Telecommunication · 12V 3A 36/60W Power Adapter 90W or 96W power adapter (By SKU) Input AC...

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Telecommunication Innovative Platforms for Next Generation SDN/NFV Infrastructure Volume 17.1 www.lannerinc.com Singel 3 | B-2550 Kontich | Belgium | Tel. +32 (0)3 458 30 33 | [email protected] | www.alcom.be Rivium 1e straat 52 | 2909 LE Capelle aan den Ijssel | The Netherlands | Tel. +31 (0)10 288 25 00 | [email protected] | www.alcom.nl V. 7/17

Transcript of Telecommunication · 12V 3A 36/60W Power Adapter 90W or 96W power adapter (By SKU) Input AC...

Telecommunication Innovative Platforms for Next Generation SDN/NFV Infrastructure

Volume 17.1 www.lannerinc.comSingel 3 | B-2550 Kontich | Belgium | Tel. +32 (0)3 458 30 33 | [email protected] | www.alcom.be

Rivium 1e straat 52 | 2909 LE Capelle aan den Ijssel | The Netherlands | Tel. +31 (0)10 288 25 00 | [email protected] | www.alcom.nl

V. 7/17

2 www.lannerinc.com

www.lannerinc.com 3

Unleashing the Power of SDN/NFV for Future Telecom

Telecom service carriers are going through a transition from fixed-line,

proprietary hardware to advanced network software, such as SDN

and NFV, to provide their services and functions over the cloud. The

potential benefits include reduced CAPEX, flexible scalability, shorter

development time and lower investment risk for functional upgrades.

Since SDN and NFV are complementary and synergetic, the opportunity

around the network software will be more dynamic than ever for the

industry, and by 2020, it is expected the emergence of 5G specifications

will totally transform network serviceability.

As leading service providers have realized the benefits of SDN and NFV

in their business advantage, Lanner, the global supplier in networking

platforms, has taken the mission to assist operators in the transition

from traditional network infrastructures to today’s agile and flexible

architectures by supplying the optimal networking hardware for SDN

and NFV deployments in telecommunication services.

Lanner possesses rich expertise and experience in the design and

customization of network security platforms, covering vCPE, SD-WAN,

SD-Security, mobile edge computing and carrier-grade network security.

Throughout 30 years of establishment, Lanner has supplied millions

of custom solutions to help enterprises boost their competitiveness.

Since 2016, Lanner has formed partnerships with NTT Lagopus, Versa

Networks, Wind River Titanium Cloud, ENEA, NEC/Netcracker and

Ciena blueplanet, and earned TL 9000 certifications for telecom quality

management.

With the anticipation of 5G around 2020, it is expected that more

than 90% of service providers will be SDN/NFV ready, and Lanner is

determined to offer the optimal hardware solutions that will help clients

in their transitions to the software-based network infrastructures.

Jeans TsengGM of Telecommunication Application Business Unit

4 www.lannerinc.com

Solution Overview for SDN/NFV

With the advances in networking software like SDN and NFV, communication service providers and carriers

benefit from the flexibility and the agility to evolve their new services. Designed for next generation

network virtualization, Lanner provides carrier-grade, NEBS-compliant communication platforms featuring

extreme computing power, modular I/O flexibility, and full redundancy design. These high-availbility SDN/

NFV ready platforms are ideal to work as virtual CPE, NFVi appliance and edge router for today’s telecom

environments.

Network Platforms for Next-Gen SDNNFV Infrastructure

vCPE Edge Routing

vCPE devices for SD-Security, SD-WAN,

vADC and other VNF in access networks

Virtual edge routers for software defined

networking in cloud-radio access networks

Mobile Edge Computing Carrier-grade NFV

C-RAN computing platforms for video

transcoding services and Cyber Security VNFs

NFV-I ready platforms for telco central

offices, data centers in core networks

www.lannerinc.com 5

Lanner works with Intel and other software partners to build up open, integrated SDN/NFV-ready

solutions optimized for vCPE, SD-security, SD-WAN, mobile edge computing and other network

virtualization applications.

Accelerating your SDN/NFV Deployment

Intel

Lanner is an Associate Member of the Intel® Network Builders Partner, a community

of SDN/NFV developers, system integrators, OEMs and solution providers committed

to the development of modular, standards-based solutions on Intel® technologies.

Wind River™ Titanium Cloud

Wind River Titanium Server is a carrier grade NFV software infrastructure solution

designed to meet the stringent “always on” requirements by the telecom industry.

Versa Networks

Versa Networks is an innovative vendor in the SD-WAN and SD-Security market.

Versa solutions enable service providers and large enterprises to transform the WAN

and branch networks to achieve unprecedented business advantages.

NEC/Netcracker

The combined NEC/Netcracker entity brings together the best of NEC’s network

innovation with Netcracker’s IT leadership and telecom expertise to deliver

comprehensive, end-to-end SDN/NFV solutions in multi-domain and multi-vendor

environments.

ENEA

Enea is a global supplier of network software platforms and world class services, with

a vision of helping customers develop amazing functions in a connected society.

NTT/Lagopus

NTT Lagopus SDN software switch is an Open Source Software (OSS), which provides

a high-performance and flexible functionality suitable for data centers and wide area

network applications.

Blue Orbit

The first partnership program of its kind, the Blue Orbit Ecosystem is focused on

accelerating multi-vendor SDN and NFV deployments. Blue Orbit is a group of

like-minded organizations committed to supporting network operators’ ongoing

transformation to open, programmable, and virtualized networks.

Trend Micro

Trend Micro Incorporated, a global leader in cyber security solutions, helps to make

the world safe for exchanging digital information.

6 www.lannerinc.com

Virtual CPE Applications

Case Study: SD-WAN and SD-SecurityLanner works with Versa Networks to create an integrated solution that combines Lanner’s compact virtual

CPE appliances and Versa Networks’ highly-flexible SD-WAN and SD-Security software. The joint solution

enables managed service providers to centrally and cost-effectively manage a truly software-defined

WAN at their network customers’ sites, instead of the traditional investment in proprietary hardware and

hands-on management. The integration of Versa’s software-defined architecture and Lanner’s compact

virtual CPE hardware delivers flexibility and cost advantages for creating agile and profitable managed

services.

IT managers in charge of administering network services for most of today’s multi-location businesses are

expected to fulfill rules and levels of authentication based on the types of network services demanded by

the local offices or transnational branches. Building a more agile and flexible network ideal for delivering

not only dynamic services but also on-demand network functions requires full-featured virtual CPE solutions

that are specifically designed for bandwidth optimization and on-demand network function deployment.

Lanner offers desktop network appliances that enable software-defined, virtualized CPE applications for

branch office network to optimize efficiency while saving physical hardware cost.

Branches / Remote Sites Data Centers / Central Offices

Service Provider

EMS/NMS

SD-WANController

Self-care PortalSD-WAN CGNAT

IPS/AV NGFW RoutingApp ID

SD-Security

Internet

SD-WAN

IP/MPLS VPN

PerformanceManagement

SD-WAN Controller

Lanner SD-WAN-CPE 1

Lanner SD-WAN-CPE 2

FW-7525• Fanless Desktop• Intel Atom C2000 CPU• 4 to 6 GbE LAN Ports• QuickAssist Accceleration• LAN Bypass

NCA-4010• 1U Rackmount• Intel Xeon D-1500 SoC• 16x GbE LAN + 2x SFP Ports• DDR4 Memory Support• 1 NIC Slot

Rangeley Broadwell-DE

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Virtual CPE Applications vCPE Gateway: NCA-1611The NCA-1611 is a desktop vCPE platform powered by Intel’s D-1500 series SoC (Broadwell-DE-NS).

Incorporating with multi-core performance, Intel QuickAssist Technology and Virtualization Technology

(SR-IOV), NCA-1611 is designed for vCPE, SD-WAN, SE-Security and other network virtualization

application. The platform features up to 8 GbE ports plus 2 10GbE SFP+ ports, DDR4 2400MHz DIMM,

redundancy power supplies and 2 mini PCI-E for wireless connectivity.

Intel® Xeon® D-1500 SoC CPUThe Intel® Xeon® processor D-1500 product

family is Intel’s third-generation 64-bit system on

a chip (SOC). The Intel® Xeon® processor series

provides Intel® Virtualization Technology (VT-x &

VT-d) for flexible virtualization.

Intel QuickAssist TechnologyThis hardware-assisted security engine is not

only designed to optimize the cryptographic and

data compression applications, but also reserves

processor cycles for critical application processing

while improving overall system performance.

