TND310 ON Semiconductor Device Nomenclature

This document contains the device nomenclature breakdown (also referred to as the part number decoder, product naming convention, or part naming convention) for ON Semiconductor orderable devices. Whenever possible, ON Semiconductor uses these numbering systems in the naming of their products.

The ESD/TVS, small signal diode and transistor, and thyristor portfolios have no single standard naming convention. They consist of many industry standard nomenclatures, along with several market targeted naming conventions. For any questions, please contact your local ON Semiconductor sales representative.

Historical Nomenclature Notes

During its history, ON Semiconductor has been part of another company, and has acquired other companies and product lines. In order to maintain consistency for customers, part numbers have not changed, wherever possible. The following prefixes may indicate the original manufacturer:

Ax – Aptina Imaging Corporation

AX – Axsem AG

ADx – Analog Devices, Inc.

AMIS – AMI Semiconductor

ASM – PulseCore

CAT – Catalyst Semiconductor

CS – Cherry Semiconductor

Kxx – Truesense Imaging, Inc.

MC – Motorola

NOI – Cypress Semiconductor

Current Nomenclatures

Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2CMOS Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Analog Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Clock and Data Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Integrated Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6MOS Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Power MOSFETs − SO−8 (MiniMOS),Micro8, SOT−223, and TSOP−6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Bipolar Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11FMO Bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12LED/Lighting Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Memory Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Low Drop Out (LDO) Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Supervisor Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Charge Pumps, LED Drivers and I/O Bus Products . . . . . . . . . . . . . . 17Digitally Programmable Potentiometer andSupervisor with Memory Products . . . . . . . . . . . . . . . . . . . . . . . . . . . 17ASIC Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Ambient Light Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Photo Diode Arrays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Contact Image Sensors & Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Image Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Hearing Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Audio Products (BelaSigna) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Passive Tunable Integrated Circuits (PTIC) . . . . . . . . . . . . . . . . . . . . 28Power Mangament ICs (PMIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29RF Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30IPM, DS and iPS Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Publication Order Number:TND310/D

© Semiconduct Components Industries LLC, 2011

Apr, 2017 – Rev. 211© Semiconductor Components Industries, LLC, 2014

August, 2014 – Rev. 12 1 Publication Order Number:

TND310/D

TND310

ON SemiconductorDevice NomenclaturePrepared by: Steve WestON Semiconductor

Whenever possible, ON Semiconductor uses the followingnumbering systems in the naming of their products.

The ESD/TVS, small signal diode and transistor, andthyristor portfolios have no single standard naming

convention. They consist of many industry standardnomenclatures, along with several market targeted namingconventions. For any questions, please contact your localON Semiconductor sales representative.

Historical Nomenclature NotesDuring its history, ON Semiconductor has been part of

another company, and has acquired other companies andproduct lines. In order to maintain consistency forcustomers, part numbers have not changed, whereverpossible. The following prefixes may indicate the originalmanufacturer:

ADxAMISASMCATCSMCKxx

−––––––

Analog Devices, Inc.AMI SemiconductorPulseCoreCatalyst SemiconductorCherry SemiconductorMotorolaTruesense Imaging, Inc.

Current Nomenclature NotesAnalog 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CMOS Logic 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog Switch 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock and Data Management 4. . . . . . . . . . . . . . . . . . . . . Integrated Solutions 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . MOS Power 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power MOSFETs − SO−8 (MiniMOS ),Micro8 , SOT−223, and TSOP−6 8. . . . . . . . . . . . . . . . Bipolar Power 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rectifiers 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FMO Bump 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ambient Light Sensors 12. . . . . . . . . . . . . . . . . . . . . . . . Contact Image Sensors & Modules 13. . . . . . . . . . . . . . . Photo Diode Arrays 14. . . . . . . . . . . . . . . . . . . . . . . . . . . LED/Lighting Products 14. . . . . . . . . . . . . . . . . . . . . . . . I2C Serial EEPROMs 15. . . . . . . . . . . . . . . . . . . . . . . . . . SPI Serial EEPROMs 15. . . . . . . . . . . . . . . . . . . . . . . . . . Microwire Serial EEPROMs 16. . . . . . . . . . . . . . . . . . . . Low Drop Out (LDO) Products 16. . . . . . . . . . . . . . . . . . Supervisor Products 17. . . . . . . . . . . . . . . . . . . . . . . . . . . Charge Pumps, LED Drivers and I/O Bus Products 17. . Digitally Programmable Potentiometer and Supervisor with Memory Products 18. . . . . . . . . . . . . ASIC Devices 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

REFERENCE MANUAL

http://onsemi.com

Image Sensors 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

© Semiconductor Components Industries, LLC, 2014August, 2014 – Rev. 12

1 Publication Order Number:TND310/D

TND310

ON SemiconductorDevice NomenclaturePrepared by: Steve WestON Semiconductor

Whenever possible, ON Semiconductor uses the followingnumbering systems in the naming of their products.

The ESD/TVS, small signal diode and transistor, andthyristor portfolios have no single standard naming

convention. They consist of many industry standardnomenclatures, along with several market targeted namingconventions. For any questions, please contact your localON Semiconductor sales representative.

Historical Nomenclature NotesDuring its history, ON Semiconductor has been part of

another company, and has acquired other companies andproduct lines. In order to maintain consistency forcustomers, part numbers have not changed, whereverpossible. The following prefixes may indicate the originalmanufacturer:

ADxAMISASMCATCSMCKxx

−––––––

Analog Devices, Inc.AMI SemiconductorPulseCoreCatalyst SemiconductorCherry SemiconductorMotorolaTruesense Imaging, Inc.

Current Nomenclature NotesAnalog 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CMOS Logic 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog Switch 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock and Data Management 4. . . . . . . . . . . . . . . . . . . . . Integrated Solutions 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . MOS Power 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power MOSFETs − SO−8 (MiniMOS ),Micro8 , SOT−223, and TSOP−6 8. . . . . . . . . . . . . . . . Bipolar Power 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rectifiers 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FMO Bump 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ambient Light Sensors 12. . . . . . . . . . . . . . . . . . . . . . . . Contact Image Sensors & Modules 13. . . . . . . . . . . . . . . Photo Diode Arrays 14. . . . . . . . . . . . . . . . . . . . . . . . . . . LED/Lighting Products 14. . . . . . . . . . . . . . . . . . . . . . . . I2C Serial EEPROMs 15. . . . . . . . . . . . . . . . . . . . . . . . . . SPI Serial EEPROMs 15. . . . . . . . . . . . . . . . . . . . . . . . . . Microwire Serial EEPROMs 16. . . . . . . . . . . . . . . . . . . . Low Drop Out (LDO) Products 16. . . . . . . . . . . . . . . . . . Supervisor Products 17. . . . . . . . . . . . . . . . . . . . . . . . . . . Charge Pumps, LED Drivers and I/O Bus Products 17. . Digitally Programmable Potentiometer and Supervisor with Memory Products 18. . . . . . . . . . . . . ASIC Devices 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

REFERENCE MANUAL

http://onsemi.com

Image Sensors 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

www.onsemi.com

TND310

http://onsemi.com2

Naming Convention for Analog Devices

Product Class• N = Standard• S = Special/Custom• X = Pilot Production• P = Engineering Prototypes

Product Group• C = Analog Integrated Circuits

Package Designator• C = CHIP• D = SOIC Narrow Body• DA = TSSOP with 0.5 mm lead pitch• DB = TSSOP with 0.65 mm lead pitch• DM = Micro• DS = D2PAK• DT = DPAK• DW = SOIC Wide Body• F = PowerFLEX�• FB = TQFP• FC = �bump Flip−Chip• FN = PLCC• FT = LQFT• H = Flip−Chip• MN = QFN/DFN/LLGA >0.8 mm thick• MT = QFN/DFN/LLGA 0.6 to 0.8 mm thick• MU = QFN/DFN/LLGA <0.6 mm thick• P = DIP−8, −14, −16, etc.• PD = Thermally enhanced with exposed

PAD SOIC Narrow Body• PL = DIP−8, −14, −16, GullWing, etc.• PP = PSOP• PW = Thermally enhanced with exposed

PAD SOIC Wide Body• SA = SON (pkg code 7040)• SL = Leadless• SN = SC59 Multi−Lead, SOT23, and

TSOP−4, −5, −6• SQ = SC70−4/5/6, SC82AB Package• SP = SPAK• ST = SOT223• T = TO220−3, −5, −7 − Straight Lead• TH = TO220 Horizontal Lead Form• TV = TO220 Vertical Lead Form• W = Wafer

N

Product Family/Performance Index• L = Lighting• N = Advanced Interface• P = Power Management• S = Signal• T = Thermal Management• V = Vehicular (Automotive)

C P 1 2 3 4 A D 3 0 RROOT

OptionsVoltage,

frequency, etc.Free form in

pick list

Tape/Reel Designator

Pb−Free Designator• G = Lead−FreeStem Number

Assigned byMarketing

(2 to 6 alpha/numeric digits)

Temp Range/Output TypeDesignator Assigned by MarketingEx:• A = Enhanced• X = Extended

G

TND310

www.onsemi.com2

TND310

http://onsemi.com2

Naming Convention for Analog Devices


Product Group• C = Analog Integrated Circuits

Package Designator• C = CHIP• D = SOIC Narrow Body• DA = TSSOP with 0.5 mm lead pitch• DB = TSSOP with 0.65 mm lead pitch• DM = Micro• DS = D2PAK• DT = DPAK• DW = SOIC Wide Body• F = PowerFLEX�• FB = TQFP• FC = �bump Flip−Chip• FN = PLCC• FT = LQFT• H = Flip−Chip• MN = QFN/DFN/LLGA >0.8 mm thick• MT = QFN/DFN/LLGA 0.6 to 0.8 mm thick• MU = QFN/DFN/LLGA <0.6 mm thick• P = DIP−8, −14, −16, etc.• PD = Thermally enhanced with exposed

