THRESHOLD Threshold... · Below are some testimoni- ... The Smart phone app, Guidebook, ... For...

Volume 34, No. 6 November/December 2018

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“I think as the first time attendance for ESDA symposium , I really learn a lot, meet with more senior and experience folks then, practice during the hands on session, it’s really good opportunity for me, I already fully took advantage of it, the symposium is very impressive for me.” Chen Xi

“The whole symposium days are really great to me. However, the 40th anniversary celebration party brings another level impression to myself. It is really my honor to attend this celebration and seeing such great people and contributors to ESD area. Thank you all of works to bring those joy to us in these days.”Tzu-Heng Chang

“Attending this year’s symposium was as technically re-warding as ever; the tutorials and workshops are always professionally presented. The exhibits were well attended, and the symposium venue never disappoints. The 40th anniversary celebration made this year’s event even more memorable. The ESDA did a fantastic job (as always) marking this benchmark year. “ Timothy Maroni

“I really enjoyed the symposium. This was my first one. Even though I have been exposed to ESD for several years, I learned many new things. There is so much information to absorb.”Jeffrey Bean

Another successful symposium has concluded. There were over 450 people at the event from across the world. This symposium was the 40th annual EOS/ESD Symposium, there was something for everyone! This year’s symposium featured tutorials, technical sessions, hands-on manufacturing demonstrations, short intense tutorials offered in the manufacturing track, and our new offering- IoT workshop and so much more. This year also introduced many new contests for attendees managed through the mobile app and sponsored by the exhibitors. A few lucky attendees left the conference winning prizes with a $600 dollar value! Below are some testimoni-als from attendees expressing their excitement from the event. We look forward to seeing you at the next EOS/ESD Symposium at the Riverside Convention Center in Riverside, California!

“My fondest memory was how proud and appreciative Stan Weitz was when he was individually recognized for his years of participation in the Symposium. It was a nice moment for one of the early pioneers.”Troy Anthony

“The ESDA symposiums are getting better each year! I learned a lot from the sessions and met more colleagues than ever, each of whom assisted me in expanding my core competency on ESD control which increased the value of me in the eyes of my company. Already looking forward to next year…”Jay Skolnik

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November/December 2018

Have a story or comment about the Symposium? Please send an e-mail to [email protected]. We look forward to hearing from you!

Symposium Testimonials continued..“I’d say that drawing a red card from a deck of cards that led to spinning the wheel that led to me winning 3 hours of online courses was up there! Hanging out with Kara and Sam from Keysight was great as well, we are learning about ESD at a relevant pace and it was great to meet new people with them to open up new dialogues.”Benjamin A. Patterson

“It was nice seeing again a few old friends from the past decades during this 40th anniversary, and sharing with mutual pride, the development of the ESD Symposium into the premier event that it has become with such wide international representation while bringing further ESD focus into the new edges of technology and innovation.”Charvaka Duvvury

“The experience I want to share is that this year the papers 6A.3 and 6A.4 presented are extremely wonderful and useful!”Guangyi Lu

“I was able to connect with a colleague in Germany who has similar interests in modeling of thermal heat pulses caused by ESD. After reading his paper and discussing our comparable approaches to the problem, we think we have a workshop presentation for IEW next spring in Monterey.”Tim Maloney

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May/June 2018

TREK, INC.190 Walnut Street, Lockport, NY USA 14094

Tel: +1-716-438-7555 Fax: +1-716-201-1804 www.trekinc.com • [email protected]

Designer and manufacturer of instrumentation and sensors for measuring surface voltage, ionizer performance, and surface resistivity

ACL STATICIDE840 W. 49th Place, Chicago, IL 60609

Tel: 847-981-9212 Fax: [email protected] • www.aclstaticide.com

Manufacturer of anti-static topicals, dissipative coatings for plastic and floors, ESD workstation products including meters. ISO 9001:2008 certified QS

I want to thank the many volunteers, exhibitors, instructors, speakers, authors, and our headquarters staff for their efforts to organize our 40th Annual EOS/ESD Symposium week. We had the best attendance at the Symposium and Tutorials than we have had in the last several years and the registration trend continues to increase. Several honored guests, past officers, and retired volunteers attended this anniversary event and were pleased to see how the Symposium week continues to evolve. The Honored Guests included Tay Chin Siang and Steven Ronggang Wang from Suzhou TA&A Ultra Clean Technologies Co., Ltd. and Tadashi Takahashi from the Reliability Center of Japan (RCJ). Special Guests included past officers and volunteers Michael Brandt from Marketing Resources Ltd., Tim Jarrett from Boston Scientific, Donald Pierce from Sandia Technologies, Inc., Ted Weggeland from Raincross Corporate Group, Bob Renninger, and Fred Tenzer. Steve Halperin and Stan Wietz were both recognized for attending every Symposium since the beginning in 1979.

There were so many different activities going on this year that it was impossible to attend everything. We strive to offer you different choices and options to customize the event.

EOS/ESD Association , Inc., President;Ginger Hansel, Dangelmayer Associates

From the President

The Manufacturing Track initiated last year returned with exciting short tutorials, case studies, demos, and hands-on activities. We are already making plans to enhance the offerings next year so if there is a subject you think needs more attention, please contact next year’s chair, Michelle Lam. The technical track continues to provide important new information each year. The Technical Program Committee has already sent out the call for papers for next year. Tutorials bookend the week with classes on Sunday, Monday and Thursday and features at least one emerging technology class. Many attendees also participate in the Standards Working Group meetings held the week before the symposium. If you want to know more about how standards are created, your input is welcome during the next virtual meeting series in January 2019. Please check the schedule at ESDA.org calendar page.

Our newest offering was the IoT (Internet of Things) Workshop that brought together experts and industry leaders with strong engagement in IoT who are concerned about the robustness of IoT devices. As this was the first of a kind workshop the focus was on sharing requirements of various application fields and discussion of the new approaches needed and standards beyond what already exists. Sessions were arranged featuring top-level corporate speakers featuring IoT Applications, Design Devices & Modules & Systems, Handling of IoT systems, and Standards for Robustness testing of modular IoT systems. Eleven experts provided high-level seminars providing attendees with specific challenges, basic functional building blocks, and a plethora of IC solutions for features of IoT. Join us next year for the next phase of this event, one not to miss!

The 40th celebration gala on Tuesday night kicked off with a synchronized music and laser show that incorporated lightning gods, chip circuitry, and many other dazzling images. The festivities included clever ESD related songs by some Association members with hidden talents. The event also featured the Association memorial awards that you can read about in this issue.

The pulse of the Symposium Week mixed technical experiences with social interactions. The Professional and Technical Women’s reception continues to be a favored highlight with over 35 attendees this year. A new reception for first time attendees drew 68 people. Fun contests in the registration lobby gave people a little break. The VIP lounge sponsored by the Education committee created a quiet area for conversation. The General Chair’s reception on Wednesday evening was open to all attendees offering another chance to review the technical posters while visiting with old and new ESDA friends. The Smart phone app, Guidebook, kept folks up to date on the schedule and location of activities.

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During conversations, one person mentioned being the only “ESD guy” at his company so he relished the chance to share questions and ideas with colleagues. Another attendee told us he deliberately signed up to take 30% of his tutorials outside his area of expertise in order to grow beyond his comfort zone. Randy Bird from BAE Systems sent this message, “I just wanted to say I thoroughly enjoyed my experience at my first Symposium. It exceeded my expectations. I found everyone to be helpful and friendly and the learning opportunities to be many and valuable.” Check out what others had to say in this issue of Threshold.

Please mark you calendar now and plan to attend the 41st Annual EOS/ESD Symposium and Exhibits, September 11-20, 2019, at the Riverside Convention Center in Riverside, California.

Most importantly, we cannot hold the event without you the attendees and the support we receive from the industry. Thank you to all who attended and to our colleagues that could not join us, we look forward to seeing you next year.

