The Role of Interfacial Compound Formation on Package ... · PDF fileThe Role of Interfacial...

IMAPS2008, the41st

AnnualSymposium

on

Microelectronics

Novem

ber 2-6,2008

Providence, RI

WWW. IMAPS .ORG

JULY/AUGUST 2008Vol. 35 No. 4

MaterialsandThermalManagement

Semiconductor Material ...

Aspects on Advanced ThermalManagement ...

Local Reactive Heat Sourcefor Room TemperatureSoldering ...

Role of Interfacial CompoundFormation ...

MaterialsandThermalManagement

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IMAPS 2008 Sponsors

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JULY/AUGUST2008

On the Cover:Courtesy of Reactive NanoTechnologies, Inc. (RNT)

Features

SemiconductorMaterial

Market TrendsDan Tracy

Aspects on AdvancedThermal Managementfor Flip Chip on LTCCM. Norén, S. Brunner,C. Hoffmann, W. Salz,

and K. Aichholzer

A Local, Reactive HeatSource for Room

Temperature Solderingof High Power Devices

to SubstratesZ. He, R. Vincent,

E. Besnoin andD. Van Heerden

The Role of InterfacialCompound Formationon Package Reliability

Jonathan H. Harrisand Erich Rubel

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ADVA N C I N G

MICROELECTRONICS

C O N T E N T S

IMAPS - InternationalMicroelectronics And

Packaging Society611 2nd Street, NE

Washington, DC 20002Tel: (202) 548-4001

Fax: (202) 548-6115E-mail:

[email protected] us on IMAPS’s Home Page:

www.imaps.org

DEPARTMENTS

4 From the President andFirst Past PresidentOur Purpose and How We AreOrganized

5 From the Editor-in-ChiefMaterials and ThermalManagement: Challengeson All Fronts

6 From the European EditorThe European Way

UPDATESf r om IMAPS

7 Call for Technical Manuscripts

28 Society Awards

29 Student Paper CompetitionWinners

29 In Memoriam –Bob Waer

30 Exhibitor Products and Services

CHAPTER a n dI NDUSTRY NEWS

34 Welcome New Members

36 American Chapter News

38 European Chapter News

IMAPS 2008

46 From the General Chairs

47 About Providence

49 IMAPS Global Business CouncilFall Marketing Forum

50 Student Symposium Programs

52 Sign Up for a PDC

53 Exhibitors

55 Sponsors

MEMBER TOOLS

45 Chapter Contacts

56 Advertiser Hotline

56 Advancing Microelectronics2008 Editorial Schedule

56 Who to Call at IMAPS HQ

Inside Front CoverIMAPS 2008 Sponsors

Inside Back CoverCalendar of Events

Design

Materials &Process

Industry

Systems &Applications

IMAPS 4-TIERPARTICIPATION

COM ING NEXT I SSUE

IMAPS 2008 Show Issue


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Executive CouncilPresidentSteven J. Adamson, Asymtek

President-ElectDoug Bokil, Namark Process Design LLC

First Past PresidentMichael R. Ehlert, Barry Industries, Inc.

Vice President of TechnologyLee Levine, Process Solutions Consulting

Vice President of Marketing and MembershipLaurie Roth, Laurie Roth Marketing

SecretarySusan C. Trulli, Raytheon RF Components

TreasurerDavid C. Virissimo, SemiconductorPackaging Materials

Northwest Regional DirectorDr. John Zhang, Finisar Corporation

Southwest Regional DirectorHossein Ahmad, Boeing SatelliteDevelopment Center

Southeast Regional DirectorDr. Kinzy Jones, Jr., Amoeba Technologies

North Central Regional DirectorAdam Schubring, Kyocera America, Inc.

Northeast Regional DirectorMichael Salloum, R&D Assembly, Inc.

Ex-Officio (Exec. Dir.)Michael O’Donoghue, IMAPS

Publications CommitteeEditor-in-ChiefJeffrey C. Demmin, TesseraTechnologies, Inc.

Editor - The Americas,Advancing MicroelectronicsGreg Caswell, D2M Technologies

Editor - Europe, Advancing MicroelectronicsSøren Nørlyng, Micronsult

Editor - Asia, Advancing MicroelectronicsDr. Hironori Asai, Toshiba Corporation

Editor, Journal of Microelectronicsand Electronic PackagingDr. Fred Barlow, University of Idaho

DirectorsExecutive DirectorMichael O’Donoghue

Director, Program Development & TechnologyBrian Schieman

Managing EditorAnn Carter Bell, ManagerMarketing & Communications

Advertising SalesLarry Driscoll818-704-9067 Ext. [email protected]

Advancing Microelectronics (formerly Inside ISHM) ispublished six times a year and is a benefit of IMAPSmembership. The annual subscription price is $75; $15for a single copy. Copyright 2008 by IMAPS—International Microelectronics And Packaging Society.All rights reserved. Except as defined in 17 USC, Sec.107, permission to republish any materials in this publi-cation must be obtained from IMAPS, 611 2nd Street,NE, Washington, DC 20002. Telephone (202) 548-4001.

U P C O M I N G E V E N T S

ATW on RF and Microwave PackagingSeptember 16-18, 2008 San Diego, CA

International Conference on Electronic Packaging Technology & High DensityPackaging (ICEPT - HDP)

July 28-31, 2008 Shanghai, China

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other EmergingTechnologies in the Development of Alternative Energy

August 12-14, 2008 Albuquerque, NM

Visit www.imaps.org for links to allupcoming events including:

� full event descriptions

� abstract submissions

� exhibition information

� event updates

IMAPS 2008November 2-6, 2008 Providence, RI

IMAPS/SEMI ATW on Wire BondingJuly 14, 2008 San Francisco, CA

XXXII International Microelectronics and Packaging IMAPS-CPMT PolandSeptember 22-23, 2008 Pultusk, Poland

Advanced Technology Workshop on Thermal ManagementOctober 14-16, 2008 Palo Alto, California

7th International Symposium on Microelectronics and Packaging (ISMP 2008)October 15-17, 2008 Seoul, Korea

Emerging Microelectronics and Interconnection Technology (EMIT 2008)December 15-18, 2008 Bangalore, India

ATW and Tabletop Exhibit on Printed Devices and ApplicationsFebruary 25-27, 2009 Orlando, FL


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ADVA N C I N G

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This year IMAPS celebrated its fortieth anniversary.In all of these years our members have been sharingideas and educating the next generation. This rolekeeps expanding as new technologies come along andwe have to adapt the society to meet the new chal-lenges. IMAPS has been from its inception a looselyorganized group. Our chapters are very independentand that frees them to be responsive to local require-ments; no one is telling them what programs they needto put on or how to do it. If they want they can ask forhelp from the International Head Quarters (IHQ) staff.This arrangement extends beyond the shores of theUSA, all chapters are equal. The IHQ staff are there tofacilitate organization of events and publishingAdvancing Microelectronics. They maintain the webpages and fulfill many functions that volunteers do nothave the time to take on, such as booking hotels andmeeting rooms for international conferences and meet-ings. This ever-evolving organization with its loose tieshas grown to the largest Microelectronic Packagingsociety in the world, several times larger than IEEE-CPMT. It would appear that the model has been verysuccessful.

Recently there was a proposal to change the way thesociety is organized. Some people felt that ourExecutive Council (EC) was dominated by the USmembers. This is true, our EC has been composed ofmembers from the US, although we have had one pastpresident who came from the UK. Members drive thecomposition of the Executive Council. Typically, it isUS members who participate in the leadership ofIMAPS functions so they become known to the mem-bership and are as a consequence nominated and elect-ed. It was proposed that we form an international gov-erning council, similar to how the United Nations oper-ates. This would allow our non-US affiliates a greatersay in how the society is run. The IMAPS executiveasked for guidance on this subject from the Advisorycommittee. The Advisory Committee is composed ofthe society's past presidents; they form the corporatememory of the society. The one striking response fromthem was the fact that the society was set up to be aloosely organized group, and they did not want to havestrong upper level management of the society at itsinception. Further feedback suggested that if we didmake changes we should not increase costs to the mem-ber. So based on this feedback the EC reviewed the pro-posed suggestions and voted not to make any changesto the way the society is organized. This was reported tothe World Liaison Committee (WLC) in Munich thispast April, by Mike Ehlert. The WLC is a group formed

to allow IMAPS chapters from around the world to haveinformal discussions and coordinate calendars, etc. It isnot a governance function.

One thing to remember here is that there is an “I” inIMAPS, we currently have an international body.Members from any country can run in the elections forEC positions. There are no set asides for members fromany region, we do not discriminate or favor people fromany region or for any reason.

We have one golden rule in IMAPS. A member is amember, no matter where they are from. How do weknow you are a member? We know you are a memberbecause you have registered as a member and paid dues.In some parts of the world the IMAPS chapters havelocal members. They pay dues to the local chapter butnothing is sent to the HQ. As well as RegularMembership we also have International Affiliate mem-bership. These are IMAPS members too and are entitledto all the benefits of membership, including running inelections for the EC. This addresses some of the eco-nomic differences around the world. Some of the inter-national chapters have complained that membersshould not have to pay the local chapter and sendmoney to the US for an International Affiliate member-ship. Unfortunately these days, if we want to run a leanstaff and control costs, we have to depend on our com-puters to do some of the work for us. If a person out-side of the US is not willing to support IMAPS by pay-ing for the Affiliate membership which currently is setat $20, we cannot afford to send them copies ofAdvancing Microelectronics or let them into our membersites on the web or offer them member discountsat IMAPS events and the other benefits of IMAPSmembership.

We have one golden rule, a Member is a Member isa Member, but you have to demonstrate that you wantto be a member by paying membership dues either as afull or international affiliate member. This also gets youa vote at the next election.

We want our chapters to be successful, we want theEuropean and Asian members of IMAPS to go out andbuild the society in the areas we have not operated pre-viously. International Headquarters will gladly supporttheir efforts.

We are organized on a very loose basis with no largecentral bureaucracy; we have many geographically sep-arated independent chapters. We are organized to beflexible and therefore can be entrepreneurial. Let’s keepour education mission in front of us, to help the nextgeneration and share ideas to help us be better at whatwe do.

Our Purpose andHow We Are Organized

Steven J. Adamson,Asymtek, Carlsbad, CAIMAPS 2008 President

Mike Ehlert,Barry Industries,First Past President


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J U LY / A U G U S T

2008

The July / August issue of Advancing Microelectronicscovers two topics that come up everywhere in theindustry – materials and thermal management.

Incidents of overheated electronics make main-stream news, and entire product lines have beenrevamped to reduce power, to the point where lowpower is now a critical differentiator in the marketplacefor many types of ICs. An informal survey of adver-tisements in a chip industry publication showed a sur-prisingly high fraction highlighting power reduction orpower management, rather than advanced silicon tech-nology or some new kind of functionality. Dealing withthe heat generated by semiconductors is a huge chal-lenge – but one that is squarely in the scope of IMAPS.Whether it is conductive materials, packaging,heatsinking, or system-level solutions, many players inthe industry can contribute to thermal solutions.

Similarly, there are widespread challenges in materi-als these days everywhere in the semiconductor indus-try. Adhesives, coatings, interconnect materials, sub-strates, dielectrics … the list of critical types of materi-als in the semiconductor industry is very long.Roadmaps such as the ITRS and iNEMI’s publicationshighlight materials issues as some of the biggest hur-dles facing the industry. Again, the scope of IMAPScovers this thoroughly. In fact, many of the traditional,long-term IMAPS members are materials companies,and we are glad to contribute to progress in the indus-try at its foundation.

At the industry level, we are glad to have an articleby Dan Tracy of SEMI, who reviews packaging materialmarket trends, including the cost of gold wire and theissue of the ROI on materials R&D. Diving deep intothe technology, Jonathan Harris and Erich Rubel ofCMC Interconnect Technology discuss the reliabilityeffects of interfacial compounds. As a (former?) mate-rial scientist, I appreciate the detail and thoroughnessof their work on this important topic.

A team from Reactive NanoTechnologies provided anice article about their novel technology that produceslocalized heat for a variety of applications. In this case,it provides room temperature soldering for attachmentof high power components. Finally, EPCOS inGermany wrote about thermal management of flip chipassemblies in LTCC, which is certainly an importantand complex challenge.

We thank our authors for contributing to anotherissue that we think should be of great interest to ourmembers.

Oh, and don’t forget to carve out some time on yourcalendar for the IMAPS 41st International Symposiumon Microelectronics coming up, back on the East Coastthis year – Providence, RI, November 2 – 6, 2008.November isn’t as far away as you think. Time flieswhen you’re having fun … which certainly applies tothose of you having fun addressing critical challengesin materials and thermal management!

Thanks for reading,Jeff Demmin

Materials and ThermalManagement: Challengeson All Fronts

F R O M T H E E D I T O R - I N - C H I E F

Jeff Demmin, TesseraTechnologies, Inc.,Editor-in-Chief

OOPS!In the last issue, we misspelled two names in the Nordson Student Award article.

Participants in the photo are Dr. Len Schaper, University of Arkansas, Student Advisor to the winner, Ying Mao (the studentwinner’s wife), Michael O’Donoghue, the winner of the award to Mr. Yang Liu (University of Arkansas) and Ray McHenry ofNordson Corp. The location is the Device Packaging Conference of IMAPS, www.imaps.org, a highly successful event with over650 attendees.


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The European WayTo demonstrate the International aspect in IMAPS

the well established CICMT (Ceramic Interconnect andCeramic Microsystems Technologies) event which hastaken place in Denver moved to Europe this year and isplanned to move to Japan 2010.

Ceramic technologies have still a very high focus inEurope (and Japan) for use in automotive electronicsand even mobile phone front end modules – besides innumerous RF and sensor applications. What could bemore natural than to take the event to where theexpertise and interest is seen.

The initiative came from individuals in IMAPSGermany and together with the German CeramicSociety with IMAPS NA and the American CeramicSociety as cosponsors the conference moved toMunich. The local arrangement – and work – was nowon the shoulders of the German team.

The conference was a success. More than 250 dele-gates and 31 exhibitors enjoyed the 2.5 day event with75 oral presentations and 50 poster presentations.

The European touch was clearly seen in the gener-ous provisioning and hospitality arrangements. The(south) German touch was seen in the abundance offood, beer and wine. All arrangements except the con-ference dinner took place in the exhibition area, so def-initely all exhibitors were exposed and busy during theconference days.

The conference dinner took place in a beer cellarand several IMAPS Germany traditions could beenjoyed: hammering the drain cock into the beer bar-rel(s) without emptying the beer on the floor or onyour clothes, and the traditional Bavarian dishes.

