Technology Presentation 0309stablcor.com/data/STABLCOR_Presentation.pdf Technology...
-
Upload
phunghuong -
Category
Documents
-
view
254 -
download
5
Transcript of Technology Presentation 0309stablcor.com/data/STABLCOR_Presentation.pdf Technology...
1
STABLCORSTABLCOR®® Technology for Technology for ““Printed Circuit Board and SubstratePrinted Circuit Board and Substrate””
STABLCOR Inc
www.stablcor.com Technology Presentation-0309
2
Outline
Electronics ChallengesToday’s Material and it’s limitationsNeed for High Performance Material and Test dataHow to use STABLCOR® in a PCBBenefits of STABLCOR® in a PCBSupply ChainCase StudyDesign GuidelinesConclusion
www.stablcor.com Technology Presentation-0309
3
Challenges of the Electronics
The electronics Industry today is facing challenges such as
HOT SPOTCTE mismatch,
solder joint stress, thermal fatigue failure
shock and vibration issues, “SMALLER, FASTER, STRONGER”
www.stablcor.com Technology Presentation-0309
4
PCB material & It’s limitations (Dielectric)
1.8-1.861.6 to 3.912 to 160.6 to 0.65Non-PTFE Ceramic(R4000)
2.1-3.00.30170.5 to 0.66PTFE Ceramic (RO3000)
1.25-1.32 to 2.19 to 120.2 to 0.3Aramid/Epoxy
1.5-1.73.5 to 4.515 to 190.2 to 0.4Polyimide/E-glass
1.6-1.83.5 to 4.516 to 200.3 to 0.4FR-4/E-glass
Density (g/cc)
Tensile Modulus
(Msi)IN-PLANE
CTE (ppm/C)
Thermal Conductivity
(W/m.K)DIELECTRIC MATERIAL
www.stablcor.com Technology Presentation-0309
5
Current Material & It’s limitations
ELECTRICAL Property- Very Good
THERMAL Property – Poor
MECHANICAL Property – PoorRigidity
Co-efficient of Thermal Expansion (CTE)
www.stablcor.com Technology Presentation-0309
6
Thermal & Thermo-mechanical material
STABLCOR® Material is used today in Printed Circuit Boards and Substrate to address THERMAL &
MECHANICAL issues
www.stablcor.com Technology Presentation-0309
7
What is STABLCOR® Material?
A thermally & Electrically Conductive Composite Material
It has very good In-plane Thermal Conductivity
It has low In-plane CTE (3-6 ppm/C)
It can be used as a plane layer, Preferably GND plane
Carbon Composite core
Copper
Copper
It is a Carbon Composite Laminate
CCL
www.stablcor.com Technology Presentation-0309
8
STABLCOR® material part number system
EP387 = EPOXY Grade STABLCOR LC909 = POLYIMIDE Grade STABLCOR
H/H, 1/10.009” (229um)ST10-LC909
H/H, 1/10.008”(203um)ST325-EP387*
H/H, 1/10.0045”(114um),0.006”(152um), 0.009”(229um), 0.018”(457um)
ST10-EP387
Copper Thickness (oz)Core ThicknessProduct Name
Part Number System: ST325-EP387-0.008 H/H
STABLCOR type
Resin typeCore thickness
Copper thickness *ST325 Material subject to have MICROCRACKS
www.stablcor.com Technology Presentation-0309
9
STABLCOR Material - Part Number List
240° C0.0104" (0.264)1/2 oz over 1/2 ozST10-LC909-0.009H/HST10
240° C0.0118" (0.300)1oz over 1ozST10-LC909-0.009 1/1
