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F U T U R E T E C H N O L O G Y M A G A Z I N E 19-viii EMEA

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LATESTNew K32 L3

microcontrollers from NXP Semiconductors

save power and harden security

SEE PAGE 3

DESIGNHow new PoE

controllers supply up to 90W over

Ethernet cabling SEE PAGE 12

TECH VIEWChip makers’ latest

design tools for machine learning

SEE PAGES 22-23

FEATURECONNECTIVITY

FROM PAGE 13

2 ©Copyright 2019 Future Electronics Ltd. All trademarks contained herein are the property of their respective owners. Applications for product samples, badge boards, demonstration boards, Future Electronics’ boards and other advertised materials from Future Electronics are offered subject to qualification. Images of product packages throughout this publication are for illustration purposes and not necessarily an exact representation of the advertised part. FTM IS ONLINE @ WWW.MY-FTM.COM – FOR PREVIOUS ISSUES AND MORE 3

Broad new family of Arm Cortex-M-basedmicrocontrollers offers high security and software flexibility

Switching regulator module operates over wide input-voltage range up to 72V DC

AC-DC converter ICs’ low standby current ideal for always-on appliances

Low-power MCUs offer advanced security including protection against physical tampering

The RA family includes the RA2, RA4 and RA6 series, giving users a wide choice of performance ratings and features. Designers using the Renesas RA family can meet the requirements for scalability, power consumption and performance of almost any embedded end product.

The launch of the RA family offers a new option for designers working in an Arm Cortex-M environment, and who want to retain existing software assets. It is an alternative to the Renesas Synergy™ family of MCUs, which includes parts based on various Arm Cortex-M cores. These parts enable re-use of software created in the Synergy environment when migrating from one MCU to another, to reduce PCB layout effort and increase manufacturing efficiency.

Now the addition of the RA MCU family gives designers a Renesas option which offers the flexibility to use existing and legacy software for the Arm Cortex-M architecture.

There is broad feature and pin compatibility across the three series of RA MCUs.

The AP3917 family consists of the AP3917B, rated for a 170mA nominal load, AP3917C for a 270mA load and the AP3917D, which has a 370mA rating.

Based on a high-performance Arm® Cortex®-M4 processor, supported by a low-power Cortex-M0+ co-processor, the K32 L3 is ideal for applications which require a host MCU and a low-power MCU.

Low power consumption and high efficiency are the hallmarks of this new family of NXP MCUs. NXP has made valuable improvements in power optimization and dynamic power performance. The K32 L3 features low static power consumption with full data retention. It also offers a 50% drop in Run current and an 80% reduction in wake-up time from deep sleep compared to its predecessors.

NXP has also built high security into the K32 L3 family, to enable users to protect against threats that compromise networks. State-of-the-art cryptography, including secure boot

This provides scalability and easy code re-use between one device and another. The RA family includes:• RA2A1, offering highly integrated, high-

accuracy analog capabilities and an Arm Cortex-M23 core

• RA4M1, for control applications which drive a segment LCD panel. It offers low-power operation and high performance thanks to its Arm Cortex-M4 core

• RA6M1, ideal for IoT endpoint devices because of its high-level security features

• RA6M2, suitable for automation applications. Upward-compatible with RA6M1 devices.

• RA6M3, offering the highest performance specifications in the family, with the largest memory options and a rich feature set including TFT LCD controller, 2D graphics engine, Ethernet connectivity and Hi-Speed USB. Like the other RA6 devices, the RA6M3 is based on an Arm Cortex-M4 core.

The RA family MCUs include an integrated capacitive touch-sensing unit for display control.

RECOM’s R-78HE5.0-0.3 is a low-cost industrial-grade regulator supplied in a classic 3-pin SIP format. It accepts an input voltage of up to 72V DC, and provides a tightly regulated 5V output at a maximum 300mA current. It includes built-in short-circuit protection.

The module operates over a wide ambient-temperature range of -40°C to 105°C without load de-rating. It is also exceptionally reliable: mean time before failure is 15 million hours. Consistently high quality is assured, as production is carefully controlled in an IATF 16949-certified factory.

The small AP3917 parts offer direct, non-isolated AC-DC conversion at high efficiency, while drawing a low standby current. These attributes are in increasing demand due to the proliferation of small, mains-powered appliances operating as either stand-alone devices or as IoT endpoints. Offering high conversion efficiency both at full and light loads, the AP3917 parts support both discontinuous and continuous conduction modes.

The AP3917 buck switcher can convert a full-wave rectified AC input voltage of between 85V and 265V AC to a nominal 8.0V DC output. Its non-isolated design requires no external transformer and few external components, saving space and bill-of-materials cost.

Featuring no-load power consumption of <30mW, the AP3917 buck switchers are particularly suitable for small appliances which operate in standby mode for prolonged periods when connected to an AC outlet.

and update functionalities, and robust enablement with NXP’s MCUXpresso software and tools, protect the confidentiality, integrity and authenticity of the host device and its data. The MCU also features tamper detection pins for protection against local physical attack.

The Renesas RA family is a new range of 32-bit MCUs which is based on the Arm® Cortex®-M core architecture, and which benefits from Renesas’ best-in-class technology for embedded system peripherals.

A new high input-voltage switching regulator module, the R-78HE from RECOM, provides excellent versatility and quality for use in industrial equipment powered by a 48V battery.

Diodes Incorporated has announced the AP3917 family of non-isolated AC-DC switching buck converters for low-power applications powered by a mains electricity outlet.

NXP Semiconductors has launched the K32 L3 family, the third generation of its Kinetis line of 32-bit microcontrollers. The K32 L3 offers marked improvements in power optimization and security capabilities, helping OEMs to implement innovative designs across a wide range of industrial and IoT applications.

The R-78HE supplies a regulated 5V output

AP3917: High conversion efficiency

COMPONENT FOCUS COMPONENT FOCUS

APPLICATIONS• Home and building automation• Industrial automation• Energy management systems• Healthcare equipment • Industrial IoT devices

FEATURES• Supported by open Flexible Software

Package (FSP) – Based on FreeRTOS – Can be replaced by any other RTOS or

middleware• IDE support:

– Renesas e²studio – KEIL MDK

• Supports GNU Arm Compiler version 6• Cryptography module• True random number generator

FREE DEVELOPMENT BOARDS Orderable Part Numbers: RTK7EKA2A1S00001BU RTK7EKA4M1S00001BU, RTK7EKA6M1S00001BU RTK7EKA6M2S00001BU, RTK7EKA6M3S00001BU

Apply at: www.my-boardclub.com

APPLICATIONS• Industrial CAN bus devices• 36V/48V lithium-ion battery-powered

equipment• Off-grid solar power supplies • Remote powered units with long supply

cables

FEATURES• ±1% output voltage tolerance• High efficiency • Low ripple and noise• 100V surge capability

APPLICATIONS• Home appliances • Office equipment • Industrial devices • IoT devices

FEATURES• 200µA operating current• 2W power rating• Frequency modulation to suppress EMI• Over-temperature protection• Overload protection• Short-circuit protection

APPLICATIONS• Building automation

– Security and access control – Building control and monitoring – HVAC control – Secure applications

• Industrial – Factory automation – Robotics

• Smart home – Door locks – Smart thermostats – Lighting control – Security systems

FEATURES• Full-Speed USB controller• Interfaces:

– 4 x UART, SPI and I2C – 1 x I2S/serial audio and SDHC

• 12-bit ADC and 12-bit DAC• 1.2V/2.1V dual-range voltage reference• Cryptographic accelerator• Four tamper detection pins• Authenticated boot• Encrypted/authenticated update capability

FOR PRICING ANDSAMPLES E-MAIL: [email protected]

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FREE DEVELOPMENT BOARD This Freedom Development Board includes a K32L3A60VPJ1A MCU backed by serial Flash memory, an NXP FXOS8700CQ digital 3D accelerometer and magnetometer, OpenSDA and single-wire debug capability, and full MCUXpresso software and tools support.

Orderable Part Number: FRDM-K32L3A6


FTM IS ONLINE @ WWW.MY-FTM.COM – FOR PREVIOUS ISSUES AND MORE4 5FOLLOW US @ FUTURE TECHNOLOGY MAGAZINE

SiC MOSFETs’ new package gives higher efficiency when switching at high frequency

15Mbits/s optocouplers offer high noise tolerance for use in industrial applications

New cost-saving package option to widen access to high-performance crossover MCU line

New module integrates low-profile reflective object sensor in complete PCB assembly

These new trench gate MOSFETs benefit from the properties of the SiC material: • Fast switching capability to enable the use of a

smaller, lighter inductor • Low switching losses for high efficiency • Operation at high temperature to reduce the

need for cooling devices such as heat-sinks

ROHM’s new four-pin TO-247 package separates the power and driver source terminals for improved switching performance. In particular, the new package produces lower turn-on losses. Total turn-on and turn-off losses are as much as 35% less than those of the equivalent SiC MOSFETs in a conventional three-pin TO-247N package.The new four-pin TO-247 MOSFETs are:• 650V SCT3030AR • 1,200V SCT3040KR • 650V SCT3060AR • 1,200V SCT3080KR • 650V SCT3080AR • 1,200V SCT3105KR

The RV1S9x60 devices operate at a low threshold input current, just 2.0mA in the case of the RV1S9160A, from a 3V to 5V power supply, to give low power consumption. Featuring a minimum common-mode ratio of 50kV/μs, these optocouplers are suitable for use in electrically noisy industrial environments, where they may be used to isolate sensitive

The new i.MX RT1010 is the lowest-cost product on the market to include a high-performance Arm® Cortex®-M7 core. In the i.MX RT1010, this core offers high-performance, real-time processing: operating at up to 500MHz, it draws on 128kbytes of tightly coupled SRAM memory to produce a low-latency response time of just 20ns.

