Technical White Paper NF5180M5 - Inspur...10 / 39 Table 4-1 10x2.5" Front Panel component...
Transcript of Technical White Paper NF5180M5 - Inspur...10 / 39 Table 4-1 10x2.5" Front Panel component...
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Technical White Paper
NF5180M5
Version: V03 Date: 2018.7.20
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Copyright © Inspur 2017. Copyright
No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Inspur Group Co., Ltd.
Trademark:
The Inspur and the Inspur logo belong to Inspur Group Co., Ltd. All the other trademarks and trade names mentioned in this document are the property of their respective holders.
Notice:
The purchased products, services and features are stipulated by the contract made between Inspur and the customer. All or part of the products, services and features described in this document may not be available within your purchase usage scope. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute any explicit or implicit warranty.
Inspur Group Co., Ltd.
Address: NO.1036 Langchao Road,
Jinan, Shandong,
People's Republic of China
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About This Document
Overview
This document describes the features and components provided by Inspur NF5180M5 server.
Intended Audience
This document can be used by marketing personnel, sales, and channel distributors for business development.
Changes History
Changes between document versions are cumulative. The latest document version contains all the changes made in earlier versions.
Issue 01 (January 10, 2018)
This issue is the first official release.
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1 PRODUCT OVERVIEW ···················································································· 5
2 PRODUCT FEATURES····················································································· 6
3 LOGICAL ARCHITECTURE DIAGRAM ······························································· 8
4 PRODUCT OVERVIEW ···················································································· 9
4.1 CLASSIFICATION OF PRODUCT ································································································································· 9 4.2 FRONT PANEL ·························································································································································· 9
4.2.1 Front panel of 10x2.5" model ······················································································································ 9 4.2.2 Front panel of 4x3.5" model ······················································································································ 10 4.2.3 Drive bay indicator ······································································································································ 12
4.3 REAR PANEL ·························································································································································· 12 4.3.1 Rear panel of storage optimized model ·································································································· 12 4.3.2 Rear Panel of I/O optimized model ·········································································································· 13
4.4 INTERNAL AERIAL VIEW ·········································································································································· 13 4.5 RISER CARD ·························································································································································· 14 4.6 MAIN BOARD LAYOUT ············································································································································ 15
5 SYSTEM SPECIFICATIONS ············································································ 19
6 COMPONENTS AND COMPATIBILITY ····························································· 22
6.1 PROCESSOR ·························································································································································· 22 MAX MEMORY SIZE ······················································································································································ 22 6.2 MEMORY ································································································································································ 23 6.3 STORAGE ······························································································································································· 24
6.3.1 Hard disk ······················································································································································ 24 6.3.2 Hard disk installation position ··················································································································· 26
6.4 HARD DISK BACKPLANE ········································································································································· 27 6.5 RAID/ SAS CARD ·················································································································································· 28 6.6 OCP/PHY MEZZANINE CARD ······························································································································· 28 6.7 NETWORK CARD ···················································································································································· 29 6.8 FC HBA CARD ······················································································································································· 30 6.9 HCA CARD ····························································································································································· 30 6.10 VIDEO CARD ························································································································································ 30 6.11 GPU ···································································································································································· 30 6.12 MICRO SD CARD ················································································································································· 31 6.13 PSU····································································································································································· 31 6.14 OPERATING SYSTEM ············································································································································ 31
7 SYSTEM MANAGEMENT ··············································································· 33
8 PHYSICAL SPECIFICATIONS ········································································· 35
9 CERTIFICATION ··························································································· 36
10 SUPPORT & SERVICES ··············································································· 37
11 DESCRIPTION OF NEW TECHNICAL POINT ··················································· 38
11.1 INTEL SCALABLE ARCHITECTURE ························································································································· 38 11.2 INTEL VROC TECHNOLOGY ································································································································ 38 11.3 QAT TECHNOLOGY ·············································································································································· 38 11.4 OCP MEZZANINE CARD ···································································································································· 38 11.5 NVDIMM ····························································································································································· 38
12 RELATED DOCUMENTS ·············································································· 39
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1 Product Overview
Inspur NF5180M5 server is a 1U two-socket rack mount server based on Intel® new generation Xeon® scalable processor, designed by Inspur to meet the demands of Internet, IDC (Internet Data Center), cloud computing, enterprise market and telecommunication business applications. It provides a high network bandwidth, high computing performance and large memory capacity, and is the best solution for customers who have high requirements for density and storage. It is particularly suitable for business intelligence, financial service, public and private cloud scenarios, and other scenarios that have excessive requirements for server density.
NF5180M5
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2 Product Features
Inspur NF5180M5 server has extremely high computational density, support all flash configuration, has strong scalability and flexible network deployment capability to meet the various applications needs of cloud computing data center. Inspur applies supreme and ultimate design concept for this server to provide a better performance, scalability, availability and manageability. NF5180M5 is consistent with Inspur servers’ high quality and highly reliable performance that make Inspur a leader in the global server market.
Performance
NF5180M5 server is based on Intel® new generation Xeon® scalable processor, with CPUs of up to 28 cores and 56 threads. Xeon® scalable processors can have a maximum frequency of 3.6 GHz, a maximum TDP of 205W, with 38.5 MB L3 cache and two 10.4 GT/s UPIs Internet link offering the best processing performance possible.
24x DDR4 2666 MT/ s ECC RDIMM or LRDIMM memory, with excellent speed, high availability feature and up to 3T memory capacity.
12x 16GB NVDIMM memory of 2666 MT/ s, The data in memory can be saved in case of power failure without reducing memory capacity and bandwidth.
