TLV7011 and TLV7021 Micro-Package, Micro-Power, … · US dime (18x18x1.35 mm3) 5-Pin X2SON 5-Lead...

US dime (18x18x1.35 mm3)

5-Pin X2SON

5-Lead SC70

Input Overdrive (mV)

Pro

paga

tion

Del

ay (P

s)

10 20 30 40 50 60 70 80 90 1000.2

0.25

0.3

0.35

0.4

TLV7

Rising EdgeFalling Edge

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Folder

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Now

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTIONDATA.

TLV7011, TLV7021SLVSDM5C –MAY 2017–REVISED MARCH 2018

TLV7011 and TLV7021 Small-Size, Micro-Power, Low-Voltage Comparators

1

1 Features1• Ultra-Small X2SON Package (0.8 mm × 0.8 mm ×

0.4 mm)• Wide Supply Voltage Range of 1.6 V to 5.5 V• Quiescent Supply Current of 5 µA• Low Propagation Delay of 260 ns• Rail-to-Rail Common-Mode Input Voltage• Internal Hysteresis (4 mV)• Push-Pull and Open-Drain Output Options• No Phase Reversal for Overdriven Inputs• –40°C to 125°C Operating Ambient Temperature

2 Applications• Mobile Phones and Tablets• Portable and Battery-Powered Devices• IR Receivers• Level Translators• Threshold Detectors and Discriminators• Window Comparators• Zero-Crossing Detectors

3 DescriptionThe TLV7011 and TLV7021 are single-channel,micro-power comparators that feature low-voltageoperation with rail-to-rail input capability. Thesecomparators are available in an ultra-small, leadlesspackage measuring 0.8 mm × 0.8 mm, making themapplicable for space-critical designs like smartphonesand other portable or battery-powered applications.

The TLV7011 and TLV7021 offer an excellent speed-to-power combination with a propagation delay of 260ns and a quiescent supply current of 5 μA. Thiscombination of fast response time at micropowerenables power conscious systems to monitor andrespond quickly to fault conditions. With an operatingvoltage range of 1.6 V to 5.5 V, these comparatorsare compatible with 3-V and 5-V systems.

These comparators also feature no output phaseinversion with overdriven inputs and internalhysteresis. These features make this family ofcomparators well suited for precision voltagemonitoring in harsh, noisy environments where slow-moving input signals must be converted into cleandigital outputs.

The TLV7011 has a push-pull output stage capable ofsinking and sourcing milliamps of current whencontrolling an LED or driving a capacitive load. TheTLV7021 has an open-drain output stage that can bepulled beyond VCC, making it appropriate for leveltranslators and bipolar to single-ended converters.

Device Information(1)(2)

PART NUMBERS PACKAGE (PINS) BODY SIZE (NOM)

TLV7011,TLV7021

X2SON (5) 0.80 mm × 0.80 mmSC70 (5) 2.00 mm × 1.25 mmSOT-23 (5) 2.90 mm × 1.60 mm

(1) For all available packages, see the orderable addendum atthe end of the data sheet.

(2) The SOT-23 packages is in preview only

TLV70x1 Family of Low Power ComparatorsPART

NUMBERS OUTPUT SUPPLYCURRENT (TYP)

PROPAGATIONDELAY (TYP)

TLV7011 Push-pull 5 µA 260 nsTLV7021 Open-drain 5 µA 260 nsTLV7031 Push-pull 335 nA 3 µsTLV7041 Open-drain 335 nA 3 µs

X2SON Package vs SC70 and US Dime Propagation Delay vs. Overdrive

TA = 25°C, VCC = 5 V, CL = 15 pF

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2

TLV7011, TLV7021SLVSDM5C –MAY 2017–REVISED MARCH 2018 www.ti.com

Product Folder Links: TLV7011 TLV7021

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Table of Contents1 Features .................................................................. 12 Applications ........................................................... 13 Description ............................................................. 14 Revision History..................................................... 25 Pin Configuration and Functions ......................... 36 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 46.2 ESD Ratings.............................................................. 46.3 Recommended Operating Conditions....................... 46.4 Thermal Information .................................................. 46.5 Electrical Characteristics........................................... 56.6 Switching Characteristics .......................................... 56.7 Timing Diagrams....................................................... 56.8 Typical Characteristics .............................................. 7

7 Detailed Description ............................................ 137.1 Overview ................................................................. 137.2 Functional Block Diagram ....................................... 137.3 Feature Description................................................. 13

7.4 Device Functional Modes........................................ 138 Application and Implementation ........................ 15

8.1 Application Information............................................ 158.2 Typical Applications ................................................ 17

9 Power Supply Recommendations ...................... 2210 Layout................................................................... 22

10.1 Layout Guidelines ................................................. 2210.2 Layout Example .................................................... 22

11 Device and Documentation Support ................. 2311.1 Device Support...................................................... 2311.2 Related Links ........................................................ 2311.3 Receiving Notification of Documentation Updates 2311.4 Community Resources.......................................... 2311.5 Trademarks ........................................................... 2311.6 Electrostatic Discharge Caution............................ 2311.7 Glossary ................................................................ 23

12 Mechanical, Packaging, and OrderableInformation ........................................................... 24

4 Revision History

Changes from Revision B (November 2017) to Revision C Page

• Changed the preview SC70 package to production data....................................................................................................... 1

