounted. Derate at 4 mW/°C for operation above 25 °C.

ABSOLUTE MAXIMUM RATINGSInput Voltage ............................................................ 15 VPower Dissipation (Note 1) ................................ 500 mWOperating Voltage Range............................... 1.4 to 14 VJunction Temperature ........................................... 150 °C

Storage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -20 to +75 °CLead Soldering Temperature (10 s) ...................... 235 °C



V NI I,V9.1= TUO Am0= 4.1 0.3 Am

V TUO egatloVtuptuOdetalugeR V NI I,V0.3= TUO Am01= 9.1 0.2 1.2 V


I TUO tnerruCtuptuO 001 061 Am

I DNG tnerruCdnuorG V NI I,V0.3= TUO Am03= 5.1 5.3 Am


geReniL noitalugeRdaoL I TUO Am06ot1= 02 04 Vm

RR noitcejeRelppiR CL I,zH004=f,Fµ3.3= TUO Am01= 36 Bd

∆V TUO /∆T erutarepmeT tneiciffeoC 51.0 C°/Vm


TK711xx

TK71125 ELECTRICAL CHARACTERISTICSTest Conditions: VIN = 3.5 V, TA = 25 °C, unless otherwise specified.



V NI I,V0.2= TUO Am0= 4.1 0.3 Am











V NI I,V5.2= TUO Am0= 4.1 0.3 Am











TK711xx




V NI I,V8.2= TUO Am0= 4.1 0.3 Am











V NI I,V0.3= TUO Am0= 4.1 0.3 Am











TK711xx




V NI I,V5.3= TUO Am0= 4.1 0.3 Am











V NI I,V0.4= TUO Am0= 4.1 0.3 Am











TK711xx



V NI I,V0.4= TUO Am0= 4.1 0.3 Am










Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.


TK711xx

TEST CIRCUIT

VIN VOUT

VOUTIOUT3.3 F

+ +0.1 F

GND

IN

VIN

VO

UT

(m

V)

50

OUTPUT VOLTAGE VS. INPUT VOLTAGE

VIN (V)

0 10 20-50

30

10

-10

-30

I GN

D (

mA

)

5

GROUND CURRENT VS. AMBIENT TEMPERATURE

TA (°C)

-50 0 50 1000

4

3

2

1

IOUT = 60 mA

IOUT = 30 mA

VD

RO

P (

mV

)

500

DROPOUT VOLTAGE VS. AMBIENT TEMPERATURE

TA (°C)

-50 0 50 1000

400

300

200

100

IOUT = 60 mA

IOUT = 30 mA

NO

ISE

(dB

)

-50NOISE SPECTRUM

FREQUENCY (kHz)

0 500 1000

-100

-150

IOUT = 30 mA

INSTRUMENT NOISE FLOOR

CL = 3.3 µF

RR

(dB

)

0

RIPPLE REJECTION VS. FREQUENCY

FREQUENCY (Hz)

100 1 k 10 k 100 k

-50

-100

CL = 1 µF

CL = 10 µF

VO

UT

LINE TRANSIENT RESPONSE

VIN

VO

UT

(20

mV

/ D

IV)

VOUT(TYP) + 2 V

TIME (50 µs / DIV)

VOUT(TYP) + 1 V

TYPICAL PERFORMANCE CHARACTERISTICSTA = 25 ° C, unless otherwise specified.


TK711xx

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)TA = 25 ° C, unless otherwise specified.

TK71120

VO

UT

LOAD TRANSIENT RESPONSE

I OU

T

VO

UT

(40

0 m

V /

DIV

)

IOUT = 30 mA

0 mA

CL = 3.3 µF

CL = 1.0 µF

TIME (50 µs / DIV)

I GN

D (

mA

)

10


IOUT (mA)

0 50 1000

8

6

4

2

VO

UT

(50

mV

/ D

IV)


VIN (100 mV / DIV)

IOUT = 0 mA30 mA

60 mA

VIN = VOUT

VOUT(TYP) + 1 V

VO

UT

(V

)

2.05


IOUT (mA)

0 50 1001.95

2.00

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mAI O

UT

(m

A)

150

OUTPUT CURRENT VS.AMBIENT TEMPERATURE

TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)

5SHORT CIRCUIT PROTECTION

IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

2.05


TA (°C)

-50 0 50 1001.95

2.00


TK711xx

VO

UT

(V

)

2.55


IOUT (mA)

0 50 1002.45

2.50I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

2.55


TA (°C)

-50 0 50 1002.45

2.50

VO

UT

(V

)

3.05


IOUT (mA)

0 50 1002.95

3.00

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

TK71125

TK71130



TK711xx


VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.05


TA (°C)

-50 0 50 1002.95

3.00

VO

UT

(V

)

3.35


IOUT (mA)

0 50 1003.25

3.30

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mAI O

UT

(m

A)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.35


TA (°C)

-50 0 50 1003.25

3.30

TK71130 (CONT.)

TK71133


TK711xx

VO

UT

(V

)

3.55


IOUT (mA)

0 50 1003.45

3.50I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.55


TA (°C)

-50 0 50 1003.45

3.50

VO

UT

(V

)

4.05


IOUT (mA)

0 50 1003.95

4.00

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100


TK71135

TK71140


TK711xx


VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

4.05


TA (°C)

-50 0 50 1003.95

4.00

VO

UT

(V

)

4.55


IOUT (mA)

0 50 1004.45

4.50

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

4.55


TA (°C)

-50 0 50 1004.45

4.50

TK71140 (CONT.)

TK71145


TK711xx

VO

UT

(V

)

5.05


IOUT (mA)

0 50 1004.95

5.00I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)

5

SHORT CIRCUIT PROTECTION

IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

5.05


TA (°C)

-50 0 50 1004.95

5.00

TK71150



TK711xx



Line regulation is the ability of the regulator to maintain aconstant output voltage as the input voltage changes.


Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It isa pulsed measurement to minimize temperature effects.The load regulation is specified an output current stepcondition of 1 mA to 60 mA.






This is a measure of how well the regulator performs as theinput voltage decreases. The smaller the number, thefurther the input voltage can decrease before regulationproblems occur. Nominal output voltage is first measuredwhen VIN = VOUT + 1 at a chosen load current. When theoutput voltage has dropped 100 mV from the nominal, VIN- VO is the dropout voltage. This voltage is affected by loadcurrent and junction temperature.



THERMAL PROTECTION



This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe mounting pad, the power dissipation of the TO-92 isincreased to 500 mW. For operation at ambienttemperatures over 25 °C, the power dissipation of the TO-92 device should be derated at 4.0 mW/°C. To determinethe power dissipation for shutdown when mounted, attachthe device on the actual PCB and deliberately increase theoutput current (or raise the input voltage) until the thermalprotection circuit is activated. Calculate the powerdissipation of the device by subtracting the output powerfrom the input power. These measurements should allowfor the ambient temperature of the PCB. The value obtainedfrom PD /(150 °C - TA) is the derating factor. The PCBmounting pad should provide maximum thermalconductivity in order to maintain low device temperatures.As a general rule, the lower the temperature, the better thereliability of the device. The thermal resistance whenmounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C / PD



TK711xx

TERMS AND DEFINITIONS (CONT.)


Procedure:








Voltage regulators require input and output decouplingcapacitors. The required value of these capacitors varywith application. Capacitors made by differentmanufacturers can have different characteristics,particularly with regard to high frequencies and EquivalentSeries Resistance (ESR) over temperature. The type ofcapacitor is also important. For example, a 4.7 µF aluminumelectrolytic may be required for a certain application. If atantalum capacitor is used, a lower value of 2.2 µF wouldbe adequate. It is important to consider the temperaturecharacteristics of the decoupling capacitors. While Tokoregulators are designed to operate as low as -40 °C, manycapacitors will not operate properly at this temperature.The capacitance of aluminum electrolytic capacitors maydecrease to 0 at low temperatures. This may causeoscillation on the output of the regulator since somecapacitance is required to guarantee stability. Thus, it isimportant to consider the characteristics of the capacitorover temperature when selecting decoupling capacitors.

The ESR is another important parameter. The ESR willincrease with temperature but low ESR capacitors areoften larger and more costly. In general, tantalum capacitorsoffer lower ESR than aluminum electrolytic, but new lowESR aluminum electrolytic capacitors are now availablefrom several manufacturers. Usually a bench test issufficient to determine the minimum capacitance requiredfor a particular application. After taking thermalcharacteristics and tolerance into account, the minimumcapacitance value should be approximately two times thisvalue. The recommended minimum capacitance for theTK711xxN is 2.1 µF for a tantalum capacitor or 3.3 µF foran aluminum electrolytic. Please note that linear regulatorswith a low dropout voltage have high internal loop gainswhich require care in guarding against oscillation causedby insufficient decoupling capacitance. The use of highquality decoupling capacitors suited for your applicationwill guarantee proper operation of the circuit. Pay attentionto temperature characteristics of the capacitor, especiallythe increase of ESR and decrease of capacitance in lowtemperatures. Oscillation, reduction of ripple rejection andincreased noise may occur in some cases if the propercapacitor is not used. An output capacitor more than 1.0 µFis required to maintain stability. The standard test conditionis 3.3 µF (TA = 25 °C).

PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100TA (°C)

PD

(m

W)

1500

600

1000

200

400

800

MOUNTED

TO-92 POWER DISSIPATION CURVE



TK711xx

Marking Information

MarkingTK71120 120TK71125 125TK71130 130TK71133 133TK71135 135TK71140 140TK71145 145TK71150 150

(1.4)

0.45

1.271.27

0.45

e e

13

.5

4.8

5.0

R2.4

M0.25

3.8

1 2 3


+ 0

.5

+0.15-0.05

+0.15-0.05

Marking

Lot Number

TO-92

PACKAGE OUTLINE




IC-160-TK711xx0798O0.0K








TK712xx

GND

NOISEBYPASS

VOUT

VIN

GND

NOISEBYPASS

VIN VOUT

THERMALPROTECTION

BANDGAPREFERENCE

GND

GND



Cordless Telephones



Toys

Low Voltage Systems



Very Stable Output

Low Noise (35 µVrms)


TK712xx

BLOCK DIAGRAM

DESCRIPTION

TK712xx is a low dropout, linear regulator. Since a PNPpower transistor is used, dropout voltage is very low,making it possible to maintain stable output voltage evenas the battery decreases. This allows longer battery life.The TK712xx has a noise bypass pin available for noisereduction.

The TK712xx is available in a miniature SOT-25 surfacemount package.



Tape/Reel Code

TK712 M

VoltageCode

VOLTAGE CODE20 = 2.0 V 35 = 3.5 V25 = 2.5 V 40 = 4.0 V28 = 2.8 V 45 = 4.5 V30 = 3.0 V 50 = 5.0 V33 = 3.3 V

20P



TK712xx



V NI I,V8.1= TUO Am0= 4.1 0.3 Am








V fer


72.1 V


TK71220 ELECTRICAL CHARACTERISTICSTest Conditions: VIN = 3 V, TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25 °C.




TK712xx




V NI I,V0.2= TUO Am0= 4.1 0.3 Am








V fer


72.1 V





V NI I,V5.2= TUO Am0= 4.1 0.3 Am








V fer

lanimretssapyBesioNegatloV

72.1 V



TK712xx




V NI I,V8.2= TUO Am0= 4.1 0.3 Am








V fer


72.1 V





V NI I,V5.2= TUO Am0= 4.1 0.3 Am








V fer


72.1 V



TK712xx



V NI I,V0.3= TUO Am0= 4.1 0.3 Am








V fer


72.1 V





V NI I,V5.3= TUO Am0= 4.1 0.3 Am








V fer


72.1 V




TK712xx



V NI I,V0.4= TUO Am0= 4.1 0.3 Am








V fer


72.1 V





V NI I,V0.4= TUO Am0= 4.1 0.3 Am








V fer


72.1 V




TK712xx

TEST CIRCUIT

VIN

NOISEBYPASS

VOUT

VIN

IIN

+

GND

+

VOUTIOUTCL

CN


VO

UT

(m

V)

50


VIN (V)

0 10 20-50

30

10

-10

-30

I GN

D (

mA

)

5


TA (°C)

-50 0 50 1000

4

3

2

1

IOUT = 60 mA

IOUT = 30 mA

VD

RO

P (

mV

)

500


TA (°C)

-50 0 50 1000

400

300

200

100

IOUT = 60 mA

IOUT = 30 mA

NO

ISE

(dB

)

-50NOISE SPECTRUM

FREQUENCY (kHz)

0 500 1000

-100

-150

IOUT = 30 mA


CN = 0.01 µFCL = 1 µF

RR

(dB

)

0


FREQUENCY (Hz)

100 1 k 10 k 100 k

-50

-100

CL = 1 µF

CL = 10 µFNO

ISE

(µV

)

300

NOISE VOLTAGE VS.BYPASS CAPACITOR

CN

1 pF 10 pF 100 pF 1000 pF 0.01 µF.1 µF

100

IOUT = 30 mA

200

150

50

0

CL = 3.3 µF

CL = 1.0 µF

CL = 10 µF

CL = 10 µF

VOUT = 2 V

VOUT = 5 V


TK712xx


VO

UT


I OU

T

VO

UT

(40

0 m

V /

DIV

)

IOUT = 30 mA

0 mA

CL = 3.3 µF

CL = 1.0 µF

TIME (50 µs / DIV)

I GN

D (

mA

)

10


IOUT (mA)

0 50 1000

8

6

4

2

VO

UT

(50

mV

/ D

IV)


VIN (100 mV / DIV)

IOUT = 0 mA30 mA

60 mA

VIN = VOUT

VOUT(TYP) + 1 V

VO

UT


VIN

VO

UT

(20

mV

/ D

IV)

VOUT(TYP) + 2 V

TIME (50 µs / DIV)

VOUT(TYP) + 1 V


TK712xx

TK71225


TK71220

VO

UT

(V

)

2.05


IOUT (mA)

0 50 1001.95

2.00I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

2.05


TA (°C)

-50 0 50 1001.95

2.00

VO

UT

(V

)

2.55


IOUT (mA)

0 50 1002.45

2.50

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100


TK712xx


TK71225 (CONT.)

TK71228

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

2.55


TA (°C)

-50 0 50 1002.45

2.50

VO

UT

(V

)

2.85


IOUT (mA)

0 50 1002.75

2.80

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mAI O

UT

(m

A)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

2.85


TA (°C)

-50 0 50 1002.75

2.80


TK712xx


TK71230

TK71233

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.05


TA (°C)

-50 0 50 1002.95

3.00

VO

UT

(V

)

3.35


IOUT (mA)

0 50 1003.25

3.30

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VO

UT

(V

)

3.05


IOUT (mA)

0 50 1002.95

3.00I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100


TK712xx


TK71233 (CONT.)

TK71235

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.35


TA (°C)

-50 0 50 1003.25

3.30

VO

UT

(V

)

3.55


IOUT (mA)

0 50 1003.45

3.50

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mAI O

UT

(m

A)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.55


TA (°C)

-50 0 50 1003.45

3.50


TK712xx

TK71240


TK71245

VO

UT

(V

)

4.05


IOUT (mA)

0 50 1003.95

4.00I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

4.05


TA (°C)

-50 0 50 1003.95

4.00

VO

UT

(V

)

4.55


IOUT (mA)

0 50 1004.45

4.50

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100


TK712xx


VO

UT

(V

)

5.05


IOUT (mA)

0 50 1004.95

5.00

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)

5


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

5.05


TA (°C)

-50 0 50 1004.95

5.00

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

4.55


TA (°C)

-50 0 50 1004.45

4.50

TK71245 (CONT.)

TK71250


TK712xx














THERMAL PROTECTION



This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe mounting pad, the power dissipation of the SOT-25 isincreased to 350 mW. For operation at ambienttemperatures over 25 °C, the power dissipation of theSOT-25 device should be derated at 2.8 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C / PD



TK712xx



Procedure:







PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100TA (°C)

PD

(m

W)

1500

600

1000

200

400

800

MOUNTED

FREE AIR



TK712xx



The ESR is another important parameter. The ESR willincrease with temperature but low ESR capacitors areoften larger and more costly. In general, tantalum capacitorsoffer lower ESR than aluminum electrolytic, but new lowESR aluminum electrolytic capacitors are now availablefrom several manufacturers. Usually a bench test issufficient to determine the minimum capacitance requiredfor a particular application. After taking thermalcharacteristics and tolerance into account, the minimumcapacitance value should be approximately two times thisvalue. The recommended minimum capacitance for theTK712xx is 2.2 µF for a tantalum capacitor or 3.3 µF for analuminum electrolytic. Please note that linear regulatorswith a low dropout voltage have high internal loop gainswhich require care in guarding against oscillation causedby insufficient decoupling capacitance. The use of highquality decoupling capacitors suited for your applicationwill guarantee proper operation of the circuit. Pay attentionto temperature characteristics of the capacitor, especiallythe increase of ESR and decrease of capacitance in lowtemperatures. Oscillation, reduction of ripple rejection andincreased noise may occur in some cases if the propercapacitor is not used. An output capacitor more than 1.0 µFis required to maintain stability. The standard test conditionis 3.3 µF (TA = 25 °C).


OPTIMUM PERFORMANCE

Optimum performance can only be achieved when the ICis mounted on a PC board according to the diagram below.This is because of the extremely small package and limitedpower dissipation. Shape the metal portion of the PCB asshown in the following drawing.

SOT-25 BOARD LAYOUT

Use a large bypass capacitor and connect it in a place nearGND of the IC. Pay attention to temperature characteristicsof the capacitor, especially the increase of ESR anddecrease of capacitance in low temperatures. Oscillation,reduction of ripple rejection and increased noise mayoccur in some cases if the proper capacitor is not used. Anoutput capacitor more than 1.0 µF is required to maintainstability. The standard test condition is 3.3 µF (TA = 25 °C).

++

GND

CN

VIN VOUT

GND

+


TK712xx

Marking Information

MarkingTK71220 J20TK71225 J25TK71228 J28TK71230 J30TK71233 J33TK71235 J35TK71240 J40TK71245 J45TK71250 J50

SOT-25 (SOT-23-5)

PACKAGE OUTLINE




IC-161-TK712xx0798O0.0K



0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.16

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.3

max

e

e e

0.1

e1

15 m

ax

Marking

0.3

+0

.1

+0.15- 0.05


+0.

15-

0.05

+0.

2-

0.3






TK713xx

GND

CONTROL

VOUT

VIN

GND

CONTROL

VIN VOUT

THERMALPROTECTION

BANDGAPREFERENCE

GND

GND

SHUTDOWN



Cordless Telephones



Toys

Low Voltage Systems



Very Stable Output

Active Low On/Off Control


TK713xx

BLOCK DIAGRAM

DESCRIPTION

TK713xx is a low dropout, linear regulator with a built-inelectronic switch. Since a PNP power transistor is used,dropout voltage is very low, making it possible to maintaina stable output voltage even as the battery voltagedecreases. This allows longer battery life. The TK713xxhas a control pin to turn the output on or off. The inputcurrent is 10 µA when the output is off.

The TK713xx is available in a miniature SOT-25 surfacemount package.



Tape/Reel Code

TK713 M

VoltageCode

VOLTAGE CODE15 = 1.5 V 33 = 3.3 V20 = 2.0 V 40 = 4.0 V25 = 2.5 V 45 = 4.5 V28 = 2.8 V 50 = 5.0 V30 = 3.0 V

20P



TK713xx



V NI I,V3.1= TUO Am0= 0.2 0.5 Am

I YBTS tnerruCybdnatS V NI FFOtuptuO,V0.3= 21 04 Aµ





geReniL noitalugeReniL V NI V0.6ot8.1= 9.0 5.1 Vm





I TNOC tnerruClortnoCV TNOC R,V0.1= TNOC 0= ,Ω FFOtuptuO 34 06 Aµ

V TNOC R,V2.1= TNOC K001= ,Ω FFOtuptuO 5.4 Aµ

V )NO(TNOC NOegatloVlortnoC R TNOC K001= ,Ω NOtuptuO 4.0 V

V )FFO(TNOC FFOegatloVlortnoC R TNOC K001= ,Ω FFOtuptuO 2.1 V


Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25 °C. Power dissipation is150 mW in Free Air. Derate at 1.2 mW/°C for operation above 25 °C.




TK713xx




V NI I,V9.1= TUO Am0= 4.1 0.3 Am
















TK713xx




V NI I,V0.2= TUO Am0= 4.1 0.3 Am
















TK713xx




V NI I,V5.2= TUO Am0= 4.1 0.3 Am
















TK713xx




V NI I,V8.2= TUO Am0= 4.1 0.3 Am
















TK713xx




V NI I,V5.3= TUO Am0= 4.1 0.3 Am
















TK713xx




V NI I,V0.4= TUO Am0= 4.1 0.3 Am
















TK713xx

TEST CIRCUIT

VIN

CONTROL

VOUT

VIN

IIN

+

GND

+

VOUTIOUTCL

RCONTVCONT


VO

UT

(m

V)

50


VIN (V)

0 10 20-50

30

10

-10

-30

I GN

D (

mA

)

5


TA (°C)

-50 0 50 1000

4

3

2

1

IOUT = 60 mA

IOUT = 30 mA

VD

RO

P (

mV

)

500


TA (°C)

-50 0 50 1000

400

300

200

100

IOUT = 60 mA

IOUT = 30 mA

RR

(dB

)

0


FREQUENCY (Hz)

100 1 k 10 k 100 k

-50

-100

CL = 1 µF

CL = 10 µF

VO

UT


VIN

VO

UT

(20

mV

/ D

IV)

VOUT(TYP) + 2 V

TIME (50 µs / DIV)

VOUT(TYP) + 1 V

NO

ISE

(dB

)

-50NOISE SPECTRUM

FREQUENCY (kHz)

0 500 1000

-100

-150

IOUT = 30 mA


CL = 3.3 µF


TK713xx


TK71315

VO

UT


I OU

T

VO

UT

(40

0 m

V /

DIV

)

IOUT = 30 mA

0 mA

CL = 3.3 µF

CL = 1.0 µF

TIME (50 µs / DIV)

I GN

D (

mA

)

10


IOUT (mA)

0 50 1000

8

6

4

2

VO

UT

(50

mV

/ D

IV)


VIN (100 mV / DIV)

IOUT = 0 mA30 mA

60 mA

VIN = VOUT

VOUT(TYP) + 1 V

VO

UT

(V

)

1.55


IOUT (mA)

0 50 1001.45

1.50

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mAI O

UT

(m

A)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

1.55


TA (°C)

-50 0 50 1001.45

1.50


TK713xx

TK71320

TK71325


VO

UT

(V

)

2.05


IOUT (mA)

0 50 1001.95

2.00I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

2.05


TA (°C)

-50 0 50 1001.95

2.00

VO

UT

(V

)

2.55


IOUT (mA)

0 50 1002.45

2.50

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100


TK713xx


TK71325 (CONT.)

TK71330

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

2.55


TA (°C)

-50 0 50 1002.45

2.50

VO

UT

(V

)

3.05


IOUT (mA)

0 50 1002.95

3.00

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mAI O

UT

(m

A)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.05


TA (°C)

-50 0 50 1002.95

3.00


TK713xx


TK71333

TK71335

VO

UT

(V

)

3.35


IOUT (mA)

0 50 1003.25

3.30I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.35


TA (°C)

-50 0 50 1003.25

3.30

VO

UT

(V

)

3.55


IOUT (mA)

0 50 1003.45

3.50

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100


TK713xx


TK71335 (CONT.)

TK71340

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

3.55


TA (°C)

-50 0 50 1003.45

3.50

VO

UT

(V

)

4.05


IOUT (mA)

0 50 1003.95

4.00

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mAI O

UT

(m

A)

150


TA (°C)

-50 0 50 10050

100

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

4.05


TA (°C)

-50 0 50 1003.95

4.00


TK713xx

TK71345


TK71350

VO

UT

(V

)

4.55


IOUT (mA)

0 50 1004.45

4.50I Q

(m

A)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100

VO

UT

(V

)


IOUT (mA)

0 100 2000

2

4

3

1

VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)

4.55


TA (°C)

-50 0 50 1004.45

4.50

VO

UT

(V

)

5.05


IOUT (mA)

0 50 1004.95

5.00

I Q (

mA

)

2


VIN (V)

0 5 100

1

IOUT = 0 mA

I OU

T (

mA

)

150


TA (°C)

-50 0 50 10050

100


TK713xx


VD

RO

P (

mV

)

500


IOUT (mA)

0 50 1000

200

400

300

100

VO

UT

(V

)

5


IOUT (mA)

0 100 2000

2

4

3

1

VO

UT

(V

)

5.05


TA (°C)

-50 0 50 1004.95

5.00

TK71350 (CONT.)


TK713xx














THERMAL PROTECTION



This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe mounting pad, the power dissipation of the SOT-25 isincreased to 350 mW. For operation at ambienttemperatures over 25 °C, the power dissipation of theSOT-25 device should be derated at 2.8 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C / PD



TK713xx



Procedure:







PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100TA (°C)

PD

(m

W)

1500

600

1000

200

400

800MOUNTED

FREE AIR



TK713xx




The ESR is another important parameter. The ESR willincrease with temperature but low ESR capacitors areoften larger and more costly. In general, tantalum capacitorsoffer lower ESR than aluminum electrolytic, but new lowESR aluminum electrolytic capacitors are now availablefrom several manufacturers. Usually a bench test issufficient to determine the minimum capacitance requiredfor a particular application. After taking thermalcharacteristics and tolerance into account, the minimumcapacitance value should be approximately two times thisvalue. The recommended minimum capacitance for theTK713xx is 2.2 µF for a tantalum capacitor or 3.3 µF for analuminum electrolytic. Please note that linear regulatorswith a low dropout voltage have high internal loop gainswhich require care in guarding against oscillation causedby insufficient decoupling capacitance. The use of highquality decoupling capacitors suited for your applicationwill guarantee proper operation of the circuit. Pay attentionto temperature characteristics of the capacitor, especiallythe increase of ESR and decrease of capacitance in lowtemperatures. Oscillation, reduction of ripple rejection andincreased noise may occur in some cases if the propercapacitor is not used. An output capacitor more than 1.0 µFis required to maintain stability. The standard test conditionis 3.3 µF (TA = 25 °C).

OPTIMUM PERFORMANCE

Optimum performance can only be achieved when the ICis mounted on a PC board according to the diagram below.This is because of the extremely small package and limitedpower dissipation. Shape the metal portion of the PCB asshown in the following drawing.

SOT-25 BOARD LAYOUT

Use a large bypass capacitor and connect it in a place nearGND of the IC. Pay attention to temperature characteristicsof the capacitor, especially the increase of ESR anddecrease of capacitance in low temperatures. Oscillation,reduction of ripple rejection and increased noise mayoccur in some cases if the proper capacitor is not used. Anoutput capacitor more than 1.0 µF is required to maintainstability. The standard test condition is 3.3 µF (TA = 25 °C).

++

GND

CONTROL

VIN VOUT

GND


TK713xx

Marking Information

MarkingTK71315 H15TK71320 H20TK71325 H25TK71328 H28TK71330 H30TK71333 H33TK71340 H40TK71345 H45TK71350 H50

SOT-25 (SOT-23-5)

PACKAGE OUTLINE




IC-xxx-TK713xx0798O0.0K



0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.16

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.3

max

e

e e

0.1

e1

15 m

ax

Marking

0.3

+0

.1

+0.15- 0.05


+0.

15-

0.05

+0.

2-

0.3






TK715xx

GND

VIN VOUT

THERMALPROTECTION

+

-

+

-

BANDGAPREFERENCE

FEATURES High Voltage Precision at ± 2.0% or ± 60 mV

Very Low Quiescent Current

Very Low Dropout Voltage

Reverse Bias Protection

Miniature Package (SOT-23-3)


High Ripple Rejection


Cellular Telephones

Pagers





Toys

Low Voltage Systems

BLOCK DIAGRAM

TK715xxS

GND

VOUT

VIN

DESCRIPTION

The TK715xx is a low dropout linear regulator housed in asmall SOT-23-3 package, rated at 350 mW. An internalPNP transistor is used to achieve a low dropout voltage of105 mV (typ.) at 50 mA load current. This device offers highprecision output voltage of ± 2.0 % or ± 60 mV. TheTK715xx has a very low quiescent current of 25 µA (typ.)at no load. The low quiescent current and dropout voltagemake this part ideal for battery powered applications. Theinternal reverse bias protection eliminates the requirementfor a reverse voltage protection diode, saving cost andboard space. The high 64 dB ripple rejection and low noiseprovide enhanced performance for critical applications.

TK715 SCL


VOLTAGE CODE19 = 1.9 V 37 = 3.7 V20 = 2.0 V 38 = 3.8 V21 = 2.1 V 39 = 3.9 V22 = 2.2 V 40 = 4.0 V23 = 2.3 V 41 = 4.1 V24 = 2.4 V 42 = 4.2 V25 = 2.5 V 43 = 4.3 V26 = 2.6 V 44 = 4.4 V27 = 2.7 V 45 = 4.5 V28 = 2.8 V 46 = 4.6 V29 = 2.9 V 47 = 4.7 V30 = 3.0 V 48 = 4.8 V31 = 3.1 V 49 = 4.9 V32 = 3.2 V 50 = 5.0 V33 = 3.3 V 60 = 6.0 V34 = 3.4 V 70 = 7.0 V35 = 3.5 V 80 = 8.0 V36 = 3.6 V 90 = 9.0 V

Voltage Code Tape/ Reel CodeTemp. CodePackage Code

TAPE/REEL CODEL: Tape Left

TEMPERATURE CODEC -30 to +80 C

PACKAGE CODES : SOT-23-3

20P

LOW DROPOUT VOLTAGE REGULATOR


TK715xx

ABSOLUTE MAXIMUM RATINGS (V OUT ≥ 5.0 V)Supply Voltage .............................................. -0.4 to 16 VPower Dissipation (Note 1) ................................ 350 mWReverse Bias .............................................................. 8 VStorage Temperature (Ambient) ............... -55 to +150 °COperating Temperature (Ambient) .............. -30 to +80 °C

Max. Operating Temperature (Junction) ............... 125 °COperating Voltage Range............................ 1.8 to 14.0 VJunction Temperature ........................................... 150 °CLead Soldering Temperature (10 s) ...................... 235 °C

TK715xx ELECTRICAL CHARACTERISTICS (V OUT ≥ 5.0 V)Test conditions: TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25 °C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: Ripple rejection is measured at VR = 200 mVrms, VIN = VOUT(TYP) + 2 V, IOUT = 10 mA, CL = 4.7 µF, f = 100 Hz.Gen. Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.


IQ tnerruCtnecseiuQI TUO V,Am0= TUO ≤ V0.4 52 54 Aµ

I TUO V,Am0= TUO ≥ V1.4 03 05 Aµ

I DNG tnerruCdnuorG I TUO Am05= 4.1 5.2 Am


geReniL noitalugeReniLV NI V= )PYT(TUO otV1+V )PYT(TUO V6+

0.1 01 Vm



V PORD egatloVtuoporD

I TUO Am05= 501.0 0810. V

I TUO V,Am001= TUO ≥ V4.2 581.0 082.0 V

I TUO V,Am001= TUO V4.2< 581.0 033.0 V

I TUO tnerruCtuptuOsuounitnoC 001 Am

RR noitcejeRelppiR )4,3setoN( 46 Bd

∆V TUO / ∆T tneiciffeoCerutarepmeT I TUO Am01= 53 C°/mpp


TK715xx

ABSOLUTE MAXIMUM RATINGS (V OUT≤ 6.0 V)Supply Voltage .............................................. -0.4 to 16 VPower Dissipation (Note 1) ................................ 350 mWReverse Bias .............................................................. 8 VStorage Temperature (Ambient) ............... -55 to +150 °COperating Temperature (Ambient) .............. -30 to +80 °C

Max. Operating Temperature (Junction) ............... 125 °COperating Voltage Range............................ 2.5 to 14.0 VJunction Temperature ........................................... 150 °CLead Soldering Temperature (10 s) ...................... 235 °C

TK715xx ELECTRICAL CHARACTERISTICS (V OUT ≤ 6.0 V)Test conditions: TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25 °C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: Ripple rejection is measured at VR = 200 mVrms, VIN = VOUT(TYP) + 2 V, IOUT = 10 mA, CL = 4.7 µF, f = 100 Hz.Gen. Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.


IQ tnerruCtnecseiuQ I TUO Am0= 23 06 Aµ

I DNG tnerruCdnuorG I TUO Am05= 4.1 5.2 Am


geReniL noitalugeReniLV NI V= )PYT(TUO otV1+V )PYT(TUO V41xaMroV6+

0.3 Vm



V PORD egatloVtuoporDI TUO Am05= 501.0 0810. V

I TUO Am001= 581.0 082.0 V


RR noitcejeRelppiR )4,3setoN( 46 Bd

∆V TUO / ∆T tneiciffeoCerutarepmeT I TUO Am01= 53 C°/mpp


TK715xx

TK715xx ELECTRICAL CHARACTERISTICS TABLE 1


3.6 V 36 3.535 V 3.665 V 4.6 V

Output Voltage VOUT(MIN) VOUT(MAX) TestVoltage Code Voltage3.7 V 37 3.630 V 3.770 V 4.7 V3.8 V 38 3.725 V 3.875 V 4.8 V3.9 V 39 3.825 V 3.975 V 4.9 V4.0 V 40 3.920 V 4.080 V 5.0 V4.1 V 41 4.020 V 4.180 V 5.1 V4.2 V 42 4.120 V 4.280 V 5.2 V4.3 V 43 4.215 V 4.385 V 5.3 V4.4 V 44 4.315 V 4.485 V 5.4 V4.5 V 45 4.410 V 4.590 V 5.5 V4.6 V 46 4.510 V 4.690 V 5.6 V4.7 V 47 4.605 V 4.795 V 5.7 V4.8 V 48 4.705 V 4.895 V 5.8 V4.9 V 49 4.800 V 5.000 V 5.9 V5.0 V 50 4.900 V 5.100 V 6.0 V6.0 V 60 5.880 V 6.120 V 7.0 V7.0 V 70 6.860 V 7.140 V 8.0 V8.0 V 80 7.840 V 8.160 V 9.0 V9.0 V 90 8.820 V 9.180 V 9.0 V


TK715xx


TEST CIRCUIT

IOUT

VINVIN

VOUT+

CIN0.1 µF

VOUT+

IIN

+

_

GND

CL2.2 µF

VO

UT

(5

mV

/ DIV

)

LOAD REGULATION

IOUT (mA)

0 50 100

VOUT TYPICAL

VO

UT

(V

)

3

5


IOUT (mA)

1

0 100 200

4

2

0

VO

UT

(25

mV

/ DIV

)


VIN (V) (50 mV/DIV)

0 VIN = VOUT

VOUT TYPICAL

IOUT = 90 mA

IOUT = 0 mA

IOUT = 60 mA

IOUT = 30 mA

VO

UT

(50

mV

/ DIV

)

LINE REGULATION

VIN (V)

0 10 20

VOUT TYPICAL

I RE

V (

µA)

60

100

REVERSE BIAS CURRENT RANGE(VIN = 0 V)

VREV (V)

20

0 5 10

80

40

0

VOUT = 2.0 V

VOUT = 8.0 V

I Q (

mA

)

2


VIN (V)

0 5 10

1

0

IOUT = 0 mA

VOUT = 3 V


TK715xx

715xx

CL4.7 µF

VOUTVIN

CIN0.1 to 1 µF


VD

RO

P (

mV

)

-100

0

OUTPUT CURRENT VS.DROPOUT VOLTAGE

IOUT (mA)

-2000 50 100

I GN

D (

µA)

200

500

GROUND CURRENT 1 VS.OUTPUT CURRENT

IOUT (mA)

100

0 5 10 15 20 25

400

300

0

I GN

D (

mA

)

2

5

GROUND CURRENT 2 VS.OUTPUT CURRENT

IOUT (mA)

1

0 20 40 60 80 100

4

3

0

I OU

T (

mA

)

160

220

MAXIMUM OUTPUT CURRENT VS.TEMPERATURE

TA (°C)

150

-50 0 50 100

200

180

VOUT IS 2.7 V OR MORE

NO

ISE

(µV

)

140

200

NOISE LEVEL VS.OUTPUT CURRENT

IOUT (mA)

120

0 50 100

180

160

100

1 µF2.2 µF3.3 µF4.7 µF 10 µF

CL =

CIN =10 µFBW = 10 Hz to 80 kHz

NO

ISE

(µV

)

140

200

NOISE LEVEL VS. CL

CL (µF)

120

1.0 5.0 10

180

160

100

5 mA10 mA30 mA60 mA90 mA

CIN =10 µFBW = 10 Hz to 80 kHz

IOUT =

RIPPLE REJECTION

0.01 0.1 1 10

f (kHz)

-80

RR

(dB

)

-20

-60

-40

0

-100

IOUT = 10 mA

CL = 4.7 µF

∆VO

UT

(m

V)

-10


TA (°C)

-20

-50 0 50 100

10

0

20

-30

3.0 V

2.9 V



TK715xx

dB

NOISE SPECTRUM

f (kHz)

-100

0 500 k 1 M

-50

CL = 4.7 µF, IOUT = 60 mA

CL = 4.7 µF, IOUT = 5 mA


RB = 1 kHz, VB = 100 Hz


TIME (50 µs/ DIV)

VIN

VO

UT

(10

mV

/ DIV

)

VO

UT CL = 4.7 µF

IOUT = 10 mA

VOUT + 2 V

VOUT + 1 V

LOAD CURRENT STEP RESPONSE 2

TIME (50 µs/ DIV)

I OU

TV

OU

T1

VO

UT

(20

mV

/ DIV

)

NOTE: VOUT2 DELAYED 50 µs FOR CLARITY

VO

UT

2

IOUT = 0 to 100 mA

IOUT = 0 to 30 mA

CL =4.7 µF


TIME (50 µs/ DIV)

I OU

TV

OU

T1

VO

UT

(20

mV

/ DIV

)

CL =4.7 µF

IOUT = 5 to 100 mA

IOUT = 5 to 30 mA

NOTE: VOUT2 DELAYED 50 µs FOR CLARITY

VO

UT

2



TK715xx









Maximum pulse width 5 ms at VOUT above 2.0 V, duty cycle12.5%: pulse load only.


Line regulation is the ability of the regulator to maintain aconstant output voltage as the input voltage changes. Theline regulation is specified as the input voltage is changedfrom VIN = VOUT(TYP) + 1 V to VIN = VOUT(TYP) + 6 V or VIN =max 14 V.


Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It isa pulsed measurement to minimize temperature effectswith the input voltage set to VIN = VOUT(TYP) +1 V. The loadregulation is specified under two output current stepconditions of 1 mA to 60 mA and 1 mA to 100 mA.




Ground current is the current which flows through theground pin(s). It is defined as IIN - IOUT, excluding control

current.


Ripple rejection is the ability of the regulator to attenuatethe ripple content of the input voltage at the output. It isspecified with 200 mVrms, 100 Hz superimposed on theinput voltage, where VIN = VOUT(TYP) + 2.0 V. The outputdecoupling capacitor is set to 4.7 µF and the load currentis set to 5 mA. Ripple rejection is the ratio of the ripplecontent of the output vs. the input and is expressed in dB.

REVERSE VOLTAGE PROTECTION



Although the architecture of the Toko regulators aredesigned to minimize semiconductor noise, furtherreduction can be achieved by the selection of externalcomponents. The obvious solution is to increase the sizeof the output capacitor. Please note that several parametersare affected by the value of the capacitors and benchtesting is recommended when deviating from standardvalues.


This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23-3 is increased to 350 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23-3 device should be derated at 2.8 mW/°C. To


TK715xx


determine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C/ PD



Procedure:

1) Find PD2) PD1 is taken to be PD x (~ 0.8 - 0.9)

3) Plot PD1 against 25 °C4) Connect PD1 to the point corresponding to the 150 °C






SOT-23-3 POWER DISSIPATION CURVE

PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100 150

TA (°C)

PD

(m

W)

0

300

500

100

200

400 MOUNTED ASSHOWN

FREE AIR


TK715xx

TK715xxS

CL

ESR



Linear regulators require input and output capacitors in order to maintain regulator loop stability. The output capacitorshould be selected within the Equivalent Series Resistance (ESR) range as shown in the graphs below for stableoperation. When a ceramic capacitor is connected in parallel with the output capacitor, a maximum of 1000 pF isrecommended. This is because the ceramic capacitor's electrical characteristics (capacitance and ESR) vary widely overtemperature. If a large ceramic capacitor is used, a resistor should be connected in series with it to bring it into the stableoperating area shown in the graphs below. Minimum resistance should be added to maintain load and line transientresponse.

Note: It is very important to check the selected manufacturers electrical characteristics (capacitance and ESR) overtemperature.

715xxS

CL

ESR

100

10

1

0.1

0 .010 50 100

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

100

10

1

0.1

0 .010 50 100

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

100

10

1

0.1

0 .010 50 100

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

CL = 1.0 µF CL = 2.2 µF CL = 4.7 µF

Note: It is not necessary to connect a ceramic capacitorin parallel with an aluminum or tantalum output capacitor.


TK715xx

In general, the capacitor should be at least 1 µF and be rated for the actual ambient operating temperature range. Thetable below shows typical characteristics for several types and values of capacitance. Please note that the ESR varieswidely depending upon manufacturer, type, size, and material.

BOARD LAYOUT

Copper pattern should be as large as possible. Power dissipation is 350 mW for SOT-23-3. A low ESR capacitor isrecommended. For low temperature operation, select a capacitor with a low ESR at the lowest operating temperatureto prevent oscillation, degradation of ripple rejection and increase in noise. The minimum recommended capacitance is2.2 µF.

The internal reverse bias protection eliminates the requirement for a reverse voltage protection diode. This saves bothcost and board space.

SOT-23-3 BOARD LAYOUT


ESRCapacitance

AluminumCapacitor

TantalumCapacitor

CeramicCapacitor

1.0 µF 2.4 Ω 2.3 Ω 0.140 Ω

2.2 µF 2.0 Ω 1.9 Ω 0.059 Ω

3.3 µF 4.6 Ω 1.0 Ω 0.049 Ω

10 µF 1.4 Ω 0.5 Ω 0.025 Ω


++

VIN VOUTGND


TK715xx

REVERSE BIAS PROTECTION

The internal reverse bias protection eliminates therequirement for a reverse voltage protection diode. Thissaves both cost and board space.

Another reverse bias protection technique is illustratedbelow. The extra diode and extra capacitor are notnecessary with the TK715xx. The high output voltageaccuracy is maintained because the diode forward voltagevariations over temperature and load current have beeneliminated.

PARALLEL OPERATION

The series resistor R is put in the input line of the low outputvoltage regulator in order to prevent overdissipation. Thevoltage dropped across the resistor reduces the largeinput-to-output voltage across the regulator, reducing thepower dissipation in the device.

715xxSVOUTVIN

GND


SWITCHING OPERATION

Even though the input voltages or the output voltages aredifferent, the outputs of the TK715xx regulators can beconnected together, and the output voltages switched. Iftwo or more TK715xx regulators are turned ONsimultaneously, the highest output voltage will be present.

CURRENT BOOST OPERATION

The output current can be increased by connecting anexternal PNP transistor as shown below. The outputcurrent capability depends upon the Hfe of the externaltransistor. Note: The TK715xx internal short circuitprotection and thermal sensor do not protect the externaltransistor.

TK715xxSVOUTVIN

TK715505 V

VIN

TK71530

TK71520

3 V

2 V

R

TK715xx

VINVOUT

0.22 µF

150 Ω

VIN

3.3 µF

TK71530VIN

TK71528VIN VOUT

3.0 OR 2.8 V


TK715xx

Marking Information

Product Code T

Voltage CodeTK71519S 19TK71520S 20TK71521S 21TK71522S 22TK71523S 23TK71524S 24TK71525S 25TK71526S 26TK71527S 27TK71528S 28TK71529S 29TK71530S 30TK71531S 31TK71532S 32TK71533S 33TK71534S 34TK71535S 35TK71536S 36TK71537S 37TK71538S 38TK71539S 39TK71540S 40TK71541S 41TK71542S 42TK71543S 43TK71544S 44TK71545S 45TK71546S 46TK71547S 47TK71548S 48TK71549S 49TK71550S 50TK71560S 60TK71570S 70TK71580S 80TK71590S 90

Marking

Voltage Code

Product Code

2.9


1.4

ma

x

0.1

1.1

0 -

0.1

(0.3

)

2.8 + 0.30

.15

+ 0

.1

1.6

(0.4)

15

m

ax.

Recommended Mounting Pad

0.7

1.0

2.4

1.90

0.95 0.95

e1

e e

e1

3

1 20.95 0.95e e

C10.10.4

+ 0.1

SOT-23-3

PACKAGE OUTLINE












TK716xx

FEATURES Available in ± 2.0 % or ± 1.0 % Output Tolerance



Very Low Dropout Voltage

Reverse Bias Protection


Short Circuit Switch

High Ripple Rejection

Very High Output Impedance (Output Off)

Very Low Noise

BLOCK DIAGRAM

TK716xx

20P GND

VIN

NOISE BYPASS

VOUT

CONTROL

CONTROL

GND

VIN VOUT

BANDGAPREFERENCE

CONSTANTCURRENTSOURCE

THERMAL ANDOVERCURRENT

PROTECTION

DISCONNECTCIRCUIT

NOISEBYPASS

+

-

CONTROLCIRCUIT

TK716 SCLTK716 S I LTK716 SCL H



TEMPERATURE CODEC: Standard Temp. Range I: Extended Temp. Range

PACKAGE CODES: SOT-23-5

TOLERANCE CODEH: 1 % Output Voltage Tolerance

Tape/Reel CodeVoltage Code

Temp. CodePackage Code

VOLTAGE CODE20 = 2.0 V * 31 = 3.1 V 42 = 4.2 V21 = 2.1 V * 32 = 3.2 V 43 = 4.3 V22 = 2.2 V * 33 = 3.3 V 44 = 4.4 V23 = 2.3 V * 34 = 3.4 V 45 = 4.5 V24 = 2.4 V 35 = 3.5 V 46 = 4.6 V25 = 2.5 V 36 = 3.6 V 47 = 4.7 V26 = 2.6 V 37 = 3.7 V 48 = 4.8 V27 = 2.7 V 38 = 3.8 V 49 = 4.9 V28 = 2.8 V 39 = 3.9 V 50 = 5.0 V29 = 2.9 V 40 = 4.0 V30 = 3.0 V 41 = 4.1 V

* Not available in I Temp. Code

Tolerance Code

DESCRIPTION

The TK716xx is a low dropout linear regulator housed in asmall SOT-23-5 package, rated at 500 mW. The device isin the “on” state when the control pin is pulled to a logic highlevel. An internal PNP pass transistor is used to achieve alow dropout voltage of 90 mV (typ.) at 50 mA load current.This device offers high precision output voltage of ± 2.0 %or ± 1.0 %. The low quiescent current and dropout voltagemake this part ideal for battery powered applications. Thispart incorporates an output disconnect feature to reducethe reverse bias current in the “off” state to less than 50 nA.The internal reverse bias protection eliminates the require-ment for a reverse voltage protection diode, saving costand board space. The high 60 dB ripple rejection (400 Hz)and low noise provide enhanced performance for criticalapplications. An external capacitor can be connected tothe noise bypass pin to lower the output noise level to 30µVrms.


Cellular Telephones

Pagers





Toys

Low Voltage Systems

LOW DROPOUT VOLTAGE REGULATOR


TK716xx

ABSOLUTE MAXIMUM RATINGSSupply Voltage ......................................................... 16 VPower Dissipation (Note 1) ................................ 500 mWReverse Bias Voltage................................................. 6 VControl Terminal Voltage ......................................... 12 VNoise Bypass Terminal Voltage ................................. 5 VOperating Voltage Range............................... 1.8 to 12 VStorage Temperature Range ................... -55 to +150 °C

Operating Temperature (Ambient) Range TK716xxSCL, TK716xxSCLH ................. -30 to +80 °C TK716xxSIL............................................ -40 to +85 °CJunction Temperature (Operating) ........................ 125 °CJunction Temperature (Shutdown) ........................ 150 °CLead Soldering Temperature (10 s) ...................... 235 °C

TK716xxSCL AND TK716SCLH ELECTRICAL CHARACTERISTICSTest conditions: VIN = VOUT(TYP) + 1 V, TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 500 mW when mounted as recommended. Derate at 4.0 mW/°C for operation above 25 °C.Gen Note: Exceeding the “Absolute Maximum Ratings” may damage the device.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.Gen Note: Ripple rejection is @ 60 dB when f = 400 Hz, CL = 10 µF, CN = 0.1 µF, input noise = 100 mVrms, VIN = VOUT(TYP) + 1.5 V and IOUT = 30 mA.Gen Note: Output noise is 0.13 ~ 0.23 µV/ Hz at 1 kHz when CN = 0.1 µF.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.



I YBTS tnerruCybdnatS V NI ,V8= FFOtuptuO 1.0 Aµ

I VER tnerruCsaiBesreveR V NI ,V0= V VER FFOtuptuO,V5= 1 05 An

I DNG tnerruCniPDNG I TUO Am05= 1 8.1 Am


I )ESLUP(TUO tnerruCtuptuOesluP %04=elcyCytuD,eslupsm01 002 Am

V TUO egatloVtuptuO V NI V= )PYT(TUO ,V1+ I TUO Am5= 2dna1elbaTeeS V

∆V TUO /∆T erutarepmeT tneiciffeoC 02 C°/mpp


2 51 Vm


I<Am1 TUO Am05< 4 81 Vm




I TUO Am05= 09 061 Vm

I TUO Am001= 041 032 Vm

I TUO Am051=V TUO ≥ V4.2 002 003 Vm

V TUO V4.2< 002 053 Vm

V fer egatloVlanimreTssapyBesioN 62.1 V


I TNOC tnerruClortnoC V TUO ,V6.1= NOtuptuO 01 Aµ




TK716xx

TK716SCL ELECTRICAL CHARACTERISTICS TABLE 1Test Conditions: V

IN = V

OUT(TYP) + 1 V, I

OUT = 5 mA, T

A = 25 °C, unless otherwise specified.

TK716SCLH ELECTRICAL CHARACTERISTICS TABLE 2Test Conditions: V

IN = V

OUT(TYP) + 1 V, I

OUT = 5 mA, T


Output Voltage VOUT(MIN) VOUT(MAX)Voltage Code2.0 V 20 1.940 V 2.060 V2.1 V 21 2.040 V 2.160 V2.2 V 22 2.140 V 2.260 V2.3 V 23 2.240 V 2.360 V2.4 V 24 2.340 V 2.460 V2.5 V 25 2.440 V 2.560 V2.6 V 26 2.540 V 2.660 V2.7 V 27 2.640 V 2.760 V2.8 V 28 2.740 V 2.860 V2.9 V 29 2.840 V 2.960 V3.0 V 30 2.940 V 3.060 V3.1 V 31 3.038 V 3.162 V3.2 V 32 3.136 V 3.264 V3.3 V 33 3.234 V 3.366 V3.4 V 34 3.332 V 3.468 V3.5 V 35 3.430 V 3.570 V

Output Voltage VOUT(MIN) VOUT(MAX)Voltage Code3.6 V 36 3.560 V 3.640 V3.7 V 37 3.660 V 3.740 V3.8 V 38 3.760 V 3.840 V3.9 V 39 3.860 V 3.940 V4.0 V 40 3.960 V 4.040 V4.1 V 41 4.059 V 4.141 V4.2 V 42 4.158 V 4.242 V4.3 V 43 4.247 V 4.343 V4.4 V 44 4.356 V 4.444 V4.5 V 45 4.455 V 4.545 V4.6 V 46 4.554 V 4.646 V4.7 V 47 4.653 V 4.747 V4.8 V 48 4.752 V 4.848 V4.9 V 49 4.851 V 4.949 V5.0 V 50 4.950 V 5.050 V

Output Voltage VOUT(MIN) VOUT(MAX)Voltage Code3.6 V 36 3.528 V 3.672 V3.7 V 37 3.626 V 3.774 V3.8 V 38 3.724 V 3.876 V3.9 V 39 3.822 V 3.978 V4.0 V 40 3.920 V 4.080 V4.1 V 41 4.018 V 4.182 V4.2 V 42 4.116 V 4.284 V4.3 V 43 4.214 V 4.386 V4.4 V 44 4.312 V 4.488 V4.5 V 45 4.410 V 4.590 V4.6 V 46 4.508 V 4.692 V4.7 V 47 4.606 V 4.794 V4.8 V 48 4.704 V 4.896 V4.9 V 49 4.802 V 5.008 V5.0 V 50 4.900 V 5.100 V

Output Voltage VOUT(MIN) VOUT(MAX)Voltage Code2.0 V 20 1.960 V 2.040 V2.1 V 21 2.060 V 2.140 V2.2 V 22 2.160 V 2.240 V2.3 V 23 2.260 V 2.340 V2.4 V 24 2.360 V 2.440 V2.5 V 25 2.460 V 2.540 V2.6 V 26 2.560 V 2.640 V2.7 V 27 2.660 V 2.740 V2.8 V 28 2.760 V 2.840 V2.9 V 29 2.860 V 2.940 V3.0 V 30 2.960 V 3.040 V3.1 V 31 3.060 V 3.140 V3.2 V 32 3.160 V 3.240 V3.3 V 33 3.260 V 3.340 V3.4 V 34 3.360 V 3.440 V3.5 V 35 3.460 V 3.540 V


TK716xx

TK716xxSIL ELECTRICAL CHARACTERISTICSTest conditions: VIN = VOUT(TYP) + 1 V, TA = 25 °C, unless otherwise specified.