Ginger

Jan-Aug 2018(Unaudited)

2017(Audited)

2016(Audited)

Total Assets $1,876,987 $1,549,956 $1,396,134

Total Liabilities ($37,419) ($89,789) ($50,302)

Net Assets Unrestricted $1,914,406 $1,639,745 $1,446,436

Jan-Aug 2018 (Unaudited)

2017(Audited)

Operating Income $1,130,805 $1,550,187

Functional Expenses $773,795 $1,354,787

Increase (Decrease) in Net Assets $357,010 $195,400

2018 2017 2016

Total Membership 1,118 1,180 1,196

* Note: The un-audited Jan-July 2018 figure does not include 2018 Symposium/Tutorial program expenses

Details published in Threshold – November/December issue

Annual ReportEOS/ESD Associatin inc annnual reprot

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40th Annual EOS/ESD Symposium and Exhibits – A HUGE SUCCESS!!

Another symposium is in the books! It was a great time of re-engaging with old friends, making new contacts, attending great technical and tutorial sessions and enjoying great activities.

If you missed it, not to worry! Preparations are already underway for the 2019 EOS/ESD Symposium!

The 2019 EOS/ESD Symposium and tutorials will be held at the September 15-20, 2019 at the Riverside Convention Center, Riverside, CA, USA

Once again there will be two exciting symposium tracks:

1. EOS/ESD IN MANUFACTURING - CONTROL MATERIALS

2. ON-CHIP ESD DESIGN, INCLUDING SYSTEM LEVEL ESD, TESTING, AND ESD CASE STUDIES

Call for papers is now open and deadline for submission is February 11, 2019. For more information about paper submission requirements go to:

https://www.esda.org/assets/Symposium/2019-Call-for-papers

Plan now to attend!!

Have you been watching for our Linked In posts? Here is one you might have missed! Watch for all of our posts!

by: Matt Strickland, Symposium Steering Committee

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Our website is changing-and we cannot wait to show it to you!

The EOS/ESD Association, Inc. website (esda.org) is getting a face lift. Not only will the design be updated for the 21st century, but navigation, organization, and ease of use is a primary enhancement. Redundant clicking and endless searching for so many offerings is gone! The content of the website is being streamlined with newer functionality and new modules.

Registering and purchasing online classes will happen directly from the website with this new site. Newer payment options and shopping cart ordering will be seamless. The site will be intuitive, engaging and, exciting.

Another great feature of these enhancements is functionality of the Buyers Guide. This re-source facilitates your search of locate suppliers of ESD control products or services. You can search by product, company, or geographic location. With the new site the Buyers Guide is a prominent listing that allows you to scroll through listings without searching by product. Listings will be clearly visible by company and each company has a prominent place on the site.

We look forward to continuing to bring more content and make navigating the esda. org website even easier and cannot wait for you to see the new site. Sit tight-we will unveil it in March.

Are you interested in listing in the Buyers Guide?

Simply send an email to [email protected] for more information about being listed in the BuyersGuide or see the listing form on the next page.

Something new is coming!March 2019

EOS/ESD Association, Inc.7900 Turin Rd., Bldg 3, Rome, NY 13440-2069

Phone: +1-315-339-6937E-mail: [email protected] Web Site: www.esda.org

EOS/ESD Association, Inc. Web Site Buyers Guide ListingOrder Form

Rates:All listings run for 12 months. Listings include company listing, plus listings in various product categories. Your E-mail address will be clickable for direct contact. Your web site address will link directly to your site.

Categories: List our company in the following product categories______ Auditing-facility evaluation______ Automated and Manual Process

Qualification______ Brass Grounding Products______ Brushes______ Cabinets-furniture______ Carts______ Casters______ Cleanroom garments-apparel______ Cleanroom supplies______ Cleanroom-equipment______ Compounds -resins______ Consulting______ Containers totes-boxes-folders______ Design Services-on-chip______ ESD and TLP Component

Level Testing______ ESD and TLP Testers______ ESD Chair Covers______ ESD Control Failure Analysis______ ESD Labels______ ESD Protection: on board______ ESD Protection: on-chip______ ESD System Level Testing______ ESD Workstation Covers

______ Field Service Kits______ Film and sheet-unconverted______ Floor Finishes______ Floor Mats______ Flooring carpet-vinyl-rubber______ Flooring epoxies-urethanes______ Flooring Inter-Lock______ Footwear shoe grounders______ Footwear shoes______ Furniture______ Garments apparel______ Grounding Products______ Hand Tools______ In-Process Equipment Trouble

Shooting______ Ionization______ Laminates______ Materials Handling Equipment______ Monitors______ Packaging bags-flexible______ Packaging corrugated______ Packaging Engineering Design

Services______ Packaging trays-semirigid-rigid______ Packaging: Labels and Tapes

______ Paints and Coatings______ Paper______ Pick and Place______ Polymeric antistatic additive______ Process Charge Profiles______ Product Qualification______ Protection Devices______ Robotics Consulting______ Rubberbands______ Seating______ Simulators______ Standards and publications______ Tapes______ Teaching ESD Standards______ Test and Measurement

Equipment______ Test Labs______ Topical Treatments______ Training-Training Aids-Video

Training______ Tutorials______ Workstations-Workbenches______ Worksurfaces-mats______ Wrist Straps______ Yarns-Tapes-Cords

Company Listing InformationComplete the following as you wish it to appear in the company listing portion of the directory

Company Name________________________________________________________________________________Company Address ______________________________________________________________________________City _______________________________________State/Prov ___________________ Postal Code ___________Country ___________________________________________Phone _____________________________ Fax_________________________Email______________________________________Web Site Address ___________________________________

Contact Information

Name _______________________________________________________________________________Company ____________________________________________________________________________Address _____________________________________________________________________________City _______________________________________State/Prov ___________________ Postal Code ___________Country _______________________________ ____________Phone _______________________ Fax___________________ E-mail __________________________Signed ______________________________________________________________________________

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We would like to congratulateStan Weitz and Steve Halperin for attending every symposium for the past 40 years!

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MONROE ELECTRONICS100 Housel Avenue, Lyndonville, NY 14098

Tel: 585-765-2254 Fax: 585-765-9330E-mail: [email protected]

www.monroe-electronics.comFull line manufacturer of static measurement equipment

CONTROLLED ENVIRONMENTS PO Box 779, Amherst, NH 03031

Tel:973-920-7000 Fax:603-672-3028 www.cemag.us [email protected]

Leading source of digital and print information on contamination prevention, detection, and control for cleanrooms and critical environments.

Outstanding Contributions AwardPresented to Gianluca Boselli (left), by Charvaka Duvvury (right), Awards ChairIn recognition of distinguished con-tributions, service, leadership and achieve-ment in the field of EOS/ESD.

Members and Volunteers awarded for a lasting impact on EOS/ESD Association, Inc!Numerous individuals contribute to the success of the industry, organization, and events. For those who go above and beyond, EOS/ESD Association, Inc. annually recognizes individuals who have made a lasting impact on the Association and the ESD industry. Individuals who have had some significant impact on the organization’s growth and development were honored at the 2018 EOS/ESD Symposium.

Industry Contribution AwardPresented to Qorvo by Charvaka Duvvury (right), Awards chair. Accepted by Nate Peachey, Qorvo, (left).In recognition of consistent and superior service to the EOS/ESD Association through continuing education, technical innovation, and unwavering support of their employ-ees who provide countless volunteer hours.

Industry Pioneer Recognition Award

Presented to David Johnsson (left) by Harald Gossner (right), Awards Committee.In recognition of unselfish devotion to advancing the awareness of EOS/ESD throughout the world and for the signifi-cant contributions you have made to our association and the industry.

General Chair’s PlaquePresented to Jim Miller (left), by Ginger Hansel (right) , EOS/ESD Association, Inc.,PresidentPresented to the General Chair in rec-ognition of their commitment, dedica-tion, and leadership in their position as Symposium General Chair.