Definitely a conference you will remember – notonly for its excellent technical program – but also forthe many new people you had time to meet due to thevery social ambience perfect for networking opportuni-ties. Many thanks to our hosts!

Søren Nø[email protected]

Søren Nørlyng, Micronsult,[email protected]

The conferencewas a success.More than 250 delegatesand 31 exhibitors ...

IMAPS 2008

Providence, RI

IMAPS 2008

www.imaps2008.org


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2008

U P D A T E S F R O M I M A P S

Call for TechnicalManuscripts

We invite all individuals involved in related tech-nologies to submit manuscripts for the Journal ofMicroelectronics and Electronic Packaging.

The IMAPS Journal is a prestigious, refereed, andarchival publication distributed worldwide to IMAPSmembers, educational institutions, and corporatelibraries. Complete information regarding this publica-tion may be found on the IMAPS website atww.imaps.org; however, the key points are:

• All submissions must be in electronic format, andshould be submitted via EMail [email protected].

• The Transfer of Copyright form must be filled outon the IMAPS website.http://www.imaps.org/jmep/copyright.pdf

• Papers should preferably be written in MicrosoftWord.

• Tables, graphs, and photographs should besubmitted at the end of the file and need not beembedded in the text.

• Photographs and other illustrations shouldpreferably be submitted in JPEG, GIF or WMFformat.

Authors of papers that have been printedin other IMAPS publications or presentedat IMAPS workshops are invited to submit

updated and/or expanded versions oftheir papers for possible publication

in the Journal.

We invite your suggestions on how to improve theJournal in any way. Please send all submissions, com-ments, or questions to [email protected].

IMAPS Headquarters611 2nd Street, NEWashington, DC 20002Phone: 202-548-4001Fax: 202-548-6115E-mail: [email protected]: www.imaps.org

Exhibit at IMAPS 2008!

Visit www.imaps2008.org for complete exhibit details.

Exhibiting at IMAPS enables you to:

• Reach over 3,000 buyers and specifiers in one place• Generate exposure in this highly competitive marketplace• Launch new products and concepts to the market• Enhance relationships with existing customers

Exhibit at IMAPS 2008!


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SSemiconductor Material Market TrendsDan Tracy, Senior Director Industry Research & Statistics, SEMI

F E A T U R E A R T I C L E

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A positive trend for suppliers of semiconductormaterials, including both the fab and packaging seg-ments of the industry, is that demand for semiconduc-tor devices will continue to increase as electronic prod-ucts become ever more widespread in our lives. Thisdemand growth for semiconductor devices means thatwafers, chemicals, resins, solder, and other materialsare consumed in the fabrication and assembly of eachdevice.

The accompanying figure shows the history of bothsemiconductor device unit sales and silicon wafer ship-ments over the past 24 years. As expected, the correla-tion between the two is strong, with both growing at8% to 9% compound annual growth rate (CAGR) trendover this time period. Making a simple assumption thatthis 8% to 9% trend growth can be maintained throughthe middle of the next decade, we are looking at anindustry that could consume 15 billion square inchesor so of silicon to produce 900 billion devices.

Source: WSTS, Rose Associates, and SEMI

Over time, the semiconductor industry has becomemore efficient in processing materials and in theamount consumed in both wafer fabrication and pack-age assembly. Layers and structures on the chip arebecoming thinner and finer in size, and many packag-ing form factors are thinner and smaller with, in somecases, multiple die stacked inside a single package.Technical challenges abound for suppliers as the indus-try advances device scaling and systems integration toincrease device performance. Key to these innovationsare materials. Declining dimensions of films and devicestructures are pushing the limits to our current under-standing of interfacial interactions and surface effects.Each generation of device technology is becoming more

and more complex with respect to process integration.Specific to packaging, where new and complicated formfactors are being developed, new materials are neededto assemble reliable devices that have increased functionality.

Beyond technology, two economic challenges stand front and center of the semiconductor industryregarding material technology development and consumption.

First is the recent trend in rising commodity pricesfor various raw and starting materials. Specific to pack-aging are the rising costs of important materials: resins,copper, tin, gold, silver, and palladium. There has beena sharp rise in pricing for these materials over the past


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several years and, as a result, this has spurred develop-ment efforts either to reduce the amount of metal con-sumed or, in some cases, investigate replacement mate-rials. For companies assembling packages, the chal-lenge is that some of the advanced packaging technolo-gies, such as CSP and wire bond Ball Grid Arrays(BGA), are viewed as commodity technologies, so high-er material costs are detrimental in achieving accept-able margins.

A prime example is the price of gold, which was$400 per troy ounce four years ago, and in the pastquarter briefly reached over $1,000 per troy ounce. (Bylate April/early May 2008, the average daily pricedeclined to under $900 per troy ounce.) Gold wire isused for all types of packaging applications and it rep-resents more than 90% of the worldwide bonding wiremarket in both volume and, of course, value.Reportedly, pricing of the high purity gold metal repre-sents an estimated 85% of the total cost of 25 microndiameter wire.

The impact of the rising cost of gold has compelledmanufacturers to migrate towards smaller diameterwire where appropriate and look at alternative technologies:• The majority of the gold wire market now consists

of 25 micron or less diameter wire.• Suppliers are increasing wire spool lengths to help

control costs through improved set up times andproduction yields at assembly.

• Higher gold pricing has contributed to the interestand on-going development in copper bondingwire.

Copper bonding wire offers high electrical and ther-mal conductivity and a lower rate of inter-metallic com-pound growth, providing superior reliability in hightemperature environments compared to gold bondingwire. Copper offers lower bulk resistance (electrical),increased operating current and greater bond stabilitycompared to gold, and has an improved lifetime at180°C. Further, from a cost perspective given currentgold pricing, copper bonding wire is about one-tenth(or less) the cost of gold bonding wire, depending onthe wire diameter. The adoption of copper bondingwire, however, requires a process change in terms oftool sets. Inert gas supply is needed for ball formationto prevent oxidation of copper bonding wire.

The price of gold wire is just one example; risingmaterial (and energy) pricing is also affecting the priceof leadframes, laminate substrates, encapsulants, andother materials. As a consequence, device manufactur-ers, their outsource manufacturing partners, and mate-rial suppliers must dedicate resources to developingprocesses and materials for cost reduction.

Throughout the industry supply chain, companiesstruggle to pay for the innovation needed to advancematerials technology. In addition to being affected byhigher starting material costs, companies are squeezedfrom the top, where the end consumer demands lowercost electronic goods, which results in pressure tocheaper semiconductor devices. This leads to the sec-ond significant challenge related to material technologyand development.

Material formulation and process development/inte-gration require considerable R&D resources. Any new

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material introduction experiences a long adoption cyclebetween the time of its initial design and developmentto full production. Added challenges include theminute amount of material required in some processes;a consolidating customer base; and unique and cus-tomer-specific material requirements. So materialsdevelopment drives a heavy R&D commitment, whilethe possibility of pursuing along a “blind alley” raisesthe risk, for a given supplier, that a Return-on-Investment (ROI) may not be realized.

The 2006 update to the International TechnologyRoadmap for Semiconductors (ITRS) notes that“increased device complexity requires higher cost pack-aging solutions,” though margins in the industry areinadequate to support innovation. With the surge in thetypes and sizes of packages, materials intensity in theback-end is growing, so solutions driving innovationare needed. Collaborative efforts, in various forms suchas through consortia or company-to-company, allowcompanies to share risks and R&D costs so to keeppace in developing new materials.


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http://www.thickfilm.net


AAspects onAdvanced ThermalManagement forFlip Chip on LTCC

M. Norén, S. Brunner, C. Hoffmann, W. Salz, K. Aichholzer

EPCOS OHG, SAW MLIP T, Siemensstrasse 43, A-8530 Deutschlandsberg,[email protected]

IntroductionThe LTCC technology is a multilayer ceramic tech-

nology, with vias as interconnects. The vias can be usedas an electrical and / or thermal conductor. On theLTCC different interconnection technologies for thesemiconductor assembly, such as wire- or FC -bondingcan be applied. Due to the fact that semiconductorsgenerate heat while operating, the thermal managementmust be considered. In a wire bonded solution the dieis mounted with the backside on a heatsink. In the flipchip technology, where the backside faces up, the heatmust be transferred through the solder bumps and theunderfill down to the substrate. For FC applications inthe LTCC module technology the FC backside can notbe used as heatsink from space prospective [1].

In order to characterize a standard FC LTCC mod-ule a test structure was designed and fabricated. Thetest module contains a FC mounted thermal test die.The test die has an integrated heating resistor and adiode to monitor the junction temperature. For thetests, the die was underfilled using a commercial stan-dard underfill. The underfill was optimized for reliabil-ity and not for thermal matter.

A daisy chain, which leads through the LTCC, thesolder bumps and the die is also integrated in the testdesigns. The structure of the samples is shown inFigure 1.

Results and DiscussionThe investigation parameters are the thermal vias,

the heatspreaders, the LTCC thickness, the underfill,the via offset, the via offset position, and the standoffheight. Figure 2 defines some of the different parame-

ters. The via diameter in the test setup was 100 micronsand in order to simulate a possible via misalignmentduring the fabrication process, the via offset was variedbetween 0 and 100 microns and the offset heightsbetween 50 microns below the top layer and50 microns above the bottom layer. One further param-eter which was tested was the standoff height. Thestandoff height mainly depends on the Under BumpMetallization (UBM) diameter, the solder bump vol-ume, the substrate planarity, the bump planarity, thewetting angle and the via diameter.

Increased standoff height has a positive influence onthe temperature cycling behavior, but a negative on thethermal management, so there must be a tradeoff here[3, 4].

For the measurement each set of samples was sol-dered on to a brass plate which acts as a reservoir at

AbstractOne of the major driving forces for the electronic industryis consumer handheld units, where more and more func-tions in a smaller volume and with longer battery time arerequested. This leads to a higher energy- and interconnectdensity. One trend to manage the interconnect density isusing Flip Chip (FC) technology which remarkablyreduces the keep out area around the die compared to awire bonded one. Two challenges related to this requestthat the industry is facing are thermal management andreliability. This paper will discuss some aspects of usingFC technology on Low Temperature Cofired Ceramics(LTCC) for this kind of product and will focus on the heatdissipation problem of a FC mounted die. Test designswere developed and built to investigate SnAgCu (SAC)bumps on five different LTCC designs and the thermalinfluence of underfills. The LTCC design parameters werethermal vias and heat spreaders. In the experimental partthe semiconductor junction temperature was measuredover a diode in the semiconductor. Furthermore cross sec-tioning, X-ray imaging and infrared thermal imagingwere used. The experiments were accompanied by FE-modeling using ANSYS workbench.

Keywords: Low Temperature Cofired Ceramics, Flipchip,Thermal Management, Reliability, FE-modeling

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Figure 1: Overview of the test design.


25°C and the heating resistor was powered with 1W.Then the voltage drop over the integrated diode wasmeasured and the semiconductor junction temperaturewas calculated using Equation 1.

UD = diode voltage [V]TM = measured die temperature [ºC]TM = (UD-0,70085) / -0,00208 (1)

The nomenclature for the samples is XYZ. Where:X � Substrate thickness: A=400µm, B=800µm

and C=1200µmY � Design option: 0,1,2,3 and 4.

See Table 1 below.Z � Underfill: U=underfill or N=no underfill

The test vehicle without underfill is shown inFigure 3 and Figure 4. Note that the four open vias tothe right indicate the options of the designs which areshown in Table 1.

The effect of using underfill or not is shown inFigure 5. There is a small but not significant decreasein the junction temperature. The used underfill wasoptimized for reliability and not for thermal matter andthe thermal conductivity was only 0.3W/mK.

The LTCC substrate thickness was varied between400 microns and 1.2 mm. The measurements of thesemiconductor junction temperature versus the LTCCsubstrate thickness are shown in Figure 6. Increasingthe LTCC substrate thickness from 400 microns to 800microns results in a 5 K higher junction temperature.

The results for the five different thermal designsdescribed in Table 1 show that the thermal vias havethe major effect on the thermal management (seeFigure 7). By adding heatspreaders and / or additionalthermal vias (design 1..4) the effect on the thermalmanagement is only minor and not significant.

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Figure 2: Overview of the different parameters for the experiment.

Table 1: Design Options

Figure 3: Sample of a thermal test die mounted with flipchip technology on a LTCC-substrate.

Figure 4: X-ray investigation of the thermal test FC diemounted on the LTCC. The 9 inner vias were optional asadditional thermal vias (see Table 1).

Figure 5: Semiconductor junction temperature rises above ambient for the underfilled case versus the not underfilled case.


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Figure 8 shows an infrared image of a cross sec-tioned test sample. The picture shows the result of asubtraction of the image at powered state minus theone in non powered state. The temperature distributionin the picture clearly points out the distinct influence ofthermal vias and heatspreaders.

For each combination of parameters a set of 5 sam-ples was measured and a supporting FE-Modeling wasdone [5]. Figure 9 shows the results for the via offsetand offset height.

The measurement and simulation shows a goodaccordance and demonstrates that a via offset smallerthan 60 microns gives only a slight temperatureincrease, regardless of the via offset height. At 100microns offset the influence of the offset height is visi-ble. The influence gets stronger while the offset getscloser to the heat source.

The influence of standoff height is shown in Figure10. The semiconductor junction temperature is direct-ly proportional to the standoff height, but the influenceis rather small.

Figure 6: Semiconductor junction temperature rises above ambient for the three different LTCC - thicknesses.

Figure 7: Semiconductor junction temperature rises above ambient for the five different thermal designs.

Figure 8: Infrared image of a FC mounted die on LTCC sub-strate with thermal vias and heatspreader.

Figure 9: Measured and simulated % change of the semiconductor junction temperature vs. via offset and offset height.


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ConclusionsTo minimize the semiconductor junction tempera-

ture in the package, the combination of material andthermal design must be considered. The main reduc-tion of the temperature is related to the usage of ther-mal vias. A via offset smaller than 60 microns with a100 microns vias diameter gives only a minor increasein the semiconductor junction temperature. Reducingthe LTCC substrate thickness will decrease the junc-tion temperature further. This paper showed that FCon LTCC is a promising key technology for poweramplifier modules e.g., PaiD (Power amplifier withintegrated Duplexer).

References1. R. R. Tummala, Fundamentals of Microsystems Packaging, 2001.2. M. Noren, S. Brunner, C. Hoffmann, W Salz, C. Block, Challenges

and Potentials with SiP using FC on LTCC, 8th EPTC Singapore2006.

