Thermal Fatigue-Resistant Lead-Free Alloys - Senju M · Thermal Fatigue-Resistant Lead-Free Alloys...

NEP16-01E

Thermal Fatigue-Resistant Lead-Free AlloysThermal fatigue-resistant alloys that constantly evolve through the accumulation of new technologies

● Joint surface reaction control technology

M794 has achieved improved thermal fatigue resistance through accumulation of new technologiesFeatures a lineup of thermal fatigue-resistant alloys tailored to various applications or requirements

Reflow 1 time Reflow 4 times Reflow 1 time Reflow 4 times

Prevents changes of the fracture mode and enhances the joint strength by controlling the joint interface reaction

● Crystal grain coarsening suppression technologyTechnology to suppress coarsening of the Sn structure after thermal cycle tests can prevent the lowering of strength and generation of cracks

M705 M705M758 M794

Ni is added to make the fragile joint interface thin, fine and smooth to ensure strength

Sn-Ag-Cu-Sb Sn-Ag-Cu-Bi-Sb-Ni-x

Ther

mal

fatig

ue-r

esis

tant

allo

y

1990 2020

Sn-Ag-Cu-Bi-NiSn-Ag-Cu

New technologyof the future

Crystal grain coarseningsuppression technology

Joint interface reaction control technology

Solid solution strengthening technology

Initial

3000cycInitial

3000cyc

Revolutionary Products

0

10

20

30

40

50

60

70

0 500 1000 1500 2000 2500 3000

M794

M758

M731

SAC305

Number of cycles (cycle)

Join

t str

engt

h (N

)

Comparison of joint strength of each alloy-40℃/30min ⇔ +125℃/30min

M731M705 M758 M794

● M731 ‒a thermal fatigue-resistant alloy best suited for �ow soldering

● M758‒general-purpose thermal fatigue-resistant alloy for SMT

● M794‒the newest thermal fatigue-resistant alloy that exhibits little deterioration due to thermal fatigue

Features

Precipitation strengthening technology

NEP16-02E

Features

● M758 group with a priority on thermal fatigue resistance

● M770 group with a priority on drop impact reliability

902 cyc. 1904 cyc. 2287 cyc. 1679 cyc.

SAC305 SAC758 M806 M807

145 times 148 times 119 times 160 times

Cu6Sn5

PKG PKG PKGPKG

(Cu,Ni)6Sn5 (Cu,Ni)6Sn5 (Cu,Ni)6Sn5

870 cyc. 899 cyc.

M770 M809

304 times 299 times

(Cu,Ni)6Sn5

PKG PKG

(Cu,Ni)6Sn5

Drop impact test

Crack path : Interface or solder.

Crack path : solder.

Thermal fatigue test

PKG Side (Cu)

PKG Side (Cu)

Board Side (Cu)

Board Side (Cu)

: solder. : solder.

● Developed Solder balls suitable for package design

● M758 group with a priority on thermal fatigue resistance

● M770 group with a priority on drop impact reliability

※This image is only reference. Drop Performance

TC

T P

erfo

rman

ce

M809

Priority on drop impact reliability

M770Sn-2Ag-Cu-Ni

SACN1205

SAC305Sn-3Ag-0.5Cu

M806

M758Sn-3Ag-0.8Cu-3Bi-Ni

SAC405Sn-4Ag-0.5Cu

M807

Priority on thermal fatigue resistanceM758 Group

M770 Group

Solder ball that withstands severe usage conditions

M770Sn-2Ag-Cu-Ni 　

Dreamlike Innovation for 3D packaging

Cu Core BallFor WLCSP

M758 Sn-3Ag-Cu-Bi-Ni

Ni Plating

Solder Electrolytic PlatingPWB

PWB

Silicon Wafer

Cu Ball

Thermal fatigue resistance changes depending on the package design or structure

1100 1000 10000

10

99.9

Cycle Number

SAC305 WLCSPSAC305 CSP

● A wide-ranging lineup of products that can be selected according to purposes or designs

