Technoform- A test tool to determine Thermoformability
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Transcript of Technoform- A test tool to determine Thermoformability
May 8, 2006 Transmit Technology Group, LLC
Applications of Thermoformability Analyzer
Amit Dharia
Transmit Technology Group, LLC
Irving, Texas
May 8, 2006 Transmit Technology Group, LLC
Objectives• To demonstrate the need for an industry wide
standard Quantitative test method for “Measuring” and “Reporting” Thermoformability of plastic materials (2005)
• To illustrate applications of test equipment and test method in understanding and resolving issues related to Thermoformability.
May 8, 2006 Transmit Technology Group, LLC
Outline
• Structure-Property- Process relationship • Current test methods • Description of Technoform • Application and data interpretation• Products – Basic, Standard, Advanced• Conclusion
May 8, 2006 Transmit Technology Group, LLC
Thermoforming Process
• Extruding sheet stock
• Heating sheet above Tg
• Stretching heated sheet in rubbery state
• Cooling
• Trimming
• Finishing
• Regrinding and recycling scrape
May 8, 2006 Transmit Technology Group, LLC
Structure - Properties -Thermoformability
• Rate of change of strength with the change in strain rate at forming temperature
• % Crystallinity – Breadth of rubbery Plateau • Molecular weight, Molecular weight
distribution, molecular architecture (branching, crosslinking) – MFR, Melt Elasticity, Rheology
May 8, 2006 Transmit Technology Group, LLC
Other parameters
• Density - % filler, type of fillers, degassing• Geometry – Thickness, area, multi-layered
structures, adhesion between layers• Residual stresses between and within in
extruded layer sheet stock• Thermal diffusivity (Cp, K. Rho)• Extrusion quality ( gels, unmelts, thickness
variation, grain patterns)• Color (IR absorption)
May 8, 2006 Transmit Technology Group, LLC
Test Methods Test Method Major Short coming
MFR Easy, measure of only MW
Melt Tension > Tm, cooling effect, uni-directional, not applicable to all materials
Sag test No external force, geometry dependent, measure of only melt strength
Stress Relaxation
Repeatable, correlates with Sag test, expensive equipment
DMTA Repeatable, effect of temperature
Hot tensile test Inconsistent results, grip extrusion, annealing
May 8, 2006 Transmit Technology Group, LLC
Major disadvantages of current methods
• Most tests are conducted in melt or near melt phase • Test Specimens do not reflect actual test geometry
(shape, size, clamping mode)• Tests do not account for orientation, thermal stresses,
thickness variations• Isothermal environment, does not account for transient
nature of heating/ cooling • Effects of secondary process parameters can not be
evaluated• Results cannot be directly used.
May 8, 2006 Transmit Technology Group, LLC
What processors want to know?
• Will this material thermoform? • Will this new material process the same? • Will this lot process the same as the last one?• Why this lot does not process the same?• How fast material will heat?• What is the right forming temperature range?• Will melt adhesion between layers survive heating and
stretching step?• Will material discolor, fed or degrade during heating?
May 8, 2006 Transmit Technology Group, LLC
What processors want to know? -II
• What is the maximum draw down?• How fast part can be made? • What is the MD and TD shrinkage?• Will material tear at the corners and ribs?• How much regrind can I use?• Will grains retain shape and depth?• Does extruded sheet have gels or unmelts?
May 8, 2006 Transmit Technology Group, LLC
What Industry Needs?
• A standard test method which reflects all unit steps – heating, 3D stretching, forming, and cooling
• A test equipment which can be precisely controlled, is rapid, easy to use, provides repeatable and quantitative information, using the least amount of material.