Changes from Revision A (July 2017) to Revision B Page

• Changed propagation delay from: 200 ns to: 260 ns ............................................................................................................ 1• Added preview SC70 and SOT-23 packages to the data sheet ........................................................................................... 1• Added TLV70x1 Family of Micropower Comparators table per marketing request................................................................ 1• Changed the key graphic title from: Propagation Delay vs. Overdrive (TLV7011) to: Propagation Delay vs. Overdrive ...... 1• Removed (TLV7011 only) text from several Typical Characteristics graphs ......................................................................... 7• Removed some Typical Characteristics graphs .................................................................................................................... 7• Added Figure 14 ..................................................................................................................................................................... 7• Added Figure 21 .................................................................................................................................................................... 9• Added content to the Inputs section ..................................................................................................................................... 13• Added the IR Receiver Analog Front End section................................................................................................................ 18

Changes from Original (May 2017) to Revision A Page

• Changed device status from ADVANCED INFO to PRODUCTION DATA ............................................................................ 1



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VCC

IN-

OUT

VEE

IN+

1

2

3

5

4

1OUT

2VCC

3

VEE 4 IN±

5 IN+

Not to scale

3

TLV7011, TLV7021www.ti.com SLVSDM5C –MAY 2017–REVISED MARCH 2018


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(1) I = Input, O = Output, P = Power

5 Pin Configuration and Functions

DPW Package5-Pin X2SON

Top View

DBV and DCK Package5-Pin SOT-23 and SC70

Top View

(1) The SOT-23 package is in preview only.

Pin FunctionsPIN

I/O/P (1) DESCRIPTIONNAME X2SON SOT-23, SC70OUT 1 1 O OutputVCC 2 5 P Positive (highest) power supplyVEE 3 2 P Negative (lowest) power supplyIN– 4 4 I Inverting inputIN+ 5 3 I Noninverting input



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4




(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, which do not imply functional operation of the device at these or any other conditions beyond those indicated under RecommendedOperating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Input terminals are diode-clamped to VEE. Input signals that can swing 0.3V below VEE must be current-limited to 10mA or less.(3) Output maximum is (VCC + 0.3V) or 6V, whichever is less.(4) Short-circuit to ground, one comparator per package.

6 Specifications

6.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNITSupply voltage (VS = VCC – VEE) 6 VInput pins (IN+, IN–) (2) VEE – 0.3 6 VCurrent into Input pins (IN+, IN–) (2) ±10 mA

Output (OUT)TLV7011 (3) VEE – 0.3 VCC + 0.3

VTLV7021 VEE – 0.3 6

Output short-circuit duration (4) 10 sJunction temperature, TJ 150 °CStorage temperature, Tstg –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD RatingsVALUE UNIT

V(ESD)Electrostaticdischarge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000V

Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000

6.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNITSupply voltage (VS = VCC – VEE) 1.6 5.5 VAmbient temperature, TA –40 125 °C

(1) For more information about traditional and new thermalmetrics, see the Semiconductor and IC Package ThermalMetrics applicationreport.

6.4 Thermal Information

THERMAL METRIC (1)TLV7011/TLV7021

UNITDPW (X2SON) DCK (SC70)5 PINS 5 PINS

RθJA Junction-to-ambient thermal resistance 497.5 278.8 °C/WRθJC(top) Junction-to-case (top) thermal resistance 275.5 188.6 °C/WRθJB Junction-to-board thermal resistance 372.2 113.2 °C/WψJT Junction-to-top characterization parameter 55.5 82.3 °C/WψJB Junction-to-board characterization parameter 370.3 112.4 °C/WRθJC(bot) Junction-to-case (bottom) thermal resistance 165.1 N/A °C/W



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tON

VOH/2

VEE

OUT

VCC VEE + 1.6VVEE

5




6.5 Electrical CharacteristicsVS = 1.8 V to 5 V, VCM = VS / 2; minimum and maximum values are at TA = –40°C to +125°C (unless otherwise noted).Typical values are at TA = 25°C.

PARAMETER TEST CONDITIONS MIN TYP MAX UNITVIO Input offset voltage VS = 1.8 V and 5 V, VCM = VS / 2 ±0.5 ±8 mVVHYS Hysteresis VS = 1.8 V and 5 V, VCM = VS / 2 1.2 4.2 14 mV

VCM Common-mode voltage rangeVS = 2.5 V to 5 V VEE VCC + 0.1

VVS = 1.8 V to 2.5 V VEE + 0.1 VCC + 0.1

IB Input bias current 5 pAIOS Input offset current 1 pA

VOHOutput voltage high (forTLV7011 only) VS = 5 V, IO = 3 mA 4.7 4.8 V

VOL Output voltage low VS = 5 V, IO = 3 mA 120 220 mV

ILKGOpen-drain output leakagecurrent (TLV7021 only)

VS = 5 V, VID = +0.1 V (output high),VPULLUP = VCC

100 pA

CMRR Common-mode rejection ratio VEE < VCM < VCC, VS = 5 V 78 dBPSRR Power supply rejection ratio VS = 1.8 V to 5 V, VCM = VS / 2 78 dB

ISC Short-circuit currentVS = 5 V, sourcing 65

mAVS = 5 V, sinking 44

ICC Supply current VS = 1.8 V, no load, VID = –0.1 V (OutputLow) 5 10 µA

(1) During power on, VS must exceed 1.6 V for tON before the output tracks the input.

