TEAM Microscope Engineering Planning

Norman Salmon

Engineering Program Manager

Seung-Kil Son Ph.D.

Staff Mechanical Engineer

December 12, 2003

Areas of Engineering Effort 2004-2007

Concept Engineering

FY2004 FY2005 FY2006 FY2007

Design/Engineering

Analysis

Fabrication

Instrumentation and Metrology

Thermal Analysis

Microscope Geometry

Sensors

Actuators

Controls

Materials

Building

Metrology

Electrical Systems

Fabrication

Mechanical Design

Initial Specification

Reset Specification Q1 2004

Critical Path for Concept Engineering and Stage Specifications

Cooling Systems

Additions to the Original Scope of Work

TEAM Stage

U of Ill - TEAM Stage Cartridge and On Stage Experiments

Cooling System

Automated Sample Loading

With Load Lock

Microscope DesignFacilities/Building Impact

Materials Be/Ceramics

62 Machine Shop

Projects and Funding that can help support an expanded scope of work

• KITECH (300K for FY2004 - ??) • Miquel Salmeron - MF• Alex Zettle (Shaul) • David Dornfeld

– Support in Equipment for Building 62 Shop (500K) – Support in Students and Post Docs to strengthen/reduce cost of

fabrication support

• Prospects – Potential Visiting Professor from Korea in PZT and Sensors

(March 2004)

– Paul Wright /Chris Talbot Applied Materials

Proposed Shift in Funding

0

100

200

300

400

2004 2005 2006 2007

TEAM Stage Funding

Current

Proposed

Engineering Effort

0

20

40

60

80

100

120

140

160

180

2004 2005 2006 2007

Concept Design

Design

Analysis

Consulting

Fabrication

Instrumentation

PurchasedComponents

Travel

Engineering Costs

• Setting up a fabrication account is essential– General and Administrative

• 46.5% GR1

• 20.6% Fab

• Detail budget should be submitted to NCEM January 1, 2004 based on limitations of scope of work

TEAM Project Management

• MS Project • Tracking of Resources • Resource Conflicts • Budgeting • Time Lines • Unique UC Numbers for

Sub-accounts to track specific project areas

Project Code Parent I.D. Description Staus

1 UC5074 501506

Design and Fabricate Fluidic Sample holder for JEM 3010 TEM probe.

Basic probe design and critcal dimensions have been modeled in SolidWorks based on LBNL drawing # 25M0266B and JEOL drawing number 8147 0528 6. - Mid January!!!!! Met with Mark on 12/111/03 - happy with current design.

2 UC 5051 503601

Design and fabricate modified cover plates for FIB with Detoronics #DTO2H-14-19PN electrical connector located and installed at the center of the cover plate.

Both plates were designed and fabricated and are referenced on LBNL drawing #s 25H206 and 25H207.

3 501506

Full Rotation Tomography Holder - Design and fabricate sample holder with +/- 70 degrees of rotation and +/- 10 degrees of tilt within 1.8mm envelope.

Concept Designs are in progress, holder blank will be from current double tilt holder for CM300 in Ti. Motor information from Clock and Kliendiek are still under investigation.

4 501506

JEOL 2010 / 3010 blank sample probe design and fabrication.Basic probe geomtry will be designed and fabricated for use as a blank for custom probe designs as needed.

Basic probe design and critcal dimensions have been modeled in SolidWorks based on LBNL drawing # 25M0266B and JEOL drawing number 8147 0528 6

5 UC4783 503601

FE SEM - Design and fabricate sample holder utilizing a parabolic mirror to collect flourescence from sample and direct it to fiber bundle.

Installation Week of Nov 10th. Installed - adjustments needed. Additional work on cooling plate design and integration.

6 UC5144 503601

A continuation of FE SEM project utilizing a 1.5mm parabolic mirror to single fiber optic.

Basic solutions have been brainstormed and concept designs are in progress.

7 XXXXX

Shaul Aloni - Joel 2010 Blank and custom probe design and fabrication. High density (80) chip contacts, high stifness, chip clamp design base on sample geometry.

Need concept design to manufacture pins. Similar to MEMS holder.