High-Quality Solder BallHigh-quality alloys make selections possible with PKG designs

NEP16-03E

Solder Paste that Suppresses VoidsReduces voids through different methods in chip components and bottom electrode components

● GLV series discharges voids due to its excellent �uidity when melted

Immediately after printing Void generation Void aggregation Void emission Solidified


The GLV series solder paste that reduce voids in components of all types

● “GLV” series, suitable for bottom electrode components in 　which temperature rise and void discharging are dif�cult● Prevents viscous phenomena even with a �ux with a high void discharging force

● “GLV2” series is suitable for void reduction in open joints such as microchip components

● Reduces voids by suppressing the number of constituents that generate voids

GLV

GLV2

GWS

K2V

Void

gen

erat

ion

rate

2005 2010 2015

[Improvement of fluidity (wettability)]

[Reduction of void components]

Open bonding

230℃ 240℃

230℃ 240℃

230℃ 240℃

Closed bonding

GLV Series prevents voids even at 230°C,a temperature at which voids become stationary

8mmQFN void area ratio

Melting temperature (°C)

Void

are

a ra

tio (%

)

60

50

40

30

20

10

0228 230 232 234 236 238 240 242

GWS

GLV

K2V

Features

NEP16-04E

Flux materials which prevent residue crackingPrevents ion migration due to dew condensation

Features

● Prevents ion migration caused by dew condensation

Bending

Thermal shock

Flux residue

Solder

Cracks

Soldering

Water passages are formed in cracks

＋－

Ion migration

Formation of water passages in cracks

Short circuit due to ion migration

Water

Generation of cracks

Dew condensation Voltage application

Temperature/humidity cycle ( in everyday life)


Crack-free �ux residue enhances ion migration resistance

● Flux-cored solder MACROS in which no �ux residue cracking 　occurs when bent or heated

● Solder paste C3T in which no �ux residue cracking occurs under thermal fatigue-resistance tests

● Crack-free �ux residue prevents ion migration caused by dew condensation

● Exerts high water repellency and prevents ion migration even under high temperature/moisture load tests

MACROS

MACROS C3T

Conventional productConventional product

Conventional product

MACROS

C3T“Stress” caused by thermal shock

Mechanical “bending”

Crack-free flux-cored solder Crack-free solder paste

After 50 cycles

After 3000 cycles

-30℃/+110℃Retained for 30 minutes

After 2000 cycles-30°C/+125°C

Retained for 30 minutes

ion migration

NEP16-05E

● High heat dissipation

Air in cracks inhibits thermal conductivity and lowers the heat radiation effect

Crack causedwhen solder is thin

Crack causedby tilt Bare chip

Preform

Excellent heat radiation Ni ball

Ni balls provide stand-off heights between components, ensuring even solder thickness

Unique ball inclusion technology exhibits an excellent reaction and prevents voids

Ni ball Ni ball

SolderSolder Solder

aa a

Semiconductor Semiconductor Semiconductor

Ni ball

High-Quality Die Bonding MountingRealizes high precision wire bonding without scattering or contamination

Features

● Crack-free solder preform that achieves an excellent heat radiation effect

HQ type that does not require flux, owing to itsspecially-processed surface

Tray or tape and reel packaging type that enables automatic mounting

Type containing Ni balls that realizes horizontal packaging

Flux-coated type with flux applied on the surface

Coating flux can be chosen according to the purpose

Supports irregular-shapedor large products Various ball sizes can be chosen

Ni ball

● HQ type that enables �ux-free & no-clean die bonding

● Solder preform containing Ni balls that achieves excellent head radiation with a low amount of voids

● Tape and reel package type, which enables automatic high-precision mounting by machines

● Flux-coated type that does not require the �ux application process

● Available in different product types that can be chosen according to the application or purpose

