Background:Light Emitting Diodes, or LEDs, have been used in industrial applications like signal indicators for decades. Recently, advances in LED technology have produced products with much higher power and brightness, creating the need for effective thermal management. Since LED light output is directly related to its temperature, it is important to consider thermal management when designing LED-based products.

As LEDs are adopted into more applications, enclosures become miniaturized and power densities increase. Thermal Interface Materials (TIMs) which effectively transfer the heat are required. Parker-Chomerics TIMs offer excellent thermal conductivity (i.e. low thermal impedance) and long-term reliability allowing for preservation of high brightness light output.

Product Attributes:• DecreasesLEDjunctiontemperatures,

increasingproductlifetimes.• Excellentlongtermreliability• LowThermalImpedance• Peel-N-StickPads• ExcellentdispensabilityforGelsand

Cure-In-Place(CIP)Products• DielectricStrength• Manyformstofitapplications:Tapes,

Gels,ThermalPads,Dielectricpads,CIP’s,Greases

Typical Applications• LCDLightEngines(i.e.LapTops

andRuggedizedDisplays)• ArchitecturalLighting• AutomotiveLighting• TrafficLightsandSigns• StreetLighting• Industrial/SafetyLighting

THERMAL INTERFACE MATERIALS (TIMs) For LED Applications & Assemblies

Contact Information:Parker Hannifin CorporationChomericsDivision77DragonCourtWoburn,MA01801

phone 781 935 4850fax 781 933 4318chomailbox@parker.com

www.chomerics.comwww.parker.com/chomerics

G579 Gap-Filler pad between LED array on printed circuit board (PCB) and aluminum housing.

ProductInformation

THERM-A-GAP™ Thermally Conductive Gap Filler Pads

Material Color CarrierStandardThickness

(inches)

Dielectric Strength at

Min. Thickness (VAC)

Thermal Impedance at Min. Thickness(ASTM D5470)

(oC-in2/W)

Flammability Rating (UL 94),

See UL File E140244 for

Details

RoHS Compliant

Comments

976 Gold Unsupported 0.040-0.200 8,000 0.27 V-0 YesHighestthermalconductivity,

conformablematerial

974 Blue Unsupported 0.020-0.060 4,000 0.32 NotTested Yes Highthermalconductivity

G974 Blue Fiberglassw/PSA 0.010-0.060 2,000 0.25 V-0 Yes HighthermalconductivitywithfiberglassPSA

G579* Pink FiberglassnoPSA 0.010-0.200 2,000 0.30 V-0 YesBestcombinationofconformabilityand

thermalperformance

G569* Gray FiberglassnoPSA 0.010-0.200 2,000 0.60 V-0 Yes Superiorconformability

HCS10G* Orange FiberglassnoPSA 0.010-0.200 2,000 0.70 V-0 Yes Highestconformabilityandeconomical

575NS Yellow Unsupported 0.020-0.100 4,000 1.10 NotTested Yes Non-Siliconegapfillerpad

G515RFA* DarkGray FiberglassnoPSA 0.010-0.200 N/A 1.10 V-0 YesConformable,EMI/RFIabsorberandthermally

conductive

*Customthicknessesavailable(upto~1inchthick)andcustommoldedshapesareavailable.ContactApplicationEngineeringfordetails.

CHO-THERM®, Thermally Conductive Electrical Insulators

Material Color Thickness

(inches)Dielectric

Strength (VAC)

Thermal Impedance**

(ASTM D5470), (oC-in2/W)

Flammability Rating (UL 94), See UL File E140244 for Details

RoHS Compliant

Comments

T500 Green 0.010 5,000 0.19 V-0 Yes Bestthermalperformance

1678 Pink 0.010 2,500 0.20 V-0 YesValue-pricedwithgoodthermalandelectrical

performance

1671* White 0.015 4,000 0.23 V-0 YesHighthermalperformanceandprovenreliabilityin

aerospaceapplications

T609§ LightGreen 0.010 4,000 0.33 V-0 Yes Excellentcombinationofperformanceandvalue