Gen Note: Exceeding the “Absolute Maximum Ratings” may damage the device.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.Gen Note: Ripple rejection is @ 60 dB when f = 400 Hz, CL = 10 µF, CN = 0.1 µF, input noise = 100 mVrms, VIN = VOUT(TYP) + 1.5 V and IOUT = 30 mA.Gen Note: Output noise is 0.13 ~ 0.23 µV/ Hz at 1 kHz when CN = 0.1 µF.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.



I YBTS tnerruCybdnatS V NI ,V8= FFOtuptuO 2.0 Aµ

I VER tnerruCsaiBesreveR V NI ,V0= V VER FFOtuptuO,V5= 1 07 An

I DNG tnerruCniPDNG I TUO Am05= 1 0.2 Am


I )ESLUP(TUO tnerruCtuptuOesluP %04=elcyCytuD,eslupsm01 002 Am

V TUO egatloVtuptuO V NI V= )PYT(TUO ,V1+ I TUO Am5= 3elbaTeeS V

∆V TUO /∆T erutarepmeT tneiciffeoC 02 C°/mpp


2 71 Vm

geRdaoL noitalugeRdaoLI<Am1 TUO Am05< 4 02 Vm



I TUO Am05= 09 061 Vm

I TUO Am001= 051 042 Vm

I TUO Am051= 002 013 Vm

V fer egatloVlanimreTssapyBesioN 62.1 V


I TNOC tnerruClortnoC V TUO ,V6.1= NOtuptuO 01 Aµ




TK716xx

TK716SIL ELECTRICAL CHARACTERISTICS TABLE 3Test Conditions: V

IN = V

OUT(TYP) + 1 V, I

OUT = 5 mA, T



Voltage Code

2.4 V 24 2.360 V 2.440 V 2.320 V 2.480 V2.5 V 25 2.460 V 2.540 V 2.420 V 2.580 V2.6 V 26 2.560 V 2.640 V 2.520 V 2.680 V2.7 V 27 2.660 V 2.740 V 2.620 V 2.780 V2.8 V 28 2.760 V 2.840 V 2.720 V 2.880 V2.9 V 29 2.860 V 2.940 V 2.820 V 2.980 V3.0 V 30 2.960 V 3.040 V 3.920 V 3.080 V3.1 V 31 3.060 V 3.140 V 3.020 V 3.180 V3.2 V 32 3.160 V 3.240 V 3.120 V 3.280 V3.3 V 33 3.260 V 3.340 V 3.220 V 3.380 V3.4 V 34 3.360 V 3.440 V 3.320 V 3.480 V3.5 V 35 3.460 V 3.540 V 3.420 V 3.580 V3.6 V 36 3.560 V 3.640 V 3.520 V 3.680 V3.7 V 37 3.660 V 3.740 V 3.620 V 3.780 V3.8 V 38 3.760 V 3.840 V 3.720 V 3.880 V3.9 V 39 3.860 V 3.940 V 3.820 V 3.980 V4.0 V 40 3.960 V 4.040 V 3.920 V 4.090 V4.1 V 41 4.059 V 4.141 V 4.009 V 4.191 V4.2 V 42 4.158 V 4.242 V 4.108 V 4.292 V4.3 V 43 4.257 V 4.343 V 4.197 V 4.893 V4.4 V 44 4.356 V 4.444 V 4.306 V 4.494 V4.5 V 45 4.455 V 4.545 V 4.405 V 4.595 V4.6 V 46 4.554 V 4.646 V 4.504 V 4.496 V4.7 V 47 4.653 V 4.747 V 4.603 V 4.497 V4.8 V 48 4.752 V 4.848 V 4.702 V 4.898 V4.9 V 49 4.851 V 5.049 V 4.801 V 5.099 V5.0 V 50 4.950 V 5.050 V 4.900 V 5.100 V


TK716xx

IRLE

AK

(nA

)

4

REVERSE LEAKAGE CURRENT VS.TEMPERATURE

TA (°C)

0 25 50 75 1000

2

VIN, VCONT FLOATINGVOUT = 5 V SOURCE

3

1

TYPICAL PERFORMANCE CHARACTERISTICS

TEST CIRCUIT

ICONT

CL = 3.3 µF

VCONT

VIN+ +

CIN = 1.0 µF

+

IIN VOUT

IOUTVOUTVIN

CONT

CN = 0.01 µF

GND

NOISE BYPASS

VO

UT

(5

mV

/ DIV

)

LOAD REGULATION

IOUT (mA)

0 50 100 150

VOUT TYPICAL

VO

UT

(V

)

3

5


IOUT (mA)

1

0 150 300

4

2

0

VO

UT

(50

mV

/ DIV

)

LINE REGULATION

VIN (V)

0 10 20

VOUT TYPICAL

VD

RO

P (

mV

)

-100

0


IOUT (mA)

-200

0 100 200

-50

-150

-250

VO

UT

(20

mV

/ DIV

)


VIN (50 MV/DIV)

0 VIN = VOUT

VOUT TYPICAL

IOUT = 150 mA

IOUT = 0 mA IOUT = 25 mA

IOUT is changed by 25 mA step.


TK716xx

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)

I GN

D (

mA

)4

GROUND CURRENT

TA (°C)

2

-50 0 50 1000

IOUT = 60 mA

IOUT = 30 mA

IOUT = 90 mA

VD

RO

P (

mV

) 200

DROPOUT VOLTAGE

TA (°C)

150

-50 0 50 1000

100

50

IOUT = 60 mA

IOUT = 150 mA

IOUT = 1mA

IOUT = 90 mA

IOUT = 30 mA

I CO

NT

(µA

)

5

CONTROL CURRENT

TA (°C)

4

-50 0 50 1000

3

2

1

VCONT = 3.3 V

VCONT = 1.8 V

STANDBY CURRENT VS.INPUT VOLTAGE

VIN (V)

I ST

BY

(A

)

0 10 20

IE-10

IE-9

IE-8

IE-7

IE-11

IE-12

QUIESCENT CURRENT (ON MODE)VS. INPUT VOLTAGE

VIN (V)

I Q (

mA

)

0 10 20

1.0

2.0

0

IOUT = 0 mA

VOUT = 3 V

VOUT = 4 V

VOUT = 5 V


VREV (V)

I RE

V (

A)

0 5 10

IE-12

IE-9

IE-6

IE-3

CONTROL CURRENT (ON MODE)VS. CONTROL PIN VOLTAGE

VCONT(V)

I CO

NT

(µ

A)

0 2.5 5

2.5

5.0

0

IOUT = 0 mA

VOUT

REVERSE BIAS CURRENT VS.TEMPERATURE (VIN = 0 V)

TA (°C)

I RE

V (

A)

0 25 50 75 100

IE-12

IE-9

IE-6

IE-3

I OU

T (

mA

)

340


TA (°C)

-50 0 50 100

260

300

320

280


TK716xx

OUTPUT NOISE DENSITY

f (Hz)

NO

ISE

(µV

/ H

Z)

100 I K 10 K 100 K

1.0

10

0

IOUT = 30 mACL = 2.2 µF

CNP = 0.001 µF

0.1

CNP = 0.01 µF

CNP = 0.1 µF


TIME (2.5 µs/ DIV)

I OU

TV

OU

T

VO

UT

(20

mV

/ DIV

)

CN = 0.01 µF, CL = 2.2 µF

IOUT = 0 to 30 mA

IOUT = 30 to 60 mA

IOUT = 5 to 35 mA

VC

ON

T

OUTPUT VOLTAGE RESPONSE 2(OFF ~ ON)

TIME (µs)

0 200 400 600 800

VO

UT

CN = 1000 pF

CN = 0.1 µF

CN = 0.01 µF

ILOAD = 30 mA, CL = 3.3 µF

VC

ON

T

OUTPUT VOLTAGE RESPONSE 1(OFF ~ ON)

TIME (µs)

0 20 40 60 80

VO

UT

CL = 2.2 µF

CL = 3.3 µF

CL = 10 µF


CL = 4.7 µF


LINE VOLTAGE STEP RESPONSE 1

TIME (50 µs/ DIV)

VIN

VO

UT

CN = 0.01 µF, CL = 2.2 µFVO

UTV

OU

T (

10 m

V/ D

IV)

CN = 0.001 µF, CL = 2.2 µF

VOUT +1 V

VOUT +2 V

LINE VOLTAGE STEP RESPONSE 2

TIME (50 µs/ DIV)

VIN

VO

UT

CN = 0.01 µF, CL = 10 µFVO

UTV

OU

T (

10 m

V/ D

IV)

CN = 0.01 µF, CL = 3.3 µF

VOUT +1 V

VOUT +2 V

NO

ISE

(µV

)

250

NOISE LEVEL VS. CN

CN

1 pF 10 pF 100 pF 1000 pF 0.01 µF 0.1 µF

50

150

200

100

0

CL = 2.2 µF

CL = 3.3 µF

CL = 10 µF

RIPPLE REJECTION

0.01 0.1 1 10 100

f (kHz)

-80

RR

(dB

)

-20

-60

-40

0

-100

IOUT =30 mA

CL = 3.3 µFCN = 0.01 µF

CL = 3.3 µFCN = 0.1 µF

∆VO

UT

/ ∆T

(pp

m)

10

OUTPUT VOLTAGE TEMPERATURECOEFFICIENT

TA (°C)

-50 0 50 100

-30

-10

0

-20

VOUT = 3 V


TK716xx



TIME (2.5 µs/ DIV)

I OU

TV

OU

TVO

UT

(20

mV

/ DIV

)

CN = 0.01 µF, CL = 2.2 µF

IOUT = 60 to 30 mA

IOUT = 30 to 0 mA

IOUT = 35 to 5 mA

CONTROL VOLTAGE VS. TEMPERATURE

TA (°C)

VC

ON

T (

V)

0 25 50 75 100

1.5

2.0

0

1.0

0.5

OUTPUT ON

OUTPUT OFF

SHORT CIRCUIT CURRENT VS. INPUT VOLTAGE

VIN (V)

I OU

T (

mA

)

0 2 4 6 8

300

400

0

200

100VOUT IS CONNECTED TO GND

CONTROL CURRENT VS. TEMPERATURE

TA (°C)

I CO

NT

(µ

A)

0 25 50 75 100

4.0

5.0

0

3.0

2.0

VCONT = 5.0 V

1.0VCONT = 2.0 V

DROPOUT CHARACTERISTICS

VIN (1 V/ DIV)

VO

UT

(0.

5 V

/ DIV

)

IOUT = 80 mA

IOUT = 0 mA

VIN = VOUT

VOUT


IOUT (mA)

I GN

D (

mA

)

0 0.9 40 50 120 160 200

30

40

0

20

10

GROUND CURRENT VS. INPUTSUPPLY VOLTAGE (V OUT = 3.6 V)

VIN (V)

I GN

D (

mA

)

0 1 2 3 4 5

3

4

0

2

1

IOUT= 50 mA

IOUT = 0 mA

GROUND CURRENT VS.TEMPERATURE

TA (°C)

I GN

D (

mA

)

0 25 50 75 100

3

4

0

2

1

IOUT = 80 mA

IOUT = 50 mA

IOUT = 0 mA

I SC

(m

A)

400

INSTANTANEOUS SHORT CIRCUITCURRENT VS. TEMPERATURE

TA (°C)

0 25 50 75 1000

200

VIN = VOUT +1CL = 2.2 µF TANTALUM

300

100


TK716xx








PULSE OUTPUT CURRENT (IOUT (PULSE))

Maximum pulse width 10 ms; duty cycle is 40%: pulse loadonly.


Line regulation is the ability of the regulator to maintain aconstant output voltage as the input voltage changes. Theline regulation is specified as the input voltage is changedfrom VIN = VOUT + 1 V to VIN = VOUT + 6 V.


Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It isa pulsed measurement to minimize temperature effectswith the input voltage set to VIN = VOUT +1 V. The loadregulation is specified under three output current stepconditions of 1 mA to 50 mA, 1 mA to 100 mA and 1 mA to150 mA.




Ground Current is the current which flows through theground pin(s). It is defined as IIN - IOUT, excluding controlcurrent.


Ripple rejection is the ability of the regulator to attenuatethe ripple content of the input voltage at the output. It isspecified with 100 mVrms, 400 Hz superimposed on theinput voltage, where VIN = VOUT + 1.5 V. The outputdecoupling capacitor is set to 10 µF, the noise bypasscapacitor is set to 0.1 µF, and the load current is set to30 mA. Ripple rejection is the ratio of the ripple content ofthe output vs. the input and is expressed in dB.

STANDBY CURRENT (I STBY)

Standby current is the current which flows into the regulatorwhen the output is turned off by the control function(VCONT = 0 V). It is measured with VIN = 8 V.

SENSOR CIRCUITS

Overcurrent Sensor

The overcurrent sensor protects the device if the output isshorted to ground.

Thermal Senso r

The thermal sensor protects the device if the junctiontemperature exceeds the safe value (Tj = 150 °C). Thistemperature rise can be caused by extreme heat, excessivepower dissipation caused by large output voltage drops, orexcessive output current. The regulator will shut off whenthe temperature exceeds the safe value. As the junctiontemperature decreases, the regulator will begin to operateagain. Under sustained fault conditions, the regulatoroutput will oscillate as the device turns off then resets.Damage may occur to the device under extreme faultconditions.




TK716xx



This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23-5 is increased to 500 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23-5 device should be derated at 4.0 mW/ °C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C / PD

PD is the value when the thermal protection circuit isactivated. A simple way to determine PD is to calculate VINx IIN when the output side is shorted. Input current graduallyfalls as temperature rises. You should use the value whenthermal equilibrium is reached.


Procedure:







SOT-23-5 POWER DISSIPATION CURVE

PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

0 50 100 150

TA (°C)

PD

(m

W)

0

100

500MOUNTED AS

SHOWN

FREE AIR

200

300

400


TK716xx


Linear regulators require input and output capacitors in order to maintain regulator loop stability. The recommendedminimum value of the input capacitor is 0.22 µF. The output capacitor should be selected within the Equivalent SeriesResistance (ESR) range as shown in the graphs below for stable operation. When a ceramic capacitor is connected inparallel with the output capacitor, a maximum of 1000 pF is recommended. This is because the ceramic capacitor'selectrical characteristics (capacitance and ESR) vary widely over temperature. If a large ceramic capacitor is used, aresistor should be connected in series with it to bring it into the stable operating area shown in the graphs below. Minimumresistance should be added to maintain load and line transient response.

Note: It is very important to check the selected manufacturers electrical characteristics (capacitance and ESR) overtemperature.


TK716xxS

CL

ESR

100

10

1

0.1

0 .01

1 50 100 150

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

100

10

1

0.1

0 .01

1 50 100 150

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

100

10

1

0.1

0 .01

1 50 100 150

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA

100

10

1

0.1

0 .01

1 50 100 150

IOUT (mA)

ES

R (

Ω)

STABLEOPERATION

AREA


TK716xxS

CL

ESR

Note: It is not necessary to connect a ceramic capacitor in parallelwith an aluminum or tantalum output capacitor.


TK716xx


BOARD LAYOUT




ESRCapacitance

AluminumCapacitor

TantalumCapacitor

CeramicCapacitor

1.0 µF 2.4 Ω 2.3 Ω 0.140 Ω

2.2 µF 2.0 Ω 1.9 Ω 0.059 Ω

3.3 µF 4.6 Ω 1.0 Ω 0.049 Ω

10 µF 1.4 Ω 0.5 Ω 0.025 Ω

+

NOISEBYPASS

CONTROL

VIN VOUT

+

GND


TK716xx

REVERSE BIAS PROTECTION

The internal reverse bias protection eliminates therequirement for a reverse voltage protection diode. Thissaves both cost and board space.

Another reverse bias protection technique is illustratedbelow. The extra diode and extra capacitor are notnecessary with the TK716xx. The high output voltageaccuracy is maintained because the diode forward voltagevariations over temperature and load current have beeneliminated.

HIGH-SIDE SWITCHING

High-side switching should not be implemented by anexternal transistor as shown below. This results in additionalvoltage drop and loss of accuracy.

TK716xxSVOUTVIN

GND


The high output voltage accuracy and low dropout voltageare maintained when the IC is turned ON/OFF by using thecontrol pin as illustrated below.

High-side switching with a FET is illustrated below. Batterylife is extended by the dropout voltage of the FET when theinput of the TK716xx is connected in front of the FETswitch.

VOLTAGE BACKUP OPERATION (HOLDUP TIME )

CL becomes the backup power supply when themicroprocessor is reset with the voltage detector ICsimultaneously with the turning OFF the TK716xx. CLprovides the holdup time necessary to do an orderlyshutdown of the microprocessor.

TK716xxSVOUTVIN

ON/OFFCONTROL

VOUTVOLTAGEREGULATOR

VDROP

TK716xxSVOUT

VIN

GND

µ PRO

VCONT

VIN

TK716xxSVOUT

VIN

GND

VOLTAGEDETECTOR IC

VCONT OFF

µ PRO

RESETCL

716xxVOUT

VIN

VCONT

FET SWITCHING OUTPUT


TK716xx

PARALLEL ON/OFF CONTROL

The figure below illustrates multiple regulators beingcontrolled by a single ON/OFF control signal. The seriesresistor R is put in the input line of the low output voltageregulator in order to prevent overdissipation. The voltagedropped across the resistor reduces the large input-to-output voltage across the regulator, reducing the powerdissipation in the device.

SWITCHING OPERATION

Even though the input voltages or the output voltages aredifferent, the outputs of the TK716xx regulators can beconnected together, and the output voltages switched. Iftwo or more TK716xx regulators are turned ONsimultaneously, the highest output voltage will be present.

The outputs of the TK716xx regulator and a CMOS regulatorcan be connected together as long as the output voltage ofthe TK716xx is greater than the CMOS regulator. Whenthe TK716xx is OFF, the CMOS regulator is turned ON.When the TK716xx is ON, the CMOS regulator is turnedOFF.


TK716505 V

VIN

TK71630

TK71620

3 V

2 V

ON/OFF CONTROL

R

TK71630VIN

TK71628VIN VOUT

3.0 OR 2.8 V

ON/OFF LOGIC

VCONT

VCONT

CURRENT BOOST OPERATION

The output current can be increased by connecting anexternal PNP transistor as shown below. The outputcurrent capability depends upon the Hfe of the externaltransistor. Note: The TK716xx internal short circuitprotection and thermal sensor do not protect the externaltransistor.

TK716xxVIN

CMOSREGULATOR

VOUT

ON/OFF LOGIC

TK716xx

VINVOUT

VCONT

0.22 µF

150 Ω

VIN


TK716xx

0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.4

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0.

15-

0.05


+0.15 -0.05

Marking Information

Part Number MarkingTK71620 L20TK71621 L21TK71622 L22TK71623 L23TK71624 L24TK71625 L25TK71626 L26TK71627 L27TK71628 L28TK71629 L29TK71630 L30TK71631 L31TK71632 L32TK71633 L33TK71634 L34TK71635 L35TK71636 L36TK71637 L37TK71638 L38TK71639 L39TK71640 L40TK71641 L41TK71642 L42TK71643 L43TK71644 L44TK71645 L45TK71646 L46TK71647 L47TK71648 L48TK71649 L49TK71650 L50

SOT-23-5

PACKAGE OUTLINE




IC-216-TK716xx0798O0.0K








TK732xx

CPULSE

CONTROL

GND

BASE

NOISEBYPASS

VSENSE

IPKVIN

TK732xx

01S

FEATURES Up to 5 A Output Current Capability With External

PNP Transistor

Internal Short Circuit Protection

Excellent Load Regulation

CMOS/TTL-Compatible On/Off Switch

Internal Reverse Bias Current Protection Switch


Broad Operating Voltage Range

High Impedance V SENSE Pin (Off Mode)

Continuous and Pulsed Current Modes


Cellular/Cordless Telephones


Wireless Communications Systems

Portable Instrumentations

Portable Computers

Personal Digital Assistants

Local Area Network (LAN) Receivers

Lithium Ion Battery Chargers

Power Recovery for Microprocessors

VOLTAGE CODE20 = 2.0 V * 32 = 3.2 V 44 = 4.4 V21 = 2.1 V * 33 = 3.3 V 45 = 4.5 V22 = 2.2 V * 34 = 3.4 V 46 = 4.6 V23 = 2.3 V * 35 = 3.5 V 47 = 4.7 V24 = 2.4 V 36 = 3.6 V 48 = 4.8 V25 = 2.5 V 37 = 3.7 V 49 = 4.9 V26 = 2.6 V 38 = 3.8 V 50 = 5.0 V27 = 2.7 V 39 = 3.9 V 55 = 5.5 V *28 = 2.8 V 40 = 4.0 V 70 = 7.0 V *29 = 2.9 V 41 = 4.1 V 80 = 8.0 V30 = 3.0 V 42 = 4.2 V 11 = 11.0 V31 = 3.1 V 43 = 4.3 V

TK732 M L


Tape/Reel Code


TEMP. RANGEC: -30 to 80 C **I : -40 to 85 C

Temp. CodePackage CodeVoltage Code

Grade

* Unavailable with I Rank** unless Otherwise Specified*** TK73241MCLH, TK73242MCLH Available Only

PACKAGE CODEM: SOT-23L-8

GRADENone: Standard 2%H: High (Special) ***

BLOCK DIAGRAM

DESCRIPTION

The TK732xx is a controller IC for a low dropout voltageregulator. The TK732xx and the external PNP powertransistor provide standard output voltages from 2 to 11 Vand output current from 100 mA to 5 A. By utilizing anexternal PNP power transistor, low dropout voltage at highcurrent can be readily achieved. The internal electronicswitch can be controlled by TTL or CMOS logic levels. Thedevice is in the “on” state when the control pin is pulled toa high logic level. A pin for a bypass capacitor, whichconnects to the internal circuitry, is provided to lower theoverall output noise level.

The current limit characteristics can be configured ascontinuous (constant current) or pulsed (cycling). An internalthermal shutdown circuit limits the junction temperaturesto below 150 °C. In the “off” mode, the output of theregulator becomes a high impedance. This prevents theoutput capacitor from being rapidly discharged for backupto the load.

CONTROL

NOISE BYPASS

VIN

THERMALSENSOR

ON/OFFCIRCUIT

BANDGAPREFERENCE

LEAKAGEPROTECTION

IPK CPULSE BASE VSENSE

GND



TK732xx

ABSOLUTE MAXIMUM RATINGS (STANDARD DEVICES) (NOTE 6)Supply Voltage Range ............................................ 19 VPower Dissipation (Note 1) ................................ 600 mWReverse Bias Voltage Range ..................................... 6 VNoise Bypass Pin Terminal Voltage Range ............... 5 VControl Pin Terminal Voltage Range........................ 14 VStorage Temperature Range ................... -55 to +150 °C

Operating Temperature Range ................... -30 to +80 °CExtended Temperature Range ................... -40 to +85 °COperating Voltage Range............................ 1.8 to 14.0 VJunction Temperature ........................................... 150 °CLead Soldering Temperature (10 s) ...................... 235 °C

TK732xx ELECTRICAL CHARACTERISTICS (STANDARD DEVICES)Test conditions: VIN = VOUT(TYP) + 1 V, TA = 25 °C, unless otherwise specified.




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TK732xx

TK732xx ELECTRICAL CHARACTERISTICS TABLE 1 (STANDARD DEVICES)Test Conditions: V

IN = V

OUT(TYP) + 1 V, I

OUT = 30 mA, T


TK732xx ELECTRICAL CHARACTERISTICS (STANDARD DEVICES) CONT.

2.0 V 20 1.940 V 2.060 V2.1 V 21 2.040 V 2.160 V2.2 V 22 2.140 V 2.260 V2.3 V 23 2.240 V 2.360 V2.4 V 24 2.340 V 2.460 V 2.300 V 2.500 V2.5 V 25 2.440 V 2.560 V 2.400 V 2.600 V2.6 V 26 2.540 V 2.660 V 2.500 V 2.700 V2.7 V 27 2.640 V 2.760 V 2.600 V 2.800 V2.8 V 28 2.740 V 2.860 V 2.700 V 2.900 V2.9 V 29 2.840 V 2.960 V 2.800 V 3.000 V3.0 V 30 2.940 V 3.060 V 2.900 V 3.100 V3.1 V 31 3.040 V 3.160 V 3.000 V 3.200 V3.2 V 32 3.140 V 3.260 V 3.095 V 3.305 V3.3 V 33 3.240 V 3.360 V 3.190 V 3.410 V3.4 V 34 3.335 V 3.465 V 3.290 V 3.510 V3.5 V 35 3.435 V 3.565 V 3.385 V 3.615 V3.6 V 36 3.535 V 3.665 V 3.485 V 3.720 V3.7 V 37 3.630 V 3.770 V 3.580 V 3.820 V3.8 V 38 3.725 V 3.875 V 3.675 V 3.925 V3.9 V 39 3.825 V 3.975 V 3.770 V 4.030 V4.0 V 40 3.920 V 4.080 V 3.870 V 4.130 V4.1 V 41 4.020 V 4.180 V 3.965 V 4.235 V4.2 V 42 4.120 V 4.280 V 4.060 V 4.335 V4.3 V 43 4.215 V 4.385 V 4.160 V 4.440 V4.4 V 44 4.315 V 4.485 V 4.255 V 4.545 V4.5 V 45 4.410 V 4.590 V 4.350 V 4.645 V4.6 V 46 4.510 V 4.690 V 4.450 V 4.750 V4.7 V 47 4.605 V 4.795 V 4.545 V 4.850 V4.8 V 48 4.705 V 4.895 V 4.640 V 4.955 V4.9 V 49 4.800 V 5.000 V 4.740 V 5.060 V5.0 V 50 4.900 V 5.100 V 4.835 V 5.165 V5.5 V 55 5.390 V 5.610 V7.0 V 70 6.860 V 7.140 V6.0 V 80 7.840 V 8.160 V 7.745 V 8.265 V11.0 V 11 10.78 V 11.22 V 10.650 V 11.365 V

Note 1: Power dissipation is 600 mW when mounted as recommended. Derate at 4.8 mW/°C for operation above 25 °C.Note 2: Refer to :Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: This pin is used for Pulse Current Limit Mode. When selecting Continuous Current Limit Mode, this pin is connected to GND.Note 5: Not applicable for VOUT > 4.8 V.Note 6: The voltage applied to any pin must be greater than -0.4 V.Gen. Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.

Room Temp. Range (TA = 25 °C) Full Temp. Range (TA = -40 to +85 °C) (Applies to "I" Rank Only)

Output Voltage Voltage Code VOUT(MIN) VOUT(MAX) VOUT(MIN) VOUT(MAX)


TK732xx

ABSOLUTE MAXIMUM RATINGS (SPECIAL DEVICES) (Note 6)Supply Voltage Range ............................................ 19 VPower Dissipation (Note 1) ................................ 600 mWReverse Bias Voltage Range ..................................... 6 VNoise Bypass Pin Terminal Voltage Range ............... 5 VControl Pin Terminal Voltage Range........................ 14 V

Storage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -10 to +60 °COperating Voltage Range............................ 1.8 to 14.5 VJunction Temperature ........................................... 150 °CLead Soldering Temperature (10 s) ...................... 235 °C

TK73241MCLH, TK73242MCLH ELECTRICAL CHARACTERISTICSTest conditions: VIN = VOUT(TYP) + 1 V, TA = 25 °C, unless otherwise specified.




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edoMtimiLtnerruCesluP 57 09 501 Vm

RR noitcejeRelppiR

C,zH004=f L ,Fµ01=CN V,Fµ1.0= NI V= )PYT(TUO ,V5.1=I TUO V,Am03= ELPPIR ,smrVm001=

)3etoN(

75 Bd

V ON esioNtuptuO,zHk03otzH004=FPB,zHk1=f

)3etoN(31.0 zH/Vµ

I ESLUP C ESLUP tnerruClanimreTniP )4etoN( 51 52 54 Aµ

∆V TUO /∆T tneiciffeoCerutarepmeT 02 C°/mpp



I TNOC tnerruClortnoC V TNOC NOtuptuO,V8.1= 5.6 02 A




TK732xx

TK73241MCLH, TK73242MCLH ELECTRICAL CHARACTERISTICS CONT.

TK73241MCLH, TK73242MCLH ELECTRICAL CHARACTERISTICS TABLE 2Test Conditions: V

IN = V

OUT(TYP) + 1 V, I

OUT = 30 mA, T


Room Temp. Range (TA = 25 °C) Full Temp. Range (TA = -10 to +60 °C)Output Voltage Voltage Code VOUT(MIN) VOUT(MAX) VOUT(MIN) VOUT(MAX)

4.1 V 41 4.067 V 4.133 V 4.050 V 4.150 V4.2 V 42 4.167 V 4.233 V 4.150 V 4.250 V

Note 1: Power dissipation is 600 mW when mounted as recommended. Derate at 4.8 mW/°C for operation above 25 °C.Note 2: Refer to “Definition of Terms.”Note 3: Ripple rejection and noise voltage are affected by the value and characteristics of the capacitor used.Note 4: This pin is used for Pulse Current Limit Mode. When selecting Continuous Current Limit Mode, this pin is connected to GND.Note 5: Not applicable for VOUT > 4.8 V.Note 6: The voltage applied to any pin must be greater than -0.4 V.Gen. Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.


TK732xx

CP CN

VIN

RIPKCONT

CL

COLLECTOR

BASEEMITTER

RP

CIN

VOUT

TK732xx

EXTERNALTRANSISTOR

TYPICAL PERFORMANCE CHARACTERISTICSTA = 25 °C, external transistor is 2SB1115(NEC), unless otherwise specified.

TEST CIRCUIT

VO

UT

(50

mV

/ DIV

)

LINE REGULATION 1

VIN (V)

0 10 20

VO

UT

(10

mV

/ DIV

)

LINE REGULATION 2

VIN (V)

0 10 20

VO

UT

(5

mV

/ DIV

)

LOAD REGULATION

IOUT (mA)

0 500 1000

VOUT TYPICAL

I Q (

mA

)

3

5

QUIESCENT CURRENT VS.OUTPUT VOLTAGE

VIN (V)

1

0 10 20

4

2

0

VOUT = 3.0 V

VOUT = 5.0 V

VD

RO

P (

mV

)

-200

0

DROPOUT VOLTAGE VS.OUTPUT VOLTAGE

IOUT (mA)

-400

0 500 1000

-100

-300

2SB799

2SB1115

2SB1114

2SB1302 I GN

D (

mA

)

3

5

GROUND CURRENT VS.OUTPUT VOLTAGE

IOUT (mA)

1

0 500 1000

4

2

0

Note:Transistor: 2SB1115CN = 0.1 µFCP = 0.1 µFCL = 4.7 µFRP = 330 kContinuous Current Limit Mode:ISET (mA) = 100 mV / RIPK (Ω)Pulse Current Limit Mode:ISET (mA) = 90 mV / RIPK (Ω)


TK732xx

∆V (

mV

) 100

CURRENT LIMIT DETECTOR VOLTAGEVS. INPUT VOLTAGE

VIN (V)

50

0 5 10 15

CONTINUOUS CURRENTLIMIT MODE

PULSE CURRENTLIMIT MODE

I B (

mA

) 100

BASE CURRENT DRIVE VS.INPUT VOLTAGE

VIN (V)

50

0 5 10 15

I RE

V (

A)

1E-6

REVERSE BIAS CURRENT(VIN = 0 TO 6 V)

VREV (V)

1E-120 5 10

1E-9VIN = 0 V

VIN = 6 V

VIN = 4 V

VIN = 2 V

I Q (

A)

1E-6

QUIESCENT CURRENT VS.INPUT VOLTAGE (OFF MODE)

VIN (V)

1E-120 10 20

1E-9

RIPPLE REJECTION

0.01 0.1 1 10 100

f (kHz)

-80

RR

(dB

)

-20

-60

-40

0

-100

CN = 0.01 µF

CN = 0.1 µF

CN = NONE

I CO

NT

(µA

)

50

CONTROL CURRENT VS. TEMPERATURE

TA (°C)

-50 0 50 100

20

40

30

10

0

VCONT = 5 V

VCONT = 2 V

VO

UT

(m

V)

50

OUTPUT VOLTAGE VARIATION VS.TEMPERATURE

TA (°C)

-50 0 50 100

-10

30

10

-30

-50

VOUT TYPICAL

732xx

CL4.7 µF

VOUTVIN

RCONT

VCONT

CN


VC

ON

T (

V)

2.0

CONTROL VOLTAGE (OUTPUT ONPOINT) VS. TEMPERATURE

TA (°C)

-50 0 50 100

1.0

RCONT = 0 Ω

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)TA = 25 °C, external transistor is 2SB1115(NEC), unless otherwise specified.


TK732xx

VC

ON

T (

V)

50

CONTROL PIN VOLTAGE VS.CONTROL CURRENT

ICONT (µA)

-50 0 50 100

20

40

30

10

0

RCONT = 0 k

RCONT = 200 k

VOUT

RCONT = 100 k

VO

UT

ON/OFF STEP RESPONSE

TIME (µs)

0 10 20 30

CL = 4.7 µFCN = NONE

ON/OFF CONTROL

VO

UT

(20

0 m

V/ D

IV)


TIME (µs)

0 5 10 15 20

IOUT = 0 TO 300 mA

CL = 4.7 µF

CL = 10 µF

CL = 47 OR 100 µF

CL = 22 µF

VO

UT

(20

mV

/ DIV

)

LINE CURRENT STEP RESPONSE

TIME (µs)

CN = 0.1 µF

IOUT = 50 mA

CN = NONE

VOUT + 2 V

VOUT + 1 V

VO

UT

VIN

RIS

E T

IME

(µ

s)

ON/OFF TRANSIENT

CN (µF)

100

5000

100.001 0.01 0.1 10

1000

CL = 100 µF

CL = 4.7 µF OR 10 µFCL = 22 µF

CL = 4.7 µF

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)TA = 25 °C, external transistor is 2SB1115(NEC), unless otherwise specified.


TK732xx





The dropout voltage is the difference between the inputvoltage and the output voltage at which point the regulatorstarts to fall out of regulation. Below this value, the outputvoltage will fall as the input voltage is reduced. It isdependent upon the load current, the external transistorand the junction temperature.

BASE CONTROL CURRENT (I BASE)

The base control current is the drive current for the base ofthe external transistor.

OUTPUT CURRENT (IOUT)

The output current depends on the characteristics of theexternal transistor and current limit setting.




Load regulation is the ability of the regulator to maintain aconstant output voltage as the load current changes. It isa pulsed measurement to minimize temperature effects.Load regulation depends on the external transistor.


The quiescent current is the current which flows throughthe ground terminal under no load conditions (IOUT = 0 mA)and excludes the control pin current.




Ripple rejection is the ability of the regulator to attenuatethe ripple content of the input voltage at the output. It isspecified with 100 mVrms, 400 Hz superimposed on theinput voltage, where VIN = VOUT(TYP) + 1.5 V. The outputdecoupling capacitor is set to 10 µF, the noise bypasscapacitor is set to 0.1 µF, and the load current is set to30 mA. Ripple rejection is the ratio of the ripple content ofthe output vs. the input and is expressed in dB.


Standby current is the current which flows into the regulatorwhen the output is turned off by the control function(VCONT = 0 V). It is measured with VIN = 8 V (9 V for the8 V output device).

REMOTE SENSING (VSENSE)

The VSENSE pin is the output voltage sensing pin. If thevoltage drop to the load caused by the PCB etch resistancecannot be disregarded, the voltage drop can becompensated by connecting the VSENSE pin as shownbelow.

The length of the VSENSE etch should be limited to 30 cm(11.8 in.) maximum.

COLLECTOR

VOUT

EMITTER BASE

RIPKCL

EXTERNALTRANSISTOR

TK732XX


TK732xx

deliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C / PD



Procedure:

1) Find PD2) PD1 is taken to be PD x (Note: It is not necessary to connect

a ceramic capacitor in parallel with an aluminum or tantalum output

capacitor. (~0.8 - 0.9)

SENSOR CIRCUITS

Overcurrent Sensor

The overcurrent sensor protects the device if the output isshorted to ground.

Thermal Sensor

The thermal sensor protects the device if the junctiontemperature exceeds the safe value (Tj = 150 °C). Thistemperature rise can be caused by extreme heat, excessivepower dissipation caused by large output voltage drops, orexcessive output current. The regulator will shut off whenthe temperature exceeds the safe value. As the junctiontemperature decreases, the regulator will begin to operateagain. Under sustained fault conditions, the regulatoroutput will oscillate as the device turns off then resets.Damage may occur to the device under extreme faultconditions.




This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23L-8 is increased to 600 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23L-8 device should be derated at 4.8 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB and


PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4


TK732xx

3) Plot PD1 against 25 °C4) Connect PD1 to the point corresponding to the 150 °C






SOT-23L-8 POWER DISSIPATION CURVE

VIN

RIPK

CONTROL

GND

GND

VOUT

DEFINITIONS AND TERMS (CONT.)

0 50 100 150

TA (°C)

PD

(m

W)

0

450

750

150

300

600 MOUNTED ASSHOWN

FREE AIR


The output capacitor is necessary for stable operation.The regulator may oscillate if the output capacitor is toosmall or missing. The output capacitor size is determinedby load, transient response and external transistor used.Evaluation in the circuit is recommended to ensureperformance requirements are satisfied. A minimum of 4.7µF is necessary for stability, with twice that valuerecommended. The minimum recommended inputcapacitor is 1 µF. Problems do not occur with larger valuesof capacitance. However, extremely low ESR may result inunstable operation. Thus, the use of large value ceramiccapacitors is not recommended on the output.

BOARD LAYOUT

SOT-23L-8 BOARD LAYOUT



TK732xx

PULSE CURRENT LIMIT MODE

The equation for the pulse output current limit is as follows:

ISET (mA) = 90 (mV) / RIPK (Ω)

During the initial turn-on, charge (surge) current flows tothe output capacitor. This IC has a possibility for thecurrent limit to operate and to turn off the output by thecharge current of the output capacitor. Therefore, therelationship between CL and CP is set as shown in thegraph below:

CP CN

VIN

COLLECTOR

BASEEMITTER

RP330 k

VOUT

VCONT

CL

RIPK

CIN

GND

EXTERNALTRANSISTOR

TK732xx


CL

(µF

)

CP (µF)

100

1000

10

100.10.01

STABLE REGION

11

VOUT

IOUT

CONTINUOUS CURRENT LIMIT MODE

In the continuous current limit mode, the CPULSE

pin (pin 3)is directly connected to ground. The output current limit isset by R

IPK according to the following equation:


If the continuous current limit mode is also used for outputshort circuit protection, the ISET value is set 50% to 100%more than the maximum operating current. The currenttransistor is selected from the ISET value. The outputvoltage drops when the output current exceeds the ISETvalue. However, the output voltage returns to normal oncethe output current decreases below the ISET value.

CN

VIN

COLLECTOR

BASEEMITTER

VOUT

VCONT

CL

CIN

CONT

RIPK

GND

EXTERNALTRANSISTOR

TK732xx


TK732xx

EXTERNAL PNP POWER TRANSISTOR

This IC can use any kind of external transistor. The external transistor selection is a function of the load current, Hfe andpower dissipation. See following chart:

HIGH-SIDE SWITCHING

High-side switching should not be implemented by an external transistor as shown above. This results in additionalvoltage drop and loss of accuracy.

The high output voltage accuracy and low dropout voltage are maintained when the IC is turned ON/OFF by using thecontrol pin as illustrated above.

LOAD CURRENT RECOMMENDED EXTERNAL TRANSISTOR RECOMMENDED R IPK (Ω)

0 ~ 180 mA 2SB624, 2SB1115, 2SB799 (NEC), 2SB970 (Matushita) 0.33 ~ 0.39

0 ~ 300 mA 2SB1115, 2SB799 (NEC) 0.22 ~ 0.27

0 ~ 500 mA2SB1114, 2SB1115 (NEC), 2SB1302 (Sanyo), 2SA1203,2SA1213, 2SA1734 (Toshiba)

0.12 ~ 0.15

0 ~ 1 A 2SA1242, 2SA1736 (Toshiba), 2SB1302, 2SA1896 (Sanyo) 0.056 ~ 0.068

0 ~ 2 A 2SA1451, 2SA1242 (Toshiba) 0.033 ~ 0.039

0 ~ 3 A 2SA1451 (Toshiba), 2SA1645 (NEC) 0.022 ~ 0.027

0 ~ 4 A 2SA1451 (Toshiba), 2SB904 (Sanyo), 2SA1645 (NEC) 0.012 ~ 0.015


ON/OFFCONTROL

VOUTVOLTAGEREGULATOR

VDROP

TK732xx

VOUTVIN

VCONT

µ PRO


TK732xx

VOLTAGE BACKUP OPERATION (HOLDUP TIME)

CL becomes the backup power supply when themicroprocessor is reset with the voltage detector ICsimultaneously with turning OFF the TK732xx. CL providesthe holdup time necessary to do an orderly shutdown of themicroprocessor.

PARALLEL ON/OFF CONTROL OPERATION

The figure above illustrates multiple regulators beingcontrolled by a single ON/OFF control signal. The seriesresistor R is put in the input line of the low output voltageregulator in order to prevent overdissipation. The voltagedropped across the resistor reduces the large input-to-output voltage across the regulator, reducing the powerdissipation in the device.


OUTPUT VOLTAGE ADJUST

When a highly accurate output voltage is necessary, theoutput can be adjusted. As shown above, higher outputresolution can be achieved by putting a resistor (RADJ) inthe VSENSE pin in parallel with a 1000 pF capacitor. A valueof 2 K provides an adjustment of 50 mV typically. Note:using this technique, the output voltage can only beadjusted higher.

BATTERY CHARGER

Continuous Current Limit Mode:


732xx

VOUT

VIN

VCONT OFF

VOLTAGEDETECTOR

IC

µ PRO

RESETCL

2 V100 mA

TK732xx5 V5 A

VIN

ON/OFFCONTROL

3 V100 mATK11230B

TK11220B

R

TK732xx

VOUT

VIN

VCONT

VSENSE

RADJ

1000 pF

VCONT

VIN

COLLECTOR

BASEEMITTER

CL

RIPK

CONT

VADJ

LOAD

VOLTAGE DETECTORCIRCUIT

ORMICROPROCESSOR

BA

TT

ER

Y

REMOTESENSING

CURRENTLIMIT

SENSING

CONT

VSENSE

VOUT

EXTERNALTRANSISTOR

TK732XX


TK732xx

ISET (Continuous Current Limit Mode) is set to the desiredcharging current.

LITHIUM ION BATTERY CHARGER WITHOVERDISSIPATION PROTECTION OF EXTERNALTRANSISTOR (SHORT CIRCUIT MODE)

(RECOMMENDED WITH TK732xxMCLH)

During normal operation, Tr1 is turned ON, connecting pin3 (CPULSE) to ground. This provides the continuous currentlimit mode for normal operating conditions. During a short

CHARGING CHARACTERISTICS

IOUT

FINISH CHARGE

SET CHARGING CURRENT

VO

UT

4.1 V


VIN

COLLECTOR

BASEEMITTER

CL

RIPK

Tr1

LOAD

R

CONT

BA

TT

ER

Y

VOUT

EXTERNALTRANSISTOR

TK732xx

circuit condition, Tr1 is turned “off.” This converts the circuitinto the pulse current limit mode of operation, reducing thepower dissipation in the pass transistor. The transitionbetween the continuous and pulse current limit modes canbe controlled by adjusting the operating point of Tr1 by thevalue of resistor R.


TK732xx

Marking InformationProduct Code C

Voltage CodeTK73220 20TK73221 21TK73222 22TK73223 23TK73224 24TK73225 25TK73226 26TK73227 27TK73228 28TK73229 29TK73230 30TK73231 31TK73232 32TK73233 33TK73234 34TK73235 35TK73236 36TK73237 37TK73238 38TK73239 39TK73240 40TK73241 41TK73242 42TK73243 43TK73244 44TK73245 45TK73246 46TK73247 47TK73248 48TK73249 49TK73250 50TK73255 55TK73270 70TK73280 80TK73211 11

0.8

0.8

3.3

0.4

2.2

(0.3

)

1.2

0.15

0.3

1.0

3.0

e 1


5

1

0 -

0.1

15

max

e

4

e

8

0.1

Çl0.1

0.45

1.4m

ax

(3.4)

3.5

marking



+0.3- 0.1

+0.

15-

0.15

+ 0.3

SOT-23L-8

PACKAGE OUTLINE











DC-DC Converters

Select product from the list below to get detailed information.

Part Number Input Voltage Output Voltage OutputCurrent

Package Features

TK11811M 0.6 to 14V 1.9V or 2.8V 10 mA SOT-23L Low startup voltage

TK11812M 0.6 to 6V1.5 to 15VAdjustable

35mA SOT-23L Low startup voltage

TK11816M1.1 to 6V1.1 to 10V

7.2V12.8V

6.7mA8.0mA

SOT-23LBuilt in rectifier

Few external parts

TK11817M1.1 to 8V1.1 to 15V

9.3V16.8V

6.2mA7.0mA


Few external parts

TK11818M 1.1 to 18V20.4V28.0V

6.0mA5.0mA


Few external parts

TK11819M 1.1 to 18V24.0V32.0V

5.0mA4.0mA


Few external parts

TK11822M 1 to 5V 7.4V 430µA SOT-23LLow noise sine wave

oscillator

TK11823M 1 to 5V 13.9V 250µA SOT-23LLow noise sine wave

oscillator

TK11830M 2.5 to 15V-0.5 to -12.5V

Adjustable100mA SOT-23L

Regulated negative voltageoutput

TK65127 0.9 to 1.6V 2.56 to 2.70 SOT-23 3 Guaranteed 0.9V Operation




TK11811

GND

T

OSC VOUT

VrefOSCILLATOR

VIN FB

+

-

BLOCK DIAGRAM

DESCRIPTION

The TK11811 is a low power, low input voltage DC-DCconverter.

This device can be optimized for use in high or low currentapplications through component selection. The outputvoltage is selectable for 1.9 or 2.8 V operation and can betrimmed to any voltage in between.

The frequency of the built-in relaxation oscillator is set byexternal components. The internal voltage regulatorprovides a stable output voltage. Optimized Toko inductorcomponents are available.


FEATURES Miniature Package (SOT-23L)

Low Start-up Voltage [0.6 V (typ.)]

Few External Components

Selectable Output Voltage (1.9 V or 2.8 V)

High and Low Current Optimized Designs

APPLICATIONS Pagers

Cassette Recorders

Cordless Telephones



Mobile Radios

Battery Operated Equipment


TK11811

20P FB

VOUT

T

OSC

GND

VIN



Tape/Reel Code

TK11811M

DC-DC CONVERTER


TK11811

TK11811 ELECTRICAL CHARACTERISTICSTest Conditions: TA = 25 °C, VOUT = 2.9 V (VOUT to T open), unless otherwise specified.

ABSOLUTE MAXIMUM RATINGS

Note 1: Power dissipation is 400 mW when mounted as recommended. Derate at 3.2 mW/°C for operation above 25 °C. Power dissipation is200 mW when in Free Air. Derate at 1.6 mW/°C for operation above 25 °C.

Note 2: This IC is a frequency-controlled DC-DC converter; thus the value is varied by condition.

Input Voltage ............................................................ 16 VPower Dissipation (Note 1) ................................ 200 mWJunction Temperature ........................................... 150 °C



V NI egnaRegatloVylppuS 6.0 41 V

V TRATS egatloVpu-tratS I TUO Am0= 6.0 57.0 V

I NI tnerruCtupnIV NI I,V1.1= TUO Am3= 0.11 Am

V NI I,V4.1= TUO Am3= 3.8 Am

V TUO egatloVtuptuOV NI I,V1.1= TUO Am3= 58.2 V

V NI I,V4.1= TUO Am3= 07.2 58.2 0.3 V

V )WOL(TUO )WOL(egatloVtuptuOV NI I,V1.1= TUO ,Am3=

VotT TUO detcennoc57.1 09.1 50.2 V

I TUO tnerruCtuptuOV NI V1.1= 0.4 5.4 Am

V NI V4.1= 0.6 8.6 Am

geReniL noitalugeReniL I TUO V1.1,Am3= ≤ V NI ≤ V0.2 01 Vm

geRdaoL noitalugeRdaoL V NI Am5.0,V1.1= ≤ I TUO ≤ Am3 54 Vm

FFE ycneiciffE V NI I,V4.1= TUO Am3= 36 27 %

F CSO ycneuqerFrotallicsO V NI I,V4.1= TUO )2etoN(,Am3= 003 zHk

∆V TUO /∆T tneiciffeoCerutarepmeT V NI I,V4.1= TUO Am3= 7.0 C°/Vm


TK11811

VIN

R110 KΩ VIN

FB

OSCDiR222 KΩ

C2 3300 pF13

4 6

LC1

10 µF

+

C310 µF

VOUT

VOUT

GND

T

+

TYPICAL PERFORMANCE CHARACTERISTICSTA = 25°C, unless otherwise specified.

OUTPUT VOLTAGE VS. OUTPUTCURRENT (VOUT = 1.9 V)

0 2 4 6 8 10

IOUT (mA)

0

VO

UT

(V

)

1.0

2.5

2.0

1.5

.5

1.6 V

1.4 V

1.2 V

1.0 V

0.8 V

VIN = 0.6 V

OUTPUT VOLTAGE VS. OUTPUT CURRENT (VOUT = 2.8 V, ILOAD = 0 mA)

.5 5 10

IOUT (mA)

0

VO

UT

(V

)

2

5

4

3

1

VIN = 0.6 V

0.8 V

1.0 V

1.2 V1.4 V

1.6 V

INPUT CURRENT VS. INPUT VOLTAGE (IOUT = 0 mA)

0 10 20

VIN (V)

I IN (

µA

)

100

200 VOUT = 2.8 V

VOUT = 1.9 V

EF

F (

%)

50

100

EFFICIENCY VS. OUTPUT CURRENT(VOUT = 1.9 V)

0 5 10

IOUT (mA)

0

1.6 V

1.4 V1.2 V

1.0 V

0.8 V

VIN = 0.6 V

EF

F (

%)

50

100

EFFICIENCY VS. OUTPUT CURRENT (VOUT = 2.8 V)

0 5 10

IOUT (mA)

0

0.8 V

1.0 V

VIN = 0.6 V

1.4 V1.2 V

1.6 V

OUTPUT VOLTAGE DRIFTVS. TEMPERATURE

-50 0 50 100

∆VO

UT

(m

V)

-50

0

+50

TA (°C)

TEST CIRCUIT

Note: Di: IS2837,38 (NEC) L: Toko 395KN-0369AQ Toko PS5CDL-1639X

(See “VoltageAdjustment Circuit”)


TK11811

VIN

R110 KΩ VIN

FB

OSCDiR222 KΩ

C2 3300 pF13

4 6

LC1

10 µF

+

C310 µF

VOUT

VOUT

GND

T

+

INPUT CURRENT VS. INPUTVOLTAGE (IOUT = 0 mA)

0 10 20

VIN (V)

0

I IN (

µA

)

100

200

VOUT = 1.9 V

VOUT = 2.8 V

EF

F (

%)

50

100

EFFICIENCY VS. OUTPUTCURRENT

0 1 2 3 4 5

IOUT (mA)

0

1.2 V

1.0 V

VIN = 0.8 V

1.4 V

1.6 V


0 1 2 3 4 5

IOUT (mA)

1

VO

UT

(V

)

2

3

1.6 V

1.4 V

1.2 V1.0 V

0.8 V

VIN = 0.6 V

TEST CIRCUIT

Note: L: Toko 395KN-0370UG

(See “VoltageAdjustment Circuit”)

Note: This test circuit is effective at low load current.



TK11811

OUTPUT VOLTAGE VS. OUTPUT CURRENT

0 2 4 6 8 10

IOUT (mA)

0

VO

UT

(V

)

2

5

4

3

1

1.4 V

1.2 V

1.0 V

0.8 V

VIN = 0.6 V

EF

F (

%)

50

100

EFFICIENCY VS. OUTPUTCURRENT

0 5 10

IOUT (mA)

0

VIN = 0.6 V

1.4 V

1.2 V1.0 V

0.8 V

TEST CIRCUIT


Note: This test circuit is effective at high load currents. By changing C2 from 3300pF to 0.1 µF, the converter operates in the burst mode. The apparentfrequency of operation drops (70 to 100 kHz) and a larger output ripple occurs during burst mode operation. A ripple filter consisting of Cf and Rf canbe added to the output to reduce noise. The values of Cf and Rf should be determined experimentally based on the design parameters. The outputvoltage will drop slightly due to Rf.