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DANGELMAYER ASSOCIATES, L.L.C.14 Butternut Lane, Gloucester, MA 01930

Tel: 978-282-8888 • Fax: 978-282-4884 Email: [email protected] • www.dangelmayer.com

ESD & EOS Consulting Services: No Product Sales!S20.20 Programs, Training, Auditing, CDM, CBE, Class 0, Cleanrooms

IEST - Institute of Environmental Sciences and Technology2340 S. Arlington Heights Road, Suite 100, Arlington Heights IL 60005

Tel: 847-981-0100 • Email: [email protected] • www.iest.comAs secretariat of ISO/TC 209, IEST offers ISO 14644 and ISO 14698

standards, as well as peer-approved standardized procedures, IEST Recommended Practices.

David F. Barber Sr. Memorial Award

Presented to Dave Swenson (left), by Jim Miller (right), 2018 General Chair.In recognition of dedication and me-ticulous attention to the myriad of details associated with the smooth running of a Symposium week activity and a personal attachment and com-mitment that led to service above and beyond the call of duty.

Joel P. Weidendorf Memorial Award

Presented to Dale Parkin (left) by Brett Carn (right), Standards Business Unit Manager.In recognition of significant contribu-tions, service, leadership, and achieve-ment in the field of EOS/ESD Standards Development.

Ed Weggeland Memorial Recognition Award

Presented to John Kinnear (middle), by Ted Weggeland (left), and Lisa Pimpinella (right), Executive Director.In recognition of the exemplary dedi-cation to the EOS/ESD Association through continuous support of programs, leadership in the vari-ous committees and, above all, for making indelible contributions to the management of the organization.

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STATICO541 Taylor Way, #1, San Carlos, CA 94070 USA

Tel: 650-592-4733 Fax: 650-508-0761 • [email protected] • www.statico.comFull Line Manufacturer and supplier of Static Control prod-

ucts.

TRANSFORMING TECHNOLOGIES, LLC3719 King Road, Toledo, OH 43617

Tel: 419-841-9552 • Fax: 419-841-3241 Email: [email protected]

www.transforming-technologies.comTransforming Technologies provides unique and outstanding products to

detect, protect, eliminate, and monitor electrostatic charges.

Symposium Paper AwardsEach year at the EOS/ESD Symposium, the latest research and developments in EOS/ESD technologies are presented in technical presentations by authors from around the world. The selection of papers to be honored by the Association with spe-cial awards is a challenging one and the Association is proud to recognize the efforts that are made by all of the authors of papers submitted for presentation. The 2017 Symposium paper awards presented at the 2018 EOS/ESD Symposium in Reno, NV.

Friendship AwardBest Paper 2017 RCJ

E Low Clamping Voltage Protection for Improvements of

Powered ESD RobustnessKoki Narita (left), Renesas

Electronics Corporation Co-Authors: Mototsugu Okushima, Renesas Electronics Corporation

Presented by Guido Notermans (right), Symposium Vice General Chair.

Best Student Paper as selected by attendee feedback

On-Chip Sensors to Measure Level of Transient Events

A. Patnaik, Missouri University of Science and Technology

Advisor: David Pommerenke Missouri University of Science and

Technology.Co-authors: M. Suchak, R. Seva, K. Pamidimukkala, D. Beetner, Missouri University of Science

and Technology; G. Edgington, R. Moseley, J. Feddeler, M. Stockinger,

NXP SemiconductorsPresented by Guido Notermans (right), Symposium Vice General Chair, accepted by Michael Stockinger on behalf of A. Patnaik (student).

Symposium Best Paperas selected by attendee feedback

Risk Assessment of Cable Discharge Events

Wolfgang Stadler (left), Josef Niemesheim, Andreas Stadler,

Sebastian Koch, Harald Gossner,Intel Deutschland GmbH

Presented by Guido Notermans (right), Symposium Vice General Chair.

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ESDEMC TECHNOLOGY, LLC4000 Enterprise Dr., Suite 103, Rolla, MO 65401

Tel: 573-202-6411 • Fax: 877-641-9358www.esdemc.com

ESDEMC Technology designs, manufactures, and markets ESD/EMC related products and consulting services.

THERMO FISHER SCIENTIFIC INC.200 Research Drive, Wilmington, MA 01887

Tel: 978-275-0800 • Fax: 978-275-0850 www.thermoscientific.com

Leading manufacturer of semiconductor test equipment for the simula-tion of Electro Static Discharge (ESD), Latch-up, and TLP events.

Symposium Outstanding Paper-Manufacturing

as selected by attendee feedbackAn ESD Case Study with High-Speed Interface in Electronics Manufacturing and its Future

ChallengeRita Fung (middle), Cisco Systems Hong Kong, Ltd.; Richard Wong (left), James Tsan, Jatin Batra, Cisco Systems, Inc.Presented by Guido Notermans (right), Symposium Vice General Chair.

Symposium Outstanding Paper-Device

as selected by attendee feedbackFinFET SCR: Design Challenges

and Novel Fin SCR Approaches for On-Chip ESD Protection

Milova Paul, B. Sampath Kumar (middle), Mayank Shrivastava, Indian Institute of Science; Christian Russ (left), Harald Gossner, Intel Deutschland GmbHPresented by Guido Notermans (right), Symposium Vice General Chair.

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RMV TECHNOLOGY GROUP, LLCNASA Ames Research Center

Tel: 650-964-4792 • 650-964-1268www.esdaerospacetraining.org

A NASA Industry Partner“Trust But Verify”

PROLINE10 Avco Rd., Haverhill, MA 01835Tel: 800-739-9067 Fax: 978-374-4885

www.1proline.com E-mail: [email protected] ESD modular and ergonomic work benches

Congratulations to Lisa Pimpinella, Executive Director, for celebrating 25 years!

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DESCO INDUSTRIES INC.3651 Walnut Ave., Chino, CA 91710

www.Descoindustries.com • Tel: CA-909-627-8178• MA-781-321-8370 ESD CONTROL PRODUCTS & MORE. Our brands include: APR, Desco,

Desco Asia, Desco Europe, EasyBraid, EMIT, ESDSystems.com, Menda, Pro-tektive Pak, SCS, SpecialTeam, Statguard, and US Toyo Fan.

NRD - ADVANCED STATIC CONTROL2937 Alt Blvd, Grand Island, NY 14072

Tel: 800-525-8076•716-733-7744•[email protected]•www.nrdinc.comManufacturer of Alpha, Corona, and Passive

Static Control Products

Congratulations to Christina Earl, for celebrating 10 years!

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ESD sensitivity data is not readily available to the public from IC suppliers to determine if a company’s ESD control program can handle its components. It is essential to know when component sensitivities fall below manufacturing capability levels. Both manufacturing and board level design teams need this information in a timely manner to avoid quality and reliability excursions. EOS/ESD Association, Inc. (ESDA) started an initiative to encourage IC suppliers to make the data readily available. The ESDA’s standards working group WG5.0 – Device Testing is working on a docu-ment to address this issue. The final document is expected to be released in early 2019 and will be designated ANSI/ESD SP5.0-2018 - Reporting ESD Withstand Levels on Data Sheets. It is strongly recommended that manufacturing quality executives require notification of any such devices to avoid a production crisis. Likewise, it is strongly recom-mended that IC suppliers make the data readily available either in publicly available data sheets utilizing the standard practice being developed by EOS/ESD Association, Inc. or in other documentation in the case of custom devices.

See: ESDA In Compliance Magazine Article for Details: “Absence of IC ESD Sensitivity Data Has Reached a Critical Stage”. October 2018 Issue: In Compliance Magazine

https://incompliancemag.com/?s=Absence+of+IC+ESD+Sensitivity+Data+Has+Reached+a+Critical+Stage

Lack of IC ESD HBM & CDM Sensitivity Data has reach a Critical Stage!