Advanced LAN BypassLAN bypass ports allow uninterrupted network

traffic even if a single in-line appliance is shut down

or hangs. Lanner’s engineers have improved on

standard bypass functionality to provide higher

reliability and more flexible control.

Wireless RF Connectivity Lanner vCPE gateway feature mini-PCIe expansion

slots, which support Wi-Fi/3G/LTE RF modules

and external antenna for wireless network

connectivity.

Redundant Power SuppliesMany top-of-the-line network appliances utilize

dual power supplies to ensure a constant flow of

power. These appliances need to run 24/7 and

every failure can cost tremendously. Therefore,

smart network maintenance experts utilize dual

power supplies to make sure these appliances

never fail.

Rack Mounting KitsFor mounting flexibility, Lanner vCPE gateway are

compatible with rack mount options for suitable

installation in any environment setting.

8 www.lannerinc.com

Carrier-grade NFV Solutions

Case Study: Virtual Network Security in Carrier-grade NFV Lanner’s carrier-grade HTCA-series platforms are pre-intergated with Wind River Titanium Server NFV

infrastructure (NFVI) software platform and Trend Micro’s Virtual Network Function Suite, to present high

availability, scale-on-demand network security function for CSPs from premise, edge to core network.

To ensure carrier-grade up-time and the high levels of reliability mandated by telecom networks, Lanner’s

NFV-ready platforms have undergone a comprehensive testing and validation process with the Wind River

Titanium Cloud NFV infrastructure (NFVI) software solution. The validation process was conducted as part

of the Wind River Titanium Cloud ecosystem program dedicated to accelerate the time-to-deployment

of carrier-grade NFV solutions. Through the validation and pre-integration of industry-leading NFV ready

hardware and software, Lanner is able to deliver carrier-grade network platforms optimized for NFV

deployment, and service providers and TEMs can also be confident in selecting validated vendors in the

ecosystem for rapid service deployment.

HTCA-6600• 6U Rackmount• 6x Compute Blades & I/O Blades• Dual Intel Xeon E5-2600v4 CPU & DDR4 Memory per Blade• BCM56854/56860/56960 Switch Fabric

FW-8896• 2U Rackmount• Dual Intel® Xeon E5-2600v4 • 8 NIC Slots • 2 Swappable Drive Bays• Redundant PSUs

HTCA-6200FW-8896 +

Wind RiverTitanium Cloud

Virtual Network Function Suite

Virtual Network Functions (VNFs)

Element Management System (EMS)

AN INTEL COMPANY

VMvIPS

VMvURLF

VMvDPI

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NFVi-ready Appliance: HTCA-6600

Validation

NEBS and FIPS compliance

High Availability

- Hot plug & hot-swap

- Redundant PSU & fans

- Rich IPMI manageability

Multiple Computing Blades

Multicore computing capability with

dual Intel® Xeon® CPUs for each blade

Switching Capacity

- Packet load balancing

- Blade communications

Fully Modular Design

A wide range of computing and

networking blades available

Control Panel

Middle Plane

Storage

SATA HDD bay for

each MB blade

x4x2

x6

Full Redundancy and High AvailabilityAll CPU blade, network I/O blades, N+1 cooling

fans and power supply units are in full-redundancy

design to ensure carrier-grade high-availability

and 99.9999% uptimes.

NEBS ComplianceLanner appliances are compliant with NEBS

design to meet the key carrier-grade requirements

required for telecom network.

PCI-Express and Storage OptionsTo meet the requirements for open compute

architecture, Lanner appliances can support up to

6 3.5” or 12 2.5” HDD/SSD storage drives and 6

PCIe slots for expansion with acceleration cards.

Multiple Computing BladesOffering extreme performance and processing

power, Lanner’s advanced network appliances

can host up to 6 CPU blades, supporting up to

12 dual Intel® Xeon® processor E5-2699v4 CPUs

with a total of 264 cores.

Fully Modular Network I/O BladesLanner’s advanced network appliances feature up

to 6 front-cabling, swappable network I/O blades.

The top 2 blade slots are reserved for switch or

Ethernet NI blades, while the other 4 slots are

solely used for Ethernet NI blades.

High-speed Switching Capacity To meet the requirement of carrier-grade

network traffic, Lanner leverages the latest

packet processors to offer 100GbE high speed

throughputs with capacity up to 1.2Tbps.

10 www.lannerinc.com

Virtual Edge Routing

The driving force of the network by moving VNF’s from the core infrastructure towards the edge and the

introduction of packaged services introduces specific requirements to sustain the control and data plane

traffic with reduced latency at the edge deployment.

The edge computing and intelligent gateway architecture require the capabilities to tremendous volume

of traffic for real-time pre-processing, data analytics, policy control, communication and messaging to

connect, collect and manage the devices to the network. Therefore, the edge routing platform requires

the following layers:

1) Control Layer

2) Infrastructure Layer

3) Application Layer

With the rollout of the CORD network infrastructure, the Virtual Edge Routing Platform requires to:

- Perform L3 unicast routing to and from the Central Office and participate in dynamic routing protocols

- Multicast signaling and forwarding

- Apply Quality of Service (QoS) policies

- Support and apply NAT functionalities

Lanner Solution on Virtual Edge RoutingThe architecture of the HTCA-1000 platform contains the framework of all three elements for edge routing

in a form factor suitable for edge deployments. Furthermore, the high switching and routing capacity in

combination of the control and infrastructure processing architecture makes it the ideal platform for

Virtual Edge Routing towards the deployment of a SDN foundation to the future of 5G telecom.

HTCA-1000• Carrier-grade Switch Based on BCM StrataDNX™• Intel Atom™ C2758 Processor (Rangeley)• BCM8867x (Jericho) with 720G~1.2Tbps Capacity• 4 x NIM Module Slots, Max. 32 x 10G or 6 x 100G Cages

Current

Access Network Core Network

CRCE

CE

PEAccess

NetworkPE

CE

CE

CR

CR

CR

SDN ControllerFuture

Access Network Core Network

Access Network

Router

Router

Router

Router

Router

Router

Switch

SVR

NFV

Switch

SVR

NFV

Switch

Switch

Switch

Switch

• 1G, 10G and 100G I/F, 100G to 1T switching• IPv4/IPv6 Routing, ECMP, Multicast, NAT• MPLS LER (3 labels, IP-VPN, VPWS, VPLS,FRR)• High performance QoS and OAM• Other service functions (Firewall, IPS/IDS, DPI, etc.)

Edge Router Function:

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Mobile Edge Computing

As the European Telecommunications Standards Institute (ETSI) led initiative in its adoption phase, the

requirements to roll out new services to the edge in the network have coined and there are several

deployments and business models for the Mobile Edge Computing (MEC) platforms. Ultimately, processing,

storage, media streaming and security functions have been migrated to the edge for mobile deployments.

With the introduction of IoT consisting of multiple vertical networks within the core network infrastructure,

Mobile Edge Computing defines a set of requirements to roll out new services. Since form factor, processing

and storage capabilities are the key elements in mobile network, Network Service Chaining and Service

Chain Provisioning are becoming the new business model with NFV deployments.

Lanner Solution on Mobile Edge ComputingWith its modularity and capability to meet the edge requirements, the Lanner portfolio is combining

multiple functionalities within the same platforms. Therefore the platforms are not only limited for general

compute but also optimized for media processing, storage and switching. The variants cover in-door edge

deployments, NEBS qualified and rugged gateway platforms.