PAD SOIC Narrow Body• PL = DIP−8, −14, −16, GullWing, etc.• PP = PSOP• PW = Thermally enhanced with exposed

PAD SOIC Wide Body• SA = SON (pkg code 7040)• SL = Leadless• SN = SC59 Multi−Lead, SOT23, and

TSOP−4, −5, −6• SQ = SC70−4/5/6, SC82AB Package• SP = SPAK• ST = SOT223• T = TO220−3, −5, −7 − Straight Lead• TH = TO220 Horizontal Lead Form• TV = TO220 Vertical Lead Form• W = Wafer

N

Product Family/Performance Index• L = Lighting• N = Advanced Interface• P = Power Management• S = Signal• T = Thermal Management• V = Vehicular (Automotive)

C P 1 2 3 4 A D 3 0 RROOT

OptionsVoltage,

frequency, etc.Free form in

pick list


Pb−Free Designator• G = Lead−FreeStem Number

Assigned byMarketing

(2 to 6 alpha/numeric digits)

Temp Range/Output TypeDesignator Assigned by MarketingEx:• A = Enhanced• X = Extended

G

TND310

http://onsemi.com3

Naming Convention for CMOS Logic Family Devices

Circuit Identifier• MC = Motorola• NL = ON Semiconductor

Family Type• 74 = 74 Series (−55 to +125°C)• AS = Analog Switches• SF = Special Function• 17 = Single Gate• 27 = Dual Gate• 37 = Triple Gate

MC

CMOS Specification Identifier• AC = Advance CMOS• ACT = Advance CMOS TTL

Compatible• HC = Buffered High Speed CMOS• HCT = High Speed CMOS TTL

Compatible• HCU = Unbuffered High Speed CMOS• LCX = Low Voltage CMOS• LVX = Low Voltage CMOS• VCX = High Speed, Low Voltage

CMOS• VHC = Advance High Speed CMOS• VHCT = VHC TTL Compatible• SV = Ultra Low Voltage Single Gate

(VCX)• SZ = Single Gate LCX• WZ = Double/Triple Gate LCX

74 VHCT XX 244A DW R2 G

Special Feature• Blank = No Specific Feature• H = Bus Hold• 1G = Single Gate• 1GT = Single Gate TTL

Compatible

Pb−Free Designator• G = Lead−Free


Function Type• 00• 04• 244

Package Type• P or N for PDIP• D for 150 mil SOIC• DF for SOT• DT for TSSOP• DW for 300 mil Plastic SOIC• M or F for 200 mil EIAJ

SOIC• MN for QFN/DFN/LLGA

>0.8 mm thick• MT for QFN/DFN/LLGA 0.6

to 0.8 mm thick• MU for QFN/DFN/LLGA

<0.6 mm thick• FCT for Flip−Chip

Naming Convention for Analog Switch Devices

Application Type• 5 = Audio• 7 = Multimedia/USB/Data• 9 = General Purpose

NLAS 5 2 2 3 0

Channel Number• 1, 2, 3, 4, 8...

Flexible(Could be used for bandwidth

or other parameters) Will not bepresent unless needed.

Ron Range• 0: Ron<100�1000 �• 1: Ron<10�100 �• 2: Ron<1�10 �• 3: Ron<1�0.5 �

Function Number• 1 = SPST• 2 = SPDT• 3 = DPDT• 4 = 4:1 Multiplexer• 8 = 8:1 Multiplexer

TND310

www.onsemi.com3

Naming Convention for Clock and Data Management Devices

V = Output Type CodeNo letter is ECL

Package Suffix• D = SOIC 8/14/16• DW = Wide Body SOIC 16/20/24• DT = TSSOP 8/14/16/20/24/28• M/F = SOIC EIAJ 8/14/16/20• FA = LQFP 32/52/64• FN = PLCC 20/28• MN = QFN/DFN/LLGA

8/16/20/24/28/32/48/52 >0.8 mm thick• MT = QFN/DFN/LLGA

8/16/20/24/28/32/48/52 0.6 to 0.8 mmthick

• MU = QFN/DFN/LLGA8/16/20/24/28/32/48/52 <0.6 mm thick

• BA = FCBGA 16/49• P = Plastic DIP 8/14/16/20/24• L = Ceramic DIP 8/14/16/20/24



123456 =•Part Number

Code• (Up to 6

Numbers)

Product Class• N = Standard• S = Special/Custom• X = Pilot Production• P = Engineering Prototypes• M = HFPD spinoff from existing ECL families

Product Group••

B = Clock ManagementBA = Automotive

Possible Device Prefixes

MCMCWhSB

MCHMCWKSC

MCKNBCNBSX (Mixed Signal)

MCW (Prescaler & Wafer Sales)NBSG

X = Performance Index Code••

•

•

34

6

7

CMOSM5 Performance (3 GHz buffer, 800 MHzsynthesizer, 1.3 GHz counter)Slowed down SiGe or M5 SpecialPerformance (6 GHz buffer fmax)SiGe Performance (12 GHz buffer fmax)

==

=

=

Y = Lowest Nominal VCC Code••••••••••

UVLNRFHWGM

1.2 – 1.5 V Core1.8 V Core2.5 V Core3.3 V Core5.0 V Core2.5 V Core, 1.5 V Output2.5 V Core, 1.8 V Output3.3 V Core, 1.0 V Output3.3 V Core, 1.8 V Output3.3 V Core, 2.5 V Output

==========

••••••••••

ACGHKLMRSV

OLDCMOSMulti StandardHSTLHCSLLow Power HSCLCMLReduced Swing ECLLVDSVariable Swing

==========

N B X Y 123456 V D GR2

TND310

www.onsemi.com4

Naming Convention for Crystal Oscillator Devices

GPb−Free Designator• G = Lead−Free


YB Y Z 1N TAZ

Package Code• CLCC−6 Ceramic Module

LN

Device Function(Root Part Number)

XXX

Frequency Stability• A = 50 ppm• B = 20 ppm

ON Designator

Family Designator• BX = XO• BV = VCXO• BT = TCXO

Number of Frequency• H or S = Single• T = Triple• D = Dual• Q = Quad

• A = 3.3 V / CMOS• B = 3.3 V / LVPECL• C = 3.3 V / LVDS• D = 3.3 V / CML• E = 3.3 V / HCSL• F = 2.5 V / CMOS• G = 2.5 V / LVPECL• H = 2.5 V / LVDS• J = 2.5 V / CML• K = 2.5 V / HCSL• M = 1.8 V / CMOS• N = 1.8 V / CML• P = 2.5 V/3.3 V / LVDS

Supply Voltage / Output Signal

TND310

www.onsemi.com5

TND310

http://onsemi.com6

Naming Convention for Integrated Solutions Devices

• V = 24 Pin MLF• H = ChipFET�• B = D2PAK• C = DPAK• − Die T & R• FC = Flip−Chip• K = Micro8�• U = MicroLeadless�• QP = PLLP• SN = POWERMITE®• MN = QFN/DFN: >0.8 mm thick• MT = QFN/DFN: 0.6 to 0.8 mm thick• MU = QFN/DFN: <0.6 mm thick• P5 = SOT953• P6 = SOT963• WT = SC70• T = SC75/SC89• W1 = SC88• W5 = SC88A• A = SMA• S = SMC• D = SOIC• Z = SOT223• L = SOT23• XV5 = SOT553• XV6 = SOT563• E = SPAK• M5 = TSOP5• M = TSOP6/SC74

‘D’ before pkg designator indicates dual.‘1’ after pkg designator = latch off SMARTonly.‘2’ after pkg designator = auto−retry for Sproducts only.

T1

Package Designator


3DUN


Product Group• U = MicroIntegration�• I = Smart

Product Family• D = Driver• F = Filter• P = Protection• S = Special Function

Descriptor 2Product Family DescriptionDriver Function TypeFilter Part NumberProtection Line TypeProtection Line TypeSpecFunct/Customer Special Part No

1 3 4 X6

Symbol1

0−912

0−9

Descriptor 3, 4Product Family DescriptionDriver Part NumberFilter Part NumberProtection Part NumberSpecFunct/Customer Special

Symbol0−90−90−90−9

Symbol DefinitionRelay4 = Audio FiltersData Line OnlyData and Power Line

Descriptor 1Product Family DescriptionDrivers Legacy

LEDFilters # of FiltersProtection # of Protected LinesSpecFunct/Customer Special Part No

Symbol34

1−91−90−9


G

TND310

www.onsemi.com6

TND310

http://onsemi.com6

Naming Convention for Integrated Solutions Devices

• V = 24 Pin MLF• H = ChipFET�• B = D2PAK• C = DPAK• − Die T & R• FC = Flip−Chip• K = Micro8�• U = MicroLeadless�• QP = PLLP• SN = POWERMITE®• MN = QFN/DFN: >0.8 mm thick• MT = QFN/DFN: 0.6 to 0.8 mm thick• MU = QFN/DFN: <0.6 mm thick• P5 = SOT953• P6 = SOT963• WT = SC70• T = SC75/SC89• W1 = SC88• W5 = SC88A• A = SMA• S = SMC• D = SOIC• Z = SOT223• L = SOT23• XV5 = SOT553• XV6 = SOT563• E = SPAK• M5 = TSOP5• M = TSOP6/SC74

‘D’ before pkg designator indicates dual.‘1’ after pkg designator = latch off SMARTonly.‘2’ after pkg designator = auto−retry for Sproducts only.