3. P. Lall, M.-G. Pecht, E. B. Hakim Influence of Temperature onMicroelectronics and System, Crc Press, 1997.

4. J. H. Lau, Flip chip Technologies, 1995.5. www.ansys.com

Figure 10: Measured % Change of the semiconductor junctiontemperature vs. stand off height.


http://www.compexcorp.com

AALocal, Reactive Heat Sourcefor Room TemperatureSoldering of High PowerDevices to SubstratesZ. He, R. Vincent, E. Besnoin and D. Van Heerden,Reactive NanoTechnologies, Inc., 111 Lake Front Drive, Hunt Valley, MD 21030, 410-771-9801


With increasing power density and higher heat dis-sipation requirements in power electronic components,minimizing the thermal resistance at the component-to-heat sink interface is critical to more effectively coolthe component for long-term reliability [1,2,3]. Inresponse to these high demands on the thermal inter-face, a new generation of low thermal resistance inter-connect materials based on reactive multilayer bonding(NanoBond®) has been developed.

This novel process uses reactive multilayer foil(NanoFoil®) to solder components in less than a sec-ond, in air, at room temperature, with minimal thermalexposure to the components. Reactive multilayer foilsare a class of nano-engineered materials fabricated byvapor depositing hundreds of nanoscale layers thatalternate between elements with large negative heats of

mixing, such as nickel (Ni) and aluminum (Al) (Figure1). Heat is generated by initiating a self-propagatingexothermic reaction in the foil via a small energyimpulse [4]. The thermal energy produced by the reac-tion rapidly melts adjacent solder layers, bonding thecomponents [5]. These solder bonds have high ther-mal conductivities as well as low thermal contact resist-ances associated with the metallic wetting of the com-ponents by the solder.

In this article, we describe the use of reactive multi-layer foils to solder-bond two different high powerdevices to heat spreaders/sinks, including the bondingof high brightness LEDs to metal core printed circuitboards (MCPCBs), as well as the bonding of bare-dieGPUs to heat sinks. We discuss the thermal perform-ance and reliability test results for reactive multilayer

16

Figure 1. Schematic of reacting multilayer foil (NanoFoil®), ignited on the left, wave propagating to the right, withmicrostructures before and after reaction.


bonds and present comparisons of thermal perform-ance between these bonds and other current marketsolutions. The test results show that the introductionof a reactive multilayer bond as a thermally conductiveinterconnect material between the high power deviceand the heat sink demonstrates significant performanceadvantages over other current commercially availableTIM (Thermal Interface Material) solutions.

Bonding of High Brightness LEDs toMCPCB Boards

Previous studies have shown that the temperature atthe junction of an LED determines the light output,spectral shift, and degradation of light output over time[3,6,7]. In this study we solder bonded OSRAMDragon-series LED packages to MCPCBs using reactivemultilayer foil, demonstrated the reliability and qualityof the bond in this application, and compared its ther-mal performance with that of commercial thermaladhesives. The joining configuration used for the reac-tive multilayer bond is shown in Figure 2.

The strength and thermal performance of the reac-tive multilayer bond was optimized by varying the mul-tilayered foil thickness and bond process parameterssuch as bonding pressure. The resulting optimizedbonds exhibit average measured thermal conductivitiesof 30W/Km and shear strengths of 35 MPa (5130 PSI)with average less than 5% void content (Figure 3).There is no significant degradation observed in thethermal performance and structural performance aftera series of reliability tests. The reliability test results aredetailed in Table 1.

Comparative thermal resistance tests were carriedout between reactively bonded LED packages and theepoxy thermal interfaces currently utilized. The testswere conducted on 1.6W Golden Dragon LEDsattached to MCPCBs, and the thermal tests using ther-mal transient testing [8]. Preliminary testing shows thereactive multilayer bonds dramatically outperformthermal epoxy with one third of thermal resistancefrom junction to MCPCB. With further optimizationthe performance gap between the reactive bonds andthermal epoxy may be even larger. This improvementin thermal resistance will result in a lower operatingtemperature for the LED die than the current thermal

adhesive solution, potentially increasing the lifetime ofthe LED devices.

Bonding of Silicon Dies to Copper HeatSinks

The joining configuration for the die to heat sinkreactive bonding method is shown in Figure 4. Indiumsolder is used because of its high thermal conductivityand its ability to accommodate the thermal expansionmismatch between the silicon die and copper heat sinkwithout degrading or applying significant stress to thecomponents [9,10].

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Figure 2: Diagram illustrating the LED reactive multilayer bond (NanoBond) process.

Figure 3: (a) LED packages bonded with reactive multilayer foil to Sn-plated MCPCB. (b)Acoustic microscopy (C-scan) image of an LED package reactively bonded to a MCPCB.The areas exhibiting dark contrast (an example of which is circled) represent bondsbetween the board and the metal slug at the base of the LED package.



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The thermal performance of the reactive multilayerbonds was measured using a laser flash technique. Inaddition a series of reliability tests were performed onthe bonded samples including temperature cycling,thermal shock, mechanical shock, vibration and tem-perature-humidity bias tests. The bonds have averagemeasured thermal resistances of 0.04-0.05 K cm2/Wwith a standard deviation of less than 0.003 K cm2/W.The results of reliability tests are summarized in Table2, and show that there is no significant degradationobserved in the thermal performance after reliabilitytesting.

To obtain a direct comparison of the thermal per-formance of reactively bonded GPU interfaces with cur-rent commercially available TIM solutions, benchmarktesting was performed using an operational video cardas a test vehicle. The performance of a reactive bondwas tested against two high-end commercial greases,one phase change material (PCM) and one low meltingalloy (LMA). The test results are listed in Table 3. Thethermal resistance of the reactive bond is roughly onefifth that of organic grease A, a quarter that of grease B,and a third that of the phase change material and lowmelting alloy.

Figure 4. Reactive metallic joining of components to silicon dies for TIM applications.(a) Typical silicon chip and heat sink package. (b) Joining configuration used.



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ConclusionsReactive multilayer bonding is demonstrated to be a

robust thermally conductive interconnect solution toattach high power devices to the heat sinks orMCPCBs. The thermal performance of a reactivelybonded commercial LED package to MCPCB is 3X bet-ter than that of the current epoxy solution and the ther-mal performance of a reactively bonded GPU to heatsink measured by benchmark tests is up to 3X - 5X bet-ter than those of other market available TIM solutions.The bonds made using this local heating technologyalso passed a series of industrial standard reliabilitytests.

References

[1] International Technology Roadmap for Semiconductors (ITRS)2003 Edition, Semiconductor Industry Association, 2003.

[2] R. Iscoff, “Thermal Management: Smaller, Faster, Hotter!,” ChipScale Review, Gene Selven & Associates, San Jose, CA, January –February 2004.

[3] Philips LumiLEDs Technology White Paper “UnderstandingPower LED Lifetime Analysis.”

[4] T. P. Weihs, “Self-Propagating Reactions in Multilayer Materials,”chapter in “Handbook of Thin Film Process Technology,” editedby D.A. Glocker and S.I. Shah, IOP Publishing, 1998.

[5] J. Wang, E. Besnoin, A. Duckham, S. J. Spey, and M. E. Reiss, O.M. Knio, M. Powers, M. Whitener and T. P. Weihs, “Room-tem-perature soldering with nanostructured foils,” Applied PhysicsLetters Vol. 83 (19) November 2003.

[6] N. Narendran and Y. Gu, “Life of LED-based white light sources,”Journal of Display Technology, Vol. 1 (1), pp. 167 – 171 (2005).

[7] Narendran, N., Y. Gu, L. Jayasinghe, J.P. Freyssinier, and Y. Zhu.2007, “Long-term performance of white LEDs and systems,”Proceeding of First International Conference on White LEDs andSolid State Lighting, Tokyo, Japan, November 26-30, 2007, pp174–179.

[8] G. Frakas, S. Haque, F. Wall, P. Martin, A. Poppe, Q. van VoorsstVader, G. Bognar, “Electric and Thermal Transient Effects in HighPower Optical Devices” Semiconductor Thermal Measurementand Management Symposium, 2004. Twentieth Annual IEEEVolume, Issue 9-11 Mar 2004 Page(s): 168 – 176.

[9] J. S. Subramanian, D. Van Heerden, and Z. He, “Direct Die AttachUsing a Room Temperature Soldering Process,” ElectronicsCooling, May, 2006.

[10] F. Hua, C. Deppisch, and T. Fitzgerald, “Indium as ThermalInterface Material for High Power Devices,” AdvancingMicroelectronics, Vol. 33, Sept/Oct. 2006, pp. 30-32.


TThe Role of InterfacialCompound Formation onPackage Reliability

Jonathan H. Harris and Erich Rubel, CMC Interconnect Technologies


Since all types of electronic packages involve thebonding of heterogeneous materials, interfaces betweendifferent material types frequently have a significantimpact on package performance characteristics.Interfacial requirements in packaging applications cantake on a number of different aspects. These includeadhesion strength of the interface, mechanical stabilitywhen stressed (for example, temperature cycling ormechanical shock), transmission of heat through theinterfacial layer and the chemical stability of the inter-face during processing or in the work environment.The focus of this paper will be to discuss the impact ofspecific chemical compounds that frequently form atmetallization interfaces in packaging applications onthe reliability of those interfaces with respect to thetype of interfacial requirements listed above.

Interfacial Failure ModesFigure 1 shows interfacial failure between a AuSi die

attach layer and the underlying Ni plating. In this case, a single mode of failure is observed:

delamination along the interface between the AuSilayer and the Ni plated layer. In general, this type offailure can have different origins: poor adhesion of thetwo components due to contamination or inappropriatematerial choices; or the presence of a brittle, continu-ous phase at the interface between the two metal layerswhich fractures when stress is applied to the interface.In fact, in Figure 1 the interfacial failure is caused bythe presence of a continuous nickel silicide layerbetween the Ni plated layer and AuSi. This nickel sili-cide (NiSi2), which is an example of an intermetalliccompound (IMC), is brittle and fractured when theinterface was exposed to a shear force. Clearly this typeof single mode failure directly through the interfacialregion is a potential reliability concern, regardless ofthe force required to instigate this failure. This articlewill focus on the role of IMC formation in precisely thistype of stress-induced interfacial failure.

Intermetallic CompoundsIntermetallic compounds (IMC) are ordered alloy

phases made up of two or more metal components witha narrow composition range (line compounds in aphase diagram). Each distinct metallic atom in the IMCstructure occupies a specific site on the crystal lattice.

The copper-silicon phase diagram is shown inFigure 2i. This system exhibits a number of differentIMC composition including: Cu33Si7, Cu16Si4, Cu9Si2,and Cu19Si6.

Because IMCs of relevance to electronic packagingmetallization systems often form in-situ during metalinterface formation, and often under non-equilibriumconditions, it is very difficult to fabricate bulk IMCsamples with the same crystalline composition andgrain structure as interfacial phases. For this reason, thebulk properties of many interfacial IMC materials havenot been well characterized.

One study performed by Fields and Lowii at NISTMetallurgical Division attempted to reproduce compo-sitions and microstructures of CuSn and NiSn IMCsfound at metallization interfaces. A summary of thedata from their study is shown in Table 1.

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Figure 1: Single Mode Failure between Die Attach and Plated Layers


There are a number of important material trendsthat are illustrated by the data in Table 1. The first keytrend is that an IMC formed from two ductile elementscan be very brittle. In this case, the parent elements Cuand Sn are ductile, but when they react to from Cu6Sn5and Cu3Sn, the resultant IMC is brittle. Another trendthat is associated with IMC formation is severe degra-dation of both thermal and electrical conductivity. Inthis case, Cu has a thermal conductivity of 385 W/m-Kwhich falls by a factor of more than 5 when Cu3Sn isformed. This is very close to the thermal conductivityof pure Sn (67 W/m-K). The same type of drop is seenin electrical conductivity.

It is very clear from this brief discussion why IMCformation can be such a serious issue for electronicpackaging metallization interfaces. Mechanical integri-ty, thermal conductivity and electrical conductivity areall critical parameters for effective package perform-ance. If a continuous IMC layer forms as part of themetallization, particularly if the IMC layer is thick,very significant degradation in device performance andreliability can be observed. For packaging applications,this could be a die attach metallization or interconnec-tion of a lead, wirebond pad or heat spreader. Specificexamples of this type of degradation in electronic pack-aging applications will be discussed later in this paper.


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Figure 2: The Copper Silicon Phase Diagram

Table 1: Key Properties of Various CuSn and NiSn IMCs (from Reference X)



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IMC Formation at Electronic PackagingMetallization Interfaces

Why is IMC formation a significant issue in elec-tronic packaging applications?

Typically thin film metallization systems are com-prised of three distinct functional layers. The first layeris designed to bond with the substrate; the second layerhas two functions. It prevents diffusion of the bondinglayer material into the top solder surface, and it alsoacts as a solder wetting surface. The top layer is hard orsoft solder or Au for wirebond or soldering applica-tions.

Table 2 lists typical elements or compounds that arefound in these metallization layers. The table also illus-trates, for different combinations of these elements orcompounds, the numerous intermetallic compoundsthat have the potential of forming at each interface.

Note that we have only listed the binary IMC phas-es that can form in Table 2. There are also numerousternary IMCs that can (and do) form in packagingapplications. It is clear from this table that minimizingthe negative impact of IMC formation on metal adhe-sion, electrical performance and thermal conductivityis a key priority in defining packaging metallizationsystems and processing.

Examples of IMC Formation in PackagingApplications

AuSi Die AttachOne very informative example of how IMC forma-

tion can impact reliability and how IMC formation canbe minimized using material know-how is AuSi dieattach. AuSi is frequently used as a high thermal per-formance die attach material for high power microwaveand RF silicon-based devices. For example, siliconLDMOS transistors that are used in cellular infrastruc-ture applications use this die attach material. Theadvantage of AuSi compared to other die attach optionsis a thermal conductivity of 190 W/m-K. This is muchhigher than AuSn at 57 W/m-K. The disadvantage ofAuSi is a very high processing temperature. The eutec-tic temperature of the Au80Si20 eutectic is 363C and diebonding is typically done at temperatures exceeding

400C. The AuSi eutectic die attach bond can be formed

“insitu” when a gold coated silicon device is bonded toa gold plated electronic package. The package con-struction in this case consists of a gold plated layer witha plated nickel under layer. The nickel layer is neces-sary to provide a wetting surface for the AuSi solder.