T444§ Beige 0.003 5,000 0.37 NotTested Yes Non-silicone,KaptonMT™****Film

1674§ Blue 0.010 2,500 0.41 V-0 Yes Generalpurposecommercialgradeinsulator

T441***§ Pink 0.008 8,500 0.41 V-0 YesExcellent dielectricstrengthathighhumidity,com-

mericalgradeinsulator

*1671availableincustomthicknesses0.020to0.060inch**TestedwithoutPSA,PSAtypciallyadds0.05oC-in2/Wtothermalimpedance***T441isavailableinotherthicknessesincluding0.013and0.018inches****TrademarkofDuPont§Availableinrollform

Thermal Interface Material

(THERM-A-GAP™ 976)

Package to Substrate Interface

Good OpportunitiesCopper Heat Slug

Package LEDs

Die/Submount to Package

Few Opportunities

Pre-molded Epoxy Lens

Silicone Encapsulant

Flip Chip LED Die

PCB / Thermally Enhanced Substrate

Substrate to Heat Sink/ Enclosure

Interface (system specific)

Excellent Opportunities

THERMFLOW Phase-Change Thermal Interface Pads*

Material ColorThickness

(inches)Carrier (inches)

Available In Roll Form

Dielectric Strength

(VAC)

Thermal Impedance(ASTM D5470),

(oC-in2/W)

Phase-Change Temperature (oC)

(ASTM D3418)

RoHS Compliant

Comments

PC07DM Pink 0.007 0.001Polyester Yes 5,000 0.28 55 YesPolyesterdielectriclayer,inherentlytacky,noadhe-

siverequired.Offersexcellentmechanicalandelectricalproperties

T710w/PSA****

LightGray 0.0055 0.002Fiberglass Yes NA 0.25 45 Yes Fiberglassreinforcement,PSAattachment

T725*** Pink 0.005 FreeFilm Yes NA 0.04 55 YesInheretlytackandeasytouseinassembly.

UL94V-0Rated(seeULfile)

T766****LightGray/Metallic

0.00350.006

0.001MetalFoil Yes NA 0.06 55 YesFoilprovidescleanbreakbetweenheatsink

andpackage

T557* Gray 0.005 FreeFilm Yes NA 0.01 45/64***** Yes Lowestthermalimpedance

T558* Gray/Silver 0.0045 0.001MetalFoil Yes NA 0.02 45/64***** Yes Lowthermalimpedance.Foilforclean-break

T777** Gray 0.0045 FreeFilm Yes NA 0.01 45/64***** Yes Lowestthermalimpedanceandoptimizedreliability

*USPatentNo.6,054,198**Enduserlicenseagreementmayapply***USPatent6,956,739B2****USPatent6,835,453*****Carrierphasechange/Alloymelttemperature

ProductInformation (cont.)

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0 100 200 300 400 500 600 700 800

Temperature Cycles

TIM

, °C

-cm

²/W

Die1 OutcoreDie2 Outcore

Temperature Cycling Testing between 0°C and 125°C with 10 min. ramping time and 10 min. soaking time

XTS 8010 Silicone Gel

0.05

0.10

0.15

0.20

0.25

0.30

0 100 200 300 400 500 600 700 800

Power Cycles

Th

erm

al Im

ped

ance

(°C

-cm

²/W

)

Commercial High End Grease

Chomerics XTS 80XX-Class Gel

Reliability Testing Platform for Greases GELs and Phase Change:

While greases can degrade thermally overtime, GELs and Phase Change materials maintain performance (and brightness).

Thermal GEL Power CycleThermal GEL Temperature CyclePhase Change vs. Grease (Uniform Heating, 120oC)

THERMAL GREASE

Material ColorThermal Impedance above 50oC

(ASTM D5470), (oC-in2/W)Thermal Impedance above 65oC

(ASTM D5470), (oC-in2/W)

Thermal Conductivity

(ASTM D5470), (W/m-K)

Viscosity (cps)

RoHS Compliant

Comments

T650 Blue 0.02at10psi 0.02at10psi 0.80 190,000 Yes Generalpurposethermalgrease

THERM-A-GAP™ Thermally Conductive Dispensable GELs

Material

Thermal Conductivity

(ASTM D5470), (W/m-K)

Dielectric Strength (ASTM D149)

(Vac/mil)

Typical Minimum Bondline Thickness

(inches)

% Deflection at Various Force Levels (ASTM C165 Modified) RoHS

CompliantComments

1lb 3lb 5lb

T630* 0.7 200 0.004/0.010* 36 54 63 Yes Fully-cured,dispensable,extremelyconformable

GEL30 3.5 200 0.004 41 59 71 Yes Excellentcombinationofthermalperformanceandflowrate

GEL8010 3.0 200 0.002 44 64 74 YesExcellentcombinationofthermalperformanceandflowrate.