T1

Package Designator


3DUN


Product Group• U = MicroIntegration�• I = Smart

Product Family• D = Driver• F = Filter• P = Protection• S = Special Function

Descriptor 2Product Family DescriptionDriver Function TypeFilter Part NumberProtection Line TypeProtection Line TypeSpecFunct/Customer Special Part No

1 3 4 X6

Symbol1

0−912

0−9

Descriptor 3, 4Product Family DescriptionDriver Part NumberFilter Part NumberProtection Part NumberSpecFunct/Customer Special

Symbol0−90−90−90−9

Symbol DefinitionRelay4 = Audio FiltersData Line OnlyData and Power Line

Descriptor 1Product Family DescriptionDrivers Legacy

LEDFilters # of FiltersProtection # of Protected LinesSpecFunct/Customer Special Part No

Symbol34

1−91−90−9


G

Naming Convention for MOS Power Devices

G

Product Class••••

NSXP

StandardSpecial/CustomPilot ProductionEngineering Prototypes

====

••••

GMTV

IGBTMicro IntegrationPower MOSFETsAutomotive MOSFETs

====

•••••••••••••

•••••

0123456789ABC

HD PlusTrench 1Standard IGBTSmart IGBTHD3ERaised PolyTMOS 7FastMOSTrench 2Trench 3Trench 4Trench 5Trench 6

=============

••••••••••••

DEFGHJLPRUU1U2

Superjunction 2SSG Trench 4SSG Trench 5GaNTrench 8Trench 7Trench 10SSG HVFETRF MOSFETUH4Superjunction Gen 1Superjunction Gen 2

============

12345

<1 to 8 V9 to 12 V13 to 20 V21 to 30 V31 to 60 V

=====

••••

6789

61 to 124 V125 to 250 V251 to 499 V500 V +

====

••••••••••••••••••••••••••••••••••••••••••••••

ABCDEFFGHJKLMNPQQRSTTUVWYZATBABDCRCTCWDPFPPLTLULWLP3P4C3C5C6ECEFEM

SC-75D2PAKChip SalesDPAKSC-89SOT-223 (Low Voltage)TO-220FP (High Voltage)TSOPChipFET™SC-88SOT-723QFN/DFN/WDFNSOIC-8SOT-1123/SOT-553/XDFN/ULLGATO-2208 mm x 8 mm (Low Voltage)TSSOP (High Voltage)SOT-23SC-70Micro8™ (Low Voltage)SOT-223 (High Voltage)SOT-953FlipChipTO-247TO-264SOT-563ATPAKTO-263 FA FormingTO-263 FD FormingDicing Ring PackingWafer Tray PackingWafer PackingTPTO-220F-3FS/3SGTO-220-3LTO-3PTO-3PFTO-247-3LCPCP4CPH3CPH5CPH6ECH8EFCPEMH8

==============================================

Product GroupPolarity/Other

Package Designator(s)

N MS N001 T1

Voltage Rating

1 3

Technology

••••••••

ABNPCFKL

Current SenseBidirectionalN ChannelP ChannelComplementaryFETKY®Temperature SenseLow Logic Level

========

••

GH

Pb-Free Plating/260cHalide Free Compound

==

•

•••••

U

STWZE

Low Gate Drive(Under 2.5 V)SenseFETTVSWafer PackESDEnhanced

=

=====

Part Number• (000 - 999) Sequential

Pb-Free/Halide Free Designator

Packaging/Tape & Reel Designator

G

•••••••••••••••

===============

M3M5M6PCSCFWVE‘D’‘L’‘S’‘F’‘G’‘J’‘Q’‘U’

MCPH3MCPH5MCPH6PCPSCH6SOIC8VEC8After Package Designator = DualAfter Package Designator = LeadlessAfter Package Designator = Single ConfigAfter Package Designator = Flat Lead (or Legacy FULLPAK™)After Package Designator = >0.80 mm ThickAfter Package Designator = 0.60 to 0.80 mm ThickAfter Package Designator = QuadAfter Package Designator = <0.60 mm Thick

•••

===

EFCEMHECH

EFCP (CSP)EMH8ECH8

Battery Protection Products

TND310

www.onsemi.com7

TND310

http://onsemi.com8

Naming Convention for SO−8 (MiniMOS�), Micro8�, SOT−223, and TSOP−6 Power MOSFETs

M

Circuit Identifier

TMOS®• M = Miniature Optional Suffix

• E = Energy Rated• HD = High Cell Density• L = Logic Level• V = TMOS V� (Five)• Z = ESD

Channel Polarity• N or P• C = Complementary

SF R1

Package Type• DF = Dual FET (SO−8)• SF = Single FET (SO−8)• FT = FET Transistor (SOT−223)• MTSF = Single FET (Micro8)• MTDF = Dual FET (Micro8)• MGSF = TSOP−6, SOT−23

Voltage Rating(Divided by 10)

M 4 P 01

Current

HD


PREVIOUS FORMAT 1

PREVIOUS FORMAT 2 T

Circuit Identifier• X = Engineering Samples

TMOS®• T = TMOS• L = SMARTDISCRETES�• G = IGBT (Except MGSF)

Optional Suffix• L = Logic Level• E = Energy Rated• T4 = Tape & Reel (DPAK/D2PAK)• RL = Tape & Reel (DPAK)• HD = High Cell Density• V = TMOS V� (Five)

Current

Channel Polarity• N or P

75 HD

Package Type• P = Plastic TO−220• D = DPAK• A = TO−220 Isolated• W = TO−247• B = D2PAK• Y = TO−264


M P N 06

M

Circuit Identifier

TMOS®• M = Miniature Voltage + 10

Technology• 5 = Trench• 4 = HD3e• 3 = HD3• 1 = HD1

SF 05


M 4 2

Even = N ChannelOdd = P Channel

PREVIOUS FORMAT 3

TND310

www.onsemi.com8

TND310

http://onsemi.com8

Naming Convention for SO−8 (MiniMOS�), Micro8�, SOT−223, and TSOP−6 Power MOSFETs

M

Circuit Identifier

TMOS®• M = Miniature Optional Suffix

• E = Energy Rated• HD = High Cell Density• L = Logic Level• V = TMOS V� (Five)• Z = ESD

Channel Polarity• N or P• C = Complementary

SF R1



M 4 P 01

Current

HD


PREVIOUS FORMAT 1

PREVIOUS FORMAT 2 T

Circuit Identifier• X = Engineering Samples

TMOS®• T = TMOS• L = SMARTDISCRETES�• G = IGBT (Except MGSF)

Optional Suffix• L = Logic Level• E = Energy Rated• T4 = Tape & Reel (DPAK/D2PAK)• RL = Tape & Reel (DPAK)• HD = High Cell Density• V = TMOS V� (Five)

Current

Channel Polarity• N or P

75 HD

Package Type• P = Plastic TO−220• D = DPAK• A = TO−220 Isolated• W = TO−247• B = D2PAK• Y = TO−264


M P N 06

M

Circuit Identifier

TMOS®• M = Miniature Voltage + 10

Technology• 5 = Trench• 4 = HD3e• 3 = HD3• 1 = HD1

SF 05


M 4 2

Even = N ChannelOdd = P Channel

PREVIOUS FORMAT 3

TND310

http://onsemi.com9

Naming Convention for Bipolar Power Devices

Product Class• M, MM, N = Standard• S = Special/Custom

Product Group• J = Bipolar Power

Optional Suffix(1 to 2 characters)• A = Audio Grade• D = Integrated Diode• D2 = Built−in Antisaturation Network• FP = Waffle Pack• WP = Wafer Pack

N

Package Designator• = TO−3• B = D2PAK• C = Bare Die• D = DPAK• E = TO−220 or Case 77• EC = Bare Die• F = TO−220 Full PAK• H = TO−218• L = TO−264• T = SOT−223• W = TO−247

J T 1 2 3 4 5 WT T1 GPREFIX


Pb−Free Designator• G = Lead−FreeDevice Identification Code

(2 to 5 digits/characters)

STEM

TND310

www.onsemi.com9

TND310

http://onsemi.com10

Naming Convention for Bipolar Power

I

Optional Suffix• WP = Wafer Pack

PT 1 2 WPREVIOUS FORMAT 1 3 4 GPREFIX STEM

Device Identification Code(2 to 4 digits/characters)C prefix denotes bare die

T


J

Optional Suffix• Z = Built−in Zener Clamp

TB 1 2PREVIOUS FORMAT 2 3 4 GPREFIX STEM

Device Identification Code(3 to 4 digits/characters)


5 T T1


Package Designator• D = Case 77, TO−218 or TO−220• UC = Bare Die• UD = DPAK• UH = Case 77 or TO−220• UL = TO−220 or TO−220 Full PAK• UV = TO−220 or TO−3• UX = TO−220

N2 1 2PREVIOUS FORMAT 3 3 4 GPREFIX STEM



5

TND310

www.onsemi.com10

TND310

http://onsemi.com10

Naming Convention for Bipolar Power

I

Optional Suffix• WP = Wafer Pack

PT 1 2 WPREVIOUS FORMAT 1 3 4 GPREFIX STEM


T


J

Optional Suffix• Z = Built−in Zener Clamp

TB 1 2PREVIOUS FORMAT 2 3 4 GPREFIX STEM

Device Identification Code(3 to 4 digits/characters)


5 T T1


Package Designator• D = Case 77, TO−218 or TO−220• UC = Bare Die• UD = DPAK• UH = Case 77 or TO−220• UL = TO−220 or TO−220 Full PAK• UV = TO−220 or TO−3• UX = TO−220

