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Grounding ........................................ 68

Lightning, Transients & ESD .....52, 84

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Testing & Test Equipment ................. 8

industries & applications

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Military ............................................... 84

Smart Grid ......................................... 60

Standards ............................................ 8

directories

2012 EMC Test Lab Directory .......... 26

Consultant Services ........................ 31

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2 interferencetechnology emctest&designguide2011

0 TESTING&TESTEQUIPMENTWhy So Many EMC Standards? ...................................8steVe hayes, tRaC Global; JaCk MCFadden, Wyle Laboratories; steVe osteen,

advanced Compliance solutions, Inc.; kenneth Wyatt, Wyatt technical services; and

daVId ZIMMeRMan, spectrum eMC Consulting

Automotive RF Immunity Test Set-Up Analysis: Why Test Results Cant Compare ................................16MaRt Coenen, eMCMCC bv; hUGo PUes, Melexis nV; and thIeRRy BoUsQUet,

Continental

Time-Domain EMI Measurement System Up to 26 GHz with Multichannel APD Measuring Function .............42hassan hanI sLIM, ChRIstIan hoFFMan, stePhan BRaUn and aRnd FReCh,

GaUss Instruments Gmbh; Johannes a. RUsseR, Institute for nanoelectronics,

technische

0 SUrGE&TraNSIENTS

Transient Voltage Suppressors (TVS) for Automotive Electronic Protection ....................................................52

soo Man (sWeetMan) kIM, Vishay Intertechnology, Inc.

2011contents

16 42

852

SPECIaLFEaTUrE

2012EMCTESTLabdIrECToryMore than 300 EMC Test Laboratories, arranged geographically, with details of services offered and contact phone numbers, are presented as a quick reference guide to EMC testing services.

26

ON THE COVER:Artistic rendering of a probability

function graph (Page 49).


InterferenceTechnologyThe EMC Directory & Design Guide, The EMC Symposium Guide, and The EMC Test & Design Guide are distributed annually at no charge to qualified engineers and managers who are engaged in the application, selection, design, test, specification or procurement of electronic components, systems, materials, equipment, facilities or related fabrication services. To be placed on the subscriber list, complete the subscription qualification card or subscribe online at InterferenceTechnology.com.

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EMC and the Smart Grid ..............................................60WILLIaM a. Radasky, Metatech Corporation

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S u b s c r i p t i o n sITEM, InterferenceTechnologyThe EMC Directory & Design Guide, The EMC Symposium Guide, The EMC Test & Design Guide and The Europe EMC Guide are distributed annually at no charge to engineers and managers who are engaged in the application, selection, design, test, specification or procurement of electronic components, systems, materials, equipment, facilities or related fabrication services. Subscriptions are available through interferencetechnology.com.

E lectromagnetic interference knows no borders, so an international collaboration seems to make the most sense when it comes to tackling the issues confronting the EMC industry, from testing standards to job qualifications. Of course, this sentiment is also logistically impractical and clearly not a reflection of reality, but there are some areas where an international approach is being applied.

Take, for instance, Germanys efforts to reverse its engineering shortage. About 76,200 engineering jobs are vacant in Germany, according to a recent assessment by the Association of German Engineers (VDI), and the nations leaders have employed two approaches to address the problem: facilitating cross-border recruiting and targeting the promotion of young talent in the field. To make it easy for engineers to move around Europe, engineering associations and other groups across Europe are working with the European Commission to launch the new Engineering Card. The card, which German engineers can apply for now and other countries are planning to launch, provides standardized information about the engineers qualifications and skills for greater transparency. Setting comparable standards helps remove barriers in changing jobs between individual member states and emphasizes professional mobility.To accomplish the second aim of increasing the numbers of young people entering the field, the German engineering associations are spearheading several promotional initiatives targeting young students and are also lobbying lawmakers to establish a nationwide educational policy for teaching technology in primary and secondary schools. Such an approach, useful for all countries, is also being expanded to the recruitment of girls and women, populations that are still under-represented in engineering. More and more initiatives are encouraging young women to be enthusiastic about technology and not be guided by old gender roles. As more role models in the form of professional engineers report on their career development in lectures, workshops and information sessions around the globe, the message will continue to sink in to everyones benefit.For the first time this year, Interference Technology is also expanding its scope, by including international listings in its EMC Test Laboratory Directory, which begins on Page 26. Common sense tells us that most engineers and designers prefer to use local testing facilities so our easy-to-use directory of labs and their services are grouped alphabetically by geography. However, this first effort is far from complete. If you own or work for an EMC test lab and we have missed you or omitted one of your services, please let us know. Well continue to update the digital edition of the directory throughout the year. You can e-mail your additions, revisions, and suggestions to me at [email protected]. Sarah Long Editor

from the editor

USA1000 Germantown Pike, F-2Plymouth Meeting, PA 19462

Phone: (484) 688-0300Fax: (484) 688-0303

[email protected]

chinA, tAiwAn, hong kongBeijing Hesicom Consulting Company

Lily Liu+86-010-65250537

E-mail: [email protected]

JAPAnTV SD Ohtama, Ltd.

Midori Hamano+81-44-980-2092

E-mail: [email protected]

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8 interference technology emc test & design guide 2011

testing/standards Why So Many EMC StandardS?

SteveHayeStrac global, Worcestershire, united Kingdom

JaCKMCFaDDeNWyle laboratories, huntsville, Alabama, usA

SteveOSteeNAdvanced compliance solutions, Atlanta, georgia, usA

KeNNetHWyattWyatt technical services, Woodland Park, colorado, usA

DaviDziMMerMaNspectrum emc consulting, eagan, minnesota

October 2011 sees the end of the tran-sitional period from previous versions of EN55022 to the latest version, which now requires testing above 1 GHz for the first time. At the same time, beginning of October 2011, the Official Journal of the European Union listing the harmonized standards for the EMC Directive has also been updated. Notable (and predicted) is the inclusion of both generic standards for emissions (EN61000-6-3 and -4). Both these standards now include emission require-ments above 1 GHz in the same way that EN55022 has. While the transitional period for EN55022 has just ended, it has just be-gun for the generic standards, making them mandatory only from January 2014. (See box on Page 10 for more on EMC testing above 1 GHz).