• 90% of CDM Data Missing from Device Datasheets!• Industry Needs IC Suppliers to Act Now!• See ANSI/ESD SP5.0-2018 – “Reporting ESD Withstand Levels on Data Sheets” upon release• Requirements/Recommendations Will be Added to Other ESDA Standards• YOU need to GET THE DATA!

Get the Data!

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What’s coming up-Watch the website and look for our email blasts!

Manufacturing Symposium in China!

Location: The Pullman ShanghaiDates: May 21-24, 2019

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December 3-4, 2018FC340: ESD Program Development and Assessment

(ANSI/ESD S20.20)December 5th 2018- Optional Program Manager Exam

EOS/ESD Association, Inc., 7900 Turin Rd. Bldg. 3, Rome, NY 13440,USALunch and refreshments provided

EOS/ESD ASSOCIATION, INC., TUTORIAL

FC340: ESD Program Development and Assessment (ANSI/ESD S20.20)Kevin Duncan, Seagate Technology;Dave Swenson, Affinity Static Control LLCCertification: PrM

This seminar provides instruction on designing and implementing an ESD control program based on ANSI/ESD S20.20. The course provides participants with the tools and techniques to prepare for an ESD facility audit. This two-day course is an ESDA certification requirement for in-plant auditors and program managers who are working toward professional ESD certification.

The following topics are covered in this course:• Overview of ANSI/ESD S20.20• How to approach an assessment• Administrative elements• ESD program assessment• ESD program techniques for different applications• Technical elements• Overview of the assessment process• The audit checklist and follow-up questions

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December 3-4, 2018FC340: ESD Program Development and Assessment

(ANSI/ESD S20.20)December 5th 2018- Optional Program Manager Exam

EOS/ESD Association, Inc., 7900 Turin Rd. Bldg. 3, Rome, NY 13440,USALunch and refreshments provided

EOS/ESD ASSOCIATION, INC., TUTORIAL EOS/ESD ASSOCIATION, INC., TUTORIAL

Professional Program Manager Certification Exam (Optional December 4, 2018)

FC340: ESD Program Development and Assessment (ANSI/ESD S202.20)

First Name: Last Name: Company Name: Street: City: State/Province: Country Zip/Postal Code:Address is (please circle the one that applies) Home or CompanyPhone: E-mail:

Course Selection

NOTE: You must initiate an official file in your name at EOS/ESD Association, Inc. headquarters, and complete all pre-requisite courses to be eligable to take the exam.

Accomodations:The Inn at the Beeches7900 Turin Road (Route 26N)Rome, NY 13440Phone: 315-336-1775 Fax: 315-339-2636Email: [email protected](walking distance to class)

Setting the Global Standards for Static Control! EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3, Rome, NY 13440-2069, USA

PH +1-315-339-6937 • Email: [email protected] • www.esda.org

Other forms of payment Contact: EOS/ESD Association, Inc. [email protected]: +1 (315) 339-6937

$60

$1,610 / non-members $1,710

Register Online: http://www.cvent.com/d/1tqh8b

Cancellation & refund requests will be honored only if received in writing no later than October 19, 2018, and are subject to a $50 fee. Any other approved dispositions will also be assessed a $50 fee.

Register before October 19, 2018 $1,510 / non-members $1,610

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2019 International ESD Workshop (IEW)March 31-April 4, 2019Hyatt Regency MontereyOne Old Golf Course Road, Monterey CA, USA

Now in its 13th year, the IEW continues to provide a relaxed, invigorating atmosphere to present new work and engage in discus-sions about the latest issues confronting the ESD and EOS communities. This year, IEW will co-locate with the International Reli-ability Physics Symposium (IRPS)! In addition to everything IEW provides, IEW registrants will can also attend the IRPS technical sessions on ESD and latch-up as well as a joint evening poster reception showcasing works from both conferences. Thus, submis-sions to IEW will receive exposure to a much broader audience. IEW attendees will also be exposed to work from a wider range of reliability topics from IRPS and will have access to IRPS keynotes. IRPS registrants will have access to IEW keynote and invited talks (but not the other unique elements of IEW). IEW will retain those elements which make it the unique experience it is: invited speakers & seminars, discussion groups, and some down time to network and explore the area.

Submission InstructionsSubmission instructions and an abstract template are available at https://www.esda.org/index.php/events/iew/. The submission is in PowerPoint format and should be no longer than 6 slides. Submissions are due December 3, 2018 to [email protected]. The IEW does not publish proceedings, even for IEW-registered posters presented during joint IRPS/IEW poster session. Do not submit the same work to both IRPS and IEW; please choose only one conference for consideration. Walk-on posters are also permitted at IEW with no prior review, but only those works which are submitted for review and acceptance will be included in the five-minute teaser presentation sessions.

New Developments in Latch-Up Emerging product trends such as technology scaling (e.g. FinFet versus planar CMOS), increasing product complexity, and more demanding operation environments (e.g. automotive; high junction temperature; radiation-induced latch-up; etc.) all lead to the stark reality that latch-up will be a major reliability threat for the foreseeable future. There are active teams in the industry working to consolidate learning and best practices for latch-up EDA tools as well to test and qualify the increasingly complex products that are being produced. The IEW welcomes you to share your experience and perspective on this important topic.

System ESDCable Discharge Event (CDE) - test methods, applicability, design impact, potential standardization. System ESD design - co-de-sign between system board and the component (SEED). System ESD simulation methods and component modeling, new stress models. On-chip design methods for improving system ESD. System ESD related failure modes and cases studies. Test methods for validating ESD on the board level - is test standardization of component robustness under system ESD feasible?

Electrical Overstress (EOS)EOS continues to be one of the largest causes of customer returns in the semiconductor industry. Have you recently completed root-cause analysis on a failure with an electrical induced physical damage (EIPD) signature? There is no defined procedure to determine absolute maximum ratings (AMR) for a product. Do you have a methodology for defining AMR for a product, and verify-ing it for different timescales? Are you an FA engineer with experience on case studies identifying EOS damage mechanisms and the ensuing physical evidence? Finding sources of EOS can be a challenge. Do you have experience auditing a manufacturing site for sources of EOS? Bring your work to the IEW and share it with your colleagues.

FOCUS TOPICS FOR IEW 2019

13th Annual International Electostatic Discharge Workshop

December 3rd, 2018

People’s Choice Award will be presented to a poster chosen by attendees.

Co-locating with IRPS

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November/December 201841st AnnualELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM

Sept 15-20, 2019 Riverside Convention Center Riverside, CA, USA

CALL FOR PAPERSTRACK 1: EOS/ESD in Manufacturing – Control Materials, Technologies, and TechniquesParallel TRACK 2: On-Chip ESD Design, including System Level ESD, Testing, and ESD Case StudiesSubmission Deadline: February 11, 2019About the “EOS/ESD in Manufacturing” TrackFor the third year, “EOS/ESD in Manufacturing” offers a full track of activities dedicated to EOS/ESD in manufacturing – control materials, technologies and techniques. This manufacturing track focuses on acombination of full technical papers, short papers, poster presentations, invited papers, discussion groups and workshops, hands-on demonstration sessions, and practical demonstrations of equipment by current exhibitors. The Call for Papers describes the offerings and submission requirements. Each abstract submission selects the track, format, and suggested area using the abstract toolkit available on the EOS/ESD Association, Inc. website www.esda.org.