N2 1 2PREVIOUS FORMAT 3 3 4 GPREFIX STEM



5

TND310

http://onsemi.com11

VR

Naming Convention for Rectifier Devices

PART NUMBER KEY XXX X XX XX XX

PREFIX

R = REVERSEL = LOW VFE = ENERGY

SUFFIX

(TYPE DESIGNATOR)F = FULLY ISOLATEDA = SURFACE MT (SMA)S = SURFACE MT (SMB/SMC)D = DPAKB = D2PAKH = MEGAHERTZM = POWERMITE�P = POWERTAP�I = IPAK

IO(X10 EXCEPTSCHOTTKY)

(DUAL DESIGNATOR)

PREFIX KEY MUR = ULTRA FAST RECTIFIERMBR = (SCHOTTKY) BARRIER RECTIFIERMR = STANDARD & FAST RECOVERYMSR = ULTRASOFT

SUFFIX KEY CT = CENTER TAP (DUAL) TO−220, POWERTAP, DPAK, D2PAKPT = CENTER TAP (DUAL) TO−218 PACKAGEWT = CENTER TAP (DUAL) TO−247SF = SOD−123 FLAT LEADPF = POWER FACTOR CORRECTION SPECIFIC

EXAMPLE: MUR 30 20 WTULTRAFAST 30 AMP 200 V CENTER TAP (DUAL) TO−247

EXAMPLE: MBR 30 45 WTSCHOTTKY 30 AMP 45 V CENTER TAP (DUAL) TO−247


XXX G


TND310

www.onsemi.com11

TND310

http://onsemi.com12

Naming Convention for FMO Bump

AF 1 5 1 0 X

Bump Location• A = ASE−Kaoshiung• F = Flip−Chip Int’l.• M = Amkor• S = Seremban• I = ICI

0 0 5 E G B E.

Place HolderDefault alpha “A’’ or “C’’.(Note: This field was originallyused to indicate test location.The field is no longer used.)

5−Character Part ID0000x−9999x(Should correspond to FGpart number root.Performance options maybe included in this field aswell. All 5 characters shouldbe populated. “0’’ may beused as a place holder.)

Stage of Completion• BE = Bump Assy.• DP = Die Probe• DC = Die Conversion

Bump Composition• G = Lead−Free• E = Eutectic

Fab/Foundry Site• Z = Aizu• E = Erfurt (XFAB)• I = Israel (Tower)• L = Lubbock (XFAB)• P = Phoenix (COM1)• S = Seremban (ISMF)• R = Roznov• Y = Piestany

2−Character MaskRevision(Use leading “0’’ forsingle−digit revision levels)

Wafer Fab/Foundry• Z = Aizu• C = COM1• I = ISMF• T = Tower• X = XFAB• R = Roznov• Y = Piestany

Naming Convention for Ambient Light Sensor Devices

Product Class• N = ON Semiconductor

Product Group• O = Opto

Package Designator• CU = CUDFN• DC = CTSSOP• W = Wafer

N

Product Family• A = Ambient Light Sensor

O A 1 2 01 V DC R GPREFIX



ROOT

Function• 1 = Ambient Light Sensor• 2 = Proximity Sensor• 3 = Multiple• 4 = Hue/Color

Output• 2 = Analog• 3 = Digital• 4 = Multiple

Temp Range/Quality Grade*• V = Vehicular (Automotive)

* Optional

Sequence

TND310

http://onsemi.com14

Naming Convention for Photo Diode Array Devices



Package Designator• CD = CerDIP

N

Product Family• P = Photo Diode Array

O P 0256 CD R GPREFIX



ROOT

Resolution• 0256 = 256 pixels• 0512 = 512 pixels• 1024 = 1024 pixels

Naming Convention for LED/Lighting Products

LNC 3 0 A

Circuit Identifier• N = ON Semiconductor• C = Integrated Circuit

0 0 R2

Device Identifier

Numeric Attributes*• Voltage or Frequency

Indicator

Alpha Attributes*• A = Close Tolerance• C = Commercial Temp Range• H = High Active or High True• L = Low Active or Low True• X = Extended Temp Range

Product Family• L = Lighting/SSL• N = Advanced Interface• P = Power Management• S = Signal• T = Thermal Management• V = Vehicular• Y = Specials/Customs

0 0 0

Package Designator• 1 to 3 Digits


X X X

* Optional

TND310

www.onsemi.com12

TND310

http://onsemi.com12


AF 1 5 1 0 X


0 0 5 E G B E.












N





ROOT




* Optional

Sequence

TND310

http://onsemi.com14





N





ROOT



LNC 3 0 A


0 0 R2

Device Identifier


Indicator



0 0 0



X X X

* Optional

TND310

http://onsemi.com15

Naming Convention for I2C Serial EEPROMs(Formerly Catalyst Semiconductor)

Product Group

Product ClassT = Standard ProductV = Automotive Grade Product

Package DesignatorHU3 = UDFN, 2 x 3 x 0.5 mmHU4 = UDFN, 2 x 3 mm, 0.5P, Extended Pad HU5 = UDFN, COL, 2 x 3 mmL = PDIP, 300 milsTD = TSOT−23, 1.6 x 2.9 x 1.00 mmVP2 = TDFN, 2 x 3 x 0.75 mmW = SOICX = SOICY = TSSOP, 4.4 mmZ = MSOP, 3 x 3 mmZD2 = TDFN, 3 x 4.9 x 0.75 mm

Temperature RangeI = Industrial (−40°C to +85°C)E = Extended (−40°C to +125°C)

Plating FinishG = NiPdAu, RoHS CompatibleBlank = Matte−Tin, RoHS Compatible

Tape & Reel DesignatorT = Tape & ReelN = Number of Thousands Pieces/Reel

Product Family24C = I2C Serial EEPROM

Memory Density01 = 1 Kb02 = 2 Kb04 = 4 Kb08 = 8 Kb16 = 16 Kb32 = 32 Kb64 = 64 Kb128 = 128 Kb256 = 256 Kb512 = 512 Kb(M) 01 = 1024 Kb

ROOT

Naming Convention for SPI Serial EEPROMs(Formerly Catalyst Semiconductor)

Product Group


Package DesignatorHU2 = UDFN, 2 x 2 x 0.5 mmHU3 = UDFN, 2 x 3 x 0.5 mmHU4 = UDFN, 2 x 3 mm, 0.5P, Extended Pad L = PDIP, 300 milsV = SOICVP2 = TDFN, 2 x 3 x 0.75 mmX = SOICY = TSSOP, 4.4 mmZ = MSOP, 3 x 3 mmZD2 = TDFN, 3 x 4.9 x 0.75 mm




Product Family25 = SPI Serial EEPROM

Memory Density010 = 1 Kb020 = 2 Kb040 = 4 Kb080 = 8 Kb160 = 16 Kb320 = 32 Kb640 = 64 Kb128 = 128 Kb256 = 256 Kb512 = 512 Kb(M) 01 = 1024 Kb

ROOT

CA T 24C AAA P TNGT −

CA T 25 AAA P TNGT −

TND310

www.onsemi.com13

TND310

http://onsemi.com16

Naming Convention for Microwire Serial EEPROMs(Formerly Catalyst Semiconductor)

Product Group


Package DesignatorL = PDIP, 300 milsTB = SOT−143, 1.30 x 2.90 x 1.22 mmV = SOICVP2 = TDFN, 2 x 3 x 0.75 mmW = SOICX = SOICY = TSSOP, 4.4 mmZD4 = TDFN, 3 x 3 x 0.75 mm




Product Family93C = Microwire Serial EEPROM

Memory Density46 = 1 kb46R = 1 kb56 = 2 kb57 = 2 kb66 = 4 kb76 = 8 kb86 = 16 kb

ROOT

Naming Convention for Low Drop Out (LDO) Products(Formerly Catalyst Semiconductor)

Product Group

Product ClassT = Standard Product

Package DesignatorSD = SC−70, 1.25 x 2.0 x 1.1 mmTB = SOT−143, 1.30 x 2.90 x 1.22 mmTD = TSOT−23, 1.60 x 2.9 x 1.00 mmUL = ULLGAV = SOICZ = MSOP, 3 x 3 mm



Product FamilyLow Drop Out (LDO)

Voltage Indicator125150180240

250270280285

300330ADJ

ROOT


CA T 6xxx AAA TNGP−

Naming Convention for EEPROM Memory

S 8 A 1 GE A 2M WC-

Memory Type• E EEPROM=

••

AI

AudiologyImplantable

==

• 2M 2 Mb=

Industry Designator

Interface

Memory Size

••

IS

I2CSPI

==

Green••

GL

GreenLeaded

==

Die Revision• 1 1st Revision=

• 8 8 Pins/Balls=

Carrier Type•••

ATU

Tape & ReelTraysTubes

===

Package•••••

ABBDDQ

HybridBGABumped DieDFNQFN

=====

••••

SUDWWC

System in Package (SiP)Unbumped DieWLCSPWLCSP with Backside Coating

====

Number of Pins/Balls

TND310

www.onsemi.com14

TND310

http://onsemi.com16


Product Group








ROOT


Product Group







250270280285

300330ADJ

ROOT



Naming Convention for Memory Products

S 6 H A 2 I L TN 25 30 S2

Product Class• N ON Semiconductor=

••••

64250102

64 kb256 kb1 Mb2 Mb

====

•••

040809

4 Mb8 Mb9 Mb

===

Type

Density

•••

864

x8x16x40

===

•••

LSM

LP SRAMSerial RAMMedical

===

•••

CIF

ComboSoCFlash

===

IO

Carrier Type• T Tape & Reel=

••

IM

IndustrialMedical

==

• E Extended=

Optional• L Low Power Sort=

Temperature

(May be used for customer ID)