The new device is supplied in a low-cost 80-pin LQFP package which supports true two-layer PCB design, and which simplifies PCB layout. It has a 12mm x 12mm footprint with a pitch of 0.5mm.

The extensive list of integrated features includes a quad and octal serial NOR Flash memory interface, a Hi-Speed USB 2.0 controller and transceiver, an audio interface, support for wireless

standards, and flexible interfacing through an on-chip 32-channel FlexIO module.

The i.MX RT1010 is fully supported by NXP’s MCUXpresso software and tools.

The module integrates the OPB9000 reflective sensor alongside peripheral circuitry such as resistors, regulators and capacitors in a robust PCB assembly measuring 18mm x 12mm x 5mm.

The sensor can detect objects as far away as 50mm using standard 90% reflective material, and objects as small as 2.5mm depending on the range.

components such as microcontrollers from high transient voltages while enabling the high-speed transmission of input signals.

Two of the parts, the RV1S9160A and RV1S9060A, also support operation in high ambient temperatures up to 125°C in a logic interface circuit, giving the board designer the freedom to place the optocoupler close to hot

components such as IGBTs or MOSFETs.There are three parts in this Renesas

optocoupler family. The smallest, the RV1S9160A, is housed in a 5-pin SOP package, and offers 200V of basic insulation. Slightly bigger, the RV1S9060A in an LSO5 package gives increased creepage of 8mm and 200V/400V of reinforced insulation.

The largest part is the RV1S9960A in an LSDIP package. This gives 14.5mm of creepage and 690V of reinforced insulation in an inverter, or 1,000V of basic insulation in a solar power conditioner.

The OPB9001 can also be programmed to measure distances within its reflective range. It rejects interference from ambient light at intensity up to 25,000lux.

The OPB9001 accepts a wide supply-voltage range from 3.3V to 30V, and is supplied with built-in over-voltage protection. An integrated, industry-standard four-pin Molex connector provides for easy connections, while on-board LED indicators indicate the module’s status during power-on, output and calibration.

Factory calibrated for a 12mm distance and a white reflective surface, the OPB9001 can be re-calibrated in milliseconds with a single command to meet different requirements. An interface cable can be purchased separately to calibrate the OPB9001 using the OPB9000-KIT.

ROHM Semiconductor has extended its portfolio of N-channel Silicon Carbide (SiC) MOSFETs to include new 650V- and 1,200V-rated devices supplied in a four-pin, through-hole TO-247 package which provides for high efficiency when switching at high frequency.

The Renesas RV1S9x60 family of optocouplers supports data-transfer rates of up to 15Mbits/s and offers high noise tolerance.

The i.MX RT1010 from NXP Semiconductors offers a new low-cost option for designers who want to take advantage of the features of NXP’s crossover microcontrollers: the high processing

capability and integrated capabilities of an applications processor with the ease of use and real-time performance of a microcontroller.

TT Electronics has launched the versatile OPB9001, a complete reflective sensor module for industrial and medical applications.

ROHM Semiconductor: 35% lower switching losses

i.MX RT1010: Processor runs at up to 500MHz OPB9001: Detection range up to 50mm

COMPONENT FOCUS COMPONENT FOCUS

APPLICATIONS• Switch-mode power supplies • DC-DC converters• Servers • Solar power inverters• Induction heating• Motor drives• Electric vehicle charging stations

FEATURES• Low on-resistance• Fast switching speed• Fast reverse recovery• Easy to operate in parallel configuration• 175°C maximum junction temperature

FREE DEVELOPMENT BOARD This kit provides an evaluation platform for a half-bridge power stage based on the 1,200V SCT3040KR SiC MOSFET.

Orderable Part Number: P02SCT3040KR-EVK-001


APPLICATIONS• Power inverters • AC servo motor controls • Programmable logic controllers • Robot arm controllers• Renewable energy generators • Battery management systems

FEATURES• 60ns maximum propagation delay time• 25ns maximum propagation delay skew• 20ns maximum pulse-width distortion• 2.0mA maximum supply current• Isolation voltage:

– 5kVrms for the RV1S9060A – 3.75kVrms for the RV1S9160A – 7.5kVrms for the RV1S9960A

• UL, CSA, VDE approvals

APPLICATIONS• Consumer

– Smart connected appliances – Professional audio equipment – Cameras

• Smart home – Door locks – Smart thermostats – Lighting controls – Security systems

• Industrial – Factory automation – Robotics – Programmable logic controllers – Unmanned vehicles

FEATURES• Industry’s lowest dynamic power • Low-power Run modes at 24MHz• On-chip power management IC with DC-DC

converter• Standalone true random number generator• Secure real-time clock• Built-in secure boot

APPLICATIONS• Industrial printing and high-speed paper

detection• Factory automation• Automated sewing machines• Automated banking machines• Portable medical equipment• Dispensing equipment• Medical diagnostic equipment• Materials handling • Asset tracking

FEATURES• 30V maximum output signal• Integrated drive circuitry• 8kV ESD protection • Programmable output configuration and

sensitivity level• Operating-temperature range: -40°C to 85°C • UL recognized• CE approval


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FREE DEVELOPMENT BOARD This evaluation kit includes an MIMXRT1011DAE5A device running at 500MHz on a two-layer, through-hole PCB.

Orderable Part Number: MIMXRT1010-EVK


FREE DEVELOPMENT BOARD Orderable Part Number: OPB9000-KIT


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Popular connector line extended to provide new 13A current rating

Quartz crystal oscillators operate from a wide supply-voltage range

Aluminum electrolytic capacitors offer long life and high reliability

These VAL-U-LOK connectors are also available in a new vertical header style which provides from two to 24 positions, and in a choice of UL 94 V-0 or Glow Wire test/UL94 V-2 or V-0 material.

The new high-current vertical headers are available with or without polarization pegs, and with or without drain holes. The new headers mate with existing UL 94 V-0 flammability and Glow Wire test housings populated with new high-conductivity socket terminals offered in 16 AWG and 18-22 AWG sizes. In addition, the new products use the same application tooling as the legacy 9A-rated contacts, allowing for backward compatibility.

They are supplied in industry-standard packages, and enable designers to build multiple product platforms with a single timing device.

Today’s quartz-based oscillators offer better overall performance than the equivalent MEMS timing devices. The ECS MultiVolt products feature better jitter, phase noise and operating current, and at a lower unit cost.

The useful life of the 150 RMI series capacitors is rated at between 4,000 and 10,000 hours when operating at the maximum temperature of 105°C.

The high-current pin and socket contacts are also designed for use in housings suitable for wire-to-wire applications.

The capacitors are also notable for their high stability and reliability.

Designers who need an aluminum electrolytic capacitor which offers both low impedance and

low equivalent series resistance can use the 150 RMI capacitors, and benefit from space savings compared to circuits that use the 136 RVI series parts, which have similar resistance and impedance characteristics. The ripple current capability of the 150 RMI series is also excellent.

The 150 RMI capacitors are supplied in a cylindrical aluminum case with pressure relief, insulated with a blue sleeve. They have radial leads. The devices are charge- and discharge-proof.

TE Connectivity (TE) has introduced an extension to its VAL-U-LOK connector product line, adding new parts which offer a higher 13A maximum current capability on a 4.2mm centerline spacing. Earlier VAL-U-LOK connectors have a 9A rating.

The MultiVolt™ series of 32.768kHz oscillators, MHz oscillators and temperature-compensated oscillators (TCXOs) from ECS Inc operate over a wide voltage range of 1.6V to 3.6V DC.

The 150 RMI polarized aluminum electrolytic capacitors from Vishay provide a long operating lifetime when used to implement smoothing, filtering and buffering functions in switch-mode power supplies and DC-DC converters. These AEC-Q200 qualified parts are suitable for use in automotive applications.