Polyimide STABLCOR® Products170° C0.0108" (0.274)1oz over 1ozST325-EP387-0.008 1/1
170° C0.0094" (0.239)1/2 oz over 1/2 ozST325-EP387-0.008H/HST325*
170° C0.0194" (0.493)1/2 oz over 1/2 ozST10-EP387-0.018H/H
170° C0.0118" (0.300)1oz over 1ozST10-EP387-0.009 1/1
170° C0.0104" (0.264)1/2 oz over 1/2 ozST10-EP387-0.009H/H
170° C0.0088" (0.224)1oz over 1ozST10-EP387-0.006 1/1
170° C0.0074" (0.188)1/2 oz over 1/2 ozST10-EP387-0.006H/H
170° C0.0073" (0.185)1oz over 1ozST10-EP387-0.0045 1/1
170° C0.0059" (0.150)1/2 oz over 1/2 ozST10-EP387-0.0045H/HST10
Epoxy STABLCOR® Products
TgOverall Thickness Inch
(mm)Copper WeightPart NumberProducts
*ST325 Material subject to have MICROCRACKS
www.stablcor.com Technology Presentation-0309
10
STABLCOR® Material
1.5-1.73.5 to 4.515 to 190.2 to 0.4Polyimide/E-glass
1.6-1.83.5 to 4.516 to 200.3 to 0.4FR-4/E-glass
1.6 to 1.65ST10~ 9
ST325~ 24ST10~4.5to6 ST325~1to3
ST10~ 2* ST325~82*
Stablcor Laminate-Unclad (X & Y)
* Theoretical calculated In-Plane values based on volume & Thermal conductivity of the composite materials
1.65 to 1.7ST10~ 10 ST325~ 25
ST10~5to7 ST325~2to4
ST10~ 75* ST325~175*
STABLCOR® Laminate-with 1oz Cu clad (X & Y)
9.90195 to 6108CIC (Copper-Invar-Copper)
8.921217 to 20385Copper
Density (g/cc)
Tensile Modulus
(Msi)CTE
(ppm/C)
Thermal Conductivity
(W/m.K)E.CONDUCTIVE MATERIAL
Thermal, Low CTE, Stiff and Light Weight MaterialCOPPER CLAD CARBON COMPOSITE (STABLCOR®)
www.stablcor.com Technology Presentation-0309
11
CTE – STABLCOR® Material
In-Plane CTE
CTE vs TemperatureMaterial: ST325-EP450 Unclad
-4-202468
1012141618
-60 -40 -20 0 20 40 60 80 100 120 140
Temperature (C)
CTE
(ppm
/C)
X1 Direction X2 Direction Linear (X2 Direction) Linear (X1 Direction)
Composite CTE (0-3 ppm) over Temp. range of -50C to +130C
12 to 16Non-PTFE Ceramic (RO4000)
17.00PTFE Ceramic (RO3000)
9 to 12Non Woven Aramid/Epoxy
15 to 19Polyimide/E-glass
16 to 20FR-4 / E-glass
In Plane CTE (ppm/C)DIELECTRIC MATERIAL
www.stablcor.com Technology Presentation-0309
12
CTE – STABLCOR® Material
209.57°C145.35°C
Alpha=42.1µm/(m·°C)
254.48°CAlpha=102µm/(m·°C)
Tg
-0.002
0.000
0.002
0.004
0.006
0.008
0.010
Dim
ensi
on C
hang
e (m
m)
0 50 100 150 200 250 300Temperature (°C)
Sample: Tg and CTE test for CCLSize: 0.7159 mmMethod: Ramp TMA
File: C:\TA\Data\TMA\Stablcor substrate.008Operator: BPRun Date: 12-Sep-2005 17:38Instrument: TMA Q400 V7.1 Build 89
Universal V4.2E TA Instruments
P/N: ST325-EP450
Through Plane CTE
201.8734.82
209.5742.11
Tg (°C)Z-CTE before Tg (ppm/oC)
Run number
Z-axis CTE measurement by TMA method 50 to 55
Non-PTFE Ceramic (RO4000)
25 to 40PTFE Ceramic (RO3000)
110 to 120Non Woven Aramid/Epoxy
50 to 55Polyimide/E-glass
55 to 60FR-4/E-glass
Through Plane CTE
(ppm/C)DIELECTRIC MATERIAL
www.stablcor.com Technology Presentation-0309
13
How is STABLCOR® used in a PCB?