6.6 Switching CharacteristicsTypical values are at TA = 25°C, VCC = 5 V, VCM = 2.5 V; CL = 15 pF, input overdrive = 100 mV (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

tPHL

Propagation delay time, high-to-low (RP = 2.5 kΩ TLV7021only)

Midpoint of input to midpoint of output,VOD = 100 mV 260 ns

tPLH

Propagation delay time, low-to-high (RP = 2.5 kΩ TLV7021only)

Midpoint of input to midpoint of output,VOD = 100 mV 310 ns

tR Rise time (for TLV7011 only) 20% to 80% 5 nstF Fall time 80% to 20% 5 nstON Power-up time (1) 20 µs

6.7 Timing Diagrams

Figure 1. Start-Up Time Timing Diagram (IN+ > IN–)



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20%

80%

20%

80%

VREF

VREF + 100 mV

95()�Å�100 mV

50% 50%

tpLH tpHL

tFtR

Input

Output

+

±

+±

VREF

InputOutput

V±

V+

V+

V±

V±

6




Timing Diagrams (continued)

Figure 2. Propagation Delay Timing Diagram



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Temperature (qC)

Hys

tere

sis

(mV

)

-40 -20 0 20 40 60 80 100 1200

2

4

6

8

10

12

14

16

TLV7

VCM = VCC / 2VCM = VCCVCM = 100 mV


Pro

paga

tion

Del

ay (P

s)

0 20 40 60 80 100 120 140 160 180 2000.2

0.3

0.4

0.5

TLV7

T = �40qCT = 25qCT = 85qCT = 125qC


Pro

paga

tion

Del

ay (P

s)

0 20 40 60 80 100 120 140 160 180 2000.2

0.3

0.4

0.5

TLV7

T = �40qCT = 25qCT = 85qCT = 125qC


Pro

paga

tion

Del

ay (P

s)

0 20 40 60 80 100 120 140 160 180 2000.2

0.3

0.4

0.5

TLV7TLV7

T = �40qCT = 25qCT = 85qCT = 125qC


Pro

paga

tion

Del

ay (P

s)

0 20 40 60 80 100 120 140 160 180 2000.2

0.3

0.4

0.5

TLV7TLV7

VCC = 3.3 VVCC = 5 V


Pro

paga

tion

Del

ay (P

s)

0 20 40 60 80 100 120 140 160 180 2000.2

0.3

0.4

0.5

TLV7


7




6.8 Typical CharacteristicsTA = 25°C, VCC = 5 V, VEE = 0 V, VCM = VCC/2, CL = 15 pF

TA = 25°C,

Figure 3. TLV7011 Propagation Delay (L-H) vs. InputOverdrive

TA = 25°C

Figure 4. Propagation Delay (H-L) vs. Input Overdrive

VCC = 5 V


VCC = 5 V

Figure 6. Propagation Delay (H-L) vs. Input Overdrive

Rpull-up = 2.5k


VCC = 1.8 V

Figure 8. Hysteresis vs. Temperature



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Hysteresis (mV)

Fre

quen

cy (

%)

0

5

10

15

20

25

30

35

40

4 5 6 73

TLV7VCM (V)

Hys

tere

sis

(mV

)

0 1 2 3 4 50

2

4

6

8

10

12

14

16

18

20

TLV7

-40qC25qC85qC125qC

VCM (V)

Hys

tere

sis

(mV

)

0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.70

2

4

6

8

10

12

14

16

18

20

TLV7

-40qC25qC85qC125qC

VCM (V)

Hys

tere

sis

(mV

)

0 0.5 1 1.5 2 2.5 3 3.40

2

4

6

8

10

12

14

16

18

20

TLV7

-40qC25qC85qC125qC

Temperature (qC)

Hys

tere

sis

(mV

)

-40 -20 0 20 40 60 80 100 1200

2

4

6

8

10

12

14

16

TLV7

VCM = VCC / 2VCM = VCCVCM = 0

Temperature (qC)

Hys

tere

sis

(mV

)

-40 -20 0 20 40 60 80 100 1200

2

4

6

8

10

12

14

16

TLV7


8




Typical Characteristics (continued)TA = 25°C, VCC = 5 V, VEE = 0 V, VCM = VCC/2, CL = 15 pF

VCC = 3.3 V


VCC = 5 V


VCC = 1.8 V

Figure 11. Hysteresis vs. VCM

VCC = 3.3 V


VCC = 5 V


Distribution Taken From 10,777 Comparators

Figure 14. Hysteresis Histogram



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VCM (V)

Inpu

t Offs

et (

mV

)

0 1 2 3-4

-3

-2

-1

0

1

2

3

4

TLV7VCM (V)

Inpu

t Offs

et (

mV

)

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5-4

-3

-2

-1

0

1

2

3

4

TLV7

Temperature (qC)

Inpu

t Offs

et (

mV

)

-40 -20 0 20 40 60 80 100 1200

0.1

0.2

0.3

0.4

0.5

0.6

0.7

TLV7


VCM (V)

Inpu

t Offs

et (

mV

)

0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7-4

-3

-2

-1

0

1

2

3

4

TLV7

Temperature (qC)

Inpu

t Offs

et (

mV

)