• Easy to use “Thermoformability Index” standard for comparing, contrasting effects of selected process/ material variables
May 8, 2006 Transmit Technology Group, LLC
VariablesMaterial Feed Stock Process
Molecular Structure Thickness Forming Method
Tg, Tm, % Xc Residual stresses Part geometry
% LCB, % Xl Layers Plug geometry
ηo, ηel Color Plug material
Rho, k, Cp Volatiles Plug temperature
Type of fillers % regrind Forming speed
% of fillers impurity
Additive package Extrusion, storage
Shrinkage
May 8, 2006 Transmit Technology Group, LLC
Desired Test Method
• MEANINGFUL
• Rapid
• Easy to use
• Quantitative
• Repeatable
• A good problem solving tool
May 8, 2006 Transmit Technology Group, LLC
Test Input – Output
Input Range Output
Method Plug assist, Vacuum Temp. vs. Time
Resin Type Any type Force vs. Time
Sheet Thickness 10 mil to 375 mil Force vs. Draw Depth
Forming Temperature 60 C to 280 C Draw vs. time
Heat Soak time Variable Force at Max Draw Depth
Plug Material Epoxy, Polished Aluminum Force vs. Depth
Plug temperature 23 C to 120 C
Forming Speed 10- 180 mm/second
Plug Dwell time Variable
Maximum Force 100 lb
Cooling Time Variable
May 8, 2006 Transmit Technology Group, LLC
Typical GUI Screen
Sag
Elastic
Plastic
Strainhardening
Thinning
May 8, 2006 Transmit Technology Group, LLC
ResultsV,T
May 8, 2006 Transmit Technology Group, LLC
Technoform
May 8, 2006 Transmit Technology Group, LLC
Schematics of Technoform
May 8, 2006 Transmit Technology Group, LLC
Melt Strength = Resistance to Deformation @ TMelt Elasticity =Capability to deform @ T
Stress(Force)
% Draw or A/Ao
Strain Hardening
May 8, 2006 Transmit Technology Group, LLC
Heating rates for various plastic materials(Heater at 600 C, 3” from upper, 2” from lower)
30
80
130
180
230
0 20 40 60 80
t (seconds)
T (c
)
PP
HDPE
HIPS
PVC
ABS
Acetal
PMMA
Nylon
May 8, 2006 Transmit Technology Group, LLC
Effect of Crystallinity
0
5
10
15
20
25
30
50 70 90 110 130
Forming distance, mm
Forc
e (N
)HDPE PP HIPS PETG ABS PMMA PVC
May 8, 2006 Transmit Technology Group, LLC
Comparison of various PELDPE, LLDPE, MDPE @ 60 mm/s
0
5
10
15
20
25
30
35
0 20 40 60 80
Depth, mm
Fo
rce
, lb
f
LDPE120
LLDPE120
MDPE120
May 8, 2006 Transmit Technology Group, LLC
Effect of Forming Temperature
0
2
4
6
8
10
12
14
125 145 165 185
Temperature (C)
Fo
rce
(N
)
ABS
PP
HDPE
HIPS
PETG
PMMA
ACETAL
May 8, 2006 Transmit Technology Group, LLC
Force100 = f (T, V, material)
• F(ABS) =9.2348 -0.0547 T (R2 =99%)
• F(PMMA)=7.1587 -0.0341 T(R2=98%)
• F(PETG)=10.096 -0.0601 T (R2=92%)
• F(HIPS)=9.6782 - 0.0503T(R2=93%)
• F(HDPE)=5.2771 -0.0266 T (R2=86%)
May 8, 2006 Transmit Technology Group, LLC
Effect of Melt Strength (% HMSCOPP in COPP)
0
0.5
1
1.5
2
2.5
0 50 100 150
0
20
40
60
80
100
May 8, 2006 Transmit Technology Group, LLC
HMSCOPP
0
10
20
30
40
0 50 100 150
Draw Depth (mm)
Foc
e lb
f (1
70
C)
0
1
2
3
4
Forc
e lb
f
170 C
180 C
190 C
210C
May 8, 2006 Transmit Technology Group, LLC
COPP vs. HMSCOPP
40
60
80
100
120
170 180 190 200 210
T, C
Dra
w d
ep
th a
t Y
ield
COPP
HMSPP
May 8, 2006 Transmit Technology Group, LLC
Isothermal vs. Non-Isothermal20 mm/s, 130 C, HIPS
02468
1012
1 2 3 4 5
Draw Depth (Inches)
Fo
rce
(lb
)
130 C-20I 130 C-20NI
May 8, 2006 Transmit Technology Group, LLC
Effect of Plug TemperatureHIPS 35 mil, 130 C, 40 mm/s, No control
0
2
4
6
8
10
12
