Technical Sessions - WordPress.com. Ingrid De Wolf, IMEC, Belgium & KULeuven, Belgium MR302, Level 3...

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Wednesday, 30th November 2016

07:30 - 08:30 Registration @ Level 3 (Secretariat Room)

08:30 - 12:20

MR300, Level 3

PDC 1 : Nanotechnologies for Microelectronics Packaging Applications Prof. James E. Morris, Portland State University, USA

MR301, Level 3

PDC 2 : 3D Integrated Circuit Failure Analysis Prof. Ingrid De Wolf, IMEC, Belgium & KULeuven, Belgium

MR302, Level 3

PDC 3 : Fan-In and Fan-Out in Wafer Level Packaging Mr. Albert Lan, SPIL, Taiwan

12:20 - 13:10 Lunch @ MR329

13:10 - 17:00

MR300, Level 3

PDC 4 : Energy Efficient Thermal Management of Data Centers Prof. Yogendra Josh, Georgia Tech, USA

MR301, Level 3 PDC 5 : Internet of Things (IoT) focusing on Wireless Sensors Network and

Active RFID Dr. Holden Li, Tamasek Laboratories at Nanyang Technological University,

Singapore MR302, Level 3

PDC 6 : 2.5D and 3D-Stacked Integrated Circuits Prof. Paul D. Franzon, North Carolina State University, USA

17:30 - 19:00 Panel Speaker Presentation (Topic : Rise of China Semiconductor) @ MR 303-304, Level 3

19:00 - 19:30 Panel Q & A

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Thursday, 1st December 2016�

07:30 - 08:30 Registration @ Level 3(Secretariat Room)

Venue/Time MR331-332, Level 3

08:30 - 08:40 Welcome Speech (EPTC 2016 General Chair) by Mr. Ranjan Rajoo

08:40 - 09:00 Opening Address by Ms. Jean M. TREWHELLA, IEEE CPMT President

09:00 - 09:30 Keynote Address 1: Packaging Matters Mr. Tom Dolbear, AMD

09:30 - 10:00 Keynote Address 2: How to Feed Enough to Greedy IOT Monster Prof. Kanji Otsuka, Meisei Univ

10:00 - 10:30 Coffee/Tea break & Interactive Session I at Foyer 5

Interactive Session I at Foyer 5

[31] High Temperature Endurable Hermetic Sealing Material Selection and Reliability Comparison for IR Gas Sensor Module Packaging K. Y. Au, Ding Mian Zhi, Vivek Chidambaram, Bu Lin, Kropelnicki, Piotr, Chuan and Kai Liang

Presenter: K. Y. Au, Institute of Microelectronics, Singapore

[32] Defects in Nickel Plating Layers on Copper-Metallized Substrates Induced by Thermal Cycles Shinji Fukuda, Kazuhiko Shimada, Noriya Izu, Hiroyuki Miyazaki, Shoji Iwakiri and Kiyoshi Hirao

Presenter: Shinji Fukuda, National Institute of Advanced Industrial Science and Technology (AIST), Japan

[34] Comparison of Au/Al, Cu/Al and Ag/Al in Wirebonding Assembly and IMC Growth Behavior Norhanani Binte Jaafar and Eva Wai Leong Ching

Presenter: Norhanani Jaafar, Institute of Microelectronics, Singapore

[40] Molding Process Development for High Density I/Os Fan-Out Wafer Level Package (FOWLP) with Fine Pitch RDL Mian Zhi Ding, Ser Choong Chong, David Soon Wee Ho and Sharon Pei Siang Lim

Presenter: Mian Zhi Ding, Institute of Microelectronics, Singapore

[42] Ga-a Masking Contamination Source to prevent FIB Cross-section on Al Film Leijun Tang, Jasmine Woo and Laiyin Wong

Presenter: Leijun Tang, Institute of Microelectronics, Singapore

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[62] Study of Dielectric Materials Coating Conformality and Adhesiveness on Epoxy Mold Compound Surface B. L., Lau, David., Ho, H.Y., Hsiao and K. Yamamoto

Presenter: B. L., Lau, Institute of Microelectronics, Singapore

[67] Thermal Management of High Performance Test Socket for Wafer Level Package Yong Han, Seow Meng Low and Jason Goh

Presenter: Yong Han, Institute of Microelectronics, Singapore

[68] Package with High Thermal Conductivity of Graphite Attached onto Die Surface to Solve Hot Spot Issue Freedman Yen, Leo Hung, Nicholas Kao and Don Son Jiang

Presenter: Freedman Yen, Siliconware Precision Industries Co. Ltd., Taiwan

[79] Chip to Wafer Hermetic Bonding with Flux-less Reflow Oven Leong Ching Wai, Vivek Chidambaram Nachiappan, Sunil Wickramanayaka and Christoph Oetzel

Presenter: Leong Ching Wai, Institute of Microelectronics, Singapore

[83] Laser De-bonding Process Development of Glass Substrate for Fan-Out Wafer Level Packaging Hsiang-Yao Hsiao, Soon Wee Ho and Boon Long Lau

Presenter: Hsiang-Yao Hsiao, Institute of Microelectronics, Singapore

[139] Double-side Direct Contact Calibration Thru Kit With Non-exchanging Structure Wen Chou, Bo-You Chen, Sung-Mao Wu, Cheng-Chang Chen and Ming-Shan Lin

Presenter: Chou Wen, National University of Kaohsiung, Taiwan

[94] Through Mold Interconnects for Fan-out Wafer Level Package Soon Wee Ho, Leong Ching Wai, Soon Ann Sek, Daniel Ismael Cereno, Boon Long Lau, Hsiang-Yao Hsiao, Tai Chong Chai and Vempati Srinivasa Rao

Presenter: Soon Wee Ho, Institute Of Microelectronics, A*STAR, Singapore

[98] Development of Bottom-up Cu Electroplating Process and Overburden Reduction for Through Silicon Via (TSV) Application Gilho Hwang, Ravanethran Kalaiselvan and Hilmi B Mohamed Yusoff

Presenter: Gilho Hwang, Institute of Microelectronics, Singapore

[150] Cu Wire Bond Process Optimization for Al Remnant Surface Xiangyang Li, Haiyan Liu, Jun Li and Sean Xu��Siong Chin Teck

Presenter: Xiangyang Li, NXP Semiconductor, China

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[118] Modeling of Differential Vertical Transition with Through Silicon Vias (TSVs) in 3D Die Stack Ka Fai Chang

Presenter: Ka Fai Chang, Institute of Microelectronics, Singapore

[123] A New Failure Mechanism of Inter Layer Dielectric Crack Haiyan Liu, Xiangyang Li, Sean Xu, Jun Li, Gary Ge

Presenter: Haiyan Liu, NXP Semiconductors, China

[115] Qualification of 3D Integrated Silicon Photonics Massimo Fere, Livio Gobbato, Matteo Tremolada, Mark Shaw, Olivier Kermarrec, Carine Besset, Roberto Curti, Fabio Pietro Fiabane and Xueren Zhang

Presenter: Massimo Fere, ST microelectronics, Italy

[162] Fan-out Wafer Level Package Electrical Performances Teck Guan Lim

Presenter: Teck Guan Lim, Institute of Microelectronics, Singapore

10:30 - 11:00 Keynote Address 3: Advances of 3D Integration in China Prof. Wenhui Zhu, Central South University

11:00 - 11:30 Keynote Address 4: Innovation in SiP & Heterogeneous Integration Dr. Bill Chen, ASE

11:30 - 12:00 Keynote Address 5: Achieving Automotive Quality Excellence : Zero Defect Performance - A foundry's perspective Mr. Jagadish CV, SSMC