This issue recently inspired Steve Hayes, CEng MIET, managing director for EMC

WhyarethereSoManyeMCStandards?industry experts ponder this and other standards-related issues

and safety at TRaC Global Ltd., to pose a question to his colleagues on LinkedIn, asking: Is this transitional period, where a manufacturer can choose to use either standard to demonstrate compliance to the EMC Directive, too long? After all, the prod-uct churn in todays world is largely much faster than this and, hence, manufacturers may see at least another product launch before above-1 GHz test requirements are required. Equally, the protection of the RF spectrum will be under pressure while millions of new products enter the market without any control of their electromagnetic emissions for another two years.

Interference Technology invited Jack McFadden, senior project engineer at Wyle Laboratories; Steve OSteen, EMC director at Advanced Compliance Solutions, Inc.; Ken Wyatt of Wyatt Technical Services; and David Zimmerman, president of Spectrum EMC Consulting, to expand on this and other questions posed by Hayes.

HAYES: Is the transitional period from old to new standards too long? zimmErmAn: This is an excellent point, and a shortcoming of the European Union EMC compliance system, in my opinion. In fact, there are other product family stan-dards that will lag behind in the emission requirement above 1 GHz, and some may not change in the next 10 years. In answer to the question, in many cases, the time between the need for testing, and the date that a standard exists that requires testing, is too long to ensure that EMC conflicts



are avoided. OSTEEn: The product churn cycle is a significant variable which will vary widely across all industries so I would not dismiss it so easily. There needs to be balance between whats economically prudent for the manufacturer and technically responsible in the interests of EMC. Equipment manufactur-ers are still held responsible for any interference caused by their equipment and are forced to resolve field complaints whether the interference is above 1 GHz or not.

I think the current two-year transition is adequate to allow the manufacturer to complete the redesign and ad-dress any compliance concerns during preliminary reviews. Large manufacturers who have their own compliance labs and permanent compliance staff are aware of the coming requirements and will typically get a jump on any issues which would be necessary due to their broad product line. Smaller manufacturers with fewer internal compliance resources will have to resort to alternate means via their local independent compliance lab, which would likely in-troduce some additional delay during the transition. From the perspective of the small independent compliance test lab, this particular example (EN61000-3 and -4) is not a concern, considering most labs have already completed the site validation above 1 GHz for EN55022:2006 + A1:2007. Any new revision of a standard that requires radical changes in the way a test is performed or in the way equipment is being used or introduces the need for a new category of test equipment could certainly require a significant amount of the transition time. wYATT: From the manufacturers and test labs point of view, a two to three year transition period is good in that it provides a defined length of time to procure new equip-ment (typically, long lead times to develop budgets, evaluate equipment, etc.), and update test procedures. More im-portantly for the manufacturers, because the EU does not allow grandfathering of existing products, this provides sufficient time to re-qualify existing products with longer lifetimes. Not all product lives are measured in months.

HAYES: Do you think the limits in EMC standards are too onerous? You can put a mobile phone (acknowledged as generating a high RF field) next to a PC or mobile elec-tronic gadget without electrical interference occurring. Based on this, could the limits be increased?wYATT: The example specified may be true in some cases, but not necessarily for all products. For example, products with sensitive analog circuitry, such as measuring equip-ment, medical products and sensors, are very likely to be affected by mobile phones and two-way radios or other ambient signals.zimmErmAn: I would have to agree with the general con-sensus that the limits are properly set. A lot of work goes into determining what the limits should be. In fact, there are standards committees that are hard at work to make testing to these limits more thorough. Things like testing all sur-

JACK McFADDEN is senior project engineer at Wyle Labora-tories in Huntsville, Ala., where he provides customer support in the field of electromagnetic interference/compatibility: generate quotes, develop budget, test schedule, create test plans/test procedures/reports, technician work instruction/direction, software validation, training, and mitigation as needed. McFadden served as chair of the Huntsville chapter of the IEEE EMC Society in 2010-2011. He a certified EMC engineer through iNARTE.

KENNETH WYATT is senior EMC engineer at Wyatt Techni-cal Services, LLC, in Woodland Park, Colo. Wyatt has worked as a product development engineer for 10 years at various aerospace firms on projects ranging from DC-DC power converters to RF and microwave systems for shipboard and space systems. He spent most of his career as a Sr. EMC engineer for Hewlett-Packard and Agilent Technologies. A prolific author and presenter, he has written or presented topics, including RF amplifier design, RF network analy-sis software, EMC design of products and use of simple tools and techniques to troubleshoot radiated emission, ESD and RF immunity.

DAVID ZIMMERMAN is an EMC engineer and president of Spectrum EMC Consulting in Eagan, Minn. Zimmerman offers consulting for the improvement of operations at EMC laboratories by increasing the accuracy of measurements, and streamlining processes resulting in higher efficiency; training in the performance of EMC testing and EMC standards at customer sites; coordination and oversight of product testing at any EMC test facility; writing test procedures and reports to a wide variety of EMC standards; and generating technical files for EMC Directive requirements.

STEVE HAYES is managing director for the EMC and Safety business of TRaC Global in Worcestershire, United Kingdom, and has been involved in EMC and product approvals for 19 years. In addition to being the UK principal expert on EMC standardization of Industrial, Scientific and Medical (ISM) products, he is also the convenor of CISPR/B/WG1 who has the responsibility of writing the International standard, CISPR 11. Hayes wrote the CE marking annex to the UKs defense EMC standard, and was co-convenor of CENELEC TC210/ WG9, responsible for writing a guide on approval of military systems with commercial requirements.

STEVE OSTEEN is EMC Director at Advanced Compliance Solutions, Inc. and is responsible for EMC-related issues and sup-port at all ACS compliance facilities. OSteen has worked in EMC and Product Safety disciplines for 20 years, which were divided among independent compliance facilities as well as on the manufacturing side. Currently, OSteen devotes much of his time to standards and equipment research, test plan and test procedure generation, EMC training and compliance mitigation issues. He also takes the lead role when out-of-scope requests are issued requiring standards and equipment research.



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faces of an EUT, and bore sighting of the antenna above 1 GHz for example. OSTEEn: No. In the example above, you give one possible interference source and one receptor for which general rules should not be based. Compliance levels and performance criteria should be based on historical data and sound engineering judgment and should ap-ply to new standards as well as revised standards. Again, a balance must be achieved between the manufacturers desire to market their products and their compliance responsibilities.

