The Heatsink Guide - Peltier Cooler Information

7/30/2019 The Heatsink Guide - Peltier Cooler Information

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Heatsink Guide - Peltier cooler information

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THE HEATSINK GUIDE: Pelt ier Guide, Part 1

History and introduction

In 1821, J. T. Seebeck (1770-1831) discovered that d issimil ar met als that are connected at t wo dif ferent locations( junc t ions) w i l l develop a mic ro-vol tage i f the tw o j unct ions are he ld a t d i f fe ren t tempera tures. Th is e f fec t is knowas the "Seebeck effect"; i t is the basis for t hermocouple thermom eters.

In 1834, a scientist cal led Pelt i er d iscovered t he inverse of t he Seebeck effect, now known as the "Pelt ier ef fect ": Hfound that i f you take a thermocouple and apply a voltage, th is causes a temperature dif ference between thej un ct ion s. Th is r esu l t s i n a smal l heat pump, l ater ref erred t o as also known as a ther mo-electr ic cooler (TEC) .

Practical TECs use several t hermocouples in series, which al lows a substant ia l amount of heat tr ansfer. Acombination of the semiconductors Bismuth and Tel lur ideis most commonly used for t he therm ocouples; t hesemiconductors are heavily doped, w hich means that addit ional impurit ies are added to either create an excess (N-type semiconductor), or a l ack (P-type semiconductor) of f ree elect rons. The t hermocouples in TECs are made of ofN-t ype and P-type semiconductor pieces bonded t ogether.

Since pelt ier e lements are active heat pumps, t hey can be used to cool components below ambient t emperature -which is not possible using conventional cooling, or even heat pi pes.

What is a pelti er cooler ?

A pelt ier cooler i s a cooler t hat uses a pelt ier e lement (TEC). Pelt ier coolers consist of the pelt ier e lem ent i t self ,and a powerful heatsink/ fan combination t o cool the TEC.

Peltier basics

The typ ical max imum tempera ture d i f f e rence be tw een the ho t side and t he co ld side o f a TEC, re fe r red to as del taTmax, is around 70C.

Does this mean that simply adding a pelt ier e lement betw een heatsink and heat source wil l cause the t emperatureof t he cooled device to drop by 70C? No, t ha t wou ld be too good to be t rue . Two impor tan t fac to rs must beconsidered:

The specif ied maximum value of delt a T only occurs when the pelt ier e lem ent does not t ransport any heat -

s ituation that does not occur in real- l i fe cooling solut ions. The actual delta T is a l inear function of the powetransferred through the thermal element, with negative slope. An example of such a function, for onepart icular TEC, is i l lustr ated i n the f o l lowing graph, which is a str ipped-down version of t he graph found inpar t 2 o f the Pe l t ie r Gu ide.

Look ing a t t he graph, you can see tha t , fo r example, i f the pe l t ie r e lement wi l l have a de l ta T o f 55C i f i thas to move 10W of power ( in the f orm of heat) You wi l l a lso see that a t one po in t - a t 40 Watt s in the cas

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2/10

Heatsink Guide - Peltier cooler information

Imagine t hat you are cooling a CPU wi th a power usage of 35W, using a conventional heatsink. Wil l thetem perature drop if you add our example pelt i er e lement betw een CPU and heatsink? No. For a s implereason: In addit ion to t ransport ingheat, pelt ier e lements also emi t considerable amounts of heat (and thususe considerable amounts of e lectr i c ity). So, the heat sink wil l have to dissipate substant ia l ly more heat thanbefore , and wi l l get much hot te r . We wi l l get in to more de ta i l about th is issue in Par t 3 o f the Pe l t ie r Guidewhere we analyze under w hich circumstances a pelt ier e lement is useful, and under which condit ions you arbe t te r o f f wi t h j ust a convent iona l heats ink.

Pelt ier e lements have very low eff ic iency. They wil l consume morepower t han they t ranspor t ! Actua l pe l t iee lements may consume tw ice as much energy ( in the fo rm o f e lec t r ic i ty ) as t hey t ranspor t ( in the fo rm o fheat). So, i f you are using a pelt ier e lement, the heatsink i t is used with must be much more powerful than aheatsink used for cooling a heat source wit hout pelt ier e l ement.

Do not confuse t he maximum amount o f power a pe l t ie r e lement can t ransport wi th the maximum amount opower usageof t he pe l t ie r e lement . Some re t a i le rs se l l "80W pel t ie r e lement" , wi t hout sta t ing what th is va lactually m eans. This is misleading - what you want is a high t ranspor t capab i l i ty , bu t a l ow powerconsumption.

To help you decide what k ind of pelt ier e l ement you need for an overclocked CPU, you can f ind instructionsfor esti mati ng power usage of overclocked CPUs here on The Heatsink Guide.

A quick look at typical peltier elements

Typical 40x40mm Pelt ier element

This is a "padded" TEC

Pelt i er e l ements come in various forms and shapes. Typical ly, they consist of a l arger amount (e.g. 127) ofthermocouples arranged in rectangular form, and packaged between two thin ceramic plates. Mult i-stage modules,to reach higher delt a T values, are also available, but less common.

The commercial TEC unit of i nterest f or PC geeks is a single stage device, about 4 - 6 mm thick and somewhere from15 to 40 mm on a side.