HTCA-6200• 2U HybridTCA™ Carrier-grade SDN/NFV Appliance• 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® E5-2690 v3/v4 CPUs and 16x DDR4• BCM StrataXGS™ Trident-II/II+ BCM56854/56860 Switch Fabric with 720/1280 Gbps• 2 x Blade Slots in the Front (Switch blade or NIC blade)• N+1 Redundant PSUs & 5x Heavy-duty Swappable Fans• NEBS Design Compliance

Internet

NFV Platform

Fixed Access Network

Mobile Access Network

SDNServiceClassifier

ServiceClassifier

Firewall

Parental Control

Antivirus

Video Optimizer

12 www.lannerinc.com

Desktop Network Appliances

Feature Description NCA-1011 NCA-1020 NCA-1031 NCA-1210 FW-7525 FW-7551 NCA-1611

Form Factor Fanless Desktop Fanless Desktop Desktop Desktop Fanless Desktop Desktop Desktop

Platform

Processor Options Intel® Celeron® J1900 (Bay Trail) Intel® Celeron® N3010 (Braswell)Intel® Atom™ x7-E3950 / x5-E3930 (Apollo Lake)

Intel® Atom™ C2358/C2558 (Rangeley)Intel® Atom™ C2358/C2518/C2558(Rangeley)

Intel® Atom™ C2358/C2518/C2758 (Rangeley)

Intel® Xeon D-1500 (Broadwell-DE NS)

CPU Socket onboard onboard onboard onboard onboard onboard onboard

Chipset SoC SoC SoC SoC SoC SoC SoC

Security Acceleration N/A N/A N/A Intel QuickAssist Technology Intel QuickAssist Technology Intel® QuickAssist Technology Intel QuickAssist Technology

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

Technology DDR3L 1333 MHz UDIMM DDR3L 1600 MHz UDIMM DDR3L 1866 MHz UDIMM DDR3 1333/1600 MHz UDIMM DDR3 1333/1600 MHz UDIMM DDR3 1333 /1600 MHz ECC DIMM DDR4 2400 MHz DIMM

Max. Capacity 8 GB 8 GB 8 GB 16 GB 8 GB 8 GB RDIMM:128 GB, UDIMM: 64 GB

Socket 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 or 2 x 204pin SODIMM (By SKU) 4 x 288-pin DIMM

Networking

Ethernet Ports 5 x GbE RJ-45 Intel® i211 3 x RJ45 GbE Intel® i211 6 or 5 x GbE RJ45 Intel® i211 4 x GbE RJ45 Intel® SoC Integrated i3544 x GbE RJ45 Intel® SoC Integrated i3542 x GbE RJ45 Intel® i210 (By SKU)

4 x GbE RJ45 Intel® SoC Integrated i354; 2 x GbE RJ45 Intel® i210 (By SKU)

8 x GbE RJ45 Intel® SoC Integrated i3502 x 10GbE SFP+ CS4227

Bypass 2 pairs Gen3 (By SKU) 1 pair Gen3 2 pairs Gen3 (By SKU) 1 pair Gen3 (By SKU) 1 pair Gen2 (By SKU) 2 pairs Gen2 (By SKU) 1 pair Gen3

NIC Module Slot N/A N/A N/A N/A N/A N/A N/A

LOMI/O Interface N/A N/A N/A N/A N/A N/A 1 x RJ45 (Optional) *Share with ETH0

OPMA Slot N/A N/A N/A N/A N/A N/A Yes

I/O Interface

Reset Button 1 1 1 1 1 1 1

LED Power/Status/Storage Power LED on power button Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 1 1 1 1 1 1

Console 1 x RJ-45 1 x RJ45 1 x RJ-45 1 x RJ-45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 2.0 1 x USB 2.0, 1 x USB 3.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 3.0

LCD Module N/A N/A N/A N/A N/A N/A N/A

Display 1 x VGA (By Project) 1 x HDMI 1 x HDMI N/A N/A N/A N/A

Power Input 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack

StorageHDD/SSD Support 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay - SSD Only (By SKU) 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional)

Onboard Storage 1 x mSATA mini 1 x mSATA mini 1 x mSATA 1 x SATA DOM 1 x Type II CF 1 x Type II CF (Optional) 1 x 16GB EMMC

ExpansionPCIe N/A N/A N/A N/A N/A N/A N/A

mini-PCIe N/A 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (By SKU) 2 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe Half Size (PCIe/USB2.0)(By SKU) 2 x Mini-PCIe (PCIe/USB2.0)

Miscellaneous

Watchdog Yes Yes Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes Yes

TPM Yes (Project Based) Yes (Optional) Yes Yes Yes (By SKU) Yes (By Project) Yes

CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passisve CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System Fanless Fanless 1 x cooling fan or fanless 1 x cooling fan or fanless (By Project) Fanless 1 x cooling fan with smart fan 3 x cooling fans with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~50ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxHxD) 230 x 44 x 170 mm 137 x 36 x 120 mm 230 x 44 x 170 mm 185 x 44 x 137 mm 177 x 44 x 146 mm 231 x 44 x 200 mm 275 x 44 x 310 mm

Weight 1.2 kg 0.5 kg 1.2 kg 1 kg 1.5 kg 1.2 kg 5 kg

PackageDimensions

(WxHxD) 518 x 264 x 391 mm 426 x 252 x 282 mm 518 x 264 x 391 mm 312 x 280 x 140 mm 270 x 250 x 120 mm 325 x 305 x 120 mm 325 x 305 x 120 mm

Weight 10 kg (4 in 1) 8.5kg (10 in 1) 10 kg (4 in 1) 1.8 kg 2 kg 2.2 kg 6 kg

PowerType / Watts 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 36W or 60W power adapter (By SKU) 12V 3A 36/60W Power Adapter 90W or 96W power adapter (By SKU)

Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz

Approvals and Compliance RoHS, CE/FCC Class B RoHS, CE/FCC Class B RoHS RoHS, CE/FCC Class B RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B

www.lannerinc.com 13

Feature Description NCA-1011 NCA-1020 NCA-1031 NCA-1210 FW-7525 FW-7551 NCA-1611

Form Factor Fanless Desktop Fanless Desktop Desktop Desktop Fanless Desktop Desktop Desktop

Platform

Processor Options Intel® Celeron® J1900 (Bay Trail) Intel® Celeron® N3010 (Braswell)Intel® Atom™ x7-E3950 / x5-E3930 (Apollo Lake)

Intel® Atom™ C2358/C2558 (Rangeley)Intel® Atom™ C2358/C2518/C2558(Rangeley)

Intel® Atom™ C2358/C2518/C2758 (Rangeley)

Intel® Xeon D-1500 (Broadwell-DE NS)

CPU Socket onboard onboard onboard onboard onboard onboard onboard

Chipset SoC SoC SoC SoC SoC SoC SoC

Security Acceleration N/A N/A N/A Intel QuickAssist Technology Intel QuickAssist Technology Intel® QuickAssist Technology Intel QuickAssist Technology

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

Technology DDR3L 1333 MHz UDIMM DDR3L 1600 MHz UDIMM DDR3L 1866 MHz UDIMM DDR3 1333/1600 MHz UDIMM DDR3 1333/1600 MHz UDIMM DDR3 1333 /1600 MHz ECC DIMM DDR4 2400 MHz DIMM

Max. Capacity 8 GB 8 GB 8 GB 16 GB 8 GB 8 GB RDIMM:128 GB, UDIMM: 64 GB

Socket 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 x 204-pin SODIMM 1 or 2 x 204pin SODIMM (By SKU) 4 x 288-pin DIMM

Networking

Ethernet Ports 5 x GbE RJ-45 Intel® i211 3 x RJ45 GbE Intel® i211 6 or 5 x GbE RJ45 Intel® i211 4 x GbE RJ45 Intel® SoC Integrated i3544 x GbE RJ45 Intel® SoC Integrated i3542 x GbE RJ45 Intel® i210 (By SKU)

4 x GbE RJ45 Intel® SoC Integrated i354; 2 x GbE RJ45 Intel® i210 (By SKU)

8 x GbE RJ45 Intel® SoC Integrated i3502 x 10GbE SFP+ CS4227

Bypass 2 pairs Gen3 (By SKU) 1 pair Gen3 2 pairs Gen3 (By SKU) 1 pair Gen3 (By SKU) 1 pair Gen2 (By SKU) 2 pairs Gen2 (By SKU) 1 pair Gen3

NIC Module Slot N/A N/A N/A N/A N/A N/A N/A

LOMI/O Interface N/A N/A N/A N/A N/A N/A 1 x RJ45 (Optional) *Share with ETH0

OPMA Slot N/A N/A N/A N/A N/A N/A Yes

I/O Interface

Reset Button 1 1 1 1 1 1 1

LED Power/Status/Storage Power LED on power button Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 1 1 1 1 1 1

Console 1 x RJ-45 1 x RJ45 1 x RJ-45 1 x RJ-45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 2.0 1 x USB 2.0, 1 x USB 3.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 3.0

LCD Module N/A N/A N/A N/A N/A N/A N/A

Display 1 x VGA (By Project) 1 x HDMI 1 x HDMI N/A N/A N/A N/A

Power Input 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack

StorageHDD/SSD Support 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay - SSD Only (By SKU) 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional)

Onboard Storage 1 x mSATA mini 1 x mSATA mini 1 x mSATA 1 x SATA DOM 1 x Type II CF 1 x Type II CF (Optional) 1 x 16GB EMMC