HAYES: Why are the automotive EMC standards so different from commer-cial ones given that the environment is the same? The basic premise that in a vehicle electrical noise is generated by the spark ignition system and the limits are set based on interference to only the FM radio band seem somewhat dated.mcfAddEn: I need to start with the questions premises that given that the environment is the same. I do not agree with this premise. The environ-ment is different. It would be easier if everything was black and white, if one size could really fit all. The world exists with various shapes, sizes and colors. There are vast environmental differences between the automotive and most commercial industries. One example, an engine control unit (ECU) operating temperatures are minimum of -40C to a maximum of +150C, reference SAE J1211, Table 1. The typi-cal commercial products have a much more benign temperature operating range. I will not take the time to go into detail to discuss the commercial vs. automotive industry differences within the power bus, grounding schemes and etc. Just keep in mind, temperature itself alters the behavior of electronic components.

Just as there are differences within the thermal environment, there are also differences within the electromag-netic spectrum. The electromagnetic spectrum varies from one location to another location. As an experiment, take a look at analog compass as you pass over a bridge or go through a

For more i n f o rma t i on on EN55022:2006 +A1:2007 and its new requirements, see Steve Hayes article, EMC Testing above 1 GHz: The Deadline Looms, in the Interference Technology 2012 Eu-rope EMC Guide. Download a pdf at www.interferencetechnology.eu. You will find the article under the United Kingdom section.

eMCteStiNgabOve1gHz

toll booth. The needle in the analog compass will lose magnetic north for a brief period then return to normal after the magnetic disturbance has passed. Electronic compasses may also be affected but it depends on their up-date rate, time within the disturbance area and the embedded software used within the electronic compass. The premise that the vehicle noise is lim-ited to just concerns from the ignition firing (spark) effect on the radio is no longer true. It has not been true since the dawn of the electronic ignition. The electrical/electronic sub-components, sensors and modules are placed all over the vehicle. Windows open through the activation of a switch. The vehicle doors lock or open with press of a but-ton. Airbags deploy when the vehicle system senses a crash. Some vehicles can actually speak to you, give you directions and make phone calls. The vehicle technology has drastically in-creased over the past few decades. As the technology has increased, so has the complexity of the vehicle, caus-ing the electromagnetic compatibility concerns to grow. For example, airbags deployment must be during a crash and the airbags should not deploy as you drop off someone at the airport. Yet the automotive technology successes have been so pervasive that the vehicles quality and reliability are often taken for granted.

Even if we were to visit Alice in Wonderland and the environment was truly the same you need to an-swer this question. What is the risk if there is a susceptibility condition? Going back to the case of the analog

compass; you will see a momentary deviation from normal operation with the compass (product) returning to normal operation after the disturbance has passed. It may be inconvenient but it is not life threatening. Now what if the automobiles operation was affected (susceptible) to its environment? What is the worst possible outcome? The vehicle accelerates without driver ac-tion and crashes into another vehicle. So the risk between most commercial products and automotive industry is different. The automotive standards need to be set higher to account for this risk (and they are). If we were to prescribe to one size fits all then we would need to raise the universal standard to the represent the highest (worse case) risk. We would be, in ef-fect, adding cost to the commercial products without value. The value the individual standards have is that they permit the industry to address their individual needs. You tailor your product requirements to meet needs of its intended environment in order to reduce the risk. Or in other words, the individual standards are designed for safe and proper operation of the prod-uct within its intended environment.wYATT: I would disagree the environ-ments are the same for office versus field. More and more automotive prod-ucts today use fly by wire technology with a myriad of microprocessor-based subsystems. Hey, even the transmis-sion on my truck has its own proces-sor! Because rapidly moving vehicles can quickly turn into deadly weapons, safety standards (and corresponding EMC standards) are necessarily more stringent. There have been numer-ous incidents where poorly shielded vehicles have developed operational issues (braking, cruise control, etc.) due to aftermarket two-way radios being installed.zimmErmAn: This appears to be an-other case where standards take a path of their own based on the committee that is writing them. These standards are driven in large part by the manu-facturers and not the consumers. From my limited experience in this area, it seems that as long as the equipment



category. Getting all of the industry experts to agree on common limits, performance criteria and methods would not be feasible. All of these Product Specific Standards are typically not written exclusive to one environment but are focused on a category of equipment but more importantly, its the performance criteria that separates these categories. Could you imagine a Product Specific Standard that would apply to all devices employed in a residence, taking into ac-count for the variety of test levels, variety of test methods and performance criteria would result in an unnecessarily complex and unmanageable standard.

In addition, standard writing committees are constantly addressing the need to revise current Product Specific Stan-dards in an effort to address compliance concerns for new technologies that happen to fall within the scope of that standard. These new environment-based standards would be in constant revision and release and would continue to lag behind the technology curve. I can certainly see the ap-peal of the environment-based standard system, but I dont think each of these standards could effectively address the specific requirements and concerns associated with each product type found in that environment.mcfadden: The environment is not the same. The environ-ment of a toaster and personal computer (PC) in the home has some similarities but they are truly different upon closer

inspection. The similarities are the utility power and the general location (home). Most toasters do not have in-tentional frequency generators within the circuitry. The typical toaster has one input power cable connecting it to the power bus. They are more electrical in design rather than electronic. The PC typically has several intentional frequency generators within its circuitry. It is a digital (electronic) device. The PC has multiple cable connec-tions bringing it to printers, Ethernet, monitors and etc. It can generate interference over a larger spectrum than the typical interference measured from a toaster. The PC can also be affected by interference from a larger spectrum than a typical toaster. The toaster and PC may share the same home, but its reaction and its impact to its environment is completely different.

If the environment is not the same and the products function/operation are not the same is it possible to make one universal standard? I believe all things are possible, but many are improbable. It is possible to generate one universal standard. The question that should be answered is what would be the cost of the universal standard? Would the universal standard be a value added or will the universal standard generate additional cost without benefit? It comes down to determining acceptable risks. The regulating bodies and industry have determined that individual standards that tailor products to specific categories are the most effective way to keep the desired product quality while keeping the cost aligned. This leads to a great deal of confusion when you are searching for the appropriate standard. Many times the governing stan-dard will reference another common standard to require

installed in vehicle does not interfere with the other installed equipment, there is no need for concern about interference beyond that which is known.