VAL-U-LOK: 4.3mm centerline spacing TE, TE Connectivity and TE Connectivity (logo) are trademarks

150 RMI: Notable for low impedance and low equivalent series resistance

APPLICATIONS• Household appliances• Industrial machinery• Automotive systems• Medical devices• Vending machines • Gaming equipment• HVAC equipment• Indoor and outdoor lighting• Security systems• Storage and networking systems

FEATURES• Vertical and right-angle pin headers available• Contacts available in strip form or loose pieces • UL recognized• CSA certified

APPLICATIONS• Portable and wearable devices• IoT devices• Handheld radios• Video equipment• Medical devices• Navigation equipment

FEATURES• HCMOS output• Compatible with 1.8V, 2.5V or 3.3V power

supply• <1ps jitter• Low operating current

APPLICATIONS• Industrial systems • Office equipment • Audio-video systems• Automotive• Telecoms equipment • Power supplies:

– Switch-mode power supplies – DC-DC converters

FEATURES• Nominal case sizes (diameter x length):

8mm x 12mm to 18mm x 40mm• Rated capacitance range: 22μF to 8,200μF• Capacitance tolerance: ±20%• Rated voltage range: 10V to 100V• Operating-temperature range: -55°C to 105°C• Useful life at 105°C:

Up to 10,000h depending on case size


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COMPONENT FOCUSINTERCONNECT • PASSIVE • ELECTROMECHANICALCOMPONENT FOCUS INTERCONNECT • PASSIVE • ELECTROMECHANICAL

FOR MORE DETAILSAND DATA E-MAIL: [email protected]

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32.768kHz Oscillators

Part Number Minimum Frequency

Maximum Frequency Size (mm) Voltage Range Operating-

Temp. Range Stability

ECS-327MV 32.768kHz 32.768kHz 1.6 x 1.2 x 0.7 1.6V to 3.6V -40°C to 85°C ±25ppm

ECS-327MVATX 32.768kHz 32.768kHz

2.0 x 1.6 x 0.9 2.5 x 2.0 x 1.03.2 x 2.5 x 1.25.0 x 3.2 x 1.37.0 x 5.0 x 1.4

1.6V to 3.6V -40°C to 85°C ±25ppm

ECS-327ATQMV 32.768kHz 32.768kHz 3.2 x 2.5 x 0.9 1.62V to 3.63V -40°C to 125°C ±100ppm

MHz Oscillators

ECS-1612MV 3.000MHz 80.000MHz 1.6 x 1.2 x 0.7 1.6V to 3.6V -20°C to 70°C -40°C to 85°C

±30ppm ±25ppm


±25ppm ±50ppm


±25ppm ±50ppm


±25ppm ±50ppm

ECS-5032MV 0.750MHz 160.000MHz 5.0 x 3.2 x 1.3 1.6V to 3.6V-20°C to 70°C-40°C to 85°C-40°C to 85°C

±50ppm±25ppm±50ppm

Tight Stability Oscillators

ECS-2520SMV 8.000MHz 60.000MHz 2.5 x 2.0 x 0.8 1.62V to 3.63V -40°C to 105°C-40°C to 105°C

±5ppm±10ppm

ECS-3225SMV 8.000MHz 60.000MHz 3.2 x 2.5 x 1.2 1.62V to 3.63V -40°C to 105°C-40°C to 105°C

±5ppm±10ppm

TCXO

ECS-TXO-3225MV 8.000MHz 60.000MHz 3.2 x 2.5 x 1.2 1.62V to 3.63V -40°C to 85°C ±2.5ppm

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Robust and compact I/O connectors support high signal-transmission speeds

Illuminated push-button switches offer six color options

Supporting CAT5e cabling rated for a signal-transmission rate of 1Gbit/s, and CAT6A cabling for 10Gbits/s speeds, the ix Industrial I/O connectors feature a shielding design which blocks EMI and ESD for safe and secure data transmission.

The ix Industrial series complies with the IEC/PAS 61076-3-124 standard. The range features receptacles and plugs with two keying codes for Ethernet and non-Ethernet applications.

There are two receptacle types in the series: the upright right-angle type can be mounted in parallel with a pitch distance of only 10mm to save space. The vertical type allows the plug to be mated from the top, giving design flexibility.

The receptacle shell is mounted on the board via through-hole solder legs to strengthen retention to the board, and to resist wrenching of the cable assembly, thus protecting the surface-mount contacts.

The bright LED color in the cap provides a visible indication of the status and proper functioning of the switch. The KLS switches are configured to operate either in momentary mode, or with a lock action. They provide an audible, tactile ‘click’ when actuated.

C&K’s KLS switches are available in single-pole, dual-throw and dual-pole, dual-throw configurations, and with a current rating of either 100mA or 500mA. Mechanical life is rated for 1,000,000 cycles, and electrical life for 200,000 cycles.

The plugs are available in Insulation Displacement Connector (IDC) or solder types. The wire-termination unit and cable clamp are integrated into a single plug shell, which prevents the connecting part of the cable assembly from being affected by the load on the cable.

Hirose’s robust ix Industrial™ series of connectors is ideal for space-constrained industrial applications requiring high-speed signal transmission at rates up to 10Gbits/s. The ix Industrial connector occupies as much as 75% less installation space than an RJ45 connector.

C&K’s KLS series offers LED-illuminated push-button switches in six configurations. They are available in three cap styles and sizes, and with six illumination options: clear, red, blue, green, yellow and white.

ix Industrial: 75% smaller than RJ45 connector

KLS series: Momentary mode or lock action

APPLICATIONS• Factory automation controllers• Servo amplifiers• Industrial robotics• Servers• Programmable logic controllers• Security systems

FEATURES• Ten contacts• Current ratings:

– 1.5A on all pins – 3A on pins 1, 2, 6 and 7 only

• Voltage rating: 50V AC/60V DC• 5,000 mating cycles• Operating-temperature range: -40°C to 85°C

APPLICATIONS• Professional audio/video equipment• Vending machines• Instrumentation• Control panels

FEATURES• 2.2mm total travel• Gold or silver contact materials• 100MΩ insulation resistance at 500V DC • 1,000V AC dielectric strength for 1 minute• Operating-temperature range: -40°C to 85°C


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New straddle-mount connectors for faceplate-pluggable OCP NIC 3.0 cards

The OCP NIC 3.0 card is one of the formats supported by the SFF-TA-1002 standard. OCP NIC 3.0 cards are horizontal and faceplate-pluggable, which helps to increase airflow through the enclosure and eases system design. The new Sliver connectors for OCP NIC 3.0 cards have a low profile for ease of system maintenance and improved thermal management.

The new Sliver straddle-mount connectors for SFF-TA-1002 cards support high signal-

transmission rates for communications protocols up to PCIe Gen 5. They also offer a roadmap for data rates up to 112Gbits/s.

SFF-TA-1002 is a proposed alternative to, or replacement for, many form factors, including M.2, U.2 and PCIe. The high-density 0.6mm pitch of the Sliver straddle-mount connectors also supports next-gen silicon PCIe lane counts.

With a proven 0.6mm contact pitch, Sliver products offer high density, allowing OEMs to fit more units inside an enclosure while

maintaining easy routing. The contact lead-frames are highly modular to provide an increased number of lanes in a connector.

TE provides a robust metal housing on the cable connector with an active latch in the plug, providing additional connection security. This new technology simplifies design and helps lower costs by eliminating the need for re-timers and more costly low-loss PCB materials.

TE Connectivity (TE) has introduced its Sliver straddle-mount connectors, the new standard form factor supporting a faceplate-pluggable Open Compute Project (OCP) NIC 3.0 card.

TE’s Sliver: Robust metal housing on the cable connector

APPLICATIONS• Networking equipment• Switches • Routers• Servers• Storage devices• High-Performance Computing (HPC)• Wireless base transmitter stations

FEATURES• Vertical, right-angle and card-edge

configurations with active latch• Supports 85Ω and 100Ω impedance values • Flexible pin-out allows for mix of differential

signal pairs and low-speed single-ended sidebands

• Flexible mounting and mating arrangements: – Cabled interconnects – Card-edge interconnects

• Receptacle-to-plug mating configurations: – Vertical to right-angle – Vertical to straight – Right-angle to right-angle – Right-angle to straight


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Cylindrical capacitors handle high ripple currents Compact wire-to-board connectors offer high current rating in industry-standard footprint

New locking flexible printed circuit connectors feature high retention force

The 259 PHM-SI devices, which provide capacitance values from as little as 39μF to as much as 2,200μF, are intended for use in smoothing and filtering functions in standard and switch-mode power supplies.

This high current density in a compact design is useful in various types of data networking equipment, as well as many other types of end product. A common industry footprint also allows for easy upgrades to existing designs.

The ELCON Micro connectors support configurations consisting of two up to 24 pins, and handle various current values, accommodating multiple combinations of different wire sizes.

The design of these FPC connectors, which have the part numbers 2041215-1 and 4-2041215-0, ensures their locking tabs remain in the retention cavity, resulting in a minimum 24N total unmating force. A robust actuator provides stronger retention of mated contacts, helping prevent breakage during assembly. The front-flip actuator allows the operator to ensure that the FPC cable is inserted correctly.

A Zero Insertion Force (ZIF) design results in less wear on the FPC contacts, and enables the connector to sustain a higher number of mating cycles.

In addition, the locking FPC connector requires no tooling for mating and unmating, simplifying installation and lowering overall cost.

They have a compact design, but still offer better ripple-current tolerance than previous aluminum electrolytic capacitors. The largest 250V-rated capacitor, offering capacitance of 1,800μF, can handle a maximum ripple current

of 4.42A. High ripple current allows designers to use fewer components, saving board space and lowering costs.

These capacitors also offer a long useful life, making them suitable for demanding applications requiring more than ten years of lifetime when operating in ambient temperatures up to 60°C.

The 259 PHM-SI products are polarized aluminum electrolytic capacitors with a non-solid electrolyte. They are supplied in two-terminal snap-in and three-terminal snap-in package variants.