10x hot plug NVMe SSD in full flash configurations, providing 10x I0Ps surpassing high-end enterprise-class SATA SSD. Extreme IO brings about a qualitative leap in storage performance
Scalability
Support up to 4x3.5” hard disk + 4x2.5” SSD or 12x2.5” hard disk. Built-in 2pcs SATA M.2 and 2pcs PCIe M.2 hard disk.
Support OCP and PHY network card with 1G, 10G, 25G, 40G and other rates to provide more flexible network structure for applications
Up to 3 standard PCIe 3.0 slots to further expand server I/O scalability.
Availability
NF5180M5 provides several features to enhance availability and increase system stable runtime:
Based on humanization design concept the whole system can be with tool-free maintenance. By structural reinforcement and optimization, the server can be assembled and disassembled rapidly, which greatly shortens the operation and maintenance time.
by Inspur unique intelligent control technology and advanced air cooling system, it offers optimal work environment, so as to guarantee stable operation of system.
Equipped with hot plug hard disks, it supports RAID 0/1/10/5/50/6/60 with RAID Cache, and power failure data protection with super-capacitor.
The new generation of Inspur BMC management system enable technicians can mark the faulty machines and detect the error occurred (or error occurring) components, by Web interface, fault diagnosis LED indicator, UID LED of front panel. So as to simplify the maintenance work, speed up problem solving and improve system availability.
System parameters monitored through BMC and alarms issued in advance, make technicians can take corresponding measures to ensure stable operation and reduce system failure probability
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Manageability
Inspur power management technology help users conduct accurate real-time monitoring and control, together with Node manager 4.0 technology make efficient comprehensive power control to further improve energy consumption performance of the whole IT architecture.
Energy efficiency
Equipped with 80 PLUS platinum 550W - 1300W power supply module, power efficiency is 94% under 50% load.
Support 1 + 1 redundant power, AC/ DC integrated, so as to improve power conversion efficiency.
High efficient single board VRD power supply reduce DC to DC conversion loss. Support intelligent speed regulation of system fans and frequency modulation of CPU for saving energy.
Optimal system heat dissipation design and efficient energy-saving system fans reduce system cooling power.
Safety
Firmware encryption/digital signature prevent illegal writing of unknown firmware.
In terms of hardware design, in addition to the panel latch design NF5180M5 support latch design for its chassis cover.
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3 Logical architecture diagram
NF5180M5 supports 2 Intel® Xeon® scalable processors and 24 DDR4 DIMMs.
The processors are interconnected by two UPI buses, with a transmission rate of up to 10.4GT/s.
The CPUs connect to two PCIe Riser cards via PCIe bus that provide different types of PCIe slots.
Figure 3-1 Logical Block Diagram of NF5180M5
Logical Block Diagram of NF5180M5
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4 Product Overview
4.1 Classification of product
According to the front panel form, two different models: 10 x 2.5" and 4 x 3.5"
10 x 2.5" model supports 10pcs 2.5inch front hard disk
4 x 3.5" model supports 4pcs 3.5inch front hard disk and 2pcs 2.5inch front SSD.
According to the rear panel form, it is divided into 2 different models: storage optimized model and I/O optimized model.
4 x 3.5" Hard Disk Model
10 x 2.5" Hard Disk Model
4.2 Front panel
4.2.1 Front panel of 10x2.5" model
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Table 4-1 10x2.5" Front Panel component identification
No. Designation No. Designation
1-10 2.5" Drive bay 0-9 12 Rack Handles
11 Control panel
LED Indicator and Button of the Control Panel
Table 4-2 10x2.5" Control Panel Module component identification
No. Designation No. Designation
1
High-density interface
(can be converted into 2 USB2.0 + 1 VGA interface)
5 Memory fault indicator
6 Fan fault indicator
2 Power button 7 Network fault indicator
3 UID LED & button 8 System overheating indicator
4 System fault indicator 9 PSU fault indicator
Note: refer to < NF5180M5 user manual> for indicator instruction
4.2.2 Front panel of 4x3.5" model
Table 4-3 4x3.5" Front Panel Module component identification
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No. Designation No. Designation
1-2 2.5" SSD Drive bay 5 Rack Handles
3 VGA interface
4 control panel 6-9 3.5" Drive bay (0-3)
Note: refer to < NF5180M5 user manual> for indicator instruction
LED Indicator and Button of Control Panel
Table 4-4 4x3.5" Control Panel Module component identification
No. Designation No. Designation
1 USB2.0+LCD 6 Memory fault indicator
2 USB3.0 7 Power fault indicator
3 Power button 8 System overheating indicator
4 UID LED & button 9 Fan fault indicator
5 network status indicator 10 System fault indicator
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4.2.3 Drive bay indicator
Table 4-5 Drive bay indicator identification
No. Designation Description
1 Hard disk fault indicator
Red light on: hard disk fault
Blue light on: hard disk locating
Blue light flashing: RAID Rebuilding
2 Hard disk activity status indicator Green light on: normal
Green light flashing: hard disk reading/writing
4.3 Rear panel
4.3.1 Rear panel of storage optimized model
Table 4-6 rear panel component identification of storage optimized model
No. Designation No. Designation
1
Rear 2.5" Drive bay
(PCIE device is alternative) 6 UID LED & Button
7 BMC reset Button
2 PCIE card (optional) 8 VGA
3 PSU0 9 USB3.0
4 PSU1 10 IPMI
5 OCP card 1 (optional) 11 OCP/PHY card0 (optional)
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Note: In storage optimized model, hard disk occupy 1 PCIE X8 and 1 PCIE X16 slot, so only one standard PCIe X16 slot(half height half length) is available. The PCIe slot relationship is also described in the following I/O optimized model.