HQ High-Quality Surface Condition

Die-bonding of power semiconductors

NEP16-06E

Ahead of all in the world, LEO series has developed by processing hard and fragile alloys into solder wire

L20-JPP that has realized high strength bonding of substrates with low heat resistance LED lights mounted on a PEN film FPC by L20-JPP

FPC PEN film FPC

● Soldering can be performed even at 200 °C

● Example of low-temperature packaging by re�ow soldering

Features

Solder Materials for Low-Temperature PackagingPET film is now available as a PCB material


L20 Solder bar for �ow solderingEnabled low-temperature flow soldering

L20&L27-LT142 Solder paste L20 Solder preform L20-JPP Solder pasteRealized a low-temperature short-time reflow profile

Prevents re-melting, ideal for shield cases retrofitted at a low temperature

Features a flux residue that reinforces joint strength as an adhesive, ideal for FPCs

0

50

100

150

200

250

300

0 50 100 150 200 250

Normal profile

Low-temperature short-time profile

Time

Temperature

Low-temperature short-time reflow profile

L20 Solder ballsFor bump formation on materials havinglow heat resistance

● Capable of packaging components or substrates having low heat resistance, and expected to radically reduce material costs

● L20-JPP is ideal for low temperature packaging in which suf�cient joint strength is obtained even when the FPCs are rolled

● Environmentally-friendly products that contribute to energy conservation through features such as a low-temperature short-time pro�le

● Prevents re-melting through packaging using M705 or other materials in combination

We offer solder materials that promote low-temperature packaging, which contribute to environmental-friendliness and cost reduction

Developedahead of all in the world

LEO L20 Cored solderHard and fragile alloy processed into flux-cored solder & solder wire

NEP16-07E

Maintains excellent wettability Prevents side balls due to oxidation Prevents voids through excellent wettability

Solder Paste Storable at Room TemperatureStorable at room temperature for six months after transportation at room temperature

Features

● Solderability after being stored for 6 month at room temperature


Can be transported and stored at room temperature and reduces costs. Product lineup include halogen-free and low-Ag types

Requires refrigeration Can be transported at room temperature

Requires refrigeration

Can be stored for 3 monthsat room temperature

Can be stored at roomtemperature for 6 monthsRequires refrigeration

GRN360 S70GR M40-RTP M705-RTP

● Reaction between the �ux and alloy powder is controlled to enable transportation and storage at room temperature

● Features excellent stability at room temperature, enabling continuous printing with a supply of additional paste

● Prevents voids and exhibits stable wettability even after being stored at room temperature for six month

● Environmentally-friendly product that contributes to energy conservation and cost reduction by eliminating the need for bringing the paste back to room temperature

Comparison of the viscosity after being stored at room temperature for 6 months

RTPseries

General product

Not requiredNot required

Not requiredNot requiredNot requiredNot required

NEP16-08E

Flux Cored Solder for Iron Tip Thinning PreventionThe spread of automatic soldering motivated the development of M84

Features

● M84 offers excellent wettability and high joint reliability, while preventing iron tip thinning

Solder wettability Joint reliability

M705

M84

Conditions


M84 that prevents iron tip thinning is ideal for automatic soldering

● Suppresses wear of iron tips, which contributes to lowering of production costs by reducing the tip replacement frequency

● Prevents wear of iron tips and facilitates soldering of �ne joint portions

● Ideal for automatic systems that always perform soldering at one spot of the iron tip

● Features wettability equivalent to that of M705 and joint reliability equivalent to or greater than that of M705

M84M705

After 12000 shotsInitial stage

Automatic system that repeats soldering at one spot of the iron tip

Solder diameter :φ0.8ｍｍIron tip temperature :420℃Solder feed amount :10ｍｍSolder feed speed :20ｍｍ/sec

-2500

-2000

-1500

-1000

-500

0

210 220 230 240 250 Temperature [degC]

M705M84

DSC

[μW

]

