TSMC Property

© 2011 TSMC, Ltd

1

The 450mm Transition

C.S Yoo

Taiwan Semiconductor Manufacturing Company

TSMC Property

© 2011 TSMC, Ltd

2

Delivered Unprecedented Improvements

10 -11 10 -18

10 -8

1970 2011

Source: Accenture

1,700% 0.6 10.8 Global Mobile-

Data Traffic

(exabytes per month)

2011 2016

TSMC Property

© 2011 TSMC, Ltd

3

0

500

1,000

1,500

2,000

2,500

1980 1985 1990 1995 2000 2005 2010 2015

Ele

ctr

on

ic E

qu

ipm

en

t R

even

ue (

$B

)

1st Wave:

Desktop PC

2nd Wave:

Mobile Phone

3rd Wave:

Mobile Computing

Mobile Computing Drives Market Growth

Source: Gartner, IDC, iSuppli, TSMC estimated

TSMC Property

© 2011 TSMC, Ltd

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Mobile Computing Cloud Computing Smart Devices

Future Growth

Drivers and

Trends

TSMC Property

© 2011 TSMC, Ltd

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NFET

PFET

Dual CESL

SiGe S/D

SMT (TSMC, VLSI’04)

MS anneal (TSMC, VLSI’06)

40nm

2nd-Gen HKMG

5th-Gen stressors

Advanced doping and

annealing for Ultra-shallow

junctions

Band-Edge Silicide

Bulk

28nm (TSMC, VLSI’04)

Nanowire FET

Defect-free High-mobility

Channel Fin-FETs on Si

TSMC 2011

HKMG (TSMC, IEDM’05,

VLSI’06, … )

Enhanced strain

20nm & Beyond

STI

Gate

SiSTISTI

Gate

SiSTI

(TSMC, IEDM’02)

FinFET

Record FinFET

TSMC, IEDM’10

1st Ge on Si Fin-FET: TSMC 2012

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

-1 -0.5 0 0.5

Id (

uA

/um

)

VG (V)

Transistor Architecture Trends

TSMC Property

© 2011 TSMC, Ltd

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Increasing Technology Complexity : As Reflected by Mask Layers Increase

TSMC Property

© 2011 TSMC, Ltd

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Technology Shrink Leads to Design

Complexity . . .

Signal

Integrity

Signal

Integrity Signal

Integrity

Signal

Integrity

RDR

DFM

Integration

Power

DFM

Integration

Power

Integration

Power

Advanced

Lithography

RDR

DFM

Integration

Power

Signal

Integrity

90nm

65nm

40nm

28nm 20nm

2004 2006 2008 2010 2012

Tech

no

log

y g

eo

metr

y

Desig

n C

om

ple

xit

y

TSMC Property

© 2011 TSMC, Ltd

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Intrinsic Wafer Cost Parity

屈 2009 TSMC, Ltd

* Intrinsic cost definition: wafer cost @ 30K/month capacity, 99% yield, same metal and without over depreciation

benefit

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 Year

Intr

insic

wafe

r co

st

pari

ty

(%,

vs.

last

no

de)

N28HP/HPM

N20G/SoC

N40G

N65G+

N10 Cost

TSMC Property

© 2011 TSMC, Ltd

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TSMC’s Mission

Our mission is to be the trusted

technology and capacity provider

for the global logic IC industry

for years to come.

TSMC Property

© 2011 TSMC, Ltd

10

8" K

Wa

fer

1,200

1,000

800

600

400

200

0

Source: SEMI

2011 Worldwide Top 20 Semiconductor Companies’

Installed Capacity (Excl. Memory)

TSMC Capacity Leadership

TSMC Property

© 2011 TSMC, Ltd

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TSMC Customers’ Expectations

• Offer leading – edge technology

• Continue to expand capacity

• Enable faster time to market

. faster technology ramp up

. faster manufacturing cycle times

• Lower cost /die

TSMC Property

© 2011 TSMC, Ltd

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The 450mm Promises Opportunities for :

• More efficient capacity expansion

• Faster technology ramp up

• Faster manufacturing cycle times

• Higher land and people productivity

TSMC Property

© 2011 TSMC, Ltd

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Challenges for 450mm Transition

• A viable photolithography technology that meets

N10 requirements by 2015 ?

• Reasonable tool cost parity that enables the expected

450mm cost advantages

• Significant productivity improvement

• Fully automated (unmanned) Fab operation

• Smart tools (self calibrated, self control, virtual metrology..)

• Green Fabs

TSMC Property

© 2011 TSMC, Ltd

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Innovations

TSMC Property

© 2011 TSMC, Ltd

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450mm Will Stimulate Industry Innovations

Many innovations enabled 300mm excellence

Single Wafer Process

Twin-Scan, Multi-Chambers

Equipment Automation

Advanced APC/AEC

Automated Material Handling System

We believe there are more innovations coming up

for 450mm

TSMC Property

© 2011 TSMC, Ltd

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New Equipment Platform Provides

Significant Productivity Improvement

Through continuous innovations

2000 2003 2003 2005 2008

KrF

Scanner 0.96 1.00 1.32

1.91 2.15

200mm

300mm

2012

450mm

Tool

productivity

TSMC Property

© 2011 TSMC, Ltd

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Tool Throughput,

Fab Ramp-up

300 mm

450 mm

Electricity

Carbon-

Footprint,

Water

per unit

Min.

Output

Full

Capacity

IC manufacturers should work with equipment/material

suppliers for eco-friendly design and green manufacturing

Pursue Green Manufacturing

TSMC Property

© 2011 TSMC, Ltd

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Summary:

Both IC makers and equipment suppliers :

- should fully leverage the G450C

- work and innovate together to make the

450mm transition a great success !