4.3.2 Rear Panel of I/O optimized model
Table 4-7 rear panel component identification of I/O optimized model
No. Designation No. Designation
1 PCIe 3.0 x16 6 OCP card 1 (optional)
Full height half length 7 UID LED & button
2 PCIe 3.0 x8
Half height half length 8 BMC reset Button
3 PCIe 3.0 x16
Half height half length 9 VGA
4 PSU0 10 USB3.0
5 PSU1 11 IPMI
12 OCP/ PHY card (optional)
4.4 Internal aerial view
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Internal Schematic Diagram
Table 4-8 Server Internal Module identification table
No. Designation No. Designation
1 2.5″SATA SSD 4 PCIe x16 full height half length
5 PCIe x8 half height half length
2 2.5” chassis PCIE 3.0 M.2 6 Redundant power supply
3 7pcs 4056Fan 7 RAID card Capacitance
Note:
2.5” chassis do not support No.1 2.5” SATA SSD
3.5” chassis M.2 is at No.7
4.5 Riser Card
Table 4-9: Riser Card
Model Riser 1 Riser 2
PCIE Riser 1(x16*1+x8*1+x1) Slot 1, slot 2 N/A
PCIE Riser 2(x16*1) N/A Slot 3
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PCIE Riser 3(4 OCU+ x8*1+x1) 4OCU, slot 2 N/A
Note:
PCIE Riser 1 supports NC-SI function of Inspur network adaptor through x1 interface.
PCIE Riser 3 supports NC-SI function of Inspur network adaptor through x1 interface.
PCIE Riser 3 supports front 4pcs NVME by connecting 4*OCU to NVME backplane.
PCIe Riser Card schematic
4.6 Main Board layout
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Table 4-10 Main Board Component identification table
No.
Designation No.
Designation No.
Designation
1 NVMe5_CPU1 16 sSATA2-5 31 Power interface of M.2 hard disk
2 NVMe4_CPU1 17 SYS_TF card slot 32 Backplane power interface 0
3 NVMe2_CPU1 18 NVMe1_CPU0 33 Backplane power interface 1
4 NVMe3_CPU1 19 OCPA_CPU0 34 System fan (6-0)
5 OCPA_CPU1 20 NVMe0_CPU0 35 CPU0
6 UID indicator&button
21 PCIE0 _ CPU0 36 Memory slot (CPU0)
7 BMC reset button
22 System power 0 37 CPU1
8 VGA 23 System power 1 38 Memory slot (CPU1)
9 BMC_TF card slot
24 Backplane power interface 2
39 Front VGA interface
10 Rear USB 3.0 25 COM0 40 Front USB + LCD interface
11 IPMI 26 BP_I²C0 41 Built-in USB3.0
12 PCIE1_CPU0/1 slot
27 BP_I²C1 42 TPM interface
13 OCPC card slot 28 IPMB 43 sSATA M.2_0 card slot
14 SATA4-7 29 Control plate connection interface
44 sSATA M.2_1 card slot
15 SATA0-3 30 Intrusion alarm interface 45 OCPB_CPU1 card slot
Note:
PCIE slots:
21 is PCIE X16 slot, signal lead to CPU0 for PCIE Riser 3
12 is PCIE X24 slot, constitute by X8+X16, X8 signal lead to CPU0, X16 signal lead to CPU1, for PCIE Riser 2 or PCIE Riser 1
PHY&OCP:
No. connector type Signal source
configuration
45 OCP connector B
OCP CPU1 1pcs OCP can be placed in this area
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5 OCP connector A
OCP CPU1
13 OCP connector C
PHY Chipset 1pcs OCP or PHY can be placed in this area
19 OCP connector A
OCP CPU0
Oculink port:
1/2/3/4/18/20 is 6 Oculink ports for connecting to NVME hard disk, signal 1/2/3/4 lead to CPU1, signal 18/20 lead to CPU0
14/15/16 is 3 Oculink ports for connecting to SATA hard disk, each port support 4 SATA
HD,totally support 12 SATA HD
NVME configuration:
While 1《NVME QTY《6,connect to 6 OCULINK ports on the main board in priority
While 7《NVMEQTY《10,configure PCIe Riser 3
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5 System Specifications
Table 5-1 System Specification
Component Description
Form 1U Rack Mount Server
Processor
Support 1/2 Intel® Xeon® 3100, 4100, 5100, 6100, 8100 Scalable Processor:
Each CPU up to 28 cores (2.5GHz frequency)
Maximum frequency 3.6GHz (4 cores)
Two UPIs Internal link, each link 10.4GT/s rate
Maximum L3 cache of 1.375MB per core
Maximum thermal design power 205W
Chipset Intel C622/C624
Display controller Integrated in Aspeed2500 chip with maximum resolution of 1280 * 1024, and 32MB display cache
Memory
Support up to 24 DIMMs, 6 memory channels/CPU, 2 slots/channel, memory speed is up to 2666MT/s. Support RDIMM, LRDIMM, Support ECC, memory mirroring
Maximum memory capacity
RDIMM: support up to 24x64GB totally 1.5TB
LRDIMM: support up to 24x128GB totally 3TB
Storage
Front panel
2.5"×10 NVMe or 2.5”×4 SATA/SAS+6×NVME supports hot plug
2.5"×6 SATA/SAS + 4×NVMe supports hot plug
2.5"×2 SATA/SAS + 8×NVMe supports hot plug
3.5"×4 SATA/SAS/NVMe supports hot plug + 2.5"×2 SSD
3.5"×3 SATA/SAS + 1×NVMe supports hot plug + 2.5"×2 SSD
Rear panel
2.5"×2 SATA SSD supports hot plug
M.2 & SD
Support up to two 110mm PCIE x4 M.2(converted via OCULINK) and two 80MM SATA M.2(via onboard interface)
Support up to two MICRO SD 8G card
Storage controller
RAID/SAS card:
RAID controller:SAS3108, SAS3008IMR, 9361-8i, PM8060
SAS controller:9400-8I, SAS3008IT
On-board SATA controller:
SATA provide RAID 0/1/5
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Support mixed use of two mode controller SATA/NVMe
A RAID key shall be configured for NVMe; Software RAID supports RAID 0/1/5, RAID 0/1/10/5.