The connectors offer easy assembly with fool-proof mating. They perform reliably in harsh environments, and feature a maximum operating temperature of 105°C.

Low maximum contact resistance of 5mΩ results in a low temperature rise and lower power loss at the connector.

New cable plugs and custom cable assemblies provide added design flexibility.

The 259 PHM-SI series of aluminum electrolytic capacitors from Vishay features high ripple-current ratings for use in demanding power-supply circuits. TE Connectivity’s (TE) ELCON Micro wire-to-board power connectors

provide a high current of 12.5A per pin in the common industry footprint of 3.0mm.

New 0.5mm locking Flexible Printed Circuit (FPC) connectors from TE Connectivity (TE) offer secure retention to prevent accidental de-mating when used in rugged environments.

259 PHM-SI: Ten years’ lifetime at up to 60°C ELCON Micro: 5mΩ maximum contact resistance

TE’s FPC connectors: Zero insertion force design

APPLICATIONS• Solar power inverters• Motor drives• Industrial air-conditioning units• Standard and switch-mode power supplies

FEATURES• Cylindrical case sizes (diameter x length):

22mm x 25mm to 35mm x 60mm• ±20% capacitance tolerance• Rated voltage range: 200V to 500V• Operating-temperature range: -40°C to 105°C• 3,000h endurance at 105°C • 3,000h useful life at 105°C

APPLICATIONS• Servers• Switches and routers• Power supplies and power distribution• Gaming machines• Printers• Security systems• Dryers• Refrigerators• Test and measurement equipment• Diagnostic equipment• Patient monitors

FEATURES• 600V maximum voltage• Operating-temperature range: -40°C to 105°C• 8.0N maximum mating force per circuit• Copper alloy contacts with tin plating

APPLICATIONS• Displays• Tablets• Wearable devices• Cameras• Inkjet, laser and 3D printers• Copiers• PCs• Mobile phones• Satellite navigation devices• Set-top boxes• Disk drives• Medical equipment• Automotive infotainment systems

FEATURES• 0.5mm centerline spacing• 0.5A current rating• 250V AC voltage rating• 500mΩ minimum insulation resistance at

100V DC• 35mΩ maximum contact resistance• 150V AC dielectric withstanding voltage


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19-viii 20 TE, TE Connectivity and TE Connectivity (logo) are trademarks

ELCON, TE Connectivity, TE and TE connectivity (logo) are trademarks

New wire-to-board solutions

Part Number Description Number of Positions

1-2204749-8 Receptacle, tin contacts –

2204748-2 Receptacle housing 4



2354149-1 Cable assembly 2x6



12

DESIGN NOTE

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To match this demand, a new universal standard for PoE, IEEE 802.3bt, was ratified in September 2018 to support power requirements up to 100W. Also referred to as ‘PoE++’, IEEE 802.3bt is backwards-compatible with the existing standards including IEEE 802.3af and 802.3at, which will remain in use by many existing PoE applications. Another benefit that the new IEEE 802.3bt standard offers is improved smart power

budgeting, which enables devices to communicate their power needs.Now ON Semiconductor has introduced new interface controllers which

implement PoE++, to support the higher power demands of new IoT end-points.

The operation of a PoE power supplyPoE technology enables the transfer of power and data over Ethernet cables. The amount of power transferred is managed through the connection between the Power Sourcing Equipment (PSE) and the Powered Device (PD). The PSE can recognize the type and class of PD device, and then ensure it safely receives the appropriate amount of power.

The new IEEE 802.3bt standard adds two new types (3 and 4) and four new classes (5 to 8) of PoE devices, which increases the maximum output power the PSE can provide to 90W. Key to this increase in power is the ability to use all four paired conductors in an Ethernet cable.

With up to 90W of power available, compared to the 30W provided by the earlier IEEE 802.at standard, IEEE 802.3bt can provide both power and connectivity to new applications that would otherwise require a dedicated power source, typically the mains power grid. PoE++ will therefore simplify network topologies and provide a more robust plug-and-play user experience.

The IEEE 802.3bt standard optimizes energy management through a new Autoclass feature, which enables PDs to communicate their specific power needs to the PSE. This in turn allows each PSE to allocate the right amount of power to each PD, maximizing both the available energy and network bandwidth.

During the first class event, Autoclass automatically detects the maximum power draw from the PD and then adjusts the classification current accordingly, in a range from 40mA for Class 4 to 2.5mA for Class 0. It typically performs this classification within 81.5ms. The timing is critical, and the power detection can only be performed by an 802.3bt-qualified PSE.

After system power-up, the PD will draw the maximum power required for operation, as measured by the PSE. Using this measurement, the PSE can determine the exact power needs of the PD and adjust its output accordingly.

New controllers for PoE PD interfaceTo provide the high-power PoE capability specified in the IEEE 802.3bt standard, ON Semiconductor has developed a new family of compliant solutions, including the NCP1095 and NCP1096 interface controllers. These ICs incorporate all the features needed to implement a PoE interface at the PD, including detection, auto-classification and current limiting.

The NCP1095 controller operates via an external hot-swap FET, while in the case of the NCP1096 this FET is integrated into the chip, as shown in Figure 1. The integrated hot-swap FET in the NCP1096 offers lower on-resistance than that of any other Type 3 or Type 4 PoE controller.

The controllers are complemented by the NCP1566 DC-DC controller, the FDMC8622 single MOSFET, and the FDMQ8203 and FDMQ8205A GreenBridge™ Quad MOSFETs, which provide a more efficient alternative to a diode bridge in PoE applications.

Together, these devices enable the designers to create highly efficient PoE interfaces with up to the standard limit of 90W of power, or up to a proprietary 100W solution if more power is needed in applications such as

telecoms equipment or digital signage.

As networks have become larger and more complex, the amount of power needed to support new Internet of Things (IoT) applications, such as connected lighting and closed-circuit security cameras, has risen above the 25W maximum supplied by the first generation of Power-over-Ethernet (PoE) standards.

How new PoE controllers support higher power demands of IoT end-points

Fig. 1: Typical PoE PD circuit based on the NCP1096 PoE interface controller

ON Semiconductors' NCP1096GEVB evaluation board


CONNECTIVITY



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New dual-core wireless MCUs provide Bluetooth 5, Thread and ZigBee connectivity

IoT device manufacturers are acutely conscious of the need to protect their hardware, as well as user data and privacy. The STM32WBx5 MCUs meet this requirement with security features including customer key storage, public key authorization, and encryption engines for the radio controller and upper layers. Security functions managed by the Cortex-M0+ core, including over-the-air secure firmware updates for applications and the radio stack, protect device integrity and intellectual property, and support robust product management.

The integrated radio transceiver supports the Bluetooth® 5 specification, and provides an IEEE 802.15.4-2011 physical layer and controller: it can be used to connect to Thread and ZigBee® 3.0 networks.

The radio is optimized for high RF performance and low power consumption, to extend battery run-time. The RF output power is programmable up to 6dBm in 1dB increments, and the MCU draws only 5.2mA when transmitting at 0dB. Receive sensitivity is -96dBm in Bluetooth Low Energy mode at 1Mbit/s. Offering a maximum link budget of 102dB, the radio ensures robust communication over long distances. It includes support for an external power amplifier.

Extensive feature integration enables product developers to minimize bill-of-materials costs and footprint. STM32WBx5 MCUs have up to 1Mbyte of on-chip Flash and a quad SPI port for efficient connection to external memory.

Additional features include crystal-less Full-Speed USB connectivity, a 32MHz RF oscillator

with trimming capacitors, a touch-sensing controller, LCD controller, analog peripherals, and multiple timers and watchdogs.

Software development support as part of the rich STM32Cube ecosystem includes the STM32CubeWB MCU Package, which features peripheral drivers, middleware, and connectivity libraries. The dedicated STM32CubeMon-RF connectivity tool for RF testing and custom use-case scripting also accelerates development.

The new STM32WBx5 series from STMicroelectronics combines features of ST’s STM32L4 Arm® Cortex®-M4 core-based microcontrollers with an on-chip 2.4GHz radio managed by a dedicated Cortex-M0+ co-processor. The STM32WBx5 MCU provides a new way to concurrently run a wireless protocol and execute application code in real time, while maintaining low power consumption.

STM32 wireless MCU: Supports Bluetooth® 5, Thread, ZigBee®

APPLICATIONS• Remote sensors• Wearable trackers• Building automation controllers• Computer peripherals• Drones • IoT devices

FEATURES• Power-saving features:

– 13nA current in shut-down mode – Adaptive voltage scaling – Adaptive real-time ART Accelerator™ engine

• Integrated balun

FREE DEVELOPMENT BOARD Orderable Part Number: P-NUCLEO-WB55



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Nucleo kit enables rapid evaluation of STM32WB55 MCU

The pack includes a Nucleo-68 board and a USB dongle to allow the developer to experiment with the Bluetooth® 5 and IEEE 802.15.4, 2.4GHz radio capabilities of the STM32WB55 MCUs. It provides Arduino™ Uno V3 and ST morpho connectivity to enable easy system expansion.

The Nucleo68 board includes a STM32WB55 MCU, three user LEDs, three user buttons and one reset button. It provides an integrated PCB antenna, as well as a footprint for an SMA connector.