ExpansionPCIe N/A N/A N/A N/A N/A N/A N/A

mini-PCIe N/A 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (By SKU) 2 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe Half Size (PCIe/USB2.0)(By SKU) 2 x Mini-PCIe (PCIe/USB2.0)

Miscellaneous

Watchdog Yes Yes Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes Yes

TPM Yes (Project Based) Yes (Optional) Yes Yes Yes (By SKU) Yes (By Project) Yes

CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passisve CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System Fanless Fanless 1 x cooling fan or fanless 1 x cooling fan or fanless (By Project) Fanless 1 x cooling fan with smart fan 3 x cooling fans with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~50ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxHxD) 230 x 44 x 170 mm 137 x 36 x 120 mm 230 x 44 x 170 mm 185 x 44 x 137 mm 177 x 44 x 146 mm 231 x 44 x 200 mm 275 x 44 x 310 mm

Weight 1.2 kg 0.5 kg 1.2 kg 1 kg 1.5 kg 1.2 kg 5 kg

PackageDimensions

(WxHxD) 518 x 264 x 391 mm 426 x 252 x 282 mm 518 x 264 x 391 mm 312 x 280 x 140 mm 270 x 250 x 120 mm 325 x 305 x 120 mm 325 x 305 x 120 mm

Weight 10 kg (4 in 1) 8.5kg (10 in 1) 10 kg (4 in 1) 1.8 kg 2 kg 2.2 kg 6 kg

PowerType / Watts 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 36W or 60W power adapter (By SKU) 12V 3A 36/60W Power Adapter 90W or 96W power adapter (By SKU)

Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz

Approvals and Compliance RoHS, CE/FCC Class B RoHS, CE/FCC Class B RoHS RoHS, CE/FCC Class B RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B

14 www.lannerinc.com

Rackmount Network Appliances

Feature Description NCA-2510 NCA-4010 NCA-4210 NCA-5210 NCA-5510

Form Factor 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount

Platform

Processor Options Intel® Atom™ C3000, 8~16 Cores (Denverton) Intel® Xeon® D-1500 4~16 Cores (Broadwell-DE)The 6/7th Intel® Core™ i7/i5/i3 or Pentium® or Celeron® (Skylake/Kaby Lake)

Intel® Xeon® E3-1200v5/v6 or the 6/7th Core™ i7/i5/i3 or Pentium® or Celeron® (Skylake/Kaby Lake)

Intel® Xeon® E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

CPU Socket onboard onboard 1 x LGA1151 1 x LGA1151 1 x LGA2011-R3

Chipset SoC SoC Intel® H110 or C236 Intel® C236 Intel® C612

Security Acceleration Intel® QuickAssist Technology N/A N/A N/A N/A

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

TechnologyDDR4 2400MHz ECC or non-ECC UDIMM

DDR4 2400MHz REG, ECC or non-ECC UDIMM

DDR4 2400MHz ECC(By CPU for C236 only) or non-ECC UDIMM

DDR4 2400MHzECC(By CPU) or non-ECC UDIMM

DDR4 2133/2400MHz REG DIMM

Max. Capacity 32GB ECC:32GB RDIMM:64GB 32GB 64GB 256GB

Socket 4 x 288pin DIMM 2 x 288pin DIMM 2 x 288pin DIMM 4 x 288pin DIMM 8 x 288pin DIMM

Networking

Ethernet Ports1 x GbE RJ45 Intel® i2104 x GbE RJ-45 Intel® i350-AM44 SFP+ Intel® Denverton Integrated (By SKU)

8 x GbE RJ45 Intel® i2108 x GbE RJ45 Intel® i350-AM4 (By SKU)2 x 10G SFP+ Broadwell-DE SOC (By SKU)

6 x GbE RJ45 Intel® i2102 x GbE SFP Intel® i210-IS (SKU B/C)8 x GbE RJ45 Intel® i210 (SKU C)

1 x GbE RJ45 Intel® i210 / 8 x GbE RJ45 Intel® i210 (SKU A) 12 x GbE RJ45 Intel® i350-AM4 + 4 x GbE SFP Intel® i350-AM4 (SKU B)4 NIC modules (SKU C)

1 x GbE RJ45 Intel® i210

Bypass 2 pairs Gen3 (By SKU) 3 or 7 pairs Gen3 (By SKU) 2 pairs Gen3 (By SKU) up to 6 pairs Gen3 (By SKU) Depends on NIC module specifications

NIC Module Slot 1 1 1 2 or 4 (By SKU) 4

LOMI/O Interface 1 x RJ45 (By SKU) 1 x RJ45 (By Project) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0

OPMA Slot N/A Yes (By Project) Yes Yes Yes

I/O Interface

Reset Button 1 1 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 3.0 2 x USB 2.0 2 x USB 3.0 2 x USB 3.0 2 x USB 2.0

LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads

Display From OPMA slot (Optional) From OPMA slot (By Project) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)

Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU

StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bays

Onboard Storage 1 x mSATA 1 x mSATA 1 x mSATA 1 x mSATA 1 x CFast

ExpansionPCIe 1 x PCI-E*8 HH/HL (Optional) 1 x PCI-E*8 FH/HL (Optional) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (Optional)

mini-PCIe N/A N/A N/A N/A N/A

Miscellaneous

Watchdog Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes

TPM Yes (optional) Yes (optional) Yes (optional) Yes (optional) Yes (optional)

CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System 2 x cooling fans with smart fan 2 x cooling fans with smart fan 2 x cooling fans with smart fan 4 x cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxDxH) 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 525 x 44 mm 438 x 580 x 44 mm

Weight 7 kg 7.5 kg 7.5 kg 15 kg 16.5 kg

PackageDimensions

(WxDxH) 540 x 500 x 230 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm

Weight 8 kg 8.5 kg 8.5 kg 16 kg 18 kg

PowerType / Watts 220W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 300W 1+1 ATX Redundant PSUs 300W 1+1 ATX Redundant PSUs

Input AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz

Approvals and Compliance RoHS RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL

www.lannerinc.com 15

Feature Description NCA-2510 NCA-4010 NCA-4210 NCA-5210 NCA-5510

Form Factor 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount

Platform

Processor Options Intel® Atom™ C3000, 8~16 Cores (Denverton) Intel® Xeon® D-1500 4~16 Cores (Broadwell-DE)The 6/7th Intel® Core™ i7/i5/i3 or Pentium® or Celeron® (Skylake/Kaby Lake)

Intel® Xeon® E3-1200v5/v6 or the 6/7th Core™ i7/i5/i3 or Pentium® or Celeron® (Skylake/Kaby Lake)

Intel® Xeon® E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

CPU Socket onboard onboard 1 x LGA1151 1 x LGA1151 1 x LGA2011-R3

Chipset SoC SoC Intel® H110 or C236 Intel® C236 Intel® C612

Security Acceleration Intel® QuickAssist Technology N/A N/A N/A N/A

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

TechnologyDDR4 2400MHz ECC or non-ECC UDIMM

DDR4 2400MHz REG, ECC or non-ECC UDIMM

DDR4 2400MHz ECC(By CPU for C236 only) or non-ECC UDIMM

DDR4 2400MHzECC(By CPU) or non-ECC UDIMM

DDR4 2133/2400MHz REG DIMM

Max. Capacity 32GB ECC:32GB RDIMM:64GB 32GB 64GB 256GB

Socket 4 x 288pin DIMM 2 x 288pin DIMM 2 x 288pin DIMM 4 x 288pin DIMM 8 x 288pin DIMM

Networking

Ethernet Ports1 x GbE RJ45 Intel® i2104 x GbE RJ-45 Intel® i350-AM44 SFP+ Intel® Denverton Integrated (By SKU)

8 x GbE RJ45 Intel® i2108 x GbE RJ45 Intel® i350-AM4 (By SKU)2 x 10G SFP+ Broadwell-DE SOC (By SKU)

6 x GbE RJ45 Intel® i2102 x GbE SFP Intel® i210-IS (SKU B/C)8 x GbE RJ45 Intel® i210 (SKU C)

1 x GbE RJ45 Intel® i210 / 8 x GbE RJ45 Intel® i210 (SKU A) 12 x GbE RJ45 Intel® i350-AM4 + 4 x GbE SFP Intel® i350-AM4 (SKU B)4 NIC modules (SKU C)

1 x GbE RJ45 Intel® i210

Bypass 2 pairs Gen3 (By SKU) 3 or 7 pairs Gen3 (By SKU) 2 pairs Gen3 (By SKU) up to 6 pairs Gen3 (By SKU) Depends on NIC module specifications