Network port PHY 10Gb/s, OCP10Gb/s, 25Gb/s
standard PCIE network adapter: 1/10/25/40/100 Gb/s
I/O expansion slot
Support maximum 3 standard PCIe slots, 1 OCP (connector A/connector B) slot, 1 OCP (connector A)/PHY(connector C) slot.
Riser Position 1 provide 2 PCIe 3.0 slots(Riser1 and Riser3):
1 PCIe3.0 x8+x1 half height half length
1 PCIe3.0 x16 full height half length
Riser Position 2 provide 1 PCIe 3.0 slot:
1 PCIe3.0 x16 half height half length
Note:
1 CPU provide 2 standard PCIe slots + 1 OCP/ PHY slot
PCIe expansion adopts modular tool-free removal and simultaneously keep screw fixed mode
Interface
3.5x4 model:
2 rear USB3.0 + 1 front USB3.0 + 1 font USB2.0 + 1 built-in USB3.0
1 front VGA
1 rear VGA
2.5x10 model:
2 rear USB3.0 + 2 front USB2.0 + 1 built-in USB3.0
1 front VGA
1 rear VGA
Fan 7pcs hot plugs N+1 redundant 4056 dual-rotor fans
PSU Support 1 + 1 redundant power supply 550W/ 800W/ 1300W.
Support CRPS, PMBUS and Node Manager 4.0 function.
CD-ROM Support USB external CD-driver
System
Management
Integrated 1 independent 1000Mbps network interface, dedicated for IPMI2.0 remote management
Operating system
Refer to section 6.13 for details
Microsoft Windows Server
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware
SUSE
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Neokylin
Oracal
Citrix
Ubuntu
Dimensions
Host machine:435mm(width) × 43.05mm(height) × 750.5mm(depth)
Package size: 651mm(width) × 307mm(height) × 971mm(depth)
Weight
26.5kg (10x2.5” model with full configuration)
27.2 kg (4x3.5” model with full configuration)
Weight include: host machine + packaging box + guide rail + accessories box
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6 Components and Compatibility
6.1 Processor
NF5180M5 supports one or two Intel Xeon® Scalable Processors.
Table 6-1: CPU
Model # of
Cores # of
Thread
Base frequency
(GHz)
Max turbo frequency
(GHz)
Cache (MB L3)
Max
Memory
Size
# of UPI
Links Power
8180 28 56 2.50 3.80 38.50 768 GB 3 205 W
8176 28 56 2.10 3.80 38.50 768 GB 3 165 W
8170 26 52 2.10 3.70 35.75 768 GB 3 165 W
8168 24 48 2.70 3.70 33.00 768 GB 3 205 W
8164 26 52 2.00 3.70 35.75 768 GB 3 150 W
8160 24 48 2.10 3.70 33.00 768 GB 3 150 W
8156 4 8 3.60 3.70 16.50 768 GB 3 105 W
8153 16 32 2.20 2.80 22.00 768 GB 3 125 W
6154 18 36 3.00 3.70 24.75 768 GB 3 200 W
6152 22 44 2.10 3.70 30.25 768 GB 3 140 W
6150 18 36 2.70 3.70 24.75 768 GB 3 105 W
6148 20 40 2.40 3.70 27.5 768 GB 3 150W
6146 12 24 3.20 4.20 25 768 GB 3 165W
6142 16 32 2.60 3.70 22.00 768 GB 3 150 W
6140 18 36 2.30 3.70 24.75 768 GB 3 140 W
6138 20 40 2.00 3.70 27.50 768 GB 3 125 W
6138T 20 40 2.00 3.70 27.50 768 GB 3 125 W
6136 12 24 3.00 3.70 24.75 768 GB 3 150 W
6134 8 16 3.20 3.70 24.75 768 GB 3 130 W
6132 14 28 2.60 3.70 19.25 768 GB 3 140W
6130 16 32 2.10 3.70 22.00 768 GB 3 125 W
6130T 16 32 2.10 3.70 22.00 768 GB 3 125 W
6126T 12 24 2.60 3.70 19.25 768 GB 3 125 W
6126 12 24 2.60 3.70 19.25 768 GB 3 125 W
5122 4 8 3.60 3.70 16.5 768 GB 2 105 W
5120 14 28 2.20 3.20 19.25 768 GB 2 105 W
5118 12 24 2.30 3.20 16.50 768 GB 2 105 W
5117 14 28 2.00 2.80 19.25 768 GB 2 105W
5115 10 20 2.40 3.20 13.75 768 GB 2 85W
4116 12 24 2.10 3.00 16.50 768 GB 2 85W
4114 10 20 2.20 3.00 13.75 768 GB 2 85W
4112 4 8 2.60 3.00 8.25 768 GB 2 85W
4110 8 16 2.10 3.00 11.00 768 GB 2 85W
4108 8 16 1.80 3.00 11.00 768 GB 2 85W
3106 8 8 1.70 / 11.00 768 GB 2 85W
3104 6 6 1.70 / 8.25 768 GB 2 85W
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Note: For any components not present in this table, please consult Inspur technicians.
