The Electronics Packaging & Flexible Electronics Centers ...
Transcript of The Electronics Packaging & Flexible Electronics Centers ...
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The Electronics Packaging &
Flexible Electronics Centers
at Binghamton University
Research Webinar
November 20, 2014
8-9:30 a.m. PST (US)
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Agenda
About S3IP
IEEC Vision & Mission
IEEC model
History
Annual symposium
Staff
Resources/facilities
Key research thrusts
Education
Economic impact
Partners
Membership
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http://www.binghamton.edu/s3ip/
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Vision
The IEEC will conduct transformational research in the area
of electronic systems integration and packaging that will
have a broad impact on society and our partners and will
contribute to their technological and economic successes.
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Mission
• To conduct world class electronics packaging research that provides significant technological advantage to our customers
• To provide physical and intellectual infrastructure and expertise that will help our customers be successful in their businesses
• To enable each of our partners to network and grow their customer and partner base
• To enable economic growth in the electronics industry throughout the region and the nation
• To provide high-quality and real-world relevant educational experiences to our students in the interdisciplinary field of electronics packaging
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IEEC model
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History Highlights
1991 founded as NSF I/UCRC at Binghamton University
Lockheed Martin, UIC, BAE Systems, and IBM
1994 Sigrity began as an IEEC project
Mid ‘90s Tear-down Reports
1996 “Graduated” from I/UCRC to a self-sustaining center
Funding from New York State
Increased member companies
2000 First IEEC laboratory
2014 Center of Excellence building
$30M, 114,000 square feet
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History
Expertise has grown with the industry
• THT to SMT, Including PIP
• Peripherally Leaded to Area Array
• Pb-Free Studies
• Nano materials for EP
• 2.5D / 3D Integration
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Annual symposium
Topics include:
• 3D Packaging
• Thermal Challenges
• Sensors/MEMS
• Embedded Electronics
• Printed Electronics / Additive Mfg.
• HiTemp Electronics
• Mobile Electronics
• Flexible Electronics
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Staff
Our seven-member staff boasts 120+ years of electronics packaging industry experience. More than a dozen Binghamton University faculty researchers are affiliated with the center.
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Resources/Facilities
MPM Stencil PrinterUniversal AdVantis PlacementHeller 1700W Reflow
Assembly
These next few slides show just a partial
list of our resources/facilities, please see
our website for the complete list
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Thermal Shock and Cycling
HAST
T/H
Drop Shock
Shaker w/ Temp
Dage 4000 and 4000+
Resources/FacilitiesStress/Reliability
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Analytical and DiagnosticResources/Facilities
Sample Preparation
CSAM
X-Ray
CMM
Profilometer
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ADL
Overview:• Analytical and Diagnostics Laboratory (ADL) in the
NY state Center of Excellence in Small Scale Systems Integration and Packaging (S3IP)
• 8000 sq-ft, state-of-the-art research facility
• Complete, advanced analytical lab accessible to industry and academic customers
• $21M NY state grant
• Opened in Fall 2007
Resources• ADL Staff:
• PhD scientists, engineers, graduate research assistants, and technicians
• Materials Science & Engineering, Physics, Chemistry, and Mechanical Engineering background
• Extensive experience in microelectronics industry
• State-of-the-art Instrumentation
• BU Faculty
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ADL Services
ADL provides
• Materials Analysis and Characterization Services
• Root cause physical failure analysis for industrial products
• Expert insight and solution to industrial manufacturing and development problems
• Access to analytical and characterization instruments
• Collaboration for product and process development with industries
• Long term research collaboration with industries
• Knowledge transfer and training
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ADL Capabilities
• Wide range of high-tech, analytical equipment under one roof
• Over 76 distinct instruments available through one user interface, over 58 in one facility.
• Electron Microscopy
• Non-destructive Testing
• Thermal Analysis
• Chemical Compositional Analysis
• Surface and Interface Analysis
• Crystallography and Particle Analysis
• Optical Microscopy
• Bio-materials analysis
• Electrical and Mechanical Testing
• Extensive Sample Prep Tools
• Device Fabrication and Processing
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Services
Consultation: We are happy to answer electronics questions, with formality ranging from a phone call to a full report.
Analytical work: The IEEC laboratories are as close as a phone call. We strive for rapid response on all requests for analysis, with same-day turn around when possible.
Environmental stressing: Chamber time is easily scheduled. In addition to stressing, we can provide in situ continuity testing.
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Services
Modeling: Microelectronic systems have peculiar thermal distributions and are prone to mechanical and thermomechanical stress failures. Finite Element Modeling can determine the thermal patterns in a given structure as well as the high stress points.
Reliability assessments and failure analysis: We can identify failure mechanisms, isolating and analyzing failures.
Materials evaluation: Our laboratories can measure material properties such as hardness, modulus, Tg, CTE, heat capacity and thermal conductivity.
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Key research thrusts
Source: M.P. Groover (Fund. of Modern Mfg.: Materials, Processes, and Systems)
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2014-2015 pooled projects
• Materials for Hi-temp Electronics
• Assessment of Potential Impact of Additive Manufacturing on Microelectronics Fabrication
• Glass Interposers – Cu Filling for High Aspect Through Holes
• Design Guidelines for 3D IC Packaging
• Reliability of Nano-Cu Alternatives to Hi-Temp Solders
• Dual-Wavelength Optical Interferometry for Characterization of EP Materials
• Characterization of the Microstructure and Reliability of Si/micro Cu pillar/solder/glass Assemblies
• Enhancement of Cu/EMC Interface Adhesion by Controlling Surface Finish of Cu
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Future research thrusts
• 3D Packaging
• Printed Electronics / Additive Manufacturing
• Flexible Electronics
• Healthcare/Medical Electronics
• Power Electronics
• Advanced Materials Development (e.g., nano materials)
• Sensors
• Photonics
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Education
375+ graduates (PhD, MS, BS) with IEEC support
A small sample of where they work:
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Economic impact
Based on letters of economic impact from partner companies
IEEC 2012-20135 YEAR
(2008-2013)SINCE 1996
Total Economic
Impact$61.9M $412.4M >$1.0B
Total New & Retained Jobs
59 549 1848
$ Economic Impact per $1 NYS Funding
$67.2 $88.0 $69.1
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Partners
ASTEELFLASH Kionix Kintner Equipment Leonardi Manufacturing
RPA Electronics
EZRED GE Ventures GE Inspection Technologies
EMS Technologies
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Member benefits
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How to become a member
Visit us online at:www.binghamton.edu/ieec
Contact us:
Daryl Santos, [email protected]
Bill Infantolino, associate [email protected]
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Thank you!