Flexible power-supply options include an ST-LINK USB bus or external sources, as well as an on-board socket for a CR2032 battery.

Comprehensive free software libraries provide code examples available with the STM32Cube expansion package.

The P-NUCLEO-WB55 pack from STMicroelectronics is a two-board development system for users of the STM32WB55 multi-protocol wireless microcontroller.

Nucleo kit: ST supplies free software libraries and code examples

FREE DEVELOPMENT BOARD Orderable Part Number: P-NUCLEO-WB55

Target MCU: STM32WB55RG (Nucleo68) Target MCU: STM32WB55CG (USB dongle)


FREE DEVELOPMENT BOARD Orderable Part Number: NCP1096GEVB


The USB dongle features another STM32WBxx wireless MCU. It also includes a switch for boot management, user push-button, three user LEDs, and an integrated PCB antenna or UFL connector.


Certified software implements mesh networking on Bluetooth Low Energy radio devices

The solution is compatible with ST’s BlueNRG range of Bluetooth network processors and network processor modules, including the BlueNRG-M0 featured on page 19.

Over a mesh network formed by devices running the STSW-BNRG-Mesh software, Bluetooth Low Energy nodes can communicate with a smartphone to enable remote control of the nodes via a convenient smartphone app. The software supports multiple communication modes.

• Smartphone-to-node communication with unicast addressing

• Smartphone-to-node communication with multicast (group) addressing

• Smartphone-to-node communication with broadcast addressing

• Node-to-node communication

Multi-hop data transmission can perform up to 126 hops. The software can be used in large mesh networks consisting of up to 32,767 nodes.

STMicroelectronics’ STSW-BNRG-Mesh is software for connecting multiple Bluetooth® Low Energy devices via a mesh network. It enables true two-way communication between Bluetooth-enabled devices in powerful, secure, integrated and range-extending mesh networks.

STSW-BNRG-Mesh: Enables remote control via smartphone app

APPLICATIONS• Home automation • Industrial automation• Assisted living• Lighting

FEATURES• Comprehensive security

– Proven security algorithms for device provisioning

– AES-128 encryption – Privacy through obfuscation – Protected against various types of

security attacks • Supported features

– Publish-subscribe paradigm to up to ten groups

– Node identity configurable by user – Transport layer handles up to 384byte

packets – Provisioning and network layer based on

Mesh profile v1.0 – Heartbeat

• Supported models – Configuration model – Health model – Generic model on-off, level example – Generic power on-off server – Generic transition time server – Lighting model example (Lightness, CTL, HSL) – Light Lc server models – Light Lc controller – Vendor model – Sensor model – Template for Time and Scene model

• Embedded software development kit with application source code demonstrations

• Bluetooth SIG Mesh 1.0 certified


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50Ω ultra-thin balun features integrated harmonic filter

Its matching impedance has been configured to complement ST’s BlueNRG-134 and BlueNRG-234 Bluetooth® Low Energy Systems-on-Chip (SoCs), which are supplied in a wafer-level chip-scale package.

When paired with the low-loss BALF-NRG-02J5, the BlueNRG radio SoC offers excellent RF performance in both transmit and receive modes.

The harmonics filter integrated in the BALF-NRG-02J5 alongside the balun offers excellent attenuation, including 47dB attenuation of the second harmonic and as much as 58dB attenuation of the seventh harmonic.

The BALF-NRG-02J5 from STMicroelectronics is a very thin balun which integrates a matching network and harmonics filter.

BALF-NRG-02J5: For BlueNRG radios

APPLICATIONS• Wearable devices• 2.45GHz radios

FEATURES• 50Ω nominal input • Low amplitude imbalance• <1.2mm2 footprint• <350μm profile after reflow


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FREE DEVELOPMENT BOARD Orderable Part Number: CY8CPROTO-062-4343W



Discrete magnetics for Ethernet interfaces help ease EMI concerns

Daughterboard provides for easy evaluation of the PAN4620

Sensor node kit provides Bluetooth Low Energy connectivity

These TE parts offer an extended operating-temperature range of -40°C to 105°C, allowing customers to use them in industrial environments subject to high ambient temperatures. They are compatible with standard 10/100Mbits/s or 1Gbit/s Ethernet interfaces.

The new discrete magnetics range complements TE’s existing RJ45 jacks with integrated magnetics, giving designers a choice between:• Greater flexibility when using the discrete

parts • Reduced board footprint and a lower

component count when using the integrated jacks

At the heart of the kit is the STEVAL-BCN002V1 multi-sensor board. This board has an accelerometer, gyroscope and

magnetometer, and pressure, humidity, time-of-flight ranging and microphone sensors, and is powered by a

CR2032 coin battery. It is controlled by the BlueNRG-2, a single-mode Bluetooth Low Energy SoC.

The kit provides for communication with a smartphone via Bluetooth: ST provides the ST BLE Sensor smartphone app which is available on the Google Play™ and Apple iTunes® stores.

The kit also includes the STEVAL-BCN002V1D adapter board for programming and debugging

the sensor board. The adapter board is powered via USB.

Industrial discrete magnetics products from TE Connectivity (TE) provide flexibility to designers of equipment that includes embedded Ethernet interfaces, enabling them to realize improved transmission characteristics and meet over-voltage requirements. The dielectric withstanding voltage rating of the TE discrete magnetics products is 1,500V ACrms.

TE magnetics operate in temperatures up to 105°C

APPLICATIONS• Programmable logic controllers• I/O modules• Servo drives• Industrial PCs• Other industrial equipment

FEATURES• Supports voltage- or current-mode

applications• Three-wire choke for Power-over-Ethernet

interfaces• Compatible with reflow soldering profiles at

260°C• Supplied in surface-mount and optional

through-hole packages

APPLICATIONS• IoT devices• Smart homes and buildings • Smart cities • Tracking systems• Supply-chain management• Smart agriculture

FEATURES• LSM6DSO iNEMO 6DoF inertial motion

sensor module• LIS2MDL three-axis magnetometer• VL53L1X long-range time-of-flight sensor for

accurate distance measurement • MP34DT05TR-A omnidirectional MEMS

digital microphone• LPS22HH piezo-resistive absolute pressure

sensor • HTS221 capacitive digital relative humidity

and temperature sensor• BALF-NRG-02D3 miniature balun and

harmonic filter• RF certified


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CONNECTIVITY


Radio module supports simultaneous operation of Bluetooth and 802.15.4 radios in smart home and building networks

The module incorporates all the required hardware elements, including a chip antenna, and the protocol software, providing a simple and quick way for OEMs to implement wireless connectivity in devices for applications such as smart homes and building automation.

The PAN4620 module is based on the NXP Semiconductors Kinetis KW41Z system-on-chip, which combines a 2.4GHz radio supporting 802.15.4 and Bluetooth Low Energy wireless connectivity, and a microcontroller based on an Arm® Cortex®-M0+ core.

Because it includes a built-in MCU, the module offers design flexibility. Featuring 512kbytes of Flash memory and 128kbytes of SRAM, the PAN4620 can easily be used as a stand-alone controller in small and low-power devices. This architecture eliminates the need for an external processor, reducing system complexity and saving space and cost.

The module can also be used alongside a host microcontroller or applications processor to provide a complete solution for 802.15.4 and Bluetooth Low Energy connectivity.

Supplied with NXP’s certified Thread and Bluetooth Low Energy

protocol stacks, the module supports concurrent

operation of two radio systems. This is ideal

for IoT applications, since it enables end-points to connect wirelessly

to the internet without the need for a gateway. In addition,

the Thread network protocol does not define an application layer, so various application layers can be used such as dotdot, IoTivity or OpenDOF.

The PAN4620 is supplied with FCC, IC and CE approvals. The surface-mount module measures 15.6mm x 8.7mm x 1.9mm. Its orderable part number is ENW-C9B01A1EF.

Panasonic provides an evaluation board for its combination 802.15.4 and Bluetooth radio module. The compact PAN4620 daughterboard provides access to all the module’s pins. It also features an on-board LED, three user buttons and a Micro-USB connector.

Panasonic recommends using NXP’s Bluetooth®, ZigBee® and Thread Software Development Kit (SDK) to implement applications on the PAN4620 module. The SDK offers full software development support via a high-level application programming interface.

Panasonic has introduced the PAN4620, a dual-mode radio module which enables simultaneous and independent connections over Bluetooth® Low Energy and Thread or other 2.4GHz IEEE 802.15.4 wireless networks.

APPLICATIONS• Smart home devices• Building automation

FEATURES• Bluetooth Low Energy v4.2 certified • Footprint- and pin-compatible with Panasonic

PAN1026, PAN1760, PAN1760A and PAN1761 modules

• IEEE 802.15.4 physical layer implementation and Simple Media Access Controller (SMAC)

• Supports Bluetooth mesh networking • Supports IPv6 6LoBLE • Bluetooth Developer Studio plug-In

FREE DEVELOPMENT BOARD Orderable Part Number: ENW-C9B01AQEF



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CONNECTIVITY

TE, TE Connectivity and TE Connectivity (logo) are trademarks

PAN4620: Can be used as a stand-alone controller

STMicroelectronics’ STEVAL-BCN002V1B BlueNRG Tile is a sensor node development kit which combines an array of environmental and motion sensors with wireless connectivity via a Bluetooth® Low Energy radio-equipped System-on-Chip (SoC). The BlueNRG-Tile

is supplied as a 25mm2 two-layer PCB, demonstrating a low-cost approach to the development of a sensor node.