FR-4
FR-4
STABLCOR®
FR-4
FR-4
L2/3
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
L4/5
GND
L6/7
L8/9
L1
L10
FR-4
FR-4
FR-4
L2*
Prepreg
Prepreg
Prepreg
Prepreg
L3/4
L5/6
L7/8
L9*
L1
L10
FR-4
FR-4
FR-4
Prepreg
Prepreg
L4/5
NF
L6/7
L9/10
Prepreg
Prepreg
L8*Prepreg
Prepreg
1-CORE 2-CORE 3-CORE
(<0.035”) PCB/Substrate (<0.093”) PCB (>0.093”) PCB
L3*
FR-4 L1/2Prepreg
Prepreg
STABLCOR®
STABLCOR®
STABLCOR®
STABLCOR®
STABLCOR®
www.stablcor.com Technology Presentation-0309
14
CROSS SECTIONS
1-CORE 2-CORE 4-CORE
6-layer PCB 12-layer PCB3-layer PCB
www.stablcor.com Technology Presentation-0309
15
Thermal
CTE (Co-efficient of Thermal Expansion)
Rigidity / Stiffness
Density / Weight
The Benefits Of STABLCOR® in a PCB / Substrate
www.stablcor.com Technology Presentation-0309
16
Thermal / HEAT
CARBON IN A PCB
www.stablcor.com Technology Presentation-0309
17
PCB Thermal Path - Schematic
Heat source
Thermal Via
Ground Via Isolated via on Ground layer
Chassis
PCB Mounting Screw
PCB Mounting Screw
STABLCOR
www.stablcor.com Technology Presentation-0309
18
Thermal Via
Ground Via
Isolated via on Ground layer
Wedge Lock
Wedge Lock
Ground Pin
Thermal Via
Cu Edge Plating
Heat source
MILLING STEP
HIGH LAYER VME CARD
VME VME -- Wedge LockWedge Lock
STABLCOR®
www.stablcor.com Technology Presentation-0309
19
THERMAL PATH
www.stablcor.com Technology Presentation-0309
20
PCB acts as HEAT SPREADER
STABLCOR® PCB FR4 PCBFR4 PCBSTABLCOR® PCB
www.stablcor.com Technology Presentation-0309
21
THERMAL – PRODUCT LEVEL
*>124.9°F
*<68.0°F
70.0
80.0
90.0
100.0
110.0
120.0
STABLCOR ®PCB – 1G module
FR4 PCB – 1G module
www.stablcor.com
STABLCOR®ST325+FR4
FR4 PCB
NATURAL CONVECTION40Watt
Technology Presentation-0309
22
THERMAL SIMULATION SOFTWARE
1. Ansys Inc. (TAS PCB Software)David RosatoPh: (978) [email protected], PA 15317
2. Fluent Inc. (Icepak Software)Dan ScharpfPh: (603) 643-2600 x [email protected] Hampshire 03766
3. Flomerics (Flotherm Software)Sherman IkemotoPh: (512) 420-9273 x [email protected], California 92083
STABLCOR® material is listed in these software library
www.stablcor.com Technology Presentation-0309
23
Co-efficient of Thermal Expansion
CARBON IN A PCB
www.stablcor.com Technology Presentation-0309
24
CTE Associated with Package Type
IC PACKAGE TYPE
Organic Packages (CTE: 16-19ppm/C)
Ceramic Packages (CTE: 6-8ppm/C)
Flip Chip, DDA, WLP (2-4ppm/C)
www.stablcor.com Technology Presentation-0309
25
CTE – STABLCOR® Material
1.60.91ST325-EP387-0.010 0/0
1.80.25ST325-EP387-0.008 0/0
6.485.85ST10-EP387-0.009 0/0
6.284.88ST10-EP387-0.006 0/0
CTE, αy(x 10-6 1/oC)
CTE, αx(x 10-6 1/oC)Sample
www.stablcor.com Technology Presentation-0309
26
CTE – STABLCOR PCB
14-Layer, 80mil Thick, FR4+Stablcor PCB
www.stablcor.com
14-Layer, 80mil Thick, FR4+Stablcor PCBTemperature Dependent Coefficient of Thermal Expansion
Temperature (oC)
-60 -40 -20 0 20 40 60 80 100 120 140 160
CTE
(ppm
/ o C
)
0
2
4
6
8
10
12
14
16
18
20
X1 direction X2 direction
Board: EP3900B-A1
αX1 = 10.96498 + 0.00834 T - 0.0000346 T2
αX2 = 12.47485 + 0.01158 T - 0.0000548 T2