The TEC wi l l have tw o wires coming ou t o f i t , i f a vo l tage is app l ied to those wir es, then a t emperature d i f fe renceacross the tw o sides is achieved, i f the polarity is reversed on t he wir es - then t he tem perature dif ference is alsoreversed. The TEC is placed in betw een the CPU/ GPU and the heatsink wit h appropriate t hermal int erface mat eria l( therm al grease). So one thing we mi ght note is that i f t he voltage is applied in t he wrong directi on then t he TECwil l cool your heatsink and heat your CPU!

Pelt ier e lements come in paddedand non-paddedversions. On non-padded pelt iers, the therm ocouples are vis ib lefrom the side. On padded pelt ier e lements, you can only see the padding materia l (often si l icon) from the side.

Problems related to peltier cooling

As menti oned above, high power usage and high power dissipation are the bi ggest problems related to pelt iercooling. In the days of f irst-generation Pentium CPUs, r eadymade pelt ier/ heatsink combinations were widelyavailable, which could be instal led and used just l i ke a regular heatsink.

For t oday's CPUs having a power dissipation of over 100W, build ing a Pelt ier CPU cooler using j ust a pelt ier e lementand a heatsink is quit e a challenge, and ready-made pelt i er coolers are scarce and expensive. With such coolers,over 200W of heat may be dissipated inside t he case. For modern CPUs, i t i s bett er t o combine pelt ier e lements wiwat ercooling. In any case, t he result ing cooling system wil l be expensive t o run, due to i t s h igh power usage, andnot very eco-fr iendly. The large power di ssipation w il l require powerf ul (and thus loud) fans.

A lso , keep in mind tha t i f the coo l ing of t he pe l t ie r e lement fa i ls (e.g . fan fa i lu re o r pump fa i lu re in case o fwat ercooling), the results wil l be more disasterous that i f a conventional cooling system fai ls. Even if your CPU hasthermal p ro tec t ion tha t wi l l cause i t t o shut down i f t he tempera ture ge ts too h igh, t he pe l t ie r e lement may s t i l l ki t by cont inue ing to heat i t up long af t e r i t has shut i t se l f down.

Another p rob lem re la ted to pe l t ie r coo l ing is condensation. Since it is possible t o cool components below ambienttemperature using pelt ier e lements, condensation may occur, which is something you' l l defin ite ly want to avoid -wat er and electronics don't m ix w ell . The exact t emperature at w hich condensation occurs depends on ambienttempera ture and on a i r humid i ty ; we wi l l look a t th is in more deta i l in par t 3 o f the Pel t ie r Guide .

Advantage of peltier elements

After having focused on problems related t o Pelt ier cooling let 's not forget about their biggest advantage: They
http://www.heatsink-guide.com/maxtemp.shtml#powerhttp://www.heatsink-guide.com/maxtemp.shtml#powerhttp://www.heatsink-guide.com/maxtemp.shtml#powerhttp://www.heatsink-guide.com/maxtemp.shtml#power


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Heatsink Guide - All about PC cooling

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THE HEATSINK GUIDE: Pelt ier Guide, part 2

Getting into the details

The second part of t he Pelt ier Guide deals specif ical ly w it h siz ing pelt iers and heatsinks, t o f i t a given application.Hopefu l ly i t w i l l a lso show some o f t he prob lems in more de ta i l , and he lp you j udge about mer i ts and t radeof fs whusing peltiers.

The fac t t ha t you are st i l l reading, and weren 't scared o f f by the f i rs t par t , shows tha t you have a keen in te rest inpe l t ie r cool ing . I f you are more in te rested in general in fo rmat ion about Pe l t ie r e lements, o r in in -depth in fo rmat ioabout t he t heory behind them, you should defin it e ly have a look at Melcor 's excellent Thermoelectr ic EngineeringHandbook.

This art ic le here mainly focuses on how t o apply pelt ier cooling to PC processors or graphics chips; i t is not asgeneral as the information you can f ind on the websites of Pelt ier manufacturers.

First, a word of warning: Read the disclaimer before proceeding. I f you damage something while fo l lowing theinstr uctions here, I cannot be held responsible. Do not supply power t o a peltier element without a heatsink, a f ta wh i le i t w i l l overheat and t he connectors wi l l me l t .

In the last part of t he guide, you wil l f ind an Excel spreadsheet w it h VBA code that wil l help you wit h the necessarcalculat ions for designing a pelt ier -based cooling system for your PC, but I ask you t o please read t he art ic le f ir stbefore you download t he spreadsheet.

Peltier Performance

One thing we m ust consider is that a therm ocouple wi l l a lways ba therm ocouple - and thus when you apply a voltage and get atem perature dif ference - you wi l l a lso cause a back voltagecreated by t he Seebeck effect. This is very simil ar t o t he backEMF created with in an electr ic motor - and thus much l ike motorTECs show a negati ve l inear load dependent output curve. Theother th ing t hat happens when a volt age is applied across the TEunit is that current f lows thr ough t he TEC. This causes inter nal

heating through I2R losses. This is a very imp ort ant fact becauseth is imposes a lot more heat on t he heats ink to coo l - w e wi l l ge

to t hat l a te r .

A performance curve from Tellurex is shown here a t t he le f t .This, by the w ay, is the same curve t hat Joe over atoverclockers.com shows in one of h is art ic l es.

The curve shows heat pumped versus temperat ure dif ferenceachieved across the pelt ier f or 3 dif ferent current input s. I f i ndth is p lo t no t par t icu lar ly easy t o read. The main prob lem I havethat the inf ormati on is presented at constant current, whereas freaks are l ikely t o have a constant voltage source available. Th

other t h ing that i s not shown is the pow er generation from the TEC it self - you can however glean t his informati onfrom the voltage and current. I have rearranged the same information into another chart I f ind more usable.
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/C|/Temp/The%20Heatsink%20Guide%20-%20All%20about%20PC%20cooling2.htm[22/11/2012 5:31:24 p.m.]

