TECHNICS MACRO-RIE 8800 STANDARD OPERATING PROCEDURES … · DOCUMENT: TECHNICS MACRO-RIE 8800...

TECHNICS MACRO-RIE 8800 STANDARD OPERATING PROCEDURES

Version: 1.0 Sept 2017

UNIVERSITY OF TEXAS AT ARLINGTON

Nanotechnology Research Center

DOCUMENT: TECHNICS MACRO-RIE 8800 SYSTEM OPERATING PROCEDURES Version: 1.0

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TABLE OF CONTENTS

1.0 DESCRIPTION..…………………………………………….…….… 3

2.0 SAFETY…................................…………………………….….... 3

3.0 REQUIREMENTS/RESTRICTIONS.…………………..…..………...... 3

4.0 SYSTEM OPERATION OVERVIEW……..…….…….……………….. 4

4.1 FAMILIARIZE YOURSELF WITH THE SYSTEM AND TOUCHSCREEN..... 4

4.2 RUNNING AN ETCH PROCESS…………...…….….…..……. 7

4.3 PLACING THE SYSTEM IN STANDBY AFTER PROCESS……. 11

5.0 APPENDIX…….………….…………..…..……………….…..…... 12

5.1 TECHNICS RECOMMENDED PROCESSES………......……...... 12


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1.0 Description

The Technics Macro-RIE 8800 etcher is used for plasma etch/ash processes. The system is fully automated using a PLC and touchscreen custom programmed for this system. The plasma etch process this system uses is generated under reduced pressure and at ambient temperature using low frequency 30 kHz RF power. The system is capable of etching up to a 8” diameter wafer or smaller samples.

2.0 Safety

2.1 This system uses Sulfur hexafluoride (SF6), Tetrafluoromethane (CF4),

Oxygen (O2), Carbon Hydro--Trifluoride (CHF3) and Argon (Ar) which can

form toxic compounds when combined with oxygen or in high concentrations can be asphyxiates. The process gases in normal operation are pumped out of system; if the process pressure is not being maintained or if the system cannot reach base pressure. Notify a Nanofab staff member immediately.

2.2 This machine uses 30 kHz low frequency power for etching. Do not operate this machine with any component enclosures/panels open.

3.0 Requirements/Restrictions

3.1 You must be a qualified user on the Technics Macro-RIE 8800 system.

3.2 You must comply with all safety requirements.

3.3 Only approved etch processes are allowed.

3.4 Metal mask and metal etch stop are allowed.

3.5 This system is for the etching of Silicon, Glass, Quartz, & Kapton substrates. Any other material must be APPROVED before processing.


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4.0 System Operation Overview

4.1 Familiarize Yourself with the System and TouchScreen.

4.1.1 All system operations are performed by the touchscreen interface. Begin by touching the touchscreen if it is in standby and the screen is dark. Press the “Screen Select” button from the lower center or upper right hand corner of the current screen. When the screen selection menu appears select the “Vacuum Function” button.

(Fig. 1)

4.1.2 The Vacuum Function screen (Fig. 2) provides the user all necessary vacuum functions to operate the system. From this screen users can either automatically pump the chamber down or vent the chamber to atmosphere and open the lid. There is also an option to perform a Rate of Rise test (ROR) to verify vacuum integrity. Users will also turn the Mechanical Pump On/Off from this screen when needed. The system controller also employs a PUMP IDLE TIMER to shut the pump down in the event of non-use. This is done to save on N2 costs as the dry pump on this system uses about 30 L/Min of N2 flow when in operation. The remaining idle time is displayed on the bottom of the screen next to the PUMP ON indicator. The chamber vacuum pressure is also displayed on this screen. Note ***The maximum pressure that will be displayed is 10 Torr due to the sensor limit.***

(Fig. 2)


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4.1.3 Press the Screen Select button again. Now from the menu press Recipe Select. The buttons in the center of the Recipes screen (Fig. 3) give a brief detail of the recipe each of them will load. Pressing one of them will load the values for that particular recipe. These recipes are in essence locked and can only be changed by a staff member using a computer to alter the parameters via software. ***Note*** The structure of this page may change over time as new recipes are added/edited, but the buttons function will remain the same.

(Fig. 3)

4.1.4 Once again press the Screen Select button. Now press the View Process button from the menu. The View Process screen (Fig. 4) is the only place to start your process once it has been selected. This screen will display all aspects of your running process once it is in progress. The steps 1, 2 & 3 are user selectable and will only be visible if you selected them when setting up your process. The etch timer displays the remaining etch time for each step, RF power and pressure both display the current values for each parameter. Process errors are all displayed on this screen and as such they must be reset from this screen.

(Fig. 4)


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4.1.5 Now press the Screen Select button again. Select the button Auto Etch Step 1 (Fig. 5) from the menu. From this screen you can change any of the recipe parameters related to the first step in your etch process. Most users will only need to have a single step recipe and that means that Step 1 is the one that will contain your parameters. If you need to process with a second step containing a different gas, gas flow, pressure or power parameter then you will select Auto Etch Step 2 from the Screen Select menu. Once in the Auto Etch Step 2 screen press the red Step 2 Deactivated button at the top left of the screen to activate the Step 2 function and then enter your parameters for the Step 2 process. You are then ready to go to the View Process screen to begin your Auto Etch process.

(Fig. 5)

4.1.6 The screens at the bottom of the Screen Selection Menu are all titled Service _____ and require a password to enter the menu. They are for NRC Staff members only.