xxxxxx (STABLCOR+ FR4)
10.9 to 12.4ppm/C
Technology Presentation-0309
27
RIGIDITY / STIFFNESS
CARBON IN A PCB
www.stablcor.com Technology Presentation-0309
28
Rigidity / Stiffness
Rigidity of STABLCOR® PCB v/s FR4 PCB at Room Temp
Printed Wiring Board Bend Data
0.02.04.06.08.0
10.012.014.016.018.020.022.024.026.028.030.032.0
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0
Displacement (mm)
App
lied
forc
e (N
)
Sample 1 (FR4)
Sample 2 (FR4)
Sample 3 (FR4 +STABLCOR)
Sample 4 (FR4 +STABLCOR)
Sample 5 (FR4 +STABLCOR)
Sample 6 (FR4 +STABLCOR)
Sample 7 (FR4 +STABLCOR)
Maximum Force at 15mm Deflection
14.00
16.00
18.00
20.00
22.00
24.00
26.00
28.00
30.00
Sample 1 (FR4) Sample 2 (FR4) Sample 3 (FR4 +STABLCOR)
Sample 4 (FR4 +STABLCOR)
Sample 5 (FR4 +STABLCOR)
Sample 6 (FR4 +STABLCOR)
Sample 7 (FR4 +STABLCOR)
Sample IdentificationM
axim
um A
pplie
d Fo
rce
(N)
This result shows the STABLCOR® samples to be ~ 66.6% stiffer than the FR4 test samples
www.stablcor.com Technology Presentation-0309
29
Rigidity / Stiffness
-0.01
0.00
0.01
0.02
0.03
0.04
0.05
Dim
ensi
on C
hang
e (m
m)
0 50 100 150 200 250 300
Temperature (°C)
Sample: PCBSize: 3.0000 mmMethod: Force RampComment: Bend Test at various temperatures
TMAFile: C:\TA\Data\TMA\3 pt bend VLP FR4.003Operator: BPRun Date: 07-Sep-2005 23:19Instrument: TMA Q400 V7.1 Build 89
Universal V4.2E TA Instruments
FR4
-0.01
0.00
0.01
0.02
0.03
0.04
0.05
Dim
ensi
on C
hang
e (m
m)
0 50 100 150 200 250 300
Temperature (°C)
Sample: PCBSize: 3.0000 mmMethod: Force RampComment: Bend Test at various temperatures
TMAFile: C:...\TMA\3 pt bend VLP Stablcor.002Operator: BPRun Date: 06-Sep-2005 19:55Instrument: TMA Q400 V7.1 Build 89
Universal V4.2E TA Instruments
STABLCOR+FR4
Bend Test Over Temperature Range (40oC to 250oC)
Length of vertical lines represent the amount of Deflection
www.stablcor.com Technology Presentation-0309
30
Rigidity / Stiffness
Rigidity of thick STABLCOR® PCB (0.093” – 0.125”)
Bend Data
0.0
20.0
40.0
60.0
80.0
100.0
120.0
140.0
160.0
180.0
200.0
220.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Displacement (mm)
App
lied
Forc
e (N
)
ST10 board 1
ST10 board 2
ST325 board 1
ST325 board 2
Polyimide board
Bend Data
0.0
20.0
40.0
60.0
80.0
100.0
120.0
140.0
160.0
180.0
200.0
220.0
240.0
ST10 board 1 ST10 board 2 ST325 board 1 ST325 board 2 Polyimideboard
Sample Identification
Max
imum
For
ce @
6m
m D
efle
ctio
n
-47.2Polyimide board5
452.1%213.4ST325 board 24
423.5%199.9ST325 board 13
265.7%125.4ST10 board 22
277.3%130.9ST10 board 11
Stiffness Improveme
nt over Sample 5
Maximum force at
6mm (N)
Sample Identification
Sample
Number
ST10 –STABLCOR® samples are ~ 275% stiffer than the Polyimide test samples
ST325- STABLCOR® samples are ~ 450% stiffer than the Polyimide test samples
www.stablcor.com Technology Presentation-0309
31
WEIGHT
9.9Copper Invar Copper
8.92Copper
2.7Aluminum
1.65STABLCOR® (w/o Cu)
1.70Polyimide
1.80FR4
Densitygm/cm3
Material(Laminate)
www.stablcor.com Technology Presentation-0309
32
Current Supply Chain