VIN

R110 KΩ VIN

FB

OSCDiR222 KΩ

C2 0.1 µF

13

4 6

LC1

10 µF

+

C310 µF

VOUTVOUT

GND

T

++

Rf

Cf

RIPPLE FILTER

L: Toko 395KN-0369AQ


TK11811

VOLTAGE ADJUSTMENT CIRCUIT

Note: The output voltage can be set between 1.9 V and 2.8 V with an external resistor connected between pins 4 and 6.

ADDITIONAL INFORMATION

R

VOUT

T


Maximize copper foil area connecting to all IC pins foroptimum performance. Place input and output bypasscapacitors close to the GND pin. For best transient behaviorand lowest output impedance use as large a capacitorvalue as possible. The temperature coefficient of thecapacitance and Equivalent Series Resistant (ESR) shouldbe taken into account. These parameters can influencepower supply noise and ripple rejection. In extreme cases,oscillation may occur. In order to maintain stability, theoutput bypass capacitor value should be minimum 10 µFin case of tantalum electrolytic or 15 µF in case of aluminumelectrolytic.


All plastic molded packages absorb some moisture fromthe air. If moisture absorption occurs prior to soldering thedevice into the printed circuit board, increased separationof the lead from the plastic molding may occur, degradingthe moisture barrier characteristics of the device. Thisproperty of plastic molding compounds should not beoverlooked, particularly in the case of very small packageswhere the plastic is very thin. In order to preserve theoriginal moisture barrier properties of the package, devicesare stored and shipped in moisture proof bags filled withdry air. The bags should not be opened or damaged prior

to actual use of the devices. If this is unavoidable, thedevices should be stored in a low relative humidityenvironment (40 to 65 %) or in an enclosed environmentwith desiccant.

INDUCTOR NOTES

The output current and efficiency are largely dependantupon the coil used. A coil with lower DC resistance isgenerally better in efficiency than one with a higher DCR(DC Resistance). The recommended TOKO 395KN-0369AQ is 1:1 turns ratio transformer with an inductance of110 µH and Toko 395KN-0370UG is 1:3 turns ratiotransformer with inductance of 60 µH:600 µH. These coils,or equivalent, should be used. Smaller coils with higherDCR will not perform as well as the above coil, and theoscillator will not be stable.

FEEDBACK RC TIME CONSTANT

If a different coil is used other than the one mentioned, theRC time constant of the feedback loop will need to beadjusted for optimum performance. Generally, a lowerresistance will give more output current. In fact, R can bezero; however, lower resistance will sacrifice efficiency atlow output currents as the quiescent current increases. Ifthe capacitance is increased beyond or below a certainvalue, the oscillator will become unstable. The optimum

VOUT 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8

R 0 12 k 22 k 33 k 56 k 82 k 150 k 330 k 560 k *


TK11811

RC values depend upon the operating current, and shouldbe chosen experimentally using the given values of 3300pF and 22 kΩ as a starting point.

INPUT/OUTPUT DECOUPLING CAPACITORS

DC-DC converters generate a large ripple current on boththe input and the output of the circuit. The capacitors usedshould be as large as possible and have low impedance inthe 300 kHz range. Since low temperatures causecapacitors to decrease capacitance and increaseEquivalent Series Resistance (ESR), care should be takento choose capacitors that have acceptable characteristicsover the temperature range you intend to use. This shouldbe done experimentally to verify results, as capacitorperformance varies widely from manufacturer tomanufacturer. Tantalum capacitors are generally the bestchoice and 10 µF should be adequate for most applications.

LOAD CHARACTERISTICS

The TK11811 should not be allowed to start-up under fullload conditions. If this occurs, the output may not stabilizeto the correct output voltage. This can be compensated for,somewhat, by adjusting the RC of the feedback loop or bydecreasing the output decoupling capacitor. Maximumcurrent can be drawn after the oscillator has started andthe output has reached nominal output voltage. This ismore critical with input voltages under 1.3 V as the converterneeds to generate sufficient output to ensure correctinternal bandgap and bias voltages.

ADDITIONAL INFORMATION (CONT.)


TK11811

Marking Information

MarkingTK11811 D1

0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-134-TK118110798O0.0K








TK11812

FB

VOUT

FB

OSC

GND

VIN

TK11812

20P

APPLICATIONS Pagers

Cassette Recorders

Cordless Telephones



Mobile Radios



FEATURES Miniature Package (SOT-23L)

Low Start-up Voltage [0.6 V (typ.)]


Adjustable Output Voltage (1.5 to 15 V)

Wide Input Voltage Range (0.6 to 14 V)

DESCRIPTION

The TK11812 is a low power, low input voltage step-upDC-DC converter.

This device can be set to an output of 1.5 to 15 V DC usingtwo resistors. The output current is dependent upon theinput voltage and ranges from 8 mA at 1.6 V to 24 mA at3.5 V. The efficiency is over 80% for an output current of4 mA to 32 mA with a 3.5 V input and 5 V output.

The frequency of the built-in relaxation oscillator is set byexternal components. The internal voltage regulatorprovides a stable output voltage. Optimized Toko inductorcomponents are available.

The TK11812 is available in a miniature 6-pin SOT-23Lsurface mount package.

BLOCK DIAGRAM

GND

FB

OSC

VOUT

OSCILLATOR

VIN FB

+

-

Vref



Tape/Reel Code

TK11812M

DC-DC CONVERTER

TK11812


Note 1: Power dissipation is 400 mW when mounted as recommended. Derate at 3.2 mW/°C for operation above 25 °C. Power dissipation is200 mW when in Free Air. Derate at 1.6 mW/°C for operation above 25°C.

Note 2: This IC is a frequency-controlled DC-DC converter, thus, the value is varied by condition.Note 3: Output with R1/R2 set for 3.0 V nominal.Note 4: Reference voltage is measured at FB pin (pin 6).


TK11812 ELECTRICAL CHARACTERISTICSTest Conditions: TA = 25 °C, VOUT = 3.0 V, unless otherwise specified.

Input Voltage ............................................................ 16 VOutput Voltage ......................................................... 15 VPower Dissipation (Note 1) ................................ 200 mWJunction Temperature ........................................... 150 °C



V NI egnaRegatloVylppuS 6.0 41 V

V TRATS egatloVpu-tratS I TUO Am0= 6.0 57.0 V

I NI tnerruCtupnIV NI I,V1.1= TUO Am3= 6 11 51 Am

V NI I,V4.1= TUO Am3= 5 3.8 41 Am

V TUO egatloVtuptuOV NI I,V1.1= TUO )3etoN(,Am3= 58.2 0.3 51.3 V

V NI I,V4.1= TUO )3etoN(,Am3= 58.2 0.3 51.3 V

V )WOL(TUO )WOL(egatloVtuptuOV NI I,V1.1= TUO ,Am3=

VotT TUO detcennoc57.1 09.1 50.2 V

I TUO tnerruCtuptuOV NI V1.1= 0.4 5.4 Am

V NI V4.1= 0.6 8.6 Am

geReniL noitalugeReniL I TUO V1.1,Am3= ≤ V NI ≤ V2.2 01 001 Vm

geRdaoL noitalugeRdaoL V NI Am5.0,V1.1= ≤ I TUO ≤ Am3 54 031 Vm

FFE ycneiciffE V NI I,V4.1= TUO Am3= 36 27 %

F CSO ycneuqerFrotallicsO V NI I,V4.1= TUO )2etoN(Am3= 003 zHk

∆V TUO /∆T tneiciffeoCerutarepmeT V NI I,V4.1= TUO Am3= 4.0 C°/Vm

V fer egatloVecnerefeR V NI I,V4.1= TUO )4etoN(,Am3= 22.1 V


TK11812


TEST CIRCUIT

13

4 6

10 F

Di

C13300 pF

R1 R2

GND

VIN

VOUT

+ 10 KW

R322 KW

L

GND

10 F

+

Note: VOUT = Vref [1 + (R1 / R2)] Vref = 1.22 V R1 = 100 k to 150 k Vref is the FB pin voltage.Note: Di: IS2837,38, or equivalent

L: Toko 395KN-0369AQ Toko PS5CDL-1639X

OUTPUT VOLTAGE VS. OUTPUTCURRENT (VOUT = 3.0 V)

IOUT (mA)

0

VO

UT

(V

)

2

5

4

3

1

VIN = 0.6 V0.8 V

1.2 V

1.6 V1.0 V1.4 V

0 2 4 6 8 10

EF

F (

%)

50

100

EFFICIENCY VS. OUTPUTCURRENT (VOUT = 3.0 V)

0 2 4 6 8 10

IOUT (mA)

0VIN = 0.6 V

1.0 V

1.4 V

0.8 V

1.2 V

1.6 V

OUTPUT VOLTAGE VS. OUTPUT CURRENT (VOUT = 3.3 V)

IOUT (mA)

0

VO

UT

(V

)

2

5

4

3

1

VIN = 0.6 V

0.8 V1.0 V 1.2 V

1.4 V

1.6 V

0 2 4 6 8 10

EF

F (

%)

50

100

EFFICIENCY VS. OUTPUT CURRENT (VOUT = 3.3 V)

IOUT (mA)

0

0.8 V

1.0 V

VIN = 0.6 V

1.4 V

1.2 V

1.6 V

0 2 4 6 8 10

VO

UT

(V

)

2

5


IOUT (mA)

0

1.6 V4

3

11.0 V

1.2 V

1.4 V

VIN = 0.6 V0.8 V

0 2 4 6 8 10

EF

F (

%)

50

100


IOUT (mA)

0VIN = 0.6 V

1.0 V

1.4 V

0.8 V

1.2 V

1.6 V

0 2 4 6 8 10

TK11812



EF

F (

%)

50

100


IOUT (mA)

0

VIN = 2.5 V

3.5 V

3.0 V

0 8 16 24 32 40


VIN (V)

0

I Q (

µA

)

200

100

VOUT = 3 V

0 0.5 1.0 1.5 2.0

VO

UT

(V

)

2

5


IOUT (mA)

0VIN = 0.6 V

1.6 V4

3

1 0.8 V

1.0 V

1.2 V1.4 V

0 2 4 6 8 10

EF

F (

%)

50

100


IOUT (mA)

0

VIN = 0.6 V

1.0 V

1.4 V

0.8 V

1.2 V1.6 V

0 2 4 6 8 10

VO

UT

(V

)

2

5


IOUT (mA)

0

VIN = 2.5 V

3.5 V4

3

1

3.0 V

0 8 16 24 32 40

OUTPUT VOLTAGE DRIFTVS. TEMPERATURE

∆VO

UT

(m

V)

-100

0

+100

TA (°C)

VOUT = 3 V

VOUT = 5 V

-50 0 50 100


TK11812


Maximize copper foil area connecting to all IC pins foroptimum performance. Place input and output bypasscapacitors close to the GND pin. For best transient behaviorand lowest output impedance, use as large of a capacitorvalue as possible. The temperature coefficient of thecapacitance and Equivalent Series Resistance (ESR)should be taken into account. These parameters caninfluence power supply noise and ripple rejection. In extremecases, oscillation may occur. In order to maintain stabilitythe output bypass capacitor value should be a minimum of10 µF in the case of tantalum electrolytic, or 15 µF in thecase of aluminum electrolytic.


All plastic molded packages absorb some moisture fromthe air. If moisture absorption occurs prior to soldering thedevice into the printed circuit board, increased separationof the lead from the plastic molding may occur, degradingthe moisture barrier characteristics of the device. Thisproperty of plastic molding compounds should not beoverlooked, particularly in the case of very small packageswhere the plastic is very thin.

In order to preserve the original moisture barrier propertiesof the package, devices are stored and shipped in moistureproof bags filled with dry air. The bags should not beopened or damaged prior to actual use of the devices. Ifthis is unavoidable, the devices should be stored in a lowrelative humidity environment (40 to 65%) or in an enclosedenvironment with desiccant.

INDUCTOR NOTES

The output current and efficiency are largely dependent onthe coil used. A coil with lower DC resistance is generallybetter in efficiency than one with a higher DCR (DCResistance). The recommended TOKO 395KN-0369 AQis a 1:1 turns ratio transformer with an inductance of 110µH, and Toko 395KN-0370UG is a 1:3 transformer ratiowith the inductance of 60 µH: 600 µH. These coils orequivalent should be used. Smaller coils with higher DCRwill not perform as well as the above coil, and the oscillatorwill not be stable.

FEEDBACK RC TIME CONSTANT

If a different coil is used other than the one mentioned, theRC time constant of the feedback loop will need to beadjusted for optimum performance. Generally, a lowerresistance will give more output current. In fact, R can bezero; however, lower resistance will sacrifice efficiency atlow output currents as the quiescent current increases. Ifthe capacitance is increased beyond or below a certainvalue, the oscillator will become unstable. The optimumRC values depend upon the operating voltage range,output voltage and operating current, and should be chosenexperimentally using the given values of 3300 pF and22 KΩ as a starting point.

INPUT/OUTPUT DECOUPLING CAPACITORS

DC-DC converters generate a large ripple current on boththe input and output of the circuit. The capacitors usedshould be as large as possible and have low impedance inthe 300 kHz range. Since low temperatures causecapacitors to decrease capacitance and increaseEquivalent Series Resistance (ESR) care should be takento choose capacitors that have acceptable characteristicsover the temperature range you intend to use. This shouldbe done experimentally to verify results, as capacitorperformance varies widely from manufacturer tomanufacturer. Tantalum capacitors are generally the bestchoice and 10 µF should be adequate for most applications.

LOAD CHARACTERISTICS

The TK11812 should not be allowed to start up under fullload conditions. If this occurs, the output may not stabilizeto the correct output voltage. This can be compensated for,somewhat, by adjusting the RC of the feedback loop or bydecreasing the output decoupling capacitor. Maximumcurrent can be drawn after the oscillator has started andthe output has reached nominal output voltage. This ismore critical with input voltages under 1.3 V as the converterneeds to generate sufficient output to ensure correctinternal bandgap and bias voltages.

ADDITIONAL INFORMATION

TK11812


Marking Information

MarkingTK11812 D2

0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-131-TK118120798O0.0K








TK11816, TK11817,TK11818, TK11819

GND

DK

OSCVIN

OSCILLATOR

STARTUPCIRCUIT

REFERENCEVOLTAGE

FEEDBACKCONTROL

VOUT

T1

DC-DC CONVERTER

FEATURES Miniature Package (SOT-23L-6)


Internal Rectifier and Regulator

Wide Input Voltage Range (1.1 to 18 V)

Selectable Output Voltages

Single Battery Cell Operation

TK11816MTK11817MTK11818MTK11819M



Tape/Reel Code

BLOCK DIAGRAM

DESCRIPTION

The TK1181x series devices generate DC output voltagesranging from 7.2 to 32 V. Each device provides tworegulated output voltages selectable by a single jumper.Designed for step-up operation, these devices will operatewith an input voltage as low as 1.1 V, thus allowing singlebattery cell operation.

These converters have a built-in relaxation oscillator. Thefrequency of operation is determined by external componentvalues. The built-in rectifier combined with an internaltemperature compensated reference allows stable outputvoltages with minimal external components.

These devices are available in a miniature SOT-23L-6surface mount package. An optimized surface mountinductor is available from TOKO (P/N: 395GN-0091IB).

APPLICATIONS Variable Capacitance and PIN Diode Bias



Mobile Radios

Cellular Telephones

Cordless Telephones

Fiber-Optic Receivers



TK11816 TK11817TK11818 TK11819

OSC

VIN

VOUT

T1

DK

GND01S


TK11816, TK11817,TK11818, TK11819

Input Voltage ............................................................ 20 VPower Dissipation (Note 1) ................................ 200 mWJunction Temperature .......................................... 150 °COperating Voltage Range (TK11816)............. 1.1 to 13 VOperating Voltage Range (TK11817)............. 1.1 to 15 V

Operating Voltage Range (TK11818)............. 1.1 to 18 VOperating Voltage Range (TK11819)............. 1.1 to 18 VStorage Temperature Range ................... -55 to +150 °COperating Temperature Range .................. -20 to +70 °CLead Soldering Temperature (10 s) .................... 235 °C


TK11816 ELECTRICAL CHARACTERISTICSTest Conditions: VIN = 5 V, TA = 25 °C (Notes 3 & 5), unless otherwise specified.


I NI tnerruCylppuSV TUO ,V8.21= I TUO Am1.0= 7.4 0.9 Am

V TUO ,V2.7= I TUO Am0.1= 1.21 0.91 Am

V TUO egatloVtuptuOV1.1 ≤ V NI ≤ V01 1.21 8.21 5.31 V

V1.1 ≤ V NI ≤ V6 58.6 02.7 05.7 V

I TUO tnerruCtuptuOV TUO V8.21= 5.3 5.4 Am

V TUO V2.7= 0.4 0.6 Am

geRdaoL noitalugeRdaoL )4etoN( 60.0 3.0 %

∆V TUO /∆T tneiciffeoCerutarepmeTV TUO ,V8.21= I TUO Am1.0= 10.1 C°/Vm

V TUO ,V2.7= I TUO Am1.0= 20.2 C°/Vm


I NI tnerruCylppuSV TUO ,V8.61= I TUO Am1.0= 7.4 0.9 Am

V TUO ,V3.9= I TUO Am0.1= 1.21 0.91 Am


V1.1 ≤ V NI ≤ V8 58.8 03.9 08.9 V

I TUO tnerruCtuptuOV TUO V8.61= 5.3 5.4 Am

V TUO V3.9= 0.4 0.6 Am


∆V TUO /∆T tneiciffeoCerutarepmeTV TUO ,V8.61= I TUO Am1.0= 18.1 C°/Vm

V TUO ,V3.9= I TUO Am1.0= 13.2 C°/Vm



TK11816, TK11817,TK11818, TK11819



Note 1: Power dissipation is 400 mW when mounted. Derate at 3.2 mW/°C for operation above 25 °C. Power dissipation is 200 mW in free air. Derateat 1.6 mW/°C for operation above 25 °C.

Note 2: When operating below 25 °C, the output capacitor degradation may increase output ripple noise.Note 3: VIN = 5.0 V, No load.Note 4: Load Regulation = (∆VOUT / VOUT) x 100 %, where ∆VOUT = VOUT (no load) - VOUT (IOUT = 1.0 mA)Note 5: Specifications are based upon a Toko 395GN-0091IB inductor. The use of other inductors may degrade performance.Note 6: See Output Voltage Selection Table for connections to obtain desired output voltage.


I NI tnerruCylppuSV TUO ,V82= I TUO Am1.0= 7.4 0.9 Am

V TUO ,V4.02= I TUO Am0.1= 1.21 0.91 Am


V1.1 ≤ V NI ≤ V81 3.91 4.02 5.12 V

I TUO tnerruCtuptuOV TUO V82= 8.1 0.3 Am

V TUO V4.02= 5.2 0.4 Am


∆V TUO /∆T tneiciffeoCerutarepmeTV TUO ,V82= I TUO Am1.0= 2.0 C°/Vm

V TUO ,V4.02= I TUO Am1.0= 6.0 C°/Vm


I NI tnerruCylppuSV TUO ,V23= I TUO Am1.0= 7.4 0.9 Am

V TUO ,V42= I TUO Am0.1= 1.21 0.91 Am


V1.1 ≤ V NI ≤ V81 5.22 0.42 5.52 V

I TUO tnerruCtuptuOV TUO V23= 8.1 0.3 Am

V TUO V42= 5.2 0.4 Am


∆V TUO /∆T tneiciffeoCerutarepmeTV TUO ,V23= I TUO Am1.0= 19.0 C°/Vm

V TUO ,V42= I TUO Am1.0= 73.1 C°/Vm


TK11816, TK11817,TK11818, TK11819

OSCVIN

VIN

DK VOUT

T1

+

1 kΩ0.022 µF

L11.2 mH

4.7 µF

+.47 to4.7 µF

+

RVOUT

NOISE FILTER

OUTPUT VOLTAGE SELECTION

TEST CIRCUIT

Note:L1 = 1.2 mHToko Part Number: 395GN-0091IB The noise filter is not built in.

Please use an external circuit if desired.ILOAD = IOUTDesign within R x IOUT = 50 to 150 mV

REBMUNTRAP GNIKRAM

EGATLOVTUPTUO

V TUO T- 1 )NEPO( V TUO T- 1 )DEREPMUJ(

61811KT 6D V8.21 V2.7

71811KT 7D V8.61 V3.9

81811KT 8D V0.82 V4.02

91811KT 9D V0.23 V0.42


TK11816, TK11817,TK11818, TK11819

TK11816 (VOUT - T1 JUMPERED)


TK11816 (VOUT - T1 OPEN)


IOUT (mA)

VO

UT

(V

)

0

5

10

0 5 10

VIN = 2 V

4 V

6 V

8 V

10 V

OUTPUT VOLTAGE CHANGE VS.TEMPERATURE

TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


IOUT (mA)

VO

UT

(V

)

5

10

15

0 10 20

4 V

6 V

8 V

VIN = 2 V

10 V

OUTPUT VOLTAGE AND SUPPLYCURRENT VS. INPUT VOLTAGE

VIN (V)

VO

UT

(V

)

5

10

15

0 1 2 3 4 5

400 µA

VOUT

200 µA

IOUT = 0 IIN

20

10

0

I IN (

mA

)


TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


VIN (V)

VO

UT

(V

)

0

5

10

0 1 2 3 4 5

VOUT

200 µA

IOUT = 0IIN

10

5

0

I IN (

mA

)

400 µA



VIN (V)

VO

UT

(V

)

0

5

10

0 1 2 3 4 5

400 µA

VOUT

200 µA

IOUT = 0 IIN

20

10

0

I IN (

mA

)


TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


IOUT (mA)

VO

UT

(V

)

0

5

10

0 10 20

4 V

6 V

VIN = 2 V

8 V


TK11816, TK11817,TK11818, TK11819






IOUT (mA)

VO

UT

(V

)

10

15

20

0 5 10

4 V

6 V

8 V

10 V

VIN = 2 V


VIN (V)

VO

UT

(V

)

0

10

20

0 1 2 3 4 5

400 µA

VOUT

200 µA

IOUT = 0IIN

20

10

0

I IN (

mA

)


TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


IOUT (mA)

VO

UT

(V

)

10

20

30

0 5 10

4 V

6 V

8 V

10 V

VIN = 2 V


TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


IOUT (mA)

VO

UT

(V

)

10

20

30

0 5 10

4 V

6 V

8 V

10 V

VIN = 2 V


TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


VIN (V)

VO

UT

(V

)

10

20

30

0 1 2 3 4 5

VOUT

IOUT = 0 IIN

20

10

0

I IN (

mA

)

400 µA

200 µA


VIN (V)

VO

UT

(V

)

10

20

30

0 1 2 3 4 5

VOUT

IOUT = 0IIN

20

10

0

I IN (

mA

)

400 µA200 µA


TK11816, TK11817,TK11818, TK11819




All plastic molded packages absorb some moisture from the air. If moisture absorption occurs prior to soldering the deviceonto the printed circuit board, increased separation of the lead from the plastic molding may occur, degrading the moisturebarrier characteristics of the device. This property of plastic molding compounds should not be overlooked, particularlyin the case of very small packages, where the plastic is very thin. In order to preserve the original moisture barrierproperties of the package, devices are stored and shipped in moisture proof bags, filled with dry air. The bags should notbe opened or damaged prior to the actual use of the devices. If this is unavoidable, the devices should be stored in a lowrelative humidity environment (40 to 65%) or in an enclosed environment with desiccant.



IOUT (mA)

VO

UT

(V

)

10

20

30

0 5 10

4 V

6 V

8 V

10 V

VIN = 2 V


TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


IOUT (mA)

VO

UT

(V

)

20

30

40

0 1 2 3 4 5

4 V

6 V

8 V

VIN = 2 V


TA (°C)

∆VO

UT

(m

V)

-500

500

-50 0 50 100

0


VIN (V)

VO

UT

(V

)

20

30

40

0 1 2 3 4 5

VOUT

IOUT = 0 IIN

20

10

0

I IN (

mA

)

400 µA

200 µA


VIN (V)

VO

UT

(V

)

10

20

30

0 1 2 3 4 5

VOUT

IOUT = 0 IIN

20

10

0

I IN (

mA

)

400 µA

200 µA



TK11816, TK11817,TK11818, TK11819

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE

Marking Information

MarkingTK11816 D6TK11817 D7TK11818 D8TK11819 D9

0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1




IC-132-TK11816x0798O0.0K







January, 1996 TOKO, Inc. Page 1

TK11821

1-30-96

APPLICATIONS Variable Capacitance and PIN Photodiode Bias



Mobile Radios

Cellular Telephones

Cordless Telephones

Fiberoptic Receivers



FEATURES Very Low Noise

Very Small Size


Wide Supply Voltage Range (0.9 to 10 V)

Sinewave Oscillator


TK11821M

Tape/Reel Code

TAPE/REEL CODEBX: Bulk/BagTL: Tape LeftMG: Magazine


DC-DC CONVERTER

TK11821M

BLOCK DIAGRAM

1

2

3

4

OSC

VD

BYPASS

VO

VIN

8

7

6

5

VFB

GND

T1

821A21

DESCRIPTIONThe TK11821 is a low power, low input voltage DC-DCconverter. The device has been optimized for variablecapacitance diode and PIN photodiode bias applications. Itgenerates 10 Vdc and 24 Vdc output voltages from an inputvoltage as low as 0.9 V.

Since the built-in high frequency oscillator generatessinewaves, the TK11821 produces very low RF interfer-ence noise. The internal oscillator is capable of operationat frequencies as high as 6-8 MHz, therefore, interferencefiltering is simple and effective. This unique feature makesthe TK11821 ideally suitable for RF and fiber optic receiverapplications.

The device is capable of operation in the 0.9 to 10 V powersupply voltage range.

The output voltage is 24 V when T1 is not connected. WhenT1 is connected to VO, the output voltage is set to 10 V.

The TK11821 is available in an 8-pin plastic surface mount(MFP-8) package. External inductive components are alsoavailable. VO

T1GND

BYPASSV REF

VFB OSC

Feedback Control

6

5 2

4

5

7

3

1

VD

VIN

TK11821

January, 1996 TOKO, Inc.1-30-96Page 2

ELECTRICAL CHARACTERISTICSTest conditions: VIN = 0.9 V → 2.0 V

Operating Conditions: VIN = 1.1 V, TA = 25 °C unless otherwise specified.

ABSOLUTE MAXIMUM RATINGSInput Voltage ............................................................ 10 VOutput Voltage ......................................................... 26 VOutput Current ..................................................... 0.5 mAOperating Voltage Range............................... 0.9 to 10 VPower Dissipation (Note 1) ................................ 350 mW

Junction Temperature .......................................... 150 °CStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................. -20 to +70 °CLead Soldering Temp. (10 sec.) ........................... 260 °C

SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

ICC Input Current IO = 0 , VO = 10 V 3.5 7.0 mA

IO = 50 µA, VO = 10 V 5.5 9.0 mA

VO Output Voltage IO = 0 µA, 1.6 V ≤ VIN ≤ 2.0 V 22.5 24.0 25.5 V

VO - T1 shorted, IO = 50 µA 9.6 10.0 10.4 V

IO Output Current VO - T1 shorted 90 100 µA

Load Reg Load Regulation Note 2 0.1 0.35 %

∆VO/TA Output Voltage VO = 24 V, IO = 50 µA +2.3 mV/°CTemperature Dependency VO = 10 V, IO = 50 µA -1.5 mV/°C

VOSC-S Oscillation Starting Voltage IO = 0 µA 0.75 V

fOSC Oscillation Frequency IO = 0 µA, Note 2 4.0 MHz

Note 1: Power dissipation must be derated at the rate of 3 mW/°C for operation at TA = 25 °C and above.Note 2: Use the same value for L that was used in the measurement circuit.Note 3: Output Voltage Variation = (∆VO1/VO1) X 100 (%), ∆VO1 = VO1 (no load) - VO1 (IO = 50 µA).Note 4: The circuit constants will be changed by the input voltage at the 0.9 V to 2.0 V range and 1.8 V to 10 V range.

ELECTRICAL CHARACTERISTICSTest conditions: VIN = 1.8 V → 10.0 V

Operating Conditions: VIN = 3.0 V, TA = 25 °C unless otherwise specified.


ICC Input Current IO = 0 , VO = 10 V 3.5 7.0 mA

IO = 50 µA, VO = 10 V 5.5 9.0 mA

VO Output Voltage IO = 0 µA, 1.6 V ≤ VIN ≤ 2.0 V 22.5 24.0 25.5 V

VO - T1 shorted, IO = 50 µA 9.6 10.0 10.4 V

IO Output Current VO - T1 shorted 90 100 µA

Load Reg Load Regulation Note 2 0.1 0.35 %

∆VO/TA Output Voltage VO = 24 V, IO = 50 µA +2.3 mV/°CTemperature Dependency VO = 10 V, IO = 50 µA -1.5 mV/°C

VOSC-S Oscillation Starting Voltage IO = 0 µA 1.5 V

fOSC Oscillation Frequency IO = 0 µA, Note 2 3.5 MHz


TK11821

1-30-96

TEST CIRCUITThe value of the circuit constantsagainst the input voltage.

0.9 V to 2 V 33 pF 10 pF PS5CDLN-1250

1.8 V to 10 V 820 pF 33 pF PS5CDLN-1303

INPUT TOKO COILVOLTAGE CA CB PART NUMBER


VIN (V)

I IN (m

A)

0 0.4 0.8 1.2 1.6 2.00

5

10

TPC03

T = 25°CA

INPUT CURRENT vs. INPUT VOLTAGE10 V OUTPUT

IO = 80 µA

IO = 40 µA

IO = 120 µA

IO = 0 µA

V (V)IN

V

(V)

O

0 0.8 1.6 2.4 3.2 4.00

10

24

TPC04

OUTPUT VOLTAGE vs. INPUT VOLTAGE24 V OUTPUT

IO = 0 µA

IO = 40 µA

IO = 80 µA

IO = 120 µA

T = 25 °CA

V (V)IN

I IN (m

A)

0 0.8 1.6 2.4 3.2 4.00

10

20

TPC05

T = 25°CA

INPUT CURRENT vs. INPUT VOLTAGE24 V OUTPUT

IO = 120 µA

IO = 0 µA

IO = 80 µA

IO = 40 µA

0 0.4 0.8 1.2 1.6 2.0

V (V)IN

0

5

10

V (

V)O

TPC01

T = 25 °CA

OUTPUT VOLTAGE vs. INPUT VOLTAGE10 V OUTPUT

40 µA

80 µA

120 µA

0 µA

0 0.2 0.4 0.6 0.8 1.0

I (mA)O

0

5

10

V (

V)O

TPC02

OUTPUT VOLTAGE vs. OUTPUT CURRENT10 V OUTPUT

TA = 25 °C

V = 4 VIN

VIN = 1 V

VIN = 3 V

VIN = 2 V

0 0.2 0.4 0.6 0.8 1.0

I (mA)O

0

5

10

V

(V)

O

TPC06

OUTPUT VOLTAGE vs. OUTPUT CURRENT24 V OUTPUT

T = 25°CA

V = 2 VIN 3 V 4 V 5 V

VIN

1

3

6

4

L

C B

CA

C2 0.1 µF

1 µF

0.1 µF

GND

821

22 µF+

+

VO

T

The output voltage is 24 V. When connected between the VO and the T terminal, the output voltage will be 10 V.

TK11821

January, 1996 TOKO, Inc.1-30-96Page 4


TEMP (°C)

V (

V)O

-30 -20 0 20 40 600

10.2

TK11821 • TPC07

OUTPUT VOLTAGE vs. TEMPERATURE

V = 10 VO

10.3

10.1

10.0

9.9

24.5

24.6

24.4

24.3

24.2

V (

V)O

V = 24 VO

+

h

AM HIGHFM LOW

T

0.1

TR

C2

821

1 PIN

6

43

1

CB

CA

+

VIN

GND

TK 11821 BD FIG 01

TYPICAL AM/FM VARACTOR DIODE BIAS CIRCUIT


TK11821

1-30-96

© 1993 Toko America, Inc. All Rights Reserved

Printed in U.S.A.Order this literature by: IC-109-TK11821

PACKAGE OUTLINES

MFP-8

YOUR LOCAL REPRESENTATIVE IS:

TOKO America, Inc.1250 Feehanville Dr.Mt. Prospect, IL 60056Tel: (800) PIK-TOKOFax: (847) 699-1194

The information furnished by TOKO, Inc. is believed to be accurate and reliable. However, TOKO reserves the right to make changes or improvements in the design, specification or manufacture of its products without further notice. TOKOdoes not assume any liability arising from the application or use of any product or circuit described herein, nor for any infringements of patents or other rights of third parties which may result from the use of its products. No license is grantedby implication or otherwise under any patent or patent rights of TOKO, Inc.

Marking Information821

4.4

5.0

0.4 1.27

1.4

1.7m

ax

0.1m

ine

0.15

6.0

0.5

0°~

10°

0.76

1.27

1.27

5.5

e

e1

0.2

±

0.2±

0.2

±

0.3±

+0.

1-0

.05

Unit:mm


0.2±

0.12 0.1M

1 4

58

+0.1 -0.01


TK11822/23

VIN

VOUT

DA

REFERENCEVOLTAGEGND

EMITTER

FEEDBACKCONTROL BASE

BASE

EMITTER

VOUT

VIN

DA

GND

BLOCK DIAGRAM

DESCRIPTION

The TK11822 and TK11823 are boost-type DC-DCconverters developed primarily for use as power suppliesto drive variable capacitance diodes. Both products arelow power output types, suitable for operation at lowvoltages. To suppress AM band noise, they use highfrequency sine wave oscillation. Both products are availablein two output voltages, allowing the user to select the mostefficient voltage for the equipment. The products havebuilt-in rectifier diodes and small packages, contributing toequipment miniaturization.

The TK11822 and the TK11823 are available in a miniatureSOT-23L surface mount package. Optimized Tokoinductors are available.

APPLICATIONS Headphone Stereos

Pagers

Mobile Wireless Equipment

Electronic Diaries

Other Battery Powered Equipment

LCD Televisions

FEATURES Very Low Noise

Low Operating Voltage Range


Wide Supply Voltage Range

Sinewave Oscillation



TK11822/23



Tape/Reel Code

TK11822MTK11823M

20P

DC-DC CONVERTER


TK11822/23

Note 1: Power dissipation is 200 mW. Derate at 1.6 mW/°C for operation above 25 °C.Gen Note: Use caution when decreasing the output capacitance at low temperatures. “UJ” type capacitors will allow little change in the oscillation

frequency.


ABSOLUTE MAXIMUM RATINGSInput Voltage .............................................................. 8 VOutput Current ..................................................... 0.5 mAOutput Voltage (TK11822) ......................................... 9 VOutput Voltage (TK11823) ....................................... 18 VOperating Voltage Range (TK11822)............... 1.1 to 6 VOperating Voltage Range (TK11823)............... 1.2 to 6 V

Power Dissipation (Note 1) ................................ 200 mWStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -20 to +70 °CJunction Temperature ........................................... 125 °CLead Soldering Temperature (10 s) ...................... 235 °C



I NI tnerruCtupnII TUO Aµ0= 1.2 6.3 Am

I TUO Aµ05= 8.3 6.5 Am

V TUO egatloVtuptuO I TUO Aµ05= 0.7 4.7 8.7 V

I TUO tnerruCtuptuOV NI V2.1= 05 Aµ

V NI V4.1= 051 Aµ

geReniL noitalugeReniL V NI I,V6.3ot4.1= TUO Aµ05= 02 08 Vm

geRdaoL noitalugeRdaoL I TUO Aµ001ot02= 03 001 Vm

∆V TUO /∆T erutarepmeT tneiciffeoC V NI I,V6.3ot4.1= TUO Aµ05= 7.0 C°/Vm

V )S(CSO egatloVpu-tratSrotallicsO I TUO T,Aµ0= A C°52= 0.1 V

f CSO ycneuqerFrotallicsO 0.3 zHM


I NI tnerruCtupnII TUO Aµ0= 4.3 6.5 Am

I TUO Aµ05= 4.5 5.8 Am

V TUO egatloVtuptuO I TUO Aµ05= 2.31 7.31 2.41 V

I TUO tnerruCtuptuOV NI V3.1= 05 Aµ

V NI V5.1= 051 Aµ

geReniL noitalugeReniL V NI I,V6.3ot5.1= TUO Aµ05= 02 08 Vm


∆V TUO /∆T erutarepmeT tneiciffeoC V NI I,V6.3ot5.1= TUO Aµ05= 0.2 C°/Vm

V )S(CSO egatloVpu-tratSrotallicsO I TUO T,Aµ0= A C°52= 1.1 V

f CSO ycneuqerFrotallicsO I TUO Aµ0= 0.3 zHM


TK11822/23

C2

VIN

C15 pF C3

8 pF

0.1 µF

0.1 µF

+

+

VOUT TK

11822/23

Toko Coil(5CDM-658BM-1085)

TEST CIRCUIT

Note: Toko inductor: 5CDM-658BN-1085TK11822: C2 = 33 pFTK11823: C2 = 68 pF

VO

UT

(V

)

5

10


IOUT (µA)

00 100 200 300 400 500

VO

UT

(V

)

7.2

7.5


IOUT (µA)

7.00 50 100

7.4

7.3

7.1

I IN (

mA

)

10

25

INPUT CURRENT VS. OUTPUT CURRENT

IOUT (µA)

00 100 200 300 400 500

20

15

5

VO

UT

(V

)

5

10


IOUT (µA)

00 100 200 300 400 500

1.4 V

VIN = 1.0 V

1.1 V

1.2 V

1.3 V

VO

UT

(V

)

7.2

7.5


VIN (V)

7.00 1 2 3 4 5

7.4

7.3

7.1

∆VO

UT

(m

V)

-100

200

OUTPUT VOLTAGE VS. TEMPERATURE

TEMPERATURE (°C)

-300-50 0 50 100

100

0

-200

TK11822



TK11822/23


VO

UT

(V

)

10

15


IOUT (µA)

50 100 200 300 400 500

VO

UT

(V

)

13.7

14.0


IOUT (µA)

13.50 50 100

13.9

13.8

13.6

I IN (

mA

)

10

25

INPUT CURRENT VS. OUTPUT CURRENT

IOUT (µA)

00 100 200 300 400 500

20

15

5

∆VO

UT

(m

V)

-100

200

OUTPUT VOLTAGE VS. TEMPERATURE

TEMPERATURE (°C)

-300-50 0 50 100

100

0

-200

VO

UT

(V

)

13.7

14.0


VIN (V)

13.50 1 2 3 4 5

13.9

13.8

13.6

VO

UT

(V

)

10

15


IOUT (µA)

50 100 200 300 400 500

1.4 V

VIN = 1.0 V

1.1 V

1.2 V

1.3 V

TK11823


TK11822/23

APPLICATIONS INFORMATION

The TK11822 and TK11823 are designed for boost-typeDC-DC converter applications in which the output voltagesare always higher than the input voltages. These ICs usesine wave oscillation to significantly reduce ElectromagneticInterference (EMI). This makes the device especiallysuitable for AM radio applications.

The bypass capacitors should be located as close to theGND terminal as possible. During the printed circuit boardlayout, etch runs should have lengths as short as possibledue to the high operating frequency (3 MHz) of the devices.Loop areas contained within the etch runs should beminimized to reduce radiated EMI. The input terminalshould be bypassed with a high quality capacitor with goodhigh frequency characteristics to prevent conducted EMIfrom the input of the converter back to the external circuitry.

The oscillation frequency of these converters is around3 MHz. If the operating frequency needs to be shiftedbecause of the application, it can be adjusted by C3. Tostabilize the operating frequency over temperature, usecapacitors with low temperature coefficients for C1, C2,and C3. The stability of the oscillator is a function of thecapacitors, coil (Toko 5CDM-658BN-1085 recommended)and the printed circuit board layout.

When the load on the converter is heavy, the sine wave willbecome distorted, producing harmonics. In the design ofthe product, use as light a load as possible to ensure lowharmonic distortion of the sine wave. This will result in alow amount of EMI.


TK11822/23

Marking Information

MarkingTK11822 D22TK11823 D23

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-XXX-TKXXXXX0798O0.0K



0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1






TK11830

CONTROL

Vref

VOSC

VFB

VIN

GND

BLOCK DIAGRAM

DESCRIPTION

The TK11830 is a positive-to-negative DC-DC converter.This IC converts a positive input voltage into a regulatednegative output voltage. This DC-DC converter featuresan On/Off function with an active low control. The internalvoltage reference provides a stable output voltage whichcan be set from -0.5 to -12.5 V. The thermal protectionfeature provides oscillator shutdown in the event of anoverload condition. The wide input voltage range of 2.5 to15 V and a 60 mA output current capability allow flexibleoperation in a large number of applications.

The TK11830 is available in a miniature SOT-23L surfacemount package. Optimized Toko inductors are available.

APPLICATIONS Pagers

Cassette Recorders

Cordless Telephones





FEATURES Positive-to-Negative Converter

Adjustable Output Voltage

On/Off Control

Thermal Protection Sensor

Broad Operating Voltage Range


TK11830



Tape/Reel Code

TK11830M

20P

Vref VIN

VOSC

THERMALPROTECTION

OSCILLATORCONTROL

CONTROL

GND

REFERENCEVOLTAGE

VFB

COMP

POSITIVE-TO-NEGATIVE DC-DC CONVERTER


TK11830

Note 1: Power dissipation is 400 mW (internally limited) when mounted as recommended. Derate at 3.2 mW/°C for operation above 25 °C.Gen Note: Output capacitor should have low ESR at reduced temperatures if used below 0 °C.Gen Note: Parameters with min. or max. values are 100% tested at TA = 25 °C.

TK11830 ELECTRICAL CHARACTERISTICSTest Conditions: VIN = 5 V, L = 470 µH, TA = 25 °C, unless otherwise specified.

ABSOLUTE MAXIMUM RATINGSSupply Voltage ......................................................... 16 VOperating Voltage ............................................Min. 2.5 VPower Dissipation (Note 1) ................................ 400 mWStorage Temperature Range ................... -55 to +150 °C

Operating Temperature Range ................... -20 to +75 °CJunction Temperature ........................................... 150 °CLead Soldering Temperature (10 s) ...................... 235 °C


V NI egatloVtupnI V NI V|+ TUO | ≤ V61 5.2 51 V

V fer egatloVecnerefeR 32.1 82.1 33.1 V

∆V fer

fotneiciffeoCerutarepmeTegatloVecnerefeR

TA 08+ot03-= ° C 1.0± /Vm ° C

I )FFO(NI nwodtuhStatnerruCtupnIR TNOC k003= ,Ω ,FFOtuptuOV NI V5=

52 001 Aµ

geReniL noitalugeReniLV NI V,V01ot5.2= TUO ,V5-=I TUO Am02=

01 05 Vm

geRdaoL noitalugeRdaoL V TUO I,V5-= TUO Am05ot1= 02 001 Vm

I TUO tnerruCtuptuO V TUO V5-= 05 06 Am

LANIMRETLORTNOCFFO/NO

I TNOC tnerruClanimreTlortnoCV TNOC R,V4.0= TNOC k003= Ω 2.0 Aµ

V TNOC R,V0.5= TNOC k003= Ω 0.3 Aµ

V )NO(TNOC )NO(egatloVlortnoC R TNOC k003= ,Ω NOtuptuO 4.0 V

V )FFO(TNOC )FFO(egatloVlortnoC R TNOC k003= ,Ω FFOtuptuO 2.2 V


TK11830

VCONT(ON/OFF)

+VIN

CIN47 µF

+

GND

Vref

1 µF

R1

20 k

CFB0.1 µF R2

103 KΩSD

L+

COUT47 µF

VOUT

CF

RFVO

GND

Cref

RCONT

300 kΩ VIN

VFB

GND

VOSC

CONTROL

TEST CIRCUIT

Note: Toko Inductor (470 µH): 646CY-471Mor 636CE-471K (D73C)VOUT = (Vref / 5) x [ 1-4 x (R2 / R1)],where Vref = 1.28 V


Note: If a noise filter is desired, select:RF = (50 to 150 mV) / IOUT,where IOUT = Load Current

OUTPUT VOLTAGE VS.LOAD CURRENT

ILOAD (mA)

-3.1

0 20 40 60 80 100

VO

UT

(V

)

-3.0

-2.9

-2.8

-2.7

-2.6

VOUT = -3 V

VIN = 3 V

VIN = 5 V

VIN = 8 V

OUTPUT VOLTAGE AND EFFICIENCYVS. LOAD CURRENT

ILOAD (mA)

-5.1

0 6 12 18 24 30

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

VOUT = -5 VVIN = 3 V

EFFICIENCY

EF

F (

%)

100

50

VOUT


ILOAD (mA)

-5.1

0 20 40 60 80 100

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

VOUT = -5 V

VIN = 3 V

VIN = 5 V

VIN = 8 V


ILOAD (mA)

-5.1

0 10 20 30 40 50

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6


EFFICIENCY

EF

F (

%)

100

50

VOUT


TK11830



ILOAD (mA)

-10.0

0 20 40 60 80 100

VO

UT

(V

)

-9.9

-9.8

-9.7

-9.6

-9.5

VOUT = -10 V

VIN = 3 V

VIN = 5 V


ILOAD (mA)

-5.1

0 20 40 60 80 100

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6


EFFICIENCY

EF

F (

%)

100

50

VOUT


ILOAD (mA)

-5.1

0 20 40 60 80 100

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = -50 °CVOUT = -5 °V

VIN = 3 V

VIN = 5 V

VIN = 8 V

OUTPUT VOLTAGE AND EFFICIENCYVS. INPUT VOLTAGE

VIN (V)

-5.1

0 4 8 12 16 20

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = -50 °C

EFFICIENCY

EF

F (

%)

100

50ILOAD = 10 mA

ILOAD = 20 mA


ILOAD (mA)

-5.1

0 20 40 60 80 100

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = 25 °CVOUT = -5 °V

VIN = 3 V

VIN = 5 V

VIN = 8 V


VIN (V)

-5.1

0 4 8 12 16 20

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = 25 °C

EFFICIENCY

EF

F (

%)

100

50

ILOAD = 10 mA

ILOAD = 20 mA


TK11830

VINCONTROL

IOFF

RCONT

300 k

1

21.0 V

VIN

VIN VOUT

ICONTRCONT

300 k

VCONT

CONTROL



ILOAD (mA)

-5.1

0 20 40 60 80 100

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = 85 °CVOUT = -5 °V

VIN = 3 V

VIN = 5 V

VIN = 8 V


VIN (V)

-5.1

0 4 8 12 16 20

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = 85 °C

EFFICIENCY

EF

F (

%)

100

50

ILOAD = 20 mA


VIN (V)

-5.1

0 1 2 3 4 5

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = -50 °CILOAD = 0 mA, 10 mA, 20 mA


VIN (V)

-5.1

0 1 2 3 4 5

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = 25 °CILOAD = 0 mA, 10 mA, 20 mA

INPUT CURRENT (SHUTDOWN) VS. INPUT VOLTAGE

VIN (V)

100

0 4 8 12 16 20

I IN(O

FF

) (µ

A) 80

60

40

20

0

OUTPUT VOLTAGE AND CONTROLCURRENT VS. CONTROL VOLTAGE

VCONT (V)

-5

0 0.4 0.8 1.2 1.6 2.0

VO

UT

(V

)

-4

-3

-2

-1

0

TA = 85 °C

TA = 25 °C

TA = -50 °C

VOUT

I CO

NT

(µ

A)

5

3

4

2

1

0


TK11830

VIN VOUT

ICONT

CONTROL



VIN (V)

-5.1

0 1 2 3 4 5

VO

UT

(V

)

-5.0

-4.9

-4.8

-4.7

-4.6

TA = 85 °C

ILOAD = 0 mA, 10 mA, 20 mA

OUTPUT VOLTAGE AMD CONTROLVOLTAGE VS. CONTROL CURRENT

ICONT (µA)

-5

0 1 2 3 4 5

VO

UT

(V

)

-4

-3

-2

-1

0

VC

ON

T (

V)

1.0

0.5

VOUT

TA = 25 °C

REFERENCE VOLTAGE VS. INPUT VOLTAGE

VIN (V)

1.29

0 3 6 9 12 15

Vre

f (V

)

1.28

1.27

REFERENCE VOLTAGE VS.AMBIENT TEMPERATURE

TA (°C)

1.29

-50 0 50 100

Vre

f (V

)

1.28

1.27

1.30

1.26

1.25


TK11830

CIRCUIT OPERATION

The TK11830 operates with a continuous mode oscillator. The circuit operates by detecting the difference between theset output voltage and the internal bandgap reference. This is used to vary the oscillator frequency in response to loadcurrent. The output voltage is regulated by controlling the power transistor switch current; this maintains a constantcharge on the output capacitor.

AAA

AAFrequency goes up when the load current goes down.

Indu

ctor

Vol

tage

~VOUT

~VIN

AAAAAAAAAAAAAA

AA

AA

Time

Start

Low Load Current

High Load Current

Set Output Voltage

Abs

olut

e O

utpu

t V

olta

geIn

duct

or C

urre

nt

ILPK(MAX) Power - Transistor Maximum


TK11830

POLARITY-INVERTING OPERATION

VSAT Power Transistor Saturation VoltageVF Diode Forward Voltage DropIL Inductor CurrentIC Capacitor CurrentILOAD Load CurrentVL Inductor Voltage

where:

VL = L x (diL / dt) and VL = a constant value: IL = (VL / L) x t

During the charge cycle:

ILPK = [(VIN - VSAT) x tON] / L(1)

During the discharge cycle:

ILPK = [(|VOFF| + VF) x tOFF] / L (IL = 0 after tOFF)

(2)

From (1) and (2):

tON / tOFF = (|VOUT| + VF) / (VIN - VSAT)(3)

When IL = IC + ILOAD and output voltage are in a steadystate, the change of the charge/discharge must beequivalent, so:

∆Q+ = ∆Q1- + ∆Q2

-

And:

ILPK = 2 x ILOAD x [(tON / tOFF) + 1](4)

Ripple Voltage:

VRIPPLE = ∆Q+ / COUT = (ILPK - ILOAD)2 x tOFF / 2COUT x ILPK ~ ILOAD x tON / COUT

(5)

CIRCUIT OPERATION (CONT.)

VIN

VSAT VF

OSCILLATORCONTROL L

IL

COUT+

VOUT

ILOAD

IC

IC

ILPK - ILOAD

∆Q1-

∆Q+ ∆Q2-

CA

PA

CIT

OR

CU

RR

EN

T

ILOAD

RIP

PLE

VO

LTA

GE

VRIPPLE

ON

OFF

VIN - VSAT

-(|VOUT| + VF)IND

UC

TO

R V

OLT

AG

E

ILPK

IL

tON tOFF

CHARGEDISCHARGE


TK11830

CIRCUIT OPERATION (CONT.)

Oscillator Frequency:

f = 1/(tON + tOFF)

Where:

tON = L x [ILPK / (VIN - VSAT)]

And:

tOFF = L x [ILPK / (|VOUT| + VF)]

Therefore:

tON / tOFF (|VOUT| + VF) / (VIN - VSAT)

ILPK 2 x ILOAD x [(tON / tOFF) + 1]

f

COUT (ILOAD x tON) / VRIPPLE

VOUT

R1

R2

R3

R4

Vref

f1

I L1

V V1

V VLPKIN SAT OUT F

=×

−+

+

=V V V V

2I V V V V

1L

IN SAT

2

OUT F

LOAD IN SAT OUT F

2

−( ) +( )− + +( )

×

The ESR of the capacitor and the effect of the input voltagedifference for the comparator function are added to VRIPPLE.The maximum inductor current is limited by the powertransistor switch capacity: ILPK(MAX) ~ 300 mA.

Output Voltage is as follows:

VOUT = (Vref / 5) x (1 - 4 x R2 / R1)

where: Vref = 1.28 VR3, R4: IC InternalR4 / R3 = 1 / 4R1, R2 : External Resistor

V V V V

2I V V V V

1L

IN SAT

2

OUT F

LOAD IN SAT OUT F

2

−( ) +( )− + +( )

•


TK11830


COMPONENT REQUIREMENTS

Inductor

DC resistance of the inductor must be less than 5 Ω. Foroptimal performance and efficiency, an inductor with a DCresistance of less than 1 Ω is recommended. The oscillatorfrequency is inversely proportional to inductance. Theinductance should be greater than 300 µH to prevent lossof efficiency at high frequencies.

There is a large peak current (up to ILPK = 300mA) whenthe inductor is saturated.

CFB, CREF, CIN, COUT

The filtered output ripple is fed back to the feedback pin. Toensure continuous operation, CFB should be connectedbetween the feedback pin and ground. If a large voltage isfed back to the feedback pin, the power transistor switchdrive will be intermittent. This causes a large ripple voltagesince ILPK becomes larger. The value of CFB is determinedby the value of the output capacitor, COUT, and the feedbackresistance, R2. The feedback capacitor must be largerwhen the ripple voltage is high due to the lower COUT. CREFis used to prevent oscillation of the band gap reference andto stabilize the feedback loop. The input capacitor, CIN, isused to reduce supply impedance and to provide sufficientinput current during switching for stable circuit operation.

