Test processes in PIC production chain: challenges and ... · >€ 600 billion by 2025...
Transcript of Test processes in PIC production chain: challenges and ... · >€ 600 billion by 2025...
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27th September 2019
Weiming Yao, Sylwester Latkowski
Salland Test Technology Symposium 2019
Test processes in PIC production chain: challenges and solutions
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Outline1. Photonics
The future of Digital Era
2. Integrated photonics ecosystem
Photon Delta, JePPIX, Pilot lines
3. Test and characterization of PICs
Open standard test framework
Automated pre-package die tester
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Photonics
The future of Digital Era
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What is Photonics?
Electronics
electrons as basic carriers of information or energy
Photonics
photons as basic carriers of information or energy
• Photon energy (𝐸𝑝ℎ = ℎ ∙ 𝑓)
• zero mass (m=0), speed of light (v=c)• Photons excite electrons • carry over (part of) their energy to electrons • Electrons can “relax” exhaust energy as a photon.
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>100 Gb/s transmitter on single chip, fabricated in our powerful MPW platform
Micro electronic device
First Transistor
First solid state laser
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Why integrated photonics?Micro electronics approach a ceiling in achievable performance
• Speed limitation – CMOS based micro electronics: 100 Gb/s• Power consumption (>50 pJ/bit) – total communication infrastructures >7% of total
electrical power (Netherlands 2018: >11% of total electrical power consumption*))
Photonics enables future performance requirements
• 2018: micro electronics technology realizes 100 Gb/s/channel• 2018: Photonics technology based demonstrator realizes data transport
159 Tb/s/fiber• 2021: Market demands 1 Tb/s/channel• 2025: Power constraint: <1 pJ/bit
Photonics technologies enable disruptive solutions
• Telecom, Datacom show exponential growth since 1990 (average growth rate: 1.7/year)
• new technologies: Preventive health cure and care, smart mobility, sustainable industry, internet of things, machine-to-machine communication, 5G network, …
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*) State of the Dutch Data Centers, Dutch Data Center Association, 2018
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[Cisco]
Data centers
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Photonic revolution in micro electronics industry
• Integrated photonics will join electronic devices and systems at demanding niches
• Telecom and datacom industry are forerunner
• Sensing is approaching in big steps
• Estimated total global economic value of Integrated Photonics:
>€ 600 billion by 2025 (expectations Nokia a.o., IPSR-I fall meeting, Boston, Nov 2018)
• Involvement of supply chain
• New production methods
• New business models
• Strong science/industry cooperation
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Integrated photonics ecosystem
Photon Delta, JePPIX, Pilot lines
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Integrated Photonics Ecosystem – Photon Delta
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Research Development End UsersManufacturing
PITC
Knowledge institutions Technology R&D Manufacturing OEM, ODM, systems
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One PIC ecosystem
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• A Platform for integrated photonics based solutions
• Funded with EUR 200 Mio+
InP and Triplex technologyFoundry services Packaging and assembly service Domain specific application centres
Knowledge Centres
PIC and PIC-powered modules ODM/vendors
Universities
Assembly/Packaging Foundries
PIC Foundries
Design Services
CITC
Tools providers
Ministerie van Economische Zaken
Sponsors/Investors
industry/technology associations
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Technology casesEnablers of fastest time-to-market for innovative solutions in multiple markets
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State of the art (5 yrs ahead of competition) highly accurate sub-system for simultaneous high-frequency measurement of force, pressure, temperature and relative spatial position of distributed sensors over one/multiple optics fibre
Fiber Optics Sensing
World’s first subsystem, powered by dedicated proprietary Photonic integrated Circuits (PIC) and hybrid PIC packaging, for single/multiantenna optical-domain beamforming in double-digit GHz range wireless communications (e.g. 5G mobile access points or multi-point broadband satellites)
Photonics Beamforming
Dynamically Tunable Laser
State-of-the-art flexible low-cost low-power highly-integrated dynamically tunable lasers sub-systems with stable and high-resolution tuning in IR C-band
Synchronized multi-parameters bio-photonics sensing subsystem, powered by dedicated proprietary PIC and VCSEL + detector integration for a.o. food safety, precision farming; healthcare screening/monitoring
Bio-photonics sensing
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JePPIX.eu
• PIC training since 2006• Open access MPW• Roadmap• Testing
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European Pilot Lines
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Scaling productionOpen-access InP PICs
pixapp.eu
inpulse.jeppix.eu/
Development of PIC technologyOpen innovation
Assembly and Packaging Pilot lineOpen-access
one-stop-shop Access to photonics technology platforms
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Test and characterization of PICs
Open standard test framework
Automated pre-package die tester
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Test processes in PIC production chain
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JePPIX Roadmap 2018 http://www.jeppix.eu/vision
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Role and importance of PIC testing• Identify known-good-die (KDG)
• Push the performance-yield envelope
• Create improved accuracy models for designers
• Testing is often a short-hand for
ValidationVerificationSelectionMeasurementCharacterization
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Chart based on data from a study of Erica R. H. Fuchs in IEEE JLT, vol. 24, No.8, 2006.