6.2 Memory
Each CPU supports 12 LRDIMM/RDIMM, two CPUs support 24 LRDIMM/RDIMM. This server support LRDIMM, RDIMM.
Dual-CPU Memory Configuration
Memory slot Memory quantity and installation location
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
CPU0
C0D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C0D1 ● ● ● ● ● ● ● ● ● ● ● ●
C1D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C1D1 ● ● ● ● ● ● ● ● ● ●
C2D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C2D1 ● ● ● ● ● ● ● ●
C3D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C3D1 ● ● ● ● ● ●
C4D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C4D1 ● ● ● ●
C5D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C5D1 ● ●
CPU1
C0D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C0D1 ● ● ● ● ● ● ● ● ● ● ●
C1D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C1D1 ● ● ● ● ● ● ● ● ●
C2D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C2D1 ● ● ● ● ● ● ●
C3D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C3D1 ● ● ● ● ●
C4D0 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
C4D1 ● ● ●
C5D0 ● ● ● ● ● ● ● ● ● ● ● ● ●
C5D1 ●
DIMM slots shematic
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Note: while one CPU, memory shall be configured according to the following sequence:
CPU0_C0D0、CPU0_C1D0、CPU0_C2D0、CPU0_C3D0、CPU0_C4D0、CPU0_C5D0、
CPU0_C0D1、CPU0_C1D1、CPU0_C2D1、CPU0_C3D1、CPU0_C4D1、CPU0_C5D1.
Support following memory protection technology:
ECC
Memory mirroring
Memory level protection
Table 6-2 Memory Option
Model Capacity Frequency Rank technics
RDIMM 16GB 2400MHZ 1R×4
RDIMM 32GB 2400MHZ 2R×4
RDIMM 16GB 2666MHZ 1R×4/2R×8
RDIMM 32GB 2666MHZ 2R×4
LRDIMM 64GB 2400MHZ 4R×4
LRDIMM 64GB 2666MHZ 4R×4
NVDIMM 16GB 2666MHZ 1R×4
Note:
For any components not present in this table, please consult Inspur technicians.
It is not allowed to install different type (RDIMM, LRDIMM) and specifications (capacity, bit width, rank, height, etc.) memories for the same server.
2 processors installed support the maximum memory capacity. 1 processor installed support half of the maximum memory capacity.
6.3 Storage
6.3.1 Hard disk
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6.3.1.1 SATA/ SAS hard disk
Table 6-3: SATA/ SAS Hard disk
Model Speed/ minute Capacity
2.5 SAS
7.2K 1T/2T
10K 300G/450G/600G/900G/1.2T/1.8T
15K 600G
2.5 SATA 7.2K 1T/2T
3.5 SAS 7.2K 1T/2T/4T/6T/8T/10T
3.5 SATA 7.2K 1T/2T/4T/6T/8T/10T
Note: For any components not present in this table, please consult Inspur technicians.
6.3.1.2 SSD hard disk
Table 6-4: SSD hard disk
Model Capacity
SATA SSD 150G
SATA SSD 240G
SATA SSD 480G
SATA SSD 800G
SATA SSD 960G
SATA SSD 1.2T
SATA SSD 1.6T
SATA SSD 1.9T
SATA SSD 3.8T
Note: For any components not present in this table, please consult Inspur technicians.
6.3.1.3 U.2 NVMe SSD
Table 6-5: U.2 NVMe SSD
Model Capacity Maximum quantity
U.2 NVMe SSD 400G 10
U.2 NVMe SSD 450G 10
U.2 NVMe SSD 800G 10
U.2 NVMe SSD 1.2T 10
U.2 NVMe SSD 1.6T 10
U.2 NVMe SSD 1.8T 10
U.2 NVMe SSD 2T 10
U.2 NVMe SSD 2.4T 10
U.2 NVMe SSD 3.2T 10
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Note:
For any components not present in this table, please consult Inspur technicians.
10x2.5" model support up to 10 NVMe, 4x3.5" model supports up to 4 NVMe.
6.3.2 Hard disk installation position
6.3.2.1 General hard disk installation sequence
3.5x4:
2.5x10:
6.3.2.2 NVMe hard disk installation position
Backplane: 3.5*4_4*NVMe
NVMe only
sequence: NVMe0, NVMe1, NVMe2, NVMe3
mix of general hard disk and NVMe
General hard disk: sequence NVMe0-NVMe3
NVMe: sequence NVMe3-NVMe0
Backplane: 3.5*4_3*SAS+1*NVMe
NVMe only or general hard disk only:
General hard disk: sequence SAS0-SAS2, NVMe0
NVMe: only in NVMe0
mix of general hard disk and NVMe
First general hard disk then NVMe, NVMe can only be installed in NVMe0
Backplane: 2.5*10_10NVMe
This backplane only support NVMe. NVMes are sequentially installed in NVMe0-9.
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Note: PCIE Riser card【YZRI-00787-101】is needed while configuring 10NVMe. 6 NVMe
connect to 6 Oculink ports of the mainboard, 4 NVMe connect to 4 Oculink ports of PCIE riser card.
