THEMIS Instrument CDR 1 UCB, April 19-20, 2004 Integration and Test Critical Design Review Rick...
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Transcript of THEMIS Instrument CDR 1 UCB, April 19-20, 2004 Integration and Test Critical Design Review Rick...
THEMIS Instrument CDR 1 UCB, April 19-20, 2004
Integration and Test
Critical Design ReviewRick Sterling
University of California – Berkeley
Thm_CDR_IT_Revc
THEMIS Instrument CDR 2 UCB, April 19-20, 2004
Agenda
Agenda• Requirements and Responsibilities
• Facilities (Integration and Environmental)
• Instrument I&T Requirements
• Instrument I&T Set-up (MGSE, EGSE)
• Instrument I&T Flows
• Instrument-Spacecraft Integration
• Issues
THEMIS Instrument CDR 3 UCB, April 19-20, 2004
Responsibilities
Responsibilities• Provide Clean Room Facility (Room 125)• Access Control & Clean Room Training• Develop MGSE
– Instrument Harness Mockups & Test Platforms
• Fabricate Instrument Harnessing• Support Instrument-Provided GSE
– Mu-Metal Enclosures for FGM & SCM
– N2 Purge Systems for ESA, SST
– Sphere Sensor Boxes for EFI
• Integrate & Functional Test of EM, F1-F6• Provide EMC, MAG, Vibration & TV Testing • Daily Logistic Planning & “Standup” meetings• Deliver & Support to Swales for Spacecraft I&T
THEMIS Instrument CDR 4 UCB, April 19-20, 2004
Facilities – Integration Lab
Instrument Integration Lab• Secure Key-Coded Lock• Class 100K Clean room• Air Quality Monitored Weekly by Assurance• Positive Air Flow• Feed Thru’s to Adjacent Lab• Gowning Area• Storage Shelving for Component Storage• Separate Flight and non-Flight Storage• Oxygen Sensor (when Nitrogen Purge used)• Used for HESSI, CHIPSAT, Stereo Impact
THEMIS Instrument CDR 5 UCB, April 19-20, 2004
Thermal Chambers• Space Sciences Lab • New Chamber for EFI Booms• Cal Chamber Upgrade for SST
Test Chamber Requirements• Pre-Test Clean• Pre-Test Bakeout• TQCM Monitoring• Cryo-Pump• Final Bakeout• GN2 Backfill
Vibration Facilities• Wyle• AMES
EMI/EMC• EMCE Engineering – Fremont
Facilities - Environmental
Available Chambers Type HiBay L1 TV AXB Booms HiBay L2 TV STEREO320 T10 TV STEREO320 Cal Vac ESA Cal320 “Mini” TV SCM, Bake-outsB20-TV “Bayside” TV EFIB20-Large TV TV Payload TV B20-Cal VAC2 Vac SST Cal B20-TV “Snout” TV
Comment
339-TV CalSST, IDPU, EFI ESA MCPs
THEMIS Instrument CDR 6 UCB, April 19-20, 2004
“Large Chamber(“Bertha”)
• Developed for EUVE
• 8’ diam x 16’ depth
• Adding thermal capability
• Can do two Themis units at a time if desired.
THEMIS Instrument CDR 8 UCB, April 19-20, 2004
Chamber for Boom Deploy
•“Jeffrey”
• EFI AXB scheduled for 5/04
• Developed for Stereo
• Sharing with Stereo
• There is another chamber with “snout” extension for boom deploy testing.
THEMIS Instrument CDR 11 UCB, April 19-20, 2004
Thermal TestingTV Plan • 2 Component-Level TV Cycles Prior to Instrument-Level I&T• 6 Instrument Level TV Cycles at Instrument-Level• Survival, Cold Start, Cycles (Functional at extremes), Bake-out
Deployments in Vacuum• SPB: Full Deploy w Takeup reel• AXB: Deploy Hot & Cold• MAG: First Motion Hot & Cold
Typical TV Profile:
Instrument Profile (6cy)
-60
-40
-20
0
20
40
60
80
0 12 24 36 48 60 72 84 96 108
Hours
Temp
CPT
CPT
LPT LPT LPT LPT LPT
LPT LPTLPTLPT LPT
BAKEOUT
THEMIS Instrument CDR 12 UCB, April 19-20, 2004
Instrument Cleanliness/Contamination Requirements• ESA and SST require continual nitrogen gas purge• Regulate and use viewcam to monitor remotely• Oxygen meter following instruments and gas purge equipment• Normal ESD concerns• Magnetometer sensor to be boxed except when under test and before flight
Instrument-Provided GSE Accommodation• Mu-Metal Enclosures for FGM & SCM• N2 Purge Systems for ESA, SST• Sphere Sensor Boxes for EFI
Instrument Red/Green Tag Items Tracking• IDPU - Arming plug enables actuators causing boom deployment• EFI - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug• EFI - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers• SST - Covers to be removed before flight• ESA - Cover; Arming plug; purge fitting;cocking pin nut
