Thermal Effects on & Thermal Properties of Materials_Ch19

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    Thermal Behavior of Materials

    ME 2105

    Dr. R. Lindeke

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    Some Definitions

    Heat Capacity: the amount of heat (energy)required to raise a fundamental quantity of amaterial 1 K

    The quantity is usually set at 1 gm-atom (elements) or 1gm-mole (compounds)

    Given by the formula: C = q/(mT) in units of J/gm-atom* K or J/gm-mole* K

    Specific Heat: a measure of the amount ofheat energy to raise a specific mass of amaterial 1 K

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    Heat Capacity

    Heat capacity is reported in 1 of two ways: Cvthe heat capacity when a constant volume of

    material is considered

    Cpthe heat capacity when a constant pressure ismaintained while higher than Cvthese values are nearly

    equal for most materials

    Cpis most common in engineering applications (heat

    stored or needed at 1 atm of pressure) At temperature above the Debye Temperature Cv3R

    Cp

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    Definitions Thermal Expansion is the growth of materials due to

    increasing vibration leading to larger inter-atomic distances

    and increasing vacancy counts for materials as temperature

    increases

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    Thermal Expansion

    Linear thermal expansion is given by thismodel:

    As an Example: A gold ring (diameter = 12.5 mm) is worn by a person,

    they are asked to wash the dishes at their apartmentwater temperature is 50C how big is the ring while itis submerged?

    dL

    LdT

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    Thermal Expansion is

    Temperature Dependent

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    Solving:

    0

    0 0

    50 27 50

    50527 27

    6

    50

    6

    0

    data from table 7.2

    * 12.5*3.14159 39.2699

    14.1

    16.5 14.1

    14.21 10 (mm/mm C )

    14.21*10 *39.27*12.5 0.007

    39.27 .00712.502

    avg

    f

    L L T

    L d

    x

    L L T mm

    D mm

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    Definition:

    ThermalConductivity: thetransfer of heatenergy through a

    material (analogousto diffusion of mass)

    Modeled by:

    at steady state conditions:

    dQdtk

    dTAdx

    Qtk

    TAx

    Note, kis a function of temperature (like was)

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    Modeling Fouriers Law of Thermal Conduction (heat

    flow thru a bounded area)

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    Thermal Conductivity

    Involves two primary (atomic level) mechanisms: Atomic vibrationsin ceramics and polymers this dominates

    Conduction by free electronsin metals this dominates

    Focusing on Metals: thermal conductivity decreases as temperature increases

    since atomic vibrations disrupt theprimary free electron

    conduction mechanism

    Adding alloying impurities also disrupts free electronconduction so alloys are less conductive than pure metals

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    Thermal Conductivity

    Focusing on Ceramics and Polymers: Atomic/lattice vibrations are wave-like in nature and

    impeded by structural disorder

    Thermal conductivity will, thus, drop with increasing

    temperature

    In some ceramics, which are transparent to IR radiation,

    TC will eventually rise at elevated temperatures since radiant

    heat transfer will begin to dominate mechanical

    conduction Porosity level has a dramatic effect on TC (pores are filled

    with low TC gases which limits overall TC for a structure

    (think fiberglass insulation and strya-foam cups)

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    And Continuing:

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    Thermal conductivity of several ceramics over a range

    of temperatures.

    (From W. D. Kingery, H. K.

    Bowen, and D. R. Uhlmann,

    Introduction to Ceramics,

    2nd ed., John Wiley & Sons,

    Inc., New York, 1976.)

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    Definition:

    Thermal Shock: it is simply defined as the fracture of amaterial (often a brittle ceramic) as the result of a(sudden) temperature change and is dependent on theinterplay of the two material behaviors: thermal

    expansion and thermal conductivity Thermal Shock can be explained in one of two ways:

    Failure stress can be built up by constrained thermal expansion

    Rapid temperature changes lead to internal temperature gradients

    and internal residual stressesbased in finite thermal conductivityreasoning

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    By Constrained Thermal Expansion:

    Thermal shock resulting from constraint of uniform thermal expansion. This

    process is equivalent to: a. free expansion followed by; b. mechanical compression

    back to the original length.

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    Lets Consider an Example:

    A 400 mm long rod of Stabilized ZrO2(=

    4.7x10-6mm/mmC) is subject to a thermal

    cycle in a ceramic engine its the crank

    shaft!from RT (25C) to 800C. Determinethe induced stress and determine if it is likely

    to fail?

    E for Stabilized ZrO2is 150 GPa MOR for Stabilized ZrO2 is 83 MPa

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    exp

    0

    6

    where:

    4.7*10 * 800 25 0.00364

    150 *0.00364 0.546 546

    TI TI

    TTI

    TI

    TI

    E

    l

    l

    mmTmm

    mmGPa GPa MPamm

    Since the Inducted Compressive Stress exceeds the MOR one might expect the

    rod to fail or rupture unless it is allowed to expand into a designed in

    pocket built into the engine block to accept the shafts expansion

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    Thermal quenches that produce failure by thermal shock are illustrated. The temperature drop

    necessary to produce fracture (T0 T) is plotted against a heat-transfer parameter (rmh). More

    important than the values of rmh are the regions corresponding to given types of quench (e.g.,

    water quench corresponds to an rmh around 0.2 to 0.3).

    (From W. D. Kingery, H. K.Bowen, and D. R. Uhlmann,

    Introduction to Ceramics, 2nd

    ed., John Wiley & Sons, Inc.,

    New York, 1976.)

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    22

    Occurs due to: uneven heating/cooling.

    Ex: Assume top thin layer is rapidly cooled from T1to T2:

    Tension develops at surface

    )( 21 TTE

    Critical temperature difference

    for fracture (set = f)

    E

    TT f

    fracture21 )(

    set equal

    Large thermal shock resistance when is large.

    E

    kf

    Result:

    E

    kf

    fractureforrate)(quench

    Thermal Shock Resistance

    Temperature difference that

    can be produced by cooling:

    kTT

    ratequench)( 21

    rapid quench

    resists contraction

    tries to contract during cooling T2

    T1

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    Thermal Shock Resistance Parameter

    f

    l

    kTSR

    E

    Where:

    fis fracture strength of a materiallis coeff. Of linear thermal expansionk is thermal conductivity of material

    E is modulus of elasticity