Bestforthinbondlineapplications(0.001-0.010inches)

Availableinlargecontainers(1and5gallons)forHighVolumeManufacturers.Largeformatsrequirecustomizeddispensingequipment.*Alsoavailablewith0.010inchglassbeadsasadielectriccompressionstop.RefertoproductT630G.

0.000

0.050

0.100

0.150

0.200

0.250

0.300

0.350

0 500 1000 1500 2000 2500

Aging Time (Hours)

Ther

mal

Impe

danc

e (°

C c

m²/W

)

T777Grease

THERMALLY CONDUCTIVE CURE-IN-PLACE (CIPs) COMPOUNDS

Material Color

Thermal Conductivity

(ASTM D5470), (W/m-K)

Shore A Hardness

(ASTM D2240)

Dielectric Strength (VAC/mil)

ComponentsApproximate Cure Time

at TemperatureRoHS

CompliantComments

T647* Gray 3.0 50 250 2-part48Hoursat25oC

10Minutesat150oCYes 1:1ratio.Highestthermalperformance

T646* Tan 0.9 50 250 2-part

48Hoursat25oC30Minutesat75oC3Minutesat150oC

Yes1:1ratio.Oftenusedinhigh-volume,

automateddispensing

T644* Pink 1.2 15 500 2-part Yes1:1ratio.Goodthermalconductivity.

Lowdensityforweightsensitiveapplications.

1642 Blue 1.0 85 500 2-part Yes10:1lowextractablesiliconecompound.

Goodthermalconductivity.Lowdensityforweightsensitiveapplications.

1641 White 0.9 78 500 1-part48Hoursat25oC

at50%RelativeHumidityYes

Moisturecure,encapsulant,pottingcompound.ComesbundledasakitwithprimerCHO-BOND1086

*Thesecompoundsareavailableinlargecontainers(1and5gallons)forHighVolumeManufacturers.Largeformatsrequirecustomizeddispensingequipment.

THERMATTACH Thermally Conductive Attachment Tapes

MaterialThickness

(inches) Carrier

Lap Shear Adhesion (ASTM D1002 Al-Al),

(psi @25oC)

Thermal Impedance**

(ASTM D5470), (oC-in2/W)

Flammability Rating (UL 94), See UL File E140244 for Details

RoHS Compliant

Comments

T404/T414§ 0.005 KaptonMT™*Film 100 0.60 V-0 Yes Electricallyinsulatingacrylicadhesive

T405§ 0.006 Aluminum 100 0.50 V-0 Yes Lowimpedance

T411§ 0.010Expanded

AluminumMesh40 1.0 NotTested Yes

Siliconeadhesive,recommendedforplasticpackageswithsiliconemoldrelease

T412§ 0.010Expanded

AluminumMesh70 0.30 NotTested Yes Highestthermalperformance,acrylicadhesive

T418§ 0.010 Fiberglass 150 1.2 V-0 Yes Superiorattachmentstrength,acrylicadhesive

*TrademarkofDuPont§Availableinrollform

ProductInformation (cont.)

SOLID STATE HEAT SPREADER (T-WING)

MaterialThickness

(inches)

ThicknessStack Up(inches)

Sizes (Width X Height)

(inches)

Typical Component Temp.

Reduction (oC) See Catalog for Details

Flammability Rating (UL 94), See UL File E140244 for Details

RoHS Compliant

Comments

T-Wing 0.013

0.001PET0.0015Acrylic0.007Copper0.0015Acrylic0.001PET

0.001SiliconePSA

2.0X0.5 3.0X0.5

10-20 V-0 Yes

Flexible,lowprofileheatspreaderslaminatedwithdielectricmaterialonbothsides.SiliconePSAforattachment.Availablecentered(seecatalogueforstandardsizes),oneentireside,or

bothsides.Customshapesavailable.

3.0X0.75 3.0X1.0

4.0X1.0 4.0X1.5

Solid State Heat Spreader T-WING®

Therm-A-Gap™ G974

Aluminum Chassis

LEDs on PCB Attached to T-WING®

Literature Number: MB 1004 EN October 2010