12:00 - 13:30

Lunch @ Summit 2

Luncheon Talk by Ms. Jean Trewhella : Acceleration of Electronic Packaging Innovation through Collaboration

Presentation of EPTC 2015 Best Paper Awards

Presentation of IEEE CPMT Certification of Appreciation to EPTC 2016 Organizing Committee

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Invited Presenters

13:30 - 14:00

MR331

Advanced MIS SIP Technology Mr. YB Lin, JCET

MR332

What’s happening in TSV based 3D/2.5D IC packaging: Latest market & Technology Trends Mr. Santosh Kumar, Yole Development

MR333

Opportunities and Challenges for Advanced Packaging Equipment Mr. Bob Chylak, K&S

MR334

Chip Integrated Single Phase Liquid Cooling Using Pin Fin Enhanced Microgaps Prof. Yogendra Joshi, Georgia Tech

MR335

A Novel NanoCopper-Based Advanced Packaging Material Dr. Alfred Zinn, Lockheed Martin Space Systems Company

MR336

Innovations in Packaging will enable the IoT world of the Future Dr. W. R. Bottoms, 3MTS

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Session A1 Advanced Packaging

Date/Time Thursday, 1st December 2016 / 14:00 - 15:20

Venue MR331

Chair YC MUI, Advanced Micro Devices, Singapore

[26] A Design-of-Experiment (DOE) to Optimize a SiP Design for Connectivity Applications Quan Qi and Carlton Hanna

Presenter: Quan Qi, Intel, United States

[08] Extremely Low Warpage Coreless Substrate for SiP Module Tang-Yuan Chen and Meng-Kai Shih

Presenter: Tang-Yuan Chen, ASE, Singapore

[25] Wire Bond Scalable Design Methodology Fee Wah Chong and Yee Huan Yew

Presenter: Fee Wah Chong, Package Engineering, Malaysia

[07] A New Structure & Fabrication of a High Dissipation 3D Package with Flexible Substrate Garry Ge, Gideon Lye and Sonder Wang

Presenter: Garry Ge, Tianjin China/ Kuala Lumpur, Malaysia

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Session A2 TSV/Wafer Level Packaging


Venue MR332

Chair Navas Khan, NXP, Singapore

[36] Ultra-Fine Pitch Cu-Cu bonding of 6��m Bump Pitch for 2.5D application Ser Choong Chong, Ling Xie, Sunil Wickramanayaka, Vasarla Nagendra Sekhar and Daniel Ismael Cereno

Presenter: Ser Choong Chong, Institute of Microelectronics, Singapore

[52] Development of an all-in One Wet Single Wafer Process for 3D-SIC Bump Integration and its Monitoring S. Suhard, A. Iwasaki, M. Liebens, K. Stiers, J. Slabbekoorn and F. Holsteyns

Presenter: S. Suhard, Screen Semiconductor Solutions Co., Ltd., Japan

[89] 3D-SoC Integration Utilizing High Accuracy Wafer Level Bonding Lan Peng, Soon-Wook Kim, Nancy Heylen, Maik Reichardt, Florian Kurz, Thomas Wagenleitner, Erik Sleeckx, Herbert Struyf, Kenneth June Rebibis, Andy Miller, Gerald Beyer and Eric Beyne

Presenter: Lan Peng, IMEC, Belgium

[88] Thermal Stress Reliability of Copper Through Silicon Via Interconnects for 3D Logic Devices Hideki Kitada, Hiroko Tashiro, Shoichi Miyahara, Aki Dote, Shinji Tadaki and Seiki Sakuyama

Presenter: Hideki Kitada, Fujitsu Limited, Japan

Technical Sessions


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Session A3 Interconnection Technologies


Venue MR333

Chair Poi Siong TEO, Infineon Technology, Singapore

[15] The Influence of Bond-pad Smear Crevices on IMC Corrosion in Cu-Al Bonds Mark Luke Farrugia

Presenter: Mark Luke Farrugia, NXP Semiconductors, Netherlands

[170] Copper Clip Package for high performance MOSFETs Ko Lwin Kyaw

Presenter: Ko Lwin Kyaw, N.A,Singapore

[41] Copper Wire Bonding - Elimination of Pad Peel C. E. Tan, Y. J. Pan and T. K. Cheok

Presenter: Y. J. Pan, ON Semiconductor, Malaysia

[47] A Study on Optimization of Process Parameters, Microstructure Evolution and Fracture Behavior for Full Cu3Sn Solder Joints in Electronic Packaging Peng Yao, Xiaoyan Li, Xiaobo Liang and Bo Yu

Presenter: Peng Yao, Beijing University of Technology, China

Technical Sessions


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Session A4 Quality & Reliability


Venue MR334

Chair Kripesh VAIDYANATHAN, ITE Singapore, Singapore

[06] Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling Yuan-wei Chang, Yin Cheng, Feng Xu, Lukas Helfen, Tian Tian, Marco Di Michiel, Chih Chen, King-Ning Tu and Tilo Baumbach

Presenter: Yuan-wei Chang, Karlsruhe Institute of Technology (KIT), Germany, Taiwan

[11] Creep Corrosion on uppf Lead Frame Package Caused by Packing Materials Huan Xu, Harvinderpal Kaur, Wee Kiat Crosby Lim, Dandong Ge, Kurnia Kumara and Ming Xue

Presenter: Huan Xu, Infineon Technologies Asia Pacific, Singapore

[12] Effect of Free-Air-Ball Palladium Distribution on Palladium-Coated Copper Wire Corrosion Resistance Liao Jinzhi, Zhang Xi, Vinobaji Sureshkumar, Bayaras Abito Danila, Chong Kim Hui, Lim Yee Weon, Lo Miew Wan, Loke Chee Keong and Zaiton Bte Bakar

Presenter: Liao Jinzhi, Heraeus Materials Singapore Pte Ltd, Singapore

[17] Reliability Study of No Clean Chemistries for Lead Free Solder Paste in Vapour Phase Reflow Emmanuelle Guene and Aurelie Ducoulombier

Presenter: Aurelie Ducoulombier, Inventec Performance Chemicals, United States

Technical Sessions


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Session A5 Materials & Substrates/Leadframe


Venue MR335

Chair Ashok, Singapore Technology, Singapore

[58] Macro and Micro-Texture Study for Understanding Whisker Growth in Sn Coatings Piyush Jagtap and Praveen Kumar

Presenter: Piyush Jagtap, Indian Institute of Science, Bangalore, India

[59] Leadframe Alloys Cu-Fe-P And Cu-Cr As An Alternative To Cu-Zr For Wheel-Speed Magnetic Sensor Package Matthew M. Fernandez, Richard Jan C. Malifer and Emily A. Gonzales

Presenter: Matthew M. Fernandez, NXP Semiconductors Cabuyao Inc, Philippines

[127] Low Stress Dielectric Layers for Wafer Level Packages to Reduce Wafer Warpage and Improve Board-Level Temperature-Cycle Reliability James T. Huneke and Swee Teck Tay

Presenter: Swee Teck Tay,Designer Molecules Inc, United States

[80] Improvement of Mechanical Properties of In-48mass%Sn Solder by Ag and Cu Addition Taiki Uemura, Taiji Sakai and Seiki Sakuyama

Presenter: Taiki Uemura, Fujitsu Laboratories Ltd., Japan

Technical Sessions


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Session A6 Electrical Modeling & Simulations


Venue MR336

Chair Dr. Gao Siping, IHPC, A*STAR, Singapore

[19] Void Risk Prediction for Semiconductor Packages Considering the Air Venting Analysis with Fluid/Structure Interaction Method Chih-Chung Hsu, Chao-Tsai Huang and Rong-Yeu Chang