Backplane: 2.5*10_2*SAS+8*NVMe
8 NVMe ports are compatible with SAS/SATA hard disk
NVMe only
NVMe: sequence in NVMe0-7
mix of general hard disk and NVMe
General hard disk: sequence SAS0-SAS1, NVMe0-NVMe7
NVMe: sequence NVMe7-NVMe0
Backplane: 2.5*10 _ 4NVMe _ 6SAS/ SATA
4 NVMe ports are compatible with SAS/SATA hard disk
general hard disk only or NVMe only
General hard disk: sequence SAS0-5, NVMe0-3
NVMe: sequence NVMe0-3
mix of general hard disk and NVMe
General hard disk: sequence SAS0-SAS5, NVMe0-NVMe3
NVMe: sequence NVMe3-NVMe0
6.4 Hard disk backplane
Table 6-6. Hard Disk Backplane
Type description instruction
2.5x10 backplane
backplane_Inspur_5180M5 _NVMe_2.5X10_ 10NVMe
1. support 10NVMe 2. support 6NVME+4SAS/SATA
backplane_Inspur_5180M5_2.5X10_4NVMe_ 6SAS/SATA
1. support 4NVMe+6SAS/SATA 2. support 10SAS/SATA
backplane_Inspur_2.5*10_2*SAS+8*NVMe
1. support 8NVMe+2SAS/SATA 2. support 10SAS/SATA
Rear 2.5x2 SSD backplane
backplane_Inspur_NF5280M5_2.5*2_SAS
Applied to 2.5x10、3.5x4 model
Front 2.5x2 SSD backplane
backplane_Inspur_Shuyu1U_SATA_2.5X2 _6G_NA
Applied to 3.5x4 model
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3.5x4 backplane
backplane_Inspur_5280M5_3.5*4_3*SAS+ 1*NVMe
1. support 1NVMe+3SAS/SATA 2. support 4SAS/SATA
backplane_Inspur_5270M5_3.5*4_4*NVMe
1. support 4NVMe 2. support 4SAS/SATA
6.5 RAID/ SAS card
Table 6-7: RAID /SAS Card
type brand description Supercap
SAS card
Inspur SAS_I_SAS3008+IT+PCIe3.0 \
LSI SAS_L_8R0_9400-8i_HDM12G_PCIe3.0 \
LSI SAS_L_16R0_9400-16i_HDM12G_PCIE3 \
RAID card
Inspur
RAID_I_SAS3108_2GB_SAS12G_PCIe3.0 Optional
RAID_I_PM8060_2GB_SAS12G_PCIe3.0 Optional
RAID_I_SAS3008+IMR+PCIe3.0 Optional
LSI
RAID_L_8R0_9361-8i_1GB_HDM12G_3.0 Optional
RAID_L_16R0_9361-16i_2GB_HDM12G_3.0 Optional
RAID_L_8R0_9361-8i_2GB_HDM12G_3.0 Optional
RAID_L_16R0_9460-16i_4GB_HDM12G_3.0 Optional
RAID_L_8R0_9460-8i_2GB_HDM12G_3.0 Optional
Table 6-8: Configuration relationship between RAID/SAS card and hard disk
Front hard disk Rear hard disk
Hard disk QTY≤8 Hard disk QTY≥9
2.5x10 \ SAS3108 2G, PM8060 2G, 9361-8i1G,
9361-8i 2G, SAS3008IMR, 9400-8i, 9400-16i, SAS3008I, T9460-8i
9361-16i 2G
9460-16i or two 8i
2.5x10 2.5x2 \ 9361-16i 2G、
9460-16i
3.5x4 \ Same with 2.5x10 \
3.5x4+2.5x2 \ Same with 2.5x10 \
3.5x4 2.5x2 Same with 2.5x10 \
3.5x4+2.5x2 2.5x2 Same with 2.5x10 \
6.6 OCP/PHY Mezzanine Card
Table 6-9 PHY
brand type description
Inspur 1 port 10G Inspur_5280M5_CS4227_10G_LC
Inspur 2 ports 10G Inspur_5280M5_10G_2
Inspur 2 ports 10G Inspur_5280M5_CS4227_10G_LC_2
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Inspur 4 ports 10G Inspur_5280M5_CS4223_10G_4
Table 6-9 OCP
brand type description
Inspur 2 ports 25G Inspur_OCP 25G_CX4LX_25G_LC_PCIEx8_2
Inspur 1 port 25G Inspur_OCP 25G_CX4LX_25G_LC_PCIEx8
OCP Mezzanine Card
PHY Mezzanine Card
6.7 Network card
Table 6-10 Network Card
1G
2 ports Intel_W_I350-T2V2_RJ_PCI-E4X_1KM
2 ports SC_W_I350_RJ_PCI-E4X_1000M
2 ports I_1G_I350F2_LC_PCIEx4_2_MM
4 ports I_1G_I350F4_LC_PCIEx4_4_MM
4 ports SC_W_I350_RJ_PCI-E8X_1000M
10G
1 ports Intel_W_82599ES_LC_PCI-E8X_10G
1 ports M_MCX311A-XCCT_LC_10G_PCIEx8_XR
2 ports Intel_W_X540-T2_RJ45_PCI-E8X_10G
2 ports M_MCX312B-XCCT_LC_10G_PCIEx8_XR
2 ports Intel_W_82599ES_LC_PCI-E8X_10G
25G
2 ports M_25G_MCX4121A-ACAT_LC_PCIEx8_D_XR
2 ports QL_25G_QL45212HLCU-SP_LC_PCIEx8_2_XR
2 ports BROADCM_25G_57414_LC_PCIEx8_2_XR_42C
40G 1 ports I_40G_XL710_LC_PCIEx8_MM single
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1 ports M_MCX313A-BCCT_QSFP_40G_PCIE8_XR
100G 1 ports M_100G_MCX415A-CCAT_LC_PCIEx16_XR
Inspur R&D 10G Optical port
Intel chip
1 ports INSPUR_82599EN_10G_LC_PCIEx8_1_XR_ daughter card
2 ports INSPUR_82599ES_10G_LC_PCIEx8_2_XR_ daughter card
2 ports INSPUR_XL710_10G_LC_PCIEx8_2_XR_ daughter card
Inspur R&D 10G Optical port
Mellanox chip 1 ports INSPUR_10G_CX3 PRO_10G_LC_S
Inspur R&D 10G Electrical port
Intel chip 2 ports INSPUR_X540_10G_RJ45_PCIEx8
6.8 FC HBA card
Table 6-11 HBA Card
HBA
Qlogic
HBA_Q_0R1_QLE2560_LC8G_PCIE
HBA_QL_8R2_QLE2562_LC_PCIE
HBA_Q_0R2_QLE2672_LC16G_PCIE
HBA_QL_4R1_QLE2690-ISR-BK_FC16G_PCIE
HBA_QL_4R2_QLE2692-ISR-BK_FC16G_PCIE
Emulex
HBA_E_0R2_LPE12002_LC8G_PCIE
HBA_E_8R0_LPE31000-M6_FC16G_PCIE
HBA_E_8R2_LPE31002-M6_FC16G_PCIE
HBA_E_0R2_LPE16002B_LC16G_PCIE
HBA_E_0R4_LPE16004_LC16G_PCIE
6.9 HCA card
Table 6-12 HCA Card
HCA Mellanox 1 port 56G HCA_M_1-IB22.4X_MCX353A-FCBT_PCIE3.0
Mellanox 1 port 56G HCA_M_MCX353A-FCCT_FDR
6.10 Video card
Table 6-13 video card specification
type cache Bit width bus Max QTY
Leadtek P600 2G 2GB 128 bit PCIe 3.0 ×16 2
Note: this video card is x16 bus that need riser X16 slot.