Package – Based on Type

Chipset Revision•••

ABC

Original1st Revision2nd Revision

===

••

DE

3rd Revision4th Revision

==

Voltage•••

121820

1.2 V1.8 V2.0 V

===

•••

223033

2.2 V3.0 V3.3 V

===

Feature – Based on Type

•••

123

One CEDual CEOE Control

===

••

12

Level 1Level 2

==

• H Hold=•••

136

16 MB32 MB64 MB

===

Type = L

Type = S

Type = M, I

Type = C

Speed – Based on Type

•••••

57891

55 ns70 ns85 ns90 ns100 ns

=====

••

12

16 MHz20 MHz

==

Customer Specific

Type = L (C) Type = S

Type = M, I (C)

••

WD

WaferDie

==

••••••

TBNT2B2N2

TSOPBGAsTSOPGreen TSOPGreen BGAGreen sTSOP

======

••

S2T2

Green SOICGreen TSSOP

==

••

MM2

66-BGAGreen 66-BGA

==

Type = L, M, I Type = S

Type = C

TND310

www.onsemi.com15

TND310

http://onsemi.com17

Naming Convention for Supervisor Products(Formerly Catalyst Semiconductor)

Product Group






Product FamilySupervisor

Voltage IndicatorA = 1.68 V C = 2.40 V F = 4.20 V L = 4.63 VH = 4.55 VM = 4.38 VJ = 4.00 V

T = 3.08 VS = 2.93 VR = 2.63 VZ = 2.32 VV = 1.60 VW = 1.67 V

ROOT

Naming Convention for Charge Pumps, LED Drivers and I/O Bus Products(Formerly Catalyst Semiconductor)

Product Group


Package DesignatorHU2 = UDFN, 2 x 2 x 0.5 mmHV2 = TDFN, 3 x 3 x 0.75 mmHV3 = TQFN, 3 x 3 x 0.75 mmHV4 = TQFN, 4 x 4 x 0.75 mmHV6 = TQFN, 4 x 4 x 0.75 mmMT4 = TDFN, 2.0 x 2.0 (2 flags)SD = SC−70, 1.25 x 2.0 x 1.1 mmTD = TSOT−23, 1.6 x 2.9 x 1.0 mm

TV = TO−263 V = SOICVP2 = TDFN, 2 x 3 x 0.75 mmVS = QSOP, 150 milsW = SOICY = TSSOP, 4.4 mmZ = MSOP, 3 x 3 mmZD4 = TDFN, 3 x 3 x 0.75 mm




Product Family3xxx = Non−inductive converters and LED Driver Charge Pumps4xxx = LED Drivers (Non−Charge pump type)9xxx = I/O Bus Products

ROOT

CA T 8xxx PA TNGT −

CA T Xxxx P TNGT −

TND310

http://onsemi.com16


Product Group








ROOT


Product Group







250270280285

300330ADJ

ROOT



TND310

www.onsemi.com16

TND310

http://onsemi.com17


Product Group








T = 3.08 VS = 2.93 VR = 2.63 VZ = 2.32 VV = 1.60 VW = 1.67 V

ROOT


Product Group








ROOT



TND310

http://onsemi.com17


Product Group








T = 3.08 VS = 2.93 VR = 2.63 VZ = 2.32 VV = 1.60 VW = 1.67 V

ROOT


Product Group








ROOT



TND310

http://onsemi.com18

Naming Convention for Digital Programmable Potentiometers andSupervisor with Memory Products

(Formerly Catalyst Semiconductor)

Product Group


Package DesignatorL = PDIP, 300 milsSD = SC−70, 1.25 x 2.0 x 1.1 mmTD = TSOT−23, 1.6 x 2.9 x 1.00 mmTB = SOT−143, 1.30 x 2.90 x 1.22 mmTD = TSOT−23, 1.6 x 2.9 x 1.00 mmV = SOICVP2 = TDFN, 2 x 3 x 0.75 mmW = SOICY = TSSOP, 4.4 mmZ = MSOP, 3 x 3 mmZD2 = TDFN, 3 x 4.9 x 0.75 mmZD4 = TDFN, 3 x 3 x 0.75 mm

Threshold Voltage Designator252830

4245




Product Family1xxx = Supervisor with Memory Products5xxx = Digital Programmable Potentiometers

ROOT

CA T Xxxx P T TNGAA −−

TND310

http://onsemi.com16


Product Group








ROOT


Product Group







250270280285

300330ADJ

ROOT



TND310

www.onsemi.com17

TND310

http://onsemi.com19

Naming Convention and Ordering Information forASIC Devices

Device Number �

�

�

�

�

�

�

�

�

�

�

�

Packing Form DesignatorXWFXSWXDWXDIXDFXDSXUDXUPXTDXTPXPDXMD

= Wafer Form= Sorted Wafer= Die in Wafer Form= Die= Die in File Frame= Die in Tape= Untested and Packaged= Untested and Packaged in Tape & Reel= Tested and Packaged in Trays or Tubes= Tested and Packaged in Tape & Reel= Photo Diode Array= Module

5−3 Digit Alpha−Numeric

Notes:1. Not all packing forms are available for each product.2. Contact ON Semicondcutor Customer Service for more details.

12345−123 − ABC

TND310

http://onsemi.com18

TND310

www.onsemi.com18

TND310

http://onsemi.com19

Naming Convention and Ordering Information forASIC Devices

Device Number �

�

�

�

�

�

�

�

�

�

�

�

Packing Form DesignatorXWFXSWXDWXDIXDFXDSXUDXUPXTDXTPXPDXMD

= Wafer Form= Sorted Wafer= Die in Wafer Form= Die= Die in File Frame= Die in Tape= Untested and Packaged= Untested and Packaged in Tape & Reel= Tested and Packaged in Trays or Tubes= Tested and Packaged in Tape & Reel= Photo Diode Array= Module

5−3 Digit Alpha−Numeric

Notes:1. Not all packing forms are available for each product.2. Contact ON Semicondcutor Customer Service for more details.

12345−123 − ABC

TND310

http://onsemi.com12


AF 1 5 1 0 X


0 0 5 E G B E.












N





ROOT




* Optional

Sequence

TND310

http://onsemi.com14





N





ROOT



LNC 3 0 A


0 0 R2

Device Identifier


Indicator



0 0 0



X X X

* Optional

TND310

www.onsemi.com19

TND310

http://onsemi.com13

Naming Convention for Contact Image Sensor Devices



Package Designator• U = Untested Wafer• W = Wafer

N

Product Family• C = Contact Image Sensor

O C 02 2 01 UPREFIX ROOT

Resolution• 02 = 200 dpi• 03 = 300 dpi• 04 = 400 dpi• 06 = 600 dpi• 12 = 1200 dpi• 24 = 2400 dpi

Speed• 5 = 5 MHz• 6 = 6 MHz• 8 = 8 MHz• A = 10 MHz

Sequence

Naming Convention for Contact Image Sensor Modules




N

Product Family• M = Contact Image Sensor Module

O M 02 A2 01 GPREFIX ROOT


LED• R = Red• B = Blue• G = Green• W = White• U = Ultraviolet

Misc & Special Option Number

• Y = Yellow• I = Infrared• C = RGB• M = Multiple• X = None

−

Output• A = Analog• D = Digital• M = Multiple

Dash

RA

Size• A2• A3• A4• A6

• A7• A8• B4• AS

TND310

www.onsemi.com20

TND310

http://onsemi.com13

Naming Convention for Contact Image Sensor Devices



Package Designator• U = Untested Wafer• W = Wafer

N

Product Family• C = Contact Image Sensor

O C 02 2 01 UPREFIX ROOT


Speed• 5 = 5 MHz• 6 = 6 MHz• 8 = 8 MHz• A = 10 MHz

Sequence

Naming Convention for Contact Image Sensor Modules




N

Product Family• M = Contact Image Sensor Module

O M 02 A2 01 GPREFIX ROOT


LED• R = Red• B = Blue• G = Green• W = White• U = Ultraviolet

Misc & Special Option Number

• Y = Yellow• I = Infrared• C = RGB• M = Multiple• X = None

−

Output• A = Analog• D = Digital• M = Multiple

Dash

RA

Size• A2• A3• A4• A6

• A7• A8• B4• AS

Naming Convention for Image Sensors(Formerly Cypress Semiconductor)

Product Class• N ON Semiconductor=

Product Group• O Opto=

Product Category•••••

ACIMP

Ambient Light SensorContact Image SensorImage SensorImage Sensor ModulePhoto Diode Array

=====

Process•••

BFS

BSINIR EnhancedStandard

===

Additional Functionality•••••

ABSTU

DefaultAdditional FeaturesSpace, Level 1Space, Level 2Space, Level 3

QFN/QFPPGA/μPGAJLDCCLGALCCCSPWafer SalesBare Die

=====

Package••••••••

FGHLQSWX

========

Color••••••••

CEFGMNPR

ColorColor MicrolensColor Microlens CRA Option 1Color Microlens CRA Option 2MonochromeMono MicrolensMono Microlens CRA Option 1Mono Microlens CRA Option 2

========

•••••••••

CPH2H3I4I5L1L2P1P2

Custom ProductHAS 2HAS 3IBIS 4IBIS 5LUPALUPA 2PYTHON LVDSPYTHON CMOS

=========

•••••••••

P3M1M2S1V1V2X1X2X3

PYTHON LVDS OPTIONMANO LVDSMANO CMOSSTARVITA LVDSVITA CMOS24 Port XGS12 Port XGS6 Port XGS

=========

•••••••••••

02500300048005001000130016002000300040005000

0.25 MP0.3 MP0.48 MP0.5 MP1.0 MP1.3 MP1.6 MP2.0 MP3.0 MP4.0 MP5.0 MP

===========

•••••••••••

66008000900094009600010K012K014K016K025KCustom Name

6.6 MP8.0 MP9.0 MP9.4 MP9.6 MP10 MP12 MP14 MP16 MP25 MP

==========

Product Family

Resolution

AF45D263 AR/ARD263 AR/IRD263D263 ARBK7G18 ARN-BK7 AR/AR

Glass•••••••

ABCDEHJ

=======

Commercial 0 to +70°CIndustrial -40 to +85°C

Temperature••

CI

==

N-BK7 IR/ARABCSapphireProtective Tape onDefault Glass LidWindowless

••••

•

KOST

W

====

=

N O I S N A – Q D I1300P1

TND310

www.onsemi.com21

Naming Convention for Image Sensors(Formerly Truesense Imaging, Inc.)