NIC Module Slot 1 1 1 2 or 4 (By SKU) 4

LOMI/O Interface 1 x RJ45 (By SKU) 1 x RJ45 (By Project) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0

OPMA Slot N/A Yes (By Project) Yes Yes Yes

I/O Interface

Reset Button 1 1 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 3.0 2 x USB 2.0 2 x USB 3.0 2 x USB 3.0 2 x USB 2.0

LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads

Display From OPMA slot (Optional) From OPMA slot (By Project) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)

Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU

StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bays

Onboard Storage 1 x mSATA 1 x mSATA 1 x mSATA 1 x mSATA 1 x CFast

ExpansionPCIe 1 x PCI-E*8 HH/HL (Optional) 1 x PCI-E*8 FH/HL (Optional) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (Optional)

mini-PCIe N/A N/A N/A N/A N/A

Miscellaneous

Watchdog Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes

TPM Yes (optional) Yes (optional) Yes (optional) Yes (optional) Yes (optional)

CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System 2 x cooling fans with smart fan 2 x cooling fans with smart fan 2 x cooling fans with smart fan 4 x cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxDxH) 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 525 x 44 mm 438 x 580 x 44 mm

Weight 7 kg 7.5 kg 7.5 kg 15 kg 16.5 kg

PackageDimensions

(WxDxH) 540 x 500 x 230 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm

Weight 8 kg 8.5 kg 8.5 kg 16 kg 18 kg

PowerType / Watts 220W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 300W 1+1 ATX Redundant PSUs 300W 1+1 ATX Redundant PSUs

Input AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz

Approvals and Compliance RoHS RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL

16 www.lannerinc.com

Rackmount Network Appliances

Feature Description FW-7571 FW-7573 FW-7584 FW-7585 UP-2010

Form Factor 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount

Platform

Processor Options Intel® Atom™ C2358 (Rangeley) Intel® Atom™ C2758/C2518 (Rangeley) Intel® Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell) Intel® Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell) Intel® Atom™ C2758 (Rangeley)

CPU Socket onboard onboard 1 x LGA1150 1 x LGA1150 onboard

Chipset SoC SoC Intel® H81 Intel® C226 SoC

Security Acceleration Intel® QuickAssist Technology Intel® QuickAssist Technology N/A N/A Intel® QuickAssist Technology

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

Technology DDR3 1333MHz ECC or non-ECC UDIMM DDR3 1333/1600MHz ECC or non-ECC UDIMM DDR3 1333/1600MHz non-ECC UDIMM DDR3 1333/1600MHz non-ECC UDIMM DDR3 1333MHz ECC or UDIMM

Max. Capacity 8GB 16GB 16GB 16GB 16GB

Socket 2 x 240pin DIMM 2 x 240pin DIMM 2 x 240pin DIMM 2 x 240pin DIMM 2 x 240pin DIMM

Networking

Ethernet Ports4 x GbE RJ45 Intel® SoC Integrated i3542 x GbE RJ45 Intel® i210 (By SKU)

4 x GbE RJ45 Intel® SoC Integrated i3542 x GbE RJ45 Intel® i210 (By SKU)

6 x GbE RJ45 Intel® i2101 x GbE RJ45 Intel® i217 PHY7 x GbE RJ45 Intel® i210

24 x GbE RJ45 (8 w/PoE) Marvell® 98DX3035 2 x 10G SFP+ Intel 82599

Bypass 2 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) N/A

NIC Module Slot N/A 1 N/A N/A N/A

LOMI/O Interface N/A N/A N/A N/A N/A

OPMA Slot N/A N/A N/A N/A N/A

I/O Interface

Reset Button 1 1 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0

LCD Module N/A 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads N/A

Display N/A N/A Optional N/A N/A

Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU

StorageHDD/SSD Support 2 x 2.5” Bays or 1x 3.5” (Optional) 2 x 2.5” Bays 2 x 2.5” Bays or 1x 3.5” (Optional) 2 x 2.5” Bay or 1x 3.5” (Optional) N/A

Onboard Storage 1 x Type II CF 1 x Type II CF 1 x Type II CF 1 x Type II CF 1 x Type II CF

ExpansionPCIe 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) N/A

mini-PCIe N/A N/A N/A N/A N/A

Miscellaneous

Watchdog Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes

TPM Yes (By Project) Yes (By SKU) Yes (By Project) Yes (By Project) Yes

CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System 1 x cooling fan with smart fan 1 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxDxH) 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 366 x 44 mm

Weight 6 kg 6.5 kg 7 kg 7 kg 8.2 kg

PackageDimensions

(WxDxH) 540 x 510 x 215 mm 540 x 510 x 215 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 554 x 485 x 215 mm

Weight 7 kg 7.5 kg 8 kg 8 kg 10 kg

PowerType / Watts 100W ATX Single PSU 150W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 500W Single PSU(Redundant optional)

Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 50~60 Hz

Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS

www.lannerinc.com 17

Feature Description FW-7571 FW-7573 FW-7584 FW-7585 UP-2010

Form Factor 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount

Platform

Processor Options Intel® Atom™ C2358 (Rangeley) Intel® Atom™ C2758/C2518 (Rangeley) Intel® Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell) Intel® Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell) Intel® Atom™ C2758 (Rangeley)

CPU Socket onboard onboard 1 x LGA1150 1 x LGA1150 onboard

Chipset SoC SoC Intel® H81 Intel® C226 SoC

Security Acceleration Intel® QuickAssist Technology Intel® QuickAssist Technology N/A N/A Intel® QuickAssist Technology

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

Technology DDR3 1333MHz ECC or non-ECC UDIMM DDR3 1333/1600MHz ECC or non-ECC UDIMM DDR3 1333/1600MHz non-ECC UDIMM DDR3 1333/1600MHz non-ECC UDIMM DDR3 1333MHz ECC or UDIMM

Max. Capacity 8GB 16GB 16GB 16GB 16GB

Socket 2 x 240pin DIMM 2 x 240pin DIMM 2 x 240pin DIMM 2 x 240pin DIMM 2 x 240pin DIMM

Networking

Ethernet Ports4 x GbE RJ45 Intel® SoC Integrated i3542 x GbE RJ45 Intel® i210 (By SKU)

4 x GbE RJ45 Intel® SoC Integrated i3542 x GbE RJ45 Intel® i210 (By SKU)

6 x GbE RJ45 Intel® i2101 x GbE RJ45 Intel® i217 PHY7 x GbE RJ45 Intel® i210

24 x GbE RJ45 (8 w/PoE) Marvell® 98DX3035 2 x 10G SFP+ Intel 82599

Bypass 2 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) N/A

NIC Module Slot N/A 1 N/A N/A N/A

LOMI/O Interface N/A N/A N/A N/A N/A

OPMA Slot N/A N/A N/A N/A N/A

I/O Interface

Reset Button 1 1 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0

LCD Module N/A 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads N/A

Display N/A N/A Optional N/A N/A

Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU

StorageHDD/SSD Support 2 x 2.5” Bays or 1x 3.5” (Optional) 2 x 2.5” Bays 2 x 2.5” Bays or 1x 3.5” (Optional) 2 x 2.5” Bay or 1x 3.5” (Optional) N/A

Onboard Storage 1 x Type II CF 1 x Type II CF 1 x Type II CF 1 x Type II CF 1 x Type II CF

ExpansionPCIe 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) N/A

mini-PCIe N/A N/A N/A N/A N/A

Miscellaneous

Watchdog Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes

TPM Yes (By Project) Yes (By SKU) Yes (By Project) Yes (By Project) Yes

CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System 1 x cooling fan with smart fan 1 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxDxH) 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 366 x 44 mm

Weight 6 kg 6.5 kg 7 kg 7 kg 8.2 kg

PackageDimensions

(WxDxH) 540 x 510 x 215 mm 540 x 510 x 215 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 554 x 485 x 215 mm

Weight 7 kg 7.5 kg 8 kg 8 kg 10 kg

PowerType / Watts 100W ATX Single PSU 150W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 500W Single PSU(Redundant optional)

Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 50~60 Hz

Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS

18 www.lannerinc.com

Rackmount Network Appliances

Feature Description FW-8759 FW-8771 FW-8877 FW-8894 FW-8895 FW-8896

Form Factor 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 2U 19” Rackmount 2U 19” Rackmount

Platform

Processor OptionsIntel® Xeon® E3-1200 v3 or Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell)

Intel® Xeon® E3-1200 v3 or Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell)