End User / CUSTOMEREnd User / CUSTOMER
Qualified PCB ManufacturerQualified PCB Manufacturer• Dynamic Details Inc ** ELTEK - Israel• Hunter Technologies ** CIREP Group – France• North Texas Circuit Board ** Stevenage Circuit - UK• Murrietta Circuits ** Graphic PLC - UK• Winonics ** Streamline Circuits- USA• Cosmotronic ** Photochemie -Switzerland• Cirtech ** Elvia PCB Group - France• Unicircuit• Harbor Electronics / ECT• TTM Technologies – Stafford & Chippewa Falls Plants
Lewcott / Carbon Core Laminates (STABLCOR material
manufacturer / Distributor)
54,000 sq.ft facility
Factory: Millbury, Massachusetts, USA
www.stablcor.com
Technology Presentation-0309
33
CASE STUDY
CASE STUDY
www.stablcor.com Technology Presentation-0309
34
CASE STUDY – Thermal at 40W, ST10
40Watt, Natural Convection, STABLCOR PCB running 11.2oC Cooler
www.stablcor.comCourtesy: CONTINENTAL Automotive France SAS, Mr. Loic Bertrand
Customer Quote:
ST10 represented a 12% to 15% temperature reduction compared to FR4
dT between ST325 and ST10 PCBs are very close to each other
FR4 PCB STABLCOR®ST10+FR4
NATURAL CONVECTION40Watt
Technology Presentation-0309
35
CASE STUDY – Thermal at 40W, ST325
40Watt, Natural Convection, STABLCOR PCB running 16.4oC Cooler
www.stablcor.comCourtesy: CONTINENTAL Automotive France SAS, Mr. Loic Bertrand
STABLCOR®ST325+FR4
FR4 PCB
NATURAL CONVECTION40Watt
Customer Quote:
With the STABLCOR we can say that hot spots are practically eliminated
ST325 represented a 15% to 20% temperature reduction compared to FR4
Technology Presentation-0309
36
CASE STUDY – Thermal at 40W
ST325: With the STABLCOR solution thermal resistance decreased by ~30% compared to the FR4 solution
www.stablcor.com
2.5oC/W4.5oC/WStablcor PCB (ST325)Not Tested4.8oC/WStablcor PCB (ST10)
With plateWithout plate
4.7oC/W6.7oC/WFR4 PCB
Thermal Resistance (at 40Watt), Natural Convection
Courtesy: CONTINENTAL Automotive France SAS, Mr. Loic Bertrand
ST10: With the STABLCOR solution thermal resistance decreased by ~28% compared to the FR4 solution
6-Layer PCB, 0.062” thick, ~6.0” x 6.0”, ST325 at L2 &L5
Technology Presentation-0309
37
CASE STUDY – SBC (Single Board Computer)
www.stablcor.com Technology Presentation-0309
38
CASE STUDY – SBC, Thermal & CTE
www.stablcor.com Technology Presentation-0309
39
CASE STUDY - THERMALHeat Dissipation of PWB Materials with End Clamped in Vise
-20
-10
0
10
20
30
40
50
60
70
80
Resistor Pos 1 Pos 2 Pos 3
Thermocouple Position
Tem
p R
ise
Abo
ve A
mbi
ent i
n C
elsi
us
FR4STBLCoreDifference
ViseR 1 2 3
The superior thermal conductivity is evident from the reduced temperature at the resistor. The power resistor was set up to heat up to about 100°C (ambient was about 24°C during the test), which required slightly over 6W into the resistor. Keeping the resistor power constant, the STABLCOR®material lowered the resistor temperature by 12.8°C. The thermal resistivity of the resistor to ambient was 12.6°C/W with the FR-4 and 10.6°C/W with the STABLCOR® indicating a 2.0W or 19% improvement in power handling capability with this configuration.