Melting peak temperature

NEP16-09E

Features

Ag-free Flux Cored SolderSimultaneously achieves a good work environment and cost reduction

● Soldering with GAO M24APComparison of smoke amount at each temperature Comparison of the degree of scorching at 450 °C Comparison of the amount of remaining

air bubbles

GAO-ST

GAO-LF

320℃ 380℃ 450℃

GAO-ST

GAO-LF

In 2Sec 4Sec 6SecScorching


● GAO series, ideal for M24AP Ag-free solder alloy

● GAO-ST, ideal for Ag-free solder alloy, with �ux that does not become scorched even at high temperatures

● GAO-LF for Ag-free solder alloys that thoroughly prevent smoke and irritating odors

● Does not entrain air bubbles in the �ux residue, enabling an accurate appearance inspection

Flux

Solder alloy

2000 2010 2020

Iron tip temperature (°C)320℃ 380℃ 450℃

Smok

e in

tens

ity

0

1

0.5

1.5

2

2.5

3

3.5

GAO-STGAO-LF

Conventional product

Comparison of the amount of smoking at each temperature

Realizes low-Ag & Ag-free packaging while maintaining reliability

M705 3.0% Ag

M40 1.0% Ag

M35 0.3% Ag

M24AP 0% Ag

NEO M35

ESC M705

GAO M24AP

GAO M24AP

Price

Lowerprices

Conventionalproduct

Conventionalproduct

Conventional productConventional product

NEP16-10E

Features

Low-Ag/Ag-free Solder PasteEliminated Ag while ensuring reliability, contributing to cost reduction

● Combination with solid solution strengthening

● Joint interface reaction control technology

Solid solution strengthening: deformation is suppressedthrough mixing of different atoms

The weakening of Precipitation strengthening by reductionof the Ag content is offset by solid solution strengthening

Joint interface structure is refined by the replacement of Ni with Cu, which enhances joint strength

M705 M40 M705 M773

Intermetallic compound

Intermetallic compound

Precipitationstrengthening

Precipitation strengthening

Solid solution strengthening


-40℃/30min ⇔ +85℃/30min

20

30

40

50

60

70

80

0 200 400 600 800 1000 1200 1400 1600

Sn-Cu-Bi-Ni

Sn-Cu-Ni-Ge

Evaluation on chip resistors

M705SAC305M773

Stre

ngth（

N）

Number of temperature cycles（Cycle)

M47-LS720V

M40-LS720V

M705 : Sn- 3Ag-0.7Cu

M40 : Sn-１Ag-0.7Cu - Bi -In

M47 : Sn- 0.3Ag-0.7Cu -0.5Bi -Ni

M773 : Sn- 0.7Cu -0.5Bi -Ni

LS720Vseries

Material cost

100%

70%

53%

2000 2010 2020

● LS720V series that satis�es the halogen-free standard of the industry, and is suitable for mobile devices

● M40-LS720V that enables packaging with the same pro�le as that for M705● M47-LS720V having the thermal fatigue resistance equivalent to that of M705 while containing only 0.3% Ag

● M773-LS720V in which joint reliability of Sn-Cu solder is enhanced through the addition of Bi and Ni

Price

Lowerprices

Halogen-free flux LS720V-HF for low-Ag/Ag-free alloys that achieves excellent wettability has been developed

3% Ag

1% Ag

0.3% Ag

0% Ag





Solid solutionstrengthening


Joint interfacereaction control

M773-LS720V

Achieves low-Ag & Ag-free packaging while maintaining reliability


Joint interfacereaction control

Reflow 1 time Reflow 4 times Reflow 1 time Reflow 4 times

NEP16-11E

Ag-free Solder BarM805E with priority on reliability, M24AP with priority on cost reduction

Features

● Ultra-trace phosphorous that suppresses dross does not exist in the joint interface, ensuring good joint reliability