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4.2 Running an Etch Process

4.2.1 At NO time should a user ever open the front panels of the Technics Macro 8800 system and operate any of the manual switches. All functions are controlled by the main touchscreen controller mounted on the right hand side of the system. Turning switches ON or OFF can cause the system to malfunction. All front panel switches must be set to their CENTER positions for the touchscreen controller to operate properly.

4.2.2 From the Screen Selection menu select the Vacuum Function screen. Once on the Vacuum Function screen ensure that the Pump button is illuminated Green and is ON. If it is not then press the “Turn Pump ON” button to start the Mechanical pump. If the pump was OFF there is a pump warm-up timer that requires 10 min of pump run time in order to warm up before processing. This is to ensure that the pumping speed is consistent between process runs. If the pump has already been on for 10 min or more then the pump warm-up timer will not be an issue.

4.2.3 Next Vent and Open the process chamber lid by pressing the button titled “Press to Vent and Open Chamber” (Fig. 6) located on the Vacuum Function screen. The button will illuminate Green and flash while the program is active.

(Fig. 6)


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4.2.4 Once the lid has fully opened inspect the chamber. If the chamber has visible particles wipe it down with alcohol and clean wipes. Now load your wafer or sample facing upward in the center of the etch pedestal (Fig. 7). **Note** If the chamber seems dirty or coated (heavily discolored) inform a staff member as a wet clean may be necessary.

(Fig. 7)

4.2.5 To close the chamber lid press the “Lid Closed” acknowledgement button on the touchscreen. Then press the two forward facing red buttons on the upper front panel of the system (Fig. 8). The chamber lid will begin to slowly close. Removing your hands from one or both buttons will stop the closing motion. Hold the buttons until the lid has fully closed.

(Fig. 8)


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4.2.6 Once the Chamber Lid has closed fully go to the Vacuum Function screen once again and press the button titled “Press to Evacuate the Chamber”. Notice the button will illuminate green and begin flashing (Fig. 9). In a few seconds a warning prompt will come on the screen reminding you to ensure the Chamber Lid is fully closed. Verify the lid is fully closed then press the on-screen prompt to continue the chamber evacuation procedure. Within two minutes the chamber should be at a base pressure of < 50mT.

(Fig. 9)

4.2.7 Now select the screen titled “Recipe Select” from the screen selection menu. Select the recipe (See. Fig. 3) you need or the recipe which is closest to the set of parameters you plan to use for your etch process.

4.2.8 Once again press the Screen Select button and select Auto Etch Step 1 (Fig. 10). Verify and adjust your parameters for Step 1 as needed. If you need to have a second step in your recipe then select Auto Etch Step 2 from the screen selection menu and adjust that step as required. ***Note*** The range for each etch parameter you may enter is listed in the keypad window that opens when you select that parameter.

(Fig. 10)


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4.2.9 Once you have finished modifying the recipe parameters as required press the Screen Select button and select View Process (Fig. 11). Ensure that the system is ready to start your process. Both of the Indicators above the Start button Must be GREEN if either of them is red then the process will not start. A RED indicator for the Pump Ready means that the pump has not been fully warmed up. Wait a few more minutes and the Pump Ready indicator should turn green. A RED indicator for the Vacuum Valve indicates that for some reason the Auto Evac routine didn’t complete go back to Step 4.2.6 and run it again. The third thing that is required to start the process is the chamber pressure indicated in the center of the screen must be < 50mT or the process will not start. Once all three of these conditions have been met you may start your Auto Etch process by pressing the Start Process button continuously for 2 seconds. Once the process begins you will immediately see activity on the screen displaying the current status.

(Fig. 11)

4.2.10 You may monitor the progress of your etch process on the View Process Screen. Any errors which may arise during your etch process will also be displayed on the View Process screen. All errors are unique and give the exact reason for the fault and an error window pointing to the display box for the out of control parameter. These errors must also be RESET from this same screen.

4.2.11 When your etch process has completed a green Process Completed prompt will be displayed on the screen. Press the prompt to reset it and then press the Select Screen button. From the screen selection menu go to the Vacuum Function screen.

4.2.12 From the Vacuum Function screen press the button titled “Press To Vent and Open Chamber” (See. Fig. 6) to begin the Auto Chamber Vent process.

4.2.13 After the lid has fully opened and stopped its rearward movement you may unload your wafer from the chamber (See. Fig. 7).

4.2.14 If you have another sample/wafer to process then you may load it at this time then proceed back to step 4.2.5 to begin processing that wafer. If you are finished processing then proceed to Section 4.3.


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4.3 Placing the System in Standby After Process

4.3.1 After unloading your final processed sample press the Load/Unload notification prompt on the Vacuum Function screen. Now press the two forward facing buttons on the upper front panel (See Fig. 8) to fully lower the chamber lid.

4.3.2 On the Vacuum Function screen select the button titled “Press to Evacuate the Chamber” in a couple of seconds you will be given a prompt to verify the chamber lid is fully clos3ed. Once verified press the on-screen prompt to continue the chamber evacuation sequence.

4.3.3 Press the Screen Select button and select the Recipe Select screen form the drop-down menu. Once on the Recipes screen select an O2 Clean recipe which is at least 50% of the total etch time of your processed samples.

4.3.4 Now press the Screen Select button again and proceed to the View Process screen. Start the O2 Clean process by pressing and holding the “Start Process” button for two seconds.

4.3.5 Allow the O2 clean process to complete. Once completed press the green flashing “Process Completed” prompt on the touch screen.

4.3.6 Make a log entry of your process in the logbook and clean up the work area.


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5.0 Appendix

5.1 Technics Recommended Processes

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