8 UC5145 511201Mems insitu tensile tester Morris Group/Andy Minor/ LLNL Ues

"3010" modular holder for this design.

9 XXXXX

Daan Hie Alsem - Contact design for fatigue test specimens used in testing fatigue and wear in silicon structural films

Norm, get together with both Shaul and Daan to look at conbining design effort.

Current Project List

Stage Concept Sketch with Autoloader

Specifications Currently Set

• Drift Specification – Dream #: 1Å / 10 mins – applications Lorentz (single spins – 1000

secs), EFTEM (for 1Å Resolution may need 5 mins exposure) – Minimum acceptable: 0.5 Å / 1 min – Present standard is 2 Å / min, so the existing minimum is almost

sufficient, but we’d really prefer to do better – This is for x, y and z

• Eucentricity – Very desirable to make any point eucentric via software control as

opposed to only having only one point in space that is eucentric. – Would represent an incredible improvement for the operator

• Range– Coarse Travel

• x & y = 2 mm • z = Dream spec 3 mm (if designing for bigger gap

microscopes, TEAM II+), minimum z = 0.5 mm for TEAM I • Note that this constraint is largely based on present 3 mm disc

size – practical reason, not an engineering – Resolution of coarse motion:

• Generally want 10 times overlap of coarse motion to fine – this dictates about 10 nm

– Range over which fine travel is in existence: 10 µm (or better)– Resolution of fine motion: 30-50pm

Specifications Currently Set (Continued 1)

• Repeatability– 5 times worse than resolution – thus, that means 250 pm (0.25 Å)

• Precision– 10 times worse than resolution – that’s then 500 pm (0.5Å)

• Repeatability between microscopes – It was noted that doing this very successfully would be very beneficial

in terms of justifying use of two columns instead of one column.– Kinematic joint for cartridge between microscopes – goal is to be able

to analyze the same nanoparticle in both the TEM and STEM columns• Repeatability resolution 250 nm coarse motion (maybe better)• Want an optical method for fine positioning • Needs to be discovered what we can expect for resolution on this, what software

exists • If better than 10 nm we’re very happy

Specifications Currently Set (Continued 2)

Specifications Currently Set (Continued 3)

• Rotations– Specimen stage: ± 20 is minimum, 45 is preferred, 70 is desired

– Resolution: 100 µrad

– Discussed in terms of requirements for TEAM I & beyond TEAM I. • Likely that TEAM I will need only 20 for routine use

• The additional tilted need for tomography will almost have to come from a special cartridge design

• Speed – Worth considering, but not a priority but a convenience

– Obviously, faster is better

– Shoot for 1 rpm

• Cartridge – Types of samples: 3mm disc, FIB, MEMS

– Sample Size: 3 mm disc as standard • Reason: if we deviate from the 3mm disc size, users will not be able to do any

sample preparation prior to use of the TEAM instrument. This is not desirable.

• Size: Thickness: 0.5 mm in center, thicker to the sides, x & y will depend on design

– Cartridge should be a kinematic fixture

Specifications Currently Set (Continued 4)

Specifications Currently Set (Continued 5)

• Materials – Non-magnetic

– Conductive

– Stiff

– Thermally stable

– UHV-compatible/bakeable

– Be? Cu-Be?

Nano/Sub-Nanometer Scale Manipulation

Control Mechanical Components Environment

1. Actuator -Piezo (No Stiction)

2. Feedback - Laser/Capacitance ~ 10 times better than target accuracy.

3. Control Technique

- Coarse/Fine (with compensation)

1. Material - Stability - CTE (Super/Invar, Zerodur) - Residual Stress - Stiffness

2. Kinematics - ABBE error - Cosine error - Axis coupling effect

3. Part Accuracy - Surface Condition - Straightness - Dimensional accuracy

1. Vibration/Acoustic - Vibration isolation - Avoiding Eigen-modes

2. Thermal - Thermal inertia - Heat isolation - Minimize heat generation

3. Electro-magnetic - Shielding & Isolation - Avoid monitors &

computers, noisy electric motors

4. Media for Sensors - Humidity, Air pressure,

Temperature change

Current Target

Technical Issues

5 ~ 10nm accuracy 0.05nm accuracy

Actuator

Feedback

Control

Thermal

5 ~ 10nm accuracy Better than 0.05nm (0.5 A)

