Larry Pagaduan

Enumerate the SOP’s while doing inspection Identify basic package types to inspect Enumerate the different inspection procedures Identify different defects per package types Identify the acceptance and rejection criteria per

defect type Passed the qualification exam Apply the knowledge learned on this training

At the end of the training, the participants should be able to:

OBSERVE PROPER USE OF ESD APPARELS- ESD shoes checked and passed

- Wear gloves, facemask & ground strap - Ensure ground strap is connected on the

CGM

CHECK PROPER LIGHTING - Ensure that the workplace has enough

lighting - Luxolamp fluorescent should be operational - Microscope fluorescent should be

operational

FOLLOW THE DEFINED SAMPLING VM SCHEME (DURING TEST)

-Randomly select 2 trays/tube from the lot being tested

***ACCEPT = 0, process lot ***REJECT = 1 , perform 100% VM

MICROSCOPE/UNDERSCOPE AREA

QFP – acronym for QUAD FLATPACK

PACKAGE

LEAD

SHOULDER

BODY

FOOT

BGA – acronym for BALL GRID ARRAYEncapsulant/Mold Package

Solder Ball

Substrate

FC – acronym for FLIP CHIP

Ni-platedCopperHeat spreader(LID)

Organic SubstrateSolder Ball,Sn63Pb37

DieSolder Bumps

LIVE BUG INSPECTION- inspection procedure wherein the inspector is viewing the top part of the unit/s.

DEAD BUG INSPECTION - inspection procedure wherein the inspector is

viewing the bottom of the unit/s.

MIRROR BLOCK INSPECTION - inspection procedure wherein the inspector is

viewing the side of the unit/s with the aid of a microscope and mirror block

WHAT TO INSPECT?1. SYMBOL2. PACKAGE (ENCAP)3. LEADS

LIVE BUG INSPECTION

WHAT TO INSPECT?1. SOLDER BALL2. SUBSTRATE

DEAD BUG INSPECTION

MIRROR BLOCK INSPECTION

WHAT TO INSPECT?1. LEAD COPLANARITY2. PACKAGE WARPAGE3. SUBSTRATE

Seating plane

Lead – refers to terminal. - it serves as a connection between the chip/die and the application board of the customer

“ Misalignment from lead center”

Seating plane

Mirror block view

Top view

“Deformity on leads such as broken, crushed and twisted”

“Lead foot lifted opposite the required angle.”

Positive Angle

MIRROR BLOCK VIEWTOP VIEW

“Lead/s that have exceeded the required distance between the lead foot and the seating plane.”

Lifted Leads Measurements from seating plane

Accept – 2.5 mills Reject – above 2.5 mills

Std. Thickness – 5 mills

2.5 mills

Mirror Block View

Solder Ball – refers to terminal. - it serves as a connection between the chip/die and the application board of the customer

“Ball shorted to each other or caused by solder or any conductive material.”

Scraped part of a solder ball connectingto the next solder ball adjacent to it.

“Missing ball on the solder ball land”

Exposed copper isvisible on the ballland area(Ball-Attach Induced)

A residue of solderis visible on the ballland area. Also referred as “SHEAREDBALL”

“Also referred as Deformed Ball. Characterization is broken down into four (4) criteria/specification.

1. Diameter of the deformed ball does not meet 1. Diameter of the deformed ball does not meet the ball spec or size diameter.the ball spec or size diameter.

1/3

2. Deformed ball that reduces space between 2. Deformed ball that reduces space between solder balls by more than 1/3 of its distance.solder balls by more than 1/3 of its distance.

3. Damaged ball that have crevices, cracks, or 3. Damaged ball that have crevices, cracks, or scratches exceeding 1/3 of the ball size.scratches exceeding 1/3 of the ball size.

4. Damaged ball that have pressed area larger 4. Damaged ball that have pressed area larger than half of the ball diameter.than half of the ball diameter.

Substrate - functions like a printed circuit board which has circuit patterns to form a connection with the chip/die

““Bent tape greater than 0.2mm (0.008 inch) Bent tape greater than 0.2mm (0.008 inch) above or below the original position.”above or below the original position.”

Reject – Copper Traces Broken

Accept – Copper Traces are in good condition

““Broken tape exposing any pattern on the Broken tape exposing any pattern on the package bottom.” package bottom.”

Package – a container for die that provides external electrical and mechanical connection, heat removal, physical protection, environmental isolation, and distribution of power and signals

““Package chips, gouges, and breaks that Package chips, gouges, and breaks that expose the pattern tape inside the expose the pattern tape inside the package.” package.”

““Any package broken such that a part of the Any package broken such that a part of the package can be moved or that allows an open package can be moved or that allows an open path to the die, the wire or the circuit pattern path to the die, the wire or the circuit pattern area covered with the solder resist tape area covered with the solder resist tape (substrate). Transverse cracks across the top (substrate). Transverse cracks across the top surface of the package.” surface of the package.”

““Contaminated area greater than 10% (for Contaminated area greater than 10% (for BGA) or 5% (for FC) of the package BGA) or 5% (for FC) of the package surface.” surface.”