Ignazio Piacentini, Ficontec @ ECOC 2019:
„Validation: Do we make a right product?”
„Verification: Do we make a product right?”
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Test intensity vs product maturity
Makoto Okano (AIST), Sylwester Latkowski(TU/e), IPSR-I 2019
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Beauty and the beast
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• Characterization is a ‘beauty’
– Delivers lots of data and information
– Good for low volume, MPW
– Essential for prototyping, R&D at a ‘startup-phase’ of a product
– Resource demanding, volume ‘unfriendly’
• Test is ‘the beast’
– Needs to be fast (s/test = $$$)
– Essential at early production stages (WLT)
– A must if volumes are considered seriously
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Standard file formats
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• Meta data: both human and machine readable
• Open standards assure data interoperability, exchangeability and traceability
• Adheres to the FAIR data principles: findable, accessible, interoperable, reusable
• Enables an assembly process validation and optimization and feedback to EPDA
Outsourced Semiconductor Test and Assembly
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Open standard test framework: openEPDA.org
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Hardware agnostic
• TU/e semi-auto tester
• ficonTEC tool
Open standards
• File formats
• Python implementation
User defined test sequence
High level of abstraction
• Data exchangeability..
• Experiment ↔ Model
S. Latkowski, et al., IEEE Journal of Selected Topics in Quantum Electronics, vol. 25, no. 5, pp. 1-8, Sept.-Oct. 2019,
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Every circuit is different – but must we re-define our testing and kit every time?Often a complex sequence of measurements is required to understand performance
InP Tx and Rx PICs under test. Images courtesy of: S.Latkowski, K. Lawniczuk, W. Yao
Testing at the circuit level: does the PIC work?
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ConventionsDie orientation
• East West North South
Fiducials
• Die positioning
• Automation
Port naming
• Optical
• Electrical
Allowed port locations
• Assembly
• Testing
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Standard layouts: rationale (I)
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Standards can cover• IO locations• IO specifications• Chip dimensions• Pad sizes
Reduced set of parameters
• avoid unnecessary reinvention
Enable
• Automated pre-package die testing
• Standardization of test protocols
• Generic assembly and packaging
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Standard layouts: rationale (II)
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Standards can cover• IO locations• IO specifications• Chip dimensions• Pad sizes
Reduced set of parameters
• avoid unnecessary reinvention
Enable
• Automated pre-package die testing
• Standardization of test protocols
• Generic assembly and packaging
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Automated pre-package die test (I)
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@ TU/e @ ficonTEC
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Automated pre-package die test (II)
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Repeatable < ±0.02 dB →< ±65 nm
• 64 source meters• 4 lensed fibers: 2 straight, 2 angled• 15 axis automated alignment
@ TU/e
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SummaryStandardization framework
Standardized file formats
• Enables exchange of data between all stakeholders
• Prevents errors
Standardized circuit layout template
• Enables automated testing
• Prevents errors
• Easy packaging of prototypes
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https://www.inpulse.jeppix.eu/
https://pixapp.eu/
http://openpics.jeppix.eu/
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