-40 -20 0 20 40 60 80 100 1200

0.1

0.2

0.3

0.4

0.5

0.6

0.7

TLV7

VCM = VCC / 2VCM = VCCVCM = 100 mV

Temperature (qC)

Inpu

t Offs

et (

mV

)

-40 -20 0 20 40 60 80 100 1200

0.1

0.2

0.3

0.4

0.5

0.6

0.7

TLV7


9





VCC = 1.8 V

Figure 15. Input Offset vs. Temperature

VCC = 3.3 V


VCC = 5 V


VCC = 1.8 V, 50 devices

Figure 18. Input Offset Voltage vs. VCM

VCC = 3.3 V, 50 devices


VCC = 5 V, 50 devices




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Temperature (qC)

I SC (

mA

)

-60 -40 -20 0 20 40 60 80 100 120 1400

10

20

30

40

50

60

TLV7

VCC = 3.5 VVCC = 5.5 V

IOUT (mA)

VO

L (V

)

0.1 0.2 0.3 0.4 0.5 0.7 1 2 3 4 550

0.05

0.1

0.15

0.2

0.25

TLV7

-40qC25qC125qC

IOUT (mA)

VO

H (

V)

0.1 1 554.75

4.8

4.85

4.9

4.95

5

TLV7

-4q0C25qC85qC125qC

IOUT (mA)

VO

L (V

)

0.1 0.2 0.3 0.4 0.50

0.01

0.02

0.03

0.04

0.05

TLV7

-40qC25qC125qC

Input Offset (mV)

Fre

quen

cy (

%)

0

5

10

15

20

-3 -2 -2 -1 0 1 2 3 4

TLV7IOUT (mA)

VO

H (

V)

0.1 0.2 0.3 0.4 0.51.75

1.755

1.76

1.765

1.77

1.775

1.78

1.785

1.79

1.795

1.8

TLV7

-40qC25qC85qC125qC

10





Distribution Taken From 10,777 Comparators

Figure 21. Input Offset Voltage Histogram

VCC = 1.8 V

Figure 22. TLV7011 Output Voltage High vs. Output SourceCurrent

VCC = 5 V

Figure 23. TLV7011 Output Voltage High vs. Output SourceCurrent

VCC = 1.8 V

Figure 24. Output Voltage Low vs. Output Sink Current

VCC = 5 V

Figure 25. Output Voltage Low vs. Output Sink Current

VCM = VCC/2

Figure 26. Output Short-Circuit (Sink) Current vs.Temperature



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VCC (V)

I CC (P

A)

1 1.5 2 2.5 3 3.5 4 4.5 52

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

TLV7

-40qC25qC85qC125qC

VCM (V)

I CC (P

A)

0 0.5 1 1.5 2 2.5 32

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

TLV7

-40qC25qC85qC125qC

Temperature (qC)

I CC (P

A)

-60 -40 -20 0 20 40 60 80 100 120 1402

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

TLV7


VCC (V)

I SC (

mA

)

1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.30

10

20

30

40

50

60

70

80

90

TLV7

-40qC25qC85qC125qC

Temperature (qC)

I SC (

mA

)

-60 -40 -20 0 20 40 60 80 100 120 1400

10

20

30

40

50

60

70

80

90

TLV7

VCC = 3.5 VVCC = 5.5 V

VCC (V)

I SC (

mA

)

1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.30

10

20

30

40

50

60

TLV7TLV7

-40qC25qC85qC125qC

11





VCM = VCC/2

Figure 27. TLV7011 Output Short-Circuit (Source) Currentvs. Temperature

VCM = VCC/2

Figure 28. Output Short Circuit (Sink) vs. VCC

VCM = VCC/2

Figure 29. TLV7011 Output Short Circuit (Source) vs. VCC

VCM = VCC/2

Figure 30. ICC vs. Temperature

VCM = VCC/2

Figure 31. ICC vs. VCC

VCC = 3.3 V

Figure 32. ICC vs. VCM



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Load Capacitance (pF)

Ris

e T

ime

(ns)

10 100 1000 10000 1000001

10

100

1000

10000

TLV7Load Capacitance (pF)

Fal

l Tim

e (n

s)

10 100 1000 10000 1000001

10

100

1000

10000

100000

TLV7

Temperature (qC)

I BIA

S (

pA)

-40 -20 0 20 40 60 80 100 1200.01

0.1

1

10

100

1000

10000

TLV7VCM (V)

I CC (P

A)

0 1 2 3 4 5 5.52

2.5

3

3.5

4

4.5

5

5.5

6

6.5

7

TLV7

-40qC25qC85qC125qC

12





VCC = 5 V

Figure 33. ICC vs. VCM

VCC = 3.3V

Figure 34. Input Bias Current vs. Temperature

VOD = 100mV

Figure 35. TLV7011 Output Rise Time vs. Load Capacitance

VOD = 100mV

Figure 36. Output Fall Time vs. Load Capacitance



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+

±

Bias Power-on-reset

IN+

IN-OUT

VCC

GND

Copyright © 2017, Texas Instruments Incorporated

13




7 Detailed Description

7.1 OverviewThe TLV7011 and TLV7021 devices are single-channel, micro-power comparators with push-pull and open-drainoutputs. Operating from 1.6 V to 5.5 V and consuming only 5 µA, the TLV7011 and TLV7021 are ideally suitedfor portable and industrial applications. The TLV7011 and TLV7021 are available in an ultra-small X2SONpackage (0.8 × 0.8 mm) to offer significant board space saving in space-challenged designs. Small 5-pin SC70and SOT-23 packages are also available for these devices.