www.stablcor.com Technology Presentation-0309
40
CASE STUDY – Solar Panel, low CTE & Rigidity
MATCHED CTEMATCHED CTEEliminates thermal induced stress on Eliminates thermal induced stress on the triple junction solar cells. Initial the triple junction solar cells. Initial thermal cycle testing has shown no thermal cycle testing has shown no
damage to solar cells due to damage to solar cells due to matching thermal expansionmatching thermal expansion
AUTOMATED AUTOMATED PRODUCTIONPRODUCTION
Reduces costReduces cost in large volume in large volume production compared with traditional production compared with traditional
attachment methodsattachment methods
RUGGEDRUGGEDThe rigidity of the CCL substrates The rigidity of the CCL substrates
reduces costsreduces costs by eliminating need by eliminating need for additional supports to meet for additional supports to meet
shock and vibration requirementsshock and vibration requirements
www.stablcor.com Technology Presentation-0309
41
CASE STUDY – Flip Chip RELIABILITY
For no underfill test, the For no underfill test, the chips on STABLCORchips on STABLCOR®®
substrate remain attached at substrate remain attached at 353 cycles. Most of the chips 353 cycles. Most of the chips detached from the other test detached from the other test boards at 353 cyclesboards at 353 cycles
With no underfill, the With no underfill, the characteristic (63.2%) life of characteristic (63.2%) life of the FRthe FR--4/NELCO is about 20 4/NELCO is about 20 cycles . The STABLCORcycles . The STABLCOR®®
board is about 173 cyclesboard is about 173 cycles
STABLCOR®
Liquid to Liquid Thermal Shock Reliability
www.stablcor.com Technology Presentation-0309
42
CASE STUDY – Ceramic BGA Reliability
10.00 10000.0100.00 1000.001.00
5.00
10.00
50.00
90.00
99.00
Cycles (-40 to +125°C)
Unr
elia
bilit
y, (%
failu
re)
WC
WFC
WF
L1
L2
L4
L5
L6
L7
ST325-EP387-0.008H/H
2ply 44N106
2ply 44N106
2ply 44N106
2ply 44N106
L8
L9L10
L11
L13
L14
1ply 2313
FR4 0.005 h/h
1 ply 2313
FR4 0.005 h/h
1ply 2313
FR4 0.005 h/h
FR4 0.005 h/h
L12-STABLCOR (GND plane)
L3- STABLCOR (GND plane)
FR4 0.005 h/h
FR4 0.005 h/h
ST325-EP387-0.008H/H
0.093” Thick PCBThermal Cycle Reliability
STABLCOR PCB
FR4 PCB
The characteristic life of the CBGA on the STABLCOR PWB is roughly 2X better than on the regular PWB
www.stablcor.com Technology Presentation-0309
43
Case Study – Thermount vs. Stablcor PCB CTE
14-Layer, 80mil Thick, 85NT Thermount PCB 14-Layer, 80mil Thick, FR4+Stablcor PCB
www.stablcor.com Technology Presentation-0309
44
Case Study – Thermount vs. Stablcor PCB CTE
14-Layer, 80mil Thick, 85NT Thermount PCB 14-Layer, 80mil Thick, FR4+Stablcor PCBTemperature Dependent Coefficient of Thermal Expansion
Temperature (oC)
-60 -40 -20 0 20 40 60 80 100 120 140 160
CTE
(ppm
/ o C
)
0
2
4
6
8
10
12
14
16
18
20