Figure 1 documents the results of a die shear testperformed on a silicon die with AuSi die attach on aplated Ni surface. The figure documents the formationof a continuous, brittle NiSi2 intermetallic compoundphase which forms between the AuSi die attach layerand the plated Ni layer. When stress is applied to thisinterface, brittle fracture of the IMC results in cleandelamination of the silicon die from the package (singlemode failure).

This situation is changed dramatically when theplated nickel layer is doped with greater than 5%cobalt. Because the kinetics of Co-silicide formation isslower than Ni-silicide formation, this doping frus-trates the formation of a thick, continuous layer of sili-cide (a thin NiSi2 layer, less than 0.3 microns, is some-times present but is too thin to lead to failure). TheNiCo layer also acts as a barrier to Ni diffusion to theinterface. Figure 3 shows a cross-section of a silicon diebonded with AuSi but with a NiCo plated layer. Notethat the NiSi2 is now isolated into discontinuous“blocks”. When die shear is performed on NiCo platedsamples, a mixed mode failure is seen with areas of fail-ure in the silicon die and areas of failure in the AuSilayer.

This example is interesting, because it illustrates asituation where the morphology of the IMC layer isaltered, not the IMC chemistry, yet a dramatic improve-ment in metallization reliability is observed.

AuSn Die AttachAuSn is commonly used as a die attach material for

high thermal dissipation applications. For example,AuSn is exclusively used to bond laser diode sub-mounts into telecommunications packages for fiberoptic applicationsiii. AuSn is also utilized as a seal ringsolder and is used to make solder interconnection inapplications where a solder hierarchy or fluxless sol-dering is required. Since AuSn is processed at 320C,

Table 2: IMC Formation at Electronic Packaging Metallization Interfaces


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joints formed with AuSn will not be disturbed by sub-sequent processing at lead-free solder temperatures(260C).

From a metallurgical perspective, AuSn is very dif-ferent than the AuSi eutectic discussed in the previousexample. Whereas the AuSi eutectic solidifies into amixture of pure Au and pure Si, AuSn eutectic liquidsolidifies into a mixture of two intermetallic com-pounds: Au5Sn and AuSn.

The following example illustrates reliability issuesthat can result when AuSn is bonded to a plated Nilayer. A Ni under layer is typically utilized for some dieattach applications and for most lead attach and sealring applications. Figure 4 shows the interface betweenthe AuSn solder and plated Ni after temperature shock.Note in this figure that a single mode interfacial failureis observed.

The EDS spectrum in Figure 5 identifies the phasethat is observed on both sides of the failure surface inFigure 4 as a Au-Ni-Sn ternary IMC.

The most likely composition of this ternary IMC is(Au0.5Ni0.5) Sn4

iv. This example illustrates an important concept in

understanding the reliability impact of IMCs at metal-lization interfaces: ternary IMC compounds, where onespecies substitutes on the lattice site of another species,generally have even worse mechanical, thermal andelectrical properties when compared to binary IMC(with no substitution).

There is a simple reason for this degradation ofproperties in the ternary compound. When one speciessubstitutes on the lattice site of a different atom, the dif-ference in atomic radii of the two materials leads to alocalized stress field around the substituted atom. Inthe case above, Au has an atomic radius of 2.88A whileNi is 1.49A. The localized stress due to the substitutionof Ni for Au as Ni diffuses into the AuSn solder can beestimated by the simple approximation:

Lattice Strain = C(crystal structure)[rsolvent – rsolute)/r solvent]2

C is a constant that is dependent on the crystal struc-ture of the IMC alloy.

This lattice strain increases the brittleness of thematerial and also scatters electrons which degrade boththermal and electrical conductivity.

Thus there are two key messages in terms of mini-mizing the impact of IMC at interfaces: (1) minimizedthe thickness and continuity of the IMC phase formedalong the interface; and (2) try to limit the formation of any ternary IMC compounds during material processing.

Sn-Ag-Cu SolderThe final example discussed in this article is the case

of a Sn96.5Ag3Cu0.5 solder ball bonded onto a Au plat-ed pad with a nickel plated underlayer. After ball shear,brittle failure is observed as shown in Figure 6.

Figure 7 shows EDS spectra from the top of the padshown in Figure 6, and Figure 8 shows EDS spectrafrom the complementary failed surface of the solderball.

Note that Figure 7 documents the presence of aNiSn IMC phase on the top of the pad after ball shear,and Figure 8 shows the presence of a ternary Ni-Cu-Sn

IMC on the back of the detached ball. This indicatesthat the failure in this case occurred at the interfacebetween two different IMC layers that formed when theNi plated layer reacted with the SAC solder. These twodistinct IMC layers are shown in cross-section inFigures 9 and 10.


Figure 3: Doping Ni with Co Frustrates IMC Formation during AuSi Die Attach

Figure 4: Failure at AuNiSn IMC when AuSn is soldered to Ni



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DiscussionThe failure analysis examples shown above illustrate

a number of key concepts concerning IMC formation atmetallization interfaces in electronic packaging applica-tions:• It is extremely difficult or impossible to eliminate

IMC formation in electronic packaging applica-tions. The groups of elements that are necessary toform effective interfaces in packaging applications (adhesion layers, bonding layers, solders) also

form numerous IMC when they interact with eachother during bonding.

• Morphology of the IMC layer is critical. If the layeris continuous or excessively thick, brittle fracturecan occur within the layer leading to delaminationof the metallization. If the continuous layer can beinterrupted, as was the case for Co doped Ni plat-ing for AuSi die attach, then the reliability of theinterface can be greatly improved.

Figure 5: EDS Spectra of the Failure Interface when AuSn is soldered to Ni.

Figure 6: Top View of Pad Showing Ball Shear Failure


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Figure 7: EDS Spectra from Top of Pad after Ball Shear

Figure 8: EDS Spectra from the Bottom of the Ball after Ball Shear



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Figure 10: Higher Magnification of IMCs at SAC Ni Interface. The line is drawn as a guide to the eye.

• Ternary IMC compounds, where reacting atomsare incorporated in the IMC structure substitu-tionally, have degraded mechanical, thermal andelectrical properties relative to binary composi-tions due to imposed lattice strain from the atom-ic substitution. In this case, failure can occur with-in the ternary compound (as in the AuSn example)or at the interface between a binary and ternaryIMC (as in the case of the SAC example).

• By implication, steps to minimize the extent andthickness of IMCs are key to improving packagereliability.

As is clear from this article, completely eliminatingformation of IMC at interfaces is not a practical solu-tion for most applications. However, there are some

actions that can be taken to try to minimize the relia-bility issues associated with IMC formation.• Microstructural Characterization: It is very

important to understand the microstructure of allinterfaces, including the identity and morphologyof any IMC phases. This is best accomplished uti-lizing cross-sectional SEM analysis. Interfacialmicrostructure as a function of processing condi-tions is very valuable for minimizing IMC impact.

• Failure Mechanism Identification: Determininghow and where interfaces fail is critical informa-tion for gauging reliability. For example, singlemode interfacial failure, even at a high inducedstress level, raises concerns because it indicates theinterface is the “weakest link.” Since external

Figure 9: IMC Formed when a SAC Solder Ball is bonded to a Ni plated layer


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stresses usually concentrate at interfaces, this typeof failure mode may impact reliability.

• Slow IMC Formation through Alloying: Dopingof plated nickel with cobalt to slow the formationof nickel-silicide IMC phases is a good example ofthis process. For this example, reliability of the dieattach was greatly improved through thisapproach.

• Minimize Diffusion Effects: To form a thick, con-tinuous IMC layer at an interface in some casesrequires significant solid state diffusion. This ismost often seen in “aging” studies, when a thinIMC layer may grow thicker, and thus more influ-ential, when the material is exposed to long tem-perature cycles. This phenomenon has been stud-ies by Zribi et al. for PbSn solders (see Referenceiv). Diffusion effects in this situation can be min-imized by limiting thermal exposure. PotentialIMC growth should also be considered when determining acceptable thermal budgetspecifications.

• Minimize Concentrations of IMC Constituents:This approach has been used for many years tominimize AuSn IMC formation in the case of PbSnsoldered to a gold plated pad. By minimizing Authickness to the very minimum required for oxi-dation resistance, the extent of AuSn formation ismitigated.

• Solder Selection: Choice of appropriate solders fora specific application is also critical. For example,the use of Cu containing solder on Ni underplatecan lead to ternary Cu-Ni-Sn IMC formation. Useof a Ag-Sn solder would avoid this issue.

References i Binary Alloy Phase Diagrams, Thaddeus Massalski, ed., 2nd

Edition, ASM, 1990ii R.J. Fields and S.R. Low, NIST Metallurgy Division, Research

Publicationiii See, for example, J.H. Harris and E. Rubel, Semiconductor

International, September 2007iv Zribi et al., 1999 ECTC Proceedings, IEEE, 451


http://www.adtechceramics.com

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Society Awards Recognizethe Efforts of Our Members

We all know members of the electronics packagingcommunity whose work contributes greatly to thehealth and vitality of the industry. IMAPS invites itsmembers to nominate deserving people to providethem recognition of their industry contributions.IMAPS recognizes both notable individual membersfor their accomplishments and recognizes one compa-ny; all have made significant technical and supportingcontributions to the microelectronics industry and toIMAPS in particular.

The process of identifying deserving nominees, andsubmitting and reviewing the nominations is very thor-ough. Most awards are reviewed by past recipients,making these awards the recognition of notables bynotables. We encourage all IMAPS members to nomi-nate those notable for consideration of an award byAugust 15, 2008. The awards presentation will be onTuesday, November 4, 2008, preceding theSymposium’s keynote speaker.

The Annual Awards for which we need your nominations:

Daniel C. Hughes, Jr. Memorial AwardJohn A. Wagnon Technical Achievement Award

William D. Ashman AwardFellow of the Society

Corporate Recognition AwardLifetime Achievement Award

Sidney J. Stein International AwardOutstanding Educator Award

Just go online to http://www.imaps.org/awards/nom-inations.asp and follow the directions for nominating adeserving member.

Questions? Contact Steve Greene, MembershipManager at 202-548-8711 or [email protected]

Mike Ehlert, Barry Industries, IMAPS 2008 First Past President


http://www.sikama.com

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Congratulations StudentPaper Competition Winners

The IMAPS Microelectronics Foundation is pleasedto announce the student winners of the NordsonStudent Paper Awards.

The two students winning the competitions receivea cash prize of $1000. IMAPS will also pay for travelexpenses and registration to the respective advancedtechnical workshops. These winning students will alsogain recognition at the workshop and in IMAPS publi-cations.

HiTEC Competition:

• Winner: Mr. PedroQuintero, University of Maryland

• Advisor: Professor F.Patrick McCluskey(McCluskey is also his advisor)

• Paper Title: HighTemperature Die Attachby Transient LiquidPhase Sintering

• Co-Author: Timothy Oberc• Bio:

Pedro Quintero received a BS and MS in Mechanical Engineering from the University ofPuerto Rico. After his graduate degree, he joinedthe electronic industry in 1997 working as aprocess engineer for Intel Corporation. Pedrojoined Hewlett Packard in 2000 where he served as a Member of the Technical Staff for the second-level interconnection process. He started his Ph.D. training in 2005 at the University ofMaryland working for the CALCE research center.He is currently a PhD candidate working on the development of die attach for high tempera-ture environments using transient liquid phasesintering methods.

Advanced Substrates and Next-Generation Semiconductors Competition:• Winner: Mr. Shadi

Dayeh, University ofCalifornia, San Diego

• Advisor: Professor Deli Wang and Professor Edward T. Yu

• Paper Title: Integrationof Vertical andElectrically-Isolated III-VNanowires on Insulatoron Silicon

• Co-Authors: Yi Jing, Peng Chen, Edward T.Yu, Deli Wang, and S. S. Lau

• Bio: Shadi Dayeh joined the PhD program at UCSD.His main research work is on the growth, fabrica-tion, and characterization of III-V semiconductornanowires; particularly InAs nanowires, in whichhe made marked contributions in both areas of itsgrowth and devices. Shadi is also very involved inacademic service at UCSD. He works as a leadteaching assistant consultant for the sciences andengineering departments where he has initiatedand conducted the new ECE TA training program.Shadi was selected in 2007 as the SummerGraduate Teaching Fellow for the ECE departmentin which he has taught ECE103, Fundamentals ofDevices and Materials.

In Memoriam – Bob Waer

We are sad to report that one of our Founding Fathers, Bob Waer, passed away on January 3,2008. Bob was one of the four who first began ISHM, now IMAPS. He was a featured guest atour 40th Annual International Symposium in San Jose. We were all pleased to be able to meethim and to acknowledge his great service to our Society and show him how far we have come

since 1967. We are thankful that he was part of our beginning.



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The Exhibitor Products and Services listed are those IMAPS 2007 Exhibitors who chose to submit this informa-tion. We are grateful for the support of all of our Exhibitors and are pleased to be able to further their exposurewith more detail on what they offer our industry.