Recommended values:

CREF > 0.1 µF

CFB > 0.01 µF

CIN > 22 µF

COUT > 22 µF

Note: COUT should be sufficiently large and have a low

ESR to minimize ripple voltage.

Control Pin Resistor (R CONT)

Input requirements of the Control pin are as follows:

When VCONT is high (above 2.2 V), the circuit operation isstopped. When VCONT is low (below 0.4 V), operation isresumed.

A control current of 3 µA (typ.) is required for shutdown.Shutdown voltage, VCONT, is related to the resistanceRCONT as shown below. VCONT changes when RCONT ischanged.

VCONT ~ RCONT x ICONT + VBE

VCONT ~ (300 kΩ) x (3 µA) + 0.7 V = 1.60 V at

RSD = 300 kΩ and VBE ~ 0.7 V

ICONT+VCONT

RCONT

VBE

30 k

ON/OFF CONTROL

-4

-2VO

UT

(V

)

-5

-3

-1

VCONT

0

TA = 25 °C

0 1 2

I CO

NT

(µ

A)

4

2

5

3

1

0

ILPK

IL

t

L(SMALL) L(LARGE)

t

ILPK(MAX)-300 mA

INDUCTORSATURATION


TK11830

ILPK(MAX)

IC

IL

tON tOFF ti

ILPK(MAX)

-ILOAD

ILOAD∆Q1-

∆Q+

∆Q2-

t

CA

PA

CIT

OR

CU

RR

EN

TIN

DU

CT

OR

CU

RR

EN

T

INTERMITTENT OSCILLATION

When the ripple voltage applied to the feedback pin is largeand CFB is small, the power transistor switch drive is largeand the output voltage exceeds the desired value. Thiscauses the oscillator to stop for a period of ti. When theripple voltage is large and the power transistor is driven atmaximum capacity, a current up to ILPK(MAX) goes throughthe inductor.

Note: tON/tOFF = (|VOUT| + VF) / (VIN - VSAT)

tON = [ILPK(MAX) / (VIN - VSAT)] x L

tOFF = [ILPK(MAX) / (|VOUT| + VF)] x L

Since the charge of the capacitor is equivalent to thedischarge (∆Q+ = ∆Q1

- + ∆Q2-):

ILPK(MAX) = 2 x ILOAD x [(tON / tOFF) + 1] + 2 x ILOAD x (ti / tOFF)

ti = ([ILPK(MAX) / (2 x ILOAD)] x tOFF) - (tON + tOFF)

f = 1 / (tON + tOFF + ti)

When load current increases, ti becomes shorter.

As in the case above, if the load current is too small, thepower transistor becomes overdriven and intermittentoscillation will occur.

PACKAGE POWER DISSIPATION

The internal thermal protection circuit will operate when Tjis approximately 150 °C. When thermal protection operates,the power transistor switch will cycle between on and off tokeep Tj ≤ 150 °C. Thermal resistance Oja is determined by

mounting. The package power dissipation curve on aprinted circuit board is estimated as follows:

When Pin 4 is connected to GND (Power transistor switchis at maximum conductance), all input power is dissipatedby the IC at TA = room temperature. In this state Tj goes upto 150 °C and thermal protection operates. Input power isdefined as PIN = VIN x <IIN>, where <IIN> is the average ofinput current. From Tj = Oja x P + TA and Tj = 150 °C.P = PIN, TA = Room temp., Oja can be found. The powerdissipation curve shows the effect of mounting on thermalcharacteristics.

PLOSS, must be within this curve. The efficiency, E (%), isthe ratio between input and output power when the dc-dcconverter is operating.

PLOSS = PIN - POUT

= POUT x [(100 / E) - 1]

= |VOUT| x ILOAD x [(100 / E) - 1]


IIN

t

<IIN>

TA = 25 °CMOUNTED ON PCB

VIN VOSC

+ +

VFBVref

IIN

VIN

IIN WAVEFORM WHEN THERMAL PROTECTION ISOPERATING


TK11830

The components shown in the test circuit may be changedfor different operating conditions (input/output voltage,output current, inductor type, etc.) The performance of theDC-DC converter depends largely on the coil in use. Tooptimize efficiency, a coil with a low DC resistance shouldbe used, such as the Toko 646CY471M. Oscillation willbegin with an inductor value as low as 100 µH. However,if the Equivalent Series Resistance (ESR) is over 5 Ω,oscillation may not occur. The input and output capacitorsshould have a low ESR and high capacity since there is alarge ripple current present. For operation below 0 °C, thecapacitors should be selected for low ESR and goodtemperature stability at reduced temperatures. This isrequired to minimize ripple current. For low values of loadcurrent, a smaller coil can be used. For higher current, alarge coil is needed to prevent saturation. When the coilsaturates, the current increases dramatically, resulting ina severe overcurrent through the inductor. Please refer tothe following drawings.

PD (mW)

25 50 75 150TA (°C)

Tj = 150 °C

0 50 100TA (°C)

PD

(m

W)

1500

450

750

150

300

600 MOUNTED

FREE AIR

TIME

IND

UC

TO

R C

UR

RE

NT

INDUCTOR CURRENT WAVEFORM(NORMAL)

TIME

IND

UC

TO

R C

UR

RE

NT

INDUCTOR CURRENT WAVEFORM(SATURATED INDUCTOR)


17.5 mm

23

.0 m

m

OUT11830

VOUT

+COUT

R2 Di

R1 CFB

0.01

CREF

1 µF

ON/OFF300 kRS D

VIN GND

+

56 4

21 3

L

CIN

TK11830


TK11830

Marking Information

MarkingTK11830 N0

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-140-TK118300798O0.0K



0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

4560

- 0.

1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1






TK651xx

VIN

GND

SW

LOI

VOUT

CONTROLCIRCUIT

OSCILLATOR

Vref UVLO

BLOCK DIAGRAM



Tape/Reel Code

TK651xxM

VOLTAGE CODE27 = 2.7 V30 = 3.0 V33 = 3.3 V

Voltage Code

DESCRIPTIONThe TK651xx low power step-up DC-DC converter isdesigned for portable battery powered systems, capableof operating from a single battery cell down to 0.9 V. TheTK651xx provides the power switch and the control circuitfor a boost converter. The converter takes a DC input andboosts it up to a regulated 2.7, 3.0 or 3.3 V output .

The output voltage is laser-trimmed. A Low Output Indicatordetector (LOI) monitors the output voltage and provides anactive low microprocessor reset signal whenever theoutput voltage falls below an internally preset limit. Aninternal Undervoltage Lockout (UVLO) circuit is utilized toprevent the inductor switch from remaining in the “on”mode when the battery voltage is too low to permit normaloperation. Pulse Burst Modulation (PBM) is used to regulatethe voltage at the VOUT pin of the IC. PBM is the processin which an oscillator signal is gated or not gated to theswitch drive each period. The decision is made just beforethe start of each cycle and is based on comparing theoutput voltage to an internally-generated bandgapreference. The decision is latched, so the duty ratio is notmodulated within a cycle. The average duty ratio iseffectively modulated by the “bursting” and skipping of

pulses which can be seen at the SW pin of the IC. Specialcare should be taken to achieve reliability through the useof Oxide, double Nitride passivation. The TK651xx isavailable in a miniature 6-pin SOT-23L-6 surface mountpackage.

Customized levels of accuracy in oscillator frequency andoutput voltage are available.

TK651xx

GND

VIN

VOUT

LOI

SW

GND20P

FEATURES Guaranteed 0.9 V Operation


Internal Bandgap Reference

High Efficiency MOS Switching

Low Output Ripple

Microprocessor Reset Output

Laser-Trimmed Output Voltage

Laser-Trimmed Oscillator

Undervoltage Lockout

Regulation by Pulse Burst Modulation (PBM)


Cellular Telephones

Pagers





STEP-UP VOLTAGE CONVERTER WITH VOLTAGE MONITOR


TK651xx

Note 1: Derate at 0.8 mW/oC for operation above TA = 25 oC ambient temperature, when heat conducting copper foil path is maximized on the printedcircuit board. When this is not possible, a derating factor of 1.6 mW/ °C must be used.

TK651xx ELECTRICAL CHARACTERISTICSOver operating temperature range and supply voltage range, unless otherwise specified.

VIN

300 k ΩGND GND

LOI

VOUTSW

I(VIN )

IB

LD

C

I(VOUT )

IOUT

VOUTVIN

GENERAL CIRCUIT

ABSOLUTE MAXIMUM RATINGSAll Pins Except SW and GND .................................... 6 VSW Pin ....................................................................... 9 VPower Dissipation (Note 1) ................................ 400 mW

Storage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -20 to +80 °CJunction Temperature ........................................... 150 °C


f CSO ycneuqerFrotallicsOlanretnI V NI ,V3.1= I TUO Am0= 07 38 201 zHk

V )GER(TUO VfodlohserhTnoitalugeR TUO TA C°52= %5- V TUO %3+ V

∆V )DAOL(TUO VfonoitalugeRdaoL )GER(TUO V NI ,V3.1= I TUO Am4ot0= 0 05 Vm

∆V )ENIL(TUO VfonoitalugeReniL )GER(TUO∆V NI V52.0= 02- 0 02 Vm

D CSO rotallicsOfooitaRytuDemit-nO TA C°52= 54 05 55 %

V IOL V TUO noitisnarTIOLgniruD TA C°52= %5- 78.0 V TUO %4+ V


TK651xx

FINAL TEST CIRCUITVIN

300 kΩGND GND

LOI

VOUTSW

IB

L = 95 µFD

IOUT

VOUT

RS

1 K

VIN

CN10 µF

CD10 µF

CS220 pF

ROF

15+ +CU

10 µFNote: Inductor L: Toko A682AE-014 or equivalent Diode D: LL101 Capacitors CN:CU:CD: Panasonic TE series, ECS-TOJY106R

Above is the Final Test Circuit through which each of the production parts must pass. In this test circuit, the part is testedagainst the specification limits in the data sheet (the min. and max. values in the Electrical Characteristics) at roomtemperature, and is rejected if the tested values are outside the minimum (min.) and maximum (max.) values.

The Bench Test Circuits shown on the following pages are the circuits used most of the time to measure the typical (typ.)values in the Electrical Characteristics section, and make the Typical Performance graphs.

Note: In measuring the oscillator frequency and the Max IOUT on the bench, the converter was loaded until “no pulseskipping” mode was achieved.


TK651xx


V NI egatloVylppuS 09.0 06.1 V

I )Q(B )3etoN(tnerruCyrettaBdaoLoNV NI ,V3.1= I TUO ,Am0=TA C°52=

65 48 Aµ

V(I NI ) VotnitnerruCtnecseiuQ NI niPV NI ,V3.1= I TUO ,Am0=TA C°52=

5.21 02 Aµ

V(I TUO ) VotnitnerruCtnecseiuQ TUO niP V NI ,V3.1= I TUO ,Am0= 5.41 32 Aµ

∆f CSO /∆T rotallicsOfoytilibatSerutarepmeT V NI ,V3.1= gnippikSesluPoN 1.0 C°/%

V )GER(TUO VfodlohserhTnoitalugeR TUO TA C°52= 65.2 07.2 97.2 V

∆V TUO /∆T VfoytilibatSerutarepmeT )GER(TUO V NI ,V3.1= I TUO ,Am0= 001 C°/mpp

V )IOL(TUO V TUO noitisnarTIOLgniruD V NI ,V3.1= TA C°52= 42.2 63.2 54.2 V

∆V )IOL(TUO V )IOL(TUO siseretsyHdlohserhT TA C°52= 83 Vm

R )NO(WS niPWSfoecnatsiser-nO V TUO ≥ V4.2 0.1 Ω

FFE )3,2setoN(ycneiciffEretrevnoCV NI ,V3.1= I TUO ,Am6=

lioCFD3,Hµ59=L67 %

V VLU egatloVtuokcoLegatlovrednU TA )4etoN(,C°52= 54.0 97.0 V

I )XAM(TUO

ImumixaM TUO retrevnoCrof)3,1setoN(

V NI T,V1.1= A ,C°52=lioCFD3,Hµ59=L

6 6.7 Am


8 8.21 Am

V NI T,V1.1= A ,C°52=lioC37D,Hµ93=L

5.51 Am


6.33 Am

VIN

300 kΩGND GND

LOI

VOUTIND

IB

L = 95 µHD

IOUT

VOUT

RN

1 K

RS

1 K

VIN

CN10 µF

CO10 µF

I(VIN)

CS220 pF

I(VOUT)

CB10 µF

BENCH TEST CIRCUITInductor L: Toko A682AE-014 or equivalentDiode D: LL103A or equivalentCapacitors CN:CO:CB: Panasonic TE series,ECS-TOJY106R

TK65127 ELECTRICAL CHARACTERISTICSOver operating temperature range and supply voltage range, unless otherwise specified.

Note 1: Maximum load current depends oninductor value and input voltages.

Note 2: Output ripple depends on filtercapacitor values, ESRs and theinductor value.

Note 3: When using specified Toko inductorand Schottky diode with VF = 0.45 V@ 100 mA.

Note 4: Regulation not guaranteed.


TK651xx

TYPICAL PERFORMANCE CHARACTERISTICSTK65127

OSCILLATOR FREQUENCY VS.TEMPERATURE

95

-50 0 50 100

TEMPERATURE (°C)

f OS

C (

kHz)

90

85

80

75

OUTPUT REGULATION VOLTAGE VS.TEMPERATURE

TEMPERATURE (°C)

VO

UT

(RE

G)

(V)

-50 0 50 100

2.75

2.70

2.65

2.80

2.60

BATTERY CURRENT VS.INPUT VOLTAGE

120

0 .5 1 1.5 2 2.5 3

VIN (V)

I B (

µA

)

100

60

80

40

20

0

TA = 25 °CNO LOAD

VO

UT

(V

)

OUTPUT VOLTAGE VS. LOAD CURRENT

IOUT (mA)

1 10 100

2.8

2.7

2.5

2.4

2.6

TA = 25 °CL = 95 µHTOKO P/N: A682AE-014(3DF SERIES)

VIN = 0.9 V 1.3 V

1.1 V 1.6 V

VO

UT

(V

)


IOUT (mA)

1 10 100

2.8

2.7

2.5

2.4

2.6

TA = 25 °CL = 100 µHTOKO P/N: A636CY-101M(D73 SERIES)

VIN = 0.9 V 1.3 V

1.1 V 1.6 V

VO

UT

(V

)


IOUT (mA)

1 10 100

2.8

2.7

2.5

2.4

2.6


VIN = 0.9 V 1.3 V

1.1 V 1.6 V

EF

F (

%)

EFFICIENCY VS. LOAD CURRENT

IOUT (mA)

85

90

600.1 1 10 100

L = 95 µFToko P/N: A682AE-014(3DF SERIES) SMALL COIL

80

75

70

65

1.6 V

1.1 V1.3 V

VIN = 0.9 V

TA = 25 °C

EF

F (

%)


IOUT (mA)

85

90

600.1 1 10 100

L = 100 µFToko P/N: 636CY-101M(D73 SERIES) LARGER COIL

80

75

70

65

1.6 V

1.1 V

1.3 V

TA = 25 °C

VIN = 0.9 V

MAXIMUM OUTPUT CURRENT VS.INDUCTOR VALUE (µH)

40

0 40 80 120 160

INDUCTOR VALUE (µH)

I OU

T(M

AX

) (m

A)

VIN = 0.9 V

30

20

10

0

NO PULSESKIPPINGMODETA = 25 °C

50

1.1 V 1.3 V


TK651xx




97 111 Aµ


02 53 Aµ

V(I TUO ) VotnitnerruCtnecseiuQ TUO niP V NI ,V3.1= I TUO ,Am0= 22 04 Aµ






R )NO(WS niPWSfoecnatsiser-nO V TUO V4.2 0.1 Ω


lioCFD3,Hµ59=L77 %


I )XAM(TUO



4 7.6 Am


6 8.01 Am


0.41 Am


6.82 Am

VIN

300 kΩGND GND

LOI

VOUTIND

IB

L = 95 µHD

IOUT

VOUT

RN

1 K

RS

1 K

VIN

CN10 µF

CO10 µF

I(VIN)

CS220 pF

I(VOUT)

CB10 µF








TK651xx



95

-50 0 50 100

TEMPERATURE (°C)

f OS

C (

kHz)

90

85

80

75

OUTPUT REGULATION VOLTAGE VS.TEMPERATURE

TEMPERATURE (°C)

VO

UT

(RE

G)

(V)

-50 0 50 100

3.05

3.00

2.95

3.10

2.90


300

0 .5 1 1.5 2 2.5 3

VIN (V)

I B (

µA

)

250

150

200

100

50

0

TA = 25 °CNO LOAD

VO

UT

(V

)


IOUT (mA)

1 10 100

3.1

3.0

2.8

2.7

2.9


VIN = 0.9 V

1.1 V

1.3 V

1.6 V

2.0 V

2.5 V

VO

UT

(V

)


IOUT (mA)

1 10 100

3.1

3.0

2.8

2.7

2.9


1.1 V

VIN = 0.9 V1.3 V

1.6 V

2.0 V

2.5 V

VO

UT

(V

)


IOUT (mA)

1 10 100

3.1

3.0

2.8

2.7

2.9


VIN = 0.9 V

1.1 V

1.3 V

1.6 V

2.0 V

2.5 V

EF

F (

%)


IOUT (mA)

85

90

600.1 1 10 100


80

75

70

65

1.6 V

1.1 V

1.3 V

2.5 V

2.0 V

TA = 25 °C

VIN = 0.9 V

EF

F (

%)


IOUT (mA)

85

90

60 0.1 1 10 100


80

75

70

65

1.6 V

1.1 V

1.3 V

2.0 V

2.5 V

TA = 25 °C

VIN = 0.9 V


40

0 40 80 120 160


I OU

T(M

AX

) (m

A)

VIN = 0.9 V

30

20

10

0


50

1.1 V 1.3 V


TK651xx




88 431 Aµ


02 53 Aµ

V(I TUO ) VotnitnerruCtnecseiuQ TUO niP V NI ,V3.1= I TUO ,Am0= 42 04 Aµ






R )NO(WS niPWSfoecnatsiser-nO V TUO ≥ V4.2 0.1 Ω


lioCFD3,Hµ59=L08 %


I )XAM(TUO



4 5.6 Am


6 0.8 Am


5.21 Am


0.02 Am

VIN

300 kΩGND GND

LOI

VOUTIND

IB

L = 95 µHD

IOUT

VOUT

RN

1 K

RS

1 K

VIN

CN10 µF

CO10 µF

I(VIN)

CS220 pF

I(VOUT)

CB10 µF








TK651xx

VO

UT

(V

)


IOUT (mA)

1 10 100

3.4

3.3

3.1

3.0

3.2


VIN = 0.9 V

1.1 V

1.3 V

1.6 V

2.0 V

2.5 V


95

-50 0 50 100

TEMPERATURE (°C)

f OS

C (

kHz)

90

85

80

75

VO

UT

(V

)


IOUT (mA)

1 10 100

3.4

3.3

3.1

3.0

3.2


VIN = 0.9 V

1.1 V

1.3 V

1.6 V

2.0 V

2.5 V

OUTPUT REGULATION VOLTAGEVS. TEMPERATURE

TEMPERATURE (°C)

VO

UT

(RE

G)

(V)

-50 0 50 100

3.35

3.30

3.25

3.40

3.20


300

0 .5 1 1.5 2 2.5 3

VIN (V)

I B (

µA

)

250

150

200

100

50

0

TA = 25 °CNO LOAD

VO

UT

(V

)


IOUT (mA)

1 10 100

3.4

3.3

3.1

3.0

3.2


VIN = 0.9 V

1.1 V

1.3 V

1.6 V

2.0 V

2.5 V

EF

F (

%)


IOUT (mA)

85

90

600.1 1 10 100


80

75

70

651.6 V

1.1 V1.3 V

2.5 V

TA = 25 °C

VIN = 0.9 V

2.0 V


16

0 40 80 120 160


I OU

T(M

AX

) (m

A)

VIN = 0.9 V

12

8

4

0


20

1.1 V1.3 V


EF

F (

%)


IOUT (mA)

85

90

600.1 1 10 100


80

75

70

65

1.6 V

1.1 V

1.3 V

2.0 V

2.5 V

TA = 25 °C

VIN = 0.9 V


TK651xx

filtering component values (consult the “Ripple and NoiseConsiderations” section) can be determined if needed ordesired.

The TK651xx runs with a fixed oscillator frequency, and itregulates by applying or skipping pulses to the internalpower switch. This regulation method is called Pulse BurstModulation (PBM).

ANALYSIS OF SWITCHING CYCLE

Above is the input or inductor current waveform over aswitching cycle.

From an oscillator standpoint, the switching cycle consistsof only an on-time and an off-time. But from an inductorcurrent standpoint, the switching cycle breaks down intothree important sections: on-time, off-time, and deadtime.The on-time of the switch and the inductor current aresynonymous. During the on-time, the inductor currentincreases. During the off-time, the inductor currentdecreases as it flows into the output. When the inductorcurrent reaches zero, that marks the end of the inductorcurrent off-time. For the rest of the cycle, the inductorcurrent remains at zero. Since no energy is being eitherstored or delivered, that remaining time is called “deadtime.”This mode of the inductor current decaying to zero everycycle is called “discontinuous mode.” In summary, energyis stored in the inductor during on-time, delivered to theoutput during off-time, and remains at zero during deadtime.

The TK651xx is a boost converter control IC with the powerMOSFET switch built into the device. It operates from asingle battery cell and steps up the output voltage to aregulated 2.7, 3.0 and 3.3 V. The device operates at afixed nominal clock frequency of 83 kHz.

In its simplest form, a boost power converter using theTK651xx requires only three external components: aninductor, a diode, and a capacitor.

The analysis is easier to follow when referencing thesimple boost circuit below.

THEORY OF OPERATION

The converter operates with one terminal of an inductorconnected to the DC input and the other terminal connectedto the switch pin of the IC. When the switch is turned on, theinductor current ramps up. When the switch is turned off (or“lets go” of the inductor), the voltage flies up as the inductorseeks out a path for its current. A diode, also connected tothe switching node, provides a path of conduction for theinductor current to the boost converter’s output capacitor.The TK651xx monitors the voltage of the output capacitorand has a 2.7, 3.0 and 3.3 V threshold at which theconverter switching becomes deactivated. So the outputcapacitor charges up to 2.7, 3.0 and 3.3 V and regulatesthere, provided that no more current is drawn from theoutput than the inductor can provide. The primary task,then, in designing a boost converter with the TK651xxis to determine the inductor value (and its peak currentrating to prevent inductor core saturation problems)which will provide the amount of current needed toguarantee that the output voltage will be able tomaintain regulation up to a specified maximum loadcurrent. Secondary necessary tasks also include choosingthe diode and the output capacitor. Then the snubber and

SINGLE-CELL APPLICATION

FIGURE 1: SIMPLE BOOST CONVERTER

VIN

GND GND

LOI

VOUTSW

+

VOUT

IPEAK

di/dt = - (VOUT + Vf - VIN)/ L

t (off) t (deadtime)t (on)

di/dt = VIN / L


TK651xx

where “VIN” is the input voltage, “D” is the on-time duty ratioof the switch, “f ” is the switching (oscillator) frequency, “L”is the inductor value, “VOUT” is the output voltage, and “VF”is the diode forward voltage. It is important to note thatEquation 1 makes the assumption stated in Equation 2:

VIN ≤ (VOUT + VF)(1 - D)(2)

The implication from Equation 2 is that the inductor willoperate in discontinuous mode .

Using worst-case conditions, the inductor value can bedetermined by simply transforming the above equation interms of “L”:

(3)

where “VF(MAX)” is best approximated by the diode forwardvoltage at about two-thirds of the peak diode current value.The peak diode current is the same as the peak inputcurrent, the peak switch current, and the peak inductorcurrent. The formula is:

(4)

Some reiteration is implied because “L” is a function of “VF”which is a function of “IPK” which, in turn, is a function of “L”.The best way into this loop is to first approximate “VF”,determine “L”, determine “IPK”, and then determine a new“VF”. Then, if necessary, reiterate.

When selecting the actual inductor, it is necessary to makesure that peak current rating of the inductor (i.e., thecurrent which causes the core to saturate) is greater thanthe maximum peak current the inductor will encounter. Todetermine the maximum peak current, use Equation 4again, but use maximum values for “VIN” and “D”, andminimum values for “f ” and “L”.

It may also be necessary when selecting the inductor tocheck the rms current rating of the inductor. Whereas peakcurrent rating is determined by core saturation, rms current

The output current of the boost converter comes from thesecond half of the input current triangle waveform (averagedover the period or multiplied by the frequency) given by theequation:

IOUT = [IPK x t(off)] x f / 2

and:

IPK = (VIN / L) x t(on) = VIN D / f L

and:

t(off) = IPK / [(VOUT + VF - VIN) / L] =(VIN D / f L) / [(VOUT + VF - VIN) / L = VIN D / f (VOUT + VF - VIN)

therefore:

IOUT = (VIN)2 (D)2 / 2 f L (VOUT + VF - VIN)

which derives Equation 1 of the next section.

INDUCTOR SELECTION

It is under the condition of lowest input voltage that theboost converter output current capability is the lowest fora given inductance value. Three other significantparameters with worst-case values for calculating theinductor value are: highest switching frequency, lowestduty ratio (of the switch on-time to the total switchingperiod), and highest diode forward voltage. Otherparameters which can affect the required inductor value,but for simplicity will not be considered in this first analysisare: the series resistance of the DC input source (i.e., thebattery), the series resistance of the internal switch, theseries resistance of the inductor itself, ESR of the outputcapacitor, input and output filter losses, and snubberpower loss.

The converter reaches maximum output current capabilitywhen the switch runs at the oscillator frequency, withoutpulses being skipped. The output current of the boostconverter is then given by the equation:

(1)

SINGLE-CELL APPLICATION (CONT.)

2 f L (VOUT + VF - VIN)IOUT =

(VIN)2 (D)2

2 f(MAX) IOUT(MAX) [VOUT(MIN) + VF(MAX) - VIN(MIN)]L(MIN) =

VIN(MIN)2 D(MIN)

2

f LIPK =

VIN D


TK651xx

rating is determined by wire size and power dissipation inthe wire resistance. The inductor rms current is given by:

(5)

where “IPK” is the same maximized value that was just usedto check against inductor peak current rating, and the termin the numerator within the radical that is added to the[on-time] duty ratio, “D”, is the off-time duty ratio.

Toko America, Inc. can offer a miniature matchedmagnetic solution in a wide range of inductor values andsizes to accommodate varying power level requirements.The following series of Toko inductors work especially wellwith the TK651xx : 10RF, 12RF, 3DF, D73, and D75. The5CA series can be used for isolated-output applications,although such design objectives are not considered here.

OTHER CONVERTER COMPONENTS

In choosing a diode, parameters worthy of considerationare: forward voltage, reverse leakage, and capacitance.The biggest efficiency loss in the converter is due to thediode forward voltage. A Schottky diode is typically chosento minimize this loss. Possible choices for Schottky diodesare: LL103A from ITT MELF case; 1N5017 from Motorola(through hole case); MBR0530 from Motorola (surfacemount) or 15QS02L from Nihon EC (surface mount).

Reverse leakage current is generally higher in Schottkysthan in pin-junction diodes. If the converter spends a gooddeal of the battery lifetime operating at very light load (i.e.,the system under power is frequently in a standby mode),then the reverse leakage current could become a substantialfraction of the entire average load current, thus degradingbattery life. So don’t dramatically oversize the Schottkydiode if this is the case.

Diode capacitance isn’t likely to make much of anundesirable contribution to switching loss at this relativelylow switching frequency. It can, however, increase thesnubber (look in the “Ripple and Noise Considerations”section) dissipation requirement.

The output capacitor, the capacitor connected from thediode cathode to ground, has the function of averaging the


current pulses delivered from the inductor while holding arelatively smooth voltage for the converter load. Typically,the ripple voltage cannot be made smooth enough by thiscapacitor alone, so an output filter is used. In any case, tominimize the dissipation required by the output filter, theoutput capacitor should still be chosen with considerationto smoothing the voltage ripple. This implies that itsEquivalent Series Resistance (ESR) should be low. Thisusually means choosing a larger size than the smallestavailable for a given capacitance. To determine the peakripple voltage on the output capacitor for a single switchingcycle, multiply the ESR by the peak current which wascalculated in Equation 4. ESR can be a strong function oftemperature, being worst-case when cold. The capacitanceshould be capable of integrating a current pulse with littleripple. Typically, if a capacitor is chosen with reasonablylow ESR, and if the capacitor is the right type of capacitorfor the application (typically aluminum electrolytic ortantalum), then the capacitance will be sufficient.

ESR and printed circuit board layout have strong influenceon RF interference levels. Special care must be taken tooptimize PCB layout and component placement.

THE BENEFITS OF INPUT FILTERING

In practice, it may be that the peak current (calculated inEquation 4) flowing out of the battery and into the converterwill cause a substantial input ripple voltage dropped acrossthe resistance inside the battery. This becomes a morelikely case for cold temperature (when battery seriesresistance is higher), higher load rating converters (whoseinductors must draw higher peak currents), and when thebattery is undersized for the peak current application.

While the simple analysis used a parameter “VIN” torepresent the converter input voltage in the equations, onemay not know what “VIN” value to use if it is delivered by abattery that allows high ripple to occur. For example,assume that the converter draws a peak current of 100 mAfor a 1 V input, and assume that the input is powered by apartially discharged AAA battery which might have a seriesresistance of 2 Ohms at 0 °C. (Environmentally clean, socalled “green” batteries tend to have higher sourceresistance than their “unclean” predecessors). If suchpartially discharged battery voltage is 1 V without load, theconverter battery voltage will sag to about 0.8 V during theon-time. This can cause two problems: 1) with the effectiveinput voltage to the converter reduced in this way, theconverter output current capability will decrease,

3

IL(RMS) = IPK D +IPK f L

VOUT + VF - VIN


TK651xx

VIN

300 kΩGND GND

LOI

VOUTSW

IB

L = 95 µFD

IOUT

VOUT

RN

1 K

RS

1 K

VIN

CN10 µF

CD10 µF

CS220 pF

ROF

15+ +CU

10 µF

FIGURE 2: FILTERED TEST CIRCUIT


2) if the same battery is powering the TK651xx at the VINpin (i.e., the normal case), then the IC may becomeinoperable due to insufficient VIN. This is why the applicationtest circuit features an RC filter into the VIN pin. The currentdraw is very small, so the voltage drop across this filterresistor is negligible. The filter serves to average out theinput ripple caused by the battery resistance. Note that thisfilter is optional, and the net effect of its use is the extensionof battery life by allowing the battery to be discharged moredeeply.

A more power-efficient method comes at the price of alarge capacitor. This can be placed in parallel with thebattery to help channel the converter current pulses awayfrom the battery. The capacitor must have low ESRcompared to the battery resistance in order to accomplishthis effectively.

Still another solution is to filter the DC input with an LCfilter. However, it is more likely that the filter will be eithertoo large or too lossy. It is of questionable benefit to smooththe input if the DC loss through the filter is large.

Assuming that input ripple voltage at the battery terminaland converter input is large, and that we filter the VIN pin ofthe IC as in the test circuit, then the parameter “VIN” in theprevious equations is not usable, and we will need to useparameters to represent both the source voltage and thesource resistance.

SWITCH ON-RESISTANCE, INDUCTOR WINDINGRESISTANCE, AND CAPACITANCE ESR

The on-resistance of the TK651xx’s internal switch isabout 1 Ohm maximum. Using the previously statedexample of 100 mA peak current, the voltage drop acrossthe switch would reach 100 mV during the on-time. Thissubtracts from the voltage which is impressed across theinductor to store energy during the on-time. As a result,less energy is delivered to the output during the off-time.

If the winding resistance of the inductor increases to 1 Ohmor greater, the voltage drop across the winding resistancealso subtracts from the voltage used to store energy in thecore. Thus, efficiency degradation occurs.

As the inductor delivers energy into the output capacitorduring the off-time, its current decays at a rate proportionalto the voltage drop across it. The idealized equationsassume that the voltage at the switching node is clamped

at a diode drop above the output voltage. However, theESR of the output capacitor can increase the voltage dropacross the inductor by the additional voltage droppedacross the ESR when the peak current flows in it. Forexample, the voltage across a capacitor with an ESR of 2Ohms (not unusual at cold temperature) would jump by200 mV when 100 mA peak current began to flow in it. Thisextra voltage drop would cause the inductor current toramp down more quickly, thus depleting the availableoutput current. Possible choices for low ESR capacitorsare: Panasonic TE series (surface mount); AVX TPSseries (surface mount); Matsuo 267 series (surface mount);Sanyo OS-CON series.

LOI FEATURES

The Low Output Indicator (LOI) output can provide a resetsignal to a microprocessor or other external systemcontroller. When the output voltage falls below the LOIthreshold (during start-up of the converter or under acurrent overload fault condition), the LOI signal is assertedlow, indicating that the system controller (i.e.,microprocessor) should be in a reset mode. This methodof reset control can be used to prevent improper systemoperation which might occur at low supply voltage levels.The LOI threshold voltage is between 87% and 93% of theregulated output voltage value. The LOI threshold also hasabout 45 mV hysteresis between its on-off trigger levels.

RIPPLE AND NOISE CONSIDERATIONS

The filtered test circuit of the TK651xx is shown below inFigure 2.


TK651xx


Compared to the simple boost circuit, this Filtered TestCircuit adds the following circuitry: the RC filter into the VINpin, the RC snubber, the RC filter at the converter output,and the pull-up resistor to the LOI pin.

The RC filter at the VIN pin is used only to prevent the ripplevoltage at the battery terminals from prematurely causingundervoltage lockout of the IC. This is only needed whenthe inductor value is relatively small and the batteryresistance is relatively high and the VIN range must extendas low as possible.

The snubber (optional) is composed of a series RC networkfrom the switch pin to ground (or to the output or input ifpreferred). Its function is to dampen the resonant LC circuitwhich rings during the inductor current deadtime. Whenthe current flowing in the inductor through the output diodedecays to zero, the parasitic capacitance at the switch pinfrom the switch, the diode, and the inductor winding hasenergy which rings back into the inductor, flowing back intothe battery. If there is no snubbing, it is feasible that theswitch pin voltage could ring below ground. Although theIC is well protected against latch-up, this ringing may beundesirable due to radiated noise. To be effective, thesnubber capacitor should be large (e.g., 5 ~ 20 times) incomparison to the parasitic capacitance. If it is unnecessarilylarge, it dissipates extra energy every time the converterswitches. The resistor of the snubber should be chosensuch that it drops a substantial voltage as the ringingparasitic capacitance attempts to pull the snubber capacitoralong for the ride. If the resistor is too small (e.g., zero), thesnubber capacitance just adds to the ringing energy. If theresistor is too large (e.g., infinite), it effectively disengagesthe snubber capacitor from fighting the ringing.

The RC filter at the converter output attenuates theconducted noise; the converter may not require this.

Finally, the pull-up resistors at the LOI pin are needed onlyif this output signal is used. Most of this circuitry whichappears in the test circuit has been added to minimizeripple and noise effects. But when this is not critical, thecircuit can be minimized.

When any DC-DC converter is used to convert power in RFcircuits (e.g., pagers) the spectral noise generated by theconverter, whether conducted or radiated, is of concern.The oscillator of the TK651xx has been trimmed andstabilized to 83 +/- 4 kHz with the intention of greatly

minimizing interference at the common IF frequency of455 kHz.

In comparison with conventional IC solutions, where theoscillator frequency is not controlled tightly, the TK651xxcan achieve as much as 20-30 dB improvements in RFinterference reduction by means of its accurately controlledoscillator frequency. This IF frequency is halfway betweenthe fifth and sixth harmonics of the oscillator. The fifthharmonic of the maximum oscillator frequency and thesixth harmonic of the minimum oscillator frequency stillleave a 39 kHz band centered around 455 kHz withinwhich a fundamental harmonic of the oscillator will not fall.Since the TK651xx operates by Pulse Burst Modulation(PBM), the switching pattern can be a subharmonic of theoscillator frequency. The simplest example, and the one tobe avoided the most, is that of the converter causing everyother oscillator pulse to be skipped. This means that theswitching pattern would have a fundamental frequency ofone-half the oscillator frequency, or 41.5 kHz. This is theeleventh harmonic, which lands at 456.5 kHz, right in theIF band. Fortunately, the energy is rather weak at theeleventh harmonic. Even more fortunate is the ease withwhich that regulation mode is avoided.

The internal regulator comparator has a finite hysteresis.When an additional output filter is used (e.g., the RC filterof the test circuit, or an LC filter), the ripple at the regulationnode is minimized. This limits the rate at which the oscillatorcan be gated. In practice, this means that rather thanexhibiting a switching pattern of skipping every otheroscillator pulse, it would be more likely to exhibit a switchingpattern of three or four pulses followed by the samenumber of pulses skipped. Although this also tends toincrease the output ripple, it is low frequency and has lowmagnitude (e.g., 10 kHz and 10 mV) which tends to be oflittle consequence.


TK651xx

HIGHER-ORDER DESIGN EQUATION

The equation above was developed as a closed form approximation. In order to allow for a closed form, the design variablethat requires the least approximation was “IOUT,” as opposed to “L.”

The approximations made in the equation development have the primary consequence that error is introduced asresistive losses become relatively large. As it is normally a practical design goal to ensure that resistive losses will berelatively small, this seems acceptable. The variables used are:

IOUT Output current capability IOUT(TGT) Targeted output current capability VOUT Output voltage VF Diode forward voltage

VBB Battery voltage, unloaded D Oscillating duty ratio of main switchf Oscillator frequency L Inductance valueRS Source resistance (battery + filter) RL Inductor winding resistanceRSW Switch on-state resistance ROF Output filter resistanceRU ESR of upstream output capacitor CS Snubber capacitance

Deriving a design solution with this equation is necessarily an iterative process. Use worst-case tolerances as describedfor inductor selection, using different values for “L” to approximately achieve an “IOUT” equal to the targeted value. Then,fine tune the parasitic values as needed and, if necessary, readjust “L” again and reiterate the process.


ƒCS [VBB2+ (VOUT+ VF)2 + (VOUT + VF - VBB)2 ]

2(VOUT + VF)IOUT =

VOUT + ROFIOUT(TGT) + (VBBRU) + VF - VBB 1 - (RS+ RL)2ƒ L

D ( 2ƒ L

D )2ƒ L

D [)( 2ƒ L

D1- (RS + RL + RSW) ]

2

-VBB

2 D


TK651xx

DUAL-CELL APPLICATION

There are special considerations involved in designing aconverter with the TK651xx for use with two battery cells.With two battery cells, the TK651xx can provide substantiallymore output current than a single cell input for the sameefficiency.

The concern is the possibility of saturating the inductor.For a single-cell input, it was only necessary to choose thecurrent capability in accordance with the maximum peakcurrent that could be calculated using Equation 4. For atwo-cell input, the peak current is not so readily determinedbecause the inductor can go into continuous mode. Whenthis happens, the increase of current during the on-timeremains more or less the same (i.e., approximately equalto the peak current as calculated using Equation 4, but theinductor current doesn’t start from zero. It starts fromwhere it had decayed to during the previous off-time.There is no deadtime associated with a single switchingperiod when in continuous mode because the inductorcurrent never decays to zero within one cycle.

The cause for continuous mode operation is readily seenby noting that the rate of current increases in the inductorduring the on-time is faster than the rate of decay thanduring the off-time. This is because there is more voltageapplied across the switching during the on-time (twobattery cells) than during the off-time (3 volts plus a diodeminus two cells). That situation, in conjunction with aswitch duty ratio of about 50%, implies that the currentcan’t fall as much as it can rise during a cycle. So, when aswitching cycle begins with zero current in the inductor, itends with current still flowing.

Continuous mode operation implies that the inductor valueno longer restricts the output current capability. Withdiscontinuous mode operation, it is necessary to choose alower inductor value to achieve a higher output currentrating (Equation 6 specifically shows “IOUT” as a function of“L”). This also implies higher ripple current from the battery.In continuous mode operation, one can choose a largerinductor value intentionally if it is desirable to minimizeripple current. The catch is that high inductance and highcurrent rating together generally imply higher inductancesize. But generally, this unrestricted inductor value allowsmore freedom in the converter design.

The dual cell input and the continuous current rating implythat the peak current in the inductor will be at least twice ashigh as it would be for a single-cell input using the same

inductor value. The Toko D73 and D75 series inductorsare partially suited for the higher output current capabilityof the dual-cell configuration.

For operation at a fixed maximum load, the inductor can bekept free of saturation by choosing its peak current ratingequal to the converter output current rating plus the singlecycle ripple current peak given Equation 4. With thatguideline followed, the risk of saturation becomes only adynamic problem. Under the situation of placing a dynamicload on the output of the converter, saturation may occur.Fortunately, unlike off-line powered converters, batterypowered converters tend to be quite forgiving of dynamicsaturation, due to the limitation of available power.

Start-up of the converter is an example of a practicallyunavoidable dynamic load change (complicated by anoutput operating point change) that can cause saturationof the inductor. However, this particular phenomenonapplies to single-cell powered converters, too. Hence,saturation is not entirely avoidable, yet does not causesystem problems. It is beyond the scope of this applicationnote to quantify the practical limitations of allowed dynamicsaturation and how stressful it may be to the variouscomponents involved. It is left to the user to examineempirically the dynamic saturation phenomenon anddetermine what performance is acceptable. In most cases,no problem will be exhibited.


TK651xx

HOW TO MAKE A STEP-DOWN CONVERTER USING THE TK651xx AND AN IRF7524D1 “FETKY” PART

The TK651xx can be used as a controller in a step-down converter with the following two additional changes. See Fig 3.

1) Change the main switch orientation for use in a step-down converter. An external P-channel power MOSFET isused as the main switch in a step-down converter configuration. The gate of FET is turned on through a resistor dividerbeing pulled down to GND by the internal output transistor of the TK651xx. This application requires both a logic levelP-channel MOSFET and a Schottky diode. An IRF7524D1 “FETKY” part contains both in a small micro 8 package.

2) Change the voltage seen at the V IN pin of the TK651xx to below the regulation voltage at the VOUT pin. A resistordivider between the converter VIN and the chip VIN pin drops the voltage seen at the VIN pin. If the VIN pin is a higher voltagethan the VOUT pin, the TK651xx will not regulate the output, but will continue to pulse its output transistor.

WHERE TO USE THIS STEP-DOWN CONVERTER

The TK65130 is a Pulse Burst Modulation (PBM) controller with a fixed duty cycle of approximately 50%. Therefore, onlyif VBATT is more than twice the voltage of VOUT can the converter run in CCM (continuous current mode). The convertercan and does regulate in DCM (discontinuous current mode) for lighter output current loads with VIN less than twice thevoltage of VOUT. But DCM produces more peak current and more ripple current than CCM. Below is a table giving someexamples of where this type of step-down converter might be used.

1 k

+

R3

150R4

10 kR1

3.9 kR2

TK65130U1

10 µH

C2

U2L1

3

1 4

2

5

VINVOUT

GND

SW

IRF7524D1

1,24

3

R71 k

C1

5,6,7,8

+

47 µFC3

47 µF

6LOI

R5

R6

300 k

300 k

VBATT VOUT

220 pFGND

STEP-DOWN CONVERTER APPLICATION

FIGURE 3: STEP-DOWN CONVERTER USING THE TK651xx SCHEMATIC

Note 1: Li-ion cell voltage range 2.7 V to 4.2 VNote 2: NiMH cell voltage range 1.1 V to 1.3 V

Type Battery # of Cells VBATT Range VOUT Typ. Max. IOUT Oper. Mode Inductor Li-ion 2 (Note 1) 5.4 to 8.4 V 3.0 V 500 mA DCM 10 µH NiMH 4 (Note 2) 4.4 to 5.2 V 3.0 V 500 mA DCM 10 µH NiMH 6 (Note 2) 6.6 to 7.8 V 3.0 V 500 mA CCM 120 µH

Note: L = 10 µHToko P/N: 636CY-100MD73C Coil


TK651xx

THE AMOUNT OF BOARD SPACE NEEDED TO IMPLEMENT THIS STEP-DOWN CONVERTER

An evaluation board for this converter has been made using a TOKO 3DF, D73 or D75 series inductor, using only 0.96sq. inches of board space. The artwork for the surface-mount circuit board is shown below in Figure 4.

Note: Short pin 2 to 5 for use with TK651xx

FIGURE 4: TK651xx STEP-DOWN CONVERTER EVALUATION BOARD ARTWORK

STEP-DOWN CONVERTER APPLICATION (CONT.)

G

G

VIN

VOUT

LBI

LOI

Actual Size

1.2 "

.8 "


TK651xx

PULSED LOAD APPLICATION

Often in the world of power conversion, the current draw of the load circuit is not constant, but rather pulsed. It is commonin power supply design to size the power path large enough, and make the feedback loop fast enough to support thesepulsed maximum currents. For applications where the pulse width is long or unpredictable, this approach may bewarranted. However, in applications where the pulse width and maximum frequency of occurrence is predictable, suchas digital cell phones or two-way pagers, it may be easier and wiser to increase the energy storage in the output filterof the power supply and keep the power path small. This leads to the need for a very large value output capacitor.Panasonic makes a series AL gold cap “super cap” which is a low voltage, large value capacitor in the one farad range.

Before designing a low power DC-DC converter with a “super cap” in its output filter, it is necessary to know the loadingprofile (the waveform of the current going into the load from the output of the converter) of the application in which it isto be used. The converter can then be designed so that the “super cap” can be recharged in the time before the next bigdischarge current pulse comes along.

Figure 5 is an example “super cap” charge/discharge diagram showing that the charge into the cap needs to equal thecharge leaving the cap during discharge. This diagram comes from the loading and unloading profile information. Inreality, some extra charge needs to go into the cap to make up for the losses caused by ESR of the cap.

Figure 6 is a schematic for this “super cap” example application.

VIN

"SUPERCAP"1 F

GOLD CAP

GND GND

LOI

VOUTIND

IB

L = 39 µF D

IOUT

VOUTVIN

RS1 k

CS220 pF

+

+

-CD

10 µF

RN1 k

CN10 µF

30 mA

2 s

60 ms

time

1A

IOUT

FIGURE 6: PULSED LOAD “SUPER CAP” APPLICATION SCHEMATIC

Note: Equal charge into and out of “supercap”2 s (30 mA) = 60 ms (1A)

Drawing not to scale

FIGURE 5: “SUPER CAP” CHARGE/DISCHARGE DIAGRAM


TK651xx

Marking Information

MarkingTK65127 27MTK65130 30MTK65133 33M

0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

4560

- 0.

1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1

SOT-23L-6

PACKAGE OUTLINE











Switching Power Supply ICs

PartNumber Function Features

TK75001 Primary Side Controller5 pin Primary Side PWM ControllerOptimized for off-line power supplies

TK75003PFC/Primary Side

Controller5 pin Power Factor CorrectorPrimary Side PWM Controller

TK75020 ZVS Resonant ControllerLow cost, High performance, zero voltageswitching resonant controller

TK75050 Smart MOSFET DriverIntegral short circuit protectionCycle by cycle current limitingUVLO with first pulse wakeup

TK83854 Power Factor ControllerControl boost PWM to 0.99 power factorWorld wide operation without switchesLicensed second source for UC3854


TK75001

OSCILLATOR

FB

CT

ICHG205 µA

fCLK

T Q

TOGGLE FF

SLOPECOMPENSATION

1.35 V

PWM LATCH

DRV

CURRENTCONTROL

DETECTOR

OVERCURRENTDETECTOR

GND

BANDGAPREFERENCE

UVLO

14.5 V10.5 V

VCC

S

R

Q

IFR146 µA

ICT

FREQUENCYREDUCTION

LATCH

17.5 V

0.98 V

S

Q

R

IDS2 mA

APPLICATIONS Off-Line Power Supplies

Industrial Power Supplies

Telecom Power Supplies

Off-Line Battery Chargers

FEATURES Optimized for Off-Line Operation

Maximum Duty Ratio 44% (typ.)

Maximum Clock Frequency Above 1 MHz

Frequency Reduction for Improved Overcurrent

Protection

Low Standby Current for Current-Fed Start-Up

Current-Mode or Voltage-Mode Control

Internal User-Adjustable Slope Compensation

Functionally Integrated & Simplified 5-pin Design

TK75001

BLOCK DIAGRAM

DESCRIPTION

The TK75001 is a simplified primary side controlleroptimized for off-line switching power supplies. It is suitablefor both voltage-mode and current-mode control and hasadvanced features not available in controllers with a higherpin count. The key to full functionality in a 5-pin design isthat the current signal and the error signal are addedtogether and fed into the feedback pin. A sawtooth currentflowing out of the feedback pin provides a slopecompensation ramp (in current-mode applications) or aPWM ramp (in voltage-mode applications), in proportion tothe resistance terminating that pin. If the sum of the currentsense signal, error signal and ramp signal exceeds theOvercurrent Detector threshold indicating that the CurrentControl Detector has lost control of the switch current, thecharging current of the timing capacitor will be reduced toabout 25% for the remainder of the clock period. Thereduced charging current causes no more than a one-thirdreduction in switching frequency, effectively preventingshort-circuit current runaway.

The TK75001 is available in an 8-pin DIP package.


TAPE/REEL CODEMG: Magazine

Tape/Reel Code

TK75001D

Temperature Code


75001

GND

DRV

NC

VCC

GND NC

FBCT

Note: Pins 2 and 3 must be externally connected for proper operation.

PWM CONTROLLER


TK75001

ABSOLUTE MAXIMUM RATINGSSupply Voltage (Low Impedance Source) ................ 16 VSupply Voltage (ICC < 30 mA) ...................... Self LimitingPower Dissipation (Note 1) ................................ 825 mWOutput Energy (Capacitive Load) .............................. 5 µJCT and FB Pins ........................................................ 16 V

Junction Temperature ........................................... 150 °CStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -20 to +80 °CExtended Temperature Range ................... -40 to +85 °CLead Soldering Temperature (10 s) ...................... 235 °C


I )TRATS(CC tnerruCylppuSpu-tratS VotecruoStnerruC CC niP 5.0 0.1 Am

I )NO(CC tnerruCylppuSgnitarepO 5.41 0.91 Am

V )NO(CC NOegatloVOLVU V CC )3etoN(,drawpUspeewS 5.21 5.41 0.61 V

V )FFO(CC FFOegatloVOLVU V CC drawnwoDspeewS 0.9 5.01 0.21 V

V TSYH siseretsyHOLVU 8.2 0.4 V

V )PMALC(CC egatloVpmalClanretnI I CC )3etoN(,Am52= 0.61 5.71 0.91 V

C(NOITCESROTALLICSO T )NIP

f VRD niPVRDtaycneuqerFTA T= j C°52= 44 05 65 zHk

TA T= j )C°08ot02-(egnaRlluF= 73 36 zHk

V )KP(TC egatloVkaeP 5.2 2.3 9.3 V

V )LV(TC egatloVyellaV 1.1 V

I )SID(TC tnerruCegrahcsiD 0.1 8.1 0.3 Am

C )XAM(T ecnaticapaCgnimiTmumixaM 7.4 Fn

)NIPBF(SNOITCESNOITCUDERYCNEUQERFDNAKCABDEEF,ROTCETEDTNERRUC

V DCC

rotceteDlortnoCtnerruCegatloVecnerefeR

TA T= j C°52= 059.0 089.0 010.1 V

TA T= j )C°08ot02-(egnaRlluF= 529.0 530.1 V

V DCO

rotceteDtnerrucrevOegatloVecnerefeR

TA T= j C°52= 023.1 053.1 083.1 V


t DP,CO,BF niPVRDotyaleDnoitagoporP V BF V2ot0morfspetS 06 031 sn

t DP,CC,BF niPVRDotyaleDnoitagoporP V BF )4etoN(,V02.1ot0morfspetS 08 081 sn

i )KP(CS

kaePnoitasnepmoCepolStnerruC

V TC V= )KP(TC T, A T= j )2etoN(,C°52= 542- 002- 551- Aµ

i )LV(CS

yellaVnoitasnepmoCepolStnerruC

V TC V= )LV(TC T, A T= j )2etoN(,C°52= 56- 04- 51- Aµ

i )LV-KP(CS

otkaePnoitasnepmoCepolSyellaV


TK75001 ELECTRICAL CHARACTERISTICSTest Conditions: VCC = 13 V, CCC = 4.7 µF, CT = 800 pF, CDRV = 1000 pF, TA = Tj = Full Operating Temperature Range.Typical numbers apply at TA = 25 °C, unless otherwise specified.