HaYeS: Why are there so many EMC standards? Surely the environment is the same whether you use a toaster or PC in the home, yet the test standards (and in some cases, limits) are different. Could a one standard fits all based on environment be produced? Imagine the savings that could be made not having to investigate which standard is the most appropriate.wYatt: I believe there has been a trend in harmonizing many standards. I know this was moderately high on our agenda when I was serving on a standards working group. There will always be differences in certain products, I sup-pose. From a manufacturers point of view, its sometimes difficult to figure out the appropriate standard to use for a given product type, however, Ive found that most test labs or consultants can assist with this. When all else fails, there ARE the generic standards.OSteen: In my opinion, this would be very difficult to ac-complish based on the engineering time and expertise de-voted to tailoring the Product Specific Standards to address potential issues and performance criteria for each product

IntErFErEnCE tEChnoLoGy

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the product to be tested with these specific tests at these specific levels (limits) while using this other standards methodology. This is true for the EN 55011, Industrial, scientific and medical (ISM) radio-frequency equipment Electromagnetic disturbance characteristics Limits and methods of measurements; and EN55024, Information technology equipment Immunity characteristics Limits and methods of measurement and a host of others.

If you wanted to develop one universal standard then you would require acceptance and input from all of the regulat-ing bodies as well as all of the industries. The industries concerns regarding their products are highly exclusive. Their concern is only for their particular product(s). Now consider the logistics of bringing all the industries and all the regulating bodies, then have them willing to be inclu-sive. You are going against human nature and it is going to be painful. If you have had any experience in attempting to achieve consensus with a small body of people, imagine the challenge of getting a global industries and their regulating bodies to agree. I am not saying it is impossible. I believe it could be done. I just believe it is improbable.zimmerman: The problem is that there are many differing opinions about what tests and limits are needed for a given environment. As long as there are two or more groups writing a standard for a given environment you will most

certainly get at least as many different standards as there are groups writing them.

HaYeS: Will ISO and IEC ever align their test methods, limits and procedures? Surely we dont need multiple ways of assessing the same issue electrical interfer-ence?wYatt: Well, I sure hope so, for the sake of everyones sanity.zimmerman: The likelihood of this happening is not great. Peace in the Middle East has a similar chance of happening in our lifetime. Standards writing bodies have a lot of pride and defend their positions with great zeal. If you check the About ISO Web page, you will see that it starts by stating ISO is the worlds largest developer and publisher of International Standards. Size matters. If you go to the About IEC Web page, you will find this statement: The International Electrotechnical Commission (IEC) is the worlds leading organization that prepares and publishes International Standards for all electrical, electronic and re-lated technologies. So the IEC is the world leader. You can see where these two groups will not want to concede their ranking. Would it make sense to align these test methods? The general consensus would be a resounding yes, but this does not mean that it will happen anytime soon. n


Automot ive RF immunit y test set-up AnAlys is: Why test Results CAnt CompARe

testing&testequipment

ABSTRACT

Though the automotive RF emission and RF immunity requirements are highly justifiable, the application of those requirements in an non-intended manner leads to false conclusions and unnecessary redesigns for the electronics involved. When the test results become too dependent upon the test set-up itself, inter-laboratory comparison as well as the search for design solutions and possible correlation with other measurement methods loses ground. In this paper, the ISO bulk-current injection (BCI) and radiated immunity (RI) module-level tests are discussed together with possible relation to the DPI and TEM cell methods used at the IC level.

Keywords: Bulk Current injection (BCI), Radiated Immunity (RI), Direct Power Injec-tion (DPI), TEM cell, wire harness, automo-tive module, Electronic Control Unit (ECU) and Electronic Sub-Assembly (ESA)

I.INTRODUCTIONThe increasing use of electronics in vehicles

requires a very high level of reliability to assure the safety of the vehicle occupants as well as all other road users. Aside all mechanical vibration, thermal and moisture requirements, the new sensors and active actuators used have to be robust against the electromagnetic threats which originate from causes both within and around the vehicle. Already in the past, RF emission and immunity requirements were set by ISO, in particular by TC22/SC3/WG3 who deals with electromagnetic interference. Due to the growing use of these requirements, it is increasingly important to avoid faulty ap-plication and interpretation of them. This has a two-fold drawback: Module compliance doesnt necessarily mean in-vehicle compliance after integra-tion and

Compliance to over-testing over a large range has an inverse impact on economicsThe playing field is wide and involves

car-manufactures as well as the Electronic Control Unit (ECU) and Electronic Sub-Assembly (ESA) manufactures, down to the silicon design to achieve a more integral economic solution.

New vehicle developments like using non-conductive composite materials, zero emission exhaust requirements for com-bustion motors, the introduction of the hybrid motor or full electric vehicle put an ever higher burden on economics as well as safety reliability for the electronics used.

The RF immunity requirements have therefore been extended beyond the 30 V/m,

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Automot ive RF immunit y test set-up AnAlys is: Why test Results CAnt CompARe


in the 20 1000 MHz frequency range, as specified in the European Automotive Directive 2004/104/EC with its many amendments [1].

Most car manufacturers use extended immunity require-ments downwards from 20 MHz to 150 kHz, typically by using the bulk current injection (BCI) test method. Where the highest level according the standards is 100 mA, levels up to 600 mA are already specified by some car-manufac-turers. BCI test set-up drawbacks and pitfalls are described in chapter II.

100 V/m has been set as typical radiated immunity (RI) requirement for non-safety related ECU/ESA and 200 600 V/m for those ECU/ESAs which are safety related. The frequency range for the radiated emission and immunity of applications has been extended upwards from 1 GHz to 2 or even 6 GHz. This will be elucidated in chapter III.

In chapter IV, the necessary conditions to obtain possible correlation with IC test methods will be given and conclu-sions will be given in chapter V.

II.BCITESTSET-UPThe BCI test set-up, according ISO 11452-4 (2005) [2] is specified in the frequency range 1 400 MHz. The BCI test defines that the cable harness length = 1 0,1 meter and it shall be positioned at 50 mm above a metal reference plane at 0,2 meter from the front edge of the metal plated table, see figure 1. The metal plated table is defined 1,5 meter wide and 0,9 meter high positioned above a conductive floor. The battery shall be connected through an artificial network (AN, also known as Impedance Stabilizing Network: ISN) with an impedance of 50 // 5 H but this network is only defined in the frequency range 0,1 - 100 MHz.

An RF-impedance undefined load simulator box is pre-scribed in-between the cable harness to the DUT and the ANs. The BCI probe shall be placed at distances, d, from the connector of the DUT; 150, 450, 750 10 mm for the open-loop method and 0,9 0,1 m for the closed-loop method. If a current measurement probe is used during the test it shall be placed at 50 10 mm from the connector of the DUT.

The calibration of the BCI clamp is described in detail in the latest version of the standard [2, 8, 9].