Exhibitor Products and Services

ReflowEquipment

Teledyne Microelectronics12964 Panama StreetLos Angeles, CA 90066310-574-2051310-574-2045www.teledynemicro.comsfletcher@[email protected]

Thin Film Industries, Inc.201 Washington RoadBuilding 3, Suite 3-130Princeton, NJ [email protected]

Torrey Hills Technologies LLC10401 Roselle St, Suite 205San Diego, CA 92121858-558-6666858-630-3383www.torreyhillstech.comkkuang@torreyhillstech.com

Williams Advanced Materials2978 Main St.Buffalo, NY 14214-1099716-837-1000716-833-2926www.williams-adv.comlbruce@beminc.com

Semiconductors -Distributors andManufacturers

Accu-Tech1175 Linda Vista DriveSan Marcos, CA 92069760-744-6692760-744-4963www.accutechlaser.comklmktg@[email protected]

Fotofab3758 Belmont Ave.Chicago, IL [email protected]

Micro Printing Systems136 So. 8th AveUnit 10Industry, CA [email protected]

NETZSCH Instruments, Inc.37 North Ave.Burlington, MA 01803704-948-9534704-948-9535www.e-thermal.combob.fidler@[email protected]

Norcom Systems1055 West Germantown PikeNorristown, PA 19403610-631-5043610-631-0934www.norcomsystemsinc.comtfoltz@[email protected]

NX Gen Electronics9771 Clairemont Mesa Blvd.San Diego, CA 92124858-430-1111858-309-6619www.nxgenelect.comssadri@NxGENelectronics.com

Premier Semiconductor Services, Inc.2330 W. University DriveTempe, AZ 85281480-736-1970480-736-1971www.premiers2.comdloaney@premiers2.com

Sonoscan, Inc.2149 E. Pratt BoulevardElk Grove Village, IL 60007-5914847-437-6400847-437-1550www.sonoscan.commbrown@[email protected]

Trebor Instrument Co.39 Balsam DriveHuntington Stat., NY 11746-7724631-293-8127631-423-3332treborinst@[email protected]

Unichem Industries, inc.1100 Calle CordilleraSan Clemente, CA 92673949-361-9999949-361-9998www.unichemind.commiles@[email protected]

ALLVIA657 N. Pastoria Ave.Sunnyvale, CA [email protected]

Anter Corp.1700 Universal RoadPittsburgh, PA 15235-3998412-795-6410412-795-8225www.anter.comgeneral@[email protected]

Cyber Technologies,USA4200 Powderhorn CircleMinnetonka, MN 55345-1615952-401-9700952-474-2211www.cybertechnologies.commichael.riddle@cybertechnologies.com

FRT of America, LLC51 E. Campbell Ave. Ste 100HCampbell, CA 95009-9051860-749-3885860-749-3899www.frtoofamerica.cominfo@frtofamerica.com

GSI Group, Inc.60 Fordham RoadWilmington, MA 01887978-661-4637978-988-8798www.gsig.compchase@[email protected]

Haiku Tech, Inc.1669 NW 79 Ave.Miami, FL 33126305-463-9304305-463-8751www.haikutech.comsales@[email protected]

Hi-Rel Laboratories6116 N. FreyaSpokane, WA [email protected]

Innov-X Systems100 Sylvan Road, Suite 100Woburn, MA [email protected]

Interconnect Systems, Inc.759 Flynn RdCamarillo, CA 93012-8056805-482-2870805-482-8470www.isipkg.commark.gilliam@[email protected]

Screen Printers,Screens and

Stencils


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2008




Laser Tech, Inc.P. O. Box 838St. Croix Falls, WI 54024715-483-1636715-483-5598www.laser-tech-inc.comlwhitman@[email protected]

Laserage Technology Corp.3021 Delany Rd.Waukegan, IL 60087-1826847-856-2207847-856-3207www.laserage.comstevec@[email protected]

Miyachi Unitek - Benchmark Div.1820 Myrtle Ave.Monrovia, CA 91017626-930-8569626-599-7906www.miyachiunitek.comivonet.gomez@[email protected]

American Technical CeramicsOne Norden LaneHuntington Station, NY 11746-2142631-622-4700631-622-4748www.atceramics.comklevine@[email protected]



Mundt & Associates14682 N. 74th Street #150Scottsdale, AZ 85260480-922-9365480-922-9341www.mundtinc.commundtinc@mundtinc.com

Newport Corp.101 Billerica Ave, Bldg 3North Billerica, MA 01862-1256978-667-9449978-667-6109www.newport.comdan.crowley@[email protected]


Reinhardt Microtech AGAeulistrasse 107323 Wangs, Switzerland +41-0-81-720-04-56+41-0-81-720-0450www.reinhardt-microtech.chp.ruoss@reinhardt-microtech.ch

Tecnisco2-2-15 Minami-Shinagawa,Shinagawa-kuTokyo 140-0004, Japan +81-3-3472-6991+81-3-3472-6316www.tecnisco.co.jpt-sekiya@tecnisco.co.jp


Thermal Interface MaterialsSolder Preforms

AIM25 Kenney DriveCranston, RI 02920401-463-5605401-463-0203www.aimsolder.comkcardone@aimsolder.com

Thin Film Foundry Services, LowTemperature Co-Fired Ceramic Products

American Technical CeramicsOne Norden LaneHuntington Station, NY 11746-2142631-622-4700631-622-4748www.atceramics.comklevine@[email protected]

Dryers (inline conveyor)Automation (parts handling)

AMI/Presco3087 US Highway 22P.O. Box 5049North Branch, NJ 08876908-722-7100908-722-5082www.ami-presco.comsales@[email protected]

Semiconductor Test Consumables

Antares Advanced Test Technologies1499 SE Tech Center Place, #140Vancouver, WA [email protected]

Isostatic Laminator Presses

Avure22408 66th Ave SKent, WA 98032253-981-6224253-981-6229www.avure.commike.shelly@[email protected]

Sockets, Test and Burn-In

Azimuth Electronics, Inc.2605 South El Camino RealSan Clemente, CA 92672949-492-6481949-492-0744www.azimuth-electronics.comsales@[email protected]

Passive Components; LTCC

Barry Industries60 Walton StAttleboro, MA 02703508-226-3350508-226-3317www.barryind.commichelle.frietas@[email protected]

Substrates -Shapes


Solder - Pastesand Creams


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Package assembly/joining materials.Preforms and Cover Assemblies

Coining of Amercia LLC280 Midland AvenueSaddle Brook, NJ 07663201-791-4020201-791-1637www.coininginc.comjscelzo@[email protected]

Bonding Wedge tools

Deweyl Tool959 Transport WayPetaluma, CA 94954707-765-5779707-765-0327www.deweyl.comjpalmer@[email protected]

-Specialty Inks & Pastes-Display Electrode Pastes-Solar Front Side Contact Pastes-Next-Generation Printable Inks

-Dispersion Services-Silver Dispersions for Die

Attach/Solder Replacement-Silica Dispersions for Capilla

Five Star Technologies, Inc.21200 Aerospace ParkwayCleveland, OH 44142440-239-7005440-239-7015www.fivestartech.comtfahey@fivestartech.com

Photochemical Machining/ ChemicalEtching


Refiners, assayers and suppliers of pre-cious metals

Gannon & Scott33 Kenney DriveCranston, RI 02920800-556-7296401-463-5971www.gannon-scott.comsales@gannon-scott.com

Precious metal reclaim - precious metalrefining precious metal recycling, gold,silver, platinum, and palladium reclaim

Geib Refining399 Kilvert St.Warwick, RI 02886800-228-4653401-732-2841www.geibrefining.comsales@geibrefining.com

Peel Back Force Testing, Axial andRadial Lead Forming

GPD Global611 Hollingsworth StreetGrand Junction, CO 81502970-245-0408970-245-9674www.gpd-global.comsven@gpd-global.com

Flip chip bonders, ribbon bonders, heavywire bonders, wedge bonders

Hesse & Knipps2305 Paragon DriveSan Jose, CA [email protected]

Mechanical components for machines

IKO International, Inc.20170 Western Ave.Torrance, CA 90501310-609-3988310-609-3916www.ikonet.co.jpyikeuchi@ikonet.co.jp

Engineered solders (solder preforms,solder ribbon, solder wire)

Indium Corp. of America1676 Lincoln Ave.P.O. Box 269Utica, NY 13503315- 831-7541315- [email protected]@indium.com

XRF AnalyzersInnov-X Systems100 Sylvan Road, Suite 100Woburn, MA [email protected]

Cost reduction modules, obsolescencesolutions, footprint conversion adapters,reballing, overmolding


Industrial and Electronic ceramics

Kyocera Industrial Ceramics Corp.24 Prime Park WayNatick, MA 01760508-651-3922508-650-0625www.kyocera.comjulie.alexander@kyocera.com

ESD shipping products/esd packagingconsulting

L. Gordon Packaging22 West Padonia Rd.Suite 304 ATimonium, MD 21093410-308-2202410-308-2207www.lgordonpackaging.comlgordonpkg@verizon.net

SurfaceMount/HybridComponents


Material manufacture

LINTEC Advanced Technologies (USA) Inc.4629 E. Chandler Blvd.Suite 110Phoenix, AZ 85048480-966-0784480-966-5321www.lintec-usa.comyukiyo-le@lintec-usa.com

Substrates & Backgrind Tape

Mitsui Chemicals America, Inc.2099 Gateway Place, Suite 260San Jose, CA 95110408-487-2888408-453-0684www.mitsuichemicals.comj.wishes@mitsuichem.com

Materials, nanomaterials

NanoDynamics901 Furhrmann Blvd.Buffalo, NY 14203716-853-4900716-853-8996www.nanodynamics.comcbabin@nanodynamics.com

High Bandwidth and fine pitch separableinterconnection

Paricon Technologies, Colrp.421 Currant RoadFall River, MA 02720508-676-8988508-676-8111www.paricon-tech.comrweiss@imaps.org

Plating and wet processing systems

Precision Process Equipment Inc.4269 N. Arrow Crest WayBoise, ID 83703602-214-3004509-272-6921www.precisionprocess.comdstewart@precisionprocess.com

Services: Electric Test, Wafer Probe,Counterfeit Test, Programming, Sn/PbConversion, Ball Attach and Reball,Retinning


Thin film substrates for microelectronics,optoelectronics, highest frequency tech-nology & micro system technology

Reinhardt Microtech AGAeulistrasse 107323 Wangs, +41-0-81-720-04-56+41-0-81-720-0450www.reinhardt-microtech.chp.ruoss@reinhardt-microtech.ch

Precious Metal Refining, Precious MetalScrap Recovery, Refining & RecyclingMetals

Reldan Metals, Inc.396-402 Whitehead Ave.South River, NJ 08882800-764-9222732-238-8595www.reldanmetals.comanadler@[email protected]

Wafer processing and sawing services

Semi Dice, Inc.10961 Bloomfield St.P.O. Box 3002Los Alamitos, CA 90720562-594-4631562-594-6475www.semidice.comdminter@[email protected]

Test Equipment -Probes, Probe

Cards andDie SortingEquipment


33


2008


Gold-N-Flo (TM)

Semiconductor Packaging Materials1 Labriola Ct.Armonk, NY 10504914-273-5500914-273-2065www.sempck.compnikac@[email protected]

Wafer Indexers and Flux Coaters

Sikama International118 East Gutierrez StreetSanta Barbara, CA 93101-2314805-962-1000805-962-6100www.sikama.comsw@[email protected]

Services: DBCu, Thin Film, Thick Film,Polish, Lap

Stellar Industries Corp.50 Howe AvenueMillbury, MA [email protected]

Test Equipment - Probes, Probe Cards and Die Sorting Equipment...continued

Advanced Packaging/SMT98 Split Brook Rd.Nashua, NH [email protected]

AMI/Presco3087 US Highway 22P.O. Box 5049North Branch, NJ 08876908-722-7100908-722-5082www.ami-presco.comsales@[email protected]

Anrich Microscreen, Inc.15751 Roxford Street, Suite GSylmar, CA 91342818-362-0423818-364-1533www.anrichmicroscreens.comanrichmi@aol.com

Haiku Tech, Inc.1669 NW 79 Ave.Miami, FL 33126305-463-9304305-463-8751www.haikutech.comsales@[email protected]


Micro Printing Systems136 So. 8th AveUnit 10Industry, CA [email protected]

Micro Screen LLC1106 South High StreetSouth Bend, IN 46601574-232-4358574-234-7496www.microscreen.orgkathyj@[email protected]

Miyachi Unitek - Benchmark Div.1820 Myrtle Ave.Monrovia, CA 91017626-930-8569626-599-7906www.miyachiunitek.comivonet.gomez@[email protected]

Photonics/Spectra2 South StreetPO Box 4949Pittsfield, MA 01201413-499-0514413-442-3180www.Photonics.comphotonics@laurin.com

Riv, Inc.25 Columbia CircleP.O. Box 220Merrimack, NH 03054-4163603-424-0510603-424-3260www.rivinc.comtania@[email protected]

SEFAR Printing Solutions, Inc.120 Mount Holly By-PassPO Box 679Lumberton, NJ 08048609-613-5034609-267-1750www.sefar.usadobie@[email protected]

Sikama International118 East Gutierrez StreetSanta Barbara, CA 93101-2314805-962-1000805-962-6100www.sikama.comsw@[email protected]

SST International9801 Everest StreetDowney, CA 90242562-803-3361562-803-4043www.sstinternational.comdmuhs@[email protected]

Webcom Communications Corp.7355 East Orchard RoadSuite 100Greenwood Vilage, CO [email protected]

Multichip modules, multichip packages,multifunction assemblies; MIL-PRF-38534 Class H and K

Teledyne Microelectronics12964 Panama StreetLos Angeles, CA 90066310-574-2051310-574-2045www.teledynemicro.comsfletcher@[email protected]

Glass wafer microfabrication by milling,sand blasting, and ultrasonic drilling

Tecnisco2-2-15 Minami-Shinagawa,Shinagawa-kuTokyo 140-0004, +81-3-3472-6991+81-3-3472-6316www.tecnisco.co.jpt-sekiya@tecnisco.co.jp

Metalized Substrates, Thin-Film Multi-Level Circuits with Filled Vias, PrecisionResistors and Polyimide Crossovers

Thin Film Industries, Inc.201 Washington RoadBuilding 3, Suite 3-130Princeton, NJ [email protected]

Engineering polymers/thermoplastics/resins for advanced sensor packaging.Design and engineering services fromproduct concept to prototyping and pro-duction

Ticona Engineering Polymers8040 Dixie HighwayFlorence, KY [email protected]

Equipment for via punching and greenceramic cutting


Precious metals recovery and refining,electronics recycling

United Recycling Industries3700 North RungeFranklin Park, IL 60131732-662-4812732-662-4812www.sims-group.comktoncic@us.sims-group.com

Thick and/or ThinFilm Materials -Precious Metalsand Polymers


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M E M B E R S H I P

Welcome New IMAPS Members!March – April 2008

OrganizationalMembers

Majelac Technologies LLCMurata ElectronicsNorth America, Inc

Individual Members

ANGELCheesebro, MattKuriyama, KenjiSaklad, Jerome

ARIZONAChapman, MarkCurtis, AnthonyDimuzio, PeteDubes, NathanKaller, DeborahLippincott, JoeMello, JimSarihan, VijayVij, Sushil

ARIZONA STATE UNIVERSITYBabiker, Mohamed HaithamBhagat, Shekhar KumarElhalawaty, ShereenFallah-Adl, AliSridharan, Arati

AUBURN UNIVERSITYHarris, Daniel

BENELUXFolkerts, Hein OttoSaib, Aimad

BRAZILAnselmo, Talita

CALIFORNIA ORANGEGarcia, VeronicaKim, SungKuhlman, MarkLevinzon, FelixLiang, Shawn

CAPITALArrell, JohnChan, DavidFirth, BudHe, JaneMarvenko, ScottMohammed, JelilaRiedelsheimer, MikeYue, Naili