This chart shows the same TEC as above - but only at 12 volts. The left -hand vert i cal axis is for bot h t emperaturedifference (C) and also for total power to heatsink (watts). The r ight-hand vert ical axis is for current(amps). Thefir st t h ing you'l l notice i s that the independent axis is power tr ansferr ed (CPU power). The next th i ng you mightno t ice about th is fo rmat is tha t you can immedia te ly see t he amount o f power t ransfer red t o t he heatsink as afunc t ion o f the amount o f power t ransmit t ed by t he TEC. For example a t 15 wat ts o f heat t ransfer across the pe l t ie

e lement another a lmost 30 wat ts o f heat is added by I2R losses to make nearly 45 wat ts t ransferr ed to the heat sinkThis i l lustrat es that TEC applications add a lot of "overhead" heat t o t he t otal system , as i t w as already pointed outin the f i rst par t o f th is guide .

Go to part 3 of t he Pelti er Guide(or return to part 1)

Note: This art i c le w as orig inal ly writ ten by "Bo", a v is itor of The Heatsink Guide, w ho wishes to remain anonymous,and only s l ightl y modif i ed by me. Thank you Bo for sharing th is art ic le wit h us!

All pages copyright 1997-2010 Til lm ann SteinbrecherLegal informat ion / Disclaimer / Impressum
http://www.heatsink-guide.com/peltierinfo-3.shtmlhttp://www.heatsink-guide.com/peltierinfo.shtmlhttp://www.heatsink-guide.com/peltierinfo.shtmlhttp://www.heatsink-guide.com/legal.shtmlhttp://adclick.g.doubleclick.net/aclk?sa=l&ai=C2HSXXfGtUIPKMObDigfPwoCYDYCgnfsEmOvU1lmQ7c3ChgEQASAAUIDH4cQEYL8FggEXY2EtcHViLTQ2MzgzMDU3NjAwMDE1ODagAdiNu9YDyAEJqAMBqgSQAU_QFrAiwYdva4mpyg86cdgC3m6q2ppXPfCOpM512DEKL-I_akCnpaMZcDACZbLLJruni-01iuasjYuz4bnV5pTRyJojmYxIbBdYpcZ-xI8n1YMIVV2pHcdmJv8HBgq0Sr_72lEeKKH_DtOqWWoUP-KmvLPnSWU6-ddG9UYKHVSoBkY8YvOSOq1mlQm2_t1NkoAG1_Ocr5b54prhAQ&num=1&sig=AOD64_0vQdjzkRE2x0CXHCdhgDyCkI-Vcw&client=ca-pub-4638305760001586&adurl=http%3A%2F%2Ftrk.atomex.net%2Fcgi-bin%2Ftracker.fcgi%2Fclk%3Fs%3D1%26urid%3D06e0d5319a7d7c7924a2aaffab4538c94e2d6ccf7354de8641334%26cr%3D29282%26al%3D14063%26a%3D4964%26sid%3D1%26bp%3DUK3xXQAMJQMK4qHm0wAhT6Cmn2u2I2u2JC4xog%26aio%3D9435%26ag%3D1%26pid%3D1%26rt%3D1353576797%26as%3D107%26l%3D0%26aelp%3D-1%26cs%3D1081753722%26fp%3D3%26us%3D0%26cc%3D0%26ivs%3D2745%26li%3D1%26pet%3D1%26m%3D1%26pu%3D1000000%26co%3D197%26re%3D0%26ci%3D0%26me%3D0%26tz%3D480%26dma%3D0%26atm_cvf%3D2%26url%3Dhttp%253A%252F%252Fwww.yourvoucher-singapore.com%252Fcgi-bin%252Fwingame.pl%253Fpartner_pk%253D293%2526wingame_pk%253D46%2526sub_id%253Dhttp://www.heatsink-guide.com/legal.shtmlhttp://www.heatsink-guide.com/peltierinfo.shtmlhttp://www.heatsink-guide.com/peltierinfo-3.shtml


5/10


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Variables that affect TEC performance

Another t h ing tha t i s impor tan t to rea l ize is tha t TECs are a f fec ted by vo l tage and t emperature . I re fe r to the Melcsit e as a place t o read up on how t o calculate TEC perform ance based upon voltage, absolute tem perature of theTEC, the number of thermocouples in the TEC, and something described as the geometr ic factor. I won' t bother torewrite al l of those relat ionships - here is the l ink i f you are interested.

You might be saying to yourself, "Dude - the m anufacturer gives you that inform ation - w hy bother?". Well, the f acis that TEC performance is very sensit ive to t emperatur ; the curve you ge t f rom the manufac turer might be fo rconstan t ho t s ide temp o f 50C - your ho t s ide tempera ture might be a lo t d i f f e ren t , your vo l tage might be d i f fe renand QMax and DTMax are al l t ied up in t ha t . The plo t shown to the r igh t i s fo r a TEC wi th QMax = 72 watts @ 20C

hotside. I t shows the solved coldside tempera ture d i f fe renceversus ambient using a 33 wattload (CPU heat), and a heatsinkresistance of RHeatsink o f 0 .5 C/ W

(see t he heatsink information

sectionfor detai ls about heatsinkperform ance measurement s).

