The Introduction of High Thermal Conductivity CEM-3-09 HT...
Transcript of The Introduction of High Thermal Conductivity CEM-3-09 HT...
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Nanya Copper Clad Laminate
The Introduction of High Thermal Conductivity CEM-3-09 HT and CEM-3-01 HC (Halogen free)
NAN YA PLASTICS CORP.
ELECTRONIC MATERIALS DIV. COPPER CLAD LAMINATES DEPT.
TAIWAN, R.O.C.
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Nanya Copper Clad Laminate Content 1.Development concept 2.The Comparison of Performance for CEM-3-09 and CEM-3-01 HC 3. The Comparison of Surface Temperature Simulation 4.Application of CEM-3-09 and CEM-3-01 HC 5.Conclusion
CEM-3-09 / CEM-3-01 HC Structure
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1.Development purpose
*High-Thermal Conductive ( For ASTM E-1461 ) : 2.0W/m.K ( For ASTM D-5470 ) : 1.0W/m.K
*Comparative tracking index (CTI) : More than CTI 600V
*Coefficient of thermal expansion of X and Y : under 20 ppm
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2.Performance Summary
Items UNIT CEM-3-09 CEM-3-01 HC CEM-3-98 A社
Thermal Conductivity W/mK 2.0 2.0 0.94 2.0
Resistivity MΩ 3.0*10^8 2.8*10^8 5.0*10^8 2.8*10^8
Tg (DSC) ℃ 130-140 110-120 125-135 125-135
CTE
X-axis
ppm/℃
16 16 24 21
Y-axis 18 18 28 23
Z-axis 22/215 22/215 65/350 30/230
Solder resistance
(PCT*240min+260℃) sec 300 ↑ 300 ↑ 300 ↑ 180-220
Permittivity (1 MHz) -- 5.1 5.1 4.50 5.1
Loss Tangent (1 MHz) -- 0.018 0.018 0.020 0.018
Comparative tracking
index V 600≦ 600 ≦ 600 ≦ 600 ≦
Punchability -- ☆ ☆ ☆ △ Flammability UL94V0 UL94 VO UL94VO UL94V0 UL94V0
☆ : Suitable △ : Acceptable X : Not Suitable Note. The process of TMA measurement (CTE) show as Appendix.2
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A. Thermal properties
Characteristice Unit Conditioning SPEC CEM-3-09 CEM-3-01 HC
Thermal conductivity W/m.K ASTM
E-1461 2.0 2.0 2.0
A-288℃ Dipping -- 30-60” 30-60”
A-260℃ Dipping 20”↑ 300”↑ 300”↑
Solder heat resistance
sec PCT*4hr+ 260℃ Dipping -- 300”↑ 300”↑
DSC N/A 134-140 110-120 Glass transition temp ℃
TMA E-2/105
N/A 130 110
X α1= 17 16
Y α1= 18 18 CTE
Z
μm/m℃ E-2/105 N/A
α1/α2= 30/210 30/212
Note1.The average value in the table refers to samles of .062” 1/1 ,Test method per IPC-TM-650 2.Thermal conductivity test by Laser Flash LFA-447 Modify ASTM E-1461 as appendix1. 3.CEM-3-09 and CEM-3-01 HC will possibility increase the reliability of improvement in through-hole ,because lower thermal expansion will decrease the crack generated by thermal stress
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B: Electrical properties
Characteristice Unit Condition
ing SPEC CEM-3-09 CEM-3-01 HC
Volume resistivity MΩ-cm C-96/35/90 10^6↑ 3.2*10^9 2.0*10^9
Surface resistivity MΩ C-96/35/90 10^4↑ 3.0*10^8 2.8*10^8
Permittivity (1MHZ) - C-24/23 5.4↓ 5.1 5.1
Dissipation factor(1MHZ) - D-24/23 0.035↓ 0.018 0.018
Dielectric breakdown KV D-48-50 40↑ 59 58
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C. Physical & Mechanical properties
Characteristice Unit Conditioning SPEC CEM-3-09 CEM-3-01 HC
Moisture absorption % E-1/105 +
D-24/23 0.30↓ 0.10-0.13 0.10-0.13
Flammability - C-24/23/50 + E24/125 94V0 94V0 94V0
Peel strength (1oz) lb/in 288℃*10” solder float 7↑ 9-11 9-11
Bow&Twist(avg) % (150℃*15’+cooling*5’) *4cycle 1%↓ 0.2-0.40 0.2-0.40
LW A 242↑ 350 360 Flexural strength
CW N/mm2
A 172↑ 250 265
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D. Punchability and CTI
Characteristice Unit Conditioning SPEC CEM-3-09 CEM-3-01 HC
MD 1150 1250 Punchability
CD Kg/cm2
Shear strength
ASTM D-732 N/A
1050 1160
Comparative tracking index voltage ASTM D-3638 N/A 600↑ 600↑
Note1.CEM-3-09 Punch condition and quality is similar to conventional CEM-3(as CEM-3-98). 2.CEM-3-09 Punchability is better than R-1787 3. CTI test instrument as appendix1
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Nanya Copper Clad Laminate E. Lead-Free Soldering
Note. CEM-3-09/CEM-3-01 HC all can pass through more than 10 times with above IR-Reflow condition
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Name Size V mcd nm
Blue Power Chip(4P3N) 1mm*1mm 4.50 1138.5 461.65
Experimental samples : LED chip
Sample Size: 5cm * 5cm, width 3mm (space 2mm), edge with silver glue fixed on the copper line
5cm
5cm
4P3N + - + -
Zoom in Zoom in
3.The Comparison of Surface Temperature Simulation
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82.43℃ 96.82℃
Conventional CEM-3 vs. Thermally Conductive CEM-3-09/CEM-3-01 HC(1.6mm)
The Comparison of Surface Temperature Simulation
LED Surface Equilibrium temperature effect Temperature Difference
14.4 ℃
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Appendix1.Installations
Sample
60℃ 60℃
d 1.5 mm
4 ± 0.2 mm
40 mm Platinum electrode
Ammonium Chloride ASTM 385 ± 5 Ω/cm
Thermal Conductivity Laser Flash LFA-447 (ASTM)
Comparative Tracking Index (IEC)
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Appendix.2 Process of TMA measurement
TMA INSTRUMENT 1.Put sample on plate,probe touch sample.
2.Measure CTE before Tg & after Tg/delamination time.
sample
Probe