6.11 GPU
Table 6-14 GPU specification
type cache Bit width bus Max QTY
Nvdia P4 8G 8GB 256 bit PCIe 3.0 ×16 1
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Note: this GPU need to be installed in the PCIE X16 slot of riser card YZRI-00869-101
6.12 Micro SD card
type capacity Max QTY
Micro SD 8GB 2
Note: two Micro SD card, one is for BMC log storage and the other is for installing ISQP suite which is for driver installation, system guide, server status recording etc.
6.13 PSU
Table 6-15 Power Supply Unit
power brand input Rated input Min. Max.
550W 800W
1300W GreatWall
AC 100-240V AC 90 264
Frequency 50Hz 47 63
DC 192-300V DC 190 310
550W 800W
LITEON
AC 100-240V AC 90 264
Frequency 50-60Hz 47 63
DC 192-300V DC 164 300
6.14 Operating system
Table 6-16 Operating System
OS HCL
Winserver2016
https://www.windowsservercatalog.com/item.aspx?idItem=f3f4a708-1131-4199-2187-9aad6086009d&bCatID=1282
Winserver2012/2012R2
https://www.windowsservercatalog.com/item.aspx?idItem=f3f4a708-1131-4199-2187-9aad6086009d&bCatID=1282
ESXi6.5
https://www.vmware.com/resources/compatibility/detail.php?deviceCategory=server&productid=44737&deviceCategory=server&details=1&keyword=44737&page=1&display_interval=10&sortColumn=Partner&sortOrder=Asc
ESXI6.0U3
https://www.vmware.com/resources/compatibility/detail.php?deviceCategory=server&productid=44737&deviceCategory=server&details=1&keyword=44737&page=1&display_interval=10&sortColumn=Partner&sortOrder=Asc
SLES11.4 https://www.suse.com/nbswebapp/yesBulletin.jsp?bulletinNumber=146166
SLES12.3 https://www.suse.com/nbswebapp/yesBulletin.jsp?bulletinNumber=146167
RHEL7.3
~7.x https://access.redhat.com/ecosystem/hardware/3213321?page=1
RHEL6.9
~6.x https://access.redhat.com/ecosystem/hardware/3213321
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Neokylin6.9
http://neocertify.cs2c.com.cn/display/webCompatibleView.do?channelId=72&id=17509
OL69 https://linux.oracle.com/pls/apex/f?p=117:2:::NO:RP:P2_CERT_ID,P2_VIRTUAL_FLAG,P2_PRODUCT_ID:12949,1,722
OL74 https://linux.oracle.com/pls/apex/f?p=117:2:::NO:RP:P2_CERT_ID,P2_VIRTUAL_FLAG,P2_PRODUCT_ID:12946,1,542
OVM3.4.4 https://linux.oracle.com/pls/apex/f?p=117:2:::NO:RP:P2_CERT_ID,P2_VIRTUAL_FLAG,P2_PRODUCT_ID:12947,1,642
Citrix7.1~7.x
https://citrixready.citrix.com/inspur/nf5180m5.html
Ubuntu14.04.5
https://certification.canonical.com/hardware/201712-25994/
Ubuntu16.04
https://certification.canonical.com/hardware/201712-25994/
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7 System Management
NF5180 M5 integrates a new generation of BMC intelligent management system, which is researched and developed by Inspur. It conforms to server industry management standard IPMI2.0, and possesses highly reliable and intelligent hardware monitor and management functions.
The main characteristics of the Inspur BMC intelligent management system are:
Support Intelligent Platform Management Interface (IPMI);
Support keyboard, mouse, video, and text console redirection;
Support remote virtual media;
Support Redfish Protocol;
Support Simple Network Management Protocol (SNMP);
Support logging in BMC via Web interface;
The detailed specifications of the intelligent management system are shown in Table 7-1.
Table 7-1 BMC Intelligent Management System Specification
Specification Description
Management protocols
Support multiple management interfaces to meet various system integrations, and can be integrated with any standard management system, so as to support the protocols shown below:
IPMI
CLI
SNMP
HTTPS
Redfish
Fault detection Provide rich fault detection capabilities to locate hardware faults accurately.