7.2 Functional Block Diagram

7.3 Feature DescriptionThe TLV7011 (push-pull) and TLV7021 (open-drain) devices are micro-power comparators that are capable ofoperating at low voltages. The TLV7011 and TLV7021 feature a rail-to-rail input stage capable of operating up to100 mV beyond the VCC power supply rail. The TLV7011 and TLV7021 also feature a push-pull and open-drainoutput stage with internal hysteresis.

7.4 Device Functional ModesThe TLV7011 and TLV7021 have a Power-on-Reset (POR) circuit. While the power supply (VS) is ramping up orramping down, the POR circuitry will be activated.

For the TLV7011, the POR circuit will hold the output low (at VEE) while activated.

For the TLV7021, the POR circuit will keep the output high impedance (logical high) while activated.

When the supply voltage is greater than, or equal to, the minimum supply voltage, the comparator output reflectsthe state of the differential input (VID).

7.4.1 InputsThe TLV7011 and TLV7021 input common-mode extends from VEE to 100 mV above VCC. The differential inputvoltage (VID) can be any voltage within these limits. No phase-inversion of the comparator output will occur whenthe input pins exceed VCC and VEE.



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V + V (V-TH OS HYST )/ 2 V + VTH OS V + V +TH OS (VHYST )/ 2

14




Device Functional Modes (continued)While TI recommends operating the TLV7011 and TLV7021 within the specified range of the ElectricalCharacteristics table, the inputs are fault tolerant to voltages up to 5.5 V independent of the applied VCC value.Fault tolerant is defined as maintaining the same high input impedance when VCC is unpowered or within therecommended operating range. Because the inputs of the TLV7011 and TLV7021 are fault tolerant, the inputs tothe comparator can be any value between 0 V and 5.5 V while VCC is ramping up or staying at 0 V. This featureallows any supply and input driven sequence as long as the input value and supply are within the specifiedranges. In this case, no current limiting resistor is required. This is possible since the VCC is isolated from theinputs such that it maintains its value even when a higher voltage is applied to the input.

The input bias current is typically 1 pA for input voltages between VCC and VEE. The comparator inputs areprotected from undervoltage by internal diodes connected to VEE. As the input voltage goes under VEE, theprotection diodes become forward biased and begin to conduct causing the input bias current to increaseexponentially. Input bias current typically doubles every 10°C temperature increases.

7.4.2 Internal HysteresisThe device hysteresis transfer curve is shown in Figure 37. This curve is a function of three components: VTH,VOS, and VHYST:• VTH is the actual set voltage or threshold trip voltage.• VOS is the internal offset voltage between VIN+ and VIN–. This voltage is added to VTH to form the actual trip

point at which the comparator must respond to change output states.• VHYST is the internal hysteresis (or trip window) that is designed to reduce comparator sensitivity to noise

(4.2 mV for the TLV7011).

Figure 37. Hysteresis Transfer Curve

7.4.3 OutputThe TLV7011 features a push-pull output stage eliminating the need for an external pullup resistor. On the otherhand, the TLV7021 features an open-drain output stage enabling the output logic levels to be pulled up to anexternal source up to 6 V independently of the supply voltage.



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+V

+5 VCC

R

100 kLOAD

WVO

R3

1 MWR2

1 MW

R1

1 MW

VIN

VA

5 V

0 V1.67 V 3.33 V

VA2 VA1

VIN

VO High

+VCC

VO Low

+VCC

VA1

R1

R2

R3

VA2

R1

R2 R3


D -V = V VA A1 A2

V = VA2 CC ´

R2 || R3

R1 + (R2 || R3)

V = VA1 CC ´R2

(R1 || R3) + R2

15




8 Application and Implementation

NOTEInformation in the following applications sections is not part of the TI componentspecification, and TI does not warrant its accuracy or completeness. TI’s customers areresponsible for determining suitability of components for their purposes. Customers shouldvalidate and test their design implementation to confirm system functionality.

8.1 Application InformationThe TLV7011 and TLV7021 are micro-power comparators with reasonable response time. The comparators havea rail-to-rail input stage that can monitor signals beyond the positive supply rail with integrated hysteresis. Whenhigher levels of hysteresis are required, positive feedback can be externally added. The push-pull output stage ofthe TLV7011 is optimal for reduced power budget applications and features no shoot-through current. When levelshifting or wire-ORing of the comparator outputs is needed, the TLV7021 with its open-drain output stage is wellsuited to meet the system needs. In either case, the wide operating voltage range, low quiescent current, andmicro-package of the TLV7011 and TLV7021 make these comparators excellent candidates for battery-operatedand portable, handheld designs.

8.1.1 Inverting Comparator With Hysteresis for TLV7011The inverting comparator with hysteresis requires a three-resistor network that is referenced to the comparatorsupply voltage (VCC), as shown in Figure 38. When VIN at the inverting input is less than VA, the output voltage ishigh (for simplicity, assume VO switches as high as VCC). The three network resistors can be represented as R1|| R3 in series with R2. Equation 1 defines the high-to-low trip voltage (VA1).