TK75001

Note 1: Power dissipation is 825 mW when mounted. Derate at 6.6 mW/°C for operation above 25 °C.Note 2: For temperature dependence refer to "Slope Compensation Peak Current vs. Temperature" graph.Note 3: The UVLO "on" voltage is guaranteed to be below the internal clamp voltage.Note 4: Guaranteed by design; not 100% tested.

TK75001 ELECTRICAL CHARACTERISTICS (CONT.)Test Conditions: VCC = 13 V, CCC = 4.7 µF, CT = 800 pF, CDRV = 1000 pF, TA = Tj = Full Operating Temperature Range.Typical numbers apply at TA = 25 °C, unless otherwise specified.


)GNIMITNOITCETORPTNERRUCREVO(RECUDERYCNEUQERF

f )RF(VRD f/ VRD

noitcudeRycneuqerFoitaR

V BF V6.1,V2.1= 53 64 55 %

)NIPVRD(NOITCESTUPTUO

D )XAM(VRD oitaRytuDmimixaM 04 44 84 %

t )ESIR(VRD emiTesiR V,daolFp0001 CC V51= 52 57 sn

t )LLAF(VRD emiTllaF V,daolFp0001 CC V51= 52 57 sn

V )HGIH(VRD HGIHegatloVtuptuOI VRD Am04-= 1.01 0.11 V

I VRD Am001-= 0.01 8.01 V

V )WOL(VRD WOLegatloVtuptuO

I VRD Am04= 1.0 52.0 V

I VRD Am001= 2.0 05.0 V

I VRD ,Am5= V CC V9= 0.1 05.1 V


TK75001

GND

DRV

NC

VCC

GND NC

FBCT

1 µF

CCC4.7 µF

OSCILLOSCOPE

CT800 pF

OSCILLOSCOPE

1000 pF

20 k

TEST CIRCUIT


I CC

(m

A)

12

20

SUPPLY CURRENTVS. SUPPLY VOLTAGE

VCC (V)

0.4

0 4 8 12 16 18

16

0.0

0.6

STANDBY

DEVICE ON

FR

EQ

UE

NC

Y (

Hz)

FREQUENCY AT DRV PIN VS. TIMING CAPACITANCE

CT (pF)

104

106

10310 100 1000 10000

105

TA = 85 °C

TA = -40 °C

VC

CD

(V

)

0.96

1.00

CURRENT CONTROL REFERENCEVS. TEMPERATURE

TEMPERATURE (°C)

0.92

-40 0 40 80 120

0.98

0.94

0.90

i SC

(PK

) (µ

A)

-100

SLOPE COMPENSATION PEAK CURRENT VS. TEMPERATURE

TEMPERATURE (°C)

-220

-40 0 40 80 120

-140

-180

-260

I CC

(m

A)

30

INPUT CURRENT VS.FREQUENCY AT DRV

FREQUENCY (kHz)

18

0 200 400 600 800

26

22

14

CDRV = 1 nF

CDRV = 0 nF

CDRV = 500 pF

FR

EQ

. RE

DU

CT

ION

RA

TIO

(%

)

50

FREQUENCY REDUCTION RATIO VS.TEMPERATURE

TEMPERATURE (°C)

40

-40 0 40 80 120

48

44

36

54


TK75001


VF

B (

mV

)

450

SLOPE COMPENSATION RAMP

TIME (µs)

0

0 10 20 30 40 50 60

300

150

600RFB = 3 k to GNDCT = 800 pF


TK75001

THEORY OF OPERATION

The TK75001 is intended for use as a primary-side PulseWidth Modulator (PWM) controller. The many featuresintegrated into a simple 5-pin design allow it to be easilyconfigured for voltage-mode or current-mode control, fixed-frequency or fixed-off-time operation, off-line boot-strapping, and direct drive of a power MOSFET. Thepolarity of the feedback signal allows for simpler interfacewith a TL431-derived error signal (see "ApplicationsInformation" section).

The most noteworthy integrated feature in the TK75001 isthe way in which the feedback control pin is configured toreceive the error signal and the current signal for current-mode control. Rather than receiving both inputs into acomparator, a single input receives both signals summedtogether and compares them against a fixed internalreference. This yields two desirable effects: 1) a current-limit threshold is automatically established, and 2) therequired error-signal polarity is the inverse of that of astandard two-input current-mode control system. Generally,the signal summation requires no additional externalcomponents and the required error-signal polarity is simplerto achieve.

Two other functions are integrated into the feedback pin.A current ramp, which can be used to establish either theslope-compensation ramp for a current-mode control designor the voltage-comparison ramp for a voltage-mode controldesign, flows out of the feedback pin. By adjusting theterminating resistance at the feedback pin, the desiredramp magnitude is established. For overcurrent protection,a second fixed-reference comparator monitors the feedbackpin. If the feedback pin voltage should reach the secondthreshold, this indicates that cycle-by-cycle PWM controlis not sufficient for maintaining control of the current (i.e.,the minimum duty-ratio is too large to achieve volt-secondbalance in the magnetics). The overcurrent detectioncomparator latches (for one cycle) a reduction in thesource current which feeds the timing capacitor. This hasthe effect of reducing the switching frequency and thus,effectively, the minimum duty ratio, which is just what isneeded to maintain control of the current.

The switching frequency is determined by an internalcurrent source charging an external timing capacitor. Thetiming capacitor is ramped between internally-fixedthresholds, valley to peak, and then quickly discharged. Afixed off-time control technique can be readily implementedby using a small transistor to keep the timing capacitordischarged during the on-time. When the on-pulse is

terminated, the timing capacitor ramps up to a fixedthreshold at a fixed rate to fix the off-time.

The Undervoltage Lockout (UVLO) feature with hysteresisminimizes the start-up current which allows a low-powerbootstrap technique to be used for the housekeepingpower. The duty ratio of the TK75001 is limited to less thanfifty percent by a toggle flip-flop, plus time required todischarge the timing ramp.


TK75001

PIN DESCRIPTIONS

SUPPLY VOLTAGE PIN (V CC)

This pin is connected to the supply voltage. The IC is in alow current (500 µA typ.) standby mode before the supplyvoltage exceeds 14.5 V (typ.), which is the upper thresholdof the UVLO circuit. The IC switches back to standby modewhen the supply voltage drops below 10.5 V (typ.). Aninternal clamp limits the peak supply voltage to about 17.5V (typ.). The absolute maximum supply voltage from a lowimpedance source is 16 V. The device is always guaranteedto turn on before the internal clamp turns on.

GROUND PIN (GND)

This pin provides ground return for the IC.

DRIVE PIN (DRV)

This pin drives the external MOSFET with a totem poleoutput stage capable of sinking or sourcing a peak currentof about 1 A. In standby mode, the drive pin can sink about5 mA while keeping the drive pin pulled down to about 1 V.The maximum duty cycle of the output signal is typically44%.

TIMING CAPACITOR PIN (CT)

The external timing capacitor is connected to the CT pin.That capacitor is the only component needed for settingthe clock frequency. The frequency measured at the CT pinis twice the frequency measured at the DRV Pin. Themaximum recommended clock frequency of the device is1.6 MHz. At normal operation, during the rising section ofthe timing-capacitor voltage, a trimmed internal current of205 µA flows out from the C

T pin and charges the capacitor.

During the falling section of the timing-capacitor voltage aninternal current of about 1.8 mA discharges the capacitor.If the voltage at the feedback(FB) pin exceeds 1.35 V (e.g.,due to the turnoff delay during a short-circuit at the outputof a converter using the IC), the charging current isreduced to about 59 µA, leading to a 2.17-fold reduction inswitching frequency. The frequency reduction is useful forpreventing short-circuit current runaway.

FEEDBACK PIN (FB)

The feedback pin receives the sum of three signals: theerror signal (from the external error amplifier), the switchcurrent signal and a voltage ramp generated across theterminating resistance by an internal sawtooth-shaped

current with a peak value of about 200 µA. The error signalis needed for stabilizing the output voltage or current. Theswitch current signal is needed in current-mode controlledconverters and in converters with cycle-by-cycle overloadprotection. Also, the switch current signal is required fordetecting impending short-circuit current runaway, and forinitiating a frequency reduction for preventing the runaway.The voltage ramp is needed for slope compensation incurrent-mode controlled converters, or for pulse-widthmodulation in voltage-mode controlled converters.

At higher clock frequencies, the bandwidth limitation of theinternally-generated sawtooth-shaped current sourcebecomes more apparent. The degree to which rampbandwidth is tolerable depends on performancerequirements at narrow pulse widths. A low impedance atthe feedback pin can effectively eliminate the internally-generated ramp effects, and an external ramp can bereadily created to attain higher performance at highfrequencies, if desired.


TK75001

DESIGN CONSIDERATIONS

SELECTING A START-UP RESISTOR

Figure 1 shows the typical application of the TK75001 in anoff-line flyback power supply (input full-wave bridge andcapacitor not shown). The IC starts when the voltageacross the capacitor CAUX reaches the UVLO on VoltageVIN(ON) of the IC. The starting resistor RST can be designedas follows:

RST(MAX) = (VIN(MIN) - VCC(ON,MAX) - 2 V) / ICC(START, MAX)

(1)

At 85 Vrms line voltage, and taking into account thespecified maximum values of the UVLO on voltage and thestart-up supply current ICC(START), the maximum allowedvalue of the starting resistor is:

RST(MAX) = (85 2 - 16 - 2 ) / 1.0 mA = 102.2 kΩ

(2)

A practical choice for the starting resistor is RST = 100 kΩ.The worst-case dissipation of the resistor appears at highline and at the minimum VCC voltage. At 265 Vrms linevoltage and 9 V VCC

, the dissipation is 2.2 W, so a 3 Wresistor should be used. Note that 1.0 mA reflects the worstcase ICC(START) at the edge of UVLO release.

SELECTING THE TRANSFORMER TURNS RATIO

During steady-state operations, the auxiliary supply voltageis generated by the auxiliary winding n3 and the rectifierdiode D3. In the flyback power supply, neglecting the effectof the leakage inductance of the transformer, the numberof turns of the auxiliary winding can be calculated from thefollowing equation:

n3 = n2 [(VAUX + VD3) / (VOUT + VD2)]

(3)

where VD2 and VD3 are the forward voltage drops of theoutput rectifier diode and the auxiliary rectifier diode. Thevoltage VAUX should be selected such that it stays betweenthe specified worst-case upper and lower limits of the IC,

considering the component tolerances, ripple, and othersecond-order effects. The upper limit for VAUX is theminimum voltage of the built-in clamp (16 V). The lowerlimit for VAUX is the maximum UVLO off voltage (12.0 V). Itis prudent to choose the mean value of those two voltages(i.e., 14.0 V), as VAUX.

COMPENSATING FOR LEAKAGE INDUCTANCE

The leakage inductance of the flyback transformer causesa voltage overshoot at turn-off of the MOSFET. Themagnitude and duration of the overshoot depends on theleakage inductance, the peak current at turn-offs, and thevoltage-clamping circuit employed to limit the overshoot.

The overshoot tends to increase the auxiliary voltage. Thesimplest solution to reduce that increase is to add aresistor RAUX in series with the rectifier diode D3. Theoptimal value of the resistor can be calculated from thesubcircuit shown in Figure 2.

The average current flowing in RAUX is equal to the currentIAUX drawn by the IC. The following equation can be writtenfrom the equality:

IAUX = (1 / RAUX) x ([(V1 - VD3 - VAUX) x (T1 / T)] + [(V2 - VD3 - VAUX) x (T2 / T)])

(4)

The voltage V1 can be calculated as follows:

V1 = (VOUT + VD2) x (n1 / n2) + [VOVERSHOOT x ( n3 / n2)]

(5)

where VOVERSHOOT is the additional voltage appearingacross the MOSFET due to the leakage inductance.


V2 = (VOUT + VD2) x ( n3 / n2)

(6)


TK75001

T1 is the time required for the leakage inductance of theflyback transformer to completely discharge its storedenergy into the voltage clamp. T1 can be calculated as:

T1 = (IPK x LLEAK ) / VOVERSHOOT

(7)

where IPK is the peak current in the MOSFET at turn-off andLLEAK is the inductance of the flyback transformer measuredat winding n1.

T2 is the conduction time of the output diode D2 and T is theswitching period.

From Equation 4 the resistance RAUX or the voltage VAUXcan be calculated.

Example: calculate the value of RAUX with the followingtypical values:

VOUT = 12 V VD2 = VD3 = 1 V IPK = 1 ALLEAK = 2 µH VOVERSHOOT = 20 V VAUX = 13.5 VIAUX = 18 mA T2 = 2 µs T = 5 µsn1 = 31 n2 = 6 n3 = 7

Equations 5, 6 and 7 yield V1 = 19.7 V, V2 = 15.2 V, andT1 = 100 ns. Substituting those values into Equation 4 andsolving for RAUX yields:

RAUX = 20.6 Ω

Rounding the result to the nearest 5% standard valuegives RAUX = 20 Ω.

DESIGN CONSIDERATIONS (CONT.)

FIGURE 1: TK75001 IN A FLYBACK POWER SUPPLY(a) SCHEMATIC (b) VOLTAGE AT FEEDBACK PIN

FIGURE 2: SUBCIRCUIT FOR CALCULATING THEVALUE OF RAUX

GND

VCC

CT

FB

DRV

CAUX

R1

VAUX

RST

VIN

n3 n2

D3

RS

OC

TL431

+ +

VOUT

D2

FEEDBACKVOLTAGE

SWITCHCURRENTSIGNAL

STABILIZINGRAMP

0.98 V

0

-

CT

GND

VCC

CT

FB

DRV

CAUX

RAUXIAUX D3

n3 T2T1

V1

V

T

Vn3

+

_

VAUX

(b)(a)


TK75001


SELF-BIASED POWER SUPPLY WITH CONSTANT-FREQUENCY CURRENT-MODE CONTROL

Figure 3(a) shows the TK75001 IC in the typical application:a flyback converter with self-bias and constant-frequencycurrent-mode control. Figure 3(b) shows the FB Pin voltage.In the converter, the voltage-error amplifier (a TL431 shuntregulator IC) is located at the output side and the errorsignal is transmitted to the input side through the opto-coupler OC. Three signals are added together at the FBPin: 1)the feedback voltage that develops across theresistor R1, 2) the switch current signal, and 3) the stabilizingramp. In each cycle, the MOSFET switch is turned off whenthe sum of those three signals reaches 0.98 V.

FIGURE 3: TK75001 IN A SELF-BIASED FLYBACKCONVERTER WITH CONSTANT-FREQUENCY

VOLTAGE-MODE CONTROL(a) SCHEMATIC (b) VOLTAGE AT FEEDBACK PIN

POWER SUPPLY WITH CONSTANT-FREQUENCYVOLTAGE-MODE CONTROL AND CYCLE-BY-CYCLECURRENT LIMIT

Voltage-mode control is free from some of thedisadvantages (e.g., subharmonic instability and noisesensitivity) of current-mode control. It is very easy toimplement that control method with the TK75001 IC.Figure 4(a) shows the IC in a voltage-mode-controlledflyback converter. Figure 4(b) shows the feedback pinvoltage. The only circuit difference between current-modecontrol and voltage-mode control is in the connection ofthe resistor R1, that terminates the feedback pin. In current-mode control, that resistor is connected to the current-

sense resistor of the converter. In voltage-mode control,that resistor is connected to ground.

In voltage-mode control, overload protection can be realizedby adding a simple circuit to the control IC, as shown in thefigure. The PNP transistor Q1, turns on and pulls up thefeedback pin when the switch current times the resistanceof the sense RS reaches the threshold set by the resistivedivider R2 and R3 and the base-emitter voltage of Q1.

FIGURE 4: TK75001 IN A VOLTAGE-MODE-CONTROLLED CONVERTER WITH ADDITIONAL

CYCLE-BY-CYCLE CURRENT LIMIT(a) SCHEMATIC (b) VOLTAGE AT FEEDBACK PIN

POWER SUPPLY WITH CONSTANT OFF-TIMECURRENT-MODE CONTROL

The advantages of constant off-time current-mode controlover constant-frequency current-mode control are: 1) thereis no need for a stabilizing ramp, 2) the converter is freefrom subharmonic instability (i.e., there is no need forslope compensation), and 3) the line voltage variation isautomatically canceled in buck-derived converters (e.g.,the forward converter). Figure 5 shows the implementationof that control method. As can be seen, a transistor Q1must be added to the controller. Figure 6 shows the timing-pin and feedback pin voltages for the TK75001. Thetransistor Q1 keeps the timing pin at ground potentialduring the on-time of the switch. Timing begins when thedrive output returns to low and Q1 is turned off. The off-timefor typical charge and discharge currents and peak andvalley voltages is:

tOFF = CT x 14 kΩ.

GND

VCC

CT

FB

DRV

CAUX

R1

VAUX

RST

VIN

n3 n2

D3

RS

OC

TL431

+ +

VOUT

D2

FEEDBACKVOLTAGE

SWITCHCURRENTSIGNAL

STABILIZINGRAMP

0.98 V

0

-

CT

GND

VCC

CT

FB

DRV

VAUX

VIN

RS

TL431

+

R3

Q1

R1

R2

OC

OC

FEEDBACKVOLTAGE

PWMRAMP

0

0.98 V

(b)(a)

(b)(a)


TK75001

FIGURE 5: TK75001 IN A FORWARD CONVERTERWITH CONSTANT OFF-TIME CURRENT-MODE

CONTROL

FIGURE 6: TIMING PIN AND FEEDBACK PINVOLTAGES WITH CONSTANT OFF-TIME CURRENT-

MODE CONTROL

TK75001 IN NON-ISOLATED APPLICATIONS

Figure 7 shows a buck-boost converter with a negativeinput voltage and a positive output voltage, controlled bythe TK75001. The Error Amplifier is a TL431 shunt regulator,and a PNP transistor provides interface between theTL431 and the control IC.

FIGURE 7: NON-ISOLATED NEGATIVE-TO-POSITIVECONVERTER


GND

VCC

CT

FB

DRVQ1

VAUX

RS

TL431

+VOUT

VIN

R1

VAUX

OC

CT

3.2 V

1.1 V

0

0.98 V

FEEDBACK VOLTAGE LEVEL

FB

CT

FB

CT

GND

VCC

CT

FB

DRV

TL431

VIN (-)

VOUT (+)


TK75001

TK75001 OFF-LINE APPLICATION EXAMPLE

Figure 8 shows an off-line, universal input, 12 W power supply. The TK75001 is the controller IC for a flyback converterwith self-bias and constant-frequency, current-mode control. The TK75001 drives the MOSFET directly to switch theflyback transformer. Feedback is accomplished by means of a TL431, configured as a secondary side error amplifier andvoltage reference, driving an opto-coupler for isolation.

FIGURE 8: OFF-LINE, UNIVERSAL INPUT, 12-WATT POWER SUPPLY


n2

1.20.25 W

+ +

RB155

GND

VCC

CT

FB

DRV220 pF

+

22 µF400 V

1 mHRM4

1.5 mH0.2 A

1 M0.25 W

1 M0.25 W

16 ΩKCO17L

85-265 VAC47-440 Hz

82 µF25 V

0.01 µF

1.8 k0.047 µF 220

220 pF50 V

15 IRFRC20

1.24 k1%

330 µF16 V

330 µF16 V

82µF25V

FMMTA42

FMMTA42

0.1 µF400 V

24 k0.5 W

0.001 µF400 V

n3

n1

RM6-N67AL250 100

0.5 W

330 pF100 V

6CWF20F

n1 = 31, AWG28n2 = 6, triple insulated, AWG24n3 = 7, AWG34

BYV26CPH

1N4148

470

4.75 k1%

4700.01 µF

4.7 k

TL431

CNY17-2

+

620

FMMT2222A

+

2 A

FERRITEBEAD

12 V1 A

TK75001


TK75001

6.4

2.54 0.46

e

3.3

3.8

3.3

0.257.62

e10 ~15

0.5

min

9.5

58

1 4


M0.25

0.3

+0.

3+

Marking

Lot Number

Country of Origin

+ 0.15- 0.05

+ 0.15- 0.05

Marking Information

MarkingTK75001 75001

DIP-8

PACKAGE OUTLINE




IC-120-TK750010798O0.0K








TK75003

OSCILLATOR

FB

CT

ICHG205 µA

fCLK

SLOPECOMPENSATION

1.35 V

PWM LATCH

DRV

CURRENTCONTROL

DETECTOR

OVERCURRENTDETECTOR

GND

BANDGAPREFERENCE

UVLO

14.5 V10.5 V

VCC

S

R

Q

IFR146 µA

ICT

FREQUENCYREDUCTION

LATCH

17.5 V

0.98 V

S

Q

R

IDS2 mA

APPLICATIONS Power Factor Correction Converters

Off-Line Power Supplies

Industrial Power Supplies

Telecom Power Supplies

Off-Line Battery Chargers

FEATURES Power Factor Correction/Line Harmonics

Reduction to Meet IEC1000-3-2 Requirements

Optimized for Off-Line Operation

Maximum Duty Ratio 88% (typ.)

Frequency Reduction for Improved Overcurrent

Protection

Low Standby Current for Current-Fed Start-Up

Current-Mode or Voltage-Mode Control

Internal User-Adjustable Slope Compensation

Functionally Integrated & Simplified 5-Pin Design

TK75003

BLOCK DIAGRAM

DESCRIPTION

The TK75003 is a simple primary side controller optimizedfor off-line switching power supplies including power factorcorrectors. It is suitable for both voltage-mode and current-mode control and has advanced features not available incontrollers with a higher pin count. The key to fullfunctionality in a 5-pin design is that the current signal andthe error signal are added together and fed into thefeedback pin. A sawtooth current flowing out of the feedbackpin provides a slope compensation ramp (in current-modeapplications) or a PWM ramp (in voltage-modeapplications), in proportion to the resistance terminatingthat pin. If the sum of the current sense signal, error signaland ramp signal exceeds the Overcurrent Detectorthreshold indicating that the Current Control Detector haslost control of the switch current, the charging current ofthe timing capacitor will be reduced to about 25% for theremainder of the clock period. The reduced chargingcurrent causes no more than a one-third reduction inswitching frequency, effectively preventing short-circuitcurrent runaway.


TAPE/REEL CODEMG: Magazine

Tape/Reel Code

TK75003D

Temperature Code


75003

GND

DRV

NC

VCC

GND NC

FBCT

Note: Pins 2 and 3 must be externally connected for proper operation.

PWM CONTROLLER


TK75003

ABSOLUTE MAXIMUM RATINGSSupply Voltage (Low Impedance Source) ................ 16 VSupply Voltage (ICC < 30 mA) ...................... Self LimitingPower Dissipation (Note 1) ................................ 825 mWOutput Energy (Capacitive Load) .............................. 5 µJCT and FB Pins ........................................................ 16 V

Junction Temperature ........................................... 150 °CStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -20 to +80 °CExtended Temperature Range ................... -40 to +85 °CLead Soldering Temperature (10 s) ...................... 235 °C


I )TRATS(CC tnerruCylppuSpu-tratS VotecruoStnerruC CC niP 5.0 0.1 Am

I )NO(CC tnerruCylppuSgnitarepO 5.41 0.91 Am

V )NO(CC NOegatloVOLVU V CC )3etoN(,drawpUspeewS 5.21 5.41 0.61 V

V )FFO(CC FFOegatloVOLVU V CC drawnwoDspeewS 0.9 5.01 0.21 V

V TSYH siseretsyHOLVU 8.2 0.4 V

V )PMALC(CC egatloVpmalClanretnI I CC )3etoN(,Am52= 0.61 5.71 0.91 V

C(NOITCESROTALLICSO T )NIP

f VRD niPVRDtaycneuqerFTA T= j C°52= 09 001 011 zHk

TA T= j )C°08ot02-(egnaRlluF= 08 511 zHk

V )KP(TC egatloVkaeP 5.2 2.3 9.3 V

V )LV(TC egatloVyellaV 1.1 V

I )SID(TC tnerruCegrahcsiD 0.1 8.1 0.3 Am

C )XAM(T ecnaticapaCgnimiTmumixaM 7.4 Fn

)NIPBF(SNOITCESNOITCUDERYCNEUQERFDNAKCABDEEF,ROTCETEDTNERRUC

V DCC

rotceteDlortnoCtnerruCegatloVecnerefeR

TA T= j C°52= 059.0 089.0 010.1 V


V DCO

rotceteDtnerrucrevOegatloVecnerefeR

TA T= j C°52= 023.1 053.1 083.1 V


t DP,CO,BF niPVRDotyaleDnoitagoporP V BF V2ot0morfspetS 06 031 sn

t DP,CC,BF niPVRDotyaleDnoitagoporP V BF )4etoN(,V02.1ot0morfspetS 08 081 sn

i )KP(CS

kaePnoitasnepmoCepolStnerruC

V TC V= )KP(TC T, A T= j )2etoN(,C°52= 542- 002- 551- Aµ

i )LV(CS

yellaVnoitasnepmoCepolStnerruC


i )LV-KP(CS

otkaePnoitasnepmoCepolSyellaV


TK75003 ELECTRICAL CHARACTERISTICSTest Conditions: VCC = 13 V, CCC = 4.7 µF, CT = 800 pF, CDRV = 1000 pF, TA = Tj = Full Operating Temperature Range.Typical numbers apply at TA = 25 °C, unless otherwise specified.


TK75003

Note 1: Power dissipation is 825 mW when mounted. Derate at 6.6 mW/°C for operation above 25 °C.Note 2: For temperature dependence refer to "Slope Compensation Peak Current vs. Temperature" graph.Note 3: The UVLO "on" voltage is guaranteed always to be below the internal clamp voltage.Note 4: Guaranteed by design; not 100% tested.


)GNIMITNOITCETORPTNERRUCREVO(RECUDERYCNEUQERF

f )RF(VRD f/ VRD

noitcudeRycneuqerFoitaR

V BF V6.1,V2.1= 02 03 04 %

)NIPVRD(NOITCESTUPTUO

D )XAM(VRD oitaRytuDmimixaM 58 88 19 %

t )ESIR(VRD emiTesiR V,daolFp0001 CC V51= 52 57 sn

t )LLAF(VRD emiTllaF V,daolFp0001 CC V51= 52 57 sn

V )HGIH(VRD HGIHegatloVtuptuOI VRD Am04-= 1.01 0.11 V

I VRD Am001-= 0.01 8.01 V

V )WOL(VRD WOLegatloVtuptuO

I VRD Am04= 1.0 52.0 V

I VRD Am001= 2.0 05.0 V

I VRD ,Am5= V CC V9= 0.1 05.1 V

TK75003 ELECTRICAL CHARACTERISTICS (CONT.)Test Conditions: VCC = 13 V, CCC = 4.7 µF, CT = 800 pF, CDRV = 1000 pF, TA = Tj = Full Operating Temperature Range.Typical numbers apply at TA = 25 °C, unless otherwise specified.


TK75003

GND

DRV

NC

VCC

GND NC

FBCT

1 µF

CCC4.7 µF

OSCILLOSCOPE

CT800 pF

OSCILLOSCOPE

1000 pF

20 k

TEST CIRCUIT


I CC

(m

A)

12

20

SUPPLY CURRENTVS. SUPPLY VOLTAGE

VCC (V)

0.4

0 4 8 12 16 18

16

0.0

0.6

STANDBY

DEVICE ON

FR

EQ

UE

NC

Y (

Hz)

FREQUENCY AT DRV PIN VS. TIMING CAPACITANCE

CT (pF)

104

106

10310 100 1000 10000

105

TA = 85 °C

TA = -40 °C

VC

CD

(V

)

0.96

1.00

CURRENT CONTROL REFERENCEVS. TEMPERATURE

TEMPERATURE (°C)

0.92

-40 0 40 80 120

0.98

0.94

0.90

i SC

(PK

) (µ

A)

-100

SLOPE COMPENSATION PEAK CURRENT VS. TEMPERATURE

TEMPERATURE (°C)

-220

-40 0 40 80 120

-140

-180

-260

I CC

(m

A)

50

INPUT CURRENT VS.FREQUENCY AT DRV

FREQUENCY (kHz)

20

0 400 800 1200 1600

40

30

10

CDRV = 1 nF

CDRV = 0 nF

CDRV = 500 pF

60

FR

EQ

. RE

DU

CT

ION

RA

TIO

(%

)

FREQUENCY REDUCTION RATIO VS.TEMPERATURE

TEMPERATURE (°C)

-40 0 40 80 120

48

46

44

50


TK75003


VF

B (

mV

)

450

SLOPE COMPENSATION RAMP

TIME (µs)

0

0 5 10 15 20

300

150

600RFB = 3 K to GNDCT = 800 pF

iSC(PK)

iSC(VL)

iSC(PK - VL)


TK75003

THEORY OF OPERATION

The TK75003 is intended for use as a primary-side PulseWidth Modulator (PWM) controller. Using a controltechnique referenced in the "Application Information"section, the TK75003 can be used as a highly cost-effective controller for power factor correction. The manyfeatures integrated into a simple 5-pin design allow it to beeasily configured for voltage-mode or current-mode control,fixed-frequency or fixed off-time operation, off-line boot-strapping, and direct drive of a power MOSFET. Thepolarity of the feedback signal allows for simpler interfacewith a TL431-derived error signal (see "ApplicationsInformation" section).

The most noteworthy integrated feature in the TK75003 isthe way in which the feedback control pin is configured toreceive the error signal and the current signal for current-mode control. Rather than receiving both inputs into acomparator, a single input receives both signals summedtogether and compares them against a fixed internalreference. This yields two desirable effects: 1) a current-limit threshold is automatically established, and 2) therequired error-signal polarity is the inverse of that of astandard two-input current-mode control system. Generally,the signal summation requires no additional externalcomponents and the required error-signal polarity is simplerto achieve.

Two other functions are integrated into the feedback pin.A current ramp, which can be used to establish either theslope-compensation ramp for a current-mode control designor the voltage-comparison ramp for a voltage-mode controldesign, flows out of the feedback pin. By adjusting theterminating resistance at the feedback pin, the desiredramp magnitude is established. For overcurrent protection,a second fixed-reference comparator monitors the feedbackpin. If the feedback pin voltage should reach the secondthreshold, this indicates that cycle-by-cycle PWM controlis not sufficient for maintaining control of the current (i.e.,the minimum duty-ratio is too large to achieve volt-secondbalance in the magnetics). The overcurrent detectioncomparator latches (for one cycle) a reduction in thesource current which feeds the timing capacitor. This hasthe effect of reducing the switching frequency and, thus,effectively, the minimum duty ratio, which is just what isneeded to maintain control of the current.

The switching frequency is determined by an internalcurrent source charging an external timing capacitor. Thetiming capacitor is ramped between internally-fixedthresholds, valley to peak, and then quickly discharged. A

fixed off-time control technique can be readily implementedby using a small transistor to keep the timing capacitordischarged during the on-time. When the on-pulse isterminated, the timing capacitor ramps up to a fixedthreshold at a fixed rate to fix the off-time.

The Undervoltage Lockout (UVLO) feature with hysteresisminimizes the start-up current which allows a low-powerboot-strap technique to be used for the housekeepingpower. The duty ratio of the TK75003 is limited toapproximately 88% by the time required to discharge thetiming ramp.


TK75003

PIN DESCRIPTIONS


This pin is connected to the supply voltage. The IC is in alow-current (500 µA typ.) standby mode before the supplyvoltage exceeds 14.5 V (typ.), which is the upper thresholdof the UVLO circuit. The IC switches back to standby modewhen the supply voltage drops below 10.5 V (typ.). Aninternal clamp limits the peak supply voltage to about 17.5V (typ.). The absolute maximum supply voltage from a lowimpedance source is 16 V. The device is always guaranteedto turn on before the internal clamp turns on.

GNOUND PIN (GND)

This pin provides ground return for the IC.

DRIVE PIN (DRV)

This pin drives the external MOSFET with a totem poleoutput stage capable of sinking or sourcing a peak currentof about 1 A. In standby mode, the drive pin can sink about5 mA while keeping the drive pin pulled down to about 1 V.The maximum duty cycle of the output signal is typically88 %.


The external timing capacitor is connected to the CT pin.That capacitor is the only component needed for settingthe clock frequency. The frequency measured at the CT pinis the same frequency as measured at the DRV pin. Themaximum recommended clock frequency of the device is1.6 MHz. At normal operation, during the rising section ofthe timing-capacitor voltage, a trimmed internal current of205 µA flows out from the CT pin and charges the capacitor.During the falling section of the timing-capacitor voltage aninternal current of about 1.8 mA discharges the capacitor.If the voltage at the feedback pin(FB) exceeds 1.35 V (e.g.,due to the turn-off delay during a short-circuit at the outputof a converter using the IC), the charging current isreduced to about 59 µA, leading to a 3.2-fold reduction inswitching frequency. The frequency reduction is useful forpreventing short-circuit current runaway.

FB (FEEDBACK) PIN

The feedback pin receives the sum of three signals: theerror signal (from the external error amplifier), the switchcurrent signal and a voltage ramp generated across theterminating resistance by an internal sawtooth-shaped

current with a peak value of about 200 µA. The error signalis needed for stabilizing the output voltage or current. Theswitch current signal is needed in current-mode controlledconverters and in converters with cycle-by-cycle overloadprotection. Also, the switch current signal is required fordetecting impending short-circuit current runaway, and forinitiating a frequency reduction for preventing the runaway.The voltage ramp is needed for slope compensation(necessary for avoiding subharmonic instability in constant-frequency peak-current controlled current- mode convertersabove 50% duty ratio), or for pulse-width modulation involtage-mode controlled converters.

At higher clock frequencies, the bandwidth limitation of theinternally-generated sawtooth-shaped current sourcebecomes more apparent. The degree to which rampbandwidth is tolerable depends on performancerequirements at narrow pulse widths. A low impedance atthe feedback pin can effectively eliminate the internally-generated ramp effects, and an external ramp can bereadily created to attain higher performance at highfrequencies, if desired.


TK75003

DESIGN CONSIDERATIONS

SELECTING A START-UP RESISTOR

Figure 1 shows the typical application of the TK75003 in anoff-line flyback power supply (input full-wave bridge andcapacitor not shown). The IC starts when the voltageacross the capacitor CAUX reaches the UVLO on VoltageVIN(ON) of the IC. The starting resistor RST can be designedas follows:

RST(MAX) = (VIN(MIN) - VCC(ON,MAX) - 2 V) / ICC(START,MAX)

(1)

At 85 Vrms line voltage, and taking into account thespecified maximum values of the UVLO on voltage and thestart-up supply current ICC(START), the maximum allowedvalue of the starting resistor is:

RST(MAX) = (85 2 - 16 - 2 ) / 1.0 mA = 102.2 kΩ

(2)

A practical choice for the starting resistor is RST = 100 kΩ.The worst-case dissipation of the resistor appears at highline and at the minimum VCC voltage. At 265 Vrms linevoltage and 9 V VCC

, the dissipation is 2.2 W, so a 3 Wresistor should be used. Note that 1.0 mA reflects the worstcase ICC(START) at the edge of UVLO release.

SELECTING THE TRANSFORMER TURNS RATIO

During steady-state operations, the auxiliary supply voltageis generated by the auxiliary winding n3 and the rectifierdiode D3. In the flyback power supply, neglecting the effectof the leakage inductance of the transformer, the numberof turns of the auxiliary winding can be calculated from thefollowing equation:

n3 = n2 [(VAUX + VD3) / (VOUT + VD2)]

(3)

where VD2 and VD3 are the forward voltage drops of theoutput rectifier diode and the auxiliary rectifier diode. Thevoltage VAUX should be selected such that it stays betweenthe specified worst-case upper and lower limits of the IC,

considering the component tolerances, ripple, and othersecond-order effects. The upper limit for VAUX is theminimum voltage of the built-in clamp (16 V). The lowerlimit for VAUX is the maximum UVLO off voltage (12.0 V). Itis prudent to choose the mean value of those two voltages(i.e., 14.0 V), as VAUX.

COMPENSATING FOR LEAKAGE INDUCTANCE

The leakage inductance of the flyback transformer causesa voltage overshoot at turn-off of the MOSFET. Themagnitude and duration of the overshoot depends on theleakage inductance, the peak current at turn-offs, and thevoltage-clamping circuit employed to limit the overshoot.

The overshoot tends to increase the auxiliary voltage. Thesimplest solution to reduce that increase is to add aresistor RAUX in series with the rectifier diode D3. Theoptimal value of the resistor can be calculated from thesubcircuit shown in Figure 2.

The average current flowing in RAUX is equal to the currentIAUX drawn by the IC. The following equation can be writtenfrom the equality:

IAUX = (1 / RAUX) x ([(V1 - VD3 - VAUX) x (T1 / T)] + [(V2 - VD3 - VAUX) x (T2 / T)])

(4)


V1 = (VOUT + VD2) x (n1 / n2) + [VOVERSHOOT x ( n3 / n1)]

(5)

where VOVERSHOOT is the additional voltage appearingacross the MOSFET due to the leakage inductance.


V2 = (VOUT + VD2) x ( n3 / n2)

(6)


TK75003

T1 is the time required for the leakage inductance of theflyback transformer to completely discharge its storedenergy into the voltage clamp. T1 can be calculated as:

T1 = (IPK x LLEAK ) / VOVERSHOOT

(7)

where IPK is the peak current in the MOSFET at turn-off andLLEAK is the inductance of the flyback transformer measuredat winding n1.

T2 is the conduction time of the output diode D2 and T is theswitching period.

From Equation 4 the resistance RAUX or the voltage VAUXcan be calculated.

Example: calculate the value of RAUX with the followingtypical values:

VOUT = 12 V VD2 = VD3 = 1 V IPK = 1 ALLEAK = 2 µH VOVERSHOOT = 20 V VAUX = 13.5 VIAUX = 18 mA T2 = 2 µs T = 5 µsn1 = 31 n2 = 6 n3 = 7

Equations 5, 6 and 7 yield V1 = 19.7 V, V2 = 15.2 V, andT1 = 100 ns. Substituting those values into Equation 4 andsolving for RAUX yields:

RAUX = 20.6 Ω

Rounding the result to the nearest 5% standard valuegives RAUX = 20 Ω.

DESIGN CONSIDERATIONS (CONT.)

FIGURE 1: TK75003 IN A FLYBACK POWER SUPPLY(a) SCHEMATIC (b) VOLTAGE AT FEEDBACK PIN

FIGURE 2: SUBCIRCUIT FOR CALCULATING THEVALUE OF RAUX

GND

VCC

CT

FB

DRV

CAUX

R1

VAUX

RST

VIN

n3 n2

D3

RS

OC

TL431

+ +

VOUT

D2

FEEDBACKVOLTAGE

SWITCHCURRENTSIGNAL

STABILIZINGRAMP

0.98 V

0

-

CT

GND

VCC

CT

FB

DRV

CAUX

RAUXIAUX D3

n3 T2T1

V1

V

T

Vn3

+

_

VAUX

(b)(a)


TK75003


SELF-BIASED POWER SUPPLY WITH CONSTANT-FREQUENCY CURRENT-MODE CONTROL

Figure 3(a) shows the TK75003 IC in the typical application:a flyback converter with self-bias and constant-frequencycurrent- mode control. Figure 3(b) shows the feedback pinvoltage. In the converter, the voltage-error amplifier (aTL431 shunt regulator IC) is located at the output side andthe error signal is transmitted to the input side through theopto-coupler OC. Three signals are added together at thefeedback pin: 1) the feedback voltage that develops acrossthe resistor R1, 2) the switch current signal, and 3) thestabilizing ramp. In each cycle, the MOSFET switch isturned off when the sum of those three signals reaches0.98 V.

FIGURE 3: TK75003 IN A SELF-BIASED FLYBACKCONVERTER WITH CONSTANT-FREQUENCY

VOLTAGE-MODE CONTROL(a) SCHEMATIC (b) VOLTAGE AT FEEDBACK PIN

POWER SUPPLY WITH CONSTANT-FREQUENCYVOLTAGE-MODE CONTROL AND CYCLE-BY-CYCLECURRENT LIMIT

Voltage-mode control is free from some of thedisadvantages (e.g., subharmonic instability and noisesensitivity) of current-mode control. It is very easy toimplement that control method with the TK75003 IC.Figure 4(a) shows the IC in a voltage-mode-controlledflyback converter. Figure 4(b) shows the feedback pinvoltage. The only circuit difference between current-modecontrol and voltage-mode control is in the connection ofthe resistor R1, that terminates the feedback pin. In current-

mode control, that resistor is connected to the current-sense resistor of the converter. In voltage-mode control,that resistor is connected to ground.

In voltage-mode control, overload protection can be realizedby adding a simple circuit to the control IC, as shown in thefigure. The PNP transistor Q1, turns on and pulls up thefeedback pin when the switch current times the resistanceof the sense RS reaches the threshold set by the resistivedivider R2 and R3 and the base-emitter voltage of Q1.

FIGURE 4: TK75003 IN A VOLTAGE-MODE-CONTROLLED CONVERTER WITH ADDITIONAL

CYCLE-BY-CYCLE CURRENT LIMIT(a) SCHEMATIC (b) VOLTAGE AT FEEDBACK PIN

POWER SUPPLY WITH CONSTANT OFF-TIMECURRENT-MODE CONTROL

The advantages of constant off-time current-mode controlover constant-frequency current-mode control are: 1) thereis no need for a stabilizing ramp, 2) the converter is freefrom subharmonic instability (i.e., there is no need forslope compensation), and 3) the line voltage variation isautomatically canceled in buck-derived converters (e.g.,the forward converter). Figure 5 shows the implementationof that control method. As can be seen, a transistor Q1must be added to the controller. Figure 6 shows the timing-pin and feedback pin voltages for the TK75003. Thetransistor Q1 keeps the timing pin at ground potentialduring the on-time of the switch. Timing begins when thedrive output returns to low and Q1 is turned off. The off-timefor typical charge and discharge currents and peak andvalley voltages is:

GND

VCC

CT

FB

DRV

CAUX

R1

VAUX

RST

VIN

n3 n2

D3

RS

OC

TL431

+ +

VOUT

D2

FEEDBACKVOLTAGE

SWITCHCURRENTSIGNAL

STABILIZINGRAMP

0.98 V

0

-

CT

GND

VCC

CT

FB

DRV

VAUX

VIN

RS

TL431

+

R3

Q1

R1

R2

OC

OC

FEEDBACKVOLTAGE

PWMRAMP

0

0.98 V

(b)(a)

(b)(a)


TK75003

tOFF = CT x 14 kΩ.

FIGURE 5: TK75003 IN A FORWARD CONVERTERWITH CONSTANT OFF-TIME CURRENT-MODE

CONTROL

FIGURE 6: TIMING PIN AND FEEDBACK PINVOLTAGES WITH CONSTANT OFF-TIME CURRENT-

MODE CONTROL

TK75003 IN NON-ISOLATED APPLICATIONS

Although the IC was intended for off-line power-supplyapplications with the voltage-error amplifier at the isolatedoutput, it is easy and economical to use the device in non-isolated applications, too. Figure 7 shows a low-cost boostpower factor corrector controlled by the TK75003. Powerfactor correction is achieved by controlling the boostconverter with constant-frequency peak-current controland exploiting the variation of the allowed peak-currentlevel caused by the variable duty ratio and the stabilizingramp. Figure 8 shows a buck-boost converter with negativeinput voltage and positive output voltage, controlled by theTK75003. In both cases, the voltage-error amplifier is aTL431 shunt regulator, and a PNP transistor providesinterface between the TL431 and the control IC.

FIGURE 7: TK75003 IN A LOW COST BOOSTPOWER FACTOR CORRECTOR

FIGURE 8: NON-ISOLATED NEGATIVE-TO-POSITIVECONVERTER


GND

VCC

CT

FB

DRVQ1

VAUX

RS

TL431

+VOUT

VIN

R1

VAUX

OC

CT

3.2 V

1.1 V

0

0.98 V

FEEDBACK VOLTAGE LEVEL

FB

CT

FB

CT

GND

VCC

CT

FB

DRV

TL431

VIN (-)

VOUT (+)

GND

VCC

CT

FB

DRV

TL431

VOUT

+ACIN


TK75003

BOOST POWER FACTOR CORRECTOR APPLICATIONCIRCUIT

Figure 9 shows a universal-input, 100 W boost Powerfactor corrector application circuit. The control technique iscalled “current-clamped control.” Both the control techniqueand the application circuit with waveforms are described inthe paper “Low-Cost Power Factor Correction/Line-Harmonics Reduction with Current-Clamped BoostConverter,” published in the conference proceedings ofPower Conversion Electronics ’95/Powersystems World™’95. A copy of the paper can be obtained by contactingToko.

For designers who wish to explore other performanceoptimizations of the current-clamped boost power factorcorrector, aside from the conference paper Toko offers aMathcad© file which can accurately display currentwaveforms and predict power factor, harmonic distortion,and individual harmonic currents. The Mathcad file and thetext which describes how to use it are available from theColorado Springs Toko IC Design Center.

The power factor corrector in Figure 9 has been optimizedfor general wide-range-input use. In order to obtain thesame performance at power levels other than 100 W, thecontrol components do not need to change. The powercomponent values change as follows: C8 scales inproportion to the power level, and L1 and R8 scales ininverse proportion to the power level. Typically, althoughnot directly related to the line-current shaping capability ofthe application circuit, C1 and C10 would scale in proportionto the power level. All the components in the power stageshould have a current rating as needed to accommodatethe power level.

Below is a step-by-step design example, showing how todetermine the resistance of R7 terminating the feedbackpin and the resistance of the current-sense resistor R8, forthe boost corrector of Figure 9.

Assumptions:

Output power: POUT = 100 W

Output voltage: VOUT = 380 Vdc

Minimum line voltage: VI(MIN) = 85 Vrms

Efficiency at 85 Vrms: EFF = 0.93


Switching frequency: f = 100 kHz

Inductance of boost inductor: L1 = 2.5 mH

Maximum duty ratio of TK75005: DMAX = 0.88

Peak value of ramp currentflowing out of the FB pin: ISC(PK) = 200 µA

Threshold voltage of thecurrent-control detector: VCCD = 0.98 V

Calculations:

Peak value of minimum line voltage:

VI(MIN)(PK) = 2 x VI(MIN) = 120 VPK

Switch duty ratio at peak of minimum line voltage:

D = 1 - VI(MIN)(PK) / VOUT = 0.684

Peak-to-peak ripple current in inductor L1:

I = VI(MIN)(PK) x D / (f x L1) = 0.33 A

Input power at minimum line voltage:

PI = POUT / EFF = 107.5 W

Peak current in L1 (at peak of minimum line voltage):

IL1(PK) = 2 x PI / VI(MIN)(PK) + I / 2 = 1.95 A

Resistance of resistor R7 (Note 1):

R7 = DMAX x VCCD / ISC(PK) = 4.312 kohms


TK75003

FIGURE 9: BOOST POWER FACTOR CORRECTOR APPLICATION CIRCUIT


Select for R7:

R7 = 4.3 kohms

Resistance of current-sense resistor R8 (Note 2):

R8 = (VCCD - ISC(PK) x R7 x D) / IL1(PK) = 0.201 ohms

Select for R8:

R8 = 0.18 ohms

Note 1: This value of R7 ensures that the line current will be zero aroundthe zero-crossing of the line voltage, which is the required condition forlow-distortion line current.

Note 2: This value of R8 ensures that the sum of the voltage drop acrossR8 (caused by the peak inductor current) and the voltage drop across R7(caused by the instantaneous value of the stabilizing current) is equal tothe threshold voltage of the current-control detector at the peak of theline voltage.

C10.1 µF

F12 A / 250 V

B1600 V, 1.5 A

R1a24 k

0.5 W

R1b24 k

0.5 W

R25.6 k

C101 nF

400 V

C2470 µF

R35.6 k

R4

150 k

D430 V

D2 IN4148

C3100 nF

C4100 nF

VCCFB

GND CT

DRV

R7

4.3 k

C610 nF

R80.18

0.5 WR12

2.43 k

C8100 µF400 V

R11a200 k

0.25 W

R11b200 k

0.25 W

D3HFA04TB60

C5820 pF

5 %

R5

10

Q1IRF840

R6

51

D11N4148

TH110 Ω

U1TK75003

t:9

ETD-29 coregap in center leg

L12.5 mHt: 220

380 V DC100 W

85-265VAC

R933 k

R101.2 k

Q22907A

U2TL431

R13

100 k

C70.33 µF

+

-


TK75003

6.4

2.54 0.46

e

3.3

3.8

3.3

0.257.62

e10 ~15

0.5

min

9.5

58

1 4


M0.25

0.3

+0.

3+

Marking

Lot Number

Country of Origin

+ 0.15- 0.05

+ 0.15- 0.05

Marking Information


DIP-8

PACKAGE OUTLINE




IC-121-TK750030798O0.0K








TK75020

FEATURES Optimized for Off-Line and Battery Powered

Operation

Internal Zero-Voltage Detector

Soft-Start

Pulse-by-Pulse Current Limit

Overdissipation Protection with Soft-Start

Overvoltage Protection with Soft-Start

Low-Current Standby mode

Programmable On/Off Timing

Enable Control

APPLICATIONS Cold Cathode Fluorescent Lamps

Resonant Power Supplies

Power Supplies for Notebook Computers

Power Supplies for Personal Electronics

DESCRIPTION

The TK75020 is a low-cost, high-performance Zero-VoltageSwitching (ZVS) controller IC. The primary applicationsare in inverters for Cold Cathode Fluorescent Lamps(CCFL) and in ZVS quasi-resonant or multi-resonantconverters. The combination of a unique (patent-pending)control concept and a ZVS resonant inverter generateslow-distortion sine wave for the fluorescent lamp, leadingto extended lamp life and high luminous efficiency. The ICfeatures all necessary circuits of a controller for suchapplications, including externally adjustable timingparameters (frequency, Ton(min), Toff(max)), current limit,Soft-Start, enable, error amplifier, and a trimmed reference.The same reference is used for undervoltage protectionand other critical internal biases. Supply current in the “off”mode is kept at a minimum level (2 µA typical). Specialcare has been taken to avoid undesirable turn-on of theexternal power MOSFET when sufficient supply voltage isnot available, or when the device is held in the off mode.Even with no Vcc applied, the drive pin of the IC will sink in

excess of 20 mA while maintaining the voltage below 1 Vto prevent that leakage currents turn on the power MOSFET.An internal zero-voltage detector monitors the voltageacross the MOSFET and ensures that the turn-on will onlytake place under zero-voltage conditions. A uniqueoverdissipation protection prevents the overheating of thepower MOSFET in case the zero-voltage switching is lost.

The TK75020 is available in a 14-lead surface mountpackage.



Tape/Reel Code

TK75020

TK75020

75020

VCCDRV

GND

OVP

EN

CT

TOFF(MAX)

TON/SS

Vref

CL

ZVD

EAOUT

EAINV

ODP

ZVS RESONANT CONTROLLER


TK75020

TK75020 ELECTRICAL CHARACTERISTICSTest conditions: VCC = 12 V, VEN = 2.4 V, CT = 360 pF, ITON / SS = ITOFF(MAX) = 50 µA, DRV is Open, TA = Full OperatingTemperature Range, Typical numbers apply at TA = 25 °C, unless otherwise specified.

Note 1: Power Dissipation is 500 mW when mounted as recommended. Derate at 4 mW/°C for operation above 25°C.Note 2: Guaranteed by design.