Product Line• K Image Sensors=

•••••••

AFAIAELISCACAT

Full Frame CCDInterline CCDInterline EMCCDLinear CCDSupport ChipCMOSTDI CCD

=======

Specified in units of 100 K pixels,e.g. 290 = 29.0 Mega Pixels

•••••••••••••••••

ABCDEFGHJLMNPQRSX

No CFA (Monochrome)Pigment, Bayer CMYPigment, Bayer RGBPigment, Linear RGB3G StaggerPigment, Bayer RGB, Gen 2Striped RGRBRB CheckerboardHybrid DichroicRBG and MonoMono with RB SurroundPigment, Bayer RGB, Shorter Red WavelengthSparse CFA Pattern ASparse CFA Pattern A, Gen 2Pigment, Linear RGB, Gen2Mono with RB Surround, Gen2Special

=================

Family Designation

Sequence (2 Digits)

Resolution (2 or 3 Digits)

Color Filter Array

•••••

•

•

•

•

•

0123A

C

E

T

M

X

=====

=

=

=

=

=

Product Grade

•••••••••

ABCDEFGHX

StandardStandard with Defect MapNon-StandardNon-Standard with Defect MapLow TemperatureLow Temperature with Defect MapCustomer SpecificStandard with Special VisualSpecial

=========

Testing Method

••••••••••••••••

ABCDEFGHJKLPQRSX

No GlassClear, No CoatingsClear, AR Coated 1 SideClear, AR Coated 2 SidesClear, AR Coated Side 1, IR Coated Side 2Quartz, No CoatingsPlastic, No CoatingsIR Absorbing, AR Coated 2 SidesClear, AR Coated 2 Sides, with Light ShieldQuartz, AR Coated 2 SidesHermetic, AR Coated 2 SidesClear, No Coatings (Taped)Clear, AR Coated 1 Side (Taped)Clear, AR Coated 2 Sides (Taped)Quartz, No Coatings (Taped)Special

================

Cover Glass

•••••••••

ABCDEFGHJ

Wafer Form (No Pkg)Die Form (No Pkg)Cerdip, Sidebrazed PinsCerdip, Sidebrazed Pins, CuWCerdip, LeadframeCLCCPLCCPlastic DIPPGA

=========

•••••••••

KLMNPQRSX

PGA, CuW BaseQFPCSPBare Die, Reconstituted WaferPolyimide SubstrateAluminum Nitride SubstratepLLPPGA, CuW Base, TEC CoolerSpecial

=========

Package

••••

•

ABCD

X

No microlensesTelecentric microlensesCylindrical microlensesNone with spacer (Not for UV or bundle attachment)Special

====

=

Microlens

Product Revision

Highest Grade (Fewest Cosmetic Defects)Cosmetic Specs Relaxed Relative to Grade 0Cosmetic Specs Relaxed Relative to Grade 1Cosmetic Specs Relaxed Relative to Grade 2Standard Grade: Used when only one grade is available for a given product.Commercial Grade: Meets all specification criteria, but have not been fully qualified. Intended for evaluation purposes only and have NO warranty. Quantities are strictly limited and sold only “as available”.Engineering Grade: Electrically functional and meet most, but not necessarily all, product performance specifications, however there are no limitations on the number of or size of cosmetic defects (points, clusters, columns, glass defects, etc.) allowed. Intended for evaluation purposes only and have NO warranty. Quantities are strictly limited and sold only “as available”.Test Sample: Closely resembles the performance of the final product, however may not meet any of the specification criteria. Intended for evaluation purposes only and have NO warranty. Quantities are strictly limited and sold only “as available”.Mechanical Sample: Meets all physical dimensions and tolerances and likely does not image. Intended for evaluation purposes only and have NO warranty. Quantities are strictly limited and sold only “as available”.Special

-K AI 290 50 - CXA - DD - AA

TND310

www.onsemi.com22

Naming Convention for Image Sensors(Formerly Aptina Imaging Corporation)

Product Line• A Image Sensors=

••••

SRPT

SOCRAW SensorISPTest Chip

====

•••

GBD

GenericBridgeDowngrade

===

Product Type

••••••••••••

Y1Y2Y9X1X90199B1B2B3B4B5

0.01 Megapixel0.02 Megapixel0.09 Megapixel0.1 Megapixel0.9 Megapixel1 Megapixel99 MegapixelDemo3 Base BoardDemo3 Adapter - Old Style HBDemo2x Adapter - New Style HBICP Adapter BoardStereo Receiver Board

============

Resolution

••••••

CSLCHQQPHDM0

Default, CMOS SensorLow CostPremiumDowngradeHigh DefinitionModule

======

••••••

HSAIATMBSRCM

High SpeedArray ImagerAutomotiveMobileSurveillanceMedical

======

••••

NBCMSCCP

NotebookCameraScanningClarity+

====

Marketing Descriptor

•••••

01234

>1” or ISP1”1/2”1/3”1/4”

=====

•••••

56789

1/5”1/6”1/7”1/8”1/9”

=====

•••••

ABCDN

1/10”1/11”1/12”1/13”N/A

=====

Optical Format

••••••

CMYRGB

RGBMonochromeCMYRCCCRGBCRCBC

======

••••••

SLANDF

CommonLogicColor ArrayMono ArrayRCCBRYYB

======

Chromaticity

••••

“0”“1”“2”“3”

– FD = 0, EDOF = 0– FD = 1, EDOF = 1– FD = 1, EDOF = 0– FD = 0, EDOF = 1

(OR) IP Control for ICP

Must increment for a new product with the same resolution and optical format (e.g., each new ¼” VGA part increments this by one). Sequence 0, 1, 2…9, A, B,…Z .

Provides marketing ability to add additional descriptive informationthat may be helpful in positioning the part.

Unique Product Identifier (ID)

Defaulted to “S”, 2~9 Major “Imager Customer” Revision

•••••••••

ABCDEFGHJ

CLCCPLCCILCCDie SalesIBGALBGAVFBGACPGATPLCC

=========

•••••••••

KLMNPQRWY

CSPWLCCLGAimBGAtpBGAiCBGAmPLCCWafer Sales (EA)Wafer Sales (WFR)

=========

Package Type

•••••••

ABCDEFZ

Lead FreeLeadedHalogen Free7.5 x 7.5 Lead Free9.5 x 9.5 Lead Free5.5 x 5.5 Lead FreeBIB/HIB Option(Different Bond Option)

=======

•••••••

0123469

Module100 μm Thickness200 μm Thickness305 μm Thickness400 μm Thickness675 μm ThicknessNo-Grinding

=======

Package Options

•••••••••••

0DHDGABCFLJ

Default, N/ADemo BoardHead BoardHigh SpeedWLM Socketed BoardEMI PadNon-CoatingWithout EMI ShieldingWith Flash Stacked DieLow CostLow Profile

===========

•

••

•

•••

K

MN

P

WD3Q

Dual Sensor (3D)HeadboardALTM OnlyDifferent PackageSizeDual Sensor (3D)Demo KitDemo ModuleDemo Kit (Demo3)Adapter/FBGA/ASIC Board

=

==

=

===

Special Options

Customer specific attributeCustomer Special

•••••

EMGEVBGEVKBlank

Base Part Number

=====

Eng Identifier (AS/ES/QS)Mechanical SampleDemo BoardDemo KitProduction Part

Sample and Demo Board Identifier

See definitions on following page

Mechanical Finish, Glass, Wafer Thickness*

••••

MCHU

MIPICCP/CCP2HISPIMULTI

====

••••

NPLS

N/APARALLELLVDSSLVS

====

Interface Type

••••

SAXN

CommercialAutomotive (–40 to +85°C)Extended (–40 to +105°C)N/A

====

Operating Temp“00” as N/A, otherwise will show the actual degree shift

CRA Degree

A S 4 0 8 C S H E05 22 XX YYYYYHD D2 - --0

TND310

www.onsemi.com23

Naming Convention for Image Sensors(Formerly Aptina Imaging Corporation)

•••

DTC

Dry PackTape & ReelChiptray

===

Mechanical Finish•

••

BR

IRBlank

Double SideBBAR GlassIRStandard Glass

=

==

Glass Type

••

PR

With Protective FilmWithout Protective Film

==

Protective Film

Packaged Parts

• 200 Wafer Thickness=Wafer Thickness

Wafer and Die Sales

••

S213AS115

DSL213ASUNEX_DSL115

==

Machanical Finish

Demo Board Special

- D P BR

- 200

- S213A

TND310

www.onsemi.com24

Naming Convention for Legacy Image Sensors(Formerly Aptina Imaging Corporation)

Product Line• MT9 Image Sensors, Legacy=

•••••••

CVMDTQP

CIFVGA1 Meg2 Meg3 Meg4 Meg5 Meg

=======

•••••••

ENJWFHS

8 Meg9 Meg10 Meg12 Meg14 Meg16 MegSpecial/Custom

=======

Product Size

••••

0123

Sensor OnlySOC“Open”DSP

====

•••

456

High SpeedCustomOthers

===

Product Type

••

01

Consumer CameraMobile/PC

==

••

23

Automotive/IndustrialSurveillance

==

Product Group

••••••

CMRGYL

RGB (Red, Green, Blue)MonochromeRed/ClearRGBCCMY (Cyan, Magenta, Yellow)Logic - IP “00”

======

Chromaticity

•••••••

ASESMSMCI:X

Alpha SampleEngineering SampleMechanical SampleModule Camera Demo SystemErrataDID Mark Designator

======

Blank Mass Production=

Special Processing

Must increment for a new product with the same resolution and optical format (e.g., each new ¼” VGA part increments this by one). Sequence 0, 1, 2…9, A, B,…Z .