(1)

When VIN is greater than VA, the output voltage is low, very close to ground. In this case, the three networkresistors can be presented as R2 || R3 in series with R1. Use Equation 2 to define the low to high trip voltage(VA2).

(2)

Equation 3 defines the total hysteresis provided by the network.(3)

Figure 38. TLV7011 in an Inverting Configuration With Hysteresis



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+V

+5 VCC

RLOAD

VO

R2

1 MW

VREF

+2.5 V

VA

5 V

0 V1.675 V 3.325 V

VIN2

VIN

VO High

+VCC

V = VA REF

R2

R1

330 kW

VIN

R1

VO Low

VIN1

V = VA REF

R1

R2

VO

VIN1

VIN2


DV = VIN CC

´R1

R2

V =IN2

VREF CC(R1 + R2) V R1- ´

R2

V = R1IN1

´

VREF

R2+ V

REF

16




Application Information (continued)8.1.2 Noninverting Comparator With Hysteresis for TLV7011A noninverting comparator with hysteresis requires a two-resistor network, as shown in Figure 39, and a voltagereference (VREF) at the inverting input. When VIN is low, the output is also low. For the output to switch from lowto high, VIN must rise to VIN1. Use Equation 4 to calculate VIN1.

(4)

When VIN is high, the output is also high. For the comparator to switch back to a low state, VIN must drop to VIN2such that VA is equal to VREF. Use Equation 5 to calculate VIN2.

(5)

The hysteresis of this circuit is the difference between VIN1 and VIN2, as shown in Equation 6.

(6)

Figure 39. TLV7011 in a Noninverting Configuration With Hysteresis



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+

±

TLV7021

Micro-Controller

+

TLV7021

3.3 V

Sensor

R1

R2

R3

RPU

UV_OV


±

17




8.2 Typical Applications

8.2.1 Window ComparatorWindow comparators are commonly used to detect undervoltage and overvoltage conditions. Figure 40 shows asimple window comparator circuit.

Figure 40. Window Comparator

8.2.1.1 Design RequirementsFor this design, follow these design requirements:• Alert (logic low output) when an input signal is less than 1.1 V• Alert (logic low output) when an input signal is greater than 2.2 V• Alert signal is active low• Operate from a 3.3-V power supply

8.2.1.2 Detailed Design ProcedureConfigure the circuit as shown in Figure 40. Connect VCC to a 3.3-V power supply and VEE to ground. Make R1,R2 and R3 each 10-MΩ resistors. These three resistors are used to create the positive and negative thresholdsfor the window comparator (VTH+ and VTH–). With each resistor being equal, VTH+ is 2.2 V and VTH- is 1.1 V. Largeresistor values such as 10-MΩ are used to minimize power consumption. The sensor output voltage is applied tothe inverting and noninverting inputs of the two TLV7021's. The TLV7021 is used for its open-drain outputconfiguration. Using the TLV7021 allows the two comparator outputs to be Wire-Ored together. The respectivecomparator outputs will be low when the sensor is less than 1.1 V or greater than 2.2 V. VOUT will be high whenthe sensor is in the range of 1.1 V to 2.2 V.



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+

±

10M

10M 470 k 470 k

0.01 �F

3 V

GND

TLV7011

Output to MCU

(Also to wake-up MCU)

R1

R2 R3R4

IR LED

C1

U1

Vref


VOUT

VIN

VTH+ = 2.2 V

VIN

VOUT

VTH± = 1.1 V

Time (usec)

Time (usec) 50 100 150 200

18




Typical Applications (continued)8.2.1.3 Application Curve

Figure 41. Window Comparator Results

8.2.2 IR Receiver Analog Front EndA single TLV7011 device can be used to build a complete IR receiver analog front end (AFE). The nanoampquiescent current and low input bias current make it possible to be powered with a coin cell battery, which couldlast for years.

Figure 42. IR Receiver Analog Front End Using TLV7011

8.2.2.1 Design RequirementsFor this design, follow these design requirements:• Use a proper resistor (R1) value to generate an adequate signal amplitude applied to the inverting input of the

comparator.• The low input bias current IB (2 pA typical) ensures that a greater value of R1 to be used.



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VOUT

VIN

VREF

1.8 V

1.2 V4.0 V

0.0 V1.61 V

1.58 V

Time

0.0 200.0 u 400.0 u 600.0 u 800.0 u

19




Typical Applications (continued)• The RC constant value (R2 and C1) must support the targeted data rate (that is, 9,600 bauds) to maintain a

valid tripping threshold.• The hysteresis introduced with R3 and R4 helps to avoid spurious output toggles.

8.2.2.2 Detailed Design ProcedureThe IR receiver AFE design is highly streamlined and optimized. R1 converts the IR light energy induced currentinto voltage and applies to the inverting input of the comparator. Because a reverse biased IR LED is used asthe IR receiver, a higher I/V transimpedance gain is required to boost the amplitude of reduced current. A 10Mresistor is used as R1 to support a 1-V, 100-nA transimpedance gain. This is made possible with the picoampsInput bias current IB (5pA typical). The RC network of R2 and C1 establishes a reference voltage Vref which tracksthe mean amplitude of the IR signal. The RC constant of R2 and C1 (about 4.7 ms) is chosen for Vref to track thereceived IR current fluctuation but not the actual data bit stream. The noninverting input is connected to Vref andthe output over the R3 and R4 resistor network which provides additional hysteresis for improved guard againstspurious toggles.