ABSOLUTE MAXIMUM RATINGSAll Pins Except T

ON / SS, T

OFF(MAX), V

REF, C

T,

ODP and EN (Low Impedance Source) ................... 16 VT

ON / SS, T

OFF(MAX), ref, C

T, ODP Pins .......................... 6 V

EN Pin ...................................................................... 16 VPower Dissipation (Note 1) ................................ 500 mW

Maximum Current (VCC

and ZVD Pins) .................. 20 mAStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -20 to +85 °CJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C


I )FFO(CC FFOtnerruCylppuS V NE V0= 2 001 Aµ

I )H,FFO(CC HGIH,FFOtnerruCylppuS V NE V,V0= CC V61= 2 Am

I )OLVU(CC edoMOLVU,tnerruCylppuS V CC V5= 007 0001 Aµ

I )NO(CC NOtnerruCylppuSV CC V6= 7.4 6 Am

V<V6 CC V61< 8 Am

I )VRD,NO(CC VRD,NOtnerruCylppuSV CC C,V6= VRD Fn1= 6.5 8 Am

V<V6 CC V61< 01 Am

V )NO(CC dlohserhThgiHOLVU 2.5 6.5 0.6 V

V )FFO(CC dlohserhTwoLOLVU 0.5 3.5 6.5 V

V )TSYH(CC siseretsyHOLVU 08 005 Vm

)NIPNE(NOITCESFFO/NO

V NE egatloVdlohserhT V<V6 CC V61< 4.0 4.2 V

I NE tnerruCtupnIV NE V4.2= 4 Aµ

V NE )2etoN(,V0= 001- An

V(NOITCESECNEREFER FER )NIP

V fer egatloVtuptuOecnerefeR I fer Am0=TA C°52= 8.3 0.4 2.4 V

TA egnaRlluF= 7.3 0.4 3.4 V

|∆V )DAOL(fer | noitalugeRdaoL I<Am1- fer Am0< 0.4 Vm

|∆V )ENIL(fer | noitalugeReniL V<V6 CC V61< 51 Vm

I )CS(fer tnerruCtiucriCtrohS V fer V0= 21- Am


TK75020


)NIPVRD(NOITCESEVIRD

V )HGIH(VRD egatloVhgiHtuptuOI VRD Am02-= 0.9 0.01 V

I VRD Am001-= 8.9 V

V )WOL(VRD egatloVwoLtuptuO

I VRD Am02= 3.0 6.0 V

I VRD Am002= 8.1 5.2 V

I VRD V,Am02= CC roV0=V NE V0=

9.0 3.1 V

I )KP,CRS(VRD tnerruCecruoSkaeP C VRD Fn01= 005 Am

I )KP,KNIS(VRD tnerruCkniSkaeP C VRD Fn01= 007 Am

t ESIR emiTesiR C VRD Fn1= 07 021 sn

t LLAF emiTllaF C VRD Fn1= 52 57 sn

AE(NOITCESREIFILPMARORRE VNI AEDNA TUO )SNIP

V )fer(AE

ecnerefeRlanretnItnelaviuqEegatloV

91.1 62.1 03.1 V

I )VNI(AE tnerruCsaiB 01.0 Aµ

V )WOL,TUO(AE WOLegatloVtuptuO I )TUO(AE V,Am1-= VNI V5.1= 52.0 V

A LO niaGpooLnepO k51 Ω AEmorF TUO Tot NO SS/ 07 Bd

WBG tcudorPhtdiwdnaB-niaGk51 Ω AEmorF TUO Tot NO ,SS/

)2etoN(2 zHM

RSSP oitaRnoitcejeRylppuSrewoP V6 ≤ V CC ≤ V61 56 Bd

C(NOITCESTIMILTNERRUC L )NIP

I LC tnerruCsaiB V LC V0= 2.0- Aµ

V )HT(LC egatloVdlohserhT 081 012 042 Vm

t )VRD(LC VRDotyaleD V LC Vm004ot0morFspetS 051 sn

T(NOITCESTRATS-TFOSDNAGNITTESEMIT-NO NO )NIPSS/

I )CS(SS/NOT tnerruCtiucriCtrohS V SS/NOT V0= 5.2- Am

V SS/NOT egatloVniP I SS/NOT Am0= 8.1 0.2 2.2 V

V )HT(SS dlohserhTtratS-tfoS 04.0 56.0 09.0 V

V )HT(HCD dlohserhTegrahcsiDPDO 0.1 4.1 9.1 V

TK75020 ELECTRICAL CHARACTERISTICS (CONT.)Test conditions: VCC = 12 V, VEN = 2.4 V, CT = 360 pF, ITON / SS = ITOFF(MAX) = 50 µA, DRV is Open, TA = Full OperatingTemperature Range, Typical numbers apply at TA = 25 °C, unless otherwise specified.


TK75020


T(NOITCESGNITTESEMIT-FFOMUMIXAM )XAM(FFO )NIP

I )XAM,FFO(T tnerruCtiucriCtrohS V )XAM,FFO(T V0= 5.2 Am

V )XAM,FFO(T egatloVniP I )XAM,FFO(T Am0= 8.1 0.2 2.2 V

C(NOITCESGNIMIT T )NIP

V )WOL(TC egatloVdlohserhTwoL 9.0 0.1 1.1 V

V )HGIH(TC egatloVdlohserhThgiH 7.2 0.3 3.3 V

f ycneuqerFrotallicsO 511 041 561 zHk

RTC NOT

CotoitaRrefsnarTtnerruC T ,niPgnitteSemit-nO

V TC V4= 2.6- 5.5- 8.4-

RTC )XAM(FFOT

CotoitaRrefsnarTtnerruC T ,niPgnitteSemit-ffOxaM

V TC V0= 57.4 52.5 57.5

)NIPDVZ(NOITCESROTCETEDEGATLOVOREZ

V )HT(DVZ dlohserhTwoLrotceteD TA C°52= 8.1 0.2 2.2 V

I DVZ tnerruCtupnI V DVZ V2= 05- 0 Aµ

t )VRD(DVZ VRDotyaleDV DVZ ,V0ot5morFspetSC VRD Fn1=

071 003 sn

)NIPPDO(NOITCESROTCETEDNOITAPISSIDREVO

V )HT(PDO egaloVdlohserhTnoitceteD 54.0 07.0 59.0 V

I )GVA(PDO tnerruCegarevA T,zHk001=f PALREVO sn002= 6.0 Aµ

)NIPPVO(NOITCESROTCETEDEGATLOVREVO

V )HT(PVO egaloVdlohserhTnoitceteD 6.3 0.4 3.4 V

t )D(PVO VRDotylaeD 053 008 sn

TK75020 ELECTRICAL CHARACTERISTICS (CONT.)Test conditions: VCC = 12 V, VEN = 2.4 V, CT = 360 pF, ITON / SS = ITOFF(MAX) = 50 µA, DRV is Open, TA = Full OperatingTemperature Range, Typical numbers apply at TA = 25 °C, unless otherwise specified.


TK75020

BLOCK DIAGRAM

GND

VCC

EN OUT

VREF

EN

VCC

TIMER

+2 V

Q9 Q10

Q11

Q1A1

A2

R1

1 K

R2

1 K

Q3

Q2

Q4

Q5Q6

Q7

Q8

Q12Q13 Q14

1.25 VERROR AMP

VBE

2 VBE

SOFT START CMP

ODP DISCHARGE CMP

VCC

EN0

B0

START-UP BIAS

BANDGAP REF

5.8/5.3 V

+4 V

UVLO CMP

REF CMP

REF BUFFEREN1 EN2

BUFFERED BIAS

B1

B2

EN1VCC

REF3.0 V2.0 V1.5 V1.25 V1.0 V0.21 V

OVERDISSIPATION VOLTAGE PROTECTION

RQ

S G4

RQ

S

CL LATCH

ODP LATCH

Q16

Q15Q17 REF

G5

CL CMP

0.21 V

EN4 REF

ODP CUR SRC

CURRENT LIMITER

STAND-BY GATE DISCHARGE

1.5 V

3 V

1 V

CMP4

CMP3

CMP2

ZVS DRIVE

REF

VREF - VB

HIGH: RAMP DOWN

S

R

Q SR

Q

G1

G2

G3

DRVLATCH

B1

EN3

VCC

DRIVE

ZVD CMP

50 µA VCC

2.5/2.7 V

D1

EN3

BIASHIGH: DRV ENABLED

ZVD

DRV

CL

ODP

OVP

EAINV

EAOUT

TON/SS

CT

TOFF(MAX)

REF


TK75020

PIN DESCRIPTION


This pin is connected to the supply voltage. The IC beginsnormal operation when two conditions are met: 1) the VCCvoltage exceeds 5.6 V and 2) the voltage of the enable pinexceeds 2.2 V. Operation ceases and the IC goes into aUVLO mode when the VCC voltage drops below 5.3 V.When the voltage at the enable pin becomes less than0.4 V, the IC is turned off (“off” mode). In UVLO mode thecurrent consumption is less than 300 µA, in off mode it isfurther reduced to below 3 µA. The operating voltagerange is 6 V to 14 V. The tolerances of the start and stopvoltages are 5.6 ± 0.4 V and 5.3 ± 0.3 V, respectively.During normal operation the total IC current consumptionis less than 8 mA (no load, 100 kHz operation).

When VCC is applied to the device with the enable pinpulled above 2.2 V (“on” mode), the following events willoccur:

First, a trimmed bandgap reference voltage will begenerated as soon as VCC reaches about 4.8 V. Thisreference will be used to determine the UVLO thresholds.When VCC reaches the upper threshold of the undervoltagelockout comparator, that comparator enables the referencebuffer. When the voltage at the output of the buffer, i.e. onthe VREF pin, becomes higher than about 3.7 V, an enablesignal is generated for the drive stage through gate G3.

Normal operation may be interrupted at any time by pullingthe enable pin below 0.4 V. When VCC is reduced below thelower threshold of the undervoltage lockout, the internal 4V bias is disabled and the drive output is quickly turned off.The bandgap reference remains active as long as VCC isabove 4.8 V. Special care has been taken to keep the driveoutput low even at a lower level of VCC in order to preventunwanted turn-on of the external MOSFET.

ENABLE (ON/OFF) PIN (EN)

The enable pin is used to enable or disable the IC. The ICis guaranteed to turn on (i.e., to enter the “on” mode) whenthe pin voltage is above 2.2 V and is guaranteed to turn offwhen the pin voltage is below 0.4 V. If the On/Off featureis not needed, the pin can be connected directly to thesupply voltage. The enable pin is internally equivalent to a200 kΩ resistor in series with two diodes.

GROUND PIN (GND)This pin provides ground return connection for the IC.

DRIVE PIN (DRV)

This pin drives the external MOSFET. During standby, theDRV pin provides at least 20 mA current sinking capabilitywith less than 1 V difference between the ground and theDRV pin. The internal circuitry connected to the DRV pinis designed to deliver a peak output voltage of 4 V aboveground when the device operates at a minimum supplyvoltage of 6 V. An internal clamp circuit, however, ensuresthat the peak output voltage will never exceed 13 V. TheDRV pin goes high only if the following five conditions aremet simultaneously: 1) the drive (DRV) latch is set, 2) theoverdissipation protection latch (ODP) is reset, 3) thecurrent limit latch (CL) is reset, 4) the enable pin is pulledhigh, and 5) the output of the reference comparator is high,i.e., it detects that the voltage at the Vref pin is sufficientlyhigh.

CURRENT LIMIT PIN (CL)

The CL pin is used for high-speed, cycle-by-cycle overloadprotection. When the voltage of the CL pin exceeds 0.2 Vabove ground, the current limit latch is set by the CLcomparator and the output stage is forced low. At the sametime, the timing capacitor is quickly discharged withtransistor Q16. Note that a quick discharge is necessary inorder to reduce the “on” time (and the duty ratio) without asignificant increase in the effective “off” time. The currentlimit latch is reset when the output of the drive latch goeslow, i.e., when the off time is over and the output of the CLcomparator goes high.

REFERENCE PIN (Vref)

The bandgap reference, an internal 4 V source, is bufferedby a reference buffer, whose output is connected to the Vrefpin. The Vref pin voltage is enabled to develop when theupper threshold of the UVLO comparator is passed by VCC.


The external timing capacitor is connected to the CT pin.The voltage across the timing capacitor oscillates betweenan upper level of 3 V and a lower level of 1 V. During thetime the voltage of the timing capacitor is rising (due to thecharging current set by the resistor between ground andthe TOFF( MAX) pin), the drive latch is in the reset state and


TK75020

PIN DESCRIPTION (CONT.)

the DRV pin is held low. The drive latch may be set eitherby the output of comparator CMP3 through the two-inputOR gate G2 or by the ZVD comparator through G1 and G2.CMP3 detects if the timing voltage reached 3 V, the ZVDcomparator detects if the voltage at the ZVD pin droppedbelow 2 V. Note that gate G1 allows setting the drive latchthrough the ZVD pin only when the voltage at the CT pin ishigher than 1.5 V and the current limit latch is in the resetstate. The reason for disabling the ZVD path at CT pinvoltages lower than 1.5 V is to prevent an immediate turn-on of the MOSFET after it was turned off. CMP4 is used todetect if the CT pin voltage is higher than 1.5 V.

When the voltage of the timing capacitor is falling (due tothe discharging current set by the external resistors betweenthe output of the error amplifier and the TON/SS pin, as wellas between the TON/SS pin and ground), the DRV pin isallowed to go high. The charge and discharge currents areenabled exclusively.

ZERO VOLTAGE DETECTION PIN (ZVD)

This pin is connected to the drain of the power MOSFETswitch of the converter or inverter through a high valueresistor or a diode. When the MOSFET is turned off, thedrain voltage increases at first and then decreases, due tothe resonant action in the loading network of the switch.When the drain voltage is above the supply voltage of theIC, the ZVD pin voltage is clamped to the supply voltagethrough the internal diode D1. As the drain voltage dropsbelow the supply voltage, the voltage of the ZVD pin beginsto follow it. When the ZVD pin voltage drops below 2 V, theoutput of the ZVD comparator goes high and sets the drivelatch through gates G1 and G2. Unless there is a faultcondition, the DRV pin goes high and turns on the MOSFETswitch. By having the ZVD feature, the circuit automaticallysets the optimum off time, essentially independently fromthe value of the resistor between the TOFF(MAX) pin andground.

ERROR AMPLIFIER PIN (EA OUT)

The EAOUT pin is the output of the internal error amplifier.The output stage of the amplifier is an open-collectortransistor. It is normally connected to the TON/SS pin via anexternal resistor. The non-inverting input of the erroramplifier is internally tied to a trimmed 1.25 V reference.The error amplifier is short-circuit protected.

ERROR AMPLIFIER INPUT PIN (EA INV)

The EAINV pin (the inverting input of the error amplifier)serves for receiving either an external voltage-feedback oran external current-feedback signal. The compensatingnetwork of the feedback loop is usually connected betweenthe EAINV and the EAOUT pins.

TURN-ON TIMING / SOFT-START PIN (TON / SS)

The on-time is inversely proportional to the current flowingin the resistor connected between this pin and the EAOUTpin. The TON/SS pin is also useful for providing Soft-Startat turn-on. Soft-Start can be achieved by connecting theseries combination of a resistor and capacitor between theTON/SS pin and ground. When the normal operation of theIC is enabled (either because the VCC voltage exceeds theupper UVLO threshold or because the IC is turned on bythe Enable pin), the Soft-Start capacitor, which was initiallydischarged, begins to charge up through the series resistor.The charging current adds to the current flowing in the on-time-setting resistor and sets a shorter on time. As thevoltage builds up across the soft-start capacitor the chargingcurrent gradually decreases and the on time graduallyincreases.

At normal operation a voltage-to-current converter formedby A2 and Q2 keeps the voltage of the TON/SS pin at 2 V.The current flowing through R2 and the external resistorconnected to the TON/SS pin and ground is mirrored withQ3 and Q4 into a second mirror formed by Q5 and Q6. Thediode-connected section of the second mirror is shortedwith the transistor Q7 via Q8 when the current switch latchis reset.

MAXIMUM TURNOFF TIMING PIN (TOFF(MAX))

An external resistor connected between this pin and groundsets the current that charges the timing capacitor. Themaximum possible off time is inversely proportional to thevalue of that current. As discussed previously, when the offperiod is terminated by the zero-voltage detector, theactual off time becomes shorter than the value set by thisresistor.

At normal operation the voltage of the TOFF (MAX) pin is keptat 2 V with the help of a voltage-to-current converterformed by the amplifier A1 and transistor Q1. The currentflowing through the off time setting resistor and R1 is


TK75020

mirrored by the transistors Q9 and Q10 and it charges thetiming capacitor. The incoming mirror current is divertedfrom the mirror with transistor Q11 when the drive latch isset.

OVERDISSIPATION PROTECTION PIN (ODP)

The ODP pin is used to realize a protection againstoverdissipation of the power MOSFET due to the loss orabsence of zero-voltage switching (ZVS). (ZVS can be lostif the load or the input voltage changes too much. ZVS isabsent if the component values of the load network are farfrom optimal, or if the ZVD function is not implemented andthe set off time is either too short or too long.) If ZVS is notpresent in a converter or inverter that was originally meantto operate with it, the MOSFET is turned on with a substantialvoltage across it and the capacitor in parallel with it. Dueto the periodic discharge of the parallel capacitor, asignificant dissipation appears in the MOSFET. Thatdissipation is proportional to the switching frequency, thecapacitance value, and the square of the voltage acrossthe MOSFET at the instant of turn-on. The overdissipationprotection works as follows: a current source is enabledwhen the MOSFET drain voltage is above the ZVDcomparator threshold when the DRV pin voltage goeshigh. A short current pulse flows into the parallel combinationof a resistor and capacitor connected between the ODPpin and ground and gradually begins to raise the pinvoltage. When the pin voltage reaches about 0.7 V, theODP latch is set via gate G4. The output signal of the ODPlatch inhibits gate G3 and forces the drive output low. Theoutput of the ODP latch also turns on transistors Q12-Q14.Q12 removes the 2 V reference signal from the non-inverting input of amplifiers A1 and A2 . Q13 pulls down theEA OUT pin. The Soft-Start capacitor connected to the TON/SS pin begins to discharge through the soft-start resistor(see application circuit) and the on-time setting resistor.When the voltage at the TON/SS pin drops below 2 VBE, theODP discharge comparator turns on Q15, which pulls downthe ODP pin voltage and discharges the capacitorconnected to that pin. When the voltage at the TON/SS pindrops below a VBE, voltage the Soft-Start comparatorresets the ODP latch. At that time the 2 V reference isenabled and a new Soft-Start cycle begins. The turnoff/softrestart cycle repeats until zero-voltage switching isreestablished.

OVERVOLTAGE PROTECTION PIN (OVP)

The OVP pin is used to monitor the voltage across a


winding of the transformer in the CCFL inverter. When theOVP comparator detects an overvoltage, it initiates ashutdown via G4 and a Soft-Start cycle begins.


TK75020


CMP4

DRV LATCHQ

VSW

CT

ZVDCMP

i SW

TOFF(MAX)

TOFF TON

2.0 V0

0

3.0 V

1.5 V1.0 V

CL LATCHQ

DRV LATCHQ

VSW

CT

CL CLAMP

iSW

0

3.0 V

1.0 V

0.2 V / RSENSE

ZVDCMP

DRV LATCHQ

VSW

CT

CMP3

i SW

TOFF(MAX)

2.0 V0

0

3.0 V

1.0 V

CMP2ODP

LATCH

TON / S.S

DRV

CMP7

ODP

VBE

1.5 V

2.0 V

VBE

0

NORMAL OPERATION

OPERATION WITHOUT ZVD

CYCLE-BY-CYCLE CURRENT LIMIT

OVERDISSIPATION PROTECTION


TK75020

VIN6 TO 16 VJ1

1

2

3

ODP

INV

EAOUT

TON/SS

TOFF

CT

EN OVP

Vref

CL

DRV

ZVD

GND

VCC

R647 k

C5100 n

Q12SK1475 C10

10 n

C210 µF

C1100 n

R518 k

R168 k

R21 k

R322 k

C3680 p

Q2

F11A

C422 µ16 V

L1270 µ8RHB

L282 µ

8RHB

D11N4148

R9470 k

R10100 k

R1168 k

R1310 k

R123.3 k

C9100 n

D21N4148

R141 k

C647 n

n1= 19 n2= 1520

1 1

2 2

CCFL220-250 mm

J2

T1 (Note 2)

(Note 1)

Gen. Note: Q2 is not required if Q1 is an avalanche rated FETGen. Note: Part #CTX01-13154 (Call Toko Technical Support (719) 528-2200).


LAPTOP DISPLAY BACKLIGHTING EXAMPLE


TK75020

3.9

1.27

1.45

0.25

max

1.64

0.42

8.65

e

l

6.07

0.2

0.5

0 ~

10

0.76

1.27

5.4

e 1

1.27e


0.12

0.1

1 7

8140.

3+

0.3+


Marking Information


SOP-14

PACKAGE OUTLINE




IC-122-TK750200798O0.0K








TK75050

GND

PGND/CS

GND

INPUT

GND GND

VCCOUTPUT

1.0/0.9 V

INPUT

VCC

THERMALOVERLOAD

GND PGND/CS

OUTPUT

155/80 °C

CURRENTOVERLOAD

OVERLOADR

SQ

QS

RBIAS

11/10 V

UVLO

STARTUP

EN

EN

1.6/1.0 V

T

FEATURES 20 ns Rise and Fall Times into 1000 pF

550 µA Standby Current Consumption

Undervoltage Lockout Combined with First Pulse

Wake-Up Feature *

Cycle-by-Cycle Current Limiting

Current Sense Voltage Spike Cancellation when

Used with Gate Charge Recovery Circuit *

Thermal Overload Protection

TTL/CMOS Compatible Input

APPLICATIONS Driving of Power MOSFETs and IGBTs

Switch Mode Power Supplies

Step Motor Drivers

Solenoid Drivers

BLOCK DIAGRAM

TK75050

DESCRIPTION

The TK75050 is a non-inverting buffer to drive high powerinsulated gate transistors (e.g., MOSFETs and IGBTs).The output can source or sink 2 A into a 10,000 pFequivalent load. The IC features built-in cycle-by-cyclecurrent limiting. Its Undervoltage Lockout (UVLO) circuit iscombined with a First Pulse Wake-up Feature*. The chiphas thermal overload protection. Using the IC in the GateCharge Recovery* application, the switching spikedeveloped across the current sense resistor practicallybecomes negligible. Due to its low standby current andfirst-pulse wake-up feature, the device can be used in self-biased power supplies. The IC's high-speed cycle-by-cycle current limiting capability eliminates the short circuitrunaway problem which characterizes most current-controlled converters. The IC is well suited to providesupplementary overload protection in voltage-controlledconverters, too. The TK75050 is available in the widelyused 8-pin DIP package.

*Toko proprietary feature: See "Application Information" section.



Tape/Reel Code

TK75050D

Temperature Code

PACKAGE CODED: DIP-8

EXTENDED TEMP. RANGEI: -40 TO +85 C

75050

SMART MOSFET DRIVER


TK75050

ABSOLUTE MAXIMUM RATINGSExtended Temperature Range ................... -40 to +85 °CJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C

TK75050 ELECTRICAL CHARACTERISTICSTest conditions: VCC = 12 V, TA = Tj = Full Operating Temperature Range, DC Test Setup 1, unless otherwise specified.

Supply Voltage (Low Impedance Source) ................ 14 VPower Dissipation TK75050D (Note 1) .............. 825 mWStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -20 to +70 °C


NOITCESYLPPUSREWOP

I )YBTS(CC tnerruCylppuS )ybdnatS( )2etoN(, V NI pU-ekaWerofeBV0= 055 0001 Aµ

I )L(CC tnerruCylppuS )WOLtuptuO( V NI pU-ekaWretfAV0= 71 62 Am

I )H(CC tnerruCylppuS )HGIHtuptuO( V NI pu-ekaWretfAV4.2= 41 81 Am

I )DS(CC tnerruCyppuS )NWODTUHStuptuO( daolrevOlamrehTrotnerruC 91 42 Am

I SC/DNGP tnerruCSC/DNGP )WOLtuptuO( V NI pu-ekaWretfAV0= 4 01 Am

NOITCESTUOKCOLEGATLOVREDNU

V )NO(CC egatloVyppuS )dlohserhTHGIHOLVU( V CC drawpUspeewS 4.01 0.11 4.11 V

V )FFO(CC egatloVyppuS )dlohserhTWOLOLVU( V CC drawnwoDspeewS 3.9 0.01 4.01 V

NOITCESTUPNI

V )L(NI egatloVtupnI )dlohserhTWOL( 6.0 0.1 V

V )H(NI egatloVtupnI )dlohserhTHGIH( 6.1 1.2 V

I )L(NI tnerruCtupnI )WOL( V NI V0= 052- 001- Aµ

I )H(NI tnerruCtupnI )HGIH( V NI V4.2= 01 52 Aµ

V )UW(NI egatloVtupnI )dlohserhTpu-ekaW( 5.0 52.1 52.2 V

NOITCESTUPTUO

V )L(TUO egatloVtuptuO )WOL(I KNIS Am05= 52.0 5.0 V

I KNIS A0.1= 0.3 8.3 V

V )H(TUO egatloVtuptuO )HGIH(I ECRUOS Am05= 7.9 5.01 V

I ECRUOS A0.1= 0.8 5.9 V

I )XAM(TUO

ecruoSrokniStuptuOmumixaM)3etoN(,tnerruC

CL Fp000,01= 0.2 A

I )YBTS(TUO tnerruCnwod-lluPtuptuOybdnatS V CC V9=V TUO V8= 1 5.2 Am

V TUO V2= 3.0 7.0 Am


TK75050

Note 1: Power dissipation is 825 mW when mounted. Derate at 6.6 mW/°C for operation above 25°C.Note 2: Conditions for "wake-up": either 1) VIN exceeds VIN(H), stays above VIN(L), and VCC passes VCC(ON) or 2) VCC exceeds VCC(ON), stays above VCC(OFF), and VIN exceeds VIN(H). Conditions for "standby": either 1) VCC never exceeds VCC(ON) or 2) VCC drops below VCC(OFF) or 3) VIN never exceeds VIN(H).Note 3: Guaranteed by design; not 100% tested.

TK75050 ELECTRICAL CHARACTERISTICS (CONT.)Test conditions: VCC = 12 V, TA = Tj = Full Operating Temperature Range, DC Test Setup 1, unless otherwise specified.


NOITCESNOITCETORPDAOLREVOLAMREHT

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051 C°

T )NO(j

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drawnwoDspeewSerutarepmeTedoMnwodtuhSlamrehTni

08 C°

NOITCESNOITCETORPDAOLREVOTNERRUC

V LC

tnerruC,egatloVesneStnerruCdlohserhTtimiL

V SC ,drawpUspeewSTA 2puteStseTCD,C°52=

8.0 59.0 1.1 V

V )TSYH(LC

tnerruC,egatloVesneStnerruC)3etoN(,siseretsyHtimiL

2puteStseTCD 001 Vm

SCITSIRETCARAHCGNIHCTIWS

t RD emiTyaleD )ESIR( CL 3puteStseTCA,Fp0001= 02 54 sn

tR emiTesiR CL 3puteStseTCA,Fp0001= 02 04 sn

t FD emiTyaleD )LLAF( CL 3puteStseTCA,Fp0001= 02 54 sn

tF emiTllaF CL 3puteStseTCA,Fp0001= 02 04 sn

t )SOC(D

daolrevOtnerruC,emiTyaleD)3etoN(,nwodtuhS

CL ,Fp0001= ∆V SC ,Vm002=3puteStseTCA

021 sn


TK75050

100 nF

+

10 µF

VIN (t)

VCC

IN

GND

PGND/CS

VCC

+

-

OUT

TRIG IN

PULSEGENERATOR1

OSCILLOSCOPE

TRIG INCh B

Ch A

CL1000 pF

f = 10 kHzD = 1:1Level = TTL

PULSEGENERATOR2

RS ≤ 50 Ω

VOUT (t)

Ch C

10 Ω

SYNCH OUT

f = 10 kHzD = 1:10Level = ADJ.

VCS (t)

VCS =

90 %

VOUT(L)

+TRIG

VIN (t)

VCS (t)

VOUT (t)

tD = 10 µs

T = 100 µs

+TRIG

tW = 10 µs

t

t

t

VCS ADJ

VOUT(H)

VCL = 1 V

t

t

50 mV200 mV

tD(COS)

ZOOM IN

ZOOM IN

100 nF

+

10 µF

VIN

VCC

IN

GND

PGND/CS

VCC

+

-

OUT

SYNCH

PULSEGENERATOR

OSCILLOSCOPE

TRIG Ch B

Ch A

CL1000 pF

ZOOM IN

ZOOM IN

1.6 V 1.0 V

+TRIG -TRIG

90 %10 %

90 %

10 %

tDR

t

t

tR tF

tDF

TEST CIRCUITS

100 nF

+

-

+ +

10 µF 10000 µF

VIN

VCC

IN

GND

PGND/CS

OUT

ISOURCE

SW1

SW2

ISINK VCC

+

-100 nF

+

-

+

10 µF

VIN

VCC

IN

GND

PGND/CS

VCC

+

-

VCS

+

-10

DC TEST SETUP 1 DC TEST SETUP 2

Note: SW1 and SW2 are open by default. To avoid excessivedissipation, they are exclusively closed only for less than 100 ms tomeasure the appropriate output voltages VOUT(H) and VOUT(L) atspecified currents ISOURCE and ISINK, respectively.

AC TEST SETUP 3

AC TEST SETUP 4


TK75050


SUPPLY CURRENT VS.TEMPERATURE

TA (°C)

-25 25 75 125

I CC

(m

A)

20

14

10

VCC = 12 VNO LOAD CONNECTED

ICC(L)18

16

12

ICC(H)

STANDBY CURRENT VS.TEMPERATURE

TA (°C)

-25 25 75 125

I CC

(ST

BY

) (µ

A)

700

400

200

NO LOAD CONNECTED

VCC = 12 V

600

500

300

VCC = 10 V

VCC = 5 V

AVERAGE SUPPLY CURRENT VS.FREQUENCY

FREQUENCY (kHz)

0.01 0.1 1 10 100 1000

I CC

(AV

G)

(mA

)

20

14

10


18

16

12

TA = 125 °C

TA = 25 °C

SUPPLY CURRENT VS.SUPPLY VOLTAGE

VCC (V)

2 6 10 14

I CC

(m

A)

20

5

TA = 25 °CNO LOAD CONNECTED

ACTIVE MODE

15

10

0SLEEP MODE

UVLO THRESHOLD VS.TEMPERATURE

TA (°C)

-25 25 75 125

UV

LO T

HR

ES

HO

LD (

V)

11.5

10.0

9.5

VCC(ON)11.0

10.5

VCC(OFF)

INPUT THRESHOLD VS.TEMPERATURE

TA (°C)

-25 25 75 125

INP

UT

TH

RE

SH

OLD

(V

)

2.0

0.8

VIN(H)1.6

1.2VIN(L)

VCC = 12 V


TA (°C)

-25 25 75 125

VO

UT

(V

)

10.8

0.0

VOUT(H)

10.4

0.2VOUT(L)


10.2

10.6

CURRENT LIMIT THRESHOLD VS.TEMPERATURE

TA (°C)

-25 25 75 125

VC

L (V

)

1.2

0.6

1.0

0.8

VCC = 12 VVIN = VIN(H)

RISE AND FALL TIME VS.TEMPERATURE

TA (°C)

-25 25 75 125

TIM

E (

ns)

28

15

24

20

VCC = 12 VCL = 1000 pF

tF

tR


TK75050


PROPOGATION DELAY VS.TEMPERATURE

TA (°C)

-25 25 75 125

PR

OP

OG

AT

ION

DE

LAY

(ns

)

36

16

32

24

VCC = 12 VCL = 1000 pF

tDF

tDR

28

20

CURRENT OVERLOAD SHUTDOWNDELAY VS. TEMPERATURE

TA (°C)

-25 25 75 125

PR

OP

OG

AT

ION

DE

LAY

(ns

)

250

0

200

100

VCC = 12 VCL = 1000 pF

150

50

∆VCS = 50 mV

∆VCS = 200 mV∆VCS = 100 mV


TK75050

1.3 V. The hysteresis ensures that noise riding on the inputsignal does not cause spurious response at the output.

POWER GROUND/CURRENT SENSE PIN (PGND/CS)

This pin has two distinct functions: 1) it provides a separate,fully floating return path for the turnoff drive current of theoutput stage and, thus, reduces the internal noise of the IC;2) by connecting the pin to a current-sense resistor, the ICacts as a fast cycle-by-cycle current limiter.

When the voltage between the power-ground pin (PGND/CS) and the signal-ground pin (GND) exceeds the 0.95 Vcurrent-limit threshold, the drive signal is terminated forthe remainder of the time while the input signal is high.Once the input signal returned to zero, the latch that storedthe information about the presence of the overcurrent isreset, and the IC is ready to acquire another overcurrentevent in the next cycle.

PIN DESCRIPTION


This pin is connected to the supply voltage. Regardless ofthe state of the other pins, the IC is always in a low-currentstandby mode when the supply voltage is below the lowerthreshold of the undervoltage lockout circuit. The IC entersnormal mode when two conditions are met simultaneously:1) the supply voltage exceeds the upper threshold of theundervoltage lockout circuit, and 2) a "first" pulse arrives atthe input.

That first pulse "wakes up" the IC ( i.e., it enables the high-speed internal circuitry). The First Pulse Wake-Up is aproprietary feature of theTK75050. The feature isproprietary, but use is granted for use with the IC. Thatfeature is indispensable in off-line self-biased power-supply applications where the start-up current is providedby a large-value resistor connected between the rectifiedline and the IC (see Figure 1). Without the First PulseWake-up, the starting current would be equal to the normalsupply current, which is prohibitively large for a self-biasedstart.

GROUND PIN (GND)

This pin provides ground return connection for the small-signal portion of the IC. The return of the output stage is notconnected here, but to the floating power GND pin.

OUTPUT PIN

This pin drives the external MOSFET using a totem poleoutput stage. The peak drive source or sink current istypically 2 A into a 10,000 pF equivalent load. The UVLOcircuity ensures that the high-level output voltage willnever be less than about 7 V. In standby mode, the outputstage is equivalent to a pull-down resistor of about 3 kΩvalue, eliminating the need for an external gate to sourceresistor. Normally, there is no need to add a Schottky diodebetween the output and ground. In applications, however,with heavy capacitive load located far from the IC or whenthe IC drives a transformer, the Schottky diode maybecome necessary.

INPUT PIN

The input pin receives the signal to be buffered. Theincoming signal is processed by a comparator with a600 mV hysteresis centered around a threshold of about


TK75050


START-UP

Figure 1 shows the application of the TK75050 smartMOSFET driver in a self-biased power supply.

FIGURE 1: TK75050 IN A SELF-BIASED POWERSUPPLY

Figure 2 shows the typical waveforms during start-up.

FIGURE 2: WAVEFORMS DURING START-UP

CYCLE-BY-CYCLE CURRENT LIMIT

Figure 3(a) shows how to use the TK75050 as a high-speed cycle-by-cycle current limiter. Figure 3(b) shows thewaveforms. Note that the preferred connection for thebottom terminal of the filter capacitor CF is to the PGND/CSpin and not to the GND pin. By connecting CF to the PGND/CS pin, the capacitive feedthrough of the drive signal thatwould appear as a leading-edge spike in the current-sensewaveform is completely eliminated. This technique, called"Gate Charge Recovery" is patented by Toko, Inc., but is

granted for use with the TK75050. For a detailed descriptionand application information of the Gate Charge Recoverytechnique, see the Toko application note "ApplicationConsiderations for a Smart Five-Pin MOSFET/IGBT Driverwith High-Speed Current-Limit Capability."

(a) (b)

FIGURE 3: CYCLE-BY-CYCLE CURRENT LIMIT WITHTHE TK75050

(a) SCHEMATIC (b) WAVEFORMS

MAIN OVERLOAD PROTECTION IN VOLTAGE-MODE-CONTROLLED CONVERTERS

Figure 4 shows the TK75050 in a voltage-mode-controlledflyback converter. In this application example, the ICprovides the main overload protection.

FIGURE 4: TK75050 IN A VOLTAGE-MODE-CONTROLLED CONVERTER

+

+

PWMCONTROLLER

VCC

VIN

TK75050

+

VOLTAGE-MODEPWM

CONTROLLER

VIN

FEEDBACK

+12 V

VIN (t) & VOUT (t)

VIN (t)

VUVLO (t)

DRIVER “WAKES UP”

FIRST PULSECONDITION

UVLOCONDITION

BOOTSTRAP REGULATIONBEGINS

PWM ENABLE

UVLO LOWER THRESHOLD

UVLO UPPER THRESHOLD

VCC (t)

VAUX

RF

CFVCC

OUTIN

GND PGND/CS

VCS (t)

+

-

RCS

0.95 V

CF IS CONNECTED TO GND

CF IS CONNECTED TO PGND/CS

IN

OUT

VCS(t)

VCS(t)

0.95 V


TK75050

ADDITIONAL OVERLOAD PROTECTION IN PEAK-CURRENT-CONTROLLED CONVERTERS

Figure 5 shows the TK75050 in a current-mode-controlledforward converter, with optically isolated feedback. In thisapplication the TK75050 helps to achieve a tightly controlledcurrent-limit-characteristic. A tight current limit cannotusually be achieved with only current-mode control due tothe presence of the stabilizing ramp. The lack of thestabilizing ensures that the knee current (i.e., the outputcurrent where the limiting begins) is only slightly lower thanthe short-circuit current. The difference between the kneecurrent and the short-circuit current is about one-half of theripple current in the filter inductor. If a stabilizing ramp wereadded to the current-sense signal, the difference would besignificantly higher.

FIGURE 5: TK75050 IN A PEAK-CURRENT-CONTROLLED CONVERTER

ADDITIONAL OVERLOAD PROTECTION IN AVERAGE-CURRENT-CONTROLLED CONVERTERS

In converters with average current control the peak currentinformation is lost and the response of the current-controlloop slows down. The speed of the current-control loopmay not be sufficient to provide effective protection againstsudden overload or saturation of an inductor or transformer.Figure 6 shows an average-current-controlled boostconverter where the TK75050 provides additional fastoverload protection.

FIGURE 6: TK75050 IN A CONVERTER WITHAVERAGE CURRENT CONTROL

FLOATING DRIVE WITH OVERLOAD PROTECTION

The TK75050 can be used as a driver and current limiterfor a floating power switch. Figure 7 shows the IC in a buckconverter with transformer-isolated drive.

FIGURE 7: TK75050 AS A FLOATING DRIVER IN ABUCK CONVERTER

DEMO BOARD

The purpose of the board is to demonstrate the high-speedcurrent-limit capability of Toko's TK75050 smart MOSFETdriver. In the board a 2-A/500 V MOSFET switch is turnedon directly (i.e., without any series impedance) into a DC-bus with up to 400 V, at a frequency of 30 kHz. By removingthe short across a 3.3 µH inductor in series with theMOSFET, it is also possible to investigate the effect of thewiring inductance between the switch and the load. In


+

CURRENT-MODEPWM

CONTROLLER

VIN

+12 V

OC

TK75050

+

VIN

+12 V

+

-

+

-

FEEDBACK

TK75050

+

VIN

TK75050


TK75050

addition to the short-circuit protection, the board also illustrates how to use the IC for driving and protecting a floatingswitch.

CIRCUIT SCHEMATIC

Figure 8 shows the circuit schematic. The operation is as follows: U1, a 5-pin PWM IC (TK75001) generates a 30 kHzsquare-wave signal, with about 15 V peak-to-peak magnitude and 44% duty ratio. That square-wave signal is connectedto the primary winding of a pulse transformer T1 through a coupling capacitor C9 and a small series resistor R11. A voltage-doubler comprising C3, C4, D3 and D4 rectifies the transformed square wave appearing across the secondary winding ofthe transformer, generating a floating supply voltage of about 12 V for the MOSFET driver IC U2 (TK75050). A drive signalis derived for U2 from the voltage across the diode D4 with the help of the resistive divider R3 and R2. The output of U2(pin 3) is connected to the gate of the MOSFET Q1 through a 150 ohm resistor R4 and a parallel diode D5. The currentof the MOSFET switch is sensed by resistor R5. D6 and D7 protect the PGND/CS pin (pin 1) of U2 from excessive voltage;D8 and D9 prevent the voltages of pins 3 and 1 from swinging below ground by more than 0.3 V. The MOSFET Q1 isconnected to a DC-bus through a small inductor L1. That inductor represents the inductance of a wire connection to aload, which is at a distance of approximately 1 meter from the MOSFET. By placing a short across jumper JP1, we canemulate the case when the free-wheeling diode in a buck or boost converter fails. If the inductor L1 is not shorted, a clampcomprising D10, C6 and R7 limits the drain voltage excursion of Q1 to about 60 V above the bus voltage.

A test loop is provided for clamp-on type current probes to monitor the current in the MOSFET Q1. Test points TP1 throughTP4 are available for measuring the dc bus voltage and the voltage across Q1.

The DC-bus is generated by rectifying the line voltage with a bridge rectifier (in the case of 230 VRMS line) or with a voltagedoubler (in the case of 115 VRMS line, when jumper JP2 is shorted). Alternatively, a DC source of not more than 400 Vcan be connected to the line terminals.

Notes: (1) Leave JP2 open if you connect more than 250 V dc voltage to the line terminals, otherwise the excess voltage across C7 or C8 can leadto failure of the capacitor. (2) Never operate the circuit from 230 VRMS line with the jumper JP2 shorted. In such a case excess bus voltage will developthat will destroy capacitor C7 and C8 and transistor Q1.


VCC

IN

GND

PGND/CS

GND

OUTFB CT

GNDGND

VCC DRV

+15 V

TP5

R101 k

D111N5226B (3.3 V)

C21.5 n

C1+ U1

TK75001 D1

D2 C91

R1110

n1 n2

T1 D4

D3 R1

10

C4

C50.1 +

D7 D6

R3

22 k

R2

10 k

U2TK75050 D8

D9

D5

R4

150

R50.471 W

Q1

HS1 D10

C6

R7

1 k1 W

R610

TP3 TP1 TP2

C8

C7

R81 M

D14

D13

JP2

R91 M

D12

D15

F11A SLOW

115 OR 230Vrms

JP1

L1

TEST LOOPFOR CURRENT

PROBETP4

TEST POINT FOR VOLTAGE OBSERVATION

TEST POINT FOR SCOPE GND CLIP

TEST POINTS FOR VCC MEASUREMENT

(MAX. 400 VDC)Q1: IRF820 (IR PREFERRED)HS1: HS121-ND (DIGI-KEY, AAVID)D1, D2, D5, D8, D9: 1N5817D3, D4, D6, D7: 1N4148D10: BYV26CD12-15: 1N4005C1, C4: 10 , 25 VC6: 15 n, 630 V(e.g. ECQ-E6153KF, PANASONIC)C7, C8: 2.2 , 250 V (PANASONIC SU SERIES, RADIAL, ECE-A2EU2R2)L1: 3.3. , 4 A (e.g. R622LY-3R3M, TOKO)T1: RM5/i, 3E1 (PHILIPS), n1 = 40, n2 = 46, SINGLE LAYER WINDINGS, WIRE SIZE TO FILL THE BOBBINMYLAR INSULATION BETWEEN LAYERS, FOR 1 kV BETWEEN PRIMARY AND SECONDARYJP2: OPEN AT 230 V, SHORTED AT 115 V.

C31

FIGURE 8: CIRCUIT SCHEMATIC


TK75050

Figures 9 and 10 show the measured voltages across Q1(top trace) and the currents in Q1 (bottom trace). Figure 9shows the wave forms when there is no inductor in series with Q1 (i.e., L1 is shorted). Figure 10 shows the waveformswhen there is an inductor in series with Q1 (i.e., L1 is notshorted). The vertical scales are 100 V/div. (top trace) and1 A/div (bottom trace). The horizontal scales are 25 ns/div.

As can be seen, the peak currents stay below 2.5 A(Figure 9) or 2.8 A (Figure 10). Those numbers correspondto 25% or 40% overshoots above the nominal current-limitthreshold of 2 A. Both figures show that the IC shuts off theMOSFET completely in less than 50 ns after the currentpassed the 2 A threshold. The measured average DCcurrent consumption at a bus voltage of 400 V and aswitching frequency of 30 kHz is 4.3 mA when L1 is shorted(Figure 9) and 5.3 mA when L1 is not shorted (Figure 10).

FIGURE 9

FIGURE 10

0V

400V

0A

2A

25ns/div.

0V

400V

0A

2A

25ns/div.


SAFETY CONSIDERATIONS/LIABILITY DISCLAIMER

Dangerous voltages are present in the demo board.Extreme caution must be used when using and testing thecircuit. Only trained personnel, experienced in workingwith high voltages and power, should operate it. Use anisolating transformer between the line and the circuit if anygrounded instrument (including the 20 V auxiliary supplyfor the square-wave generator at the primary side oftransformer T1) is to be connected to the board. Note:Although the two windings of transformer T1 are isolatedfrom each other, the transformer is not designed to providesafety isolation between those windings.

Toko, Inc. disclaims any and all liability arising from use ormisuse of the demo board described herein.


TK75050

6.4

2.54 0.46

e

3.3

3.8

3.3

0.257.62

e10 ~15

0.5

min

9.5

58

1 4


M0.25

0.3

+0.

3+

Marking

Lot Number

Country of Origin

+ 0.15- 0.05

+ 0.15- 0.05

DIP-8

PACKAGE OUTLINE




IC-164-TK750500798O0.0K



Marking Information







TK83854

GND

PKLMT

CAOUT

ISENSE

MULTOUT

IAC

VAOUT

VRMS

GTDRV

VCC

CT

SS

RSET

VSENSE

ENA

Vref

ENA

OSC

7-5 VREF

IC POWER

15 V

RUN

R

R

S

Q

A

B

C

RUN

1

VSENSE

IAC

VRMS

SS

ISENSE CT RSET GND

GTDRV

VCCVrefPKLMTCAOUTMULTOUTVAOUT

VCC

16/10 V

7.5 V

2.5/2.25 V

14 µAX2

IM = ABC

FEATURES Control Boost PWM to 0.99 Power Factor

Limit Line Current Distortion to < 5%

Worldwide Operation without Switches

Feed-Forward Line Regulation

Low Noise Sensitivity

Pin Compatible with UC2854, and UC3854

(Licensed Source)

FEATURES (CONT.) Low Start-Up Supply Current

Fixed-Frequency PWM Drive

Low-Offset Analog Multiplier/Divider

1 Amp Totem-Pole Gate Driver

Precision Voltage Reference

BLOCK DIAGRAM

TK83854

DESCRIPTION

The TK83854 family of integrated circuits provide activepower factor correction for power systems that otherwisewould draw non-sinusoidal current from sinusoidal powerlines. These parts implement all the control functionsnecessary to build a power supply preregulator capable ofoptimally using available power-line current whileminimizing line-current distortion. To do this, the TK83854contains a voltage amplifier, a precision analog multiplier/divider, a current amplifier, and a fixed-frequency PWM. Inaddition, the TK83854 contains a power MOSFET gatedriver, 7.5 V reference, line anticipator, load-enablecomparator, low supply detector, and overcurrentcomparator.

The TK83854 family uses average current-mode control toaccomplish fixed-frequency current control with stabilityand low distortion. Unlike peak current-mode control,average current control accurately maintains sinusoidalline current without slope compensation.

The TK83854's high reference voltage and high oscillatoramplitude minimize noise sensitivity while fast PWMelements permit chopping frequencies above 200 kHz.The TK83854 can be used in systems with line voltagesthat vary from 75 to 275 V and with line frequencies acrossthe 50 Hz to 400 Hz range. To reduce the burden on the


TAPE/REEL CODETL: Tape LeftMG: Magazine

Tape/Reel Code

TK83854

Extended Temp. RangePackage Code

PACKAGE CODED: DIP-16M: SOP-16

TEMP. RANGE (OPTIONAL)I: -40 TO +85 C

circuitry that supplies power to this device, the TK83854family features low start-up supply current.

These devices are available in 16-pin plastic dual in-line(DIP) and 16-pin surface mount (SOP) packages.

83854

83854

DIP-16

SOP-16

HIGH POWER FACTOR PREREGULATOR


TK83854


TK83854 ELECTRICAL CHARACTERISTICSTest conditions: VCC = 18 V, RSET = 15 k to GND, CT = 1.5 nF, PKLMT = 1 V, ENA = 7.5 V, VRMS = 1.5 V, IAC = 100 µA,VISENSE = 0 V, VOUT(CA) = 3.5 V, VOUT(VA) = 5 V, VSENSE = 7.5 V, No load on SS, CAOUT, VAOUT, Vref, GTDRV, TA = OperatingTemperature Range, unless otherwise specified.

Supply Voltage ......................................................... 35 VPower Dissipation TK83854D (Note 1) ..................... 1 WPower Dissipation TK83854M (Note 2) .............. 750 mWGTDRV Current (Continuous) ................................. 0.5 AGTDRV Current (50% Duty Cycle) .......................... 1.5 AInput Voltage (VSENSE, VRMS) .................................... 11 VInput Voltage (ENA, ISENSE, MULTOUT) .................. 11 V

Input Voltage (PKLMT)............................................... 5 VInput Voltage (IAC, RSET, PKLMT) ........................ 10 mAStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ...................... 0 to +70 °CExtended Temperature Range ................... -40 to +85 °CJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C

Note 1: Power dissipation is 1 W when mounted as recommended. Derate at 8 mW/°C for operation above 25°C.Note 2: Power dissipation is 750 mW when mounted as recommended. Derate at 3.3 mW/°C for operation above 25°C.Gen. Note: All voltages with respect to GND (Pin 1).Gen. Note: All currents are positive into the specified terminal.


I )FFO(CC FFOtnerruCylppuS V0=ANE 5.1 0.2 Am

I )NO(CC NOtnerruCylppuS 01 61 Am

OLVU )NO( V CC dlohserhTno-nruT 5.41 0.61 5.71 V

OLVU )FFO( V CC dlohserhTffo-nruT 9 01 11 V

V ANE gnisiR,dlohserhTelbanE 04.2 55.2 07.2 V

V )TSYH(ANE siseretsyHdlohserhTelbanE 02.0 52.0 03.0 V

I ANE tnerruCtupnIelbanE V0=ANE 0.5- 2.0- 0.5 Aµ

I )SMR(V V SMR tnerruCtupnI V SMR V5= 0.1- 10.0- 0.1 Aµ

REIFILPMAEGATLOV

V )AV(SO egatloVtesffOpmAegatloV AV TUO V0= 8- 8 Vm

I )AV(B V ESNES tnerruCsaiB 005- 52- 005 An

A )AV(LO niaGpmAegatloV 07 001 Bd

∆V )AV(TUO gniwStuptuOpmAegatloV 8.5ot5.0 V

I )AV(CS tnerruCtiucriCtrohSpmAegatloV AV TUO V0= 03- 21- 5- Am

I SS tnerruCSS V5.2=SS 02- 41- 6- Aµ

REIFILPMATNERRUC

V )AC(SO egatloVtesffOpmAtnerruC 4- 4 Vm

I )AC(B I ESNES tnerruCsaiB 005- 021- 005 An

A )AC(LO niaGpmAtnerruC 08 011 Bd

∆V )AC(TUO gniwStuptuOpmAtnerruC 61ot5.0 V


TK83854

Note 3: Guaranteed by design; not 100% tested.Gen Note: ENA input is internally clamped to approximately 14 V.

TK83854 ELECTRICAL CHARACTERISTICS (CONT.)Test conditions: VCC = 18 V, RSET = 15 k to GND, CT = 1.5 nF, PKLMT = 1 V, ENA = 7.5 V, VRMS = 1.5 V, IAC = 100 µA,VISENSE = 0 V, VOUT(CA) = 3.5 V, VOUT(VA) = 5 V, VSENSE = 7.5 V, No load on SS, CAOUT, VAOUT, Vref, GTDRV, TA = OperatingTemperature Range, unless otherwise specified.


REIFILPMATNERRUC

I )AC(CS tnerruCtiucriCtrohSpmAtnerruC AC TUO V0= 03- 21- 5- Am

V )ESNESI( I,egnaRtupnI ESNES TLUM, TUO

ot3.0-5.2

V

WBG tcudorPWB-niaGpmAtnerruC TA )3etoN(C°52= 004 008 zHk

ECNEREFER

V fer egatloVecnerefeRI fer T,Am0= A C°52= 4.7 5.7 6.7 V

I fer .pmeTrevO,Am0= 53.7 05.7 56.7 V

∆V )DAOL(fer V fer noitalugeRdaoL I<Am01- fer Am0< 51- 5 51 Vm

∆V )ENIL(fer V fer noitalugeReniL V<V51 CC V53< 01- 2 01 Vm

I )CS(fer V fer tnerruCtiucriCtrohS V fer V0= 05- 82- 21- Am

TIMILKAEP

V )LP(SO egatloVtesffOTMLKP 01- 01 Vm

I )LP(B tnerruCtupnITMLKP V1.0-=TMLKP 002- 001- Aµ

t )LP(D yaleD.porPVRDTGotTMLKPVm05morfgnillafTMLKP

Vm05-ot571 sn

REVIRDETAG

V )XAM(G egatloVtuptuOVRDTGmumixaM V<V81 CC daoLoN,V53< 0.31 5.41 0.81 V

V HG HGIHegatloVtuptuOVRDTG V,ecruoSAm002 CC V51= 0.21 8.21 V

V )FFO(LG FFO,WOLegatloVtuptuOVRDTG V,kniSAm05 CC V0= 9.0 5.1 V

V LG ,WOLegatloVtuptuOVRDTGkniSAm002 0.1 2.2 V

kniSAm01 1.0 4.0 V

I )KP(G tnerruCVRDTGkaeP daoLFn01 0.1 A

t )G(R t/ )G(F emiTllaF/esiRVRDTG daoLFn1 53 sn

D XAM elcyCytuDmumixaMVRDTG AC TUO V7= 59 %


TK83854

Note 4: Multiplier gain constant (K) is defined by IOM = [K x IIAC x (VOUT(VA) - 1)] / VRMS2.

TK83854 ELECTRICAL CHARACTERISTICS (CONT.)Test conditions: VCC = 18 V, RSET = 15 k to GND, CT = 1.5 nF, PKLMT = 1 V, ENA = 7.5 V, VRMS = 1.5 V, IAC = 100 µA,VISENSE = 0 V, VOUT(CA) = 3.5 V, VOUT(VA) = 5 V, VSENSE = 7.5 V, No load on SS, CAOUT, VAOUT, Vref, GTDRV, TA = OperatingTemperature Range, unless otherwise specified.