Parallel Track Options are:

1. EOS/ESD IN MANUFACTURING - CONTROL MATERIALS,TECHNOLOGIES, AND TECHNIQUES□

2. ON-CHIP ESD DESIGN, INCLUDING SYSTEM LEVEL ESD,TESTING, AND ESD CASE STUDIES □

SUGGESTED SUBMISSION AREA FROM PAGE 3: SUGGESTED SUBMISSION AREA FROM PAGE 4:

STUDENT PAPER □ STUDENT PAPER □

FULL TECHNICAL PAPER □CONSIDER THIS SUBMISSION FOR POSTER SESSION □

SHORT TECHNICAL PAPER OR CASE STUDIES □CONSIDER THIS SUBMISSION FOR POSTER SESSION □

POSTER SESSION □DISCUSSION GROUP □WORKSHOP □HANDS-ON DEMONSTRATION □

FULL TECHNICAL PAPER □DISCUSSION GROUP □WORKSHOP □POSTER SESSION □

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EOS/ESD Symposium CALL FOR PAPERSTRACK 1: EOS/ESD in Manufacturing – Control Materials, Technologies, and TechniquesParallel TRACK 2: On-Chip ESD Design, including System Level ESD, Testing, and ESD Case StudiesSubmission Deadline: February 11, 2019

About the EOS/ESD SymposiumEOS/ESD Association, Inc. is sponsoring the 41stAnnual Symposium on Electrical Overstress (EOS) and Electrostatic Discharge (ESD) effects. The Symposium is dedicated to the understanding of issues related to electrostatic discharge and electrical transients / overstress, and the application of this knowledge to the solution of problems in consumer, industrial, and automotive applications, including electronic components and manufacturing, as well as in systems, subsystems, and equipment.

Papers/ContributionsThe Technical Program Committee solicits symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to EOS/ESD.

Electronic SubmissionsAbstract submissions shall be made electronically via an emailed PDF file to [email protected]. One file for each submission is required.

DeadlinesThe abstract submission deadline is Monday,February 11, 2019. Abstracts not meeting guidelines may not be accepted. The final submission deadline for the finished papers is Friday, June 3, 2019. ESDA reserves the right to withdraw any paper or presentation that does not meet the guidelines, including deadlines. Your paper MUST be submitted by the deadline. Final full technical papers will be limited to a maximum of 10 pages -guidelines will be provided after acceptance of the paper.

Paper AcceptanceThe Technical Program Committee accepts unpublished papers for peer review with the understanding that the author will not publish the work elsewhere prior to presentation at the Symposium. Presentation of your work at the earlier International ESD Workshop (IEW) or the Symposium for Manufacturing Issues will not preclude your Annual Symposium abstract submission. The submission must follow guidelines and be expanded significantly in the abstract submission for the EOS/ESD Symposium. Publication of accepted papers in any form prior to presentation at the Symposium may result in the paper being withdrawn from the Symposium Proceedings. Authors must obtain appropriate company and government clearances prior to submitting their abstracts.

Paper Awards and RecognitionAwards are presented annually for the Symposium Outstanding Paper (selected by Symposium attendees), the Best Paper (selected by the Technical Program Committee), and the Best Student Paper. The Best Paper is considered for presentation at the RCJ EOS/ESD Symposium in Japan. The Outstanding Paper is considered for presentation at the ESD Forum in Germany. Eligible student contributions for the Best Student Paper Award should be marked as such by the authors at the time of abstract submission.

Accepted full technical papers covering selected topics may be considered for review for invited publications in IEEE Transactions on Device and Materials Reliability (TDMR), IEEE Transactions on Electron Devices, the Microelectronics Reliability Journal, the Journal of Electrostatics, or other appropriate publications.

Sponsored by EOS/ESD Association, Inc. in cooperation with IEEE.Technically co-sponsored by the Electron Devices Society.

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November/December 2018Papers / Presentations / Group Sessions in Track 1. EOS/ESD in Manufacturing – Control Materials, Technologies, and Techniques are solicited in the following areas and formats:

A. Full Technical PaperAuthors must submit a maximum 50 word abstract and 4-page maximum summary of their work. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors suggest the appropriate technical area related to their submission. Authors are required to use the abstract submission toolkit available on the EOS/ESD Association, Inc. website www.esda.org.

B. Short Technical Paper or White Paper with Presentation of Case StudiesAuthors must submit a maximum 50 word abstract and 2-page maximum summary of their work. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors suggest the appropriate technical area related to their submission. Authors are required to use the abstract submission toolkit available on the EOS/ESD Association, Inc. website www.esda.org.

C. Poster SessionAuthors must submit abstracts in the form of a short PowerPoint presentation. After the title slide, the second slide of the presentation should describe the objective and significance in a maximum 200 word summary. The abstract presentation should not exceed 5 additional slides; with representative data and figures that will be the foundation for the longer poster maximum of 24 slides that you plan to present. A formal five minute presentation is given by each author followed by the poster session. Authors are required to use the abstract submission toolkit available on the EOS/ESD Association, Inc. website www.esda.org.

D. Workshops and Discussion GroupsProposals for workshops and discussion groups must be submitted with an abstract describing the proposal. The abstract toolkit is used to indicate participation as a workshop moderator or committee participant. Workshops address fundamentals and generally accepted techniques. Topics consider present and future challenges and solutions to problems. Discussion Groups address EOS/ESD novel ideas. Ideas consider new developments or common myths dispelled. The discussion should encompass some provocative points of view.

E. Hands-on Demonstration SessionsProposals for hands-on demonstrations of measurement techniques must be submitted with an abstract defining the presentation and measurement. Authors complete a presentation describing the measurement technique followed by a hands-on station for attendees to perform the measurement as described. Application, limitations, and common pitfalls should be discussed. Authors are required to use the abstract submission toolkit available on the EOS/ESD Association, Inc. website www.esda.org. (Note: ESDA does not provide equipment).

Track 1 Suggested Submission Areas:

• ESD Packaging and Handling Procedures

• EOS/ESD Detection and Measurement Techniques

• ESD Facility Design, Mitigation in Test and Manufacturing; Ionization

• Manufacturing EOS/ESD Case Studies, Reviews and Analysis

• EOS/ESD Process Assessment

• ESD Control Materials and Use of Antistatic Materials

• ESD Issues in 2.5D & 3D Stacking and TSV

• Control Program Topics (Cost/Benefit Analysis, training, etc.)

• ESD control in Graphic Arts, Explosives & Pyrotechnics, Oil/Petroleum/Biomedical/Chemical Industry

• Standards – Comparison and Analysis

Contact information for questions or further information:

EOS/ESD Association, Inc.Lisa Pimpinella

EOS/ESD Association, Inc.7900 Turin Road, Building 3

Rome, NY 13440 USAPhone: (+1) 315-339-6937

e-mail: [email protected]

Technical Program ChairWolfgang Stadler

Intel Deutschland GmbHNeubiberg, Germany

Phone: (+49) 160-8935308


EOS/ESD in Manufacturing Chair: Michelle Lam, IBM

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Technical Program ChairWolfgang Stadler

Intel Deutschland GmbHNeubiberg, Germany

Phone: (+49) 160-8935308e-mail: [email protected]

EOS/ESD Association, Inc.Lisa Pimpinella

EOS/ESD Association, Inc.7900 Turin Road, Building 3

Rome, NY 13440 USAPhone: (+1) 315-339-6937


Papers / Presentations for Track 2. On-Chip ESD Design track, including System Level ESD, ESD Testing, ESD Case Studies are solicited in the following areas:

A. Full Technical Paper Authors must submit a maximum 50 word abstract and 4-page maximum summary of their work. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors suggest the appropriate technical area related to their submission. Authors are required to use the abstract submission toolkit available on the EOS/ESD Association, Inc. website, www.esda.org.

B. Workshops and Discussion GroupsProposals for workshops and discussion groups must be submitted with an abstract describing the proposal. The abstract toolkit is used to indicate participation as a moderator or committee participant. Workshops address fundamentals and generally accepted techniques. Topics consider present and future challenges and solutions to problems. Discussion Groups address EOS/ESD novel ideas. Ideas consider new developments or common myths dispelled. The discussion should encompass some provocative points of view.

C. Poster SessionAuthors must submit abstracts in the form of a short PowerPoint presentation. After the title slide, the second slide of the presentation should describe the objective and significance in a 200 word maximum summary. The abstract presentation should not exceed 5 additional slides; with representative data and figures that will be the foundation for the longer poster maximum of 24 slides that you plan to present. A formal five minute presentation is given by each author followed by the poster session. Authors are required to use the abstract submission toolkit available on the EOS/ESD Association, Inc. website, www.esda.org.