The only variable i s ambienttem perature (ranging from 20Cto 60C). This shows that yourTEC works bett er when it isho t te r , bu t moreover the to ta lsystem performance changes by8C re la t ive to ambient over the40C span! The t emperature isimpor tan t because i t a f fec ts theSeebeck coefficient elect ricalresist ivit yof the thermocouples aswel l as the t herm al conduct ivi t yof the substrate.

The voltage obviously i s import antbecause it affects the enforcedtempera ture d i f fe rence.

Two parameters we haven 't looked a t un t i l now is the max imum a l lowed e lec t r ica l cur ren t Ima x through the device

(exceeding the current wil l damage the TEC), and the geometry factor G.

The number o f thermocoup les and t he geometry fac tor he lp to descr ibe t he size o f t he dev ice - m ore thermocoup lmeans more pa thways to pump heat - t he geometry fac tor is no t exp lained by Melcor . They o f fe r the fac tor (G) f otheir devices - but t hat doesn' t help when tr y ing to calculate perform ance for another manufacturer 's TEC. One thinI d id observe about G is that i t is re lated t o t he densit y of t hermocouples per square area and it is a lso related tothe th ickness of t he TEC. Aft er looking at the Melcor data I f inal ly d i scovered that G = Ima x/ 50 . It is a pe r f ec t mat c

for every Melcor TEC. When I went to make t he above plot f or t he Tellurex TEC (using the Melcor relat ions), I hadto p lay wi th G a l i t t le to get t he r ight curve - 3 .9/ 50 = 0 .078 , bu t I found t ha t G = 0.084 was about r ight to matchthe Te l lu rex char t .

This "empir ical" determ ination of t he geometry factor G is c learly a a hack - but i t is al l I have - i f anyone knows thcalculat ion of G more specif ical ly p l ease email me.

Melcor has a downloadable program called Aztec tha t can hand le a l l t h is fo r you au tomat ica l ly , bu t I d idn 't l ike t hechoices of i ndependent versus dependent variables they used. As it t urns out I am t ry ing to calculate hot s ide tempand cold side t emp - not continually guess at w hat t hey might be - but hey - Aztec works and it 's free. The otherobvious problem is that i t is only for Melcor TECs (but other TEC manufacturers, such as KryoTherm , o f fe r similarsoftware for download as well) .

Thus I went to the Melcor inform ation page and spent some looking over their equations tr y ing to come up wi th afew qu ick ru les of t humb. I f ina l ly real ized tha t the sensib le t h ing to do w as to imp lement t he i r equat ions in to a fecustom Excel VBA functions. These f unctions are the basis for a l l of t he plot s shown in th is art ic le - detai l s fo l lowlater. One f inal note - I used the Melcor supplied values for t he Seebeck coeff i c ient, resist iv it y and therm alconductiv it y - a l l of t h is applies to Bismut h-Tellur i de TECs only!

For another TEC flavour we w ould need to adapt those values - but Bismut h-Tellur i de is the only mat eria l comm on
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/C|/Temp/The%20Heatsink%20Guide%20-%20All%20about%20PC%20cooling.htm[22/11/2012 5:16:46 p.m.]

used for TECs that are suitable for t emperature ranges common in elect ronics cooling.

System Int egrati on of TEC wi th CPU and Heatsink

We should know the fo l l owing: CPU (or graphics chip) pow er out put, heatsink t hermal resistance, TEC parameters,ambient tempera ture . That is al l we need.

If we don' t know the CPU or GPU power output - then we look on the web, manufactures publish i t . A very goodpage where you can f i nd processor el ectr ical specif icati ons of a l l common CPUs is Chris Hare's Processor ElectricalSpecification page.

Gett i ng your heatsink's therm al resistance could be t r icky - some m anufacturers specify t he t hermal resistance oftheir heatsinks, but the values are often not very precise, or "optimized" for marketing purposes. Check out the

heatsink information page for m ore in fo rmat ion on t hermal resistance, and how t o ca lcu late i t . You must know youTEC parameters, at the very least QMax and hopeful ly more.

Lets suppose w e have t he Tellurex TEC curve f rom above. Also suppose our CPU is at 15 wat ts (keep i n mind thatthe power usage of current CPUs is much higher!), our heatsink has RHeatsink = 0 .5 C/ W and ambient t emperature

25C.

Here is the most simple m ethod:Interpolat e along the TEC curve t o t he CPU output (15 wat ts) and f ind that DT = 45C. Look at t he tot al power out pand see that i t is about 43 watt s to t he heatsink. 43 wat ts*0.5C/ W = 21.5C. Thus the heatsink wil l be 25 + 21.5 =46.5C. The TEC is enforcing a 45C diff erence and t hus the coldside t emp of t he TEC wil l be 46.5 - 45 = 1.5C.That's pret ty cold - good stuf f for an overclocker; but you might encounter problems wit h condensation. See t he laspart of t he Pelt i er Guide for detai ls about condensation problems.

Let us now l ook at a less favourable example: Suppose your have a poor quali t y heatsink; suppose RHeatsink is 1.5

C/ W - t hen your heatsink wil l be 65C over ambient 65+25 = 90C and then your coldside temp would be 45C.

What i f you didn' t use the TEC? Then your CPU would be 15watt s * 1.5C/ W = 22.5C over ambi ent or at 47.5C. Inthat case it is probably is not w orth using the TEC because you are dumping 30 extra watt s into your case anddrawing 3 amps off of your power supply.

In the nex t par t , we ana lyze in more de ta i l in wh ich s i tua t ions a pe l t ie r e lement wi l l he lp cool ing, and in wh ichsituations i t won' t.