Presenter: Chih-Chung Hsu, National Tsing Hua University, Taiwan

[21] Signal Integrity Analysis of SERDES based Communication in 2.5D Integrated Systems using low Cost Silicon Interposer Andy Heinig and Muhammad Waqas Chaudhary

Presenter: Andy Heinig, Fraunhoer IIS/EAS, Germany

[28] Placement of Decoupling Capacitor on Packages Based on Effective Decoupling Radius Jun Wang, Jianmin Lu and Yushan Li

Presenter: Jun Wang, Xidian University, China

[45] Development of UHF to 2. 4GHz and 5. 2GHz Dual Band Up-conversion CMOS Mixer Ryoya Miyamoto, A. I. A. Galal and Haruichi Kanaya

Presenter: Ryoya Miyamoto, Kyushu University, Japan

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15:20 - 16:40

Coffee/Tea Break/ Exhibitor Presentation @ Summit 2

Lam Research : Partnering for Growth in Advanced Packaging, Mr. Lee Chee Ping

Indium Corporation : Materials for Advance Packaging, Ms. Sze Pei LIM

PacTech Asia Sdn. Bhd : PacTech Technology Introduction (commercial video)

SPIL : SPIL Innovative Package Solutions, Mr. Albert Lan

AMAT : Process and Equipment Technology for Advanced Packaging, Dr. Arvind SUNDARRAJAN

ASM : Solutions For Large Format Packaging, Dr. Li Ming

Technical Sessions


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Session B1 Mechanical Modeling & Simulation


Venue MR331

Chair Prof. Tay Andrew, Singapore University of Technology and Design, Singapore

[16] Modeling of the Effect of Heat Flux on Replication Accuracy using Roll-to-roll Micro Hot Embossing S. H. Chen, X. C. Shan, H. H. S. Ng, Z. W. Zhong and Mohaime B. M.

Presenter: S. H. Chen, Singapore Institute of Manufacturing Technology, Singapore

[38] Study on Board Level Solder Joint Reliability for Extreme Large Fan-Out WLP under Temperature Cycling F.X. Che

Presenter: F.X. Che, Institute of Microelectronics, Singapore

[43] Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs Qinghua Zeng, Jing Chen and Yufeng Jin

Presenter: Qinghua Zeng, Peking University, Beijing, China

[65] Novel Way of Characterizing Fracture Toughness of Ultra-Low Temperature SiN Films by Nanoindentation H. Zhang, G. T. W. Goh and Y. Huang

Presenter: H. Zhang, Applied Materials, Singapore

Technical Sessions


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Session B2 Interconnection Technologies


Venue MR332

Chair Dr. Tee Tong Yan, Singapore

[48] Evolution of Structured Adhesive Wafer to Wafer Bonding enabled by Laser Direct Patterning of Polymer Resins Kai Zoschke and Klaus-Dieter Lang

Presenter: Kai Zoschke, Fraunhofer IZM, Germany

[50] Optimizing the IC Wire Short Quality via Six Sigma Approach Tee Swee Xian, Mok Fock Lin and Appukkutty Vinoth Kumar

Presenter: Tee Swee Xian, Infineon Technologies (Advanced Logic) Sdn. Bhd., Malaysia

[86] Basics of Thermosonic Bonding of Fine Alloyed Ag Wires Sarangapani Murali, B. Senthilkumar, Loke Chee Keong, Ei Phyu Phyu Theint and IT Kang

Presenter: Murali Sarangapani, Senior Principal Research Engineer, Singapore

[93] High Bandwidth Interconnect Design Opportunities in 2. 5D Through-Silicon Interposer (TSI) Roshan Weerasekera, Ka Fai Chang, Songbai Zhang, Guruprasad Katti, Hong Yu Li, Rahul Dutta and Joseph Romen Cubillo

Presenter: Ka Fai Chang, Institute of Microelectronics, Singapore

Technical Sessions


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Session B3 Emerging Technologies


Venue MR333

Chair James How

[09] Packaging of 50 x 50 MEMS-Actuated Silicon Photonics Switching Device How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Lee Carroll, Ming C. Wu and Peter O'Brien

Presenter: How Yuan Hwang, Tyndall National Institute, Ireland

[74] Large Area Roll-to-Roll Screen Printing of Electrically Conductive Circuitries B. Salam, X. C. Shan and Wei Jun

Presenter: B. Salam, Singapore Institute of Manufacturing Technology, A-Star, Singapore

[161] Systematic Approach in Testing the Viability of Mechanical Partial-cut Singulation Process towards Tin-Plateable Sidewalls for Wettable Flank on Automotive QFN Technology Patricio Cabading Jr., Sotero Malabanan, Francis Ann Llana, Lester Garcia and Ian Harvey Arellano

Presenter: Ian Harvey Arellano, ST Micro Electronics, Inc., Philippines

[134] Investigation on the Influence of Phosphor Particle Size Gradient on the Optical Performance of White Light-Emitting Diodes Jiaqi Wang, S. W. Ricky Lee and Huayong Zou

Presenter: Shi-Wei Ricky Lee, Hong Kong University of Science and Technology, Hong Kong

Technical Sessions


77

Session B4 Quality & Reliability


Venue MR334

Chair Dr. David Hutt, Loughborough University, UK

[18] Rapid Thermal Annealing to Significantly Reduce Delamination of Silver Thin Film Sputtered on Silicon Dioxide Surface Sivanantham Neelakandan, Peng Koon Chua, Kok Siong Yeo, Bo Zhao and Veera Sae Tae

Presenter: Sivanantham Neelakandan, Lumileds Singapore Pte Ltd, Singapore

[24] Leakage Detection In Wire-Bonding Gas Supply System Yue Zhang and Haoming Chang

Presenter: Yue Zhang, ASM Technology Singapore, Singapore

[46] Effect of Mechanical Properties of the Ceramic Substrate on the Thermal Fatigue of Cu Metallized Ceramic Substrates Hiroyuki Miyazaki, Shoji Iwakiri, Hideki Hirotsuru, Shinji Fukuda, Kiyoshi Hirao and Hideki Hyuga

Presenter: Hiroyuki Miyazaki, National Institute of Advanced Industrial Science and Technology (AIST), Japan

[113] Analysis of Crack and Dislocation of Direct Wafer Bonded Silicon Diaphragm Ling Eng Khoong and Tai Kwee Gan

Presenter: Ling Eng Khoong, Delphi Automotive Systems Singapore Pte Ltd, Singapore

Technical Sessions


78

Session B5 Processes and Automation/Equipment


Venue MR335

Chair Adeline Lim, KnS

[63] Alternative Dicing Solution of Multi-Project Wafer (MPW) by Stealth Dicing Jen-Hsien Chang, Pei-Ling Chen, Chien-Chih Huang, Guo-Hao Cao and Ji-Ye Wang

Presenter: Pei-Ling Chen, SPIL, Taichung, Taiwan

[75] Friction Wear Test Evaluation for Assembly Tool Ong Chen Ho, Alfred Yeo, Tan Han Guan, Ng Lay Peng, Chan Kuok Wai and Lum Chee Choong

Presenter: Ong Chen Ho, Infineon Technologies Asia Pacific Pte. Ltd., Malaysia

[107] Reduction of Cu-Ni-Pd Pad Discoloration Caused by Cu Re-deposition Laura May Antoinette Clemente, Kejun Zeng and Amit Nangia

Presenter: Laura May Antoinette Clemente, Texas Instruments Incorporated, Philippines

[106] Highly Efficient and Accurate Package Electrical Modeling Automation Po-Wei Chiu, Chun-Hung Lin and Hong Shi