Alarm management
Support alarm management and SNMP Trap (v1/ v2c/ v3), Email Alert, syslog service and other alarms in various formats, so as to guarantee the highly reliable operation of equipment in 7X24 hours.
Virtual KVM Provide convenient remote fault maintenance method including even there is system faults.
Virtual media Can virtually attach USB equipment and folder to remote server, so as to simplify the complexity of installation of operation system.
Web-based user interface
Support visual image interface, to perform setting and task query quickly through simply clicking on the interface.
Screenshot View a screenshot without logging in, so that the regular inspection can be achieved easily.
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Software dual-mirroring backup
When the currently running software crashes completely, the server can be started from the backup mirroring.
Support intelligent power supply management.
Power capping technology allows you to easily increase deployment density, and dynamic energy-saving technology helps you reduce operating expenses effectively.
IPv6 IPv6 function is supported, so as to make it convenient for establishing and perfecting IPV6 environment and provide rich IP address resources.
NC-SI function Support the NC-SI (Network Controller Sideband Interface) function which allows you to easily access the BMC system through service network.
Hardware monitor timer
If the non-response time of BMC exceeds the safe setting time, the fans enter the full-speed protection mode.
Power control on/off/cycle/status
UID remote control Remotely turn on the UID light of single machine for locating the equipment in machine room easily. The ULD light also flashes when opening KVM and upgrading the firmware.
Firmware upgrade BMC/BIOS upgrade
Serial interface redirection
Serial interface I/O in system can be directed by IP-based IPMI session.
Storage information viewing
Raid logic array information and the information of corresponding physic disc under logic array can be monitored.
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8 Physical Specifications
Table 8-1 Physical Specifications
Item specification
Dimension 435 width × 43.05 height × 750.5 depth (unit: mm)
Weight 26.5kg(10*2.5 model full configuration) 27.2 kg(4*3.5 model full configuration) Weight includes: host + packing box + rail + accessories box
Power 550 W (input voltage: 100 V~240 V AC or 192 V~300 V DC) 800 W (input voltage: 100 V~240 V AC or 192 V~300 V DC) 1300 W (input voltage: 100 V~240 V AC or 192 V~300 V DC)
temperature
Operating temperature: 5℃~40℃
Storage temperature (with package): -40℃~+70℃
Storage temperature (without package):-40℃~+55℃
Humidity
Operating humidity: 10%~90% R.H.
Storage humidity (with package): 10%~93% R.H.
Storage humidity (without package): 10%~93%R.H.
Height 0 ~ 914 meter(3000 feet) Operating temperature:5℃~ 40℃
914~2133 meter(7000 feet) Operating temperature: 10 ℃~ 32 ℃
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9 Certification
FCC
China CCC
CB
CE
UL
CU
BIS
KC
RCM
Energy Star
Table 9-1
FCC Federal Communications
Commission
China CCC china compulsory certification
CB Scheme of the IECEE for Mutual Recognition of Test Certificates
for Electrical Equipment
CE Communate Europpene
UL Underwriter Laboratories Inc.
CU Custom Union TR Certificate
BIS The Bureau of Indian Standards
KC Korea Certification
RCM Regulatory Compliance Mark
Energy Star Energy Star
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10 Support & Services
Global Services Hotline:
1-844-860-0011 (Free phone)
1-646-517-4966 (Direct line)
Service e-mail: [email protected]
Information to be provided by the customer:
Name
Telephone number
E-mail address
Model
Product service SN number
Description of the problem
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11 Description of New Technical Point
11.1 Intel scalable architecture
Intel’s new generation of Xeon processor is based on Skylake architecture, and adopts the new Mesh interconnected architecture in substitution to the traditional Ring interconnected architecture. This architecture helps to improve the CPU access delay and support higher memory frequency. Meanwhile, Skylake features low power consumption, which allows it to work at low speed on lower processor and in environment with relatively low voltage, so as to provide better performance improvement, as well as higher energy efficiency. Compared with the last generation of Xeon processor, the overall performance of Intel Xeon Scalable Processor is improved about 1.65 times, and the OLTP library load is 5 time higher than previous system.
11.2 Intel VROC technology
The Intel® Virtual RAID on CPU (Intel® VROC) technology is designed specifically for enterprise-class RAID solutions for NVMe* SSDs, which can directly manage inside Intel scalable processor NVMe* SSDs connected on the PCIe channel without using specific RAID HBA.
11.3 QAT technology
Intel® QuickAssist Technology (Intel® QAT) enables security and compression acceleration on standard servers for networking, cloud, and storage; ensuring peerless performance while your cycles are efficiently running your applications. It is specifically embodied as follows.
Improve the application program throughput in cloud area, and accelerate the network security, routing, storage and big data addition hardware, so as to maximize the CPU usage.
Intel® QuickAssist accelerates the SSL/TLS in network aspect, so as to allow the encryption communication with high performance in safe network and provide higher platform application program efficiency.
As for big data, the compressed document system data block supports faster analysis for accelerating the Hadoop* operation time of big data and reducing the processor demand, reducing the every work completion delay rate leading to an overall performance improvement.
11.4 OCP Mezzanine CARD
Open Computing Project (OCP) is the open source server project specifically focuses on data centers, and its purpose is to share a server with high efficiency designed for data centers. As the OCP member, Inspur designs a series of OCP Mezzanine Cards based on the OCP standard.
11.5 NVDIMM
The Non-Volatile DIMM (NVDIMM) is a memory stick specification that integrates DRAM and non-volatile memory chips, which can store complete memory data in case of power loss.
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