CAROLINASGustainis, Mary EllenHanser, AndrewNies, CraigRayegan, RambodSimpson, ScottVenkatasubramanian, Rama

CENTRAL TEXASGoncharenko, AlexanderJamison, KeithMangrum, MarcMinson, EliRaines, TimothySchreiber, RobertStanes, BrettWilliams, WadeWisinger, John

CHICAGO/MILWAUKEEBoklach, Vitaliy

CHINAHng, GaryLeung, Lisa

FLORIDAGrummel, BrianIvanov, StanislavSchoenwald, Kipp

FRANCEAlleno, PascalBarbara, FrançoisBasse, ThierryBertrou, PierreBoukari, NabilBoulay, NadiaBoutry, HervBouvier, ThierryChauchat, BertrandConseil, FrançoisCordier, YvonHeusdens, BrunoLe Clech, ThierryLetonnellier, LoicLouage, SophieManceu, SébastienMascaro, PhilippeMayor, Jean-MichelNapolitano, BrunoRibot, HervéRispal, ThierryScannell, MarkTalbotier, JacquesVerjus, FabriceVervier, Daniel

GARDEN STATEEltringham, ThomasEngelberth, JonNash, FranklinReith, LeslieSlusark, WalterZhao, Jian

GEORGIA INSTITUTE OF TECHNOLOGYPapapolymerou, Ioannis

GERMANYHeuck, NicolasKriegel, KaiSpilka, GregorTraintinger, Peter

GREAT LAKESBorgeson, Roger

INDIAAngra, Beenu

INDIANAChang, CarlCulley, DennisMunson, Terry

JAPANInoue, HiroshiKamiya, HirokiKaneko, MasahiroKato, NobuyukiKomiyama, MikioMaebashi, TakanoriMiyakawa, NobuakiNakamura, NatsuoOkubo, TakuyaYamada, YasushiYang, Nianjun

KEYSTONEEnlow, DavidFrantz, EricKwon, SeongtaeLeslie, ScottMin, Cheolhong

KOREACha, JunghagKim, Deuk HanLim, Yongjin

METROPOLITANCali, AnthonyCygan, StanDoscher, CarolHibbert, JasonIrwin, PatriciaMacaluso, SueTilak, Vinayak

NEW ENGLANDCarroll, JonCole, BenDvorkin, AlekseyMacGillivray, ScotMaksimenko, IrinaMannick, CatheunePotanin, AlexanderRichardson, ThomasRobinson, MarySchaefer, SteveSittard, PaulZylinski, Michael

NORDICHolm, ReidarJohannessen, Rolf

NORTH TEXASBoard, TonyEatman, JamesLeuenberger, GregMoore, MarvinSulser, DanTaylor, JamesWerner, John


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2008

NORTHERN CALIFORNIAAvsian, OsherCaruso, JeffGupta, PavanKrastev, EvstatinKriman, MosheLassig, SteveLee, EstherOu, LorentzSamoilov, ArkadiiStoops, MarielWasserbauer, JohnYokozawa, Shuichi

NORTHWESTFormiller, PaulKobayashi, Hideo

REGIONAL CHAPTER - CANADAHeppler, TrevorHubert, MikeLandsberger, LesLozinsky, ClintMayer, MichaelSmith, Kenton

REGIONAL CHAPTER - EUROPECakil, SemihFell, ChrisKeller, RolfKirkac, CagatayO’Donovan, BrianTemolin, Engin Ufuk

REGIONAL CHAPTER - NORTHEASTVajtai, Robert

REGIONAL CHAPTER -NORTHWESTCampbell, StuartKuhr, WernerRitzdorf, Tom

REGIONAL CHAPTER -SOUTH AMERICABellodi, Marcello

REGIONAL CHAPTER -SOUTHEASTKota, PratibhaLin, Hua-TayMoore, BriceMorris, StevenPeters, RandallRitenour, AndrewShah, SwatiTagami, Makoto

REGIONAL CHAPTER -SOUTHWESTBracht, StephenHuque, MohammadLuke, JamesVenkataraman,SrinivasanWilcox, BenjaminYuan, Zhe

ROCKY MOUNTAINBeckman, DaleCrandell, CourtneyKellums, RobertOberg, JudyPreston, ScottSullivan, TimWatts, MarkWay, Richard

SAN DIEGOGladu, JacquesRay, Urmi

TAIWANHis, Chi-ShiungHwang, Sheng-JyeKuang, Jao-Hwa

TEMPLE UNIVERSITYHuang, YaoyaoKosempel, John

TRI-VALLEYBriere, RogerShinn, Jim

UNITED KINGDOMAndrews, ChrisClark, DavidHorler, GregJohnson, ChristopherMillman, WilliamStacey, SimonZizzo, Claudio

UNIVERSITY OFARKANSASChowdhury, Mohammad

UNIVERSITY OFMARYLANDOberc, Timothy

VIKINGBarnes, CindyBurr, DonaldDzarnoski, JohnErich, RobertPost, DevonRomanko, ThomasSvoma, Kelly

IMAPS 2008Providence, Rhode Island

November 2-6

www.imaps2008.org


creo

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A M E R I C A N C H A P T E R N E W S

Angel ChapterThe IMAPS Angel Chapter held its SoCal’08

Technical Symposium and Tabletop Exhibition on June4. This one-day symposium featured complimentaryadmission, lunch, over 25 exhibitors, and 12 presenta-tions. The presentations and exhibits covered the tech-nical areas of military, aerospace, space, commercialmicroelectronics, and electronics packaging.

For more on So Cal 2008 and other Angel Chaptermeetings, please view www.imaps/chapters/angel

Arizona ChapterThe IMAPS Arizona Chapter held a member lunch-

eon, tour, and presentation at the Flexible DisplayCenter at Arizona State University on April 17. Dr.Doug Loy and Dr. Shawn O’Rouke, directors at theCenter, gave an overview of materials and processingchallenges associated with display manufacture on flex-ible substrates to 25 Arizona chapter members. Thehigh level discussion focused on materials and process-ing necessary for the temporary bonding and debond-ing process, the approach to lithography on warpedsubstrates, and the thermal restrictions associated withprocessing on plastic. Following the talk, the Center’sstaff provided a 20-minute tour of their facility andmanufacturing capabilities.

Florida ChapterThe IMAPS Florida Chapter’s June meeting featured

a reception, dinner, and presentation on LTCC byMichael Ehlert, Director of Process Engineering ofBarry Industries Inc. Mr. Ehlert is also the IMAPS FirstPast President. Mr. Ehlert provided a broad overviewof LTCC from conception to the present. He examinedsome of the key drivers for its conception, what makesit unique, and possible future applications. Mr. Ehlertlater reported on the latest status on the current workin developing a comprehensive set of standards for allbranches of the LTCC supply chain including firedproperties, un-fired properties, and processing. Formore information, please view http://www.imaps.org/chapters/florida/index.htm.

Indiana ChapterIMAPS Indiana’s 2008 Vendors Day and Technical Symposium

The IMAPS Indiana Chapter held its 23rd annualVendors Day and Technical Symposium in Indianapolison April 14, 2008. The event featured 53 attendees, 15vendor tables, and 8 technical presentations. Eighteendoor prizes from the chapter, IMAPS, and several par-ticipating vendors were provided.

Presentation topics included computed tomography,embedded dielectric capacitors in LTCC substrates,component reliability, RoHS compliance, and electrical-ly conductive adhesives. Of special interest to atten-dees was Delphi Electronics’ concept vehicle for infor-mation, convenience, and protection. Dr. WilliamChappell of Purdue University won the Best Paperaward for his presentation, “Advancements in TunableFront Ends for Wireless Systems.”

The event marked the conclusion of a successful2007-08 meeting schedule in which Indiana IMAPSwitnessed the past, present and future of manufacturingin the state of Indiana. These past meetings includedtours of Haynes International in Kokomo (nickel andcobalt-based alloys), the Studebaker Museum in SouthBend, DePuy Orthopedics in Warsaw, and WabashNational (semi trailers) in Lafayette. The IMAPSIndiana Chapter will continue to focus on Indiana man-ufacturing during the meetings and tours in 2008-09.

Please see http://www.imaps.org/chapters/indiana/index.htm for more information.

New England ChapterIMAPS New England Chapter Symposium & Expo

The IMAPS New England Chapter held its 35thSymposium and Expo on May 6th with the sporttheme, “Champion Nation.” This show was a great success with over 80 exhibitors and nearly 500attendees.

The technical symposium included session topicson ceramics, cavity plastic packaging, surface mounttechnology, optoelectronics, microwave, and thermalmanagement. The poster sessions included good stu-dent presentations from Worcester PolytechnicInstitute, University of Massachusetts-Lowell, andSUNY-Binghamton.

This successful symposium illustrates the importantrole of New England area businesses and universities inelectronics development and innovations. The IMAPSNew England Chapter provides a vital link to the multiple disciplines that are necessary for these innovations.

Planning is underway for next year’s 36thSymposium and Expo to be held May 5th 2009. Formore information and pictures from this year’s event,please visit www.imapsne.org.

April MeetingFor its April monthly meeting, IMAPS New England

members toured the plant of Stellar Industries. Over 30chapter members gained information on Stellar’s cus-tom lapped and polished electronic grade ceramics andcustom services for metallizations on these ceramics.For more event pictures, tour information and aPowerPoint presentation, see http://www.imapsne.org/lastmeeting.html.

L-R: Eric Brown, John Snook, Derek Richardson, and WendySherwood


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2008

Viking ChapterIntriCon Corporation hosted the IMAPS Viking

Chapter meeting on April 10, 2008. The meeting fea-tured tours of the IntriCon electronic assembly facilityin Arden Hills, MN and the IntriCon micro-miniatureinsert molding facility in Vadnais Heights, MN.

Chris Conger, Vice President of Engineering atIntriCon, presented two case studies at IntriCon. Thefirst was a fast-track program for design and manufac-turing in a clean room environment for a medical appli-cation. The second case study was how IntriConbrought back an offshore medical program to the USAthrough the use of automation and superior quality systems.

Planned events for the Viking Chapter for 2008 can be seen on the chapter web site at http:// www.imaps.org/chapters/viking/index.htm.

A M E R I C A N C H A P T E R N E W S

Viking Chapter meeting at IntriCon Corporation


http://www.lpt-inc.com

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France:Meetings Program:Technical day “Connectique” Paris, October 23

The next 1-day technical meeting of IMAPS Francewill be held, October 23, in the conference rooms of theNovotel, Paris La Défense.

Entitled “Journée Connectique,” it will be dedicatedto the new connection challenges in different fields ofapplication.

Innovative connection devices or traditional con-nectors, specific technologies for microwaves or optics,the connection solutions will have to follow therequirements of the different market sectors.• Miniaturization for customer mobile products.• Increasing high rate for the multimedia telecom-

munications and the data transmission needs relat-ed to the new system architectures.

• Power, environment stresses and electromagneti-cal compatibility for automotive, including thenew hybrid and electrical vehicles.

• High reliability for the military, aerospace andmedical fields.

The assembly solutions, on printed circuit board aswell as on flexible printed circuit, will be included tooin the program.

News from the Chapter:Thanks to our webmaster

Jean-Louis Fouré will not renew his mandate asboard officer and webmaster of IMAPS France.

We want here to congratulate him for his work onthe board and particularly for the design and mainte-nance of the French site as well as for his contributionto the European one.

Many thanks, Jean-Louis and good luck in your newactivities.

IMAPS France web site For the incoming events, the site is progressively

updated by our webmaster with the useful documentsas soon as available: Poster, Call for papers, Exhibitorsfiles, Technical program, Registration files.

The “member only” section is open to our memberswith their membership number as a password. Besidesthe directory of IMAPS France, papers presented atIMAPS events are available on line.Visit us @: www.imapsfrance.org

Links are available for a direct access to other chap-ters in Europe and United States.

More information?IMAPS France, Events, Membership? Ms. Florence Vireton, Bureau IMAPS-France 49 rue Lamartine - 78 035 VERSAILLES cedex Phone: 33 (0) 1 39 67 17 73 Fax: 33 (0) 1 39 02 71 93E-mail: [email protected] Microelectronics contact for France: [email protected]

Germany:Meetings Program:Autumn Conference, October 14-15, Munich

The yearly autumn conference takes place at theTechnical High school, Munich.

More info on www.imaps.de

News from the Chapter:CICMT 2008, Munich, April 21-24

More than 75 papers, 50 posters, 31 exhibitorsattracted 250 delegates to the very well organized eventat Holiday Inn in Munich. The choice of venue was per-fect with very good conditions for exhibitors, with twoadjacent conference rooms and space for good logisticsregarding the serving of lunches and the coffees. To thiscomes a fair price of the hotel rooms and a good loca-tion near the subway with access to the center city orairport.

If anybody had had the impression that ceramicstechnologies were fading away and lost attraction, theconference demonstrated the opposite. Not only forharsh environments and high end products in the auto-motive, space and military sector but also in high vol-ume mobile phone applications, thickfilm or LTCC willor can be the solution. But it is not an easy task to “sell”these technologies to the design engineers who mostoften prefer the “easier” solutions on laminate sub-strates due to the well established design rules and larg-er formats. System cost issues have to be addressed andit would be nice if cost benefits via high(er) reliability,less service, better thermal management could be seenmore clearly, when cost comparisons between tech-nologies are made.

Anyway, the organizers had done what they could tocreate an ideal ambience for the visitors to CICMT withsufficient time in the breaks to network and with thesocial arrangements for getting together.

A few pictures also from the gala dinner in a beercellar illustrate this.

SN


Break


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More information? On IMAPS Germany? Events?Latest CD ROM proceedings? Membership? Pleasecontact:www.imaps.deMartin Oppermann, Point of Contact AM,[email protected]

Hungary:News from the Chapter:ISSE 2008, Spring Seminar, May 7-10

This 31st International Spring Seminar onElectronics Technology attracted 160 delegates and had140 oral and poster presentations.

Again this European event had high focus on bring-ing people together after the technical sessions.

The full arrangement package gave also the dele-gates from the many countries outstanding sightseeingpossibilities with opening reception at the TechnicalUniversity, a dinner during a cruise on the Danube, anexcursion to a castle and an organ concert in Gödöllöwith outdoor dinner at a Czardas restaurant with folk-loristic entertainment and finally a Gala Dinner wherevarious awards were exchanged.

Many thanks to Prof. Zsolt Illyefalvi-Vitéz and histeam for hard work and a very interesting event.

