Title No. : Company : Contestant :. 2 Content >Contestant Introduction >Company & Product...

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Title No. Company Contestant

Transcript of Title No. : Company : Contestant :. 2 Content >Contestant Introduction >Company & Product...

Page 1: Title No. : Company : Contestant :. 2 Content >Contestant Introduction >Company & Product Introduction >Product and Mold Development Process >Product.

Title

No. :Company :Contestant :

Page 2: Title No. : Company : Contestant :. 2 Content >Contestant Introduction >Company & Product Introduction >Product and Mold Development Process >Product.

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Content

> Contestant Introduction

> Company & Product Introduction

> Product and Mold Development Process

> Product Development Trend and Challenge

> CAE Application Process

> Moldex3D Successful Application Case Study

> Moldex3D Application Value and Benefit Analysis

> Moldex3D Future Application

Page 3: Title No. : Company : Contestant :. 2 Content >Contestant Introduction >Company & Product Introduction >Product and Mold Development Process >Product.

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Contestant Introduction

> Name:

> Company:

> Department:

> Products in-charge:

> Specialties:

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Company Introduction

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Product Introduction

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Product and Mold Development Process

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Product Development Trend and Challenge

> Development Trend

> Challenge

> Common Problems

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Why CAE?

> Problems encountered

> Short-term solution implemented

> Why utilize CAE Simulation Analysis

> Expected results and objects

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CAE Application Process

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Moldex3D Successful Application Case Study

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Background

> Product Size– Length : mm

– Width : mm

– Height : mm

– Thickness : mm

> Material

> Process Condition– Filling Time : Sec

– Melt Temperature : ℃– Mold Temperature : ℃

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Mesh Model

> Mesh Type

> Mesh Count– Part Mesh:– Runner Mesh:

> CPU CPU Time – Flow:– Pack:– Cool:– Warp:

> Computer Information– CPU: – RAM:

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Runner Layout

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Cooling Channel Design

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Analysis Items and Contents

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Original Design Analysis and Results Interpretation

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Process Parameter

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Melt Front Time

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Filling Analysis _ Internal Temperature Distribution

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Cooling Analysis _ Temperature Distribution

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Cooling Analysis _ Cooling Time

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Warpage Analysis _ Total Displacement

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Warpage Analysis _ Sink Mark Index

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Design Alternatives and Simulation Analysis

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Attempts of Revised Design

> Issues with original design

> Revised Design

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Filling Analysis Result _ Injection Pressure

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Cooling Analysis Result _ Cooling Temperature

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Warpage Analysis Result _ Z-Displacement

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Warpage Analysis Result _ Sink Mark Index

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Comparison of Z-Displacement

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Comparison of Warpage Displacement

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Comparison of Simulation Result and Real Product

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Comparison Result

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Benefit Analysis and Future Application

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Moldex3D Application Value Analysis

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Moldex3D Future Application

> Future Application

> Future Study Direction

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Thank you for your attention!