ToF, the Improving Performance in Application
14
ToF, the Improving Performance in Application
Transcript of ToF, the Improving Performance in Application
ToF, the Improving Performance in Application
2015.04 2016.042015.122015.03 2017.05 2017.12
Pico founded Launched co-
branded super
helmet with
LeTv, the first
portable, 3D,
big screen
theater
Launched Pico1,
totally branded
under name of
Pico
Launched all-in-
one mobile VR
product, which
was equipped
Qualcomm
Snapdragon 820
Launched series of VR products: Pico Goblin, Pico U, Pico Neo DKS,Pico Tracking Kit..
Launched
industrial the very
first 6Dof head &
hand VR, Pico
Neo.
Launched
2018.7
Launched
industrial the
very first all-in-
one VR device at
price $199,
which was
equipped
Qualcomm
Snapdragon 835
2019.01
Launched G2 4K
VR product,
which was
equipped
Qualcomm
Snapdragon 835
2019.03
Air Camera DCAM710DCAM110
San Francisco TokyoBarcelona Beijing
QingdaoShanghai
Beijing Officeheadquarters, product
R&D, marketing, content
development and other
departments.
San Francisco OfficeCore technology development
(UI/UX algorithm), content
cooperation, overseas market
promotion.
Tokyo OfficeJapan marketing &sales,
content development
Qingdao OfficeHardware, structure
development and optical
research department
Edge AI
3DCamera
CoreAlgorithm
3 Cornerstones
Branding
Hardware Solution Customization Service
AI Chip inside
Business Model
PCBA
Module
Algorithm & System
Pico Interactive Confidential, no allowance of disclosure without Pico Permission
SDK
Dimension(L*W*H)
Minimum size if Depth only
35mm × 20mm × 7mm
Distance Range
From 15cm to 15m, support
WDR(Wide Dynamic Range)
Field of View
60°、70°、90°、100°、110°、
120°
Interface
MIPI/USB2.0/USB3.0/Type C
Ethernet/CAN
Operation System
Android/Linux / ARM
Linux/Windows7/8/10
ROS/OpenNI
ProjectManagement
Working Sample 2 Month
Engineering Sample 3-4 Month
Production Prove out 5 Month
R&Dstrength
Pico SDK
Supportive
Hardware structure / System
/ Application software
Provide flexible integrated
configuration space.
Actively cooperate with clients, in
order to achieve the common goals.
Simulation in EE/ME/OpticsCustomized calibration and flexible manageable test plan
ProductValidation
ProductTest
“Menu Service” Engineering
Edge AI Camera“Air Camera”
Technical Specifications
Hardware
CPU
QCS605, 10 nm LPE FinFET processCPU: 8 x Kryo 300, 2 x Gold(2+ GHz), 6 x Silver(1.6+ GHz)DSP: Hexagon V65 1.2GHz, 2 x HVX, 1024bit, 512KB cacheGPU: Adreno 615, 700MHz
RAM 3GB
ROM 32GB
Software
System Android NN
FunctionsSupport Face Detection and Recognition, Skeleton Recognition, Gesture Recognition, Objects Detection and Recognition
Networking Multiple Devices Networking
Depth Camera
Resolution VGA 640*480
Frame Rate 30fps
FOV H 69°/V 51°
RGB Camera
RGB Sensor Samsung S5K5E9YX04
Resolution 5M
Frame Rate 1080P@60fps
FOV DFOV：74.5°，HFOV62.5°
Interface
Input DC/USB-C 3.0/Micro SD
Audio Dual Mics
Wireless2*2 MIMO WIFI 2.4G/5G Dual Band 8012.11b/g/n/ac, Bluetooth 4.2
IMU IMU Sensors 9 axis IMU Sensors
Button&LEDButton Function Button*1
LED RGB 3-Colors LED Indicator
Dimension Dimension 94mm*40mm*27mm
Weight Weight TBD
Industry grade ToF camera“DCAM800”
Parameter Pico DCAM900
Technology TOF (Time of flight) Depth Camera
Depth Sensor Format & Frame rate 640 x 480(VGA)@30FPS
Depth Sensor Field of ViewH - Horizontal, V - Vertical (degree)
H - 58V - 44
Use Range 0.25 - 10m
Precision 1%
LENS Focal length: 2.47mm f/number<1.2
Illumination 850nm / 940nm, VCSEL Class 1
Processor Xilinx Zynq-7000 AP SoC XC7Z020
Memory DDR3 SDRAM 512MB, QSPI Flash 16MB
Industrial ProtocolGigE Vision, PROFINET, Ethernet/IP, EtherCAT, POWERLINK, SERCOS III
Power Supply M12, 8 Pole / POE
Software C/C++ SDK, Matlab-SDK
Operation System Linux / Windows7/8/10
Dimension (L*W*H) 81mm x 75mm x 70mm
Temperature range -20 °C … +60 °C
⚫ Output: 12-bit Depth & IR Image & RGB Image⚫ Depth Camera Resolution: 640*480@15FPS⚫ Depth FOV: H 45.4*V 58.6⚫ Depth Range: 0.3m~1.2m⚫ RGB Camera Resolution: 360P/720P/1080P⚫ RGB Camera FOV: H 50.1*V79.9⚫ Indoor/Outdoor: Outdoor⚫ SoC: RK1108⚫ Power Supply：USB 2.0⚫ Power Consumption: <2.5W⚫ Interface: USB 2.0, MIPI CSI-2⚫ Support OS: Windows, Linux, Android⚫ Operation Temperature: -20 - +50degree °C⚫ Dimension: 64mm*18mm*14mm⚫ Weight: 17.5g
Face Recognition Module“FireBug”（“萤火虫”）
New Design!For
Face Recognition
前视窗（客户自行提供）
“萤火虫”模组
固定螺钉M2
固定支架上预留的固定孔，数量4固定孔与支架一体化，精度好，强度佳
固定孔平面上下皆可使用，主机厂螺钉固定方向可选：1、可以从上向下打螺钉2、可以从下向上打螺钉两种方式皆可合理利用厚度尺寸
模组美观设计：1、中间摄像镜头位于模组中心2、左、右两处的TOF镜头、激光器对称布局
模组尺寸：长64*宽18*厚15尺寸紧凑，小型化利于嵌入式使用
模组预留防尘设计：1、模组自带三处镜头泡棉2、模组自带距离传感器密封套嵌入主机厂设备中与前视窗结合后密闭防尘
Micro USB2.0接口居中、向下不偏向任何一侧，更佳的位置适配性
前壳一体设计，与主机厂对接面为平面美观、简介的光学开口，更易做到对主机厂外观要求的一致化
“萤火虫”之超易用性设计
Global tier1 Manufacturing
SMT COB FATP
Class 100000Over 45 SMT lines
Class 100Full-automatic COB line
Class 10000In-house made automatic FATP line
Injection Coating Assembly
Class 10000Injection Machine: 63 sets
Class 10000Vacuum Coating Machine：8 sets
Class 1000In-house made Assembly Line
Optical
Component
Optical
Module
Quality for mass production
声学实验室
Physics and Chemistry laboratory
Reliability Laboratory
Optical Laboratory
Lens Testing Center
THE END
Email: [email protected]