To reduce the current drain from the coin cell battery, data transmission must be short and infrequent.

8.2.2.3 Application Curve

Figure 43. IR Receiver AFE Waveforms



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CC 2A1

2 1 3

V RV

R R IIR

u

�

20




Typical Applications (continued)8.2.3 Square-Wave OscillatorSquare-wave oscillator can be used as low cost timing reference or system supervisory clock source.

Figure 44. Square-Wave Oscillator

8.2.3.1 Design RequirementsThe square-wave period is determined by the RC time constant of the capacitor and resistor. The maximumfrequency is limited by propagation delay of the device and the capacitance load at the output. The low input biascurrent allows a lower capacitor value and larger resistor value combination for a given oscillator frequency,which may help to reduce BOM cost and board space.

8.2.3.2 Detailed Design ProcedureThe oscillation frequency is determined by the resistor and capacitor values. The following calculation providesdetails of the steps.

Figure 45. Square-Wave Oscillator Timing Thresholds

First consider the output of Figure Figure 44 is high which indicates the inverted input VC is lower than thenoninverting input (VA). This causes the C1 to be charged through R4, and the voltage VC increases until it isequal to the noninverting input. The value of VA at the point is calculated by Equation 7.

(7)

if R1 = R2= R3, then VA1 = 2 VCC/ 3



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� �f 1/ 2 R4 C1 In2 u u

CC 2 3A2

1 2 3

V (R IIR )V

R +R IIR

21




Typical Applications (continued)At this time the comparator output trips pulling down the output to the negative rail. The value of VAat this point iscalculated by Equation 8.

(8)

if R1 = R2 = R3, then VA2 = VCC/3

The C1 now discharges though the R4, and the voltage VCC decreases until it reaches VA2. At this point, theoutput switches back to the starting state. The oscillation period equals to the time duration from for C1 from2VCC/3 to VCC / 3 then back to 2VCC/3, which is given by R4C1 × ln 2 fro each trip. Therefore, the total timeduration is calculated as 2 R4C1 × ln 2. The oscillation frequency can be obtained by Equation 9:

(9)

8.2.3.3 Application CurveFigure 46 shows the simulated results of tan oscillator using the following component values:

• R1 = R2 = R3 = R4 = 100 kΩ• C1 = 100 pF, CL = 20 pF• V+ = 5 V, V– = GND• Cstray (not shown) from VA TO GND = 10 pF

Figure 46. Square-Wave Oscillator Output Waveform



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0.1 uF

Package

Body

Outline

OUT

VCC

IN+

IN-

4 mil VIABottom-Layer

Trace

Top-Layer

Trace

Top-View

8 mil VIA

22




9 Power Supply RecommendationsThe TLV7011 and TLV7021 have a recommended operating voltage range (VS) of 1.6 V to 5.5 V. VS is definedas VCC – VEE. Therefore, the supply voltages used to create VS can be single-ended or bipolar. For example,single-ended supply voltages of 5 V and 0 V and bipolar supply voltages of +2.5 V and –2.5 V create comparableoperating voltages for VS. However, when bipolar supply voltages are used, it is important to realize that the logiclow level of the comparator output is referenced to VEE.

Output capacitive loading and output toggle rate will cause the average supply current to rise over the quiescentcurrent.

10 Layout

10.1 Layout GuidelinesTo reduce PCB fabrication cost and improve reliability, TI recommends using a 4-mil via at the center padconnected to the ground trace or plane on the bottom layer.

A power-supply bypass capacitor of 100 nF is recommended when supply output impedance is high, supplytraces are long, or when excessive noise is expected on the supply lines. Bypass capacitors are alsorecommended when the comparator output drives a long trace or is required to drive a capacitive load. Due tothe fast rising and falling edge rates and high-output sink and source capability of the TLV7011 and TLV7021output stages, higher than normal quiescent current can be drawn from the power supply. Under thiscircumstance, the system would benefit from a bypass capacitor across the supply pins.

10.2 Layout Example

Figure 47. Layout Example



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23




11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 Evaluation ModuleAn evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TLV70x1device family. The TLV7011 Micro-Power Comparator Dip Adaptor Evaluation Module can be requested at theTexas Instruments website through the product folder or purchased directly from the TI eStore.

11.2 Related LinksThe table below lists quick access links. Categories include technical documents, support and communityresources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICALDOCUMENTS

TOOLS &SOFTWARE

SUPPORT &COMMUNITY

TLV7011 Click here Click here Click here Click here Click hereTLV7021 Click here Click here Click here Click here Click here

11.3 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on ti.com. In the upperright corner, click on Alert me to register and receive a weekly digest of any product information that haschanged. For change details, review the revision history included in any revised document.

11.4 Community ResourcesThe following links connect to TI community resources. Linked contents are provided "AS IS" by the respectivecontributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms ofUse.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaborationamong engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and helpsolve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.

11.5 TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge CautionThis integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 GlossarySLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.