Track 2 Suggested Submission Areas:I. Advanced CMOS (Analog/Digital) EOS/ESD and Latch-up

• ESD Issues in Advanced Technologies (Multi-gate, FinFET, SOI, SiGe, Compound, Graphene, nanowire, etc.)

• On-Chip ESD Protection Devices & Techniques in Advanced CMOS Technologies

• IC Design and Layout Issues

• Circuit Simulation of EOS/ESD Events in Advanced CMOS Technologies

• DC/Transient Latch-up Issues and Solutions, Troubleshooting, Simulation

• ESD Issues in 2.5D & 3D Stacking and TSVII. ESD Protection in Bipolar, RF, High Voltage and BCD Technologies

• ESD Issues in Bipolar, RF, High Voltage and BCD Technologies and power Technologies (SiC, GaN, etc.)

• On-Chip ESD Protection Devices & Techniques in Bipolar, RF, High Voltage and BCD Technologies

• IC Design and Layout Issues

• Circuit Simulation of EOS/ESD Events in Bipolar, RF, High Voltage and BCD Technologies

• DC/Transient Latch-up Issues and Solutions, Troubleshooting, Simulation

• ESD Circuit Simulation and Co-Design III. Numerical Modeling and Simulation for On-Chip ESD Protection

• ESD Device TCAD Simulation• Simulation Tool and Methodology

• Numerical Modeling and Physics of EOS/ESD Events• TCAD/Circuit Co-simulation

IV. EOS/ESD Failure Analysis, Troubleshooting and Case Studies• EOS/ESD Case Studies, Reviews and Analysis• EOS/ESD Phenomena in MEMS (Microelectromechanical

Systems)• Failure Analysis Techniques and Interpretations

• EOS/ESD Component Failure Analysis• Testing of MR/TMR Heads and Ultra-Sensitive Devices• EOS/ESD Protection for Aircraft, Spacecraft and Avionics

V. Device Testing: Testers, Methods and Correlation Issues• Transmission Line Pulse Testing Systems • Novel EOS/ESD Test Methods• Novel TLP Measurement Results

• HBM, CDM Tester Issues and Solutions• Tester Correlation Issues• Standards – Round-Robin Testing, Results and Analysis

VI. System Level EOS/ESD/EMC, HMM• System Level EOS/ESD/EMC Test Methods • System Level EOS/ESD Modeling and Simulation• EOS/ESD Simulators, Calibration and Correlation

• Transient ESD/EMI Induced Upset• Case Studies, Reviews and Analysis• Standard Test Boards as an Early Measure of Robustness

VII. Chip/Module/Package EOS/ESD Electronic Design Automation • Novel EOS/ESD EDA Tools• ESD Checking and Verification Methodology

• Application of EDA tools for EOS/ESD Failure Analysis, Design and Verification

Contact information for questions or further information:

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September/October 2018

EOS/ESD Symposium

This will be the final series of past papers. Returning to the subject at the beginning of the series, this set of papers from 1992, 2002 and 2012 deal with triboelectric testing. These papers have contributed to the understanding of the triboelectric phenomena and have influenced standards.

Triboelectric Testing of Packaging Materials – Practical Considerations: What is Important? What Does it Mean? 1992 EOS/ESD Proceedings

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November/December 2018Triboelectric Testing of Packaging Materials – Practical Considerations: What is Important? What Does it Mean? 1992 EOS/ESD Proceedings

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November/December 2018Triboelectric Testing of Packaging Materials – Practical Considerations: What is Important? What Does it Mean? 1992 EOS/ESD Proceedings

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28

RTP COMPANY580 East Front Street, Winona, MN 55987 USA

Tel: +1-507-454-6900 • Fax: +1-507-454-2041 [email protected] • www.rtpcompany.com

Engineers from RTP Company develop customized thermoplastic compounds in over 60 different resin systems for applications requiring color conductive, elastomeric,

flame retardant, high temperature, structural, and wear resistant properties.

BARTHELECTRONICS.COM702.293.1576

JS-002 Compliant CDM Test Heads for RCDM3 or Orion Testers & non-compliant JEDEC Conversions.

1589 Foothill DriveBoulder City, NV USA 89005

[email protected]


PB

LUBRIZOL ADVANCED MATERIALS, INC.9911 Brecksville Rd. Brecksville, OH USA 44141

Tel: +1-888-234-2436 Email: [email protected] www.lubrizol.com/Engineered-Polymers

Lubrizol is a global leader in supplying innovative polymer solutions for applications in the electronics, industrial, and sports and recreation markets.

TECH WEAR, INC.6154 Innovation Way, Carlsbad, CA 92009

Tel: 760-438-7788 Email: [email protected] www.techwear.comIndustry leader in static control garments, including groundable cleanroom

garment systems.


30

GRUND TECHNICAL SOLUTIONS, INC.370 South Abbott Ave, Milpitas, CA 95035 USA

Tel: 408-216-8364, Fax: 408-217-0160 Email: [email protected] www.grundtech.com

GTS is a leader in the design & manufacture of electrostatic discharge (ESD), transmission pulse (TLP), and charged device model (CDM) test

equipment

SelecTech, Inc.33 Wales Ave, Suite F, Avon MA 02322 USA

Ph: 508-583-3200 Fax: 877-738-4537 Email: [email protected] www.selectechinc.com

Manufacturer of StaticStop interlocking flooring


PB

KEY RESIN COMPANY, INC.4050 Clough Woods Drive, Batavia, OH 45103

513-943-4225, Fax 513-943-4255 [email protected] www.keyresin.com

Manufacturer of conductive and ESD resinous flooring and floor sealers.KEY RESIN WEST 1315 E. Gibson, Suite D., Phoenix, AZ 85034

602-523-9353, Fax 602-523-9349

Polyonics28 Industrial Park Dr., Westmoreland, NH, 03467 USA

Ph: +1-603-352-1415 Email: [email protected] • www.polyonics.com

Polyonics maunufactures ANSI/ESD S20.20 compliant low charging labels, tapes, and film

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PB

SCS - Formerly 3M Static Control914 JR Industrial Drive, Sanford, NC 27332 USA

Ph: 919-718-0000 www.staticcontrol.comESD control products: bags, floortiles, foot grounders, ionizers, mats, testers & monitors, smocks, vacuums, wrist straps, Static Control Management and

more.

Innovative Circuits Engineering, Inc.2310 Lundy Avenue, San Jose, CA 95131 USA

Ph: +1-408-955-9505 Fax: +1-408-955-9599 www.icenginc.comProviding reliability testing, ESD testing, and failure analysis services for es-

tablished and startup organizations in the United States and around the globe.

PB

May/June 2018


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Antistat, Inc.3913 Todd Lane #106 Austin TX USA

Ph: +1-512-377-9010 Email: [email protected] www.antistat.com

Award winning Global supplier of ESD, Production, and Cleanroom consum-ables to the world’s Electronics, Automotive, Pharma, & Biotech sectors.