Presenter: Po-Wei Chiu, Xilinx Inc., Taiwan

Technical Sessions


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Session B6 Advanced Packaging


Venue MR336

Chair Alvin LEE, Brewer Science

[44] Systematic Development Approach New QFN LTI Package in Logic Segment Andrew Saw Khay Chwan

Presenter: Andrew Saw Khay Chwan, Infineon Technologies (Advance Logic) Sdn. Bhd, Malaysia

[95] A Comparison of Polymers and Solder Alloys by Reliability Tests on Multi-layer Redistribution Lines in Fan out Wafer Level Package Hong-Da Chang, Jay Hsiao, Kenny Liu, H.S Hsu, Andrew You, Carter Ding, Soriente Joshua Pagala, Tammy Zhu, Ivan Chang, James Jiang, Cheng-An Chang, Tommy Sun, George Pan, Nicholas Kao and Jase Jiang

Presenter: Hong-Da Chang, Siliconware Precision Industries Co., Ltd, Taiwan

[103] On-Demand Laser-Sintering of Copper Micro-Particles on Ferrite/Epoxy Resin Substrates for Power Electronics Devices Hisaya Sonoda, Ryosuke Atsumi, Mamoru Mita, Kazuhiko Yamasaki and Katsuhiro Maekawa

Presenter: Hisaya Sonoda, Ibaraki University, Japan

[112] Resist Defined bump with Fluxless Flip Chip bonding for Productivity and Reliability Lee Teck Kheng, Ser Bok Leng, Yan Guo Qiang and Tioh Beng Chuan

Presenter: Teck Kheng Lee, Institute of Technical Education, Singapore

18:30 - 22:30 Conference Banquet ( Venue : Prive @ CHIJMES )

Technical Sessions


80

Friday, 2nd December 2016

Invited Presenters

08:30 - 09:00

MR331

In the IoT development frame : How to address mechanical and thermal issue? Dr. Sebastien Gallois-garreignot, STMicroelectronics

MR332

Laser Processing of Printed Copper Interconnects On Polymer Substrates Dr. David HUTT, Loughborough Univ.

MR333

Package Miniaturization & Integration for Future Automotive Applications Mr. Andreas Fischer, Robert Bosch

MR334

Packaging and Testing of High Speed Rotor for MEMS Gas Turbine Engines Prof. Yan Xiaojun, Beihang Univ.

MR335

Technology and Market Trends in Packaging Mr. Damo Srinivas, Lam Research

MR336

Wafer Bonding as an Enabler for Microsystems Packaging and Integration Prof. Chuan Seng Tan, NTU

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Session C1 Mechanical Modeling & Simulation

Date/Time Friday, 2nd December 2016 / 09:00 - 10:00

Venue MR331

Chair Cheryl Selvanayagam, Advanced Micro Devices, Singapore

[70] Different Conservation Laws Utilized for Warpage Prediction of MUF FCCSP with 4L ETS Chih-Sung Chen, Nicholas Kao and Don Son Jiang

Presenter: Chih-Sung Chen, Siliconware Precision Industries Co. Ltd., Taiwan

[102] Analysis of Moisture Transport Between Connected Enclosures Under a Forced Thermal Gradient ��. Staliulionis, S. Joshy, R. Ambat, M. Jabbari, S. Mohanty and J. H. Hattel

Presenter: ��. Staliulionis, Technical University of Denmark, Denmark

[142] Investigation of Residual Stress Effect during the Anodic Bonding Process with Different Bondable Materials for Wafer Level Packaging Design Xiaodong Hu, Maozhou Meng, Manuel Baeuscher, Ulli Hansen, Simon Maus, Oliver Gyenge, Piotr Mackowiak, Biswajit Mukhopadhyay, N. Vokmer, Oswin Ehrmann, Klaus Dieter Lang and Ha-Duong Ngo

Presenter: Ha-Duong Ngo, Fraunhofer Institute for Reliability and Microintegration, Germany

Technical Sessions


82

Session C2 Materials & Substrates/Leadframe


Venue MR332

Chair LC Tan, NXP, Singapore

[82] Warpage Control Technique for Thin Coreless Substrates Tito T. Mangaoang Jr., Jerome J. Dinglasan, Rammil A. Seguido, Jefferson S. Talledo and Godfrey C. Dimayuga

Presenter: Tito T. Mangaoang Jr., ST Micro electronics, Inc., Philippines

[108] A Halogen-free Epoxy with Intrinsic Flame Retardance for use in Electronic PackagingSong Kiat Jacob, Lim; Jian Rong Eric, Phua; Yu, Bai; Xiao, Hu; Chee Lip and Gan

Presenter: Song Kiat Jacob, Lim, Nanyang Technological University, Singapore

[61] Leadframe-To-Mold Adhesion Performance Of Different Leadframe Surface Morphologies Matthew M. Fernandez, Marianne Therese Bauca and Richard Jan C. Malifer

Presenter: Matthew M. Fernandez, NXP Semiconductors Cabuyao Inc, Philippines

Technical Sessions


83

Session C3 Wafer/Package Level & TSV Testing & Characterization


Venue MR333

Chair Dr. Kim Do Won, Institute of Microelectronics, A*STAR, Singapore

[13] Stabilization and Utilization of Coupling MOS Capacitance between TSVs Runiu Fang, Huan Liu, Min Miao, Xin Sun and Yufeng Jin

Presenter: Runiu Fang, Peking University, China

[72] Gas Chromatography Mass Spectrometry (GC-MS) application in Back End Semiconductor: Chemical Cleaning Efficiency Assessment Lee Chai Ying and Lim Koo Foong

Presenter: Lee Chai Ying, Infineon Technologies (M) Sdn. Bhd., Malaysia

[137] Packaging Solution for a Novel Silicon-based Trace Humidity Sensor using Coulometric Method Piotr Mackowiak, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang, Michael Woratz, Peter Herrmann, Olaf Pohl, Volker Noack, Suyao Zhou, Quoc Cuong Dao,Thanh Hai Hoang and Ha-Duong Ngo

Presenter: Ha-Duong Ngo, Fraunhofer IZM, Germany

Technical Sessions


84

Session C4 Emerging Technologies


Venue MR334

Chair Prof. Chris Balley, University of Greenwich, UK

[85] Evaluation of Printed Heating Elements for Continuous Flow PCR Application W. Fan, B. K. Lok and F. K. Lai

Presenter: W. Fan, Singapore Institute of Manufacturing Technology (SIMTech), Singapore

[143] Highly Efficient and Flexible Plasma based Copper Coating Process for the Manufacture of Direct Metallized Mechatronic Devices Martin Mueller and Joerg Franke

Presenter: Martin Mueller, Friedrich-Alexander University Erlangen-Nuremberg (FAU), Germany

[77] Design and Optimization of Molding Process for MEMS WLSCP Bu Lin, Ding Mian Zhi, Ding Zhi Peng, Peter Chang Hyun Kee, Zhaohui Chen and Boo Yang Jung

Presenter: Lin Bu, IME, Singapore

Technical Sessions


85

Session C5 Processes and Automation/Equipment


Venue MR335

Chair Won Chul Do, Amkor, Korea

[147] Unconventional Copper Wirebond Looping Profile Approach Allen M. Descartin, Wei Yadong, Li Jun, Xu Xuesong and Song Zhanbin

Presenter: Allen M. Descartin, NXP Semiconductors, China

[218] A Novel Flexure-based XY�� Motion Compensator: Towards High-precision Wafer-level Chip Detection Sifeng He, Hui Tang, Qian Qiu, Xiaobin Xiang, JunjieChe, Chuangbin Chen, Jian Gao, Xin Chen and Yunbo He