Instrument Requirements
THEMIS Instrument CDR 13 UCB, April 19-20, 2004
Integration Set-up
- Instruments at SSL integrated on platform same form factor as probe - 80/20 framing supports platform and sets comfortable work height - Metal rack alongside holds electrical GSE (power supply, UPS, scope) - GSE communicates with BAU Simulator via hardwire or ethernet
INSTRUMENT PAYLOAD ASSEMBLY PLATE
THEMIS Instrument CDR 14 UCB, April 19-20, 2004
Instrument Payload I&T Flow
FGMFunctional(Level 2)
SCMFunctional(Level 2)
SSTFunctional(Level 2)
HarnessBake-out
IDPU-HarnessSafe-to-Mate
PayloadEMC/EMI/MAGl
PayloadT-V
ESAFunctional(Level 2)
• Test Review
InstrumentPER
MAG INTEGRATION
EFI INTEGRATION
ESA/SST INTEGRATION
PAYLOAD ENVIRONMENTALPayloadPayloadVibrationVibration
PayloadAcceptance
• ONLY if req’d (workmanship)
MagAlignment
EFI AXBDeploy
EFI SPBDeploy
Mag BoomDeploy
EFIFunctional(Level 1)
EFIFunctional(Level 2)
EFI/SCM/FGMPhasing
ESA/SSTTiming
PayloadCPT
THEMIS Instrument CDR 15 UCB, April 19-20, 2004
FGM I&T Flow
FGSVibration
FGSThermal
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
FGSAcceptance
FGMFunctional(Level 2)
• Inspection• Mass Properties• DC Magnetics
• 2 cycles T-V• Bake-out +60C
• Sensor in TCU
FGEAcceptance
FGMFunctional(Level 0)
• Without FGS• Inspection
IDPUThermal
• 2 cycles T-V• Bake-out +60C• FGS Functional (Level 1)
FGBVibration
FGB/SCBThermal
• 1 cycle T-V• Hot/Cold Deploy
FGBAcceptance
• Inspection• Mass Properties• DC Magnetics
• Backplane
Alignment EFI/SCM/FGM
Phasing Mag Boom
Deploy Payload
Safe-to-Mate
• Harness
PayloadEMI/EMC/MAGl
PayloadT-V
• 6 cycles T-V• FGM Functional Lev1)
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
• Test Review
• Boom Levels
InstrumentPER
FGM BOOM (FGB)
FGM SENSOR (FGS)
FGM ELECTRONICS (FGE)
FGM / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTALPayloadVibration
PayloadAcceptance
• ONLY if req’d (workmanship)
THEMIS Instrument CDR 16 UCB, April 19-20, 2004
FGM Level 0 – Without Sensor (Aliveness)• B-field about zero if FGM in Cal Mode (preferred mode)
• B-field saturated if feedback is closed
• Interface full functional
• Power consumption reduced by about 200mW
FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test)• B-field about 10,000nT, Noise about 1nT
• Full functionality,
but B-field not representative
FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) • B-field < 10nT, Noise <10pT/sqrt (Hz)
• B-field has to be available in full quality
• Delta in calibration coefficients known
FGM Test Configurations
THEMIS Instrument CDR 17 UCB, April 19-20, 2004
SCM I&T Flow
SCM SensorVibration
SCM SensorThermal
SCM Pre-AmpBake-out
IDPU/ESA/SCM Pre-Amp
Vibration
SCM SensorBake-out
Functional(Level 3)
• Bake-out +60C• 3 cycles (air)
• SCM Sensor in Mu Metal
SCM Pre-AmpThermal
SCM Pre-AmpAcceptance
IDPUThermal
• 2 cycles T-V• Bake-out +60C• SCM Functional (Level 1)
SCBVibration
• 14.1g RMS
FGB/SCBThermal
• 1 cycle T-V• Hot/Cold Deploy
SCBAcceptance
• Inspection• Mass Properties• DC Magnetics
• Bake-out +60C
Alignment EFI/SCM/FGM
Phasing Mag Boom
Deploy Payload
Safe-to-Mate
• Harness
PayloadEMI/EMC/MAGl
PayloadTV
• 6 cycles T-V• SCM Functional (Lev 2)
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
• Test Review
• Boom Levels
InstrumentPER
SCM BOOM (SCB)
SCM SENSOR (SCM)
SCM PRE-AMP
SCM / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTALPayloadVibration
PayloadAcceptance
• ONLY if req’d (workmanship)
SCM SensorAcceptance
• Inspection• Mass Properties• DC Magnetics
• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics
THEMIS Instrument CDR 18 UCB, April 19-20, 2004
SCM Test ConfigurationsSCM Safety – Feedback Plug
• Required when SCM Pre-Amp is powered and sensor is not connected
SCM Level 0 – With SCM EGSE I/F Box (Aliveness)• Same Power, Command, Analog output interfaces
• Power and Cal Mode identification by LED
• Cal Signal re-injected to the input