1 nm resolution 0.01 nm (0.1 A) resolution

610accuracy

workspace 810accuracy

workspace

Low CTE materials Low CTE materials and Compensation

improvement

How to solve the problems

Piezo actuationLaser/capacitance

readbackCoarse/Fine

control

5mm PZT

5mm workspace

0.5nm open loop resolution

Laser

0.01nm resolution

Capacitance

0.01nm resolution

Target

Target

Electric field

310

610

910

1210

][m

fine motion

coarse motion

Joint bearings (fine-motion)

Bearings

Stick-slip

Error motion

Flexures

Continuous

Small error

Small workspace

System Design

• Why do we need Nanometer accuracy for the Macro-scale components?– The guiding system directly effects the system overall accuracy.

– The error amount should be within fine motion control region

1

e

2

12 e

: Orthogonality: Straightness: ABBE error

It’s not easy to get better than 0.1 mrad ABBE error with conventional machining.

)sin(_ rreerrorABBE

x-axis

y-axis guide surface

error amount ( ) < fine motion travel range (1~10 microns)),,( ef

mmradmm 51.050 (when e=0.1mrad and r=50mm)

10-3 10-4 10-5 10-6 [m]

meso machining

miniature machining

silicon µ-machining

Critical dimensions

Meso-scale machining: 10 µm ~ 1mm

Micro Milling, Drilling and Turning

Micro Stepper Motor Laminates - Produced Using 100 Micron Diameter Rotary Cutting Tools - Tech Transfer Grant for Empire Magnetics FY2002

100 Micron Diameter Micro Electrodes Produced for Alexander Zholents 2002 AFRD LDRD

Holes as small as 40 Microns can be drilled in Stainless Steel - Shown is a 70 Micron Drill compared with a Human Hair

10µm gears in silicon

25µm channel in diamond

FIB Milling

17µm cutting tool

20µm channel in graphite

1mm

Examples Meso-Machining at LBL

Micro Turbine Blades

2-translational axis manipulation for FESEM

1. Technical challenge• No-existing manipulation• collect light coming from the sample• Limited installation space• Following the table movement• Don’t hinder other instrument inside

the chamber

2. Approach• Parabola mirror• Two axis stage• Piezo actuation• Step-like actuation for stability• Open loop control

3. Installation and Test Results• Positioning accuracy: 0.02mm• Easy user control with VisualBasic• No damage on vacuum grade• No X-ray through the stage

Installation surface

X-axis stage

Sensor position

5mm

10mm

FESEM TableWith 5-DOF

Diamond turned mirror surface

Installation and test of FESEM Stage

2-axis stage

FESEM

Monitor

Outside view

Inside view

Mirror engagement

Test result

Control Panel

Hole on the parabola mirror

0.5mm

Control panel for FESEM Stage

Software : VisualBasic

Stage aging time control

+/-X axis feedrate control

Z-axis control

Stage pausing

Auto-homing

Z-axis voltage level control

X-axis voltage level control

2-rotational axis manipulation for TEM

1. Technical challenge• Sub m-radian accuracy with

with 6.5mm shaft.• Two independent rotations• Attachment to the existing

Goniometer

2. Approach• Piezo actuation• String type rotating mechanism• Jewel bearing• Minimization stick-slip

3. Expected results• 0.6 mrad accuracy tilting

(equivalent with 3micron linear displacement)

• 0.03 mrad accuracy rotation• Smooth operation• No-jittering• Easy jog control

(patent disclosure)

Fluid Holder for JEOL 3010 (Mark Williamson)

Modular Sample Holder for the JEOL 3010

Ti - 6Al4V

Delrin

Aluminum

Other Ongoing Projects

• Florescence Holder for the CM-300

• LLNL/Morris In-Situ Tensile Test Holder

• Single Tilt Full Rotation Tomography Holder

• IC Holder for Daan Hein

1mm Parabolic Mirror for TEM Sample Holder