The 3D Silicon Leader

Les capacités en Silicium pour les

applications de puissance demandant une

très forte stabilité et fiabilité

Journée Puissance Tours October , 2012

Catherine Bunel , R&D Director

2

Who are we?

• Independent Company located in

Caen, Normandy, France

• Dedicated to manufacturing of leading

edge Integrated Passive Devices

• 20 M$ revenues, 100 people and

operating own Silicon wafer fab

• Strong R&D team and collaborations

with leading research institutes

Quality Certifications

“We aim at exceeding our customers expectations by

reaching the highest level of Quality Standards” Franck Murray, IPDiA C.E.O.

3

• ISO-9001

• ISO-14001

• ISO-TS16949 (Automotive)

• ISO-13485 (Medical)

• OHSAS-18001

• RoHS compliant

What do we do?

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High performance, high

stability and high reliability

silicon passive components

to customers in communication,

harsh environment, industrial,

lighting, and medical markets.

PICS-IPD, a Unique Technology

5

Passive Integration Connecting Substrate

Up to 100’s of

passive components

can be integrated

IPDIA value proposition:

Technology that enables

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• Miniaturization of application

– Module: High density integration

– High PCB area saving (e.g. > 40%)

– Silicon die with embedded passives as

replacement of external SMD components

– Compatible with standard wire

bonding or reflow assembly according

to scenarios

• Enhanced Performance

– Very high stability vs temperature,

-55°C to +210(*)°C operating range

– High stability vs voltage, time…

– High reliability (no cracking & very low

failure rate<2ppm)

– Efficient decoupling with low ESR/ESL by

full integration on silicon

– Lower battery life time with very low

leakage current

– PCB influence cancelled • Reduced Cost

– BOM level

– Simpler manufacturing with

module

– Simpler application with less

components to place

• Greater Flexibility

– One configurable IPD allowing

a set of output voltages

(*): limited by the active part, up to 250°C is

possible with our passive integration

PICS-IPD, a Unique Technology

7

e

SC S0The world

record of

capacitance

density in Silicon

in volume

production

• 250nF/mm² (100µm thin) in production

• 550nF/mm² already tested and demonstrated

Process nodes available

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9

Oustanding performance for High

Temperature applications

For X7R 402 100nF capacitors the cumulated derating @ 200°C is -77%

For 3D Silicon capacitor , it is < 2%

Extreme stability

Outstanding low derating

0,0E+00

1,0E-09

2,0E-09

3,0E-09

4,0E-09

5,0E-09

0 20 40 60 80 100 120

Ip (A

)

Time (s)

Ip 85 Ip 200°C Ip 250°C Ip 275°C Ip 300°C

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I(120s) < 2 nA @ 300°C

DC leakage current at high Temperature

C= 100nF (Amps @ 3V)

I(120s) < 20pA @ 25°C

Performances: High Reliability

Very Low Failure rate

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Used at 85°C and 50% of the Rating

voltage the Failure Rate of a Silicon

Capacitor is Insignificant (Only 2

Units failed on a Million after 10

Years operation time)

This very low Failure Rate

confirms the Excellent Reliability

of 3D Silicon Capacitors ( No

Ageing )2

187

491

0

100

200

300

400

500

600

3D-Si Capacitor X7R Tantalum

Failu

re R

ate

'p

pm

'

Projected Failure Rate in 10 Years

Failure Predictions of Tantalum, Ceramic ‘X7R’ and 3D-Si based Capacitors

Failure rate:

FIT rates calculated at 60% confidence level

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0,001

0,01

0,1

1

10

100

25°C 50°C 75°C 100°C 125°C 150°C 225°C

HEC X8R IPDiA

Standard Product Offering

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Wirebond Silicon Capacitors

• Vertical Silicon Capacitors (WBSC)Broadband and RF communication modules

• Wirebond & Embedded Silicon Capacitors (EMSC)Bypass capacitor applications

High Temperature Silicon Capacitors

• High Temp. Silicon Capacitors 200°C (HTSC)Downhole equipments , avionics

• Xtreme Temp. Silicon Capacitors 250°C (XTSC)Downhole equipments , avionics

• 100% burn-in tested

• Very low derating rate

• Low ESR & ESL

• Thickness down to 100µm

• Efficient decoupling inside

IC module

• For wirebonding and

embedding assembly

• 100% burn-in tested

• Max 1% capacitance

variation

JEDEC Compliant Silicon Capacitors

• High Stability Silicon Capacitors (HSSC)All high-rel applications(Medical and Automotive…)

• Low Profile Silicon Capacitors (LPSC)System in Package, IC modules, ASICS

Low Profile Silicon Capacitor (LPSC)

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Typical 100nF Capacitor Thickness

Volume comparison of 1206 Case size capacitors

6 Times smaller

More than 2 times smaller

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1°) Embedding Applications

-Capacitance up to 4,7µF

-Copper or Aluminum finishing

2°) Molding Applications ( Smart cards, Bank cards, RFID’s )

3°) Customized Applications ( Memories, IC Modules…)

Low Profile Silicon Capacitor (LPSC)

Conductive glue on backside

0303 10nF Vbd>50V

30/04/12

RC Snubber capacitor

Capacitance range 1nF-50nF

Tolerance +/- 5%

Nominal voltage 75V

Insulation Resistance > 100GΩ

Temerature range -50°C + 200°C

T°C linearity 45ppm/°C

Performance Characteristics

Silicon Capacitor

array using

250nF/mm² node

Current Ceramic capacitor array

size: 13mm² and 1mm thickness

size : 0.72mm² and

80 µm thickness

Custom Product Offering

The Cubic Path

=

up to 10

stacked dies

80µm thick

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22µF

Min BV =11V

In a package size of

4.88 x 3.6 x 2.2 mm

Vuse = 4 V

Applications

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All applications with demanding requirements

Extended temperature ranges

Miniaturization / Higher integration

Electrical & Mechanical Reliability

Low energy consumption

Engine

Wheels

&

Brakes

Gearbox

Transmission Exhaust

High-temperature environments

e.g. Down-Hole Drilling , Heavy industrial sensors, Automotive

Conclusion

IPDIA 3D Silicon Capacitor is offering many advantages

over the other types of capacitors :

High capability of integration

High robustness at 80µm thickness

Very high stability with an outstanding behaviour at 250°C

Extremely low failure rate .No burn-in test .

Ultra Low leakage .

Large range of products

Ideal solution where volume and weight are major concerns .

IP Protection

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