• Signal generator connected to input
• Validation by analysis of data
SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) • Sensor kept in mu metal box during integration
• Axis identification
• Re-verification of end-to-end calibration
• Phase relation
• Check of conducted noise
• SCM/EField timing reference
THEMIS Instrument CDR 19 UCB, April 19-20, 2004
ESA I&T Flow
ESAFunctional(Level 2)
• Instrument Functional• Cover Simulator Test
ESAThermal
ESAAcceptance
• Inspection• Mass Properties• DC Magnetics
ESA/SSTTiming
PayloadSafe-to-Mate
• Harness
PayloadEMI/EMC/MAG
PayloadT-V
• 6 cycles T-V• ESA Functional (Lev 1)
• Test Review
InstrumentPER
ESA SENSOR
ESA ELECTRONICS (ETC)
ESA / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTAL PayloadVibration
PayloadAcceptance
• ONLY if req’d (workmanship)
• 2 cycles T-V• Bake-out +60C
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
ESAFunctional(Level 0)
IDPUThermal
• 2 cycles T-V• Bake-out +60C
• Backplane
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
ETCAcceptance
• Inspection
THEMIS Instrument CDR 20 UCB, April 19-20, 2004
SST I&T Flow
SSTFunctional(Level 2)
• SST w/ Radiation Source• Attenuator Test
SST Vibration
SSTThermal
SSTAcceptance
• Inspection• Mass Properties• DC Magnetics
ESA/SSTTiming
PayloadSafe-to-Mate
• Harness
PayloadEMI/EMC/MAGl
PayloadT-V
• 6 cycles T-V• SST Functional (Level 1)
• Test Review
InstrumentPER
SST SENSOR
SST ELECTRONICS(DAP and ETC)
SST / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTAL PayloadVibration
PayloadAcceptance
• ONLY if req’d (workmanship)
• 2 cycles T-V• Bake-out +60C
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
DAPAcceptance
SSTFunctional(Level 0)
• Without SST
• InspectionIDPU
Thermal
• 2 cycles T-V• Bake-out +60C
• Backplane
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
ETCAcceptance
• Inspection
THEMIS Instrument CDR 21 UCB, April 19-20, 2004
EFI I&T Flow
EFI Pre-AmpBake-out
EFI AXBDeploy
• Sensor in Mu Metal
EFI Pre-AmpThermal
EFI Pre-AmpAcceptance
AXBVibration
AXBThermal
• 1 cycle T-V• Hot/Cold Deploy
AXBAcceptance
• Inspection• Mass Properties• DC Magnetics
• Bake-out +60C
EFI Functional(Level 2)
EFI/SCM/FGMPhasing
EFI SPBDeploy
PayloadSafe-to-Mate
• Harness
PayloadEMI/EMC/MAGl
PayloadT-V
• 6 cycles T-V• EFI Functional (Lev 1)
• Test Review
InstrumentPER
EFI AXIAL BOOM (AXB)
EFI RADIAL BOOM (SPB)
EFI PRE-AMP
EFI / PAYLOAD INTEGRATION
PAYLOAD ENVIRONMENTAL PayloadVibration
PayloadAcceptance
• ONLY if req’d (workmanship)
• 3 cycles (air) • Inspection• Mass Properties• DC Magnetics
EFI ELECTRONICS(BEB and DFB)
SPBVibration
SPBThermal
• 1 cycle T-V• Hot/Cold Deploy
SPBAcceptance
• Inspection• Mass Properties• DC Magnetics
EFI Pre-AmpVibration
IDPUSafe-to-Mate
IDPU/ESA/SCM Pre-Amp
Vibration
BEBAcceptance EFI
Functional(Level 0)
• Without sensors
• Inspection
IDPUThermal
• 2 cycles T-V• Bake-out +60C
• Backplane
IDPUAcceptance
• Inspection• Mass Properties• DC Magnetics
DFBAcceptance
• Inspection
THEMIS Instrument CDR 22 UCB, April 19-20, 2004
Instrument I&T with SC
Berkeley to Provide:
• GSE Equipment for independent verification instrument operation.
• Purge monitoring support
• Safety control support (securing of deployable items etc)
THEMIS Instrument CDR 23 UCB, April 19-20, 2004
Schedule – Overview of Key Dates• ETU: I & T 7/04 – 8/04• Integrating and Testing Flight Units Fall 2004 – Spring 2005.• Delivery P1: 2/10/05• Delivery P2: 4/6/05• Delivery P3: 5/4/05• Delivery P4: 6/6/05• Delivery P5: 7/1/05
With each instrument suite we deliver harnesses, GSE computer, booms, sensors in protection boxes.
Instrument Delivery to SC
THEMIS Instrument CDR 24 UCB, April 19-20, 2004
Issues
Transportation/Shipping Berkeley to Swales
• Ground or commercial air? Under consideration.
Access for Red/Green Tag Instrument Items when all probes on PCA
• Logistics and timing of removal/addition of red and green tag items still to be detailed.
Detailed I & T Plans, Functional Procedures, etc.
• In development.