Texas Instruments Maine (MFAB)...Maine Site Jean Hoerni & Robert Noyce develop IsoPlanar process at...

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Texas Instruments Maine (MFAB) John Doxsey – IT Manager

Transcript of Texas Instruments Maine (MFAB)...Maine Site Jean Hoerni & Robert Noyce develop IsoPlanar process at...

Page 1: Texas Instruments Maine (MFAB)...Maine Site Jean Hoerni & Robert Noyce develop IsoPlanar process at Fairchild Semiconductor. 1959 . 1961 . 1978 . 4” Fab Expansion 1963 . First Fab

Texas Instruments Maine (MFAB)

John Doxsey – IT Manager

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About John Doxsey • Work Experience

– “Doing computers” for 42 years, Fairchild/National/TI for last 30 – Some form of Factory Automation since 1976

• Education – Took my 1st computer class in 1965 at the age of 14 (FORTRAN)

– B.A. in Computer Science from SUNY Potsdam – “Almost-a-Masters” in Computer Science from RPI

• Hobbies – Reading, sailing, skiing, re-constructing various parts of my home,

watching my three daughters grow into young women

• Personal Philosophy – If work isn’t fun you’re doing the wrong job

• IT Philosophy – You can’t have a good information system without a good data

collection system. Get the data right. Keep it. Use it.

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Importance of Thinking Globally

• 95% of the world's customers live overseas

• TI ships 100,000 Products

• To 100,000 Customers

• 90% of TI’s revenue comes from overseas

• 60% of that revenue comes from Asia

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Digital video recorder/server

IP phones

Wireless

infrastructure

Smart phones

Motor control

Computing

Digital TV

E-bikes

Analog Embedded Processing

Digital audio & radio

Wireless LANs

Smart energy meters

Medical Test equipment

TI’s Analog and Embedded Processing products powering diverse and fast growing applications

Automotive & HEV

Digital still cameras

Industrial weigh scales

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Freising FFAB 200mm

Texas

Dallas DFAB 150mm, 200mm DMOS5 200mm

DHC MEMS Heater Chips

DMOS6 300mm

DBUMP

RFAB 300mm

Aguascalientes TMX

Baguio City TIPI

Pampanga Clark Bump

Kuala Lumpur TIM

Taipei TITL

Aizu 200mm

Miho 200mm

Hiji 150mm Assembly and test

SFAB 150mm

Houston HFAB 150mm HBUMP

Chengdu CFAB 200mm

LEGEND Wafer Fabs Assembly / Test Bump

Worldwide Manufacturing sites

Portland MFAB 200mm

Greenock GFAB 150mm, 200mm

Melaka TIEM

Page 6: Texas Instruments Maine (MFAB)...Maine Site Jean Hoerni & Robert Noyce develop IsoPlanar process at Fairchild Semiconductor. 1959 . 1961 . 1978 . 4” Fab Expansion 1963 . First Fab

Maine Site Jean Hoerni & Robert Noyce

develop IsoPlanar process at Fairchild

Semiconductor.

1959

1961 1978

4” Fab Expansion

1963

First Fab in Maine

1984

5” Fab Expansion

First Commercial Integrated Circuit

TI & Fairchild

1987

NSC purchases Fairchild

Semiconductor

1993

6” Fab Expansion

1995

200MM Die Fab; Nov ‘95 Groundbreaking

1996

1st 200mm Production

1997

FSC sold to Fairchild management team

1999

2001

BiCMOS8

2008

CBC8

2009

Texas Transfer

BiCMOS13

2010

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National founded in

Danbury, CT

Sept 2011

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What MFAB Produces ….

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Semiconductor Manufacturing 101

• From Silicon to Wafers to Die (Chips) to Packaged Parts

• High Complexity – 300 – 700 unique operations to fully process the wafer – Each operation uses a different kind of equipment (tool)

• High Precision – Every operation must be performed in the correct order – Each must be executed perfectly - Every Time !! – Equipment must operate within narrow tolerances

• Super Cleanliness – Class 1 Clean Room – Class “sub-1” Pods & Mini-environments – “Class” = # of .5 micron particles found per cubic foot of air

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How big is a Micron?

• 1-millionth of a meter (1/1,000,000)

• Diameter of a Human Hair 40-50 microns

• Red Blood Cell 6-10 microns

• Typical Bacteria 5-20 microns

• Clean Room Particle Detection .5 micron

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MFAB Factory Automation System • Software has all been developed “in-house” by our IT Staff

• We fully Automate “the Simple, but Important Things” – Right lot, right tool, right recipe, right operator, right reticle

• Everything in the Factory gets controlled or tracked – 100% of equipment is controlled and operated by the system – All wafers are in Pods with Smart Tags

• Each wafer is uniquely identified via a number etched into the silicon • The position within the pod is tracked (Slot 1 – 25) • The Smart Tag has a unique ID burned into its EPROM • The Smart Tag communicates with the System via Infrared (TV Remote)

• System supports all aspects of Manufacturing – Running Wafers on Equipment – Maintaining the Equipment (Repairs and Preventive Maintenance) – Statistical Process Control

Link to Video