Core Insight, Inc.186 Galmachi-ro, Seongnam-city, Gyeonggi-do, 13230, Korea

Phone: +82-31-750-9200. Email: [email protected]: www.coreinsight.co.kr

Steady-State DC Ionizer Manufacturer for BenchTop, Overhead, Nozzle, Gun, Air Assist, and Ceiling Ionizers

Triboelectric Testing at KSC Under Low Pressure and Temperature 2002 EOS/ESD Proceedings continued

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Molded Fiberglass Tray Co.6175 US Highway 6, Linesville, PA 16424 USA

Ph: +1-814-683-4500 Fx: +1-814-683-4504 www.mfgtray.com

Manufactures fiberglass reinforced plastic Fiberstat ESD products; trays, bins, totes, and mats

HPPI GmbH Stadlerstrasse 6A, D-85540 Haar, Germany

Phone: +49 (0)89 / 878 06 98 – 443; www.hppi.de Development and sales of ESD Testers


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HANWA ELECTRONIC IND. CO., LTD. 689-3, Ogaito, Wakayama, Japan 649-6272

TEL:+81-73-477-4435 • FAX:+81-73-477-3445 [email protected] • www.hanwa-ei.co.jp

Full Automatic Wafer Level ESD Tester / HBM, MM, HMM, and SCM ESD Tester, TLP Tester/ CDM Tester/ Electrostatic Imaging System

Advanced Test Equipment Rentals10401 Roselle Street San Diego, CA 92121

Toll Free: 800-404-ATEC (2832) • Fax: 858-558-6570 [email protected] • www.atecorp.com

ESD control failure analyis, TLP testers, simulators, test and measurement equipment.


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NQA 289 Great Rd., Suite 105, Acton, MA 01720

(800) 649-5289 • [email protected] • www.nqa.comLeading global ANSI/ESD S20.20 certification body audit firm - providing

accredited ESD facility certifications and a full suite of ISO services

Simco-Ion1601 Harbor Bay Pkwy, Ste 150

Alameda, CA USA 94502800-367-2452 510-217-0484 [email protected]

www.simco-ion.comSimco-Ion has been the world’s largest provider of solutions for static charge control for over 40 years. Products include ioniz-

ing bars, ionizing blowers, in-line ionizing products with balance control as low as ±1V, Novx real-time monitors and ESD event

detection.


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November/December 2018Triboelectric Testing at KSC Under Low Pressure and Temperature 2002 EOS/ESD Proceedings continued

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Advanced Test Equipment Rentals10401 Roselle Street San Diego, CA 92121

Toll Free: 800-404-ATEC (2832) • Fax: 858-558-6570 [email protected] • www.atecorp.com

ESD control failure analyis, TLP testers, simulators, test and measurement equipment.

NQA 289 Great Rd., Suite 105, Acton, MA 01720

(800) 649-5289 • [email protected] • www.nqa.comLeading global ANSI/ESD S20.20 certification body audit firm - providing

accredited ESD facility certifications and a full suite of ISO services


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Triboelectrification of Static Dissipative Materials 2012 EOS/ESD Proceedings

Triboelectrification of static dissipative materials

Toni Viheriäkoski (1), Peter Ristikangas (2), Jukka Hillberg (3),

Heikki Svanström (4), Terttu Peltoniemi (5)

(1) Cascade Metrology, Hakulintie 32, FI-08500, Lohja, Finland

tel.: +358 445688599, e-mail: [email protected]

(2) Premix Oy, Muovitie 4, FI-05201 Rajamäki, Finland

(3) IonPhasE Oy, Hepolamminkatu 29, FI-33720, Tampere, Finland

(4) VTI Technologies Oy, Myllynkivenkuja 6 FI-01620, Vantaa, Finland

(5) Nokia Siemens Networks Oy, Kaapelitie 4, FI-90620 Oulu, Finland

50 Words Abstract - Static dissipative surfaces may cause an unexpected charging of electrostatic sensitive

devices having dielectric surfaces. We have demonstrated how triboelectric charging between an insulating and

grounded static dissipative object can be more critical than charging between insulating pairs. In addition a

novel test method for characterizing triboelectric friction is presented.

I. Introduction Electrostatic discharge (ESD) control items typically have static dissipative properties for ensuring the

proper protection against ESD. Static dissipative

objects are mainly used to reduce the influence of

electrostatic fields to ESD sensitive devices. On the other hand, the energy dissipation of the discharge

circuit is often directed to the static dissipative ESD

control items.

Protective functions of static dissipative materials are

important, but drawbacks related to electrical

conductivity are often unrecognized. Triboelectric

charging between an insulating object and grounded static dissipative or conductive object may be more

effective than charging between insulating pairs.

Triboelectrification or contact electrification refers to

the charging process, where two materials are

connected and separated from each other. In theory, contact electrification is a consequence of electron

transfer, which is influenced by the work functions of

the materials. In addition, charging depends on the

density of surface states and actual contact area

between the objects. Electrons flow from the material

with a lower work function to material having a

higher work function. The charge flow terminates

when the Fermi levels are equalized [1].

The energy states are compared with the vacuum state

which represents the lowest possible energy in nature.

When materials are connected together, the energy

states will be shifted from the original levels

compared with the vacuum state.

In practice a conductive or static dissipative object is

typically connected to the ground if the ESD

protection principles are followed. The static

dissipative object is then bonded to the ground level

preventing the floating energy states. The simplified

example of the electric potentials after triboelectric

friction and separation is shown in Figure 1.

Figure 1: Triboelectrification between Polyethylene film and

PTFE surface

Negative side

of the series

Friction between

insulating objects

Static dissipative

PE forced to the

ground potential

during the friction

PE

PTFE

+

-

Triboelectric series

Electric potential

40

May/June 2018


After contact electrification both objects will have an

equal amount of charges with the different polarities.

This physical rule makes it possible to ensure the

measurement is made correctly and charges or electric

field lines are not lost during the measurement. In practice, both objects shall be measured at the same

time during the friction. The test method for

triboelectric friction is presented in the second

chapter. Results and conclusions are shown in next

chapters and finally the subject is discussed in

Chapter V.

II. Tribocharging test method Measurement setup consists of two planar electrodes,

two charge meters and oscilloscope (Figure 2).

Figure 2: Test Setup

The bottom electrode consists of 3 mm thick

aluminum plate, 2 mm thick friction layer and

isolation pads. The bottom electrode is placed on a ground plane made of steel. The top electrode consists

of a conductive rubber surface and approximately 2.3

kg weight made of stainless steel.

The electrodes were connected to the virtual ground

of the integrating type of charge meters. The analog

outputs of the meters were connected to the inputs of

the oscilloscope. Charge transfer was measured during

the movement of the top electrode on the bottom

electrode. Electrostatic influence of the friction

surface was measured from the bottom electrode.

Charge flow of the sample, was measured from the

top electrode.

A. Initialization

The bottom electrode and the sample were both

carefully neutralized with the blower type of ionizer.

The sample was placed on the bottom electrode

connected to the charge meter. The top electrode connected to another charge meter was then placed on

the top of the sample. An initial state of charge

densities caused by the placement of the sample and

top electrode was ignored from the measurements of

triboelectric friction. Therefore the meters were reset

before friction.

If the sample has slowly dissipative electrostatic

properties, charge transfer may be indicated after

reset. In this case meters will be reset again when the

reading of the meter is stabilized. The setup is then

ready for the friction test.

B. Procedure

The top electrode together with the sample was

shifted manually with an electrically isolated rod on

the bottom electrode. Velocity of the movement was

approximately 10 cm per second. The velocity was

recorded with an oscilloscope. Unwanted

triboelectrification caused by generating the motion was prevented by small touching area between the top

electrode and the rod. The rod was ionized before

touching the top electrode. The charging effect of the

rod was noticed to be negligible (< 1/100) in

comparison with the friction.

Charge transfers during the sliding of top electrode.

Results were continuously recorded from both

electrodes with an oscilloscope until the motion was

stopped and charge flow was substantially slowed

down. If both samples were insulating, influenced

charge transfer was measured from the bottom

electrode after removal of the sample.

The test sequence was repeated at least five times.

Minimum, maximum, and median of the readings and

the friction time of the reading representing the

median were recorded for each sample under test.

III. Case studies This paper presents three different case studies. As in

many other triboelectrification studies [2] the friction surface was chosen from the negative end of the

triboelectric series to ensure the best possible

repeatability for the tests. In addition, Polycarbonate

Sliding top Electrode

Sample under test

Ground Plane Bottom electrode

Friction surface

Oscilloscope

[nC] [nC]

Isolating rod

- +

Conductive rubber

Isolation pads

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November/December 2018Triboelectrification of Static Dissipative Materials 2012 EOS/ESD Proceedings

was chosen for the friction surface to test opposite

polarities of the static dissipative thermoplastic

compounds.