M705 M24AP

Cu

(Cu,Ni)3Sn

Sn

Cu3Sn

123456

0.0024.5227.6229.0721.68100.0

100.0067.7264.2867.6578.320.00

0.007.768.103.280.000.00

0.000.000.000.000.000.00

0.000.000.000.000.000.00

Sn Cu Ni P Ge

[at%]


2000 2005 2010 2015

M705

M35

M24AP

3.0% Ag

0.3% Ag

0% Ag

Price

Lowerprices

M805E

● M805E Ag-free featuring enhanced reliability achieved through solid solution hardening by the addition of Bi

● M24AP that has realized cost reduction through signi�cant dross reduction by the addition of phosphorus and germanium

M24AP/MTNo phosphorus and germanium

M24MT/M24AP一般品

70％reduction

Realizes low-Ag & Ag-free packaging while maintaining reliability

M24AP analysis result

NEP16-12E

Features

Solder Paste for Micro Component PackagingEnsures sufficient solder amounts even on thin masks with small openings

● Ball-shaped solder alloy powder manufactured using the granulation technology developed over a long period of time

Average grain size φ 30µm

Type4


Type5


Type6


Type7


Type8


● RGS800 Type6 realizes packaging of 0201 size micro chip components

● Activity enhanced through the improvement of rosin or other active agents that ensures good wettability despite using micro grains

● Increased �ux deactivation temperature that prevents reoxidation during re�ow soldering

● Features good printability realized by the ball-shaped solder alloy manufactured through a uniquely-developed granulation technology

Narrower pitch

Type5 Type6Type7

Type8

1005 type components 0603 type components 0402 type components 0201 type components

2000

2010

2020

Type4

GRN360

GWS

S70G

GLV

RGS800RGS800

Promoting further development

Packaging of micro components achieved through re�ning of powder grains and development of �uxes

Packaging of 0201 components

NEP16-13E

Dispensing method Jet dispensing method

Solder Paste for 3D PackagingNext-generation packaging through the jet-dispensing method

Features

● Mask-free application method ● Application of dots with a diameter of φ 300 µm by jet dispensing（min. φ100μｍ）

Pressure


Dispenser Jet dispensing

Drawn by jet dispensing

3D printing

Speed increase

RGS800 NXD900 seriesGLVseries NXDseries JPP

Rolling Stencil

Substrate

Contact application

NozzlePaste grain

Paste

Special nozzle

High-speed no-contact application

Shift

Mask-free

● No-contact method enables application of solder paste to concave and convex parts with high precision

● Jet dispensing method enables narrow-pitch/minute application and high-aspect ratio supply

● Jet dispensing method is capable of high-speed application and suitable for mass production

● No-contact method facilitates re�ow soldering for retro�tting

Our products support various application methods, including the jet dispensing method, which has enabled high-speed application to concave and convex parts

Pressure Pressure

Substrate

Screen printer

NEP16-15E

Features

Halogen-free Ultra�ne Flux Cored Solder WiresIdeal for narrow-pitch packaging on flexible substrates

● Ideal for narrow pitch packaging on �exible substrates of mobile devices

● Suppresses scattering with a �ux specially designed for ultra�ne wires

CBF5


Pulse heater

FPC

Heating

Substrate Electrode Electrode

FPC

Substrate

● Product lineup includes halogen-free CBF5 ideal for mobile devices

● Advanced wire drawing technology prevents wire disconnection during the soldering process

● Thermal compression bonding (TCB) realizes narrow-pitch packaging on �exible substrates

● Development of the �ux exclusively for ultra�ne wire has achieved low scattering

Additional soldering of insertion-type components

Rework soldering of surface mount components

Soldering on narrow pitch patterns

Φ300μｍ

Φ150μｍ

Φ100μｍ

Φ65μｍ

2000 2010 2016

TCB（Thermal Compression Bonding）

CBF5

EFC

Micronizing of powder grains and development of the �ux enable micro components mounting

