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MEMS
Workshop
Additional
Collaboration
Opportunities
Breakout Group
Participants:
Bill Bader iNEMI
Keith Jackson AM Fitzgerald
Jean-Phillipe Polizzi CEA-LETI
Janusz Bryzek Fairchild
Stephen Breit Coventor
Valerie Marty HP
Michael Muller Fraunhofer IPMS
Mike Pinelis MEMS Journal
David DiPaola Dipaola Consulting
Eric Levy-Meyers MEMS Industry Group
1
Team on Additional Collaboration Opportunities
Next Areas of Collaboration to Enable Rapid Market
Growth
1. Roadmap of the critical applications and devices that constitute the
mass of the volume for the next 10 years
– Accelerometers
– Gyros
– Pressure Sensors
– Etc
2. Effect a structure and system that brings key industry players together
to identify key/common process modules required to support these
applications
– Modules should include process scope, materials, equipment and metrology
– Start with process performance specs and envelope definition
– Wafer level, chip scale integration, package development, test processes
– Key Players Include: TSMC, Intel, Global Foundries, Hankeng, ST, Bosch, ADI, TI, Silex,
Other Foundries, Samsung, Major Equipment Players Assembly and Test
3. And……develop a collaborative approach to work towards MEMS
module integration (MH, ESD, Automation, Communication Interfaces)
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Additional Collaborative Opportunities
4. Develop next generation of simulation tools that can create virtual
data sheets:
– Simulation Tool Vendors, EDA Vendors, Foundry, & Device OEM
collaboration needed
5. Work collectively to create intelligent accurate models for
integrating ASICS and MEMS (not necessarily monolithically)
6. Identify critical industry players needed to define communication
and SW standard for MEMS devices.
7. Standardize transferring of MEMS layouts to foundries via
adoption of improved and approved layout formats.
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Needed To Facilitate FAST Industry Growth
• Government funding support to education and research in
support of MEMS
• Curriculum development and deployment for rapidly
growing MEMS workforce.
– Technician level focused programs in multiple geographic
hubs. Lorrain CC can be the model to follow
• University investments, supported by industry partners, in
developing higher level engineering/scientist workforce
needed to design and manufacture the fastest ramping
products and processes
– Partnering of industry with schools on curriculum
development and updates is key.
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www.inemi.org Email contacts:
Bill Bader
Bob Pfahl
Grace O’Malley - Europe
Haley Fu - Asia