Go to part 4 of t he Pelti er Guide(or return to part 2)

Note: This art i c le w as orig inal ly writ ten by "Bo", a v is itor of The Heatsink Guide, w ho wishes to remain anonymous,and only s l ightl y modif i ed by me. Thank you Bo for sharing th is art ic le wit h us!

All pages copyright 1997-2010 Til lm ann SteinbrecherLegal informat ion / Disclaimer / Impressum
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7/10

eatsink Guide - All about PC cooling

C|/Temp/The%20Heatsink%20Guide%20-%20All%20about%20PC%20cooling4.htm[22/11/2012 5:30:55 p.m.]


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Examining the i nfluence of dif ferent parameters

Let us now look at the relat ionships of RHeatsink , QCPU and Qmax in a more general sense. Below, you see a f ew contourplots . The f i rst t hing to consider is : Given a pow erful TEC ( Qmax = 75 wat ts), w hat k ind of CPU tem peratures can be

expected based upon vary ing heat load (QCPU) and vary ing RHeatsink ? The fol lowing t wo plot s are based upon perf ormance f

the TEC at 12V.

This plot shows cold side t emp of t he TEC for various heat loads and heats ink capabi l i t ies . So f or example we can see t hatat QCPU= 33 and RHeatsink = 0.475, the cold s ide temp i s about 28C, or 3C over ambient - not too bad. What about t he fact