Some pictures illustrate the experience.SN

E U R O P E A N C H A P T E R N E W S


Exhibition

Committee

Beer Barrel

Dinner

Budapest

ISSE Opening

Excursion


Italy:Meetings Program:EMPC2009, Rimini, June 14-17, 2009

The IMAPS Steering Committee has started theimplementation of the EMPC2009 conference withexhibition.

It will take place June 14-17, 2009 at Rimini, abeautiful tourist spot on the Adriatic Sea in the north-east side of the country.

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continued on page 42Folklore


http://www.harropusa.com

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The Call for papers are now available atwww.empc2009.org.

Please check the website and read about Rimini,find the exhibitor details, etc.

Enjoy!

News from the Chapter:More information? For more information on IMAPSItaly and its events, please look at:www.imaps-italy.it or www.italy.imaps.org/

Nordic:Meetings Program:IMAPS Nordic 2008, Hotel Marienlyst, Helsingoer,Denmark, September 14-16

The 2008 event takes place in Denmark. Again thewell suited and popular Hotel Marienlyst, Helsingoer,located at the beach and close to the Kronborg castle,has been chosen. Kronborg is world famous as thehome of prince Hamlet.

The exhibition area is located just outside the con-ference rooms allowing and encouraging maximuminteraction.

The conference will focus on both the latest mostexotic and new topics (SIP, TSV, stacking, thinning,embedding, etc.) as well as on the day-to day chal-lenges, manufacturing and system cost issues.

Please mark the dates in your calendar now. The Program and Exhibitor package is available at

http://www.imapseurope.org/nordic/Past.aspMore info: please mail [email protected]

News from the Chapter:More information? On IMAPS Nordic? Events?

Membership? Please check the IMAPS Nordic home-page at http://www.nordic.imaps.org/

Poland:Meetings Program:IMAPS Poland – September 21-24

The 32nd IMAPS-Poland International Conference,September 21-24, will take place in The Polonia Housein Pułtusk (60km from Warsaw). Chairman of theOrganizing Committee is Małgorzata Jakubowska.For further details, please checkhttp://imaps2008.imio.pw.edu.pl,www.poland.imaps.org/index.asp or contact: Malgorzata Kramkowska,[email protected]

UK:Meetings Program:ESTC 2008, September 1-4, Greenwich

The IEEE ESTC Electronics Systems-IntegrationTechnology Conference (ESTC) is the MajorElectronics packaging, interconnection and integrationconference of Europe held biennially. ESTC alternateswith the IMAPS European Microelectronics PackagingConference and is co-sponsored by both IEEE-CPMTand IMAPS-Europe. This second ESTC to be held dur-ing 1st – 4th September 2008 follows the very success-ful first ESTC held in Dresden in 2006.

ESTC-2008 will be held at Greenwich, the magnifi-cent World Heritage site and major maritime site on thebanks of the River Thames in the great city that isLondon. The Conference and Exhibition will be hostedat the University of Greenwich in the buildings of theformer Royal Naval College – which has a tremendousheritage: Plenary sessions will be in the Great PaintedHall – providing a wonderful ambience for the techni-cal presentations; and when you visit the Exhibitionyou will be standing directly over the former palace ofKing Henry the Eighth, and the Queens House is whereSir Walter Raleigh placed his cloak over a puddle forQueen Elizabeth the First to step onto.

More on: www.estc.biz


E U R O P E A N C H A P T E R N E W S

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CHAPTER NAME REGION NAME MEMBER NAME COMPANY REP E-MAIL WORK PHONE

ANGEL SOUTHWEST Maurice Lowery Northrop Grumman Space Technology [email protected] 310-814-1890

ARIZONA SOUTHWEST Clark K. Fisher Lord Corporation [email protected] 480-294-1139

BENELUX EUROPE Eric O. L. Beyne IMEC [email protected] +3216281261

CALIFORNIA ORANGE SOUTHWEST William Gaines Northrop Grumman ES-SRS [email protected] 626-812-2199

CAPITAL SOUTHEAST Steve Greene IMAPS [email protected] 202-548-8711

CAROLINAS SOUTHEAST Jim W. Lawson Bourns, Inc. [email protected] 919-363-2235

CENTRAL TEXAS SOUTHEAST Andrew Mawer Freescale Semiconductor [email protected] 512-895-7925

CHICAGO/MILWAUKEE NORTH CENTRAL Andrew R. Lytis United Electronics Corp. [email protected] 847-671-6034

CHINA ASIA Dr. Jusheng Ma Tsinghua University [email protected] 886-1-62782126

CZECH/SLOVAK EUROPE Prof. Josef Sikula CNRL, Faculty of Electrical Engineering [email protected] 42-054 114 3328

FLORIDA SOUTHEAST C. Mike Newton Harris Corp., GCSD [email protected] 321-729-3748

FRANCE EUROPE Brigitte Braux EADS Astrium [email protected] 33-1 39 45 25 44

GARDEN STATE NORTHEAST Dr. David Seeger IBM [email protected] 914-945-3838

GERMANY EUROPE Dr. Jens Mueller TU Ilmenau [email protected] 49-3677693381

HUNGARY EUROPE Peter Gordon Budapest University of Technology and Econ. [email protected] 361-4632748

INDIANA NORTH CENTRAL Larry Wallman Hi-Tek Sales [email protected] 317-887-2564

ISRAEL EUROPE Uri Barneah Barkoh Technologies [email protected] 972-54-672508

ITALY EUROPE Roberto May Microtel S.P.A. [email protected] 02-9543901

JAPAN ASIA Itsuo Watanabe Hitachi Chemical Co., Ltd. [email protected] 81-296-25-3286

KEYSTONE NORTHEAST Tom Green TJ Green Associates LLC [email protected] 610-625-2158

KOREA ASIA Dr. Young-Ho Kim Hangyang University [email protected] 02-2220-0405

METROPOLITAN NORTHEAST Steven P. Lehnert Loral Space Systems [email protected] 631-379-8239

NEW ENGLAND NORTHEAST Mark Occhionero CPS Technologies Corporation [email protected] 508-222-0614

NORDIC EUROPE Søren Noerlyng Micronsult [email protected] 45-44651457

NORTH TEXAS SOUTHEAST Don R. Schuyler InterFET [email protected] 972-567-6221

NORTHERN CALIFORNIA NORTHWEST Anwar A. Mohammed Infineon [email protected] 408-776-7254

NORTHWEST NORTHWEST Steve Kirby Kirby & Demarest [email protected] 360-466-1211

POLAND EUROPE Dr. Malgorzata Jakubowska Institute of Electronic Materials Technology [email protected] 48-22-835-30-41

ROCKY MOUNTAIN SOUTHWEST Tim LeClair Displaytech, Inc. [email protected] 303-774-2242

ROMANIA EUROPE Dr. Paul Svasta Politechnica University of Bukarest [email protected] +40214116674

RUSSIA ASIA Sergej N. Valev Mozaik [email protected] 7-0842 579 823

SAN DIEGO SOUTHWEST Carl S. Edwards Space Micro Inc. [email protected] 858-332-0704

SLOVENIA EUROPE Prof. Slavko Amon Electron Devices [email protected] 38-661-176-8352

TAIWAN ASIA Dr. Kuo-Ning Chiang National Tsing Hua University [email protected] +886-3-574-2925

TRI-VALLEY SOUTHWEST Lawrence Driscoll Southern California Technical Sales, Inc. [email protected] 818-704-9087

UNITED KINGDOM EUROPE Andy Longford PandA Europe Limited [email protected] + 014-887-3512

VIKING NORTH CENTRAL Jay Ellingboe Starkey [email protected] 952-947-4740


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IMAPS 2008Providence, Rhode IslandNovember 2-6

IMAPS will be holding the 41st InternationalSymposium on Microelectronics in November inProvidence, RI with technical sessions addressingeverything in packaging “between the chip and the sys-tem.” You will find distinct benefits by attending thisyear’s conference through gains in understanding thenewest technical challenges we all face in electronicproduct enhancement for the global marketplace. Inkeeping with the international nature of this confer-ence and to reflect globalization of the electronicsmarketplace, translated Japanese and Chinese sessionswill again be included in our agenda. This year’s showwill focus on biomedical, telecom, military, consumerelectronics, and for the first time, alternative energyapplications. We will continue to demonstrate theimportance of System Packaging/Applications/Designwith software and firmware applications through aseries of design sessions. Imaging sensors and theircontinued increased packaging requirements will beincluded as last year. ESD protection, packaging forextreme environments, ceramic, polymer and conduc-tive materials, and microwave communications areagain planned for 2008 as these session topics are ofprofound importance as design constraints continue toshrink and more electronics find homes in severeenvironments. The New England area is rich inIMAPS-related companies and technology and we areparticularly excited this year that the symposium is inProvidence, RI. This area is a hot-bed of technologyinvestors and we fully expect a lot of attendance frommany of these new companies. The technical programwill consist of 6 parallel sessions addressing these top-ics during the symposium as well as 16 ProfessionalDevelopment Courses (PDC). We look forward to see-ing new and current members at our technical ses-sions in Providence. Come ready to learn about yourarea of expertise, aid others in learning about yoursubject, and network with past and new business asso-ciates.

Jim Drehle and Kishio Yokouchi are gathering thepresentations for another Japanese translated sessionand Randy Kline and Charles Luo are similarly prepar-ing one Chinese translated session. Both sessions willdelineate the technical advances in the technology intheir countries and offer a great learning experience toall attendees.

Sponsorship is an integral part of such a largeundertaking. To date, we are fortunate that our plat-inum – Natel Engineering, gold – Panasonic FactorySolutions, and silver – Hesse & Knipps sponsors haveall agreed to help us again this year. SEFAR is repeat-ing as the Badge Holder Lanyard sponsor and Umicorehas joined our list at the $10,000 level. Thanks to allof them for their support. There are several otheropportunities to sponsor still available; [email protected]. The exposure provided by IMAPS

makes being a sponsor a very viable advertising tech-nique.

We are working hard to bring 220 exhibitors to theevent and to date 135 booths have been sold. Thisevent will fill up quickly, so if you plan to exhibit youshould contact Ann Bell at headquarters soon. AreaMilitary Contractors include Lockheed Martin, BAE,Northrop Grumman, Harris, Sakorsky, Raytheon,United Technologies, Martin Marietta, Draper Labs,Concord Labs, and Allied Signal. Also headquartersfor Analog Devices, GE, IBM, Honeywell, Raytheon,Xerox, Kodak, L-3, Textron, EMC, Fisher Scientific,Corning, Raytheon, Boston Scientific, and GTE are inthe Providence area. The NE area is rich inMicroelectronics, so don’t miss this opportunity toexhibit at this event.

The 2008 Companion Tour will occur on Tuesday,November 4 and Wednesday, November 5, with visitsto Mystic, CT, and Newport, RI. Newport’s 11 historicmansions and landscapes - seven of which areNational Historic Landmarks - trace America’s archi-tectural and social development from the Colonial erathrough the Gilded Age. Since the 1600s, MysticSeaport has been a center of shipbuilding. As thegreat Age of Sail gave way to steamships and railroads,wooden ships and boats were turned into firewoodand the nation’s seafaring traditions began to disap-pear, three Mystic residents decided to work togetherto keep the past alive. The story of the town’s nauti-cal connection is told at the Mystic Seaport, theworld’s largest maritime museum. Look for moreinformation in the IMAPS 2008 Advance Program.

The annual Foundation Golf Tournament will takeplace on Monday, November 3rd at the Alpine CountryClub in Cranston, Rhode Island. This is a private,family-oriented country club, rich in tradition as it isin natural beauty. Home of one of New England’s mostchallenging course layouts, Alpine Country Club hasplayed host to some of Rhode Island’s most time-hon-ored golf tournaments. Nestled on 205 quiet acres,Alpine Country Club is located in the Rhode Islandcountryside just 5 miles west of historic Providenceand can be viewed at www.alpinecountryclubri.com.Golf chairs Howard Imhof and Gary Hemphill areworking hard to gather sponsors for the event andprices for the players.

Providence has big city amenities and small towncharm, easy to get to and to get around with greatrestaurants, museums and entertainment at your fin-gertips. We look forward to seeing you at our 41st

International Symposium in Providence, Rhode Island.

Larry RexingGeneral ChairIMAPS 2008 Symposium

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About Providence

Providence, one of the first cities in America (1636),is the capital of the smallest state in the union. This his-toric city boasts a fascinating blend of colorful historyand unusual technologies. The great manufacturingmills, many still standing, played a key role in theAmerican Industrial Revolution that was launchedalong the many rivers in this region. You can still see,and even touch, some of the massive factory steamengines that are preserved — and operational — at thefamous New England Wireless and Steam Museumlocated 30 minutes south of the city. Providence ishome to many metal artisans, and has long been thejewelry manufacturing capital of the USA — an art stillpracticed, although on a smaller scale. Education washighly valued from the start, and world-renownedBrown University is just a short walk from theConvention Center. The remarkable 131-year oldRhode Island School of Design is also nearby andincludes an extraordinary museum. But it is Johnson &Wales Culinary School that insures Providence has thebest food in New England.

This ancient historic city, founded by seekers of reli-gious freedom, continues to embrace the newest tech-nologies with passion. Cyber tech, software develop-ment, biotech are important pursuits. Rhode Island isalso a center for high-tech gaming technology andequipment with GTECH’s new headquarters buildingrecently completed in the downtown area. Providenceprobably has more miles of fiberoptic per capita thanany other place in the USA. Today, the area is in themidst of a massive fiber-to-premise rollout that willeventually link the home user to the Internet at a blaz-ing 100Gbit/sec. So come to the Ocean State to enjoythe old, the new and the strange; Providence was alsohome to horror story pioneer - HP Lovecraft.


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IMAPS Global Business CouncilFall Marketing ForumWednesday, November 5 from 5:15 - 6:15 2008 IMAPS International Symposium in Providence, RI

Mr. Richard ChleboskiStrategic MarketingVice PresidentEvergreen Solar, Inc.

“PV Industry and theChallenges of RapidGrowth”

Mr. Chleboski will providean overview of the solar powerindustry. The talk will providea brief overview of the industry’s history, its recentrapid growth and future opportunities. Particular focuswill be on the supply chain challenges for an industrythat has been growing over 50% annually and whatchallenges the industry faces to achieve parity with gridpower.

About Mr. Chleboski:Mr. Chleboski co-founded Evergreen Solar in 1994.

He has served in many leadership positions since then.Previously, he worked at Mobil Solar EnergyCorporation for seven years where he was the StrategicPlanner focusing on developing long-range businessplans working with strategic partners. He also servedas a Process Engineer responsible for the operation ofMobil Solar’s manufacturing line. Mr. Chleboskireceived a B.S. in Electrical Engineering fromMassachusetts Institute of Technology and an M.B.A.from Boston College.