Intel® Xeon® E5-2600 v1/v2(Sandy/Ivy Bridge-EP)

Intel® Xeon® E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Intel® Xeon® E5-2600 v1/v2 (Sandy/Ivy Bridge-EP)

Intel® Xeon® E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

CPU Socket 1 x LGA1150 1 x LGA1150 1 x LGA2011 2 x LGA2011-R3 2 x LGA2011 2 x LGA2011-R3

Chipset Intel® C226 Intel® C226 Intel® C600 Intel® C612 Intel® C600 Intel® C612

Security Acceleration N/A N/A N/A Intel® QuickAssist Technology (By SKU) Cavium CN1620 (By SKU) Intel® QuickAssist Technology (By SKU)

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

TechnologyDDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM

DDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM

DDR3 1333/1600MHz REG, ECC or non-ECC UDIMM

DDR4 2133/2400MHz REG DIMM

DDR3 1333/1600MHz REG or ECC DIMM

DDR4 2133/2400MHz REG DIMM

Max. Capacity 16GB 32GB 64GB 512GB 128GB 512GB

Socket 2 x 240pin DIMM 4 x 240pin DIMM 8 x 240pin DIMM 16 x 288pin DIMM 16 x 240pin DIMM 16 x 288pin DIMM

Networking

Ethernet Ports1 x GbE RJ45 Intel® i217 PHY7 x GbE RJ45 Intel® i210

8 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® 82574L 1 x GbE RJ45 Intel® i210

Bypass 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications

NIC Module Slot 1 2 (By SKU) 4 4 8 8

LOMI/O Interface 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0

OPMA Slot Yes (By Project) Yes Yes Yes Yes Yes

I/O Interface

Reset Button 1 1 1 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 2.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0

LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads

Display From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)

Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU

StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bay 1 x 3.5” or 2 x 2.5” bay 2 x 3.5” bay (SKU A/B) or 4 x 3.5” bay (SKU C/D)

1 x 3.5” or 2 x 2.5” internal bay (SKU A/B/C/D)2 x 2.5” external accessible tray (SKU E/F/G/H)

Onboard Storage 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast

ExpansionPCIe 1 x PCI-E*8 FH/HL (optional) 2 x PCI-E*4 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) N/A 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional)

mini-PCIe N/A N/A N/A N/A N/A N/A

Miscellaneous

Watchdog Yes Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes

TPM Yes (By Project) Yes (By SKU) Yes (By Project) Yes (Optional) Yes (By SKU) Yes (Optional)

Cooling

Processor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System 3 x cooling fans with smart fan 3 x cooling fans with smart fan4 x individual hot-swappable cooling fans with smart fan

4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxDxH) 431 x 415 x 44 mm 431 x 468 x 44 mm 438 x 580 x 44 mm 438 x 630 x 44 mm 444 x 600 x 88 mm 444 x 600 x 88 mm

Weight 11.5 kg 12.5 kg 16.5 kg 16.5 kg 24 kg 24 kg

PackageDimensions

(WxDxH) 570 x 530 x 240 mm 735 x 595 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm 825 x 600 x 270 mm 825 x 600 x 270 mm

Weight 12.5 kg 13.5 kg 18 kg 18 kg 26 kg 26 kg

PowerType / Watts

220W ATX Single PSU or 300W 1+1 ATX Redundant PSUs

270W ATX Single PSU or300W 1+1 ATX Redundant PSUs

400W 1+1 ATX Redundant PSUs 650W 1+1 ATX Redundant PSUs 600W 1+1 ATX Redundant PSUs 600W/800W 1+1 ATX Redundant PSUs

Input AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz

Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL

www.lannerinc.com 19

Feature Description FW-8759 FW-8771 FW-8877 FW-8894 FW-8895 FW-8896

Form Factor 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 1U 19” Rackmount 2U 19” Rackmount 2U 19” Rackmount

Platform

Processor OptionsIntel® Xeon® E3-1200 v3 or Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell)

Intel® Xeon® E3-1200 v3 or Core™ i7/i5/i3 or Pentium® or Celeron® (Haswell)

Intel® Xeon® E5-2600 v1/v2(Sandy/Ivy Bridge-EP)

Intel® Xeon® E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Intel® Xeon® E5-2600 v1/v2 (Sandy/Ivy Bridge-EP)

Intel® Xeon® E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

CPU Socket 1 x LGA1150 1 x LGA1150 1 x LGA2011 2 x LGA2011-R3 2 x LGA2011 2 x LGA2011-R3

Chipset Intel® C226 Intel® C226 Intel® C600 Intel® C612 Intel® C600 Intel® C612

Security Acceleration N/A N/A N/A Intel® QuickAssist Technology (By SKU) Cavium CN1620 (By SKU) Intel® QuickAssist Technology (By SKU)

BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS

System Memory

TechnologyDDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM

DDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM

DDR3 1333/1600MHz REG, ECC or non-ECC UDIMM

DDR4 2133/2400MHz REG DIMM

DDR3 1333/1600MHz REG or ECC DIMM

DDR4 2133/2400MHz REG DIMM

Max. Capacity 16GB 32GB 64GB 512GB 128GB 512GB

Socket 2 x 240pin DIMM 4 x 240pin DIMM 8 x 240pin DIMM 16 x 288pin DIMM 16 x 240pin DIMM 16 x 288pin DIMM

Networking

Ethernet Ports1 x GbE RJ45 Intel® i217 PHY7 x GbE RJ45 Intel® i210

8 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® 82574L 1 x GbE RJ45 Intel® i210

Bypass 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications

NIC Module Slot 1 2 (By SKU) 4 4 8 8

LOMI/O Interface 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0

OPMA Slot Yes (By Project) Yes Yes Yes Yes Yes

I/O Interface

Reset Button 1 1 1 1 1 1

LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage

Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch

Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45

USB 2 x USB 2.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0

LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads

Display From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)

Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU

StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bay 1 x 3.5” or 2 x 2.5” bay 2 x 3.5” bay (SKU A/B) or 4 x 3.5” bay (SKU C/D)

1 x 3.5” or 2 x 2.5” internal bay (SKU A/B/C/D)2 x 2.5” external accessible tray (SKU E/F/G/H)

Onboard Storage 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast

ExpansionPCIe 1 x PCI-E*8 FH/HL (optional) 2 x PCI-E*4 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) N/A 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional)

mini-PCIe N/A N/A N/A N/A N/A N/A

Miscellaneous

Watchdog Yes Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes

TPM Yes (By Project) Yes (By SKU) Yes (By Project) Yes (Optional) Yes (By SKU) Yes (Optional)

Cooling

Processor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink

System 3 x cooling fans with smart fan 3 x cooling fans with smart fan4 x individual hot-swappable cooling fans with smart fan

4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan

Environmental Parameters

Temperature0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

0~40ºC Operating-20~70ºC Non-Operating

Humidity (RH)5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

5~90% Operating5~95% Non-Operating

SystemDimensions

(WxDxH) 431 x 415 x 44 mm 431 x 468 x 44 mm 438 x 580 x 44 mm 438 x 630 x 44 mm 444 x 600 x 88 mm 444 x 600 x 88 mm

Weight 11.5 kg 12.5 kg 16.5 kg 16.5 kg 24 kg 24 kg

PackageDimensions

(WxDxH) 570 x 530 x 240 mm 735 x 595 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm 825 x 600 x 270 mm 825 x 600 x 270 mm

Weight 12.5 kg 13.5 kg 18 kg 18 kg 26 kg 26 kg

PowerType / Watts

220W ATX Single PSU or 300W 1+1 ATX Redundant PSUs

270W ATX Single PSU or300W 1+1 ATX Redundant PSUs

400W 1+1 ATX Redundant PSUs 650W 1+1 ATX Redundant PSUs 600W 1+1 ATX Redundant PSUs 600W/800W 1+1 ATX Redundant PSUs