FREE DEVELOPMENT BOARD Orderable Part Number: STEVAL-BCN002V1B


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Custom and standard antennas support wide range of frequencies and radio protocols

Off-the-shelf firmware connects STM32 MCUs to a Sigfox network

Available as embedded or multi-element external antennas, these solutions provide clear transmission in wireless devices over a wide variety of frequencies, including the bands used by Bluetooth®, Wi-Fi®, LTE™ and ZigBee® radio systems.

Antennas supplied by TE may be tested before shipping for near- and far-field patterns, scattering parameters, specific absorption rate, vibration, humidity, temperature shock, salt fog, throughput and acoustic characteristics.

Hosted on a supported STM32 microcontroller, FP-ATR-SIGFOX1 is intended for use in asset-tracking applications. It provides a complete firmware suite for connecting an IoT node to a Sigfox network. Low-power device geolocation is provided by the Sigfox network infrastructure.

The firmware runs on an STM32 MCU, and includes drivers for ST’s S2-LP ultra low-power RF transceiver, Bluetooth® Low Energy modules such as the BlueNRG-M0, which enhance functionality by enabling the user to control nodes via a Bluetooth wireless link, and motion and environmental sensors.

Message transmission is triggered by a user button, timer event, the crossing of a threshold value measured by an environmental sensor, or movement detected by an accelerometer.

Thresholds can be set using the ST Asset Tracking app, and transmitted to the firmware via a Bluetooth link.

The package implements low-power profiles and related transitions to ensure long battery run-time.

TE Connectivity’s (TE) portfolio of standard and custom antennas features technologies including two-shot molding, stamped metal, Flexible Printed Circuit (FPC), PCB and Laser Direct Structuring (LDS).

FP-ATR-SIGFOX1 from STMicroelectronics is a function pack extension to its STM32Cube embedded software suite which enables devices to read data from environmental and motion sensors and send the collected data via a long-range Sigfox wireless link.

TE antennas are available for wireless voice and networking applications

FP-ATR-SIGFOX1: Includes drivers for radio transceivers and sensors

APPLICATIONS• Wearable devices• Wireless printers• Smart meters• Power distribution equipment• Data communications equipment• Connected cars and trucks• Remote radio equipment

FEATURES• Antennas for wireless networking and voice

applications – IEEE 802.11a/b/g/n/ac/ad at 2.4GHz

and 5GHz – LTE bands 700 to 2700MHz with multi-

band and MetaSpan antenna technology – GSM/UMTS bands 850 to 2170MHz, single

and multiband – WiMax bands 2300 to 3800MHz

• Antennas for other technologies – ISM ZigBee band 902 to 928MHz – Bluetooth wireless technology band

2400 to 2483.5MHz – Zigbee band 2400 to 2483.5MHz – UWB band 3100 to 6000MHz – DVB-H band 1670 to 1675MHz – NFC band 13.56MHz

APPLICATIONS• Asset tracking

FEATURES• Middleware library supports:

– Sigfox connectivity from the X-CUBE-SFXS2LP1 software package

– Bluetooth connectivity from the X-CUBE-BLE1 software package

• Sample implementation available for X-NUCLEO-S2868A1, X-NUCLEO-IDB05A1 and X-NUCLEO-IKS01A2 or X-NUCLEO-IKS01A3 expansion boards connected to NUCLEO-L053R8 and NUCLEO-L476RG development boards

• Easy portability across multiple STM32 MCU families

• Free, user-friendly licence


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ESD array protects HDMI and other high-speed differential interfaces

Featuring very low variation of capacitance, the HSP061-2 has little effect on signal skew. High bandwidth of 6GHz means that the array is compatible with interface protocols which support signalling rates of up to 5Gbits/s.

The product is available in two variants:• The HSP061-2M6 is supplied in a six-

lead QFN package measuring 1.45mm x 1.0mm, and with a 500μm pitch

• The HSP061-2N4 is supplied in a four-lead QFN package measuring 1.0mm x 0.8mm, and with a 400μm pitch

Both parts provide comprehensive support for OEMs’ compliance efforts and comply with the specifications of:• MIL-STD 883G Method 3015-7 Class 3B,

giving protection up to ±8kV

• IEC 61000-4-2 level 4:• Protection up to ±15kV for air discharge• Protection up to ±8kV for contact discharge

STMicroelectronics’ HSP061-2 is a two-channel ESD array with a rail-to-rail architecture intended for the protection of high-speed differential lines, such as USB interfaces, against electrostatic discharges.

HSP061-2: Supports signalling rates up to 5Gbits/s

APPLICATIONS• High-speed digital interfaces:

– HDMI 1.3 and 1.4 – Digital Video Interface (DVI) – DisplayPort – USB 3.0 – Serial ATA – Ethernet

FEATURES• Flow-through routing to maintain signal

integrity• 0.60pF typical I/O-to-ground capacitance• 0.03pF variation of capacitance• 100nA maximum leakage current • Junction-temperature range: -40°C to 150°C


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CONNECTIVITY CONNECTIVITY

TE, TE Connectivity and TE Connectivity (logo) are trademarks

RF module provides complete hardware and software platform for Bluetooth Low Energy connectivity

The BlueNRG-M0 module provides a complete, certified RF platform in an 11.5mm x 13.5mm footprint, including the radio, a chip antenna, and high-frequency and low-power oscillators.

The module provides a comprehensive Bluetooth Low Energy firmware stack.

An external host controller may be connected to the BlueNRG-M0 module through a standard serial peripheral interface.

The BlueNRG-M0 module can be powered directly with a standard 3V coin cell battery, a pair of AAA batteries, or any power source supplying between 1.7V and 3.6V.

The module is based on ST’s BlueNRG-MS network processor, which consists of a Bluetooth physical layer and 2.4GHz radio, Arm® Cortex®-M0 core running the Bluetooth protocol stack, and a dedicated security co-processor providing AES-128 encryption.

An applications programming interface and power management and Flash memory circuitry are also integrated in the processor.

The module is supplied in two versions, the BlueNRG-M0A, which is optimized for low power consumption, and the BlueNRG-M0L, which has a lower unit cost and higher power consumption.

STMicroelectronics’ BlueNRG-M0 is a very low-power network processor module which provides Bluetooth® Low Energy connectivity for wearable and mobile devices. The module can perform multiple roles simultaneously, acting as both a Bluetooth Low Energy sensor and hub device.

BlueNRG-M0: 11.5mm x 13.5mm footprint

APPLICATIONS• Watches• Fitness, wellness and sports equipment• Consumer medical devices• Security/proximity applications• Remote controls• Home automation • Industrial automation• Assisted living• Mobile phone peripherals• PC peripherals

FEATURES• Bluetooth v4.2 compliant• Bluetooth protocol stack supports GAP, GATT,

SM, L2CAP, LL and RFPHY profiles• Up to 8dBm output power• -88dBm maximum sensitivity• Up to 96dBm link budget offering excellent

link reliability• Certifications:

– CE qualified – FCC, IC modular approval certified – TYPE qualified – BQE qualified

• Operating-temperature range: -40°C to 85°C STSW-BNRG-Mesh software featured on page 14


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20

By François MirandEMEA Technical Director at Future Lighting Solutions, a division of Future Electronics

These characteristics have led specialist lighting engineers to propose innovative new uses for UV light. They also give good reason for UV equipment manufacturers to evaluate LEDs as a straightforward replacement for legacy UV light-source technologies.

Although the advantages of UV LEDs look attractive on paper, in practice the rate of adoption of UV LED technology has lagged far behind that of visible light LEDs. Now the introduction of new LED products offering a dramatic reduction in unit costs alongside higher optical-power output looks set to launch a wave of new UV product developments, promising valuable cost, environmental and operational benefits for users.

Why UV LED light sources are in growing demandThe classification of the UV part of the spectrum of electromagnetic radiation covers the range of wavelengths between 100nm and 400nm, as shown in Figure 1.

By convention, this UV part of the spectrum is itself split into three: UVA, UVB and UVC. As Table 1 shows, some applications are better served by one class of UV light than by another.

The value of UV light derives from the powerful chemical and biological effects that it has on irradiated objects, effects which are far greater than simple heating. Many practical applications of UV radiation derive from its interactions with organic molecules.

For instance, the energy of UVA photons may be used to activate chemical reactions through photo-initiators, a useful function in applications such as curing of paint or other coatings, curing of glue or varnish, and photolithography.

For disinfection and sterilization, UVC light is required. A combination of UVC, UVB and UVA light may be used in curing: for instance, UVC hardens the surface, while the more penetrative UVB and UVA cure the bulk of the material. UVB is also preferred for phototherapy such as psoriasis treatment, for which it provides the best combination of effectiveness and safety.