About Evergreen Solar Inc.: Evergreen Solar Inc. is a global innovation leader in

developing, manufacturing and marketing photovoltaicmodules – the engines of solar electric systems. Thecompany is recognized as one of the brightest risingstars in the solar industry. Evergreen produces solarpanels using the company’s proprietary crystalline sili-con technology, known as String Ribbon™. For moreinformation, see www.evergreensolar.com

Ms. Cecilia AguillonDirector, BusinessDevelopment andGovernment RelationsKyocera Solar, Inc.

“Policies andIncentives to Developthe Solar Industry”

Ms. Aguillon will speakabout the roles of governmentand private sectors in encouraging the growth of solarenergy markets in Asia, Europe, and North America.The presentation will describe policy tools used to cre-ate incentive programs that are attracting investment,technology improvements, cost reductions, and howsolar markets are being shaped by those policies.

About Ms. Aguillon:Cecilia Aguillon works with local, state, and federal

governments across the United States, Canada, andMexico on designing and implementing solar energypolicies to create robust and sustainable solar markets.She also works with Solar Energy Industry AssociationChapters in several states to develop sustainable solarmarkets. Cecilia graduated with a Master’s degree inInternational Relations/Pacific Studies from Universityof California, San Diego in 1998.

About Kyocera Solar, Inc.:Kyocera Solar, Inc. serves the widely varying needs

of customers for distributed solar electricity throughtwo major market channels. Industrial customers (suchas original equipment manufacturers, governmentorganizations, utilities, corporate clients and institu-tions) are served directly with fully integrated systempackages. KSI also serves a global network ofAuthorized Distributors and Dealers with components,packaged systems, engineering, technical support, andproject management. The company’s expertise is basedupon designing, manufacturing, and installing the mosttechnologically advanced solar electric power systemsavailable today. For more information, see kyoceraso-lar.com/

GBC Forum Chairs:Howard Imhof, Metalor Technologies USA and Arne

Knudsen, Kyocera America, Inc.

The GBC Marketing Forum is a business session for all IMAPS 2008 attendees. A networking reception will follow.

Alternative Energy: Options, Supply Chains, and Industry Trends

Confirmed Speakers:


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2008 IMAPS StudentSymposium Programs41st International Symposium in Providence, RI

Take advantage of valuable student programs at IMAPS 2008. These programs are designed to providetechnical information, industry insight, and valuable connections.

Student Paper CompetitionStudent authors will deliver presentations throughout the Symposium. Their presentations will be evalu-

ated on technical content, presentation skills, the written manuscript, and audience interaction. Winning stu-dents will receive cash prizes, a certificate, and recognition in Advancing Microelectronics magazine.

Student Booth CompetitionStudents will learn what other academic programs are doing at the student booths. Student booths will be

evaluated by a panel of judges on various criteria. Winning chapter booths will receive cash prizes, certifi-cates, and magazine recognition.

Student Chapter MeetingGain more insight and share your success on increasing membership and producing better programs with

other student chapter leaders. Learn ways to gain more funding.

Student-Industry Panel and ReceptionThe Student-Industry Panel will provide students both career development and industry insight from lead-

ing professionals. Industry leaders and professional engineers will describe and discuss how their education,interests, and career experiences led to successful careers. A reception will immediately follow where studentswill have the opportunity to talk with industry panelists and other leaders.

Plant Tour: Barry IndustriesThis industry tour is designed to provide you with industry insight and technical expertise. Barry

Industries is a vertically integrated, microelectronics manufacturing company. Barry’s product lines are thickfilm resistor products (precision resistors, power terminations, attenuators - up to 1500 watts pulsed power)and LTCC. The tour will include a guided walk through the facility’s areas of design and simulation, themachine shop, CO2 Laser Machining, thick film printing/firing, YAG Laser trim, assembly, and engineer-ing/testing. A valuable group discussion will follow.

Employment Center The Employment Center will offer job seekers valuable complimentary services. Center volunteers will

post job openings, collect and forward resumes for these postings, and help schedule interviews at theemployer’s request.


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Think Outside the Box ...Sign Up for a PDC

For those of you not familiar with the term PDC itstands for Professional Development Course. Typicallya full or ½ day educational seminar taught by an indus-try expert at an IMAPS event and focused on a specifictechnology area. The PDC provides the student anopportunity to learn from an expert in a relaxed class-room setting. We all want to be able to “think outsidethe box”! Attending a PDC is a good first step. Withthe knowledge gained and valuable peer interactionyou may be able to latch onto those one or two reallygood ideas that make a difference in your company. ThePDC experience will change your perspective. InProvidence the courses run on Sunday and Monday ofsymposium week. The PDCs are designed to educateour membership at large and is a primary mission ofIMAPS. This year’s PDC selections include some famil-iar topics covering the basic technology areas alongwith several new course offerings.

A day or two of professional education is a great wayto stay competitive, both from a personal and companyperspective. “Enlightened” is how most students feel

after attending an IMAPS-sponsored PDC. Besides theobvious opportunity to learn and grow, attending aPDC is a great way to network. It’s fun to meet andconnect with others in the industry, often faced withthe same challenges and day-to-day struggles with tech-nology. The PDC experience includes coffee breaks, anice lunch and social hour at the end of the day to min-gle with fellow students and get to know the instructoron a more personal level. All the PDCs include a fullset of comprehensive notes for the student and manyalso include a textbook. Class sizes typically rangefrom eight to thirty students and there is always ampletime for questions. The instructors are seasoned pro-fessionals hand picked from industry and academia.Many companies require ongoing professional educa-tion and the selection offered by IMAPS is a great wayto fulfill this requirement.

Sign up now and I’ll see you at the PDCs in RhodeIsland!

Tom Green2008 PDC Chair

IMAPS 2008Providence, RINovember 2-6

www.imaps2008.org

Visit www.imaps.org for links to all upcoming events including:

� full event descriptions

� abstract submissions

� exhibition information

� event updates


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IMAPS 2008 ExhibitorsAs of 6/10/08

AdTech Ceramics

Advanced Chemical Company

Advanced Cooling Technologies

AI Technology, Inc.

AIM Products

ALLVIA, Inc.

American Beryllia Inc.

American Technical Ceramics

AMI/Presco

Anaren Microwave

AOS Thermal Compounds

Asymtek

ASYS Inc.

Barry Industries, Inc.

Bennington Microtechnology Center

CAD Design Software

Centrotherm Technologies

Chip Supply, Inc.

Coining, Inc.

Compex Corp.

CoorsTek

Co-Planar, Inc.

CPS Technologies

Crane Aerospace & Electronics

Dage Precision Industries, Inc.

Datacon Technology GmbH

Deweyl Tool Company, Inc.

DuPont Electronic Technologies

EFD, Inc.

Emerson & Cuming

Endicott Interconnect Technologies,Inc.

Epoxy Technology, Inc.

ES Components, Inc.

ESL ElectroScience

F&K Delvotec, Inc.

Ferro Corporation

Finetech, Inc.

FRT of America, LLC

Gannon & Scott

Geib Refining Corporation

General Metal Finishing Co., Inc.

GPD Global, Inc.

Graphite Concepts, Inc.

GSI Group Inc.

Haiku Tech, Inc.

Harrop Industries, Inc.

Heraeus Thick Film Division

Heraeus-SMT

Hesse & Knipps

Hi-Rel Laboratories

Indium Corporation

Infinite Graphics, Inc.

Innov-X Systems


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IMAPS 2008 Exhibitors...continued

Interconnect Systems, Inc.

International ManufacturingServices, Inc. (IMS)

J-Tech Distributors USA, Ltd.

Kyocera Industrial Ceramics

Kyzen Corp.

Laser Processing Technology, Inc.

Laser Tech, Inc.

Laserod

LINTEC Corporation

Maxtek Components Corporation

Metachem Resins Corporation(Merico)

Micro Hybrid Dimensions, Inc.

Micropac Industries, Inc.

MicroScreen LLC

Micross Components Corp.

Minco Technology Labs., Inc.

Mini-Systems, Inc.

Mitsui Chemicals America, Inc.

Miyachi Unitek - Benchmark Div.

NAMICS Technologies, Inc.

NanoDynamics

Natel Engineering Co., Inc.

Newport Corporation

NorCom Systems, Inc.

NTK Technologies, Inc.

NuSil Technology

Oneida Research Services, Inc.

Orthodyne Electronics

Pac Tech USA - PackagingTechnologies, Inc.

Palomar Technologies, Inc.

Panasonic Factory Solutions Co. of America

Paricon Technologies Corp.

Looking Ahead...

IMAPS 2008Providence, RINovember 2-6


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Perfection Products, Inc.

Photofabrication Engineering, Inc.

Reactive Nano Technologies (RNT)

Reinhardt Microtech AG

Reldan Metals, Inc.

Remtec, Inc.

Riv, Inc. - Thick Film Screens

Rogers Corporation

SEFAR Printing Solutions, Inc.

Semiconductor Equipment Corp.

Semiconductor Packaging Materials(SPM)

Sikama International, Inc.

Silicon Cert, Ltd.

Sims Recycling Solutions

Sonoscan, Inc.

SST International

Stellar Industries Corp.

Stellar Microelectronics Inc.

Taconic

TDK Corporation of America

Technic, Inc.

Technical Materials, Inc.

Teledyne Microelectronics

Ticona Engineering Polymers

Toray Engineering Co., Ltd.

Torrey Hills Technologies LLC

Trebor Instrument Corp.

Umicore EM - EPM

VIOX Corporation

Vishay Electro Films

Weiss-Aug Co. Inc.

West-Bond, Inc.

Williams Advanced Materials

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SMU will not discriminate on the basis of race, color, religion, national origin, sex, age, disability, or veteran status. SMU’s commitment to equal opportunity includes nondiscrimination on the basis of sexual orientation.

For more, visit engr.smu.edu/packaging or phone 214-768-2002.

Get an M.S. in Packaging of Electronics and Optical Devices from SMU

IMAPS 2008 Exhibitors...continued


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IMAPS’ Ad Hotline is provided as a courtesy to our advertisers and readers. Although every attempt is made to ensure accuracy, theinformation contained herein cannot be guaranteed.

ADVERTISER CONTACT TELEPHONE EMAIL WEBSITE PAGE

AdTech Ceramics Brian Bukovitz 423-755-5510 [email protected] www.adtechceramics.com 27

Compex Darryl Moody 856-335-2277 [email protected] www.compexcorp.com 15

Harrop Industries Paul Timmel 614-231-3621 [email protected] www.harropusa.com 41

Heraeus Yin Yin 610-825-6050 [email protected] www.heraeus.com 11

Laser Processing Technology, Inc. Connie L. Callow 503-254-2761 [email protected] www.laserprocessingtech.com 37

Sikama International, Inc. Phil Skeen 805-962-1000 [email protected] www.sikama.com 28

Southern Methodist University Teresa Harvey 214-768-2002 [email protected] www.engr.smu.edu/imaps 55

Ticona Engineering Polymers Steve Cushard 859-372-3164 [email protected] www.ticona.com back cover

A D V E R T I S E R H O T L I N E

WHO TO CALL

Michael O’Donoghue, Executive Director, (202) 548-8707, [email protected], Strategic Planning, Contracts andNegotiations, Legal Issues, Policy Development, Intersociety Liaisons, Customer Satisfaction

Brian Schieman, Director, Program Development and Technology, (202) 548-8715, [email protected], Development of Society Programs, Website Development, Database Management, Communication Tools and otherTechnology

Ann Bell, Manager, Marketing & Communications, (202) 548-8717, [email protected], Public Relations, Marketing,Fundraising, Advertising, Exhibits, Advancing Microelectronics

Steve Greene, Membership Manager, (202) 548-8711, [email protected], Member Relations and Services Administration,Dues Processing, Membership Invoicing, Foundation Contributions, Data Entry, Mail Processing, Address Changes, TelephoneSupport

Rick Mohn, Operations Manager, (202) 548-8703, [email protected], Financial Management, Accounts Payable, Accounts Receivable, Human Resources, Employee Benefits, Budget Issues, Business Services, FacilitiesManagement, Publications Sales

Jackki Morris-Joyner, Technical Program Manager, (305) 382-8433, [email protected], Technical Program Developmentand Coordination, ATWs, PDCs, Calls for Papers, Speaker Communications, Proceedings Publication, Event Program Activities

Elizabeth Keller, Meetings Coordinator, (202) 548-8716, [email protected]

I M A P S H E A D Q U A R T E R S

...contactIMAPSHeadquarters See staff listing for specific program areas.

Advancing Microelectronics 2008 Editorial ScheduleIssue Theme Copy Deadline Ad Commitment I/Os DeadlineSep/Oct 2008 IMAPS 2008 Show Issue July 15, 2008 July 20, 2008

Nov/Dec 2008 Portable and Consumer Sept. 15, 2008 Sept. 20, 2008


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7-14-08 7-14-08 IMAPS/SEMI ATW on Wire BondingSan Francisco, CA [email protected]/wirebonding

7-28-08 7-31-08 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT - HDP)Shanghai, China [email protected]/newweb/cpage.asp

8-12-08 8-14-08 ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative EnergyAlbuquerque, NM USA [email protected]/energy

9-15-08 9-16-08 IMAPS Nordic 2008Helsingoer, Denmark [email protected]/past.asp

9-16-08 9-18-08 ATW on RF and Microwave PackagingSan Diego, CA [email protected] www.imaps.org/rf

9-22-08 9-23-08 XXXII International Microelectronics and Packaging IMAPS-CPMT Poland ConferencePultusk, Poland [email protected]

10-14-08 10-16-08 Advanced Technology Workshop on Thermal ManagementPalo Alto, California - USA [email protected]/thermal

10-15-08 10-17-08 7th International Symposium on Microelectronics and Packaging (ISMP 2008)Seoul, Korea [email protected]

11-2-08 11-6-08 IMAPS 2008 - ProvidenceProvidence, RI IMAPS International Symposium [email protected]

12-15-08 12-18-08 Emerging Microelectronics and Interconnection Technology (EMIT 2008)Bangalore, India [email protected]/callfor/emit2008.pdf

2-25-09 2-27-09 ATW and Tabletop Exhibit on Printed Devices and ApplicationsOrlando, FL [email protected]/printed

2008

NOVEMBER

SEPTEMBER

DECEMBER

JULY

AUGUST

2009

OCTOBER

FEBRUARY



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