Input AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz

Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL

20 www.lannerinc.com

NIC Modules

Model Name

Ports Chipset Bypass FW-7573 NCA-4010FW-8759FW-8771

NCA-4210 NCA-5210

FW-8877 NCA-5510FW-8894FW-8896

GbE Copper Modules

NCS2-IGM806A 8 i350-AM4 4 Pairs Gen3 V V V V V V V

NCS2-IGM806B 8 i350-AM4 N/A V V V V V

NCS2-IGM808A 8 i210AT 4 Pairs Gen3 V V V V V

NCS2-IGM808B 8 i210AT N/A V

GbE Fiber Modules

NCS2-ISM405A 4 i350-AM4 Fiber Bypass V V V V V

NCS2-ISM406A 4 i350-AM4 N/A V V V V V V

NCS2-ISM802A 8 i350-AM4 N/A V V V V V V

GbE Copper/Fiber Mixed Modules

NCS2-IMM401 2+2 i350-AM4 N/A V V V V V V

NCS2-IMM802 4+4 i350-AM4 2 pair Gen 3 V V

10GbE Copper Modules

NCS2-ITM203B 2 X540 N/A V V V V V

10GbE Fiber Modules

NCS2-IXM204A 2 82599ES N/A V V V V V V

NCS2-IXM205A 2 82599ES 1 Pair Gen3 V V V V V

NCS2-IXM405A 4 82599ES N/A V V V V V V V

NCS2-IXM407 4 XL710-AM1 N/A V V V V V V V

40GbE Fiber Modules

NCS2-IQM201 2 XL710-AM2 N/A V V V V V V

100GbE Fiber Modules

NC2S-RRC01A 2 FM10420 N/A V

NC2S-MXH01A 2 ConnectX-4 N/A V

www.lannerinc.com 21

Networking I/O Blades

To meet the next-generation network requirements, Lanner has introduced HybridTCA network

appliances: HTCA-6600 and HTCA-6200. HTCA-6600 is ideal for NFV DPI Server which can afford

massive DPI parsing capability, while HTCA-6200 is ideal for Edge Router with NFV Application.

In order to enhance scalability of the HybridTCA appliances above, Lanner also announces its latest

HTCA-compatible and swappable HLM-series carrier-grade blades lineup that provides enhanced

redundancy, interoperability, flexibility, bandwidth and performance boosts. For instance, Lanner’s

HLM-1020 switching blade comes with dual 100GbE CXP ports and 20 10GbE SFP+ ports. These blades

also pave the way for seamless migration in the near future.

The rising adoption of SDN and NFV in telecommunication industry has driven the demands for

consolidated and integrated hardware architectures for networking purposes, including servers, switches

and routers. The software approaches are favored by telecommunication sectors as SDN and NFV help

reduce implementations of proprietary hardware equipments. By leveraging the benefits of SDN and NFV,

carriers are gaining lower TCO, higher efficiencies and increased flexibility in network managements.

Video Transcoding ModulesLanner provides front-facing, easily swappable video transcoding modules that transport high quality

streaming and bandwidth-hungry video content.

4K Video Transcoding Module - NCS2-VT02A• Video transport NIC module for Lanner network appliances• Onboard Intel® Xeon® E3-1565L v5 CPU with C236 chipset• Support 4K Ultra-HD resolution and H.265 compression• Built-in Intel® Iris Pro Graphics GT4e

I/O Blades Picture Ports Chipset Bypass HTCA-1000/2000 HTCA-6600/6200

HLM-10004 port GbE RJ45,16 port 10GbE SFP+

BCM56854 N/A V

HLM-1001 32 port 10GbE SFP+ Intel XL710 N/A V

HLM-10202 port 100GbE CXP + 20 10GbE SFP+

BCM56860 N/A V

HLM-10306 100GbE QSFP+4 40G8 10G

BCM56960 N/A V

HLM-2000 2 port 100G QSFP+ BCM82381 N/A V

HLM-2001 8 port 10G SFP+ BCM82328 N/A V

The I/O blades or NIC modules shown in this material are not designed to operate independently without a compatible Lanner appliance. Please make sure a compatible Lanner appliance is in place before purchasing the modules.

22 www.lannerinc.com

Advanced Network Platforms

Feature Description FX-3411 FX-7220 FX-3810 HTCA-1000A HTCA-6200A HTCA-6600A

Form Factor 3U Rackmount 2U Rackmount 3U Rackmount 1U Rackmount 2U Rackmount 6U Rackmount

PlatformProcessor Options

Intel® Xeon® processor E5-2600 series on LGA2011 (Sandy Bridge-EP or Ivy Bridge-EP)

Intel® Xeon® processor E5-2600 series on LGA2011 (Sandy Bridge-EP or Ivy Bridge-EP)

Intel® Xeon® processor E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Intel Atom™ processor C2758 SoC (Rangeley)Intel® Xeon® processor E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Intel® Xeon® processor E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Chipset Intel C604 Chipset Intel® C600 Chipset Intel C612 Chipset SoC Intel C612 Intel C612

OS Support Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above, ONIE, Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above

System Memory

Technology DDR3 1066/1333/1600 MHz REG DIMM DDR3 up to 1600 MHz REG DIMM DDR4 2400 MHz REG DIMM DDR3 1333 MHz ECC DDR4 2400 MHz REG DIMM DDR4 2400 MHz REG DIMM

Max. Capacity 512GB 128 GB 256 GB 64 GB 512 GB (16 x 32GB) per M/B tray 512 GB (16 x 32GB) per M/B tray

Socket 16 x 240-pin DIMM 8 X 240-pin DIMM 8 x 288-pin DIMM Up to 2 x SODIMM 16 x 288-pin DDR4 DIMMs per M/B 16 x 288-pin DDR4 DIMMs per M/B

StorageHDD Bays 12 x 3.5” Swappable HDD drive bays 2 x 3.5” Swappable HDD drive bays 2 x 2.5” Swappable HDD drive bays 1 x SATA III, 1 x mSATA connectors 2 x 2.5” Swappable HDD drive bays 6 x 3.5” Swappable HDD drive bays

CF/SD 1 x CF card Type II 1 x CF card Type II 1 x mSATA connector 1 x mSATA 64GB 1 x CF per M/B tray 1 x CF per M/B tray

Networking

Ethernet Ports1x RJ-45 with LED for IPMI / Management port

Up to 36 x GbE SFP or 12 x 10GbE SFP+ via 3 network blades with onboard 1 man-agement port and 1 SFP+ dedicate port

2x RJ-45 with LED for IPMI / Management port, 1x RJ45 for console port

Up to 32 x 10GbE SFP+ ports or 6 x 100GbE QSFP ports Blade 1~2: Switch Fabric Blade or Ethernet I/O BladeBlade 1~2: Switch Fabric BladeBlade 3~6: Ethernet I/O Blade

Bypass Depends on NIC module specification Depends on blade specification N/A N/A N/A N/A

ControllersIntel Ethernet controller, depends on NIC module specification

Intel 82574L & 82599ES 1 x Intel i210Broadcom® StrataDNX BCM8867x (Jericho) packet processor with 720Gbps ~1.2Tbps capacity

Depends on blade specification (HLM series) Depends on blade specification (HLM series)

NIC Module Slot / Blade 2 x NIC Module Slots 3 x Blades N/A 4 x NIM Module Slots 2 x Blades 6 x Blades

IPMI Share with Management port 1 x IPMI port 1 x IPMI port 2 x onboard IPMI ports 1 x onboard IPMI ports 1 x onboard IPMI ports

Management Port 1 x Management port 1 x Management port 1 x Management port 2 x 10G SFP+ ports 1 x Management port 1 x Management port

I/O Interface

Reset Button Yes Yes Yes Yes Yes Yes

Console 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45

USB 2 x USB 2.0 1 x USB 2.0 1 x USB 3.0 2 x USB 2.0 1 x USB 2.0 1 x USB 2.0

ExpansionPCIe

1 x PCI-E*8 full height PCI-E card in the front; 1 x PCI-E*8 in the rear via riser card

N/A2* PCI-E Gen 3 x 8 Removable slots 4* PCI-E Gen 3 x 16 Removable slots

N/A N/A N/A

PCI N/A N/A N/A N/A N/A N/A

CoolingProcessor CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct

System 3 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 8 x hot-swappable cooling fans 4 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 5 x hot-swappable cooling fans per M/B

Environmental Parameters

Temperature0 ~ 40ºC Operating -20~70ºC Non-Operating

0 ~ 55°C / 95W0 ~ 40°C / 130W

0 ~ 40ºC Operating -20~70ºC Non-Operating

0ºC ~55ºC Operating -20ºC~70ºC Non-Operating

0 ~ 40ºC Operating -20~70ºC Non-Operating

0 ~ 40ºC Operating -20~70ºC Non-Operating

Humidity (RH)5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

Miscellaneous

LCD Module 2 x 20 characters Hinged LCM, 2 x 20 characters LCM, 2 x 20 characters N/A 2 x 20 characters 2 x 20 characters