Soldering by TCB

Ultrafineflux-cored solderwire

Pressure

Cconventional product

NEP16-16E

Features

Micro/Cu-core Solder BallsCu-core balls for 3D packaging and LAS balls that prevent soft errors

● Ensures space through Cu-core balls with high joint reliability

Our unique solder plating technology prevents voids Cu is covered by a controlled plating �lm during the primary re�ow processing, which forms a diffusion layer that improves the drop impact resistance

The Cu-cored ball in the photo on the left obtains a good joint condition through the secondary re�ow processing

Solder plating

Cu core Cu coreDiffusion layer


● Superior solder plating technology facilitates high-quality 3D packaging

● Cu-cored balls with a Ni layer improve drop impact resistance

● Realizes narrow-pitch packaging with a φ20 μm solder ball with a narrow-tolerance and a true sphere

● Low α solder balls protect products from soft errors

80μｍ 60μｍ 40μｍ 20μｍ

We continue to make our solder balls smaller to meet the needs of the times

α ray

α ray

0.002cph/㎝² or smaller

Our outstanding manufacturing process realizes ultra-low α ray solder ballsα count

Cu-Core Solder BallFacilitates 3D packaging

Micro Solder BallSupports narrow pitch packaging

Low α Solder BallProtects semiconductors from malfunctions

LOW

SOLDERALPHA

2010

2015

2020

1

10

99.9

1 10 100 1000

Cum

ulat

ive

failu

re ra

te

Number of times dropped

Drop impact test result

Solder ball Cu-cored ball

M705 C-Cu M90

Φ240μｍ Φ180μｍ Φ70μｍBGA・CSP WLP μBALL

We provide solder balls suitable for diversifying semiconductor packages

Products of another company SMIC product

Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 http:// jp.senju.com/ja/

NEP16-17E

Zero flux residue by hot water cleaning Flux residue reinforces joints Flux becomes volatilized during reflow processing

Low-volatile, water-clean type WF-6317 Low-volatile, no-clean type JPK9S Ultra-low-residue, no-clean type 901K5

Wafer

Sub Sub

WaferUltra-low flux residue

Reflow

901K5 volatile

Cooling/bonding

Flux for Semiconductor PackagingSupports semiconductor packaging with a superior organic synthesis technology

Features

● Fluxes for semiconductor packaging used when mounting solder balls, CSPs, or BGAs on PCBs


For bump shape correction3

2

For connection to PCBs

For connection to wafers

1Flux forsemiconductorpackaging

3 For bump shape correctionSPK-3400Low-volatile/ Water-clean

1 For connection to PCBs(BGA packaging)

WF-6317JPK9S901K5

1 For connection to PCBs(Ball packaging)

WF-6317JPK9S901K5

2 For connection to wafers

MB-T100

WF-6317PRosin-based/Solvent-clean

Water-soluble/ Water-clean

1 For connection to PCBs (CSP packaging)WF-6317 Low-volatile/Water-clean

Low-volatile/No-clean (strength reinforcement)

Ultra-low residue/No-clean

JPK9S

901K5

Ball packaging

CSP packaging

BGA packaging

Please select fluxes that are effective for soldering according to the applications or purposes

PCB

Wafer Wafer

● Highly active, high heat-resistant water soluble �ux WF-6317● WF-6317 that is capable of suppressing contamination of the re�ow oven due to its low volatility

● JPK9S with thermosetting resin residue that reinforces joints

● 901K5 that achieves at least 95% volatilization in re�ow process and supports no-clean process

Resi

due

rate

(%)

Reflow temperature (°C)0

102030405060708090

100

WF-6317 JPK9

901K5

Conventional typeResidue: Several tens%

Low volatile typeResidue: At least 95%

Flux: 5% or lessUltra-low flux type

Select �uxes that are effective for soldering according to the applications or purposes

Evaluation of flux volatility

Thermal Fatigue-Resistant Lead-Free Alloys - Senju M · Thermal Fatigue-Resistant Lead-Free Alloys...

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