that the TEC is adding heat ? We must m ake sure t hat w e are progressing not r egressing! For that I took t he same inform atand compared i t t o the temper ature t hat w ould have been achieved at t he same CPU load and w i th t he same heatsink butwi thou t the TEC. I subtracted the calculated temperature w i t h TEC f rom the calculated temperature wi thou t TEC. Thus, ithe next plot , I am showing t he advantage of using the TEC. When the numbers are posi t ive, the TEC does improve cool ingwhen they are negative, the TEC is a disadvantage.
http://www.heatsink-guide.com/main.shtmlhttp://www.heatsink-guide.com/board/http://www.heatsink-guide.com/faq.shtmlhttp://www.heatsink-guide.com/heatsinkinfo.shtmlhttp://www.heatsink-guide.com/faninfo.shtmlhttp://www.heatsink-guide.com/compound.shtmlhttp://www.heatsink-guide.com/maxtemp.shtmlhttp://www.heatsink-guide.com/case.shtmlhttp://www.heatsink-guide.com/hdd.shtmlhttp://www.heatsink-guide.com/connector.shtmlhttp://www.heatsink-guide.com/control.shtmlhttp://www.heatsink-guide.com/conversion.shtmlhttp://www.heatsink-guide.com/peltierinfo.shtmlhttp://www.heatsink-guide.com/heatpipes.shtmlhttp://www.heatsink-guide.com/vapor.shtmlhttp://www.heatsink-guide.com/manufacturers.shtmlhttp://www.heatsink-guide.com/shops.shtmlhttp://www.heatsink-guide.com/otherlinks.shtmlhttp://googleads.g.doubleclick.net/aclk?sa=L&ai=CxeqwQfGtUNuVBqm9igfMu4DYCIbcpuIB7oXC8CHAjbcBEAEgt9mmAygCUM-I4uwCYL8FyAEBqQJLCA3B6GWrPqgDAcgD3wSqBJMBT9D3gwAc4DwnJm_PP6rT8rIvKfSxuhFL51GyC82jLhWqolsZearhri5C_xREqetLz-Fm-XtYzXNv2cAD_DfMpjCVm_USvFDWZsBf_-v6GU5NAddEDFOh0Uy7mAj5lk-Co1BREfxU8NMWUzuH02CX8nwdv33cLcqSdSKTgszlnPwQWLWYpPj-JIJ56EiW2dAkLufQ&num=1&sig=AOD64_038-i8QqNiJBt0SP7WfAawPM_0iw&client=ca-pub-4638305760001586&adurl=http://www.acmeca.com.sg/albumshttp://googleads.g.doubleclick.net/aclk?sa=L&ai=CxeqwQfGtUNuVBqm9igfMu4DYCIbcpuIB7oXC8CHAjbcBEAEgt9mmAygCUM-I4uwCYL8FyAEBqQJLCA3B6GWrPqgDAcgD3wSqBJMBT9D3gwAc4DwnJm_PP6rT8rIvKfSxuhFL51GyC82jLhWqolsZearhri5C_xREqetLz-Fm-XtYzXNv2cAD_DfMpjCVm_USvFDWZsBf_-v6GU5NAddEDFOh0Uy7mAj5lk-Co1BREfxU8NMWUzuH02CX8nwdv33cLcqSdSKTgszlnPwQWLWYpPj-JIJ56EiW2dAkLufQ&num=1&sig=AOD64_038-i8QqNiJBt0SP7WfAawPM_0iw&client=ca-pub-4638305760001586&adurl=http://www.acmeca.com.sg/albumshttp://googleads.g.doubleclick.net/aclk?sa=L&ai=Cz-NkQfGtUNuVBqm9igfMu4DYCKiaxKkE6Pqzsj7AjbcBEAIgt9mmAygCUM_h_Z4GYL8FyAEBqAMByAPfBKoElgFP0OeJNRzjPCcmb88_qtPysi8p9LG6EUvnUbILzaMuFaqiWxl5quGuLkL_FESp60vP4Wb5e1jNc2_ZwAP8N8ymMJWb9RK8UNZmwF__6_oZTk0B10QMU6HRTLuYCPmWT4KjUFER_FTw0xZTO4fTYJfyfB33fU1xYGWYyXNiIQ56NP2ue51R-zjRgb8dC4Y5lvgmMmAFGZk&num=2&sig=AOD64_0iS4R_nCudiKyEVjINoe-X1RL77g&client=ca-pub-4638305760001586&adurl=http://115.xg4ken.com/media/redir.php%3Fprof%3D38%26camp%3D117403%26affcode%3Dkw1213556%26cid%3D16682961696%26networkType%3Dcontent%26cm_mmc%3DSG-PPC-0411-_-google-_-0_RS-Brand_Content-_-electronic%2520components_Phrase%26url%5B%5D%3Dhttp%253A%252F%252Fsingapore.rs-online.com%252Fweb%252Fhttp://googleads.g.doubleclick.net/aclk?sa=L&ai=Cz-NkQfGtUNuVBqm9igfMu4DYCKiaxKkE6Pqzsj7AjbcBEAIgt9mmAygCUM_h_Z4GYL8FyAEBqAMByAPfBKoElgFP0OeJNRzjPCcmb88_qtPysi8p9LG6EUvnUbILzaMuFaqiWxl5quGuLkL_FESp60vP4Wb5e1jNc2_ZwAP8N8ymMJWb9RK8UNZmwF__6_oZTk0B10QMU6HRTLuYCPmWT4KjUFER_FTw0xZTO4fTYJfyfB33fU1xYGWYyXNiIQ56NP2ue51R-zjRgb8dC4Y5lvgmMmAFGZk&num=2&sig=AOD64_0iS4R_nCudiKyEVjINoe-X1RL77g&client=ca-pub-4638305760001586&adurl=http://115.xg4ken.com/media/redir.php%3Fprof%3D38%26camp%3D117403%26affcode%3Dkw1213556%26cid%3D16682961696%26networkType%3Dcontent%26cm_mmc%3DSG-PPC-0411-_-google-_-0_RS-Brand_Content-_-electronic%2520components_Phrase%26url%5B%5D%3Dhttp%253A%252F%252Fsingapore.rs-online.com%252Fweb%252Fhttp://adclick.g.doubleclick.net/aclk?sa=l&ai=CxnVFQfGtUMjXC-Xbige5y4CgDICgnfsEmOvU1lmQ7c3ChgEQASAAUIDH4cQEYL8FggEXY2EtcHViLTQ2MzgzMDU3NjAwMDE1ODagAdiNu9YDyAEJqAMBqgSQAU_QXQQ_PWVyAGfY1FBwfwE-uJ818nX2ofNxzR1QotKEdxn8lVH6O3v9sa5tQ0O__3B-WJBkI7KtMLRdNO19nwMk5emgE2GLk4PJRfBEn7oVoNRxI7U7KIeXVXWWnTFK7M0W4pOzB4OGLhf45SfVtpJCnb2Iv1jQq1NcLVPbuRBdDB9ojMYVEWQpKHGJkWv7bYAG1_Ocr5b54prhAQ&num=1&sig=AOD64_0GMOCl31GJxj-TfKTO3dqgSkrqpw&client=ca-pub-4638305760001586&adurl=http%3A%2F%2Ftrk.atomex.net%2Fcgi-bin%2Ftracker.fcgi%2Fclk%3Fs%3D1%26urid%3D06d0d5312ad66bcab98fa61bab4933c8fb8d4705a6aeeecf62633%26cr%3D29282%26al%3D14065%26a%3D4964%26sid%3D1%26bp%3DUK3xQQAC68gK4q3lxAAluUXddcETB_qkZd15Rg%26aio%3D9435%26ag%3D1%26pid%3D1%26rt%3D1353576769%26as%3D106%26l%3D0%26aelp%3D-1%26cs%3D1254378180%26fp%3D3%26us%3D0%26cc%3D0%26ivs%3D2747%26li%3D1%26pet%3D1%26m%3D1%26pu%3D1000000%26co%3D197%26re%3D0%26ci%3D0%26me%3D0%26tz%3D480%26dma%3D0%26atm_cvf%3D1%26url%3Dhttp%253A%252F%252Fwww.yourvoucher-singapore.com%252Fcgi-bin%252Fwingame.pl%253Fpartner_pk%253D293%2526wingame_pk%253D46%2526sub_id%253Dhttp://www.google.com/url?ct=abg&q=https://www.google.com/adsense/support/bin/request.py%3Fcontact%3Dabg_afc%26url%3Dfile:///C%25257C/Temp/The%252520Heatsink%252520Guide%252520-%252520All%252520about%252520PC%252520cooling4_files/menu.htm%26gl%3DSG%26hl%3Den%26client%3Dca-pub-4638305760001586%26ai0%3DCxeqwQfGtUNuVBqm9igfMu4DYCIbcpuIB7oXC8CHAjbcBEAEgt9mmAygCUM-I4uwCYL8FyAEBqQJLCA3B6GWrPqgDAcgD3wSqBJMBT9D3gwAc4DwnJm_PP6rT8rIvKfSxuhFL51GyC82jLhWqolsZearhri5C_xREqetLz-Fm-XtYzXNv2cAD_DfMpjCVm_USvFDWZsBf_-v6GU5NAddEDFOh0Uy7mAj5lk-Co1BREfxU8NMWUzuH02CX8nwdv33cLcqSdSKTgszlnPwQWLWYpPj-JIJ56EiW2dAkLufQ%26ai1%3DCz-NkQfGtUNuVBqm9igfMu4DYCKiaxKkE6Pqzsj7AjbcBEAIgt9mmAygCUM_h_Z4GYL8FyAEBqAMByAPfBKoElgFP0OeJNRzjPCcmb88_qtPysi8p9LG6EUvnUbILzaMuFaqiWxl5quGuLkL_FESp60vP4Wb5e1jNc2_ZwAP8N8ymMJWb9RK8UNZmwF__6_oZTk0B10QMU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Again, w hat is plot t ed here is the advantage of us ing the TEC versus not us ing one - for example f rom the condi t ions befor(Q CPU= 33 and RHeatsink = 0.475) we see that the advantage is about 12.5C. The TEC coldside t emp was 28C; using the