With the BCI test, there are two options implemented: open loop and closed loop. With the open loop test, the voltage coupled into the calibration test jig to achieve the required current through a 50 load (where the opposite side of the test jig is loaded with 50 as well) is recorded and the forward power level is maintained during the im-munity test while the injection probe is positioned at the three harness locations.

With the closed loop test, the RF current is increased up to a level where the DUT fails or the current limit or the forward power limit is reached: 4x the nominal RF power as used during calibration to meet the induced current requirements.

However, the open loop test method was intended to apply for non-grounded DUTs and the closed loop should apply for grounded DUTs only (as RF currents will flow intentionally).

Applying a closed loop bulk current of 100 mA into a insulated sensor with a capacitance to the reference plane of 20 pF at 3 MHz would require an output power of nearly 1500 Watt from a 50 RF generator when no power limit is applied. Applying the open loop test would only require 0,5 Watt, a difference of 35 dB in RF power.

The second pitfall comes in three: the length of the har-ness, the equivalent RF termination at both ends of the harness and the BCI clamp itself.

The cable harness above the reference plane represents a transmission line with a characteristic impedance of 150 200 , Figure 1. Even in the ideal case when the cable harness is only terminated by two ANs to ground, being equal to 25 in common-mode, there is a serious mismatch between the harness transmission line impedance and the ANs in parallel.

When a capacitor to ground is used for one of the (signal) lines in the load box circuit, the harness termination imped-ance mismatch will even be higher and standing waves over the harness will result.

Figure 1. The characteristic impedance calculation of a cable harness over a metal plate (Agilent AppCad (freeware)).

Figure 2. Simulated BCI clamp turns ratio effect on resonances 1) 1:5, 2) 1:2, 3) 1:1 load box impedance is 1 , DUT is floating, open loop test.

Coenen, Pues, Bousquet

interferencetechnology.com interferencetechnology 19


On the opposite side of the harness, the DUT will be left floating or grounded. In either case, another ideal condition for resonances. However, these harness resonance frequen-cies are fully determined by the cable harness length which might include the wiring inside the load box up to the ANs.

The third item in this equation is the BCI clamp itself as the turn ratio between primary and secondary of this transformer determines the resistive loading of the har-ness loop. Dependent on the frequencies designed for, the BCI clamp turns ratio also varies between manufactures, this between 1:1 and 1:5 which alters the equivalent damp-ing resistance between 50 and 2 (when excluding the RF losses of the clamp itself).

The length of the cable harnesses tested with varies between 1 - 2 meter determined by the specification of the end-user i.e. car manufacturer and has typically the same topology as used with the RI test set-up.

In the simulated results of figure 2, the DUTs RF voltage towards the reference plane is given from a floating sensor under the condition when the load box represents low RF impedance at the end of the harness. 0 dB represent the nominal voltage. Due to the open-ended transmission line, the induced voltage appears in full at the lower frequencies. This DUT to reference plate voltage, divided by the distance gives the local E-field strength. Excesses over 30 dB both above and below nominal can be noted which are also mea-

sured from the test set-up and can also be seen in real RF immunity test results, figure 3. The resonances occur at all harmonics of where the harness length equals n/4. When the cable harness is 2 meter long, the first resonance occurs at 37,5 MHz, see figure 3.

Figure 3. Measured BCI clamp turns ratio 1:2; load box impedance is 1 , DUT is floating, open loop test, nominal level is 100 dBV.


Automot ive RF immunit y test set-uP AnAlys is: Why test Results CAnt ComPARe


However, when the load box is replaced by a grounded network which represents, in total, the characteristic im-pedance of the cable harness, the influence of the current injection probe reduces as well as that the cable harness length related resonances and variation diminish: 3 dB, see figure 4. To enable these values in real vehicles, also the equivalent RF common-mode impedances at the ESA/ECU ports to the sensors connected have to be adapted to meet

the cable harness characteristic impedances as well.Only for the artificial BCI and RI test set-up, the cable

harness will be used at 50 mm apart from a metal reference plane i.e. vehicle frame. In real cars, where the harness is routed against the vehicles frame characteristic impedances of 50 20 can be found. The common-mode termination to achieve best compliance with the test set-up will divert from the optimal impedances occurring in real vehicle ap-plications.

III.RITESTSET-UPThe RI test set-up, according ISO 11452-2 (2004) [3] defines that the cable harness (length 1,5 0,1 meter) shall be positioned at 50 mm above a metal reference plane at 0,1 meter from the front edge of the metal plated table. The RI test is specified in the frequency range 80 MHz 18 GHz. The antenna front is at 1 meter from the cable harness (0,9 meter from the metal plated table top and the antenna center is at the harness center. The metal plated table is defined 2 meter wide and 0,9 meter height above a conductive floor. The battery is still connected through an artificial network (AN). Also here the impedance undefined load box is defined in-between the cable harness to the DUT and the ANs.

The ISO standard reads: The load simulator box shall be placed directly on the ground plane. If the load simulator has a metallic case, this case shall be bonded to the ground

Figure 4. Simulated BCI clamp turns ratio 1:1, 2, 5; load box impedance is 150 , DUT is floating, open voltage and open loop test condition.




plane. Alternatively, the load simulator may be located adja-cent to the ground plane (with the case of the load simulator bonded to the ground plane) or outside of the test chamber, provided the test harness from the DUT passes through an RF boundary bonded to the ground plane. When the load simulator is located on the ground plane, the DC power sup-ply lines of the load simulator shall be connected through the AN(s). This open description allows for a very broad variety of RF impedances represented by the load box.

As result of different dimensions defined in the BCI and the RI standards, the widest metal plated table is used with a long cable harness. The cable harness is fixed at 50 mm above the metal plane and pretty undefined RF terminated by the load simulation box, which may or may not be grounded.

On the opposite side of the harness, the DUT shall be placed on an insulating support; also 50 mm height and the DUT shall be grounded by a ground strap (when defined by application).

When performing radiated immunity tests e.g. according IEC 61000-4-3, the E-field strength in front of the antenna is measured at 1 meter distance at center level, without any nearby object to the antenna. In the ISO RI case, the antenna is placed in front of the metal plated table which is at 0,9 meter distance as the distance to the cable harness has to be set to 1 meter. The E-field strength is measured 0,15 meter above the metal plate at 0,1 meter from the edge without

the cable harness present. The antenna height is adjusted such that the antenna center is also at the harness cable height: 0,95 m above the ground reference plane. For each frequency, the RF generator settings e.g. forward power is recorded to obtain the field strength at that single E-field sensor position.