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http://www.ti.com/tool/tlv7011-2-3-41evm

http://www.ti.com/product/TLV7011?dcmp=dsproject&hqs=pf

http://www.ti.com/product/TLV7011?dcmp=dsproject&hqs=sandbuy&#samplebuy

http://www.ti.com/product/TLV7011?dcmp=dsproject&hqs=td&#doctype2

http://www.ti.com/product/TLV7011?dcmp=dsproject&hqs=sw&#desKit

http://www.ti.com/product/TLV7011?dcmp=dsproject&hqs=support&#community

http://www.ti.com/product/TLV7021?dcmp=dsproject&hqs=pf

http://www.ti.com/product/TLV7021?dcmp=dsproject&hqs=sandbuy&#samplebuy

http://www.ti.com/product/TLV7021?dcmp=dsproject&hqs=td&#doctype2

http://www.ti.com/product/TLV7021?dcmp=dsproject&hqs=sw&#desKit

http://www.ti.com/product/TLV7021?dcmp=dsproject&hqs=support&#community

http://www.ti.com/corp/docs/legal/termsofuse.shtml

http://www.ti.com/corp/docs/legal/termsofuse.shtml

http://e2e.ti.com

http://support.ti.com/

http://www.ti.com/lit/pdf/SLYZ022

24




12 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.



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PACKAGE OPTION ADDENDUM

www.ti.com 29-Mar-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

TLV7011DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 19N

TLV7011DCKT ACTIVE SC70 DCK 5 250 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 19N

TLV7011DPWR ACTIVE X2SON DPW 5 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 125 7N

TLV7021DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 19O

TLV7021DCKT ACTIVE SC70 DCK 5 250 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 125 19O

TLV7021DPWR ACTIVE X2SON DPW 5 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 125 7P

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

http://www.ti.com/product/TLV7011?CMP=conv-poasamples#samplebuy






PACKAGE OPTION ADDENDUM

www.ti.com 29-Mar-2018

Addendum-Page 2

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

TLV7011DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q2

TLV7011DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q2

TLV7011DPWR X2SON DPW 5 3000 178.0 8.4 0.91 0.91 0.5 2.0 8.0 Q2

TLV7021DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q2

TLV7021DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q2

TLV7021DPWR X2SON DPW 5 3000 178.0 8.4 0.91 0.91 0.5 2.0 8.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 30-Apr-2018

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TLV7011DCKR SC70 DCK 5 3000 190.0 190.0 30.0

TLV7011DCKT SC70 DCK 5 250 190.0 190.0 30.0

TLV7011DPWR X2SON DPW 5 3000 205.0 200.0 33.0

TLV7021DCKR SC70 DCK 5 3000 190.0 190.0 30.0

TLV7021DCKT SC70 DCK 5 250 190.0 190.0 30.0

TLV7021DPWR X2SON DPW 5 3000 205.0 200.0 33.0

PACKAGE MATERIALS INFORMATION

www.ti.com 30-Apr-2018

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

C

4X 0.270.17

3X 0.320.23

0.4 MAX

0.050.00

2X0.48

0.270.17

0.25 0.1

B 0.850.75

A

0.850.75

(0.1)

(0.06)

4X (0.05) (0.25)

2X (0.26)

X2SON - 0.4 mm max heightDPW0005APLASTIC SMALL OUTLINE - NO LEAD

4223102/B 09/2017

PIN 1 INDEX AREA

SEATING PLANE

NOTE 3

1

2

3

4

0.1 C A B0.05 C

5

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The size and shape of this feature may vary.

NOTE 3

SCALE 12.000

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EXAMPLE BOARD LAYOUT

0.05 MINALL AROUNDTYP

(0.21) TYPEXPOSED METALCLEARANCE

(0.48)

(0.78)

4X (0.42)

4X (0.22)

( 0.25)

4X (0.26)

4X (0.06)

( 0.1)VIA

(R0.05) TYP


4223102/B 09/2017

SYMM

1

2

3

4

SYMM

LAND PATTERN EXAMPLESOLDER MASK DEFINED

SCALE:60X

SOLDER MASKOPENING, TYP

METAL UNDERSOLDER MASKTYP

5

NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note in literature No. SLUA271 (www.ti.com/lit/slua271).

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EXAMPLE STENCIL DESIGN

(0.48)

(0.78)

4X (0.42)

4X (0.22)

4X (0.26)

4X (0.06)

( 0.24)

(0.21)TYP

(R0.05) TYP


4223102/B 09/2017

NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

SOLDER PASTE EXAMPLEBASED ON 0.1 mm THICK STENCIL

EXPOSED PAD

92% PRINTED SOLDER COVERAGE BY AREASCALE:100X

SYMM

1

2

3

4

SYMM

EDGESOLDER MASK

5

IMPORTANT NOTICE

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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OFPRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES INCONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEENADVISED OF THE POSSIBILITY OF SUCH DAMAGES.Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, suchproducts are intended to help enable customers to design and create their own applications that meet applicable functional safety standardsand requirements. Using products in an application does not by itself establish any safety features in the application. Designers mustensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products inlife-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., lifesupport, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, allmedical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applicationsand that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatoryrequirements in connection with such selection.Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-compliance with the terms and provisions of this Notice.

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TLV7011 and TLV7021 Micro-Package, Micro-Power, … · US dime (18x18x1.35 mm3) 5-Pin X2SON 5-Lead...

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Transcript of TLV7011 and TLV7021 Micro-Package, Micro-Power, … · US dime (18x18x1.35 mm3) 5-Pin X2SON 5-Lead...