The X-Factor -How X-ray Technology is Improving the ...
Transcript of The X-Factor -How X-ray Technology is Improving the ...
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©2018 Creative Electron, Inc.
The X-Factor - How X-ray Technology is Improving the Electronics Assembly Industry
Dr. Bill CardosoCreative Electron, Inc.
+1 760.752.1192 [email protected]
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Summary for today
1. Electronic component inspection and failure analysis.2. Component counting and material management.3. Reverse engineering.4. Counterfeit detection.5. Real-time defect verification.6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D,
and 3D x-ray inspection.7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI).8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC).9. Artificial Intelligence and x-ray inspection
©2018 Creative Electron, Inc.
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Where Are Defects Introduced?
Counterfeit Components
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Defects associated with paste applicationExcess solderSolder bridgesInsufficient solder
Solder Paste Application Defects
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Component Placement Defects
Defects associated with component placementMisalignmentPolarityMissing component
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Reflow Oven Defects
Defects associated with the reflow profileVoidingBridgingSolder ballsExcess solderInsufficient solder
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Statistical Process Control
Manufacturing process quality assurance.Solder joint measurement data, collected during x-ray test, can be statistically analyzed to identify manufacturing drifts, trends and other relevant process quality issues.
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Principles of x-ray inspection
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X-ray imaging 101: the bottom terminated component, side view
BTC
PCB
Solder Balls Side View
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PCB
X-ray imaging 101: the BGA, top view
Solder Balls
BGA
X-ray image of BGA
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QFN assembly with excess voiding
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Detail of open pin in QFN package
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Void Measurement
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Solder voids in LED assembly
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BGA Inspector
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Dual EnergyHigh Energy Image Low Energy Image
Dual Energy Image
PATENT PENDING
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The best – and worse – BGA assembly1. COPLANARITY
2. SHORT
3. HEAD IN PILLOW
4. OPEN
9. MISSING
8. SHAPE
7. VOIDS
6. SOLDER MASK 5. SPLATTER
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Design For Inspection: Think 3D!n Components on both sides of board align in such a way it’s difficult
to assess defects¨ Overlapping BTC ¨ Caps under QFN and BGA¨ Heat sinks
n How to avoid it¨ ($) Design for Inspection¨ ($$) 2.5 or ($$$$) 3D x-ray inspection
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BGA 2D x-ray
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BGA 2.5D x-ray
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So what’s 3D X-Ray Inspection (Computed Tomography)?
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Principle of Planar CT: 3D x-ray
Large AreaDetector
Steer-ableX-Ray Source
Inspection Plane
Multiple Transmission Images
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Principle of Planar CT
Use multiple off-axis x-ray images to separate top/bottom overlapping or obscured solder connections
QFP
ResistorPCB
Top Side
Bottom Side
Cross Section x-ray provides the capability to generate un-obscured views of top and bottom side components
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2D
2.5D
3D
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Design for Inspection
n Think carefully about component placement when designing PCBn Place parts so 2.5 and 3D x-ray are not needed. n Goal is to have the whole board inspected with 2D x-ray
¨ Faster¨ Better quality¨ Cheaper
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Power components under BGA
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Caps under BGA
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Caps under QFN leads
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Caps under BGA balls
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Sample
Voiding
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Complex construction
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Caps and QFN
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QFN overlap
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Heat sink
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Heat sink: x-ray
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Heat sink removed: x-ray
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Think 3D!
n X-rays are a requirement when inspecting BTCn DFM + DFI: Easier to design for inspection n Some applications require 2.5D & 3D x-rayn Miniaturization major driver for high resolution, high
magnification, x-ray inspection
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Design for Inspection – DFI
n The right time to think about x-ray inspection is during PCB layout
n After board is assembled is too late to improve x-ray inspection ability
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Counterfeit Electronics
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Surplus stock of electronic components dumped into the market further establishing the broker and grey marketsHuge amounts of scrap electronicsComponents made obsolete Need for short delivery timeMassive cost reduction pressures on OEM buyers for double digit price reductionsBuying and selling via the internet became common practice
The counterfeit electronics problem
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Component Harvesting
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Only expensive parts are counterfeited…
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Anything wrong with these caps?
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What happens when you got the wrong cap?
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Component Counting and Material Management
©2018 Creative Electron, Inc.
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Material Management 101
n What does a factory do?¨ Moving, Storing, Transforming
n What materials need to be purchased?n Who will supply these materials?n When do these materials need to be purchased?n How much of these materials need to be purchased?
©2018 Creative Electron, Inc.
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Just-In-Time Inventory vs. Reality
n Too little inventory¨ Results in costly production line stoppages
n Too much inventory¨ Wasted cash sitting on the shelves
n To achieve best balance, real time data counts must be accurate
©2018 Creative Electron, Inc.
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Part Counting
X-ray image taken of entire reel of components. Image is analyzed and component type, quantity, and defects can be reported back to operator.
©2018 Creative Electron, Inc.
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X-ray Part Counting Benefits
n Fast (15-30seconds per reel)n Accurate Countbacks (99%+)n Component Type Identificationn Counterfeit Detectionn Integration with MRP System
©2018 Creative Electron, Inc.
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Artificial Intelligence
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30-second intro to artificial intelligence (AI)
X ? YX Y2 40 03 6-5 -1010 20
x2
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Automatic Phone Inspection
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Automatic Phone Inspection
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Automatic Phone Inspection
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©2018 Creative Electron, Inc. www.creativeelectron.com
Automatic Phone Inspection
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Automatic Phone Inspection
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Automatic Phone Inspection
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Medical Devices
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