All the tests were made in the conditions of (12 ± 3)

% RH and (23 ± 2) °C.

A. Polyethylene film

Three structures of the static dissipative Polyethylene

bags were studied from the triboelectrification point

of view. The first sample had insulating surfaces (s >

10 T). The second sample had one static dissipative

surface (s = 10 G) on insulating base material (v >

10 Tm). Both surfaces of the third sample were

static dissipative (s = 10 G) and middle layer was insulating (v > 10 Tm). Forth sample had insulating

surfaces (s > 10 T) but the middle layer was static

dissipative. The middle layer was verified in a

changing electrostatic field. [3]

The friction area was approximately 60 cm2.

Table 1: Comparison between static dissipative structures of Polyethylene films, Friction against PTFE

Triboelectrification of the static dissipative samples

was found to be more effective compared to the

insulating surfaces.

B. PC/ASA IDP compounds

Four pieces of electrically homogenous specimens

were analyzed. The specimens were made of

Polycarbonate Acrylonitrile Styrene Acrylate. The

friction area was approximately 100 cm2. Electrical

conductivity of the specimens was realized with the

compounds of inherently dissipative polymers. The

results of comparison tests are shown in Table 2.

Examples of charge transfer during the friction are

shown in Figures 3 and 4. The more conductive the

sample was, the more efficient was tribocharging

during friction.

Table 2: Comparison between static dissipative PC/ASA IDP

compounds, Friction against PTFE

Figure 3: Friction against slowly dissipative specimen, 7 % IDP

Figure 4: Friction against static dissipative specimen, 15 % IDP

C. HIPS static dissipative compounds

Four pieces of thermoplastic compound samples

based on High Impact Polystyrene measured.

Permanent static dissipative properties were build in polymer chains. The friction area was approximately

100 cm2. The results of comparison tests are shown in

Tables 3 and 4. Examples of charge transfer during

the friction are shown in Figures 5 and 6.

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Table 3: Comparison between HIPS compounds

Friction against PTFE

Figure 5: Friction between static dissipative specimen and PTFE,

100 % D compound

Table 4: Comparison between HIPS compounds Friction against Polycarbonate

Figure 6: Friction between static dissipative specimen and

Polycarbonate, 100 % D compound

IV. Conclusions It is evident that static dissipative surfaces can charge

up insulating surfaces more efficiently than insulating

surfaces. We have demonstrated a correlation between

resistivity and triboelectrification with several

samples in the case of friction between grounded

static dissipative and insulating surfaces. The more

conductive an object was the more efficient was the

triboelectrification against opposite insulating

material.

On factory level, static dissipative objects are mainly

used for reducing the influence of electrostatic fields or for attenuating electrostatic discharges [4]. From

the triboelectrification point of view, the back flow

prevents charge accumulation while the pair is

separated if both objects are conductive enough.

However, in electronics industry, insulators are often

needed and therefore charging properties should be

taken into account when ESD control items are chosen. Static dissipative surfaces are not always the

best solutions for prevention of triboelectrification of

process relevant insulating materials in EPA’s.

V. Discussion Triboelectrification aspect is often understated,

ignored or misunderstood. This study was previously

launched after finding the real world case, where the

static shielding bag having a static dissipative inner

layer caused efficient triboelectric charge

accumulation for large ASICs on printed wiring board (PWB) when the PWB was pulled out from the bag.

In this case operator was touching the PWB only to

the electrically isolated sides of the board due to prevention of contamination and mechanical stress.

Charged board type of ESD event (CBE) occurred

when the PWB was placed on a grounded metal

chassis. Because of the CBE type of ESD failures, the

yield in manufacturing line decreased from 100 %

below 70 % during cold and low humidity period in

winter. The problem was finally solved by changing the intimate shielding bag to a static dissipative tray.

The same failure mechanism was early explained in

detail by David Swenson and Ron Gibson in

EOS/ESD Symposium proceedings in 1992 [5].

The previous studies related to triboelectrification of

PTFE and quartz was fairly criticized because the

results of extreme materials are useless for

applications. Therefore it is highly recommended that

comparison measurements for acceptance tests shall

be made by choosing the real candidates of the

materials to be chosen for the application.

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Chargeability of product parts and process relevant

insulators must be evaluated case by case. It is

important to note that triboelectrification is highly

related to the test arrangement and tolerable

repeatability is difficult to achieve in practice. In this study PTFE and Polycarbonate was used as a friction

surface due to the extreme dielectric properties

gaining chargeability information for the better

understanding about tribolelectrification as a

phenomenon.

A position of the material in the triboelectric series is

often expressed as a tendency to be polarized during

triboelectrification. This rule applies only to the pairs

of materials in contact electrification. The other

material from the electrically floating pair charges up

positively even if both of the materials are positioned

on the negative side of the triboelectric series. In electronics industry, static dissipative materials are

typically on the negative side of the series, but it does

not mean that they always charge up to negative

polarity.

Acknowledgements We would like to thank Mr. Jorma Sipiläinen from

Premix Oy for preparing the samples for the study. In

addition we appreciate valuable support given by

Dipl.-Ing. (FH) Rainer Pfeifle from Wolfgang

Warmbier GmbH & Co. KG, Germany, while

mentoring the paper.

References [1] Electrostatic Discharge in Electronics, William D.

Greason, The University of Western Ontario,

Canada

[2] Triboelectric Charge Accumulation Testing, ESD

ADV11.2-1995, ESD Association Advisory

[3] Characterizing Slowly Dissipative Materials,

EOS/ESD Symposium, 2010 32nd, Viheriäkoski,

T.; Laajaniemi M.; Niemelä S.; Hillberg J.;

Tamminen P. EOS/ESD

[4] Electrostatic discharge attenuation test for the characterization of ESD protective materials

Jaakko Paasi, Toni Viheriäkoski, Pasi Tamminen, Lassi Sutela, Journal of Physics: Conference

Series 142 (2008) 012038

[5] Triboelectric Testing of Packaging Materials:

Practical Considerations. What is Important?

What does it mean? David E. Swenson, Ron

Gibson, 1992 EOS/ESD Symposium Proceedings,

EOS/ESD Association INC. Rome, New York

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Q) My question is on mobile carts grounding in respect to carts used to transport product, ESDS, etc.These carts could consists of metal/wire (METRO-type) shelving with casters. Our EPA areas have ESD protected flooring.

All of our carts are grounded using a “drag chain” method. This method was established during the development of our ESD S20.20 program-Are drag chains allowed to be used to ground mobile carts or must ESD casters be used instead?

Electrically bonding carts to the ESD protective floor with a drag chain is acceptable as long as it is functioning correctly. Make a resistance measurement from a shelf on the cart to ground (at a workstation) to see if you have continuity from the cart, through the floor to ground. In order to be in compliance the cart resistance to ground would have to be < 1 x 10E9 ohms. It is also a good idea to move the cart around while making the measurement to make sure continuity is maintained while the cart is in motion.”

Q) We have conductive tools that are currently used in our EPA. We do have product qualification for these items but my question is, do they need to be listed as “ESD Control Items” and are they also subject to Compliance verification?

Thank you for your question. Fundamentally, everything that you list in your ESD control program plan as an ESD control item must be considered in the compliance verification plan. For conductive tools, it is likely best to avoid listing them in your plan unless they are an intimate part of the process. Maintaining your information on Qualification is important but you likely can avoid the routine compliance verification testing - especially if the tools are rugged and unlikely to fail to an insulative state. Hand-tools (pliers, cutters etc.) are in this category unless they have insulative handles that have to be treated with something to maintain dissipative properties. These types of tools would need to be part of the compliance verification plan.

The response given is a service to industry; EOS/ESD Association, Inc. is not responsible for content. The users of this information need to determine the suitability of the response

Q&A

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