Presenter: Hui Tang, Guangdong University of Technology, China

Technical Sessions


86

Session C6 Interconnection Technologies


Venue MR336

Chair Ser Choong Chong, Institute of Microelectronics, A*STAR, Singapore

[117] Dissolution in Service of the Copper Substrate of Solder Joints Wayne C. W. Ng, Keith Sweatman, Tetsuya Akaiwa, Takatoshi Nishimura, Michihiro Sato, Christopher Gourlay and Sergey Belyakov

Presenter: Wayne C. W. Ng, Nihon Superior Co. Ltd., Japan

[221] Process Optimization of Zinc Based High Temperature Lead Free Solder for die Attach Application Pan Wei Chih and Baquiran Joseph Aaron Mesa

Presenter: Joseph Aaron Mesa Baquiran, Heraeus Materials Singapore Pte Ltd, Singapore

[145] Investigations on the Oxide Removal Mechanism during Ultrasonic Wedge-Wedge Bonding Process Yangyang Long, Folke Dencker, Friedrich Schneider, Benjamin Emde, Chun Li, Jörg Hermsdorf, Marc Wurz and Jens Twiefel

Presenter: Yangyang Long, Leibniz Universit��t Hannover, Germany

Technical Sessions


87

10:00 - 11:20

Coffee/Tea Break/ Exhibition@ Summit 2

Advisian : Realistic Simulation and Infinite Opportunities, Mr. Nishant Kumar

CST : Signal and Power Integrity Simulations in Packages and PCBs, Mr. Klaus Krohne

ULVAC : ULVAC Solutions for Printed Circuit Board Packaging, Mr. James Tan

Nordson : X-ray Metrology “Measuring the Invisible”, Mr. Steve Hursey

CAD-IT : ANSYS Multiphysics Simulation for IoT, Dr. Lee Yong Jiun

AGC Asia Pacific Pte Ltd : "We are AGC !", Ms. Jasmine Chen

Technical Sessions


88

Session D1 Advanced Packaging


Venue MR331

Chair KL Heng, ACCURUS SCIENTIFIC, Taiwan

[201] Large Format Packaging-an Alternative Format for Discrete Packaging: Its Challenges and Solutions Eric Kuah, Hao JY, WL Chan, Wu Kai, C. Ashokkumar, SC Ho and Leroy Christie

Presenter: Eric Kuah, ASM Technology Singapore, Singapore

[236] Failure Mechanisms of Solder Interconnects under Current Stressing - a Progress Update from Recent Studies on Novel Interconnect Materials Yan Cheong Chan, Yi Li, Fengshun Wu and Zhong Chen

Presenter: Yan Cheong Chan, City University of Hong Kong, Hong Kong

[33] High Throughput Thermo-compression Bonding with Pre-applied Underfill for 3D Memory Applications Adeline B. Y. Lim, Alireza Rezvani, Ryjean Datinguinoo Bacay, Tom Colosimo, Oranna Yauw, Horst Clauberg and Bob Chylak

Presenter: Adeline B. Y. Lim, Kulicke and Soffa Pte Ltd, Singapore

[35] Development of Chip-to-Wafer (C2W) bonding process for High Density I/Os Fan-out Wafer Level Package (FOWLP) Sharon Pei-Siang LIM, Ser Choong Chong, Mian Zhi Ding and Vempati Srinivasa Rao

Presenter: Lim Sharon Pei Siang, Institute of Microelectronics, Singapore

Technical Sessions


89

Session D2 TSV/Wafer Level Packaging


Venue MR332

Chair Santosh Kumar, Yole Development, France

[54] Integrated Clean for TSV: Comparison Between Dry Process and Wet Processes and their Electrical Qualification S. Suhard, Y. Li, A. Iwasaki, S. Van Huylenbroeck, S. Draper, A. Mizutani T. Dory and F. Holsteyns

Presenter: S. Suhard, Imec, Kapeldreef 75 3001 Heverlee Belgium

[104] Board Level Reliability of Automotive eWLB (embedded wafer level BGA) FOWLP Lin Yaojian, Bernard Adams, Roberto Antonicelli, Luc Petit, Daniel Yap, Kim Sing Wong and Seung Wook Yoon

Presenter: Seung Wook Yoon, Stats Chippac Pte Ltd, Singapore

[116] TAIKO Wafer Ball Attach Saskia Schröder, Markus Schröder, Wolfgang Reinert and Karl Heinz Priewasser

Presenter: Saskia Schröder, Fraunhofer ISIT Fraunhofer Str. 1, 125524 Itzehoe, Germany

[120] MEMS WLCSP Development using Vertical Interconnection Boo Yang Jung, Chen Zhaohui, Bu Lin, Ding Mian Zhi, Ding Zhi Peng and Chai Tai Chong

Presenter: Chen Zhaohui, Institute of Microelectronics, Singapore

Technical Sessions


90

Session D3 Quality & Reliability


Venue MR333

Chair Li Ming, ASM, Singapore

[55] Key Parameters Influencing Cu-Sn Interfacial Void Formation Glenn Ross, Vesa Vuorinen and Mervi Paulasto-Kröckel

Presenter: Ross G, Aalto University, Finland

[56] Thin Copper Wire Under Extreme HTSL Stress Duration: Crack Failure Mechanism Characterization R. Enrici Vaion, A Mancaleoni, L Cola, M. De Tomasi and P Zabberoni

Presenter: R. Enrici Vaion, Via C. Olivetti n°2, Agrate Brianza (MB ), Italy

[100] Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective Surfaces–Phase 2 Neil Hubble

Presenter: Neil Hubble, Akrometrix, United States

[125] Reliability Evaluation of Copper (Cu) Through-Silicon Via (TSV) Barrier and Dielectric Liner by Electrical Characterization Jiawei Marvin Chan, Xu Cheng, Kheng Chooi Lee, Werner Kanert and Chuan Seng Tan

Presenter: Jiawei Marvin Chan, Nanyang Technological University of Singapore, Singapore

Technical Sessions


91

Session D4 Mechanical Modeling & Simulation


Venue MR334

Chair Tang Gong Yue, Institute of Microelectronics, A*STAR, Singapore

[164] Optimization of Electronic Enclosure Design for Thermal and Moisture Management using Calibrated Models of Progressive Complexity Sankhya Mohanty, Zygimantas Staliulionis, Parizad S. Nasirabadi, Rajan Ambat and Jesper H. Hattel

Presenter: Sankhya Mohanty, Technical University of Denmark, Denmark

[167] Influence of Sintering Conditions on Mechanical Properties of Ag-nano sintered material Shota Okuno, Qiang Yu and Yusuke Nakata

Presenter: Shota Okuno, Yokohama National University, Japan

[71] Molded Wafer Level Package Evaluation and Characterization Vito Lin, Nicholas Kao and Don Son Jiang

Presenter: Vito Lin, Siliconware Precision Industries Co. Ltd.,Taiwan

[173] Finite Element Analysis of Arbitrarily Complex Electronic Devices Mario Gschwandl, Peter Fuchs, Klaus Fellner, Thomas Antretter, Thomas Krivec and Tao Qi

Presenter: Mario Gschwandl, Polymer Competence Center Leoben, Austria

Technical Sessions


92

Session D5 Materials & Substrates/Leadframe


Venue MR335

Chair Tan Chuan Seng, Nanyang Technology University, Singapore

[144] Characterization of Anodic Bondable LTCC for Wafer-Level Packaging Xiaodong Hu, Manuel Bäuscher, Piotr Mackowiak, Yucheng Zhang, Ole Hoelck, Hans Walter, Martin Ihle, Steffen Ziesche, Ulli Hansen, Simon Maus, Oliver Gyenge, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang and Ha-Duong Ngo