heatsink alone, we w ould have reached a temper ature di f ference of 33 wat ts * 0.475C/ W = 15.7C. Add t hat t o 25C =40.7C, w hich is 12.5C hot t er t han the solut ion wi t h the TEC. I think t his k ind of plot can be real ly i nterest ing - i t showshow quick ly i t can go bad i f we use ei ther an undersized TEC or an unders ized heats ink.

How about TEC voltage? Again pl ott ed against CPU pow er, same TEC ( QMax = 75 wat t s) but choosing RHeatsink = 0.5 C/ W.

This is qui te interest ing because i t shows tw o t hings: Fi rs t of al l there is an opt imum vol tage - in t his case about 10.5 - 11.vol ts , depending upon the pow er. Second, i t shows that you can get aw ay wi th a much lower vol t age and s t i l l do someserious cool ing. This may be im portant in the case that your power supply is put t ing out less than 12 vol ts due t o t he ext raload of t he TEC. Of course, under these c i rcumstances one should consider an al t ernate power source for the TEC.

The last thing I 'd l ike t o show is a plot that i l lus t rates how big the TEC and heatsink should be, based upon the power loadI 've normal ized t he CPU power on t he TEC Qmax as thus: Normal ized Power = QCPU/Qm ax .

I also normal ized t he CPU power on RHeatsink : Normalized Cooling = QCPU*RHeatsink . The purpose of t his is that the p lot

direct l y t e l ls how b ig t he TEC and heats ink should be based upon the power requirement . The temperature shown is theadvantage over us ing the same heats ink wi t hout the TEC.


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Coinc idental ly , t he values along the horizontal ax is also happen to be the t emperatur e r ise over ambient t hat t he heats inkwork ing alone (wi t hout TEC) would produce.

The temp erature contours are again the advantage of us ing the TEC versus using the same load and heat sink wi t hout t heTEC. Thus at 0 is is break even - posi t ive num bers (C) indicate that the TEC is helpful , negat ive number s indicate that theTEC is heat ing t he CPU. So we can i mmediatel y see that i f the heatsink alone can not keep the CPU less than 26C overambient - then under no c i rcumstances wi l l i t ever get bet t er w hen you add a TEC. Furtherm ore, you should add a 5-10Cpenal ty for t he fact that the ext ra heat inside your case caused by the TEC wi l l work t o your disadvantage - thus I 'd say thyou real ly need a heats ink (or watercooler) that wi l l keep your CPU no more t han 15C -18C above ambient for i t to besui table for apply ing a Pel t ier. Now - bear in mind that this is the CPU temp measured at the interface wi th the heats ink -you are measuring the t emperature of t he CPU f rom the CPU's internal t emperatur e diode, then you may see a highertemperatures than at the heats ink interface.

I f t he CPU load is about equal or greater t han t he TEC QMax - t hen even the very best heats ink in the wor ld w i l l no t j ust i f yusing the TEC.

Final ly , we can see that t he opt im um s ize of t he TEC is such that the CPU power is 1/ 3 - 1/ 2 of QMax . I f you have a real ly

good cooler, such as a powerf ul wat er cooler, then get a TEC that has QMax = 3 t imes t he CPU heat load. I f the heatsink is

marginal (15C-18C above ambient w i thout TEC) t hen go for QMax = 2 t imes t he CPU heat load.

Excel Spreadsheet

As ment ioned before, you can download an excel spreadsheet wi th the the funct ions I used to create the above plots . Aswi t h any computat ion t ool - check to see i f the resul ts make sense. Remember t hat your output s are only as good as yourinputs (garbage in = garbage out ). A l l theory comes f rom Melcor. Basical ly there are tw o user def ined f unct ions that m ay buseful f or someone engineering thei r own pel t ier cooled assembly . One funct ion ( pe l t i e r ) w i l l ca lcu la te the heat t ransfer reacross the TEC - t his is real ly only a support funct ion for ( cputemp) which w i l l ca lcu la te the co ldside temp d i rec t l y . Thefunct ions require t hat you know how many t hermocouples are in your TEC and you must also come up w i th something knowas the "Geometry f actor". As I ment ioned above I found f rom t he Melcor data t hat G = Imax/ 50 - bu t t he ac id t est i s t o

recreate a manufacturer 's suppl ied curve at t he speci f ied t emperatur e.

Af ter you open up t he spreadsheet there is a page sort of ak in t o a user 's manual - and another page t o chart the TECperform ance. You can access these tw o funct ions by insert ing a user def ined funct ion. I did not protect the VBA stuf f so fef ree to hack i t - but this is my material - please give credi t where i t is due.

Condensation

As ment ioned before, cool ing below ambient t emperatur e may r esul t in condensat ion problems, w hich is something you' l ldef ini tely want to avoid. Us ing padded pel t ier elements wi l l prevent condensat ion inside t he TEC, but i t w on't prot ect youfrom condensat ion on cooled components .