REILPITLUM

I )CAI(MO

tnerruCtuptuOreilpitluM CAI()DETIMIL

R,Aµ001=CAI TES k01= 022- 002- 081- Aµ

I )CZ(MO oreZtnerruCtuptuOreilpitluM R,Aµ0=CAI TES k51= 0.2- 2.0- 0.2 Aµ

I )TES(MO

tnerruCtuptuOreilpitluM R( TES

)DETIMILR,Aµ054=CAI TES ,k51=

V SMR V6=AV,V1=082- 552- 022- Aµ

I MO tnerruCtuptuOreilpitluM

V,Aµ05=CAI SMR ,V2=V4=AV

05- 24- 33- Aµ


83- 72- 21- Aµ


561- 051- 501- Aµ


052- 522- 051- Aµ


59- 08- 06- Aµ

K tnerruCniaGreilpitluM )4etoN( 0.1- V

ROTALLICSO

f CSO ycneuqerFrotallicsOR TES k51= 64 55 26 zHk

R TES k2.8= 68 201 811 zHk

V PR CT edutilpmAkaeP-ot-kaePpmaR 9.4 4.5 9.5 V

V VR CT egatloVyellaVpmaR 8.0 1.1 3.1 V


TK83854

10 k

10 k 100

10 k

10 k

10 k

10 nF

10 nF

0.1 nF

0.39 nF

1.0 nF

1.0 nF

0.01 nF

8.2 k

10 k

15 k

100

10 µF0.1 µF

GND

PKLMT

CAOUT

ISENSE

MULT

IAC

VAOUT

V RMS

GTDRV

VCC

CT

SS

RSET

VSENSE

ENA

Vref

PKLMT

NC

CAOUT

IAC

MULTOUTNC

VAOUT

VRMS

NC

ENA

NC

VCC

BA C

7.5 V

IM = (AB) / C

TYPICAL PERFORMANCE CHARACTERISTICSTA = TJ = 25 °C

TEST CIRCUIT

MU

LTO

UT

(µ

A)

0

400

MULTIPLIER OUTPUT vs.VOLTAGE ON MULTIPLIER

IAC (µA)

0 200 400 600 800

200

600VAOUT = 5 VV(rms) = 2 V

MULTOUT = 3 V

MULTOUT = 0 V

MULTOUT = 1 V

MULTOUT = 2 V

0.1 1 10 100 1000 10000

FREQUENCY (kHz)

AO

L(C

A)

(dB

)AN

D P

HA

SE

MA

RG

IN (

) 120

100

80

60

20

40

PHASE MARGIN

OPEN LOOP GAIN

CURRENT AMPLIFIER GAIN ANDPHASE vs. FREQUENCY

0

-200.1 1 10 100 1000 10000

FREQUENCY (kHz)

AO

L(V

A)

(dB

)AN

D P

HA

SE

MA

RG

IN (

) 120

100

80

60

20

40

PHASE MARGIN

OPEN LOOP GAIN

VOLTAGE AMPLIFIER GAIN ANDPHASE vs. FREQUENCY

0

-200 10 100

RSET (kΩ)

DU

TY

CY

CLE

(%

)

100

95

90

80

85

GATE DRIVE MAXIMUM DUTYCYCLE vs. R SET

75

70

FR

EQ

UE

NC

Y (

kHz)

RSET (kΩ)

1 10 100

1000

100

1

100 pF

OSCILLATOR FREQUENCY VS.RSET AND CT

10

200 pF

500 pF

10 nF 5 nF

1 nF

2 nF

3 nF

t R(G

) / t

F(G

) (n

s)

100

500

GATE DRIVE RISE AND FALL TIMESvs. LOAD CAPACITANCE

CLOAD (µF)

0 .01 .02 .03 .04 .05

300

700

FALL TIME

RISE TIME


TK83854

MU

LT O

UT

(µA

)

40

120

MULTIPLIER OUTPUT vs. MULTIPLIERINPUT (MULTOUT = 0 V)

IAC (µA)

0 100 200 300 400 500

80

0

160V(rms) = 4 V

VAOUT = 5 V

VAOUT = 3 V

VAOUT = 2 V

VAOUT = 1.25 V

VAOUT = 4 V

MU

LT O

UT

(µA

)

20

100


IAC (µA)

0 100 200 300 400 500

60

140V(rms) = 5 V

VAOUT = 5 V

VAOUT = 3 V

VAOUT = 1.25 V

MU

LT O

UT

(µA

)

150

250


IAC (µA)

100

0 100 200 300 400 500

200

0

300

50

V(rms) = 3 V

VAOUT = 5 V

VAOUT = 3 V

VAOUT = 2 V

VAOUT = 1.25 V

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)TA = TJ = 25 °C


TK83854

PIN DESCRIPTION

GROUND PIN (GND)

All voltages are measured with respect to GND. VCC andVref should be bypassed directly to GND with a 0.1 µF orlarger ceramic capacitor. The timing capacitor dischargecurrent also returns to this pin, so the lead from theoscillator timing capacitor to GND should also be as shortand as direct as possible.

PEAK LIMIT (PKLMT)

The threshold for PKLMT is GND. Connect this input to thenegative voltage on the current sense resistor as shown inFigure 1. Use a resistor to Vref to offset the negative currentsense signal up to GND.

CURRENT AMPLIFIER OUTPUT (CA OUT)

This is the output of a wide-bandwidth op-amp that sensesline current and commands the Pulse Width Modulator(PWM) to force the correct current. This output can swingclose to GND, allowing the PWM to force zero duty cyclewhen necessary. The current amplifier will remain activeeven if the IC is disabled.

CURRENT SENSE MINUS (ISENSE)

This is the inverting input to the current amplifier. This inputand the non-inverting input MULTOUT remain functionaldown to and below GND. Care should be taken to avoidtaking these inputs below –0.5 V, because they areprotected with diodes to GND.

MULTIPLIER OUTPUT AND CURRENT SENSE PLUS(MULTOUT)

The output of the analog multiplier and the non-invertinginput of the current amplifier are connected together atMULTOUT. The cautions about taking ISENSE below –0.5 Valso apply to MULTOUT. As the multiplier output is acurrent, this is a high impedance input similar to ISENSE, sothe current amplifier can be configured as a differentialamplifier to reject GND noise. Figure 1 shows an exampleof using the current amplifier differentially.

INPUT AC CURRENT (IAC)

This input to the analog multiplier is a current. The multiplieris tailored for very low distortion from this current input (IACto MULTOUT), so this is the only multiplier input that should

be used for sensing instantaneous line voltage. The nominalvoltage on IAC is 6 V, so in addition to a resistor from IACto rectified line, connect a resistor from IAC to Vref. If theresistor to Vref is one-fourth of the value of the resistor tothe rectifier, then the 6 V offset will be cancelled, and theline current will have minimal crossover distortion.

VOLTAGE AMPLIFIER OUTPUT (VA OUT)

This is the output of the op-amp that regulates outputvoltage. Like the current amplifier, the voltage amplifier willalso stay active even if the IC is disabled with either ENAor VCC. This means that large feedback capacitors acrossthe amplifier will stay charged through momentary disablecycles. Voltage amplifier output levels below ~1 V willinhibit multiplier output.

RMS LINE VOLTAGE (V(rms) )

The output of a boost PWM is proportional to the inputvoltage, so when the line voltage into a low-bandwidthboost PWM voltage regulator changes, the output willchange immediately and slowly recover to the regulatedlevel. For these devices, the V(rms) input compensates forline voltage changes if it is connected to a voltageproportional to the RMS input line voltage. For best control,the VRMS voltage should stay between 1.5 V and 3.5 V.

VOLTAGE REFERENCE OUTPUT (Vref)

Vref is the output of an accurate 7.5 V voltage reference.This output is capable of delivering 10 mA to peripheralcircuitry and is internally short circuit current limited. Vref isdisabled and will remain at 0 V when VCC is low or whenENA is low. Bypass Vref to GND with a 0.1 µF or largerceramic capacitor for best stability.

ENABLE (ENA )

ENA is a logic input that will enable the PWM output,voltage reference, and oscillator. ENA also will release thesoft start clamp, allowing SS to rise. When unused, connectENA to a +5 V supply or pull ENA high with a 22 k resistor.The ENA pin is not intended to be used as a high-speedshutdown to the GTDRV output.


TK83854

VOLTAGE AMPLIFIER INVERTING OUTPUT (V SENSE)

This is normally connected to a feedback network and tothe boost converter output through a divider network.

OSCILLATOR CHARGING CURRENT AND MULTIPLIERLIMIT SET (RSET)

A resistor from RSET to ground will program oscillatorcharging current and maximum multiplier output. Multiplieroutput current will not exceed 3.75 V divided by the resistorfrom RSET to ground.

SOFT-START (SS)

SS will remain at GND as long as the IC is disabled or VCCis too low. SS will pull up to over 8 V by an internal 14 µAcurrent source when both VCC becomes valid and the IC isenabled. SS will act as the reference input to the voltageamplifier if SS is below Vref. With a large capacitor from SSto GND, the reference to the voltage regulating amplifierwill rise slowly, and increase the PWM duty cycle slowly.In the event of a disable command or a supply dropout, SSwill quickly discharge to ground and disable the PWM.

OSCILLATOR TIMING CAPACITOR (C T )

A capacitor from CT to GND will set the PWM oscillatorfrequency according to this relationship:

fOSC = 1.25 / (RSET x CT)

POSITIVE SUPPLY VOLTAGE (V CC)

Connect VCC to a stable source of at least 20 mA above 17V for normal operation. Also bypass VCC directly to GND toabsorb supply current spikes required to charge externalMOSFET gate capacitances. To prevent inadequateGTDRV signals, these devices will be inhibited unless VCCexceeds the upper undervoltage lockout threshold andremains above the lower threshold.

GATE DRIVER (GTDRV)

The output of the PWM is a totem pole MOSFET gatedriver on GTDRV. This output is internally clamped to15 V so the IC can be operated with VCC as high as 35 V.Use a series gate resistor of at least 5 ohms to prevent


interaction between the gate impedance and the GTDRVoutput driver that might cause the GTDRV output toovershoot excessively. Some overshoot of the GTDRVoutput is always expected when driving a capacitive load.


TK83854


A 250 W PREREGULATOR

Figure 1 shows a typical application of the TK83854 as apreregulator with high power factor and efficiency. Theassembly consists of two distinct parts, the control circuitcentering on the TK83854 and the power section.

The power section is a "boost" converter, with the inductoroperating in the continuous mode. In this mode, the dutycycle is dependent on the ratio between input and outputvoltages. Also, the input current has low switching frequencyripple, which means that the line noise is low. Furthermore,the output voltage must be higher than the peak value ofthe highest expected AC line voltage, and all componentsmust be rated accordingly.

In the control section, the TK83854 provides PWM pulsesto the power MOSFET gate (GTDRV, Pin 16). The dutycycle of this output is simultaneously controlled by fourseparate inputs to the chip:

INPUT PIN # FUNCTIONVSENSE 11 Output DC Voltage

IAC 6 Line Voltage Waveform ISENSE /MULTOUT 4/5 Line Current VRMS 8 RMS Line Voltage

Additional controls of an auxiliary nature are provided.They are intended to protect the switching power MOSFETfrom certain transient conditions, as follows:

INPUT PIN # FUNCTIONENA 10 Start-up Delay

SS 13 Soft Start PKLMT 2 Maximum Current Limit

PROTECTION INPUTS

Enable (ENA)

The ENA input must reach 2.5 V before the Vref andGTDRV outputs are enabled. This provides a means toshut down the gate in case of trouble, or to add a time delayat power up. A hysteresis gap of 200 mV is provided at thisterminal to prevent erratic operation. Undervoltageprotection is provided directly at Pin 15, where the on/offthresholds are 16 V and 10 V, respectively.

Soft-Start (SS)

The voltage at Pin 13 (SS) can reduce the referencevoltage used by the error amplifier to regulate the outputDC voltage. With Pin 13 open, the reference voltage istypically 7.5 V. An internal current source deliversapproximately 14 µA from Pin 13. Thus, a capacitorconnected between that pin and GND will charge linearlyfrom zero to 7.5 V in 0.54 x C seconds, with C expressedin microfarads.

Peak Current Limit (PKLMT)

Use Pin 2 to establish the highest value of current to becontrolled by the power MOSFET. With the resistor dividervalues shown in Figure 1, the 0.0 V threshold at Pin 2 isreached when the voltage drop across the 0.25 Ω currentsense resistor is 7.5 V x 1.6 k / 10 k = 1.2 V, correspondingto 4.8 A. A bypass capacitor from Pin 2 to ground isrecommended to filter out very high frequency noise.

CONTROL INPUTS

Output DC Voltage Sense (V SENSE)

The threshold voltage for the VSENSE input is 7.5 V and theinput bias current is typically -10 nA. The values shown inFigure 1 are for an output voltage of 400 VDC. In thiscircuit, the voltage amplifier operates with a constant lowfrequency gain for minimum output excursions. The0.047 µF feedback capacitor places a 15 Hz pole in thevoltage loop that prevents 120 Hz ripple from propagatingto the output current.

Line Waveform (IAC)

In order to force the line current waveshape to follow theline voltage, a sample of the power line voltage waveformis introduced at Pin 6. This signal is multiplied by the outputof the voltage amplifier in the internal multiplier to generatea reference signal for the current control loop.

This input is not a voltage, but a current (hence IAC). It isset up by the 220 k and 910 k resistive divider (see Figure1). The voltage at pin 6 is internally held at 6 V, and the tworesistors are chosen so that the current flowing into pin 6varies from zero (at each zero crossing) to about 400 µAat the peak of the waveshape. The following formulas were


TK83854

used to calculate these resistors:

RIAC = VPK(MAX) / 400 E - 6

= (260 VAC x 2 ) / 400 µA

= 910 k

RREF = RIAC / 4 = 220 k

where VPK is the peak line voltage.

Line Current (I SENSE/MULTOUT )

The voltage drop across the 0.25 Ω current-sense resistoris applied to Pins 4 and 5 as shown. The current-senseamplifier also operates with high low-frequency gain, butunlike the voltage amplifier, it is set up to give the current-control loop a very wide bandwidth. This enables the linecurrent to follow the line voltage as closely as possible. Inthe present example, this amplifier has a zero at about500 Hz, and a gain of about 18 dB thereafter.

RMS Line Voltage (V RMS)

An important feature of the TK83854 preregulator is that itcan operate with a three-to-one range of input line voltages,covering everything from low line in Japan (85 VAC) tohigh line in Europe (255 VAC). This is done using line feed-forward, which keeps the input power constant with varyinginput voltage (assuming constant load power). To do this,the multiplier divides the line current by the square of therms value of the line voltage. The voltage applied to Pin 8,proportional to the average of the rectified line voltage (andproportional to the RMS value), is squared in the TK83854,and then used as a divisor by the multiplier block. Themultiplier output, at Pin 5, is a current that increases withthe current at Pin 6 and the voltage at Pin 7, and decreaseswith the square of the voltage at pin 8.

PWM Frequency

The PWM oscillator frequency in Figure 1 is 100 kHz. Thisvalue is determined by CT at Pin 14 and RSET at Pin 12.RSET should be chosen first because it affects the maximumvalue of IOM according to the equation:

IOM(MAX) = -3.75 V / RSET

This effectively sets a maximum PWM-controlled current.


With RSET = 15 k:

IOM(MAX) = -3.75 V / 15 k = -250 µA

It is also important to note that the multiplier output currentwill never exceed twice IAC.

With the 3.9 k resistor from MULTOUT to the 0.25 Ω currentsense resistor, the maximum current in the current senseresistor will be:

IRCS(MAX) = (-IOM(MAX) x 3.9 k) / 0.25 Ω = -3.9 A

Having selected RSET, the current sense resistor, and theresistor from MULTOUT to the current sense resistor,calculate CT for the desired PWM oscillator frequency fromthe equation:

CT = 1.25 / (f OSC x RSET)


TK83854


ENA

OSC

7-5 VREF

IC POWER

15 V

RUN

R

R

S

Q

A

B

C

RUN

1

VSENSE

IAC

VRMS

SS

ISENSE

CT RSET GND

GTDRV

VCCVrefPKLMT

MULTOUTVAOUT

C100.01 µFC9

220 µF

+

C161 µF

C70.47 µF

R1020 K

C120.1 µF

R9

91 K

R25910 K

R8910 K R12

27 K

R1375 K

R203 K

R27

8.2 M

R21

24 K

R23470 K

R2230 K

Q2

D3

1N4746A

D51N4148

Q3ZVN4206A

C10.47 µF

BR1KBU8J

+

-~

~

TH1KC015L

C50.47 µF

D9

1N5406

L11 mH

C140.1 µF

C170.1 µF

D12MUR110

D13 1N4148D11 MUR110

R7

240 K

C6 0.047 µF

R1

0.25 R33.9 K

D71N5817

R23.9 K

R41.6 K C3 270 pF

C1368 pF

D10 1N4737

C15 680 pF

D8 1N5817

R29 10 K

R624 K

C4 1 µF

R16

20

R1810 K

R17511 K

C2330 µF

D2MUR860

Q1IRF840

D41N5821

+

C111000 pF

R1415 k

ILIMIT

X214 µA

7.5 V

2.5 V

16 VVCC

R28220 K

IM =ABC

VOUT385 VDC

TIP50GE

F16 A

FIGURE 1: 250 W PREREGULATOR


TK83854

2.3

0.4

10.3

1.270.1Ç l0.12

e

2.8

max

7.5

10.3

0.7

0.76

1.7

1.27

9.53


81

16 9

0.25

e

e 1

0 ~

10


+0.15-0.05

0.3+

+0.

15-0

.05

0 ~

0.3

Marking Information


SOP-16

PACKAGE OUTLINE




IC-167-TK838540798O0.0K



DIP-16

2.54 0.5

4.2

3.2

e

M0.25

1e

19.05

0.5

min

7.62 0 ~15

3.3

6.35

1 8

916


0.3

+0.

3+

0.25

+0.15-0.05

Marking

Country of Origin

Lot Number





Temperature Sensor ICs

Part Number Function Features

TK11031 Temperature Sensor ICLinear Output Voltage 10mV/°C Output

4.5 to 10.0 Volt Supply Range













TK11050 Temperature Controller ICInternal Temperature Sensor, Voltage

Reference and Comparator

TK11051 Temperature Controller ICInternal Temperature Sensor, Voltage

Reference and Comparator

TK11070 Temperature Sensor ICLinear Output Voltage -8mV/°C

Output


TK11031

GND

VCONT

HS

ON/OFFCIRCUIT

TEMPERATUREDETECTION

CIRCUIT

VCC

VOUT

VCC

+

-

APPLICATIONS Home and Industrial Thermostats

Automotive Climate Control

Battery Charger Temperature Monitor

Notebook Computer Temperature Monitor

Electronic Thermometers

Fish Finder Water Temperature

Industrial Process Controllers

Home Appliance Temperature Control

HS

VCC

VCONT

GND

VOUT

TK11031

TEMPERATURE SENSOR IC

FEATURES Linear Output Voltage 10 mV/ °C Output


4.5 to 10.0 V Supply Range


Minimum External Parts Count

Low Power Consumption

BLOCK DIAGRAM



Tape/Reel Code

TK11031M

Note: Connect Pin 2 to GND.

DESCRIPTION

The TK11031 is a temperature sensor IC with a linearoutput of 10 mV/°C over the range of -30 to + 105 °C. Itswide operating voltage range of 4.5 to 10.0 V makes itsuitable for a number of applications requiring accuratetemperature control, such as electronic thermostats forclimate control, refrigerators, and industrial processcontrols. The device is in the “on” state when the control pinis pulled to a logic high level.

A typical application is to make a digital representation oftemperature with an A/D converter, or to make a thermaldetector with a comparator.

The TK11031 has a compensation pin for a 0.1 µF capacitorthat ensures stability over the IC's operating temperaturerange.



TK11031


V TUO egatloVtuptuO

TA C°52= 259.2 289.2 210.3 V

TA C°58= 155.3 195.3 136.3 V

TA C°03-= 534.2 V

TC tneiciffeoCerutarepmeT TA C°58otC°52= 53.9 51.01 59.01 C°/Vm

geReniL noitalugeReniL V CC V01ot5= 02- 5 02 Vm


I CC tnerruCylppuS 09 051 Aµ

I TUO tnerruCtuptuO ∆V TUO ≤ Vm02 004 Aµ

I )YBTS(CC tnerruCylppuSybdnatS V TNOC ≤ V6.0 1 Aµ


V )NO(TNOC )NO(egatloVlortnoC V TUO NOtuptuO,V210.3ot259.2= 8.1 4.2 V CC V

V )FFO(TNOC )FFO(egatloVlortnoC V TUO ≤ FFOtuptuO,V1.0 DNG 6.0 V

I TNOC tnerruClortnoC 5.4 5.7 Aµ

Supply Voltage ......................................................... 12 VOperating Voltage .......................................... 4.5 to 10 VPower Dissipation (Note 1) ................................ 150 mWJunction Temperature ........................................... 150 °C


TK11031 ELECTRICAL CHARACTERISTICSTest Conditions: VCC = 5.0 V, VCONT = 2.4 V, IOUT = 0 µA, TA = 25 °C, unless otherwise specified.


Storage Temperature Range ................... -55 to +150 °COperating Temperature Range ................. -30 to +105 °CLead Soldering Temperature (10 s) ...................... 235 °C


TK11031

VCC

+

VCONT

VCONT

GND HS

VOUT

COUTIOUT VOUT

0.1 µF

10 µF

ICC

ICONT

VCC

TEST CIRCUIT

VO

UT

(V

)

2

4

OUTPUT VOLTAGE vs.TEMPERATURE

TA (°C)

0

-40 0 40 80 120

3

1

I CC

(µA

)

80

100

INPUT CURRENT vs.TEMPERATURE

TA (°C)

60

-40 0 40 80 120

90

70

TE

RR

( C

)

0

2

LINEARITY ERROR vs.TEMPERATURE

TA (°C)

-2

-40 0 40 80 120

1

-1

I CC

(µ

A)

80

100

INPUT CURRENT vs.INPUT VOLTAGE

VCC (V)

60

2 4 6 8 10

90

70

VE

RR

(m

V)

0

20

LINE REGULATION

VCC (V)

-20

2 4 6 8 10

10

-10

VE

RR

(m

V)

0

20

LOAD REGULATION

IOUT (µA)

-20

0 100 200 300 400

10

-10

TYPICAL PERFORMANCE CHARACTERISTICSVCC = 5 V, VCONT = 2.4 V, IOUT = 0 µA, TA = 25 °C, unless otherwise specified.


TK11031

VO

UT

(V

)

2

4

OUTPUT VOLTAGE vs.CONTROL VOLTAGE

VCONT (V)

0

0 0.6 1.2 1.8 2.4

3

1

I CC

(µA

)50

100

INPUT CURRENT vs.CONTROL VOLTAGE

VCONT (V)

0

0 0.6 1.2 1.8 2.4

75

25

I CO

NT

(µA

)

4

6

CONTROL CURRENT vs.TEMPERATURE

TA (°C)

2

-40 0 40 80 120

5

3

VO

UT

(V

)

2

4

CONTROL VOLTAGE RESPONSE A

TIME (ms)

0

0 1 2 3 4

3

1

COUT = 0.1 µF

VO

UT

(V

)

2

4

CONTROL VOLTAGE RESPONSE B

TIME (ms)

0

0 1 2 3 4

3

1

COUT = 0 µF

VO

UT

(V

)

2

4

TEMPERATURE RESPONSE A

TIME (s)

0

0 20 40 60 80

3

1

25 TO 85 °C

I CO

NT

(µA

)

4

8

CONTROL CURRENT vs.CONTROL VOLTAGE

VCONT (V)

0

0 0.6 1.2 1.8 2.4

6

2

RR

(dB

)

40

80

RIPPLE REJECTION RATIO B

f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0 µF

Vrr = 100 mVrms

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)VCC = 5 V, VCONT = 2.4 V, IOUT = 0 µA, TA = 25 °C, unless otherwise specified.

RR

(dB

)

40

80

RIPPLE REJECTION RATIO A

f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0.1 µF

Vrr = 100 mVrms


TK11031V

OU

T (

V)

2

4

TEMPERATURE RESPONSE B

TIME (s)

0

0 20 40 60 80

3

1

25 TO -30 °C



TK11031

0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.4

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0.

15-

0.05


+0.15 -0.05

Marking Information

MarkingTK11031 31C

SOT-25 (SOT-23-5)

PACKAGE OUTLINE







IC-231-TK110310798O0.0K





TK11032

HS

VCC

VCONT

GND

VOUT

TK11032


FEATURES Linear Output Voltage 6 MV/ °C Output














BLOCK DIAGRAM



Tape/Reel Code

TK11032M

01S

GND

VCONT

HS

ON/OFFCIRCUIT


CIRCUIT

VCC

VOUT

VCC

+

-

Note: Connect Pin 2 to GND

DESCRIPTION






TK11032







V TUO egatloVtuptuO

TA C°52= 2177.1 2987.1 2708.1 V

TA C°58= 6031.2 6451.2 6871.2 V

TA C°03-= 0164.1 V












TK11032

TEST CIRCUIT

VCC

+

VCONT

VCONT

GND HS

VOUT

COUTIOUT VOUT

0.1 µF

10 µF

ICC

ICONT

VCC

VO

UT

(V

)

2

4


TA (°C)

0

-40 0 40 80 120

3

1

TE

RR

( C

)

0

2


TA (°C)

-2

-40 0 40 80 120

1

-1

I CC

(µA

)

80

100


TA (°C)

60

-40 0 40 80 120

90

70

I CC

(µA

)

80

100


VCC (V)

60

2 4 6 8 10

90

70

VE

RR

(m

V)

0

20

LINE REGULATION

VCC (V)

-20

2 4 6 8 10

10

-10

VE

RR

(m

V)

0

20

LOAD REGULATION

IOUT (µA)

-20

0 100 200 300 400

10

-10



TK11032

VO

UT

(V

)

2

4


VCONT (V)

0

0 0.6 1.2 1.8 2.4

3

1

I CC

(µA

)

50

100


VCONT (V)

0

0 0.6 1.2 1.8 2.4

75

25

I CO

NT

(µA

)

4

6


TA (°C)

2

-40 0 40 80 120

5

3

I CO

NT

(µA

)

4

8


VCONT (V)

0

0 0.6 1.2 1.8 2.4

6

2

VO

UT

(V

)

2

4


TIME (ms)

0

0 1 2 3 4

3

1

COUT = 0.1 µFV

OU

T (

V)

2

4


TIME (ms)

0

0 1 2 3 4

3

1

COUT = 0 µF

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0.1 µF

Vrr = 100 mVrms

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0 µF

Vrr = 100 mVrms

VO

UT

(V

)

2

4


TIME (s)

0

0 20 40 60 80

3

1

25 TO 85 °C



TK11032

VO

UT

(V

)

2

4


TIME (s)

0

0 20 40 60 80

3

1

25 TO -30 °C



TK11032

0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.4

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0.

15-

0.05


+0.15 -0.05

Marking Information

MarkingTK11032 32C

SOT-25 (SOT-23-5)

PACKAGE OUTLINE




IC-232-TK110320798O0.0K








TK11033

GND

VCONT

HS

ON/OFFCIRCUIT


CIRCUIT

VCC

VOUT

VCC

+

-

TK11033


FEATURES Linear Output Voltage 5mV/ °C Output














BLOCK DIAGRAM



Tape/Reel Code

TK11033M

HS

VCC

VCONT

GND

VOUT

01S

Note: Connect Pin 2 to GND

DESCRIPTION






TK11033


V TUO egatloVtuptuO

TA C°52= 0674.1 0194.1 0605.1 V

TA C°58= 5577.1 5597.1 5518.1 V

TA C°03-= 5712.1 V


geReniL noitalugeReniL V CC V01ot3= 01- 5.2 01 Vm















TK11033

VCC

+

VCONT

VCONT

GND HS

VOUT

COUTIOUT VOUT

0.1 µF

10 µF

ICC

ICONT

VCC

VO

UT

(V

)

2

4


TA (°C)

0

-40 0 40 80 120

3

1

TE

RR

( C

)

0

2


TA (°C)

-2

-40 0 40 80 120

1

-1

I CC

(µA

)

80

100


TA (°C)

60

-40 0 40 80 120

90

70

I CC

(µA

)

80

100


VCC (V)

60

2 4 6 8 10

90

70

VE

RR

(m

V)

0

20

LINE REGULATION

VCC (V)

-20

2 4 6 8 10

10

-10

VE

RR

(m

V)

0

20

LOAD REGULATION

IOUT (µA)

-20

0 100 200 300 400

10

-10


TEST CIRCUIT


TK11033

VO

UT

(V

)

2

4


VCONT (V)

0

0 0.6 1.2 1.8 2.4

3

1

I CC

(µA

)50

100


VCONT (V)

0

0 0.6 1.2 1.8 2.4

75

25

I CO

NT

(µA

)

4

6


TA (°C)

2

-40 0 40 80 120

5

3

I CO

NT

(µA

)

4

8


VCONT (V)

0

0 0.6 1.2 1.8 2.4

6

2

VO

UT

(V

)

2

4


TIME (ms)

0

0 1 2 3 4

3

1

COUT = 0.1 µF

VO

UT

(V

)

2

4


TIME (ms)

0

0 1 2 3 4

3

1

COUT = 0 µF

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0.1 µF

Vrr = 100 mVrms

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0 µF

Vrr = 100 mVrms

VO

UT

(V

)

2

4


TIME (s)

0

0 20 40 60 80

3

1

25 TO 85 °C



TK11033

VO

UT

(V

)

2

4


TIME (s)

0

0 20 40 60 80

3

1

25 TO -30 °C



TK11033

0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.4

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0.

15-

0.05


+0.15 -0.05

Marking Information

MarkingTK11033 33C

SOT-25 (SOT-23-5)

PACKAGE OUTLINE




IC-233-TK110330798O0.0K








TK11034

TK11034
















BLOCK DIAGRAM



Tape/Reel Code

TK11034M

GND

VCC

NC

VOUT

VCONT

GND01S

GND

VCONT

GND

ON/OFFCIRCUIT


CIRCUIT

VCC

VOUT

VCC

+

-

Note: Both GND pins must connect to GND

DESCRIPTION






TK11034


V TUO egatloVtuptuO

TA C°52= 569 599 5201 Vm

TA C°58= 3751 3161 3561 Vm

TA C°03-= 5.824 Vm




I CC tnerruCylppuS V TNOC V4.2= 061 022 Aµ




V )NO(TNOC )NO(egatloVlortnoC V TUO NOtuptuO,Vm5201ot569= 8.1 4.2 V CC V



Supply Voltage ......................................................... 12 VOperating Voltage ............................................ 2.4 to 8 VPower Dissipation (Note 1) ................................ 200 mWJunction Temperature ........................................... 150 °C






TK11034

VCC

+

VCONT

VCONT

GND GND

VOUT

COUTIOUT VOUT

0.1 µF

10 µF

ICC

ICONT

VCC

VO

UT

(V

)

1.0

2.0


TA (°C)

0.0

-40 0 40 80 120

1.5

0.5

VE

RR

(m

V)

0

16


TA (°C)

-16

-40 0 40 80 120

8

-8

I CC

(µA

)

160

200


TA (°C)

120

-40 0 40 80 120

180

140

I CC

(µA

)

160

200


VCC (V)

120

2 4 6 8 10

180

140

VE

RR

(m

V)

0

20

LINE REGULATION

VCC (V)

-20

2 4 6 8 10

10

-10

VE

RR

(m

V)

0

20

LOAD REGULATION

IOUT (µA)

-20

0 100 200 300 400

10

-10


TEST CIRCUIT


TK11034

VO

UT

(V

)

0.8

1.6


VCONT (V)

0

0 0.6 1.2 1.8 2.4

1.2

0.4

I CC

(µA

)100

200


VCONT (V)

0

0 0.6 1.2 1.8 2.4

150

50

I CO

NT

(µA

)

4

6


TA (°C)

2

-40 0 40 80 120

5

3

I CO

NT

(µA

)

4

8


VCONT (V)

0

0 0.6 1.2 1.8 2.4

6

2

VO

UT

(V

)

0.8

1.6


TIME (ms)

0

0 1 2 3 4

1.2

0.4

COUT = 0.1 µF

VO

UT

(V

)

0.8

1.6


TIME (ms)

0

0 1 2 3 4

1.2

0.4

COUT = 0 µF

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0.1 µF

Vrr = 100 mVrms

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0 µF

Vrr = 100 mVrms

VO

UT

(V

)

1.4

1.8


TIME (s)

1.0

0 20 40 60 80

1.6

1.2

25 TO 85 °C



TK11034

VO

UT

(V

)

0.8

1.2


TIME (s)

0.4

0 20 40 60 80

1.0

0.6

25 TO 85 °C



TK11034

Marking Information

MarkingTK11034 34C

0.95 0.95

0.32

e eM0.1

(3.4)

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

0.4M0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.15- 0.05

+ 0.3



5 PL

3.5+0.3- 0.1

+0.

15-

0.05

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-xxx-TK110340798O0.0K








TK11041


DESCRIPTION

The TK11041 is a temperature sensor IC with a linearoutput of 10 mV/°C over the range of -30 to + 105 °C. Itswide operating voltage range of 4.5 to 10.0 V makes itsuitable for a number of applications requiring accuratetemperature control, such as electronic thermostats forclimate control, refrigerators, and industrial processcontrols.









BLOCK DIAGRAM



Tape/Reel Code

TK11041M-1

VCC

VOUT

TE

MP

ER

AT

UR

ES

EN

SO

R

X1









TK11041

01S

Note: Connect pin 2 to GND

HS

VCC

NC

GND

VOUT


TK11041

AMBIENT TEMPERATURE (°C)

-20 0 25 50 85 105

2.53

2.73

2.98

3.23

3.58

3.78

OU

TP

UT

(V

)



TK11041 ELECTRICAL CHARACTERISTICSTest Conditions: VCC = 5.0 V, IOUT = 0 µA, TA = 25 °C, unless otherwise specified.



FIGURE 1. OUTPUT CHARACTERISTICS


V TUO egatloVtuptuO

TA C°52= 259.2 289.2 210.3 V

TA C°58= 345.3 385.3 326.3 V

TA C°03-= 134.2 V



geRdaoL noitalugeRdaoL I TUO Aµ001ot0= 0 2 51 Vm

I CC tnerruCylppuS TA C°52= 011 081 Aµ



TK11041

TYPICAL PERFORMANCE CHARACTERISTICSVCC = 5 V, TA = 25 °C, unless otherwise specified.

TEST CIRCUIT

VCC 10 F

0.1 F

++

HS

VCC

NC

GND

VOUT

I CC

(µ

A) 150

250

SUPPLY CURRENT vs.SUPPLY VOLTAGE

VCC (V)

50

0 2 4 6 8 10

200

100

0

VO

UT

(V

)

2.98

3.02

OUTPUT VOLTAGE vs.SUPPLY VOLTAGE

VCC (V)

2.94

0 2 4 6 8 10

3.00

2.96

VO

UT

(V

)

2.98

3.02

OUTPUT VOLTAGE vs.OUTPUT CURRENT

IOUT (µA)

2.94

0 200 400 600 800 1000

3.00

2.96

I CC

(µ

A)

150

250

SUPPLY CURRENT vs.TEMPERATURE

TA (°C)

50

-40 0 40 80 120

200

100

0

VCC = 12 V

VCC = 5 V VO

UT

(V

)

3

5


TA (°C)

1

-40 0 40 80 120

4

2

0

VE

RR

(m

V)

+40


TA (°C)

-40

-40 0 40 80 120

+20

-20

0

VERR = VOUT - VREALVREAL = 2.98 + (TA - 25) X 10 mV

Note: Connect pin 2 to ground


TK11041

SOT-25 (SOT-23-5)

PACKAGE OUTLINE




IC-227-TK110410798O0.0K



0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.4

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0.

15-

0.05


+0.15 -0.05

Marking Information

MarkingTK11041 41C






TK11042

TK11042


DESCRIPTION


















BLOCK DIAGRAM

VCC

VOUT

TE

MP

ER

AT

UR

ES

EN

SO

R

X1



Tape/Reel Code

TK11042M-1

HS

VCC

NC

GND

VOUT

01S



TK11042


-20 0 25 50 85 105

1.52

1.64

1.79

1.94

2.15

2.27

OU

TP

UT

(V

)








V TUO egatloVtuptuO

TA C°52= 677.1 497.1 218.1 V

TA C°58= 131.2 551.2 971.2 V

TA C°03-= 364.1 V







TK11042


TEST CIRCUIT


VCC 10 F

0.1 F

++

HS

VCC

NC

GND

VOUT

I CC

(µ

A) 150

250


VCC (V)

50

0 2 4 6 8 10

200

100

0

VO

UT

(V

)

1.80

1.84


VCC (V)

1.76

0 2 4 6 8 10

1.82

1.78

VO

UT

(V

)

1.80

1.84


IOUT (µA)

1.76

0 200 400 600 800 1000

1.82

1.78

VE

RR

(m

V)

+40


TA (°C)

-40

-40 0 40 80 120

+20

-20

0


VO

UT

(V

)

3

5


TA (°C)

1

-40 0 40 80 120

4

2

0

I CC

(A

) 150

250


TA ( C)

50

-40 0 40 80 120

200

100

0

VCC = 12 V

VCC = 5 V


TK11042

0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.4

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0.

15-

0.05


+0.15 -0.05

Marking Information

MarkingTK11042 42C

SOT-25 (SOT-23-5)

PACKAGE OUTLINE




IC-228-TK110420798O0.0K








TK11043


DESCRIPTION


















TK11043

HS

VCC

NC

GND

VOUT

01S

BLOCK DIAGRAM




Tape/Reel Code

TK11043M-1

VCC

VOUT

TE

MP

ER

AT

UR

ES

EN

SO

R

X1


TK11043


-20 0 25 50 85 105

1.275

1.376

1.502

1.628

1.804

1.905

OU

TP

UT

(V

)








V TUO egatloVtuptuO

TA C°52= 784.1 205.1 715.1 V

TA C°58= 487.1 408.1 428.1 V

TA C°03-= 522.1 V







TK11043


TEST CIRCUIT

VCC 10 F

0.1 F

++

HS

VCC

NC

GND

VOUT

I CC

(µ

A) 150

250


VCC (V)

50

0 2 4 6 8 10

200

100

0

VO

UT

(V

)

1.50

1.54


VCC (V)

1.46

0 2 4 6 8 10

1.52

1.48

VO

UT

(V

)

1.50

1.54


IOUT (µA)

1.46

0 200 400 600 800 1000

1.52

1.48

VO

UT

(V

)

3

5


TA (°C)

1

-40 0 40 80 120

4

2

0

VE

RR

(m

V)

+40


TA (°C)

-40

-40 0 40 80 120

+20

-20

0



I CC

(µ

A)

150

250


TA (°C)

50

-40 0 40 80 120

200

100

0

VCC = 12 V

VCC = 5 V


TK11043

0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.4

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0.

15-

0.05


+0.15 -0.05

Marking Information

MarkingTK11043 43C

SOT-25 (SOT-23-5)

PACKAGE OUTLINE




IC-229-TK110430798O0.0K








TK11050

VCONT

VCC

COMP IN

COMP OUT

VREF

GND

FEATURES Internal Temperature Sensor, Voltage Reference

and Comparator

Temperature Threshold and Hysteresis Set by Only

Two External Resistors

Output Logic: Low to High with Increasing Temp.



Miniature Package (SOT-23L-6)



Very Wide Temperature Range

BLOCK DIAGRAM

TK11050

DESCRIPTION

The TK11050 is an accurate temperature controller IC foruse over the -30 to +105 °C temperature range. TheTK11050 monolithic bipolar integrated circuit contains atemperature sensor, stable voltage reference and acomparator, making the device very useful as an on/offtemperature controller. Two external resistors easily setthe sensing temperature threshold and hysteresis. Its wideoperating voltage range of 2.7 to 6.0 V makes this ICsuitable for a number of applications requiring accuratetemperature control. The device is in the “on” state whenthe control pin is pulled to a logic high level.

The TK11050 is available in a miniature SOT-23L-6 surfacemount package.

01S

VREF

GND

VCONT

COMP OUT

VCCON/OFFCIRCUIT

VOLTAGEREFERENCE

+

-

TEMPERATURESENSOR

COMP IN

VPTAT



Tape/Reel Code

TK11050MTL




Pentium Processor Temperature Monitor

Power Supply Overtemperature Protection

Copy Machine Overtemperature Protection

System Overtemperature Protection

TEMPERATURE CONTROLLER IC


TK11050

ABSOLUTE MAXIMUM RATINGSSupply Voltage ......................................................... 10 VPower Dissipation (Note 1) ................................ 200 mWStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................. -30 to +105 °C

Operating Voltage Range................................. 2.7 to 6 VJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C

TK11050 ELECTRICAL CHARACTERISTICSTest conditions: TA = 25 °C, VCC = 3.0 V, VCONT = 2.4 V, IOUT = 40 µA, R3 = 100 kΩ, unless otherwise specified.

Note 1: Power dissipation is 200 mW when in Free Air. Derate at 1.6 mW/°C for operation above 25 °C.Note 2: The resistance values of R1 and R2 can be calculated as follows: R1 = Vref x TSH / (TSET x ISH - (TSET -TSH) x IIB), R2 = TSET x TC x R1 / (Vref -

R1 x IIB - TSET x TC). IIB is 0.1 µA and ISH is 1.25 µA.Note 3: When VPTAT < COMP IN, COMP OUT < 0.3 V (Low Level). When VPTAT > COMP IN, COMP OUT > 2.8 V (High Level).Note 4: VPTAT does not have an output pin.


I CC tnerruCtnecseiuQWOLtuptuOrotarapmoC 052 053 Aµ

HGIHtuptuOrotarapmoC 012 053 Aµ

I YBTS tnerruCybdnatS V TNOC ≤ V6.0 1 Aµ

V TATP

egatloVrosneSerutarepmeT)4etoN(

TA C°52= 291.1 V

TA C°58= 234.1 V

TA C°03-= 279.0 V

TC tneiciffeoCerutarepmeT TA C°58ot0= 0.4 C°/Vm

T RRE rorrEerutarepmeT TA )2etoN(,C°58ot0= 0.4- 0 0.4 C°

C HL HGIHtuptuOrotarapmoC )3etoN( 8.2 V

C LL WOLtuptuOrotarapmoC R3 ≥ k01 Ω )3etoN(, 3.0 V

I BI tnerruCsaiBtupnI V>NIrotarapmoC TATP 1.0 3.0 Aµ

I HS tnerruCteSsiseretsyH V<NIrotarapmoC TATP 9.0 52.1 6.1 Aµ

I TUO tnerruCkniStuptuO C LL ≤ V3.0 03 003 Aµ

V fer SCITSIRETCARAHCLANIMRET

V fer egatloVecnerefeR TA C°52= 6.1 V

I fer tnerruCtuptuOecnerefeR R1 R+ 2 k04= Ω 04 005 Aµ

geReniL noitalugeReniL V CC V6ot3= 2 8 Vm



I TNOC tnerruClortnoC 1 5.3 6 Aµ

V )NO(TNOC )NO(egatloVlortnoC NOtuptuO 8.1 V CC V

V )FFO(TNOC )FFO(egatloVlortnoC FFOtuptuO DNG 6.0 V


TK11050

ON/OFFCIRCUIT

VOLTAGEREFERENCE

+

-

TEMPERATURESENSOR

VPTAT

ICONT

VCONT

R1

R2

IIB

ISH

R1 + R2 = 40 kΩ

VCC

ICC

R3100 k

10 µF

ISINK

COMP OUT

COMP IN

Vref

GND

TYPICAL PERFORMANCE CHARACTERISTICSTA = 25 °C, VCC = 3 V, VCONT = 2.4 V, IOUT = 40 µA, unless otherwise specified.

TEST CIRCUIT

Vre

f (V

)

1.60

1.62

LINE REGULATION

VCC (V)

1.58

2 4 6 8 10

1.61

1.59

VP

TA

T (

V)

1.2

1.6

REFERENCE VOLTAGE vs.TEMPERATURE

TA (°C)

0.8

-40 0 40 80 120

1.4

1.0

I CO

NT

µA

)

2

4


VCONT (V)

0

0 0.6 1.2 1.8 2.4

3

1

I CO

NT

µA

)

2

4


TA (°C)

0

-40 0 40 80 120

3

1

Vre

f (V

)

1.60

1.62

LOAD REGULATION

Iref (mA)

1.58

0 0.2 0.4 0.6 0.8

1.61

1.59

Vre

f (V

)

1.60

1.62


TA (°C)

1.58

-40 0 40 80 120

1.61

1.59


TK11050

Vre

f (V

)

1.0

2.0


TIME (ms)

0

0 2 4 6 8

1.5

0.5

VCONT = 0 TO 2.4 V

COUT = 0.1 µ F Vre

f (V

)1.0

2.0


TIME (ms)

0

0 2 4 6 8

1.5

0.5

VCONT = 0 TO 2.4 V

COUT = 0 µF RR

(dB

)

40

80

RIPPLE REJECTION RATIO A (V ref )

f (Hz)

0

10 100 1 k 10 k 100 k

60

20

VRR = 100 mVrms

COUT = 0.1 µ F

RR

(dB

)

40

80

RIPPLE REJECTION RATIO B (V ref )

f (Hz)

0

10 100 1 k 10 k 100 k

60

20

VRR = 100 mVrms

COUT = 0 µF I B (

nA)

80

120

INPUT BIAS CURRENT vs.TEMPERATURE

TA (°C)

40

-40 0 40 80 120

100

60

COMP IN > VPTAT

I SH

(µA

)

1.2

1.4

HYSTERESIS SET CURRENT vs.TEMPERATURE

TA (°C)

1.0

-40 0 40 80 120

1.3

1.1

COMP IN < VPTAT

I CC

(µA

)

220

260


TA (°C)

180

-40 0 40 80 120

240

200

COMP OUT = LOW LEVEL

R1 + R2 = 40 kΩR3 = 100 kΩ

COMP OUT = HIGH LEVEL

I CC

(µA

)

250

350


VCC (V)

150

2 3 4 5 6

300

200COMP OUT = HIGH LEVEL

R1 + R2 = 40 kΩR3 = 100 kΩ


Vre

f (V

)

0.8

1.6

REFERENCE VOLTAGE vs.CONTROL VOLTAGE

VCONT (V)

0

0 0.6 1.2 1.8 2.4

1.2

0.4

TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)TA = 25 °C, VCC = 3 V, VCONT = 2.4 V, IOUT = 40 µA, unless otherwise specified.


TK11050


I CC

(µA

)

160

320

SUPPLY CURRENT vs.CONTROL VOLTAGE

VCONT (V)

0

0 0.6 1.2 1.8 2.4

240

80

CLL

(m

V)

80

160

COMPARATOR OUTPUT (LOW LEVEL)vs. OUTPUT SINK CURRENT

IOUT (mA)

0

0 0.2 0.4 0.6 0.8

120

40 CO

MP

OU

T (

V)

2

4

COMPARATOR OUTPUT vs.TEMPERATURE

TA (°C)

0

65 70 75 80 85

3

1

TSET = 80 °CTSH = 5 °C

CO

MP

OU

T (

V)

2

4


TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO 85 CTSET = 80 C

CO

MP

OU

T (

V)

2

4

TEMPERATURE RESPONSE C

TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO -30 CTSET = -20 C

CO

MP

OU

T (

V)

2

4

TEMPERATURE RESPONSE D

TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO -30 CTSET = -25 C

CO

MP

OU

T (

V)

2

4

CONTROL VOLTAGE RESPONSE

TIME (ms)

0

0 2 4 6 8

3

1

VCONT = 0 TO 2.4 V

CO

MP

OU

T (

V)

2

4

COMPARATOR INPUT RESPONSE

TIME (ms)

0

0 0.2 0.4 0.6 0.8

3

1

COMP IN = 1.6 TO 0.8 V

CO

MP

OU

T (

V)

2

4


TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO 85 CTSET = 75 C


TK11050

The hysteresis voltage (VSH) of the comparator can becalculated as follows:

(5)

where ISH = 1.25 µA

The hysteresis represented as temperature is:

(6)

Solving for temperature coefficient (TC):

(7)

Solving for R1 from Equations 3 and 7:

(8)

R2 can now be calculated by substituting R1 into Equation 4:

Example:

R1 and R2 when set temperature is 80 °C (TSET = 353 °K)and temperature hysteresis (TSH) is 5 °C.

APPLICATION HINTS

DRRDRDROP

EXTERNAL RESISTORS R 1 AND R2

The temperature set point (TSET) and hysteresis (TSH) ofthe TK11050 are easily set by two external resistors R1 andR2. See Figure 1 for clarification of TSET and TSH.

The set voltage (VSET) of the comparator at the settemperature (TSET) is calculated as follows:

(1)

where TSET is an absolute temperature (°K).That is, TSET (°K) = °C + 273 and TC = 4 mV/°C.

1. For Set Temperatures ≥ 25 °C

(2)

where Vref = 1.6 VIIB = 0.1 µA

The temperature coefficient (TC) is calculated by Equations1 and 2, resulting in:

(3)

From Equation 3, R2 is calculated as follows:

(4)

(Vref - R1 x IIB)VSET = = xR1 + R2

R2 x Vref

R1 + R2

R1 x R2 x IIBR1 + R2

R2

TSET

TC = xR1 + R2

R2 Vref - R1 x IIB

R1 x R2VSH =R1 + R2

X( ) (ISH - IIB)

R1 + R2

R1 x R2TSH =(ISH - IIB)

TCx( )

R1 + R2

R1 x R2TC =(ISH - IIB)

TSHx( )

R1 =TSET x ISH - ( TSET - TSH) x IIB

Vref x TSH

R2 = Vref - R1 x IIB - TSET x TC

TSET x TC x R1

VSET = TSET x TC

TSETTSH

FIGURE 1

R1 = 19.68 k = 20 kΩ

R1 = 353 x1.25 µ - ( 353 - 5) x 0.1 µ1.6 x 5

R2 =1.6 -19.68 k x 0.1 µ - 353 x 4 m

353 x 4 m x 19.68 k

R2 = 149.39 k = 150 kΩ


TK11050

2. For Set Temperatures < 25 °C

(9)

(10)

Example:

R1 and R2 when set temperature is -25 °C (TSET = 248 °K)and temperature hysteresis (TSH) is 5 °C.


The power dissipation rating of 200 mW represents theamount of power the device can dissipate without damageto the IC. Power dissipation should be kept to a minimumto reduce temperature errors due to self-heating.

APPLICATION HINTS (CONT.)

R1 =(TSET x TSH) x ISH - TSET x IIB

Vref x TSH

R2 =1.6 - 27.45 k x 1.25 µ - 248 x 4 m

248 x 4 m x 27.45 k

R2 = 47.47 k = 47 kΩ

R2 =Vref - R1 x ISH - TSET x TC

TSET x TC x R1

R1 = 27.45 k = 27 kΩ

R1 =(248 x 5) x 1.25 µ - 248 x 0.1 µ

1.6 x 5


TK11050

0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1

Marking Information

MarkingTK11050 50C

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-xxx-TK110500798O0.0K







August 1998 TOKO, Inc. Page 1

TK11051

VCONT

VCC

COMP IN

COMP OUT

VREF

GND

FEATURES Internal Temperature Sensor, Voltage Reference

and Comparator

Temperature Threshold and Hysteresis Set by Only

Two External Resistors

Output Logic: High to Low with Increasing Temp.



Miniature Package (SOT-23L-6)



Very Wide Temperature Range

BLOCK DIAGRAM

TK11051DESCRIPTION

The TK11051 is an accurate temperature controller IC foruse over the -30 to +105 °C temperature range. TheTK11051 monolithic bipolar integrated circuit contains atemperature sensor, stable voltage reference and acomparator, making the device very useful as an on/offtemperature controller. Two external resistors easily setthe sensing temperature threshold and hysteresis. Its wideoperating voltage range of 2.7 to 6.0 V makes this ICsuitable for a number of applications requiring accuratetemperature control. The device is in the “on” state whenthe control pin is pulled to a logic high level.

The TK11051 is available in a miniature SOT-23L-6 surfacemount package.

01S

VREF

GND

VCONT

COMP OUT

VCCON/OFFCIRCUIT

VOLTAGEREFERENCE

+

-

TEMPERATURESENSOR

COMP IN

VPTAT



Tape/Reel Code

TK11051MTL




Pentium Processor Temperature Monitor

Power Supply Overtemperature Protection

Copy Machine Overtemperature Protection

System Overtemperature Protection

TEMPERATURE CONTROLLER IC

August 1998 TOKO, Inc.

TK11051

ABSOLUTE MAXIMUM RATINGSSupply Voltage ......................................................... 12 VPower Dissipation (Note 1) ................................ 200 mWStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................. -30 to +105 °C

Operating Voltage Range................................. 2.7 to 6 VJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C

TK11050 ELECTRICAL CHARACTERISTICSTest conditions: TA = 25 °C, VCC = 3.0 V, VCONT = 2.4 V, IOUT = 40 µA, R3 = 100 kΩ, unless otherwise specified.