Today, these applications are typically served by conventional UV light sources. These UV lamp types remain in common use because of their relatively low unit cost, or more properly, their low cost:radiant power ratio, and also the high radiant power capability. The effectiveness of a UV light application is essentially a function of irradiance and exposure time. To disinfect the water in a municipal swimming pool, a UV light source must irradiate a large volume of water flowing at a constant fast rate: this calls for high irradiance because the exposure time is short.

By contrast, disinfection of the drinking water stored in a small pleasure boat’s tank can be performed slowly, giving a long exposure time and thus requiring low radiant power which is an ideal application for UV LEDs.

In fact, UV LEDs are superior to conventional UV light sources in almost every respect: the LED’s chief drawback is that its cost:radiant power ratio is markedly higher than that of conventional UV light sources. This means that swimming pool disinfection will remain, as it is now, an application for UV arc lamps for the foreseeable future.

For many applications, however, the characteristics of LEDs are markedly superior.

TECHNICAL VIEW

One battle is already over: the LED has defeated conventional visible light-source technologies in every important indoor and outdoor general lighting application.

But what about applications for invisible light in the ultraviolet part of the spectrum? The same characteristics that have made LEDs so attractive for general lighting also apply, in theory at least, to the applications for which UV light can be used, such as curing, disinfection, chemical analysis and synthesis:• Small light-emitting surface and small overall package size• Long operating life, and low maintenance and repair costs• Low-voltage operation and low power consumption• Tight control of the wavelength of the emitted light• Freedom from harmful chemical components

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Advances in UV LED technology promise faster rate of adoption

For instance, nail bars use UV light to fast-cure nail varnish. Here the LED offers superior value:• Small size and light weight, making the curing equipment compact and

easy to handle• Robust and tolerant of being knocked or dropped from a work surface• Low operating voltage, making it easy to ensure the electrical safety of

the operator

LEDs also support the development of new applications for which a conventional light source such as a mercury vapor lamp is unsuitable. For instance, a small UVC LED may be mounted inside the tank of a coffee machine or drinking-water fountain to inhibit the growth of micro-organisms in the water. This application is particularly well suited to UV LEDs because:• The LED is small, so is easily accommodated in tight spaces• The low-voltage operation of the LED in a wet environment is

electrically safe• The LED’s long operating lifetime eliminates the need for expensive

lamp replacement

The same features of UV LEDs are also valuable in new, compact air purifiers or deodorizers. In these devices, UVA light irradiates a titanium dioxide-coated catalyser to generate free radicals which break down large organic molecules. These purifiers can be embedded in refrigerators and air-conditioning systems. In cars, they can remove odoriferous volatile organic compounds such as cigarette smoke or plastic outgassing residue. Combined with bactericidal UVC light, a purifier will keep a car’s air-conditioning system fresh and free of airborne pathogens while reducing the frequency of cleaning and filter replacement.

These practical advantages of UV LED light sources are now gaining even greater value with the recent introduction of new LED products with superior specifications.

New LED products spur faster adoptionFor curing applications such as varnish-drying in a nail bar, speed is of the essence, and speed correlates with UV irradiance. Compared to traditional technologies, compact LED light sources are easier to focus and to install close to the target, keeping optical losses to a minimum and producing good irradiance at a small target area.

But the introduction of new multi-die modules enables compact LED light sources to reach even higher irradiance. A good example is Nichia’s new NVCUQ096A-D4 UVA module, as shown in Figure 2. At a peak wavelength of 385nm, it produces an optical power output of 150W in a ±30° beam. The module has a small footprint of just 25mm x 45mm.

Seoul Viosys is also producing interesting innovations in the UV LED market. While mainstream UVC LEDs have a vertical chip structure in a ceramic package sealed with a quartz glass window, Seoul Viosys has developed a streamlined chip-scale package under the WICOP UV brand. This ‘package-free’ surface-mount chip technology removes both the cost and the optical losses associated with the conventional ceramic + quartz glass architecture.

When implemented in new UV equipment designs, WICOP UV LEDs promise to provide a higher optical power output in a smaller space at a lower unit cost.

The WICOP UV technology is rivalled on the UVA side by Lumileds’ LUXEON UV FC Line of products, in which FC denotes FlipChip platform technology, as shown in Figure 3. The LUXEON UV FC Line products, which have a 1mm2 die, are supplied as a Chip-Scale Package (CSP) LED which can be reflowed on to a substrate with standard surface-mount assembly equipment and processes.

Examples of applications for these devices include off-the-shelf, fully-packaged UVA emitters. Both the LUXEON UV U1 (1mm2) and the LUXEON UV U2 (2mm2) are powered by Lumileds’ FlipChip platform technology.

Support for integration of UV LEDs in end product designs UV LED selection and specification are key tasks in system design. LED manufacturers allocate produced units to bins, allowing the buyer to

specify products according to flux (optical power output), forward voltage and peak wavelength.

Selection from a broad market provision of binned UV LEDs will be made easier by use of product comparison software such as Future Lighting Solutions’ Usable Light Tool. The user can specify a required flux and peak wavelength, and the tool will provide a detailed list of products meeting the specification. Use of the tool can save many hours of tedious online datasheet searches, while providing valuable application-specific comparison data.

System designers can also use the tool, together with guidance from Future Lighting Solutions’ applications engineering experts, to specify appropriately the supporting components:• LED drivers are readily available, providing a constant-current output

and any standard output-voltage rating• Optics for beam control are beginning to come on to the market.

Standard LED thermoplastics are not transparent to UV light, but LEDiL has developed silicone optics which are compatible with UVA LEDs. Development work on optics for UVB and UVC LEDs continues.

With the support of Future Lighting Solutions’ optical

technology experts and software tools, designers of UV lighting equipment can now use the

latest UV LEDs in confidence, benefiting from the space, cost and power savings promised by this technology.


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19-viii 34

Fig. 1: UV light’s position in the spectrum of electromagnetic radiation. (Image credit: Seoul Viosys)

Fig. 2: Nichia’s NVCUQ096A-D4 UVA module has a footprint of 25mm x 45mm

Table 1: The characteristics of and typical applications for the classes of UV light

Fig. 3: The LUXEON UV FC Line LEDs, showing top and back views. (Image credit: Lumileds)

TECHNICAL VIEW

Read this to find out about:• The different uses to which UVA, UVB and UVC light can be put

• Examples of applications in which UV LEDs can replace conventional UV light sources

• The improved features and performance of the latest UV LED products to reach the market

Type of UV Light

Wavelength Range (nm) Applications

UVA

315-400Not absorbed by the atmospheric

ozone layer

Curing of polymers: ink, paint, coatings, glueAir deodorization, airborne pathogen reduction

Insect trapsMedical analysis and physiological monitoring

Photochemistry, molecule synthesisOptical sensing and imaging of dyes, inks and markers

UVB

280-315Mostly

absorbed by the atmospheric ozone layer

CuringPhototherapy

Horticulture, growing and post-harvesting treatmentForensic analysis

UVC

100-280Completely

absorbed by the atmospheric ozone layer

Surface disinfectionWater purificationFood processing

Characteristics of Conventional UV Light Sources

Characteristics of UV LEDs

Bulky Compact package

Omnidirectional light emission and large light-emitting surface make light beam hard to control

Small point source of light can be directed at the target

Brittle glass bulb is easily damaged or broken

LED’s solid-state technology is robust and withstands high levels of shock and vibration

Lifetime is often <2,000 hours Long operating lifetime

High operating voltage Low forward voltage

Radiant power distribution covers wide range of UV spectrum Peak wavelength may be precisely specified

22

These limited breakthroughs in OCR did not, however, immediately herald a stream of new applications. The great leap forward came in 2012, when a team of researchers from Toronto won an annual machine learning developers’ competition, achieving an image-recognition error rate of just 15%, some ten percentage points better than the next best competitor’s score.

The Toronto team’s success showed what had been holding back the adoption of machine learning: its hugely improved image-recognition capability stemmed from the decision to train its machine-learning algorithm on a much larger data set than had ever been used before, and to do so by training its algorithm on a large array of now affordable Graphics Processing Units (GPUs).

By 2012 it had become clear that the wider use of machine learning was going to depend on the availability both of data, and of cheap, high-speed processor chips.

These factors explain why machine learning has, in 2019, changed from being theoretically attractive, to being practically viable for any manufacturer of industrial or consumer electronics products. Training data sets are now large enough to support a wide range of applications such as speech recognition, image recognition, people counting and video analytics thanks to the huge stores of data generated by services such as YouTube, Facebook and the apps associated with smart watches and wristbands.

At the same time, today’s microcontrollers, applications processors and FPGAs can perform inferencing at the edge, that is to say, without requiring a connection to an Artificial Intelligence (AI) service in the cloud, at high speed and with good accuracy. Silicon chip manufacturers have also introduced new tools to support the implementation of machine learning software on their devices.

An ecosystem for training machines has also emerged. Training frameworks such as Caffe™, TensorFlowLite™ and PyTorch are available to any OEM to train neural networks on its data set. The machine learning models that they produce are packaged in standard data formats that most MCU, processor and FPGA manufacturers support.

So now machine learning is ready to be implemented on the hardware that embedded developers are already familiar with: devices such as Arm® Cortex®-M-based microcontrollers, Cortex®-A based applications processors, or low-power FPGAs. But to what extent do the manufacturers of these hardware devices provide a bridge between the machine learning model produced by a framework such as Caffe or TensorFlow Lite, and the OEM’s chosen MCU, processor or FPGA?