X1 direction X2 direction
Board: EP3900B-C1 (Thermount)
αX1 = 12.0942 + 0.015026 T - 0.000118 T2
αX2 = 10.33096 + 0.00757 T - 0.0000488 T2
xxxxxxx
Temperature Dependent Coefficient of Thermal Expansion
Temperature (oC)
-60 -40 -20 0 20 40 60 80 100 120 140 160
CTE
(ppm
/ o C
)0
2
4
6
8
10
12
14
16
18
20
X1 direction X2 direction
Board: EP3900B-A1
αX1 = 10.96498 + 0.00834 T - 0.0000346 T2
αX2 = 12.47485 + 0.01158 T - 0.0000548 T2
xxxxxx (STABLCOR+ FR4)
10.3 to 12.1ppm/C 10.9 to 12.4ppm/C
www.stablcor.com Technology Presentation-0309
45
CASE STUDY
Technology Presentation
JPL
Stud
y fo
r Mul
tifun
ctio
nal
Spac
ecra
ft St
ruct
ure
www.stablcor.com
46
DESIGN GUIDELINES
DESIGN GUIDELINES
www.stablcor.com Technology Presentation-0309
47
DESIGN GUIDELINES
STABLCORSTABLCOR®® Laminate Laminate
…………is anis an…………
Electrically ConductiveElectrically Conductive MaterialMaterial
www.stablcor.com Technology Presentation-0309
48
DESIGN GUIDELINES
Thus,Thus,……………….. ..
It is used as a PLANE layer, It is used as a PLANE layer, preferably GROUND planepreferably GROUND plane layer layer within a multilayer PCBwithin a multilayer PCB
www.stablcor.com Technology Presentation-0309
49
BEST WAY TO USE STABLCOR?
USE AS A GROUND PLANE
USE ALL STABLCOR LAYERS AS SAME GROUND
DO NOT USE AS SPLIT GROUND PLANE
DO NOT USE AS A POWER PLANE
DO NOT USE AS A MIX PLANE LAYER
www.stablcor.com Technology Presentation-0309
50
OPTIMIZE CLEARANCE PAD SIZES ON GND Plane
Anti-pad size “TOO BIG” Optimized Anti-pad sizes
Plated Through Hole (PTH) pattern
DESIGNER MUST OPTIMIZE ANTI-PAD SIZES ON A STABLCOR GROUND PLANE DATA
www.stablcor.com
Rule to optimize anti-pad size:PTH size + 20mil (minimum)PTH size + 28mil (maximum)** stay towards minimum side
Technology Presentation-0309
51
STABLCOR must be symmetrical in a stack-up
FR-4
FR-4
STABLCOR®
FR-4
FR-4
L2/3
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
L4/5
GND
L6/7
L8/9
L1
L10
1-CORE 2-CORE 3-CORE
FR-4
FR-4
FR-4
L2*
Prepreg
Prepreg
Prepreg
Prepreg
L3/4
L5/6
L7/8
L9*
L1
L10
Prepreg
Prepreg
STABLCOR®
STABLCOR®
FR-4
FR-4
FR-4
Prepreg
Prepreg
L4/5
NF
L6/7
L9/10
L8*Prepreg
Prepreg
L3*
FR-4 L1/2Prepreg
PrepregSTABLCOR®
STABLCOR®
STABLCOR®
STABLCOR LAYERS MUST BE PLACED SYMMETRICALLY ALONG THE THICKNESS OF A PCB
www.stablcor.com Technology Presentation-0309
52
Proposed stack-up to Optimize RIGIDITY Benefit
STABLCOR® along the Neutral Axis
STABLCOR® near the surface and away from the Neutral Axis
FR-4
FR-4
FR-4
FR-4
L2/3
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
L4/5
GND
L6/7
L8/9
L1
L10
STABLCOR® 9to18mil coreFR-4
FR-4
FR-4
L2 Gnd
Prepreg
Prepreg
Prepreg
Prepreg
L3/4
L5/6
L7/8
L9 Gnd
L1
L10
Prepreg
PrepregSTABLCOR® 4.5 to 9mil core
STABLCOR® 4.5 to 9mil core
Optimized Stack-up for RigidityNon-Optimized Stack-up for RigidityPrinciple: Use STABLCOR® layers away from Neutral Axis