Unique Product Identifier (ID)

••••••••••••••••••••••••••••••••••

ABCDEFGHIJKLMNPQLCRST3UVWXYZPF2345678

Lens Head Board and Adapter KitNon-Standard CRANon-Standard CRA 27 DegreesDemo BoardRecon (RDL)Frame GrabberWLM Socketed HeadboardHead BoardIR GlassJPEG OutputSpecial Die OffsetLens Eval KitMiPiNo LidCCPOptical QualityLow CostReference CameraHigh SpeedTier 3Parallel InterfaceSerial InterfaceNTUBNo Micro LensBlack Solder MaskNon-Standard Micro Lens ShiftProtective Film200 μm Wafer Thickness305 μm Wafer Thickness200 μm Thick Cover Glass300 μm Thick Cover Glass675 μm Wafer ThicknessEMI PadNon-Coating

==================================

Special Options

Six characters will appear for Die/Wafer Only

Design ID and Probe/Test Level

•••

STATXT

CommercialAutomotiveExtended

===

Operating Temp

••••

ACXE

TSV-RDLCeramicXintecTessera

====

••••

PSIL

PlasticShellcaseImagerLaminate

====

•••

TZM

TinyCWL CSPWLC

===

Material/ConstructionPACKAGE CODE

••••••••

01234567

3228486414420828052

========

••••••••

89ABCDEF

3044351384137/1691638

========

•••••••

GHJKLMN

11612254255567120

=======

Leads/Bumps/Pins

•••••••

0123456

CSPLCC Pb-FreeICSPPGAQFPCustomBumped

=======

•••••••

789ABCD

BGACSP Pb-FreeICSP Pb-FreeBGA Pb-FreeMVPNon-Bumped TSV-RDLLow Profile

=======

Package Type

Form

•••

DWM

Singulated DieDie in Wafer FormModule

===

•••

BRV

Demo Base BoardDemo Received BoardLVDS Adapter Board

===

Form 1: Form

Form 2 = 0

Form 3 = 0

Note: If using Form 1, Form 2 (Package Type) and Form 3 (Leads/Bumps/Pins) will be “0”

MT9 J 0 1 ST C xxxxxx0 ESI12 V

TND310

www.onsemi.com25

Naming Convention for Preconfigured Hearing Products

Naming Convention for Open-Programmable Hearing Products

Family Designation••

AR

AYRERHYTHM

==

• 3 Wolverine=

•••••

13579

BasicLowMidHighPremium

=====

Platform Gerenation

Configuration

Feature Set

••••

ABCD

OriginalFirst RevisionSecond RevisionThird Revision

====

Chipset Revision

••

1020

1st Configuration2nd Configuration

==

Packing Format•••

TWB

Tape & ReelWaffle PackBubble Pack

===

JESD97 Indetification••

E1E6

SnAgCuContains Bi

==

Package Revision•••

ABC


===

Package••••

ABCD

HybridDieWaferPrinted Substrate

====

••••

EFGH

SMT PCBSMT FlexSubmoduleAssembly

====

Memory••••

ABCD

No MemoryOTP64 kb256 kb

====

•••

EFG

512 kb1 Mb2 Mb

===

R C F A B T3 9 10 E1- -

Family Designation• E EZAIRO=

••••

59627188

EzairoEzairo PlusEzairo “NP5”Ezairo “NP6”

====

Configuration

Feature Set

••

12

FirstSecond

==

Chip Version

••

1020


==

Green••

GL

GreenLeaded

==


A (7100)A (7110)B (7110)

Tape & Reel; MOQ 5,000Tape & Reel; MOQ 500Tape & Reel; MOQ 500

===

Number of Pins/BallsNumeric Value

•••

TUW

TraysTubesWafer Box

===


ABBDHQ

HybridBGABumped DieAssemblyWFN

=====

•••••

SUDWDWWC

System in Package (SiP)Unbumped DieWafer in Die QuantityWLCSPWLCSP with Backside Coating

=====

E 1 A G10 33- 01 WD71

Chipset Revision (Major)•••

000102


==

-

TND310

www.onsemi.com26

Naming Convention for Custom Hearing Products

Naming Convention for BelaSigna Products

C C F A B T01XX E1- -

Custom Designation• C Custom=

• XX Two Digit Customer Code=

Configuration/Product

Customer Code

••••

ABCD

OriginalFirst RevisionSecond RevisionThird Revision

====

Chipset Revision

••

0102


==

Packing Format•••

TWB


===


E1E6

SnAgCuContains Bi

==

Package Revision•••

ABC


===

Package••••

ABCD


====

••••

EFGH


====

Memory••••

ABCD


====

•••

EFG

512 kb1 Mb2 Mb

===

A 1W GBR XY35 02300

Product Family••

BBR

BelaSignaBelaSigna R Series

==

•••

250261300

250 Series261 Series300 Series

===

Package Type

Product Series

••••

BDQW

BGADFNQFNWLCSP

====

Green••

GL

GreenLeaded

==

Software Code••••

E1R1XXXY

ExAudio BSEROM-Based BSENo Software IncludedNo Software Included

====

Chipset Revision••

0102

1st Revision2nd Revision

==

MPQ Variant ID• 1 ?=


ATU


===

• 35 35 Pins=Number of Pins/Balls

TND310

www.onsemi.com27

Naming Convention for Passive Tunable Integrated Circuits (PTIC)

Naming Convention for Passive Tunable Integrated Circuit (PTIC) Controllers

Product Line• TCP Tunable Components=

••••

XSP“Blank”

Pilot productionSpecial/CustomPrototype

===

Production=

Process Status

•••

415060

Gen 4.1Gen 5.0Gen 6.0

===

Process Generation

•••••

1012182733

1.0 pF1.2 pF1.8 pF2.7 pF3.3 pF

=====

•••••

3947566882

3.9 pF4.7 pF5.6 pF6.8 pF8.2 pF

=====

Capacitor Value

• T Tape & Reel=Packing

••

DQ

WLCSPQFN

==

Package

•••

ABC

HighNormalLow

===

••

UX

< 2.7 GHz> 2.7 GHz

==

Linearity

Tuning

-TCP S N A50 47 - D T

Product Line• TCC PTIC Controller=

••••

XSP“Blank”

Pilot productionSpecial/CustomPrototype

===

Production=

Process Status

••••

10202130

Gen 1.0Gen 2.0Gen 2.1Gen 3.0

====

Process Generation

••••

3456

3 Outputs4 Outputs5 Outputs6 Outputs

====

Number of Outputs


•••••

PROSD

Peripheral BumpRDLInterposerSSOP16Bare Die

=====

Package/Format

••••

ABCD

00011011

====

MIPI ID

-TCC S A30 3 - D T

TND310

www.onsemi.com28

Naming Convention for Dual PTIC RF Tuner IC

Naming Convention for Power Management ICs

Product Line• TCP Tunable Components=

••

5060

Gen 5.0Gen 6.1

==

Process Generation

• 1 8.2 pF PTIC + 2.7 pF PTIC=Product Variant


• D WLCSP=Package

• ‘Blank’ Standard Part=Optional Suffix

-TCP 1 x50 - D T

C CBD10HPM A01 -- TE1Packing Format•••

TWB


===


E1E6

SnAgCuContains Bi

==

Product Class• HPM Hearing Aid Power Management=

• 1020

Contact-Based VersionWireless Version

=

Configuration/Product

Product Generation

••

0102


== Package Revision

•••

ABC


===

Package••••

ABCD


====

••••

EFGH


====


ABBDDQ

HybridBGABumped DieDFNWFN

=====

••••

SUWWC

System in Package (SiP)Umbumped DieWLCSPWLCSP with Backside Coating

====

Memory••••

ABCD


====

•••

EFG

512 kb1 Mb2 Mb

===

TND310

www.onsemi.com29

TND310

PUBLICATION ORDERING INFORMATIONN. American Technical Support: 800−282−9855 Toll FreeUSA/Canada

Japan: ON Semiconductor, Japan Customer Focus Center2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051Phone: 81−3−5773−3850

TND310/D

LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 61312, Phoenix, Arizona 85082−1312 USAPhone: 480−829−7710 or 800−344−3860 Toll Free USA/CanadaFax: 480−829−7709 or 800−344−3867 Toll Free USA/CanadaEmail: [email protected]

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

For additional information, please contact yourlocal Sales Representative.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

MicroLeadless, POWERTAP, and FULLPAK are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ChipFET is a trademark of Vishay Siliconix. FETKY is a registered trademark of International Rectifier Corporation. Micro8 is a trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation. All other brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders.