Diverse approaches to machine learning enablementIn fact, different manufacturers have taken different approaches to the porting of machine learning models to a hardware target. Some provide extensions to existing development tools to enable the developer to compile a machine learning model to a specific hardware device. Others have created a complete Integrated Development Environment (IDE) for machine learning.

Microchip Technology has taken a third route: rather than providing a specific set of machine learning tools for users of its PolarFire® FPGAs, it has partnered with a third party, ASIC Design Services, to perform conversion of the OEM’s Neural Network (NN) model to an FPGA bitstream output. This output can then be compiled to a PolarFire FPGA target using Microchip’s familiar Libero® SoC design suite.

The advantage of this approach is that an engagement with ASIC Design Services provides for consultancy as well as model conversion, and avoids the need for the PolarFire user to learn how to perform model conversion.

Another FPGA manufacturer, Lattice Semiconductor, provides a comprehensive set of services and tools, sensAI, to enable users of its iCE40 and ECP FPGAs to do the porting themselves, as shown in Figure 1. The sensAI stack incorporates modular hardware platforms, example demonstrations, reference designs, neural network IP cores, software tools for development, as well as custom design services.

This comprehensive stack is particularly useful for streamlining the development of applications supported by the Lattice reference designs, such as people counting: Lattice supplies ready-made training scripts and sample data sets to support model training in a standard framework such as Caffe, as well as the tools for compiling the finished model to the chosen hardware target.

TECHNICAL VIEW

Technology companies have dreamed about the potential applications for machine learning in mainstream electronics for decades. Wartime code-breaker Alan Turing was already thinking about the concept of machine learning in the 1940s. Practical progress was slow until the 1990s, however, when techniques for Optical Character Recognition (OCR) enabled machines for the first time to read handwriting. The technology was deployed commercially in the late 1990s, for instance, to read bank checks written by hand.

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Right tools for the job? How semiconductor manufacturers are smoothing the process of implementing machine learning on their devices

A similarly comprehensive offering of tools, but for applications processors rather than FPGAs, is provided by NXP Semiconductors. Its eIQ™ ML Software Development Environment offers the key components required to deploy a wide range of machine learning algorithms. It includes inference engines, NN compilers, vision and sensor solutions, and hardware abstraction layers, as shown in Figure 2.

At launch, it supported the i.MX RT crossover microcontroller family and the i.MX family of applications processors, but NXP’s intention is to deploy the platform to its complete range of processors and MCUs over time. Implementation is particularly well supported for NXP’s eIQ application samples: face recognition, object detection, anomaly detection and voice recognition.

In addition, an NXP development kit for the i.MX 8M provides a useful demonstration of the potential for Alexa voice-recognition applications.

While NXP’s eIQ platform is a discrete set of tools for machine learning, STMicroelectronics has chosen to support machine learning development through its existing STM32CubeMX design environment for 32-bit MCUs. With STM32Cube.AI, developers can convert pre-trained neural networks into C code that runs on the company’s STM32 Arm Cortex-M-based MCUs.

The strength of the STM32Cube.AI package is that it is integrated with ST’s portfolio of environmental and motion sensors. Predictive maintenance, which depends on accurate recognition of patterns in parameters such as vibration and temperature, is expected to be the killer app for machine learning. STM32Cube.AI is supplied with ready-to-use software function packs which include example code for two applications:• Human activity recognition• Audio scene classification

These code examples are immediately usable with the ST SensorTile reference board and the ST BLE Sensor mobile app. The SensorTile board features an accelerometer/gyroscope module, pressure sensor, microphone and Bluetooth® radio transceiver.

Machine learning framework built for the embedded worldThe tool offerings from most semiconductor suppliers assume that the OEM’s model will be trained in a standard third-party model-training framework such as Caffe or TensorFlow. These frameworks have their roots in the enterprise computing world, and their output, the inference engine they produce, is ideally suited to a cloud-based run-time environment featuring arrays of high-power processors, rather than for resource-constrained embedded hardware.

That’s why the machine learning platform provided by QuickLogic and its SensiML subsidiary is so interesting to embedded developers. SensiML’s Endpoint AI Toolkit, a complete model training tool suite, was built from the ground up for embedded hardware targets. Intended for use in typical embedded applications such as predictive maintenance, the SensiML toolkit does not assume that a neural network is necessarily the right type of inference engine for the intended application. SensiML maintains that: • Slowly varying sensors, such as temperature or humidity sensors, can

often use basic rules or threshold analysis• Dynamic time-series data can nearly always be handled by machine

learning classifiers• Spatial (image) data typically requires neural networks

Offering a growing library of feature transforms and classifier algorithms, SensiML’s toolkit automates the search for, and optimization of, the best approach for a given problem, rather than imposing a one-size-fits-all deep-learning approach, as shown in Figure 3. Benefits include the potential to occupy a much smaller code footprint, and performing model training with much less data than a neural network requires.

Crucially, it enables developers to build intelligent IoT sensing devices in just days or weeks without the expertise in data science or embedded firmware that frameworks such as TensorFlow or Caffe typically require. And because SensiML is part of QuickLogic, its sensor algorithms are optimized for implementation on QuickLogic’s EOS™ S3 sensor processing system-on-chip, although they are also compatible with various other hardware targets including Arm Cortex-M-based MCUs.

Rapid development in tool offeringsManufacturers of MCUs, applications processors and FPGAs have already introduced a wide range of tools to support the needs of embedded developers who are implementing machine learning models. But this field is young, and intensive development continues. The performance of these tools is only going to get better and the features of them more sophisticated.

For embedded developers, this means that there has never been a better time to start experimenting with machine learning in real-world applications.


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19-viii 35 Fig. 1: Implementation flow on Lattice Semiconductor sensAI tools

Fig. 2: NXP’s eIQ platform for hosting an inference engine on an embedded processor or MCU

Fig. 3: The SensiML inference engine development flow

TECHNICAL VIEW

Read this to find out about:• The reasons for the rapid adoption of machine learning

technology in the embedded world

• The types of semiconductor hardware which can support artificial intelligence in embedded devices

• The development tools that semiconductor manufacturers provide to support machine learning applications

By Future Electronics


REFERENCE NUMBER

19-viii 36

Dual-Mode Choke Addresses Differential and Common Mode Noise

By: Lazaro Rodriguez, Standard Product Engineering Manager, Triad Magnetics

Circuit designers must deal with many types of noise: internal, external, RF, line frequency and more. Noise can be a limiting factor in system performance and so must be addressed and minimized. The challenge is, 'at what effort and cost?'

Even the ubiquitous switched-mode power supply (SMPS) has noise issues. Due to its efficiency and small size, this device is used in applications including LED drivers and electronic ballasts, etc. Unfortunately, SMPS units also are subject to Differential Mode (DM) noise and Common Mode (CM) noise, both of which must be suppressed.

Noise Mechanisms and Solutions

Differential mode and common mode noise have different causes and thus different solutions. Differential mode noise is noise that is conducted on the line and neutral in opposite directions, as shown in Figure 1. Common mode noise is conducted on the line and neutral in the same direction returning through ground, also Figure 1.

The basic DM filter uses a single-winding choke (inductor) inserted in series with the line path, along with a capacitor from line to neutral, thus blocking noise propagation through the system.

Since the DM inductor is in series with the line path, it handles the noise and DC offset current being supplied to load.

Fig. 1

Therefore, it must be designed to provide the needed inductance, but do so with low DC resistance to handle the RMS current and peak line current without saturating, as shown in Figure 2.

The basic CM filter uses a dual-winding inductor in both the line and neutral paths, plus a capacitor from line to ground, as shown in Figure 3.

Since the line and neutral currents pass through the CM windings in opposite directions, there is no net magnetic flux and therefore no possibility of saturating the CM choke. The CM filter choke only needs to have the required inductance along with sufficiently low DCR for the RMS current.

A Better Idea from Triad Magnetics

Since the DM and CM noise mechanisms are largely unrelated, their solutions require two different chokes. It would be fortunate if the two noise-suppressing approaches could be implemented by one choke – saving space, simplifying the Bill of Materials (BOM) and reducing cost.

Fig. 3

Fortunately, a new solution from Triad Magnetics combines both chokes into a dual-function, open-frame design that provides the features of both chokes in a single, smaller, more cost-effective package. CMF Series Dual Mode Chokes, as shown in Figure 4, are more than a simplistic co-packaging of two distinct devices into a single component. Instead, their design enhances the electrical performance, while yielding savings in size and cost.

There are 21 CMF models with current ratings from 0.45 to 2.3A; inductances from 10 to 100mH; stray inductances from 200 to 2100mH. DC resistances are 188 to 2930mΩ, depending on model. They are available in horizontal packages (13.5h × 15 × 24.5mm to 14h × 25 × 29mm) and vertical packages (27h × 15 × 29mm) to fit tight clearance situations.

Despite their small size, the creepage and clearance parameter is greater than 3mm and they are rated for 300VAC operation. They are an excellent solution for most designs.

Fig. 4

Fig. 2

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