Due to the close proximity of the metal table, the an-

Figure 5. Worst-case E-field to induced voltage ratio from a 2 meter cable harness at 50 mm above a metal reference plate while the load box/AN impedance is varied; red = 2,5 k, blue = 50 sensor to GRP impedance.




tennas radiation pattern is affected by mutual coupling. More problematic w.r.t. RI test result comparison is the antenna used as the formal antenna factor and gain factor are given for an antenna in free space. When high(er) gain horn antennas are used, the distance at which a plane EM field can be expected has to be multiplied by the gain factor. When the wavelength is 1 meter, the theoretical near-field to intermediate-field transition occurs at 1/(2) meter distance. When the antenna gain is 12 dB e.g. with horn antennas, the distance to achieve this condition is 2 times further away as with a log-periodic antenna with a gain of 6 - 7 dB. The E-fieldstrength requirements can be met but the plane-wave conditions are not. As such, the local E-fieldstrength over the cable harness length has become antenna dependent thus unpredictable and non-calculable.

Similar to the BCI test set-up, the voltage i.e. current induced in the cable harness will depend on the RF termina-tion at both ends of the harness. To verify this, a test set-up has been built using a horn antenna at 1 meter distance from the harness while sweeping through the frequency band from 400 MHz to 1 GHz. The antenna polarization was changed from horizontal to vertical while measuring the induced voltages in-between an insulated sensor and the reference plate. The worst case induced voltage was recorded and the load box impedance was varied between 1 and 200 , see figure 5. What was already expected is that

the maximum induced voltage reduces when the common-mode termination resistance at one end of the harness cable topology becomes terminated close to its characteristic impedance; 150 - 200 in this case. Again this test set-up optimum common-mode termination impedance will be less in real vehicle applications.

The differences between the red and blue line results in figure 5 indicate that the worst-case resonances occur-ring under no-load conditions are substantially worse than when loaded with 50 , by about 10 dB. In either case, the induced voltage decreases when the load box impedance is increased. No valid simulation model has been found yet to describe these cases.

IV.POSSIBLE(COR)RELATIONWITHDPIOROTHEREMCICTESTMETHODSBased on the lack of site-to-site correlation and the lack of sufficient bounds in-between the BCI set-ups, it will be very hard to find any correlation with DPI or TEM-cell results according IEC 62132-2, IEC 62132-4 or other test methods [4 - 7]. What has remained from the measurements in the 80-ies is the relation between the E-fieldstrength applied to exterior of the vehicle and the levels of the induced currents obtained on the internal harnesses of the car which appears to be 1 mA/V/m.

When with BCI a current is applied of 200 mA, which




across 50 equals 10 Volt during cali-bration, this harness voltage, applied in open loop control will increase at resonance (worst-case) to about 200 300 Volt. Unfortunately, the same holds for closed loop BCI where due to the impedance at the sensor the local voltage may go to high extremes of > 500 Volt, as described earlier.

With the TEM cell test method as described in IEC 62132-2, only the IC itself will be exposed to EM-fields, none of the external components or the sensor front-end will be incorpo-rated in the EM-field, unless the whole application board is applied on the 4 by 4 inch (or 100 x 100 mm) PCB struc-ture as described in IEC 62132-1 [4]. The E-field applied will be RF voltage applied divided by distance between septum to outer enclosure, being 45 mm in a FCC TEM cell; a distance slightly less than the harness height of the BCI/RI test set-up.

When 5 Watt RF power is applied to the IC related TEM cell, terminated by 50 , the inside E-fieldstrength will become 350 V/m, which is more than enough to satisfy the 200 V/m require-ments but hardly enough when all the excessive voltages occurring at reso-nances have to be taken into account.

From figure 5 it can be derived that the maximum induced voltage from a 2 meter harness exposed to 200 Volt/m (in the frequency range 400 1000 MHz) will be 20 Volt when a low impedance termination at the load box is considered. This RF signal level divided by the sensor height above the reference plane of 50 mm yields 400 Volt/m, so slightly over 5 Watt RF power should be enough to satisfy this excessive condition (under the assumption that a large broadband horn antenna will be used rather than a log-per or any other type of antenna structure suitable in that frequency range). When the cable harness ex-posed is characteristic terminated in common-mode at the load box side, the worst case induced voltage reduces by 8 dB (2,5 x) which means that testing with only 160 V/m is enough; quite similar to what is occurring at the BCI/RI sensor position.

The DPI test is typically done by ap-

plying up to 30 dBm on the global pins (those port pins connected to wires leaving the PCB into a cable harness) and up to 12 dBm to the local pins (for those pins connected to local on-board components only). The coupling oc-curs from a 50 source in series with a coupling capacitance of max. 6,8 nF or a value which can still be handled by the circuit connected to. For the

CAN-bus interfaces, these RF voltages requirements have been raised even further to 36 dBm (4 watt; which equals 28 Volt RMS open voltage to an input or 40 Volts peak). Dedicated ESD pro-tection structures need to be defined and special insulation techniques have to be used.

All RF voltages applied to each pin with the DPI tests are referenced to the




common Vss/ground reference layer of the PCB. As such the delta voltages appearing on the PCB application have to be known between the various pins.

V.CONCLUSIONSThe present ISO standards carry many faces by their implementations; open/ closed loop, cable harness length, load box impedances, the grounding of the loading box as well as the DUT, etc., which leads to an ambiguous definition of these test set-ups, yielding severe differences in test results.

The closed loop E-field measure-ment with the RI measurements close to the surface of the conductive table is incorrectly related on incident and ref lective EM-field effects and therefore, together with the antenna chosen poorly correlated with EM-simulations. Also as different kind of antennas are allowed, these do yield differences in test results.

Open loop testing should be re-stricted to electrically floating sensors

and closed loop testing shall apply to electrically grounded applications. The use of the open loop and closed loop testing shall be defined in the BCI stan-dard in relation to how the DUT will be used in its application and not be left to the interpretation of an individual EMC test engineer or specification from a car manufacturer.

As real in-vehicle applications will deviate from the artificial ISO test set-up topologies, over-testing will not guarantee immunity compliance when the ESA/ECU will be integrated into a vehicle. The equivalent ESA/ECU RF common-mode impedance port definitions have to be aligned with the BCI/RI test set-ups or better vice versa, this to achieve comparable test data. Resonances in the test set-ups shall be avoided and equal measures shall be taken at the ESA/ECU ports also to avoid resonances while being integrated into a vehicle.