Naming Convention for Bluetooth® Low Energy RF ICs

WCx 5101 A B G-NCH RSL- -

Chip Revision (Major)

•••••••••

ABBDDQSUWWC

HybridBGABumped DieDFNQFNSystem in Package (SiP)Unbumped DieWLCSPWLCSP with Backside Coating

=========

Package••

0102

1st Revision2nd Revision

==

Product Class••

NCH-RSLMD-RSL

Consumer/HealthcareLife Critical Devices

==

Chip Version••

12

1st Version2nd Version

==

Special/Custom*• ‘Blank’ = Standard * Reserved for Special or Custom Designator

Product Generation• 10 Bluetooth 5.0=

10Package••

GL

GreenLeaded

==

Qualification•••

ABC

Medical – Life ThreateningMedical – Non-Life ThreateningConsumer

===


ATU


===

Package Pins• 51 51 Pins=

1

TND310

www.onsemi.com30

TND310

PUBLICATION ORDERING INFORMATIONN. American Technical Support: 800−282−9855 Toll FreeUSA/Canada

Japan: ON Semiconductor, Japan Customer Focus Center2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051Phone: 81−3−5773−3850

TND310/D

LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 61312, Phoenix, Arizona 85082−1312 USAPhone: 480−829−7710 or 800−344−3860 Toll Free USA/CanadaFax: 480−829−7709 or 800−344−3867 Toll Free USA/CanadaEmail: [email protected]

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

For additional information, please contact yourlocal Sales Representative.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

MicroLeadless, POWERTAP, and FULLPAK are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ChipFET is a trademark of Vishay Siliconix. FETKY is a registered trademark of International Rectifier Corporation. Micro8 is a trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation. All other brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders.

Naming Convention for Standard RF ICs(Formerly Axsem)

Naming Convention for RF Microcontrollers(Formerly Axsem)

Product Group

Family

Package Type•••

012

QFN or DieTSSOPOther QFN Option

===

•••

256

LCD DriverSub 1 GHz Radio2.4 GHz Radio

===

Type•••

123

Type 1Type 2Type 3

===

Orderable Quantity••••

1052030

15002,0003,000

====

Function••••

3456

Transmitter OnlyNarrow Band Capable TransceiverGeneral Purpose TransceiverOther

====

AX 5 0 4 3 - -1 TW 30

Packing

Version

•

••

TW

WDBA

T: Tape & ReelW: Die OrientationWafer Sell in Die QtyBag

=

==

Product Group

Microcontroller

Memory Type

Memory Size•••

123

64 K Flash32 K Flash16 K Flash

===

•••

FRX

FlashROMRAM

===

Type•••

123

Type 1Type 2Type 3

===

Orderable Quantity•••

10530

15003,000

===

Function•••

345

Transmitter OnlyNarrow Band Capable TransceiverGeneral Purpose Transceiver

===

AX 8052 F 1 4 3 - -2 TB 05

Packing

Version

•

••

TB

WDBA

T: Tape & ReelB: Die OrientationWafer Sell in Die QtyBag

=

==

TND310

www.onsemi.com31

Naming Convention for RF Microcontrollers with Radio Standards(Formerly Axsem)

Naming Convention for RF Modules(Formerly Axsem)

Product Group

Radio Standard

Software Option

Hardware Version

••

EmptyAPI

DefaultAPI

==

•••••

SFEUSFUSEOEUEOUSAT

SIGFOX EUSIGFOX USENOCEAN EUENOCEAN US

=====


10530

15003,000

===

AX SFEU API 1 --- - -01 TB 05

Packing

Firware Version

•

•

TX

D

T: Tape & ReelX: Die OrientationWafer Sell in Die Qty

=

=

Product Group

Radio Standard

Hardware Type & Version•••

MINI21ANT21USB21

MINI-STAMPANT-STAMPUSB Stick

===

••••

AT10SF10EO10WM10

AXSEM ATSIGFOXENOCEANWireless M-Bus

====


10530

15003,000

===

AX AT10 MINI21 -- - -868 B 1

Packing

Carrier Frequency

• B Bag=

TND310

www.onsemi.com32

Naming Convention for IPM Devices

Circuit Identifier

Product Group

Package Type• See Table

••••••••

12345679

Small Signal (> 10 MHz)Audio PowerSmall Signal (< 100 kHz)Audio Power (AB Class)Inverter (New), PFC*Actuator Driver, Inverter (Old)Switching ModeAutomotive

========

••

STKOther

StandardCustom

==

Lead Forming• See Table

Maximum Rated Current• See Table

Maximum Rated Voltage• See Table

Function Division or Forming Change••••

0123

Standard1st Change2nd Change3rd Change

====

Special Division••

EH

Pb-FreeHalogen Free

==

UL Standard Certification••

–U

Normal ProductsUL Standard Certified Products

==

STK 1 2 3 54- -0 A B E

Optional Suffix••

One ot two digitsVersion change, testing change, forming change, etc.

Function• See Table

Designator

2 3 4 5 A

Package Type Function Maximum Rated VoltageMaximum

Rated Current Lead Forming

(Blank) — — — — Straight

1 Smart 3-Phase Inverter; Built-In 1 Shunt R Up to 150 V; Active High 1 A or Lower —

2 Smart 2nd 3-Phase Inverter; For External 1 Shunt R Up to 599 V; Active High Up to 2 A —

3 SIP04 3-Phase Inverter; Built-In 3 Shunt Rs 600 V; Active High Up to 3 A —

4 SOP1 3-Phase Inverter; For External 3 Shunt Rs 600 V; Active High Up to 5 A —

5 SIP1A Single-Phase Inverter; Built-In 1 Shunt R 600 V; Active High Up to 8 A —

6 SIP2Single-Phase Inverter; For External 1

Shunt RUp to 1200 V; Active High Up to 10 A —

7 SIP2A Induction Heating; 1 Burner 1700 V; Active High Up to 10 A —

8 SIP3 induction Heating; 2 Burners — Up to 12 A —

9 SIP2 Case Type PFC + 3-Phase Inverter — Up to 15 A —

0 SIP3 Case Type PFC + 3-Phase Inverter — Up to 15 A —

A DIP30 PFC; No Bridge Up to 150 V; Active Low Up to 20 A SL Zigzag (From case to first clipping point = 2.5 mm)

B DIP42 PFC; With Bridge Up to 599 V; Active Low Up to 25 A SL Zigzag (From case to first clipping point = 5.35 mm)

C DIPS PFC; Bridge Free 600 V; Active Low Up to 30 A One Side Zigzag (Lead length 6.8 mm version)

D DIP05 PFC; Interleave 600 V; Active Low Up to 40 A SL Bent

E DIP2 PFC; Bridge Free Interleave 600 V; Active Low Up to 50 A One Side Zigzag (With insert plate)

F DIP4 PFC + 3-Phase Inverter; No Bridge Up to 1200 V; Active Low Up to 60 A L Bent

G DIP5 PFC + 4-Phase Inverter; With Bridge 1700 V; Active Low Up to 75 A SL Bent + Stopper

H Tenmen Case Screw PFC + 5-Phase Inverter; Bridge Free — 75 A or Larger —

J Tenmen Case Terminal PFC + 6-Phase Inverter; Interleave — Up to 1 kW / 5 ADIPS Bent (One side SL/One side SL Chidori; Lead length 5.5 mm version above case)

K SIP2B Power Conditioner; Converter — Up to 2 kW / 10 A One Side Zigzag (Lead length 9 mm version)

L DIPS2 Power Conditioner; Inverter 600 V Up to 3 kW / 15 A L-Zigzag (Smart 1st)

M SIP3B Power Conditioner; Converter + Inverter 600 V; Built-In 1 Shunt R Up to 4 kW / 20 A Both Side Chidori (Smart 2nd bent)

N New Package Power Conditioner; Others 600 V; Built-In HVIC Up to 5 kW / 25 ADIPS Bent (One side SL/One side SL Chidori; Lead length 9.7 mm version above case)

P SIP3A — 600 V; Built-In HVIC + Shunt R Up to 6 kW / 30 A —

Q DIPS33-Phase Inverter + Break; Built-In a

Shunt R1200 V Up to 8 kW / 40 A —

R DIPS3.53-Phase Inverter + Break; For External

3 Shunt Rs1200 V; Built-In 1 Shunt R Up to 10 kW —

S PQFN CIB; Built-In a Shunt R 1200 V; Built-In HVIC 10 kW or Larger —

T SIP3A CIB; For External 3 Shunt Rs 1200 V; Built-In HVIC + Shunt R Up to 100 A —

U DIP-C2 — — Up to 150 A —

V DIP-C3 — — Up to 200 A —

TND310

www.onsemi.com33

Naming Convention for DS and iPS Devices

LC - XXX

Packing Name•••

EGH

===

Pb-FreePb-Free (Legacy)Halide Free

Part CodeNumber and alpha characters

Quantity Level• U = Automotive

Hotsukyo Code• Z = Hotsukyo

Revision Code•••••

NABYS

=====

Rev 1Rev 2Rev 3Rev 4Rev 5

Package Designator

Price Code•••

LLLLM

===

Price Change First TimeSecond TimeThird Time

1 2 3 4 5 6 7 8 9 A B

Device Identification CodeIncludes all or some of

the following items

PRODUCT NAME

Product Class••••••

LLALBLCLELV

Power Supply (Regulator)Bipolar LinearBipolar DigitalCMOSMemoryBi-CMOS

======

TND310/DPDF

LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected]

N. American Technical Support: 800-282-9855 Toll Free USA/Canada.Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910Japan Customer Focus Center Phone: 81-3-5817-1050

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local Sales Representative

PUBLICATION ORDERING INFORMATION

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

Bluetooth is a registered trademark of Bluetooth SIG. MicroLeadless and FULLPAK are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ChipFET is a trademark of Vishay Siliconix. FETKY is a registered trademark of International Rectifier Corporation. PowerFLEX is a trademark of Texas Instruments Incorporated. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation. All other brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders.

TND310 ON Semiconductor Device Nomenclature

Documents

Transcript of TND310 ON Semiconductor Device Nomenclature