Two thin STABLCOR® layers as arranged below would give higher stiffness than single thick core in a center
www.stablcor.com Technology Presentation-0309
53
Do’s and Don’ts
Do’s & Don’ts
www.stablcor.com Technology Presentation-0309
54
Do’s & Don’t
DISTRIBUTE THE STABLCOR MATERIAL ACROSS THE THICKNESS OF A PCB
Thick Dielectric CoreL2
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
L4 GND
L1
L8
STABLCOR®
STABLCOR®
Prepreg
STABLCOR®
Thick Dielectric Core
L5 GND
NF
L6
L3
L7
Don’t
Thick Dielectric CoreL3
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
L2 GND
L1
L8
STABLCOR®
STABLCOR®
Prepreg
STABLCOR®
Thick Dielectric Core
L7 GND
NF
L5
L4
L6
Do’s
www.stablcor.com Technology Presentation-0309
55
Do’s & Don’t
USE THICK CORE INSTEAD OF USING TWO THIN CORE NEXT TO EACH OTHER
Don’t
Dielectric Core
L3 GND
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
L2 GND
L1
L10
8mil STABLCOR®
8mil STABLCOR®
Prepreg
8mil STABLCOR® L9 GND
L5
L7
L4
L8 GND
Dielectric Core
8mil STABLCOR®
Prepreg
L6
Do’s
Dielectric Core
L3
3ply 106 Prepreg min.
3ply 106 Prepreg min.
Prepreg
L2 GND
L1
L10
16mil STABLCOR®
Prepreg
L9 GND
L5
L7
L4
Dielectric Core
L6
Dielectric Core
3ply 106 Prepreg min.
3ply 106 Prepreg min.
16mil STABLCOR®
L8
www.stablcor.com Technology Presentation-0309
56
Do’s & Don’t
SINGLE CORE, SINGLE PLY STACK-UP
Top
Bottom
NF, STABLCOR(CTE control layer)
Prepreg
Prepreg
DOUBLE PLY, UNCLAD, STABLCOR LAMINATE
Top
Bottom
NF, STABLCOR(CTE control layer)
Prepreg
Prepreg
DOUBLE PLY, Copper CLAD, STABLCOR LAMINATE
DO NOT USE “SINGLE PLY” STABLCOR IF THERE IS ONLY ONE CORE STACK-UP
Don’ts Do’s
Top
Bottom
0.01
0”to
0.0
50”
NF, STABLCOR(CTE control layer)
Prepreg
Prepreg
SINGLE PLY, UNCLAD, STABLCOR LAMINATE
“Single ply” Stablcor in a “Single Core, Thin PCB”stack-up will cause “warpage”. That is why it is recommended to use “Double ply” Stablcor in a “Single Core, thin PCB”
SINGLE CORE, DOUBLE PLY STACK-UP
www.stablcor.com Technology Presentation-0309
57
LIMITATIONS
IT IS NOT A DIELECTRIC MATERIAL
IN SOME CASES IT CAN INCREASE FINISH PCB THICKNESS
STABLCOR “CORE” WILL BE EXPOSED AROUND THE PERIMETER OF THE FINISHED PCB
AVAILABLE FROM AUTHORIZED MANUFACTURERS ONLY
IT IS NOT RECOMMENDED TO USE HOT AIR SOLDER LEVEL (HASL) SURFACE FINISH FOR ST325 PRODUCTS
www.stablcor.com Technology Presentation-0309
58
CONCLUSION
Operates Cooler Reduces Hot SpotPCB acts as a Heat SinkReduces Thermal Stress on Components
Matches CTEAttach Ceramic packages more reliablyAttach Flip Chip more reliably
All above benefits at almost no weight premium
StiffnessPrevents WarpageIncreased Yields for Component Placement
Benefits for lead free PCBA processing lower reflow oven temperatures
www.stablcor.com Technology Presentation-0309
59
For more info www.stablcor.com
STABLCOR Inc
www.stablcor.com Technology Presentation-0309