It is necessary to enforce (by stan-dard) a unified AN (including the load

simulation box) which is encapsulated into one metal box. This box shall be grounded to the reference plane and shall yield a defined CM output imped-ance at the ESA/ECU port of 150 - 200 over the whole frequency range of application rather than 25 (two ANs in parallel) again in parallel to the load box input filter topology in a limited frequency band.

Care shall be taken with the real characteristic common-mode imped-ance occurring in a vehicle which will be around 50 and thus less that the artificial impedances one used with the test set-ups. Changing the cable harness height over the reference plane to achieve 50 could be a better alter-native but will require new evidence building compared to the data gathered over the last 25 years.

The induced RF voltages occurring from the BCI can be forecasted by an analogue circuit simulator for both open and closed loop measurement set-ups for the various application

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conditions of the BCI clamp. When the common mode termination impedances are set to the characteristic imped-ance of the cable harness under these test conditions, the turns ratio of the BCI clamps becomes close to irrelevant.

The root causes for the differences in test results in-between the BCI and RI test set-ups have been described and based on these findings the requirements for a TEM-cell or DPI test set-up can be adapted accordingly. The RF volt-ages induced from both the BCI and RI test set-ups could compare with the TEM cell and DPI test methods under the condition that resonances are avoided and common-mode cable harness impedance requirements are met. Fortunately, these two measures coincide in one action.

When the relations between the BCI/RI and the DPI/TEM- cell test methods become justified, earlier compliance to the requirements can be proven which then shortens development cycles by months and probably will reduce a substantial amount of non-predictable redesigns.

ACKNOWLEDGEMENTThe work carried out is supported by a Dutch Governmental innovation program WBSO, under number: ZT09051042.SO

REFERENCES [1] Commission Directive 2004/104/EC of 14 October 2004 adapt-

ing to technical progress Council Directive 72/245/EEC relating to the radio interference (electromagnetic compatibility) of vehicles and amending Directive 70/156/EEC on the approximation of the laws of the Member States relating to the type-approval of motor vehicles and their trailers (followed by numerous amendments)

[2] ISO 11452-4, Road vehicles - Component test methods for electrical disturbances from narrowband radiated electromagnetic energy - Part 4: Bulk current injection (BCI)

[3] ISO 11452-2, Road vehicles - Component test methods for electrical disturbances from narrowband radiated electromagnetic energy - Part 2: Absorber-lined shielded enclosure

[4] IEC 62132-1, Integrated circuits - Measurement of electro-magnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions

[5] IEC 62132-2, Integrated circuits - Measurement of electro-magnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method

[6] IEC 62132-3, Integrated circuits - Measurement of elec-tromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method

[7] IEC 62132-4, Integrated circuits - Measurement of electro-magnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method

[8] Pignari S.A., Grassi F., Marliani F., Canavero F. G., "Experi-mental characterization of injection probes for bulk current injec-tion," www.ursi.org/Proceedings/ProcGA05/pdf/EA.4(0494).pdf

[9] Crovetti P.S., Fiori F, "A Critical Assessment of the Closed-Loop Bulk Current Injection Immunity Test Performed in Compli-ance With ISO 11452-4," IEEE Transactions on Instrumentation and Measurement, April 2011.

Mart Coenen has more than 30 years of experience in EMC in vari-

ous fields and has published many papers and publications. He has been actively involved in international EMC standardization since 1988 and was awarded with the IEC 1906. He is the former project leader of the standards: IEC 61000-4-6 and IEC 61000-4-2 but has moved his focus towards EMC in integrated circuits. He was the former convenor of IEC TC47A/WG9 and until last year, a member of IEC TC47A/WG2. Coenen is CEO of EMCMCC bv. He can be reached at [email protected]. Hugo Pues is senior development engineer of EMC at Melexis NV. He can be reached at [email protected].

Thierry Bousquet is ASICs Development Engineer EMC at Continental. He can be reached at [email protected]. n

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2012emCtestLaboratoryDirectoryCommonsenseteLLsus that most engineers and designers prefer to use local testing facilities. We have created an easy-to-use directory of labs and their services grouped alphabetically by state and city, so that our readers can identify those labs closest to them. We have endeavored to make this directory as accurate as possible; however, we realize that we have not found every lab or listed every service offered. If you own or work for an EMC test lab and we have missed you or omitted one of your services, please let us know. You can add a listing or update your current listing by logging onto www.interferencetechnology.com and following the easy step-by-step instructions. You can also e-mail your addi-tions, revisions, and suggestions to [email protected].

aLabamaHuntsville EMC Compliance (256) 650-5261

Huntsville NASA Marshall Space Flight Center (256) 544-0694

Huntsville Redstone Technical Test Center (U.S. Army) (256) 876-3556

Huntsville WyleLaboratories (256)837-4411

arizonaFt. Huachuca EPG Blacktail Canyon Test Facility (520) 533-5819

Phoenix Compliance Testing, LLC, aka Flom Test Lab (480) 926-3100

Phoenix Sypris Test & Measurement (602) 395-5911

Scottsdale General Dynamics C4 Systems (480) 441-5321

Tempe Lab-Tech, Inc. (480) 317-0700

tempe nationaltechnicalsystems (480)966-5517

Tucson RMS EMI Laboratory (520) 665-5990

CaLiforniaAgoura Compatible Electronics, Inc. (818) 597-0600

Anaheim EMC TEMPEST Engineering (714) 778-1726

Brea CKC Laboratories, Inc. (714) 993-6112

Brea Compatible Electronics, Inc. (714) 579-0500

Calabasas nationaltechnicalsystems(nts) (800)270-2516

China Lake NAWCWD EMI Lab (760) 939-4669

Chino Robinsons Enterprise (909) 591-3648

Costa Mesa Independent Testing Laboratories, Inc. (714) 662-1011

E. Rancho Dominguez Liberty Bel EMC/EMI Services (310) 537-4235

El Dorado Hills Sanesi Associates (916) 496-1760

elsegundo WyleLaboratories (310)322-1763

Escondido RF Exposure Lab, LLC (760) 737-3131

Fremont CKC Laboratories, Inc. (510) 249-1170

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Fremont Compliance Certification Services (510) 771-1000