Watchdog Yes Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes

DimensionsDimensions (WxHxD) 442 x 132 x 631 mm 431 x 88 x 710 mm 438 x 609 x 132 mm 438 x 44 x 450 mm 438 x 88 x 685 mm 438 x 265.9 x 685 mm

Weight 35 kg 32 kg 35 kg 13 kg 26 kg 55 kg

Power

Watts / Type 800W 1+1 ATX Redundant PSUsAC 1200 watt 1+1 redundant /each DC 1010 watt 1+1 redundant /eachPM bus support

AC 1100 watt 1+1 Redundant /eachDC 1100 watt 1+1 Redundant /eachPM bus support

300W 1+1 ATX Redundant PSUsAC 1200 watt N+1 Redundant /eachDC 1010 watt N+1 Redundant /eachPM bus support

AC 1200 watt N+1 Redundant /eachDC 1010 watt N+1 Redundant /eachPM bus support

Input 90~264V @ 47~63HzAC 100~240V @ 50~60HzDC -36 ~ -72V

AC 90~264V @ 50~60HzDC -36 ~ -72V

AC 90~264V @ 50~60HzDC -36 ~ -72V

AC 85 ~ 264 VDC -36V ~ -72V

AC 85 ~ 264 VDC -36V ~ -72V

Approvals & Compliance CE Class A, FCC Class A, RoHSCE Emission, FCC Class A, UL, C-Tick, VCCI

RoHS complianceCE class A, FCC Class A, RoHS, UL, NEBS design compliance

CE Class A, FCC Class A, RoHS, NEBS design compliance CE Class A, FCC Class A, RoHS, NEBS design compliance

www.lannerinc.com 23

Feature Description FX-3411 FX-7220 FX-3810 HTCA-1000A HTCA-6200A HTCA-6600A

Form Factor 3U Rackmount 2U Rackmount 3U Rackmount 1U Rackmount 2U Rackmount 6U Rackmount

PlatformProcessor Options

Intel® Xeon® processor E5-2600 series on LGA2011 (Sandy Bridge-EP or Ivy Bridge-EP)

Intel® Xeon® processor E5-2600 series on LGA2011 (Sandy Bridge-EP or Ivy Bridge-EP)

Intel® Xeon® processor E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Intel Atom™ processor C2758 SoC (Rangeley)Intel® Xeon® processor E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Intel® Xeon® processor E5-2600 v3/v4(Haswell-EP/Broadwell-EP)

Chipset Intel C604 Chipset Intel® C600 Chipset Intel C612 Chipset SoC Intel C612 Intel C612

OS Support Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above, ONIE, Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above

System Memory

Technology DDR3 1066/1333/1600 MHz REG DIMM DDR3 up to 1600 MHz REG DIMM DDR4 2400 MHz REG DIMM DDR3 1333 MHz ECC DDR4 2400 MHz REG DIMM DDR4 2400 MHz REG DIMM

Max. Capacity 512GB 128 GB 256 GB 64 GB 512 GB (16 x 32GB) per M/B tray 512 GB (16 x 32GB) per M/B tray

Socket 16 x 240-pin DIMM 8 X 240-pin DIMM 8 x 288-pin DIMM Up to 2 x SODIMM 16 x 288-pin DDR4 DIMMs per M/B 16 x 288-pin DDR4 DIMMs per M/B

StorageHDD Bays 12 x 3.5” Swappable HDD drive bays 2 x 3.5” Swappable HDD drive bays 2 x 2.5” Swappable HDD drive bays 1 x SATA III, 1 x mSATA connectors 2 x 2.5” Swappable HDD drive bays 6 x 3.5” Swappable HDD drive bays

CF/SD 1 x CF card Type II 1 x CF card Type II 1 x mSATA connector 1 x mSATA 64GB 1 x CF per M/B tray 1 x CF per M/B tray

Networking

Ethernet Ports1x RJ-45 with LED for IPMI / Management port

Up to 36 x GbE SFP or 12 x 10GbE SFP+ via 3 network blades with onboard 1 man-agement port and 1 SFP+ dedicate port

2x RJ-45 with LED for IPMI / Management port, 1x RJ45 for console port

Up to 32 x 10GbE SFP+ ports or 6 x 100GbE QSFP ports Blade 1~2: Switch Fabric Blade or Ethernet I/O BladeBlade 1~2: Switch Fabric BladeBlade 3~6: Ethernet I/O Blade

Bypass Depends on NIC module specification Depends on blade specification N/A N/A N/A N/A

ControllersIntel Ethernet controller, depends on NIC module specification

Intel 82574L & 82599ES 1 x Intel i210Broadcom® StrataDNX BCM8867x (Jericho) packet processor with 720Gbps ~1.2Tbps capacity

Depends on blade specification (HLM series) Depends on blade specification (HLM series)

NIC Module Slot / Blade 2 x NIC Module Slots 3 x Blades N/A 4 x NIM Module Slots 2 x Blades 6 x Blades

IPMI Share with Management port 1 x IPMI port 1 x IPMI port 2 x onboard IPMI ports 1 x onboard IPMI ports 1 x onboard IPMI ports

Management Port 1 x Management port 1 x Management port 1 x Management port 2 x 10G SFP+ ports 1 x Management port 1 x Management port

I/O Interface

Reset Button Yes Yes Yes Yes Yes Yes

Console 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45

USB 2 x USB 2.0 1 x USB 2.0 1 x USB 3.0 2 x USB 2.0 1 x USB 2.0 1 x USB 2.0

ExpansionPCIe

1 x PCI-E*8 full height PCI-E card in the front; 1 x PCI-E*8 in the rear via riser card

N/A2* PCI-E Gen 3 x 8 Removable slots 4* PCI-E Gen 3 x 16 Removable slots

N/A N/A N/A

PCI N/A N/A N/A N/A N/A N/A

CoolingProcessor CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct

System 3 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 8 x hot-swappable cooling fans 4 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 5 x hot-swappable cooling fans per M/B

Environmental Parameters

Temperature0 ~ 40ºC Operating -20~70ºC Non-Operating

0 ~ 55°C / 95W0 ~ 40°C / 130W

0 ~ 40ºC Operating -20~70ºC Non-Operating

0ºC ~55ºC Operating -20ºC~70ºC Non-Operating

0 ~ 40ºC Operating -20~70ºC Non-Operating

0 ~ 40ºC Operating -20~70ºC Non-Operating

Humidity (RH)5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

5 ~ 90% Operating 5 ~ 95% Non-Operating

Miscellaneous

LCD Module 2 x 20 characters Hinged LCM, 2 x 20 characters LCM, 2 x 20 characters N/A 2 x 20 characters 2 x 20 characters

Watchdog Yes Yes Yes Yes Yes Yes

Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes

DimensionsDimensions (WxHxD) 442 x 132 x 631 mm 431 x 88 x 710 mm 438 x 609 x 132 mm 438 x 44 x 450 mm 438 x 88 x 685 mm 438 x 265.9 x 685 mm

Weight 35 kg 32 kg 35 kg 13 kg 26 kg 55 kg

Power

Watts / Type 800W 1+1 ATX Redundant PSUsAC 1200 watt 1+1 redundant /each DC 1010 watt 1+1 redundant /eachPM bus support

AC 1100 watt 1+1 Redundant /eachDC 1100 watt 1+1 Redundant /eachPM bus support

300W 1+1 ATX Redundant PSUsAC 1200 watt N+1 Redundant /eachDC 1010 watt N+1 Redundant /eachPM bus support

AC 1200 watt N+1 Redundant /eachDC 1010 watt N+1 Redundant /eachPM bus support

Input 90~264V @ 47~63HzAC 100~240V @ 50~60HzDC -36 ~ -72V

AC 90~264V @ 50~60HzDC -36 ~ -72V

AC 90~264V @ 50~60HzDC -36 ~ -72V

AC 85 ~ 264 VDC -36V ~ -72V

AC 85 ~ 264 VDC -36V ~ -72V

Approvals & Compliance CE Class A, FCC Class A, RoHSCE Emission, FCC Class A, UL, C-Tick, VCCI

RoHS complianceCE class A, FCC Class A, RoHS, UL, NEBS design compliance

CE Class A, FCC Class A, RoHS, NEBS design compliance CE Class A, FCC Class A, RoHS, NEBS design compliance

Please verify specifications before quoting. All product specifications are subject to change without notice. No part of this publication

may be reproduced in any form or by any means, electronic, photocopying or otherwise without prior written permission of Lanner

Electronics Inc. All brand names and product names are the trademarks or registered trademarks of their respective companies.

© Lanner Electronics Inc., 2017 www.lannerinc.com

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