Presenter: Xiaodong Hu, Technischen Universität Berlin, China

[180] A Study on Dimensional Variation in Flexible Printed Circuits During Post-Lamination Baking Ruey Jun Yan, Zalina Abdullah, Chee Wei Mok, Mihai D. Rotaru and Suan Hui Pu

Presenter: Ruey Jun Yan, University of Southampton Malaysia Campus, Malaysia

[209] Warpage Behavior of SiP's built with Different Bumping Solutions, Substrate Designs and Encapsulant Materials Quan Qi and Carlton Hanna

Presenter: Quan Qi, Intel, United States

[119] Study of De-gate Remnant Resolution with High Reliability Performance Moulding Compound Ng S.P, Wang H.T and Goo F.T

Presenter: Goo F.T, Infineon, Malaysia

Technical Sessions


93

Session D6 Electrical Modeling & Simulation


Venue MR336

Chair Mihai Rotaru, University of Southampton , UK

[57] Determination of Dielectric Thickness, Constant, and Loss Tangent from Cavity Resonators A. Ege Engin, Ivan Ndip, Klaus-Dieter Lang and Jerry Aguirre

Presenter: A. Ege Engin, San Diego State University, United States

[64] A Novel Trench Routing for Next-Generation High-Speed Serial Buses Beyond 10Gbps Applications Jackson Kong, Bok Eng Cheah, Khang Choong Yong, Howard Heck and Louis Lo

Presenter: Jackson Kong, Intel Microelectronics (M) Sdn. Bhd., Malaysia

[76] Novel Impedance Matching Technique for Pogo Pin Design Chee Hoe Lin

Presenter: Chee Hoe Lin, AMD Singapore, Singapore

[101] High Efficiency Energy Harvesting Circuit with Impedance Matched Antenna Yuharu Shinki, Kyouhei Shibata, Mohamed Mansour and Haruichi Kanaya

Presenter: Yuharu Shinki, Kyushu University, Japan

12:40 - 13:50

Lunch @ Summit 2

Presentation of Appreciation to Invited Papers' Authors

18th Electronic Packaging Technology Conference Organisation Committee Appreciation

19th Electronic Packaging Technology Conference Introduction

Technical Sessions


94

Invited Presenters

13:50 - 14:20

MR331

Enabling Design for Reliability in Advanced Interconnects for 3D IC and Next Generation Solar PV (Photovoltaics) Systems Prof. Arief Budiman, SUTD

MR332

Multi-die integration using advanced fan-out packaging technology Mr. WonChul Do, Amkor

MR333

Materials and Processes of Fan-out Wafer/Panel Level Packaging Dr. Li Ming, ASM

MR334

3D-Printing and Electronic Packaging: Current Status and Future Challenges Prof. Christopher Bailey, University of Greenwich

MR335

Patent Monetization Mr. Dexter Chin, Horizon IP Pte Ltd

MR336

Requirement for Advanced Packaging Technology of Power Semiconductor Module in High Power Density Converter for More Electric Transportation Dr. Rejeki Simanjorang, Rolls Royce

Technical Sessions


95

Session E1 Quality & Reliability


Venue MR331

Chair Chin Hui CHONG, Micron Technology, Singapore

[129] Bromine induces Corrosion in Reliability Test Ni Hsing Lee, Cheng Fu Yu, Orla O Halloran, Abdellatif Firiti, Zemre Acar , Nicolas Cannesan, Yuan Wen Hao, Jyun Ji Chen, Johan Tsai, Peter Sun and Sharon Chen

Presenter: Ni Hsing Lee, NXP Semiconductors, Taiwan

[133] Improving Intrinsic Corrosion Reliability of Printed Circuit Board Assembly Rajan Ambat and Hélène Conseil-Gudla

Presenter: Rajan Ambat, Technical University of Denmark, Denmark

[211] High Lead Solder Failure and Microstructure Analysis in Die Attach Power Discrete Packages Kenny Chiong, Hong Wen Zhang and Sze Pei Lim

Presenter: Kenny Chiong, Sr. Technical Engineer, Singapore

[148] Flip Chip Laser Mark Bare Die Strength Characterization Kesvakumar Muniandy, Ilko Schmadlak, Betty Yeung, Matt Lauderdale and Trent Uehling

Presenter: Kesvakumar Muniandy, NXP Semiconductor, Malaysia

Technical Sessions


96

Session E2 TSV/Wafer Level Packaging


Venue MR332

Chair Damo Srinivas, Lam Research, Singapore

[122] Novel WLCSP Technology Solution for Fusion Device of CMOS Integrated Circuit with MEMS. Takahide Murayama, Toshiyuki Sakuishi and Yasuhiro Morikawa

Presenter: Yasuhiro Morikawa, ULVAC,Inc.Institute of Semiconductor and Electronics Technologies Division 3rd Section 1st, Japan

[156] Integration of Low Temperature PECVD Deposited Silicon Oxides with Advanced Packaging Chunmei Wang, Steven Lee, Xiangyu Wang, King Jien Chui and Mingbin Yu

Presenter: Chunmei Wang, Institute of Microelectronics, Singapore

[185] Overlay Performance of Through Si Via Last Lithography for 3D Packaging Warren W. Flack, Robert Hsieh, Gareth Kenyon, John Slabbekoorn, Piotr Czarnecki, Bert Tobback, Stefaan Van Huylenbroeck, Michele Stucchi, Tom Vandeweyer and Andy Miller

Presenter: Gareth Kenyon, Ultratech, USA

[212] An Accurate Calculation Method on Thermal Effectiveness of TSV and Wire Yudan Pi, Wei Wang and Yufeng Jin

Presenter: Yudan Pi, Peking University, China

Technical Sessions


97

Session E3 Interconnection Technologies


Venue MR333

Chair Hong Meng HO, STATS ChipPAC Pte Ltd., Singapore

[157] The Exploration and Characterization of Insulated Au-Flash PdCu Wire Bonding Applications Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Su Dan, Tok Chee Wei, Loh Wan Yee and Zhangxi

Presenter: Siong Chin Teck, NXP Semiconductors, Malaysia

[160] Manufacturing and Characterization of Die to Die Interconnections for 3D Applications in Harsh Environmental Conditions C. Hartler, J. Siegert, F. Schrank, M. Schrems, Z. Hajdarevic and S. Bulacher

Presenter: C. Hartler, AMS AG, Austria

[225] Pressureless Low Temperature Sintering Paste for NiAu PCB Substrate Yong Ling Xin, Tan Juo Yan, Wolfgang Schmitt, Jens Nachreiner and Chew Ly May

Presenter: Ling Xin Yong, Heraeus, Singapore

[237] Double Side Sintered IGBT 650V/ 200A in a TO-247 Package for Extreme Performance and Reliability Gustavo Greca, Paul Salerno, Jeffrey Durham, Francois Le Henaff, Jean Claude Harel, Johan Hamelink and Weikun He

Presenter: Johan Hamelink, Boschman Technologies, Netherlands

Technical Sessions


98

Session E4 Emerging Technologies


Venue MR334

Chair Charles LEE, ASE, Singapore

[78] Gravure Printing of Ag Electrodes for Electroluminescent Lighting Vasudivan Sunappan

Presenter: Vasudivan Sunappan, Singapore Institute of Manufacturing Technology, Singapore

[178] Embedding of Wearable Electronics into Smart Sensor Insole M. Hubl, O. Pohl, V. Noack, P. Hahlweg, C. Ehm, M. Derleh, T. Weiland, E. Schick, H-H. Müller, D. Hampicke, P. Gregorius, T. Schwartzinger, T. Jablonski, J.-P. Maurer, R. Hahn, O. Ehrmann, K.-D. Lang, E. Shin and H.-D. Ngo