Note 1: Power dissipation is 200 mW when in Free Air. Derate at 1.6 mW/°C for operation above 25 °C.Note 2: The resistance values of R1 and R2 can be calculated as follows: R1 = Vref x TSH / (TSET x ISH - (TSET -TSH) x IIB), R2 = TSET x TC x R1 / (Vref -

R1 x IIB - TSET x TC). IIB is 0.1 µA and ISH is 1.25 µA.Note 3: When VPTAT < COMP IN, COMP OUT > 2.8 V (High Level). When VPTAT > COMP IN, COMP OUT < 0.3 V (Low Level).Note 4: VPTAT does not have an output pin.


I CC tnerruCtnecseiuQWOLtuptuOrotarapmoC 052 053 Aµ

HGIHtuptuOrotarapmoC 012 053 Aµ

I YBTS tnerruCybdnatS V TNOC ≤ V6.0 1 Aµ

V TATP

egatloVrosneSerutarepmeT)4etoN(

TA C°52= 291.1 V

TA C°58= 234.1 V

TA C°03-= 279.0 V

TC tneiciffeoCerutarepmeT TA C°58ot0= 0.4 C°/Vm

T RRE rorrEerutarepmeT TA )2etoN(,C°58ot0= 0.4- 0 0.4 C°

C HL HGIHtuptuOrotarapmoC )3etoN( 8.2 V

C LL WOLtuptuOrotarapmoC R3 ≥ k01 Ω )3etoN(, 3.0 V

I BI tnerruCsaiBtupnI V>NIrotarapmoC TATP 1.0 3.0 Aµ

I HS tnerruCteSsiseretsyH V<NIrotarapmoC TATP 9.0 52.1 6.1 Aµ

I TUO tnerruCkniStuptuO C LL ≤ V3.0 03 003 Aµ

V fer SCITSIRETCARAHCLANIMRET

V fer egatloVecnerefeR TA C°52= 6.1 V

I fer tnerruCtuptuOecnerefeR R1 R+ 2 k04= Ω 04 005 Aµ

geReniL noitalugeReniL V CC V6ot3= 2 8 Vm



I TNOC tnerruClortnoC 1 5.3 6 Aµ

V )NO(TNOC )NO(egatloVlortnoC NOtuptuO 8.1 V CC V

V )FFO(TNOC )FFO(egatloVlortnoC FFOtuptuO DNG 6.0 V


TK11051

ON/OFFCIRCUIT

VOLTAGEREFERENCE

+

-

TEMPERATURESENSOR

VPTAT

ICONT

VCONT

R1

R2

IIB

ISH

R1 + R2 = 40 kΩ

VCC

ICC

R3100 k

10 µF

ISINK

COMP OUT

COMP IN

Vref

GND

TYPICAL PERFORMANCE CHARACTERISTICSTA = 25 °C, VCC = 3 V, VCONT = 2.4 V, IOUT = 40 µA, unless otherwise specified.

TEST CIRCUIT

Vre

f (V

)

1.60

1.62

LINE REGULATION

VCC (V)

1.58

2 4 6 8 10

1.61

1.59

VP

TA

T (

V)

1.2

1.6


TA (°C)

0.8

-40 0 40 80 120

1.4

1.0

I CO

NT

µA

)

2

4


VCONT (V)

0

0 0.6 1.2 1.8 2.4

3

1

I CO

NT

µA

)

2

4


TA (°C)

0

-40 0 40 80 120

3

1

Vre

f (V

)

1.60

1.62

LOAD REGULATION

Iref (mA)

1.58

0 0.2 0.4 0.6 0.8

1.61

1.59

Vre

f (V

)

1.60

1.62


TA (°C)

1.58

-40 0 40 80 120

1.61

1.59


TK11051

Vre

f (V

)

1.0

2.0


TIME (ms)

0

0 2 4 6 8

1.5

0.5

VCONT = 0 TO 2.4 V

COUT = 0.1 µ F Vre

f (V

)1.0

2.0


TIME (ms)

0

0 2 4 6 8

1.5

0.5

VCONT = 0 TO 2.4 V

COUT = 0 µF RR

(dB

)

40

80

RIPPLE REJECTION RATIO A (V ref )

f (Hz)

0

10 100 1 k 10 k 100 k

60

20

VRR = 100 mVrms

COUT = 0.1 µ F

RR

(dB

)

40

80

RIPPLE REJECTION RATIO B (V ref )

f (Hz)

0

10 100 1 k 10 k 100 k

60

20

VRR = 100 mVrms

COUT = 0 µF I B (

nA)

80

120

INPUT BIAS CURRENT vs.TEMPERATURE

TA (°C)

40

-40 0 40 80 120

100

60

COMP IN > VPTAT

I SH

(µA

)

1.2

1.4

HYSTERESIS SET CURRENT vs.TEMPERATURE

TA (°C)

1.0

-40 0 40 80 120

1.3

1.1

COMP IN < VPTAT

I CC

(µA

)

220

260


TA (°C)

180

-40 0 40 80 120

240

200


R1 + R2 = 40 kΩR3 = 100 kΩ

COMP OUT = HIGH LEVEL

I CC

(µA

)

250

350


VCC (V)

150

2 3 4 5 6

300

200COMP OUT = HIGH LEVEL

R1 + R2 = 40 kΩR3 = 100 kΩ


Vre

f (V

)

0.8

1.6

REFERENCE VOLTAGE vs.CONTROL VOLTAGE

VCONT (V)

0

0 0.6 1.2 1.8 2.4

1.2

0.4



TK11051

I CC

(µA

)

160

320

SUPPLY CURRENT vs.CONTROL VOLTAGE

VCONT (V)

0

0 0.6 1.2 1.8 2.4

240

80

CLL

(m

V)

80

160

COMPARATOR OUTPUT (LOW LEVEL)vs. OUTPUT SINK CURRENT

IOUT (mA)

0

0 0.2 0.4 0.6 0.8

120

40 CO

MP

OU

T (

V)

2

4

COMPARATOR OUTPUT vs.TEMPERATURE

TA (°C)

0

65 70 75 80 85

3

1

TSET = 80 °CTSH = 5 °C

CO

MP

OU

T (

V)

2

4

CONTROL VOLTAGE RESPONSE

TIME (ms)

0

0 2 4 6 8

3

1

VCONT = 0 TO 2.4 V

CO

MP

OU

T (

V)

2

4

COMPARATOR INPUT RESPONSE

TIME (ms)

0

0 0.2 0.4 0.6 0.8

3

1

COMP IN = 1.6 TO 0.8 V

CO

MP

OU

T (

V)

2

4


TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO 85 CTSET = 75 C

CO

MP

OU

T (

V)

2

4


TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO 85 CTSET = 80 C

CO

MP

OU

T (

V)

2

4

TEMPERATURE RESPONSE C

TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO -30 CTSET = -20 C

CO

MP

OU

T (

V)

2

4

TEMPERATURE RESPONSE D

TIME (s)

0

0 5 10 15 20

3

1

TA = 25 TO -30 CTSET = -25 C



TK11051

The hysteresis voltage (VSH) of the comparator can becalculated as follows:

(5)

where ISH = 1.25 µA

The hysteresis represented as temperature is:

(6)

Solving for temperature coefficient (TC):

(7)

Solving for R1 from Equations 3 and 7:

(8)

R2 can now be calculated by substituting R1 into Equation 4:

Example:

R1 and R2 when set temperature is 80 °C (TSET = 353 °K)and temperature hysteresis (TSH) is 5 °C.

APPLICATION HINTS

DRRDRDROP

EXTERNAL RESISTORS R1 AND R2

The temperature set point (TSET) and hysteresis (TSH) ofthe TK11050 are easily set by two external resistors R1 andR2. See Figure 1 for clarification of TSET and TSH.

The set voltage (VSET) of the comparator at the settemperature (TSET) is calculated as follows:

(1)

where TSET is an absolute temperature (°K).That is, TSET (°K) = °C + 273 and TC = 4 mV/°C.

1. For Set Temperatures ≥ 25 °C

(2)

where Vref = 1.6 VIIB = 0.1 µA

The temperature coefficient (TC) is calculated by Equations1 and 2, resulting in:

(3)

From Equation 3, R2 is calculated as follows:

(4)

(Vref - R1 x IIB)VSET = = xR1 + R2

R2 x Vref

R1 + R2

R1 x R2 x IIBR1 + R2

R2

TSET

TC = xR1 + R2

R2 Vref - R1 x IIB

R1 x R2VSH =R1 + R2

X( ) (ISH - IIB)

R1 + R2

R1 x R2TSH =(ISH - IIB)

TCx( )

R1 + R2

R1 x R2TC =(ISH - IIB)

TSHx( )

R1 =TSET x ISH - ( TSET - TSH) x IIB

Vref x TSH

R2 =Vref - R1 x IIB - TSET x TC

TSET x TC x R1

VSET = TSET x TC

TSETTSH

FIGURE 1

R1 = 19.68 k = 20 kΩ

R1 =353 x1.25 µ - ( 353 - 5) x 0.1 µ

1.6 x 5

R2 =1.6 -19.68 k x 0.1 µ - 353 x 4 m

353 x 4 m x 19.68 k

R2 = 149.39 k = 150 kΩ


TK11051

2. For Set Temperatures < 25 °C

(9)

(10)

Example:

R1 and R2 when set temperature is -25 °C (TSET = 248 °K)and temperature hysteresis (TSH) is 5 °C.


The power dissipation rating of 200 mW represents theamount of power the device can dissipate without damageto the IC. Power dissipation should be kept to a minimumto reduce temperature errors due to self-heating.

APPLICATION HINTS (CONT.)

R1 =(TSET x TSH) x ISH - TSET x IIB

Vref x TSH

R2 =1.6 - 27.45 k x 1.25 µ - 248 x 4 m

248 x 4 m x 27.45 k

R2 = 47.47 k = 47 kΩ

R2 =Vref - R1 x ISH - TSET x TC

TSET x TC x R1

R1 = 27.45 k = 27 kΩ

R1 =(248 x 5) x 1.25 µ - 248 x 0.1 µ

1.6 x 5


TK11051

0.95 0.95

0.32

e eM0.1

3.5

1.2

0.15

0.3

3.3

2.2

0.4

0.95 0.95

3.0

ee

e1

0.6

1.0


1 2 3

456

0 -

0.1

15

max

1.4

max

Marking

+0.15- 0.05

+0.3- 0.1

+ 0.3

(3.4)

+0.

15-

0.05


0.1

Marking Information

MarkingTK11051 51C

SOT-23L (SOT-23L-6)

PACKAGE OUTLINE




IC-xxx-TK110510798O0.0K








TK11070

TK11070

NEGATIVE SLOPE TEMPERATURE SENSOR IC

FEATURES Linear Output Voltage -8 mV/ °C Output














Liquid Crystal Panel Contrast Adjustment

BLOCK DIAGRAM



Tape/Reel Code

TK11070M

HS

VCC VOUT

CONTROL GND

01S

GND

CONTROL

HS

ON/OFFCIRCUIT


CIRCUIT

VCC

VOUT

VCC

+

-

DESCRIPTION

The TK11070 is a temperature sensor IC with a linearnegative slope output of -8 mV/°C over the range of -30to + 105 °C. Its wide operating voltage range of 2.7 to10.0 V makes it suitable for a number of applicationsrequiring accurate temperature control, such as electronicthermostats for climate control, refrigerators, and industrialprocess controls. The device is in the “on” state when thecontrol pin is pulled to a logic high level. In the ”off” state,the standby current is 1 µA maximum.



The TK11070 is available in a miniature SOT-23-5 surfacemount package.

Note: Pin 2 must connect to GND


TK11070

Supply Voltage ......................................................... 12 VOperating Voltage ....................................... 2.7 to 10.0 VPower Dissipation (Note 1) ................................ 150 mWJunction Temperature ........................................... 150 °C






V TUO egatloVtuptuO

TA C°03-= 044.2 V

TA C°52-= 089.1 000.2 020.2 V

TA C°58= 294.1 025.1 845.1 V

TC tneiciffeoCerutarepmeT TA C°58ot52= 5.8- 0.8- 5.7- C°/Vm


geRdaoL noitalugeRdaoL I TUO Aµ01±otAµ0= 8- 0 8 Vm

I CC tnerruCylppuS V TNOC V4.2= 57 001 Aµ

I TUO tnerruCtuptuO ∆V TUO ≤ Vm02 001- 01 Aµ

I YBTS tnerruCylppuSybdnatS V TNOC ≤ V6.0 1 Aµ


I TNOC tnerruClortnoC 0.2 5.3 0.6 Aµ


V )FFO(TNOC )FFO(egatloVlortnoC V TUO FFOtuptuO,V1.0< DNG 6.0 V


TK11070

VCC

+

VCONT

CONTROL

GND HS

VOUT

COUTIOUT VOUT

0.1 µF

10 µF

ICC

ICONT

VCC


TEST CIRCUIT

VO

UT

(V

)

2.0

3.0


TA (°C)

1.0

-40 0 40 80 120

2.5

1.5

TE

RR

( C

)

0

2


TA (°C)

-2

-40 0 40 80 120

1

-1

I CC

(µA

)

60

100


TA (°C)

20

-40 0 40 80 120

80

40

I CC

(µA

)

60

100


VCC (V)

20

2 4 6 8 10

80

40

VE

RR

(m

V)

0

20

LINE REGULATION

VCC (V)

-20

2 4 6 8 10

10

-10

VE

RR

(m

V)

0

40

LOAD REGULATION

IOUT (µA)

-40

-40 -20 0 20 40

20

-20

Note: Output Voltage: VOUT(TYP) = 2.2 V + (-8 mV/°C) x TA where TA is in °C

Linearity Error: VERR = VOUT - VOUT(TYP) TERR = VERR / (-8 mV/°C)


TK11070

VO

UT

(V

)

1.0

2.0


VCONT (V)

0

0 0.6 1.2 1.8 2.4

1.5

0.5

I CC

(µA

)40

80


VCONT (V)

0

0 0.6 1.2 1.8 2.4

60

20

I CO

NT

(µA

)

2

4


TA (°C)

0

-40 0 40 80 120

3

1

I CO

NT

(µA

)

2

4


VCONT (V)

0

0 0.6 1.2 1.8 2.4

3

1

VO

UT

(V

)

1.0

2.0


TIME (ms)

0

0 2 4 6 8

1.5

0.5

COUT = 0.1 µFV

OU

T (

V)

1.0

2.0


TIME (ms)

0

0 10 20 30 40

1.5

0.5

COUT = 0 µF

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0.1 µF

Vrr = 100 mVrms

RR

(dB

)

40

80


f (Hz)

0

10 100 1 k 10 k 100 k

60

20

COUT = 0 µF

Vrr = 100 mVrms

VO

UT

(V

)

1.8

2.2


TIME (s)

1.4

0 20 40 60 80

2.0

1.6

25 TO 85 °C



TK11070

VO

UT

(V

)

2.2

2.6


TIME (s)

1.8

0 20 40 60 80

2.4

2.0

25 TO -30 °C



TK11070

Marking Information

MarkingTK11070 70C

SOT-26 (SOT-23-6)

PACKAGE OUTLINE




IC-xxx-TK110700798O0.0K







0.95 0.95

0.950.95e

M0.1

2.9

1.6

1.1

0.15

0.4

2.8

1.90

2.4

e'


1 2 3

45

1.0

0.7

(0.8

)

0 -

0.1

(0.6

)(0

.6)

1.3

max

e

e e

0.1

e1

0 -

15

max

Marking

± 0.3

+0

.1

+0.15- 0.05


+0

.15

- 0

.05

Solid State Switches

Part Number Features

TK70001 Single Input, Two Output Solid State Switch

TK70002 Single Input, Two Output Solid State Switch

TK70003 Two Output, Single Input Solid State Switch


TK70001

INPUT

OUTPUT 1

CONT 2

CONT 1

OUTPUT 2

GND

FEATURES Internal PNP Power Transistor

Reverse Bias Voltage Protection

Very Low Input-Output Voltage Difference

Very Low Standby Current

Overtemperature Protection

Single Input with Two Controlled Outputs

Low Noise



Automatic Test Equipment (ATE)

Power Management

Process Control Equipment

Power Distribution Control

Communication Equipment

BLOCK DIAGRAM

TK70001

01S

DESCRIPTION

The TK70001 is a monolithic bipolar integrated circuit withhigh side current switches of low saturation type. Thecurrent, including the control current, is zero (pA level)when the control pin is “off”. The impedance on the outputside is high and the reverse current does not flow when thecontrol pin is “off”. These are effective to decrease thedissipation currents, making the TK70001 a very efficientdevice for power management and power distributioncontrol.

The TK70001 is available in a miniature SOT-26 surfacemount package. When mounted as recommended, thispackage is capable of dissipating up to 350 mW.

CONT 2

GND

OUTPUT 2

CONT 1

INPUT

OUTPUT 1

THERMALPROTECTION

SWCIRCUIT

SINGLE INPUT, TWO OUTPUT SOLID STATE SWITCH


TAPE/REEL CODEB: Tape Left

Tape/Reel Code

TK70001MCB


TK70001

ABSOLUTE MAXIMUM RATINGSOperating Temperature Range ................... -30 to +80 °COperating Voltage Range............................... 1.6 to 12 VJunction Temperature .......................................... 150 °CLead Soldering Temperature (10 s) ..................... 235 °C

TK70001 ELECTRICAL CHARACTERISTICSTest conditions: TA = 25 °C, VIN = 2.5 V, unless otherwise specified.

Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25°C. Power dissipation is150 mW in Free Air. Derate at 1.2 mW/°C for operation above 25 °C.

Note 2: By grounding this terminal, the operation completely stops and the input current decreases to a pA level.Note 3: Ground current is defined as IIN - IOUT, excluding control terminal current. Refer to “Definition of Terms.”Gen. Note: Parameters with min. or max. values are 100% tested.Gen. Note: Exceeding “Absolute Maximum Ratings” can damage the device.

Supply Voltage ......................................................... 14 VOutput Current .................................................... 130 mAPower Dissipation (Note 1) ................................ 350 mWStorage Temperature Range ................... -55 to +150 °C


IQ tnerruCtnecseiuQ I TUO I,Am0= TNOC Aµ05= 6.0 2.1 Am

I YBTS tnerruCybdnatSV NI ,FFOtuptuO,V8=V TNOC V0=

1.0 001 An

I TUO tnerruCtuptuOV PORD I,V5.0= TNOC Aµ05= 06 001 Am

V PORD I,V5.0= TNOC Aµ001= 08 031 Am

I DNG )3etoN(tnerruCdnuorG I TUO I,Am05= TNOC Aµ05= 5.3 5.5 Am

V PORD egatloVtuoporD I TUO I,Am05= TNOC Aµ05= 71.0 53.0 V

∆VD slennahCneewteBecnalaBV PORD ,ecnereffidI TUO I,Am05= TNOC Aµ05=

05 Vm

I VER tnerruCsaiBesreveRV NI V,V0= VER ,V8=V TNOC FFOtuptuO,V0=

20.0 05 An


I TNOC tnerruClanimreTlortnoC V TNOC I,V6.1= TUO Am05= 05 59 041 Aµ


V )FFO(TNOC )FFO(egatloVlortnoC )2etoN(FFOtuptuO 2.0 V


TK70001

IOUT 1

OUTPUT 1

ICONT 2

CONT 1CONT 2

IOUT 2

ICONT 1

VCONT 2 VCONT 1

OUTPUT 2

CIN1 µF

VIN IIN

RCONT 2

INPUT

VOUT 2VOUT 1

CL 1 = 0.1 µFCL 2 = 0.1 µF

RCONT 1


TEST CIRCUIT


IOUT (mA)

400

300

100

0 50 100 150

VD

RO

P (

mV

)

200

0

VIN = 5.0 V

VIN = 2.5 V

VIN = 1 V


VIN (V)

00 5 10 15

I Q (

A)

250

500ICONT = 50 A

ICONT = 30 A

ICONT = 10 A

ICONT = 20 A

ICONT = 40 A

REVERSE CURRENT VS.REVERSE VOLTAGE

00 5 10 15

I RE

V (

nA)

1

2

VREV (V)

DROPOUT VOLTAGE VS. CONTROL CURRENT

ICONT ( A)

0

100

200

300

400

0 50 100

VD

RO

P (

mV

)

125 mA

100 mA

75 mA

50 mA

IOUT = 25 mA

CONTROL CURRENT VS.CONTROL VOLTAGE

VCONT (V)

20

40

60

80

100

0 1 2 3 4 5

I CO

NT

(A

)

0

100K

75K

50K

30K

20K10K

RCONT = 0

MAX OUTPUT CURRENT VS.CONTROL CURRENT

ICONT ( A)

20

60

100

10 20 30 40 50

I OU

T (

mA

)

140

VIN = 1.5 VVIN = 3.0 V

VIN = 6.0 VVIN = 4.5 V


TK70001



IOUT (mA)

5

10

00 50 100

I GN

D (

mA

)


VIN (V)

0 5 10 15

I Q (

mA

)

5.0

2.5

0

ICONT = 150 µA

ICONT = 100 µA

ICONT = 50 µA


IOUT (mA)

0

0 100 200

-100

-200

-300

-400

VD

RO

P (

mV

)

AT 2 CIRCUIT PARALLEL

ON/OFF RESPONSE

TIME (µs)

0 1 2 3 4

CIN = 0.1 µF

CIN = 0

VCONT

ON/OFF RESPONSE

TIME (µs)

0 1 2 3 4

CL = 0

CL = 0.001 µF

VCONT

CL = 0.01 µF

VINIOUT = 30 mA

CIN

CIN must be over 0.1 µF

VINIOUT = 30 mA

CL1 µF


TK70001


LOAD RESPONSE

0 10 20 30 40

TIME (µs)

0

CL = 0.1 µF

IOUT

VOUT

CIN = 1 µF50 mV/ DIV

30 mA

VINIOUT = 0 to 30 mA

CL1 µF


TK70001

ON/OFF CONTROL CURRENT

The characteristics of TK70001 change by the value ofcontrol current. Please refer to the electrical characteristicsgraphs on the data sheet and determine the optimumvalue. The standard measurement condition isICONT = 50 µA. (The application is max. ICONT = 200 µA). Inthe condition where there is very little output current,connect the resistor RCONT to the control terminal (pleaseconsider the reduction of the terminal voltage, the resistancevalue, etc.). This current can be lowered.

THERMAL SENSOR

The thermal sensor protects the device in the event thatthe junction temperature exceeds the safe value (Tj =150 °C). This temperature rise can be caused by externalheat, excessive power dissipation caused by large input tooutput voltage drop, or excessive output current. Theswitch will shut off when the temperature exceeds the safevalue. As the junction temperature decreases, the switchwill begin to operate again. Under sustained fault conditions,the switch output will cycle as the device turns off, and thenresets. Damage may occur to the device under extremefault conditions.


This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-26 is increased to 350 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-26 device should be derated at 2.8 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. These



The output voltage decreases with the increase of outputcurrent. It is dependent upon the load current and thejunction temperature. The dropout voltage is the differencebetween the input voltage and the output voltage. Themeasurement current is IOUT = 50 mA. (ICONT = 50 µA,VIN = 2.5 V).


The rated output current is specified under the conditionwhere the output voltage drops 0.5 V below the no loadvalue. The input voltage is set to 2.5 V, and the current ispulsed to minimize temperature effects.


The quiescent current is the current which flows throughthe ground terminal under no load conditions (IOUT = 0 mA)with VIN = 2.5 V and excludes the control pin current.


Standby current is the current which flows into the solidstate switch when the output is turned off by the controlfunction (VCONT = 0 V). It is measured with VIN = 8 V.



ON/OFF CONTROL

High is “on” (referenced to ground). The input current is atthe pA level by connecting the control terminal to ground.




TK70001



BOARD LAYOUT

The copper pattern should be as large as possible.

+

GND

INPUT

+

+

PCB: CLASS EPOXY T=0.8 mM

OUTPUT 2

OUTPUT 1

CONT 1

CONT 2


SOT-26 BOARD LAYOUT

SOT-26 POWER DISSIPATION

measurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C/ PD



Procedure:





APPLICATION INFORMATIONPD

DPD

25 50 75 150

(mW)

TA ( C)

3

6

5

4

0 50 100 150

TA ( C)P

D (

mW

)

0

250

450

50

150

350 MOUNTED ASSHOWN

FREE AIR


TK70001

0.95 0.95

0.950.95e

M0.1

2.9

2.8

1.90

2.4

e

e1


1 2 3

46

1.0

0.7

0 ~

0.1

(0.6

)(0

.6)

1.4

max

(1.9)

e

e e

5

Marking

0.3+

0.15

0.1

+

0.3

1.1

0.1+

1.6

0-13


0.1

Marking Information

MarkingTK70001 01S

SOT-26 (SOT-23-6)

PACKAGE OUTLINE




IC-216-TK700010798O0.0K








TK70002

CONT 2

GND

OUTPUT 2

CONT 1

INPUT

OUTPUT 1

SWCIRCUIT

THERMALPROTECTION

BASECONTROLCURRENT

BASECONTROLCURRENT

SWCIRCUIT






Single Input with Two Controlled Outputs





Power Management



BLOCK DIAGRAM

TK70002

20P

INPUT

OUTPUT 1

CONT 2

CONT 1

OUTPUT 2

GND

DESCRIPTION

The TK70002 is a monolithic bipolar integrated circuit withhigh side current switches of low saturation type. Thesupply current, including the control current, is virtuallyzero (pA level) when the control pin is “off”. The impedanceon the output side is high and the reverse current does notflow when the control pin is “off.” These are effective todecrease the dissipation currents, making the TK70002 avery efficient device for power management and powerdistribution control.

The TK70002 is available in a miniature SOT-23-6 surfacemount package. When mounted as recommended, thispackage is capable of dissipating up to 350mW.



Tape/Reel Code

TK70002MCB

SINGLE INPUT, TWO OUTPUT SOLID STATE SWITCH


TK70002

ABSOLUTE MAXIMUM RATINGSStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -30 to +80 °COperating Voltage Range............................... 1.6 to 12 VLead Soldering Temperature (10 s) ..................... 235 °C

TK70002 ELECTRICAL CHARACTERISTICSTest conditions: VIN = 2.5 V, TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25 °C. Power dissipation is150 mW in Free Air. Derate at 1.2 mW/°C for operation above 25 °C.

Note 2: By grounding this terminal, the operation completely stops and the input current decreases to a pA level.Note 3: Ground current is defined as IIN - IOUT, excluding control current. Refer to “Definition of Terms.”Gen. Note: Parameters with min. or max. values are 100% tested.Gen. Note: Exceeding the “Absolute Maximum Ratings” can damage the device.

Supply Voltage ......................................................... 14 VOutput Current .................................................... 130 mAPower Dissipation (Note 1) ................................ 350 mWControl Terminal Voltage ........................................... 8 VReverse Bias Voltage................................................. 8 V


IQ tnerruCtnecseiuQ I TUO IedulcxE,Am0= TNOC 52.0 56.0 Am


5.0 001 An

I TUO tnerruCtuptuO V PORD V5.0= 07 011 Am

I DNG )3etoN(tnerruCdnuorG I TUO Am05= 5.2 5.4 Am

V PORD egatloVtuoporD I TUO Am05= 81.0 53.0 V

∆VD slennahCneewteBecnalaB V PORD I,ecnereffid TUO Am05= 1 52 Vm

I VER tnerruCsaiBesreveR V NI V,V0= VER V,V8= TNOC V0= 3.0 05 An


I TNOC tnerruClanimreTlortnoC V TNOC V6.1= 7 51 Aµ




TK70002


TEST CIRCUIT

IOUT 1

OUTPUT 1

ICONT 2

CONT 1CONT 2

IOUT 2

ICONT 1

VCONT 2 VCONT 1

OUTPUT 2

CIN0.1 µF

VIN IIN

INPUT

VOUT 2VOUT 1

CL 1 = 0.1 µFCL 2 = 0.1 µF

RCONT 2 RCONT 1

CONTROL CURRENT 1 VS.CONTROL VOLTAGE

VCONT (V)

I CO

NT

(A

)

0

20

40

60

80

100

0 2 4 6 8 10

RCONT = 0


VCONT (V)

I CO

NT

(A

)

0

10

30

20

40

0 1 2 3 4 5

RCONT = 0

VOUT

100 k

200 k

IOUT (mA)

VD

RO

P (

mV

)

-400

-300

-200

-100

0

0 50 100

VIN = 1.0 V 1.2 V

1.4 V

1.8V

1.6 V



IOUT (mA)

VD

RO

P (

mV

)

-400

-300

-200

-100

0

0 100 200

VIN = 2.5 V

PARALLEL OPERATION

SINGLE OPERATION


IOUT (mA)

I GN

D (

mA

)

0

5

10

0 50 100

1.8 V

VIN = 1.0 V1.2 V

1.4 V

1.6 V


VREV (V)

I RE

V (

nA)

0

1

2

0 5 10 15


TK70002


GROUND CURRENT

TA (°C)

I GN

D (

mA

)

0

2

3

-50 0 50 100

IOUT = 50 mA

DROPOUT VOLTAGE

TA (°C)

VD

RO

P (

mV

)

240

-50 0 50 100

200

100

IOUT = 50 mA

OUTPUT CURRENT

TA (°C)

I OU

T(m

A)

90

140

-50 0 50 100

130

100

VIN = 2.5 VAT VDROP = 0.5 V

110

120

CONTROL VOLTAGE (V OUT = ON)

TA (°C)

VC

ON

T (

V)

0

1.0

-50 0 50 100

0.5

ON/OFF RESPONSE 1

TIME (µs)

0 1 0 10 20

VCONT

CL = 0.01 µF

ILOAD = 30 mA

CL = 0.1 µF

LOAD STEP RESPONSE

0 4 8 12 16

CL = 0.01 µF

ILOAD = 0 to 30 mA

CL = 0.1 µF

TIME (µs)

100 mV/DIV

CONTROL CURRENT

TA (°C)

I CO

NT

(µ

A)

0

10

-50 0 50 100

8

6

4

2

VCONT = 1.6 V

ON/OFF RESPONSE 2

TIME (µs)

0 1 2 3 4

VCONT

CL = 0.1 µF

ILOAD = 30 mA

CL = 0.01 µF

CL = NONE


TK70002



This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases. The rate oftemperature rise is greatly affected by the mounting padconfiguration on the PCB, the board material, and theambient temperature. When the IC mounting has goodthermal conductivity, the junction temperature will be loweven if the power dissipation is great. When mounted onthe recommended mounting pad, the power dissipation ofthe SOT-23-6 is increased to 350 mW. For operation atambient temperatures over 25 °C, the power dissipation ofthe SOT-23-6 device should be derated at 2.8 mW/°C. Todetermine the power dissipation for shutdown whenmounted, attach the device on the actual PCB anddeliberately increase the output current (or raise the inputvoltage) until the thermal protection circuit is activated.Calculate the power dissipation of the device by subtractingthe output power from the input power. Thesemeasurements should allow for the ambient temperatureof the PCB. The value obtained from PD /(150 °C - TA) is thederating factor. The PCB mounting pad should providemaximum thermal conductivity in order to maintain lowdevice temperatures. As a general rule, the lower thetemperature, the better the reliability of the device. Thethermal resistance when mounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C/ PD



The output voltage decreases with the increase of outputcurrent. It is dependent upon the load current and thejunction temperature. It measures the differential voltagebetween the input voltage and the output voltage when theinput voltage is set to 2.5 V and the output current is set to50 mA.









ON/OFF CONTROL





TK70002

OUTPUT 1

CONT 1

OUTPUT 2INPUT

CONT 2

GND


Procedure:








SOT-23-6 POWER DISSIPATION

0 50 100 150

TA (°C)

PD

(m

W)

0

250

450

50

150

350 MOUNTED ASSHOWN

FREE AIR

DEFINITIONS AND TERMS (CONT.)

PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

BOARD LAYOUT



TK70002

Marking Information

MarkingTK70002 02S

0.95 0.95

0.950.95e

M0.1

2.9

2.8

1.90

2.4

e

e1


1 2 3

46

1.0

0.7

0 ~

0.1

(0.6

)(0

.6)

1.4

max

(1.9)

e

e e

5

Marking

0.3+

0.15

0.1

+

0.3

1.1

0.1+

1.6

0-13


0.1

SOT-26 (SOT-23-6)

PACKAGE OUTLINE




IC-217-TK700020798O0.0K








TK70003

CONT 2

GND

INPUT 2

CONT 1

OUTPUT

INPUT 1

SWCIRCUIT

THERMALPROTECTION

BASECONTROLCURRENT

BASECONTROLCURRENT

SWCIRCUIT




Power Management








Single Output with Two Controlled Inputs


BLOCK DIAGRAM

TK70003

20P

OUTPUT

INPUT 1

CONT 2

CONT 1

INPUT 2

GND

DESCRIPTION

The TK70003 is a monolithic bipolar integrated circuit withhigh side current switches of low saturation type. Thesupply current, including the control current, is virtuallyzero (pA level) when the control pin is “off.” The impedanceon the output side is high and the reverse current does notflow when the control pin is “off.” These are effective todecrease the dissipation currents, making the TK70003 avery efficient device for power management and powerdistribution control.

The TK70003 is available in a miniature SOT-23-6 surfacemount package. When mounted as recommended, thispackage is capable of dissipating up to 350 mW.



Tape/Reel Code

TK70003MCB

SINGLE OUTPUT, TWO INPUT SOLID STATE SWITCH


TK70003

ABSOLUTE MAXIMUM RATINGSSupply Voltage ......................................................... 14 VOutput Current .................................................... 130 mAPower Dissipation (Note 1) ................................ 350 mWControl Terminal Voltage ........................................... 8 VReverse Bias Voltage................................................. 8 V

Storage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -30 to +80 °COperating Voltage Range............................... 1.6 to 12 VLead Soldering Temperature (10 s) ...................... 235 °C

TK70003 ELECTRICAL CHARACTERISTICSTest conditions: VIN = 2.5 V, TA = 25 °C, unless otherwise specified.

Note 1: Power dissipation is 350 mW when mounted as recommended. Derate at 2.8 mW/°C for operation above 25 °C. Powerdissipation is 150 mW in Free Air. Derate at 1.2 mW/°C for operation above 25 °C.

Note 2: By grounding this terminal, the operation completely stops and the input current decreases to a pA level.Note 3: Ground current is defined as IIN - IOUT, excluding control current. Refer to “Definition of Terms.”Note 4: If both input voltages are the same (parallel operation), both switches can be turned on at the same time. If the input voltages

are different, only one switch should be turned on at any given time.Gen. Note: Parameters with min. or max. values are 100% tested.Gen. Note: Exceeding “Absolute Maximum Ratings” can damage the device.


IQ tnerruCtnecseiuQ I TUO IedulcxE,Am0= TNOC 52.0 56.0 Am


5.0 001 An

I TUO tnerruCtuptuO V PORD V5.0= 07 011 Am

I DNG )3etoN(tnerruCdnuorG I TUO Am05= 5.2 5.4 Am

V PORD egatloVtuoporD I TUO Am05= 81.0 53.0 V

∆VD slennahCneewteBecnalaB V PORD I,ecnereffid TUO Am05= 1 52 Vm

I VER tnerruCsaiBesreveR V NI V,V0= VER V,V8= TNOC V0= 3.0 05 An


I TNOC tnerruClanimreTlortnoC V TNOC V6.1= 7 51 Aµ

V )NO(TNOC )NO(egatloVlortnoC )4etoN(NOtuptuO 2.1 V



TK70003


TEST CIRCUIT

INPUT 1

ICONT 2

CONT 1CONT 2

IIN 2

ICONT 1

VCONT 2 VCONT 1

INPUT 2

CL = 0.1 µFVOUT

IOUT

OUTPUT

VIN 2

CIN 2 0.1 µF

IIN 1 VIN 1

RCONT 2 RCONT 1

CIN1 0.1 µF


IOUT (mA)

VD

RO

P (

mV

)

-400

-300

-200

-100

0

0 100 200

VIN = 2.5 V

PARALLEL OPERATION

SINGLE OPERATION


IOUT (mA)

I GN

D (

mA

)

0

5

10

0 50 100

1.8 V

VIN = 1.0 V1.2 V

1.4 V

1.6 V


VREV (V)

I RE

V (

nA)

0

1

2

0 5 10 15


VCONT (V)

I CO

NT

(A

)

0

20

40

60

80

100

0 2 4 6 8 10

RCONT = 0


VCONT (V)

I CO

NT

(A

)

0

10

30

20

40

0 1 2 3 4 5

RCONT = 0

VOUT

100 k

200 k

IOUT (mA)

VD

RO

P (

mV

)

-400

-300

-200

-100

0

0 50 100

VIN = 1.0 V 1.2 V

1.4 V

1.8V

1.6 V



TK70003


GROUND CURRENT

TA (°C)

I GN

D (

mA

)

0

2

3

-50 0 50 100

IOUT = 50 mA

DROPOUT VOLTAGE

TA (°C)

VD

RO

P (

mV

)

240

-50 0 50 100

200

100

IOUT = 50 mA

OUTPUT CURRENT

TA (°C)

I OU

T(m

A)

90

140

-50 0 50 100

130

100

VIN = 2.5 VAT VDROP = 0.5 V

110

120

CONTROL VOLTAGE (V OUT = ON)

TA (°C)

VC

ON

T (

V)

0

1.0

-50 0 50 100

0.5

ON/OFF RESPONSE 1

TIME (µs)

0 1 0 10 20

VCONT

CL = 0.01 µF

ILOAD = 30 mA

CL = 0.1 µF

ON/OFF RESPONSE 2

TIME (µs)

0 1 2 3 4

VCONT

CL = 0.1 µF

ILOAD = 30 mA

CL = 0.01 µF

CL = NONE

LOAD STEP RESPONSE

0 4 8 12 16

CL = 0.01 µF

ILOAD = 0 to 30 mA

CL = 0.1 µF

TIME (µs)

100 mV/DIV

CONTROL CURRENT

TA (°C)

I CO

NT

(µ

A)

0

10

-50 0 50 100

8

6

4

2

VCONT = 1.6 V


TK70003



This is the power dissipation level at which the thermalsensor is activated. The IC contains an internal thermalsensor which monitors the junction temperature. When thejunction temperature exceeds the monitor threshold of150 °C, the IC is shut down. The junction temperaturerises as the difference between the input power (VIN x IIN)and the output power (VOUT x IOUT) increases (Note: bothVIN pins are connected together and both switches “on” forthis measurement). The rate of temperature rise is greatlyaffected by the mounting pad configuration on the PCB,the board material, and the ambient temperature. Whenthe IC mounting has good thermal conductivity, the junctiontemperature will be low even if the power dissipation isgreat. When mounted on the recommended mountingpad, the power dissipation of the SOT-23-6 is increased to350 mW. For operation at ambient temperatures over 25°C, the power dissipation of the SOT-23-6 device shouldbe derated at 2.8 mW/°C. To determine the powerdissipation for shutdown when mounted, attach the deviceon the actual PCB and deliberately increase the outputcurrent (or raise the input voltage) until the thermalprotection circuit is activated. Calculate the powerdissipation of the device by subtracting the output powerfrom the input power. These measurements should allowfor the ambient temperature of the PCB. The value obtainedfrom PD /(150 °C - TA) is the derating factor. The PCBmounting pad should provide maximum thermalconductivity in order to maintain low device temperatures.As a general rule, the lower the temperature, the better thereliability of the device. The thermal resistance whenmounted is expressed as follows:

Tj = 0jA x PD + TA


150 °C = 0jA x PD + 25 °C0jA = 125 °C/ PD



The output voltage decreases with the increase of outputcurrent. It is dependent upon the load current and thejunction temperature. It measure the differential voltagebetween the input voltage and the output voltage when theinput voltage is set to 2.5 V and the output current is set to5 mA.









ON/OFF CONTROL





TK70003

INPUT 1

CONT 1

INPUT 2OUTPUT

CONT 2

GND


Procedure:








SOT-23-6 POWER DISSIPATION

0 50 100 150

TA (°C)

PD

(m

W)

0

250

450

50

150

350 MOUNTED ASSHOWN

FREE AIR

PD

DPD

25 50 75 150

(mW)

TA (°C)

3

6

5

4

BOARD LAYOUT

DEFINITIONS AND TERMS (CONT.) APPLICATION INFORMATION


TK70003

Marking Information

MarkingTK70003 03S

0.95 0.95

0.950.95e

M0.1

2.9

2.8

1.90

2.4

e

e1


1 2 3

46

1.0

0.7

0 ~

0.1

(0.6

)(0

.6)

1.4

max

(1.9)

e

e e

5

Marking

0.3+

0.15

0.1

+

0.3

1.1

0.1+

1.6

0-13


0.1

SOT-26 (SOT-23-6)

PACKAGE OUTLINE




IC-218-TK700030798O0.0K







Variable Capacitance Diodes

Product Package Operating voltage Capacitance Ratio

KV1811E URD 1 to 8 V A = 7.8

KV1812E URD 1 to 8 V A = 7.4

KV1832C SRD 1 to 4 V A = 3.4

KV1832E URD 1 to 4 V A = 3.4

KV1841E URD 1 to 8 V A = 2.35

June, 1998 TOKO, Inc. Page 1

KV1811E


VR Reverse Voltage IR = 10 µA 20 V

IR Reverse Current VR = 16 V 5.0 nA

C1 Diode Capacitance 1 VR = 1 V, f = 1 MHz 19.51 21.50 23.55 pF


RS Series Resistance 8 pF, f = 470 MHz 1.8 Ω

A Capacitance Ratio C1 / C8 7.8

VARIABLE CAPACITANCE DIODE

FEATURES Very Small URD Surface Mount Package

Very Low Operating Voltage (1 to 8 V)

Large Capacitance Ratio (A = 7.8)

Excellent Linearity (CV Curve)

Very Small Capacitance Deviation at Tape/Reel

APPLICATIONS Communications Equipment

Multi-channel Cordless Telephone

Voltage Controlled Oscillator

UHF Wireless Communication Systems

ELECTRICAL CHARACTERISTICSTest conditions: TA = 25 °C


TAPE/REEL CODETR: Tape Right

Tape/Reel Code

KV1811E

KV1811E

Note 1: Diode Capacitance measured with HP 4279A or equivalent instruments (at OSC level 20 mVrms, ± 5 mVrms).Note 2: Series Resistance measured with HP 4191A or equivalent instruments.

Reverse Voltage....................................................... 25 VForward Current .................................................... 10 mAPower Dissipation ................................................ 50 mW

ABSOLUTE MAXIMUM RATINGSStorage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -55 to +85 °C

KV1811E

June, 1998 TOKO, Inc.

0 4

REVERSE CURRENT vs.REVERSE VOLTAGE

168

VR (V)

I R (

A)

1 n

100 p

10 p

1 p

10 f20

100 f

12

TA = 85 °C

TA = 55 °C

TA = 25 °C

50 300100

REVERSE RESISTANCE vs.FREQUENCY

500

f (MHz)

RS

(Ω

)

3.0

1.0

0.51000

VR = 4 VTA = 25 °C

40 2

vs. TEMPERATUREC (TA)

C (25 °C)

6

VR (V)

1.08

1.00

8

1.04

0.96

0.92

C (

TA

)

C (

25 C

)

TA = 85 °C

TA = -55 °C

TA = -15 °C

TA = 25 °C

TA = 55 °C

f = 1 MHz

∆C /

TA

(pp

m/

C)

40 2

CAPACITANCE TEMPERATURECOEFFICIENT vs. REVERSE VOLTAGE

6

VR (V)

3000

1000

300

1008

TA = -55 °C to +85 °Cf = 1 MHz


1040 2

Q vs. REVERSE VOLTAGE

6

VR (V)

Q

300

100

30

8

f = 50 MHzf = 100 MHz

f = 300 MHz

f = 470 MHz

40 2 6 8

CAPACITANCE vs. REVERSE VOLTAGE

VR (V)

C (

pF)

50

30

10

3

1

f = 1 MHzTA = 25 °C


KV1811E


1.7

0.2 min 0.3

0.9

-0.0

6 ~

0.0

6

0.8

2.3

0.8

1.25

2.5

0.13

1 2

0.1

+

+ 0.3


URDMarking Information

Product Code F

IC-???-KV1811

PACKAGE OUTLINE

The information furnished by TOKO, Inc. is believed to be accurate and reliable. However, TOKO reserves the right to make changes or improvements in the design, specification or manufacture ofits products without further notice. TOKO does not assume any liability arising from the application or use of any product or circuit described herein, nor for any infringements of patents or otherrights of third parties which may result from the use of its products. No license is granted by implication or otherwise under any patent or patent rights of TOKO, Inc.


http://www.ictoko.com

Midwest Regional OfficeToko America, Inc.1250 Feehanville DriveMount Prospect, Il 60056Tel: (847) 297-0070Fax: (847) 699-7864

Western Regional OfficeToko America, Inc.2480 North First Street, Suite 260San Jose, CA 95131Tel: (408) 432-8281Fax: (408) 943-9790



© 1998 Toko, Inc.All rights reservedPrinted in the USA


KV1812E





C2 Diode Capacitance 2 VR = 2 V, f = 1 MHz 9.00 pF

C4 Diode Capacitance 4 VR = 4 V, f = 1 MHz 3.00 pF

















Tape/Reel Code

KV1812E

KV1812E




KV1812E


0 4


168

VR (V)

I R (

A)

1 n

100 p

10 p

1 p

10 f20

100 f

12

TA = 85 °C

TA = 55 °C

TA = 25 °C

50 300100


500

f (MHz)

RS

(Ω

)

3.0

1.0

0.51000

VR = 4 VTA = 25 °C

40 2


C (25 °C)

6

VR (V)

1.08

1.00

8

1.04

0.96

0.92

C (

TA

)

C (

25 C

)

TA = 85 °C

TA = -55 °C

TA = -15 °C

TA = 25 °C

TA = 55 °C

f = 1 MHz

∆C /

TA

(pp

m/

C)

40 2


6

VR (V)

3000

1000

300

1008

TA = -55 °C to +85 °Cf = 1 MHz


40 2


6

VR (V)

300

100

30

108

f = 50 MHzf = 100MHzf = 300 MHz

f = 470 MHzQ

40 2


6

VR (V)

C (

pF)

30

10

3

18

f = 1 MHzTA = 25 °C


KV1812E


1.7

0.2 min 0.3

0.9

-0.0

6 ~

0.0

6

0.8

2.3

0.8

1.25

2.5

0.13

1 2

0.1

+

+ 0.3



Product Code G

IC-???-KV1812

PACKAGE OUTLINE










KV1832C









FEATURES Very Small SRD Surface Mount Package





Very Low Series Resistance








Tape/Reel Code

KV1832C

KV1812E




RANKC

A B C D E

C2

MIN 5.95 7.50 9.05 11.25 12.80

MAX 7.60 9.15 11.35 12.90 14.45

CLASSIFICATION Unit: pF

KV1832C


0 4 168

VR (V)

I R (

A)

1 n

100 p

10 p

1 p

10 f20

100 f

12

TA = 85 °C

TA = 55 °C

TA = 25 °C


50 300100


500

f (MHz)

RS

(Ω

)

1.0

0.7

0.51000

VR = 4 VTA = 25 °C

0 1 32

VR (V)

1.10

1.02

4

1.06

0.98

0.94

TA = 85 °C

TA = -55 °C

TA = -15 °C

TA = 25 °C

TA = 55 °C

0.90


C (25 °C)

C (

TA

)

C (

25 C

)

0


31 2

VR (V)

3000

1000

300

1004

TA = -55 °C to +85 °Cf = 1 MHz

∆C /

TA

(pp

m/

C)


0 21


VR (V)

Q

300

100

30

103

f = 50 MHz500

f = 470 MHz

4

f = 100 MHz

f = 300 MHz

0 1

CAPACITANCE vs.REVERSE VOLTAGE

32

VR (V)

C (

pF)

30

10

34

TA = 25 °Cf = 1 MHz


KV1832C


3.8

1.6

2.65

0.3

0.13

0.6

1.1

1.5

1.5

3.5

-0.0

5 ~

0.1


+ 0.3

+ 0

.1

SRDMarking Information

Product Code C

IC-???-KV1832C

PACKAGE OUTLINE










KV1832E























Tape/Reel Code

KV1832E

KV1832E




RANKC

1A 2A 3A 4A 5A

C2

MIN 8.5 9.05 9.75 10.55 11.25

MAX 9.15 9.85 10.65 11.35 11.90

CLASSIFICATION Unit: pF

KV1832E


0 4 168

VR (V)

I R (

A)

1 n

100 p

10 p

1 p

10 f20

100 f

12

TA = 85 °C

TA = 55 °C

TA = 25 °C


50 300100


500

f (MHz)

RS

(Ω

)

1.0

0.7

0.51000

VR = 4 VTA = 25 °C

0 1 32

VR (V)

1.10

1.02

4

1.06

0.98

0.94

TA = 85 °C

TA = -55 °C

TA = -15 °C

TA = 25 °C

TA = 55 °C

0.90


C (25 °C)

C (

TA

)

C (

25 C

)

0


31 2

VR (V)

3000

1000

300

1004

TA = -55 °C to +85 °Cf = 1 MHz

∆C /

TA

(pp

m/

C)


0 21


VR (V)

Q

300

100

30

103

f = 50 MHz500

f = 470 MHz

4

f = 100 MHz

f = 300 MHz

0 1


32

VR (V)

C (

pF)

30

10

34

TA = 25 °Cf = 1 MHz


KV1832E


1.7

0.2 min 0.3

0.9

-0.0

6 ~

0.0

6

0.8

2.3

0.8

1.25

2.5

0.13

1 2

0.1

+

+ 0.3



Product Code C

IC-???-KV1832E

PACKAGE OUTLINE










KV1841E














Tape/Reel Code

KV1841E

KV1841E





IR Reverse Current VR = 10 V, f = 1 MHz 5.0 nA



RS Series Resistance 11 pF, f = 470 MHz 0.25 0.30 Ω


Storage Temperature Range ................... -55 to +150 °COperating Temperature Range ................... -55 to +85 °C

Reverse Voltage....................................................... 18 VForward Current ...................................................... 7 mAPower Dissipation ................................................ 25 mW

KV1841E


0


84

VR (V)

I R (

A)

1 n

100 p

10 p

1 p12

TA = 25 °C

TA = 55 °C

TA = 85 °C

300100

REVERSE RESISTANCE vs. FREQUENCY

f (MHz)

RS

(Ω

)

0.5

0.3

0.1

VR = 3 VTA = 25 °C

40 2


C (25 °C)

6

VR (V)

1.08

1.00

8

1.04

0.96

0.92

C (

TA

)

C (

25 C

)

TA = 85 °C

TA = -55 °C

TA = -15 °CTA = 25 °C

TA = 55 °C

f = 1 MHz

40 2


6

VR (V)

∆C /

TA

(pp

m/

C)

300

1008

TA = -55 °C to +85 °Cf = 1 MHz


40 2


6

VR (V)

Q

300

100

30

108

f = 470 MHz

f = 50 MHz500

f = 300 MHz

f = 100 MHz

0 2

CAPACITANCE vs.REVERSE VOLTAGE

64

VR (V)

C (

pF)

50

30

10

8

TA = 25 °Cf = 1 MHz


KV1841E


1.7

0.2 min 0.3

0.9

-0.0

6 ~

0.0

6

0.8

2.3

0.8

1.25

2.5

0.13

1 2

0.1

+

+ 0.3



Product Code P

IC-???-KV1841

PACKAGE OUTLINE









Toko IC ProductsToko IC Products

Selection Guides:

• TK11812• TK11830• TK11900

Toko Worldwide OfficesToko Worldwide Offices

Office Location:Toko Worldwide HeadquartersToko, Inc.1-17, Higashi-yukigaya 2-chome,Ohta-ku, Tokyo, 145 JapanTel: (03) 3727-1161Fax: (03) 3727-1176, 1169

Toko America HeadquartersToko America, Inc.1250 Feehanville DriveMt. Prospect, IL 60056Tel: (847) 297-0070Fax: (847) 699-1194

Midwest Regional OfficeToko America, Inc.1250 Feehanville DriveMt. Prospect, IL 60056Tel: (847) 297-0070Fax: (847) 699-1194

Semiconductor Technical SupportToko Design Center4755 Forge RoadColorado Springs, CO. 80907Tel: (719) 528-2200Fax: (719) 528-2375

Western Regional OfficeToko America, Inc.2480 North First St., Suite 260San Jose, CA 95131Tel: (408) 432-8281Fax: (408) 943-9790


OR1-800-PIK-TOKO

Worldwide OfficesAuthorized Toko America Distributors

& RepresentativesDigi-Key

1-800-DIGIKEYPenstock

1-800-PENSTOCK

Sager1-800-SAGER800

Varigon - San Diego, Inc.

619-576-0100

Copyright © 1999 Toko America, Inc. All rights reserved.

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