0 20 40 60 80 100 120 140
Draw Depth, mm
Forc
e, L
bf Series1
Series2
Series3
May 8, 2006 Transmit Technology Group, LLC
Effect of Plug Temperature-II35 mil HIPS, 130 C, 40 mm/s, Plug at 23 C
0
2
4
6
8
10
12
0 20 40 60 80 100 120
Depth, mm
Fo
rce
, Lb
f #1
#2
#3
#4
May 8, 2006 Transmit Technology Group, LLC
Effect of Plug induced cooling -IIIHIPS (with and without hole)
0
0.2
0.4
0.6
0.8
1
1.2
0 20 40 60 80 100 120
Draw Depth, mm
Fo
rce
, lb
f
wo with
May 8, 2006 Transmit Technology Group, LLC
Effect of Plug Material35 mm HIPS, 40 mm/s, 130 C
0
1
2
3
4
5
6
0 20 40 60 80 100 120
Depth (mm)
Fo
rce
(lb
)
WF WFT Bix
May 8, 2006 Transmit Technology Group, LLC
Effect of Sheet Thicknesson heating rates
0
100
200
300
0 500 1000time (sec)
Surfa
ce
Tem
pera
ture
(C)
100 mil 150 mil 250 mil
May 8, 2006 Transmit Technology Group, LLC
Effect of Sheet Thickness
0
1
2
3
4
5
6
7
8
9
0 20 40 60 80 100
Depth (mm)
Froc
e (lb
f)
95 150 250
May 8, 2006 Transmit Technology Group, LLC
Effect of Color on heating Rate
32
82
132
0 50 100
time (sec)
Su
rfa
ce
Te
mp
era
ture
(C
)Red Blue Metalic
May 8, 2006 Transmit Technology Group, LLC
Effect of Color CoPP, 35 mil, 40 mm/s, 160 C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 20 40 60 80 100 120
Depth (mm)
Fo
rce
(lb
)
0
2
4
6
8
10
12
blue red Metallic
May 8, 2006 Transmit Technology Group, LLC
Effect of Lot to Lot Variation
170 C, 40 mm/s, 190 mil TPO
0123456789
10
0 10 20 30 40 50 60 70
Depth (mm)
Fro
ce (
lbf)
1-1 1-2 1-3
May 8, 2006 Transmit Technology Group, LLC
Effect of Regrind (FR-ABS)
125 mil, 160 C, 40 mm/sec
0
2
4
6
8
10
12
14
0 20 40 60 80 100
Depth (mm)
Fro
ce (
lbf)
50% RG 100% RG
May 8, 2006 Transmit Technology Group, LLC
Effect of Regrind (GPPS)125 mil, 190 C, 40 mm/sec
0
2
4
6
8
10
12
14
0 50 100
Draw Depth (mm)
Fo
rmin
g F
orc
e (
lbf)
PS Virgin
PS Regrind
May 8, 2006 Transmit Technology Group, LLC
Processing Window of Commercial TPOs
0
10
20
30
0 20 40 60 80 100
Depth (mm)
Forc
e (lb
f)170 180 190 170TPO
May 8, 2006 Transmit Technology Group, LLC
COPP- Nano clay Composites
Force @ yield
0.9
0.95
1
1.05
1.1
1.15
1.2
COPP(0.8) COPP2.6NC COPP2.6C
Fy,190
May 8, 2006 Transmit Technology Group, LLC
CoPP-Nano Clay Composites
50
75C
OP
P(0
.8)
CO
PP
2.6N
C
CO
PP
2.6CDra
w D
epth
@ y
ield
Dy,190/100
May 8, 2006 Transmit Technology Group, LLC
How to Standardize?
• Thermoforming Index (TFI)– Force required to draw a sheet of thickness X at
speed Y mm/second using a Plug of specified geometry G at Temperature Tf to area ratio A (or volume ratio V), with plug temperature Tp.
• TFI = [Force (M, Tm)/ Force (GPPS, Ts)]
May 8, 2006 Transmit Technology Group, LLC
Thermoforming Index (example)
• 125 mil, GPPS, 40 mm/s force to draw to 45 mm depth @ 160 C is 7 lbs.
• 125 mil, PP, 40 mm/s Force required to draw to 45 mm depth @ 170 C is 3.5 lbs.
• TFI of PP = F 45,PP * thickness (GPPS)
F 45, GPPS * thickness (PP)
= 3.5*0.125/ 7* 0.325
= 0.5
May 8, 2006 Transmit Technology Group, LLC
Conclusions
• Easy and rapid test method with overall operation similar to actual Thermoforming process
• Economical vs. Field trials• Test equipment and method can be applied to wide
range of Industrial applications• TFI offers one simple number (like MFI)
representing material’s Thermoformability • Test equipment and method can be applied to wide
range of Industrial applications