Presenter: M. Hubl, University of Applied Science (HTW), Germany

[190] Copper Circuit Traces by Laser Cladding with Powder Injection for Additive Manufactured Mechatronic Devices Martin Mueller, Oliver Hentschel, Michael Schmidt and Joerg Franke

Presenter: Martin Mueller, Friedrich-Alexander University Erlangen-Nuremberg (FAU), Germany

[188] An Innovative Approach to Accelerate High Temperature Operating Endurance Test for Automotive Electronic Control Units. Abdalla Youssef, Ingo Birner, Robert Vodiunig, Jean Thierauf, Holger Voelkel, Hans Walter, Andreas Middendorf, Klaus-Dieter Lang

Presenter: Abdalla Youssef, BMW Group, Germany

Technical Sessions


99

Session E5 Materials & Substrates/Leadframe


Venue MR335

Chair Vempati Srinivasa RAO, Institute of Microelectronics, A*STAR, Singapore

[224] Effect of Doping Element on the Interfacial Reaction Behavior of Ag Alloy Wires Bonding on Al Pad after HTST and TCT Tests Yu-Wei Lin, Mei-Chen Su, Wei-Hsiang Huang, Ying-Ta Chiu, Te-Ping Shih and Kwang-Lung Lin

Presenter: Yu-Wei Lin, R&D, Precision Packaging Materials Corp. (PPM), Taiwan

[96] Influence of Package Lead Type Onto Final Test Contacting Praveen Kumar Ramamoorthy, Tan Han Guan, Alfred Yeo and Yang Kai

Presenter: Praveen Kumar Ramamoorthy, Infineon Technologies Asia Pacific Pte Ltd, Singapore

[223] Test Method to Evaluate a Robust Ball Grid Array (BGA) Ball Mount Flux Sheng-Hung Chou, Yan Liu, Maria Durham, Sze Pei Lim, Te-Hua Fang and Yu-Jen Hsiao

Presenter: Sheng-Hung Chou, Indium Corporation 29 Kian Teck Avenue Singapore 628908

Technical Sessions


100

Session E6 Electrical Modeling & Simulation


Venue MR336

Chair Wui-Weng WONG, Advanced Micro Devices, Singapore

[136] Performance Modeling and Broadband Characterization of Chip-to-Chip Interconnects with Rough Surfaces Rohit Sharma and Somesh Kumar

Presenter: Rohit Sharma, IIT Ropar, India

[158] Signal Integrity and Crosstalk Analysis of the Transmission Lines on SOI Substrate for High-Speed up to 50 GHz Do-Won Kim, Chao Li and Patrick Lo Guo Qiang

Presenter: Do-Won Kim, Institute of Microelectronics, Singapore

[184] Multi-Port High Bandwidth Interconnect Equivalent Circuit Model for 3. 2 Gbps Channel Simulation Hui Lee Teng and Yee Huan Yew

Presenter: Hui Lee Teng, Altera Corporation, Malaysia

[227] Antenna Array Integrated on Multilayer Organic Package for Millimeter-wave Applications Cheng-Yu Ho, Ming-Fong Jhong, Po-Chih Pan, Chen-Chao Wang, Chun-Yen Ting, Ken-Huang, Lin, En-Yi, Hsueh, Shang-Hao, Liu, and Hung-Chia and Chang

Presenter: Cheng-Yu Ho, Advanced Semiconductor Engineering Group, Taiwan

Technical Sessions


101

15:40 - 16:10 Coffee/Tea break & Interactive Session II at Foyer 5

Interactive Session II at Foyer 5

[97] Thermal Design and Temperature Gradient Analysis for a Thermoelectric Energy Harvest Device in Off-shore and Marine Application Gongyue Tang, Sarbudeen Mohamed Rabeek and Muthukumaraswamy Annamalai Arasu

Presenter: Gongyue Tang, Institute of Microelectronics, Singapore

[130] Modeling The Package IP Physical Model and Verification. Che-Shuan Lin, Bo-You Chen, Sung-Mao Wu, Cheng-Chang Chen and Ming-Shan Lin

Presenter: Che-Shuan Lin, National University of Kaohsiung, Taiwan

[92] Development of Wafer Level Laminated Magnetic Thin Film for Integrated Voltage Regulator Application Jun Yu, Muthukumaraswamy Annamalai Arasu and Sunil Wickramanayaka

Presenter: Jun Yu, Institute of Microelectronics, Singapore

[152] Evaluation on Multiple Layer PBO-based Cu RDL Process for Fan-Out Wafer Level Packaging (FOWLP) Soh Siew Boon, K.J. Chui, David Ho S.W., S.A. Sek, Mingbin Yu, Prayudi Lianto, Yu Gu, Guan Huei See and Marvin L. Bernt

Presenter: Serine Soh, Institute of Microelectronics, Singapore

[171] Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips Wei Meng, Yong Guan, Qinghua Zeng ,Jing Chen and Yufeng Jin

Presenter: Wei Meng, Peking University, China

[179] Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer Yong Guan, Shenglin Ma, Qinghua Zeng, Wei Meng, Jing Chen and Yufeng Jin

Presenter: Yong Guan, Peking University, China

[181] Fine Pitch RDL Patterning Characterization Chen Bing, Soh Siew Boon, Ho Soon Wee and Jung Boo Yang

Presenter: Bing Chen, Institute of Microelectronics, Singapore

[183] Evolution of the Topographical and Chemical Signatures of Plasma-treated Surfaces along the Staging Time Pathway Ian Harvey Arellano and Amor Zapanta

Presenter: Ian Harvey Arellano, ST Micro electronics, Inc., Philippines

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Technical Sessions


102

[199] Process Considerations, Process Challenges and Manufacturing Systems for Roll-to-Roll Processing X. C. Shan, S. H. Chen, B. Salam, M. B. Mohahidin and J. Wei

Presenter: X. C. Shan, Senior Scientist, Singapore

[207] Plasma Etching of SiO2 with Tapered Sidewall for Thin Film EncapsulationVladimir Bliznetsov, Bin Li, Jae Wung Lee and Huamao Lin

Presenter: Vladimir Bliznetsov, Institute of Microelectronics, Singapore

[210] Ultrasonic Power Closed-loop Control on Wire Bonder He Yunbo, Hu Yongshan, Chen Xin, Gao Jian, Yang Zhijun, Zhang Kai, Chen Yun, Zhang Yu, Tang Hui and Ao Yinhui

Presenter: Hu Yongshan, Guangdong University of Technology, China

[213] Novel Correctable Testing Interface for High Speed/Frequency Device Testing Chih-Cheng Chuang, Kuan-I Cheng, Sung-Mao Wu, Lung-Shu Huang and Bang-Cheng Chiu

Presenter: Chih-Cheng Chuang, National University of Kaohsiung, Taiwan, Taiwan

[246] Thermal Effect on Fan-out Wafer Level Package Strength Cheng Xu, Z. W. Zhong and W. K. Choi

Presenter: Cheng Xu, Nanyang Technological University, Singapore

[267] Thermomechanical Reliability of a Cu-TSV Integration Model based on 3D Fabrication Processes Yunna Sun, Seung-lo Lee, Yanmei Liu, Jiangbo Luo, Yan Wang, Guifu Ding, Hong Wang and Jinyuan Yao

Presenter: Yunna Sun, Shanghai Jiao Tong University, China

[268] A High Efficient Integrated Heat Dissipation Systems with CNT Array based Heat Lines and Microchannel Heat Sink in 3D ICs Yunna Sun, Seung-lo Lee, Qiu Xu, Jiangbo Luo, Hongfang Li, Yan Wang, Guifu Ding and Xiaolin Zhao