Whether condensat ion occurs, depends on the temperature o f t he coo led ob jec t , on the ambient temperature , and on theair humidi t y . Here is a table t hat w i l l give you an indicat ion whether you are r isk ing condensat ion problems:

Air humidity . /30% 35% 40% 45% 50% 55% 60% 65% 70% 75% 80% 85% 90% 9
http://www.heatsink-guide.com/peltier-xls.ziphttp://www.heatsink-guide.com/peltier-xls.ziphttp://www.heatsink-guide.com/peltier-xls.zip


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Air temperature

30 C 10,5 12,9 14,9 16,8 18,4 20,0 21,4 22,7 23,9 25,1 26,2 27,2 28,2 2

29 C 9,7 12,0 14,0 15,9 17,5 19,0 20,4 21,7 23,0 24,1 25,2 26,2 27,2 2

28 C 8,8 11,1 13,1 15,0 16,6 18,1 19,5 20,8 22,0 23,2 24,2 25,2 26,2 2

27 C 8,0 10,2 12,2 14,1 15,7 17,2 18,6 19,9 21,1 22,2 23,3 24,3 25,2 2

26 C 7,1 9,4 11,4 13,2 14,8 16,3 17,6 18,9 20,1 21,2 22,3 23,3 24,2 2

25 C 6,2 8,5 10,5 12,2 13,9 15,3 16,7 18,0 19,1 20,3 21,3 22,3 23,2 2

24 C 5,4 7,6 9,6 11,3 12,9 14,4 15,8 17,0 18,2 19,3 20,3 21,3 22,3 2

23 C 4,5 6,7 8,7 10,4 12,0 13,5 14,8 16,1 17,2 18,3 19,4 20,3 21,3 2

22 C 3,6 5,9 7,8 9,5 11,1 12,5 13,9 15,1 16,3 17,4 18,4 19,4 20,3 2

21 C 2,8 5,0 6,9 8,6 10,2 11,6 12,9 14,2 15,3 16,4 17,4 18,4 19,3 2

20 C 1,9 4,1 6,0 7,7 9,3 10,7 12,0 13,2 14,4 15,4 16,4 17,4 18,3 1

19 C 1,0 3,2 5,1 6,8 8,3 9,8 11,1 12,3 13,4 14,5 15,5 16,4 17,3 1

18 C 0,2 2,3 4,2 5,9 7,4 8,8 10,1 11,3 12,5 13,5 14,5 15,4 16,3 1

17 C -0,6 1,4 3,3 5,0 6,5 7,9 9,2 10,4 11,5 12,5 13,5 14,5 15,3 1

16 C -1,4 0,5 2,4 4,1 5,6 7,0 8,2 9,4 10,5 11,6 12,6 13,5 14,4 1

15 C -2,2 -0,3 1,5 3,2 4,7 6,1 7,3 8,5 9,6 10,6 11,6 12,5 13,4 1

14 C -2,9 -1,0 0,6 2,3 3,7 5,1 6,4 7,5 8,6 9,6 10,6 11,5 12,4 1

13 C -3,7 -1,9 -0,1 1,3 2,8 4,2 5,5 6,6 7,7 8,7 9,6 10,5 11,4 1

12 C -4,5 -2,6 -1,0 0,4 1,9 3,2 4,5 5,7 6,7 7,7 8,7 9,6 10,4 1

11 C -5,2 -3,4 -1,8 -0,4 1,0 2,3 3,5 4,7 5,8 6,7 7,7 8,6 9,4 1

10 C -6,0 -4,2 -2,6 -1,2 0,1 1,4 2,6 3,7 4,8 5,8 6,7 7,6 8,4 9

All values are in C.Example f or us ing this table: Ambient t emperature=20C, ai r humidi t y=65%. Result : Condensat ion wi l l occur at a surfacetemper ature (CPU, Pel t ier cooler) of 13.2C

Condensat ion pr oblems can be avoided by properly insulat ing t he cooled components . The bet t er solut ion is to use atemper ature control for your TEC, t o avoid tem peratures that are so low that condensat ion becomes a problem. A simplec i rcui t ry , l i ke the one presented here on The Heatsink Guide is useful f or control l ing fan speed, but not for control l i ngpel t ier elements, due to thei r high power usage. Pulse-width modulat ion can be used for control l ing pel t ier power; this is arather complex issue, and beyond t he scope of this guide.

Summary

In conc lusion, TECs are sol id stat e heat pumping dev ices that can reduce component (CPU) t emperatures, but they requir esome f orethought t o apply . I f t he TEC is misappl ied, t hen the uni t may actual ly heat your CPU rather t han cool i t . The moimport ant t hing is that the heat sink and the TEC must be properly s ized t o sui t t he heat load. The heats ink must be at leagood enough that i t w i l l keep the CPU only 15-18C above ambient w i thout the TEC. The TEC must have a maximum heatt ransfer capabi l i t y about 2 - 3 t imes more than t he amount o f heat that the CPU puts out .

Return to part 3 of t he Peltier Guide, or return t o first part .

Note: This art ic le was or iginal ly wri t ten by "Bo", a v is i tor of The Heats ink Guide, w ho wishes to remain anonymous, and onsl ight ly modi f ied by me. Thank you Bo for sharing this art ic le w i th us!

Al l pages copyright 1997-2010 Ti l lm ann SteinbrecherLegal informat ion / D isc laimer / Impressum
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The Heatsink Guide - Peltier Cooler Information

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