Presenter: Yunna Sun, Shanghai Jiao Tong University, China

[193] The Study of Bond Pad Discoloration in Power Package Assembly Zhang Ruifen, Baquiran and Joseph Aaron Mesa

Presenter: Zhang Ruifen, project lead, Singapore

[216] Effects of Humidity on the Electro-Optical-Thermal Characteristics of High-Power LEDs T.K. Law, Fannon Lim, Y. Li, J.W.Ronnie Teo and Sophia Wei

Presenter: Thong Kok Law, University of Glasgow, UK. Nanyang Polytechnic, Singapore

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Technical Sessions


103

Session F1 Mechanical Modeling & Simulation


Venue MR332

Chair Prof. Yan Xiaojun, Beihang University, China

[194] Brittle Fracture and Damage in Bond Pad Stacks �� A Study of Parameter Influences in Coupled XFEM and Delamination Simulation of Nanoindentation J. Albrecht, J. Auersperg, G. M. Reuther, P. W. Kudella, J. Brueckner, S. Rzepka and R. Pufall

Presenter: J. Albrecht, Micro Materials Center, Germany

[202] Modelling Solder Extrusion Using J-integral Method Cheryl Selvanayagam and Teng Di Sheng

Presenter: Cheryl Selvanayagam, AMD, Singapore

[208] Effect of Interconnect Plasticity on Soldering Induced Residual Stress in Thin Crystalline Silicon Solar Cells Sasi Kumar Tippabhotla, Ihor Radchenko, Wenjian Song, N. Tamura, Andrew A. O. Tay and A. S. Budiman

Presenter: Sasi Kumar Tippabhotla, Singapore University of Technology, Singapore

[168] Development of Evaluation Method That Takes into Account the Effect the Fine Structure of Adhesive Interface for Delamination Strength of the Packaging Resin Yukichi Furuyama, Okihisa Honda and Qiang Yu

Presenter: Yukichi Furuyama, Yokohama National University, Japan

Technical Sessions


104

Session F2 TSV/Wafer Level Packaging


Venue MR333

Chair Boo Yang JUNG, Global Foundries, Singapore

[195] Isolate Micro-bump Process Development and Improvement H. Y. Li, Leong Yew Wing, Hwang Gilho, Chong Kok Piau, Norhanani Binte Jaafar and Surasit Chungpaiboonpatana

Presenter: H. Y. Li, Institute of Microelectronics, Singapore

[233] Understanding Size Effects in the Advanced Through-Silicon Via Interconnect Schemes for 3D ICs Imran Ali, Ihor Radchenko, Sasi Kumar Tippabhotla, Song Wenjian M.Ridhuan, Andrew A. O. Tay, Nobumichi Tamura, Seung Min Han and Arief SuriadiBudiman

Presenter: Imran Ali, Pillar of Engineering Product Development, Singapore University of Technology & Design, Singapore 138682, Singapore

[205] Laser Multi Beam Full Cut Dicing of wafer level chip-scale packages (Fan In) Jeroen van Borkulo, Eric M. M. Tan and Richard Boulanger

Presenter: Jeroen van Borkulo, ASM Pacific Technology Ltd., Netherlands

[191] Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration Huan Liu, Qinghua Zeng, Yong Guan, Runiu Fang, Xin Sun, Fei Su, Jing Chen, Min Miao and Yufeng Jin

Presenter: Huan Liu, Peking University, Beijing, China

Technical Sessions


105

Session F3 Quality & Reliability


Venue MR334

Chair Alfred YEO, Infineon Technology, Singapore

[172] Reliability Evaluation of Car Power Module using Electrical-Thermal-Structural Coupled Analysis based on Field Driving Data Shingo Nakayama, Hirotaka Morita and Qiang Yu

Presenter: Shingo Nakayama, Yokohama National University, Japan

[111] Drop Impact Reliability Study of High Density Fan-Out Wafer Level Package Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai and Vempati Srinivasa Rao

Presenter: Zhaohui Chen, Institute of Microelectronics, Singapore

[189] Copper Ball Bond Recipe Cliff Test on Two Pad Aluminum Thicknesses Kok Inn Hoo, Edsel DeJesus, Priscila Brown, Rachel Wynder, Alan Eddington and Stevan Hunter

Presenter: Kok Inn Hoo, ON Semiconductor, Malaysia, ON Semiconductor, USA, and BYU-Idaho, USA

[135] Semi-Empirical Prediction of Moisture Build up in an Electronic Enclosure using Analysis of Variance (ANOVA) Parizad Shojaee Nasirabadi, H��l�ne Conseil-Gudla, Sankhya Mohanty, Masoud Jabbari, Rajan Ambat and Jesper H. Hattel

Presenter: Parizad Shojaee Nasirabadi, Technical University of Denmark, Denmark

Technical Sessions


106

Session F4 Advanced Packaging


Venue MR335

Chair Shan GAO, Global Foundries, Singapore

[140] 3D IC Assembly using Thermal Compression Bonding and Wafer-Level Underfill-Strategies for Quality Improvement and Throughput Enhancement Teng Wang, Pieter Bex, Giovanni Capuz, Fabrice Duval, Fumihiro Inoue, Carine Gerets, Julien Bertheau, Kenneth June Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Masanori Natsukawa, Kazuyuki Mitsukura and Keiichi Hatakeyama

Presenter: Kenneth June Rebibis, IMEC, Belgium

[99] Copper Wire Bond Pad/IMC Interfacial Layer Crack Study During HTSL (high temperature storage life) Test Mingchuan Han, Miao Wang, Lidong Zhang, Beiyue Yan, Jun Li, Meijiang Song and Varughese Mathew; Allen M. Descartin

Presenter: Allen M. Descartin, NXP semiconductor Tianjin, China

[200] Integration of MEMS/ Sensors in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP) André Cardoso, Steffen Kroehnert, Raquel Pinto, Elisabete Fernandes and Isabel Barros

Presenter: Steffen Kroehnert, NANIUM S. A., Portugal and Germany

[146] Copper Electrodeposition Advancements for FOWLP Bryan Buckalew

Presenter: Bryan Buckalew, Lam Research

Technical Sessions


107

Session F5 Thermal Characterization & Cooling Solutions


Venue MR336

Chair Edwin Teo, Nanyang Technology University, Singapore

[66] Heat Dissipation Capability of Package with Integrated Processor and 3D-Stacked Memory Yong Han, F. X. Che, Sharon Seow Huang Lim and Masaya Kawano

Presenter: Yong Han, Institute of Microelectronics, Singapore

[114] A Way for Measuring the Temperature Transients of Capacitors Zoltan Sarkany and Marta Rencz

Presenter: Zoltan Sarkany, Mentor Graphics, Hungary

[109] Thermal Design and Analysis of High Power SiC Module with Low Profile and Enhanced Thermal Performance Tang Gongyue, Lee Jong Bum and Chai Tai Chong

Presenter: Tang Gongyue, Institute of Microelectronics, Singapore

Session IEEE CPMT PKG Roadmap Workshop


Venue MR331

Chair Bill Chen, ASE, Singapore

17:30 - 18:00

Summit 2

Keynote Address 6: Light-Emitting Diodes for Non-Lighting Applications ~ beyond seeing and being seen ~ Prof. Ricky SW Lee, Hong Kong Univ. Science & Technology

18:00 - 18:20 Closing Ceremony and Lucky Draw @ Summit 2

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Technical Sessions


108

Saturday, 3rd December 2016 �

08:30 - 12:00SUTD(Singapore University of Technology and Design) Visit to ( 3D fabrication lab / International Design Centre / Jackie Chan Ancient Chinese Structures)

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Technical Sessions


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