Fremont Elliott Laboratories (408) 245-7800

Fremont Elma Electronics, Inc. (510) 656-3400

Fremont EMCE Engineering, Inc. (510) 490-4307

fullerton Dnbengineering,inc. (800)282-1462

fullerton nationaltechnicalsystems(nts) (714)879-6110

Gardena Parker EMC Engineering (910) 823-2345

Garden Grove Semtronics (714) 799-9810

Gilroy Scientific Hardware Systems (408) 848-8868

Irvine 7Layers, Inc. +10949 7166512

Irvine Mitsubishi Digital Electronics America Inc. (949) 465-6206

Irvine Northwest EMC (888) 364-2378

Lake Forest Compatible Electronics, Inc. (949) 587-0400

Lake Forest Intertek Testing Services (949) 448-4100

Los Angeles Field Management Services (323) 937-1562

Los Gatos Pulver Laboratories, Inc. (408) 399-7000

Mariposa CKC Laboratories, Inc. (209) 966-5240

Menlo Park Intertek Testing Services (650) 463-2900

Milpitas CETECOM, Inc. (408) 586-6200

Mountian View Electro Magnetic Test, Inc. (650) 965-4000

Mountain View EMT Labs (650) 965-4000

Mountain View EMC Compliance Management Group (650) 988-0900

Newark Elliott Laboratories (510) 578-3500

North Highlands Northrop Grumman ESL (916) 570-4340

Oakland ITW Richmond Technology (510) 655-1263

Orange G & M Compliance, Inc. (714) 628-1020

Pico Rivera Stork Garwood Laboratories, Inc. (562) 949-2727

Pleasanton MiCOM Labs (925) 462-0304

Pleasanton TV Rheinland of North America (925) 249-91923

Poway APW Electronic Solutions (858) 679-4550

Rancho St. Margarita Aegis Labs, Inc. (949) 454-8295

Redondo Beach Northrop Grumman Space Tech. Sector (310) 812-3162

riverside Dnbengineering,inc. (800)282-1462

Riverside Global Testing (951) 781-4540

Sacramento Northrop-Grumman EM Systems Lab (916) 570-4340

San Clemente Stork Garwood Laboratories, Inc. (949) 361-9189

San Diego Lambda Electronics (619) 575-4400

San Diego NEMKO (858) 755-5525

sanDiego tVsDamerica,inc. (858)678-1400

Santa Clara Montrose Compliance Services, Inc. (408) 247-5715

San Jose ARC Technical Resources, Inc. (408) 263-6486

San Jose ATLAS Compliance & Engineering, Inc. (866) 573-9742

San Jose Safety Engineering Laboratory (408) 544-1890

San Jose Underwriters Laboratories, Inc. (408) 754-6500

ca

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interferencetechnology.com interference technology 29

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San Ramon Electro-Test, Inc. (925) 485-3400

santaClara metLaboratories,inc. (408)748-3585

Santa Clara Montrose Compliance Services, Inc. (408) 247-5715

Sunnyvale Bay Area Compliance Labs. (408) 732-9162

Sunnyvale Elliott Laboratories, Inc. (408) 245-7800

Sunnyvale Sypris Test & Measurement (408) 720-0006

Sunol ITC Engineering Services, Inc. (925) 862-2944

Torrance Lyncole XIT Grounding (310) 214-4000

Trabuco Canyon RFI International (949) 888-1607

unionCity metLaboratories,inc. (510)489-6300

Van Nuys Sypris Test & Measurement (818) 830-9111

CoLoraDoBoulder Ball Aerospace & Technology Corp. (303) 939-4618

Boulder Percept Technology Labs, Inc. (303) 444-7480

Boulder Intertek Testing Services (303) 786-7999

Colorado Springs INTERTest Systems, Inc. (719) 522-1402

Lakewood Electro Magnetic Applications, Inc. (303) 980-0070

Littleton Sypris Test & Measurement (303) 798-2243

Longmont EMC Integrity, Inc. (888) 423-6275

Rollinsville Criterion Technology (303) 258-0100

ConneCtiCutEast Haddam Global Certification Laboratories, Ltd. (860) 873-1451

East Haddam Turnkey OATS Construction, LLC (860) 873-8975

Middletown Product Safety International (860) 344-1651

Milford Harriman Associates (203) 878-3135

Newtown TV Rheinland of North America, Inc. (203) 426-0888

Norwalk Panashield, Inc. (203) 866-5888

Stratford Total Shielding Systems (203) 377-0394

DistriCtofCoLumbiaWashington American European Services, Inc. (202) 337-3214

fLoriDaBoca Raton Advanced Compliance Solutions, Inc. (561) 961-5585

Boca Raton Jaro Components (561) 241-6700

Cocoa Beach Elite Electronic Engineering Company (800) ELITE-11

Dade City Product Safety Engineering, Inc. (352) 588-2209

DadeCity tVsDamerica,inc. (352)588-1033

Jupiter East West Technology Corporation (561) 776-7339

Lake Mary Test Equipment Connection (800) 615-8378

Largo Walshire Labs, LLC (727) 530-8637

Melbourne Rubicom Systems, Division of ACS (321) 951-1710

Newberry Timco Engineering, Inc. (888) 472-2424

Orlando Sypris Test & Measurement (800) 839-4959

Orlando Qualtest, Inc. (407) 313-4230

Palm Bay Harris Corporation EMI/TEMPEST Lab (321) 727-6209



ESD

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City Companyname ContaCt TEMP

EST

GeorGiaAlpharetta EMC Testing Laboratories, Inc. (770) 475-8819

Alpharetta U.S. Technologies, Inc. (770) 740-0717

Buford (Atlanta) Advanced Compliance Solutions, Inc. (770) 831-8048

Lawrenceville Motorola Product Testing Services (770) 338-3795

Peachtree Panasonic Automotive (770) 515-1443

iDaHoPlummer Acme Testing Company (360) 595-2785

iLLinoisAddison Sypris Test & Measurement (630) 620-5800

Downers Grove Elite Electronic Engineering, Inc. (630) 495-9770

Montgomery E.F. Electronics Co. (630) 897-1950

Mundelein Midwest EMI Associates, Inc. (847) 918-9886

Northbrook Underwriters Laboratories, Inc. (847) 272-8800

Palatine Trace LaboratoriesEMC (847) 934-5300

Peoria EMC Testing Inc., A Caterpillar Company (309) 578-1213

Poplar Grove LF Research EMC Design & Test Facility (815) 566-5655

rockford nationaltechnicalsystems(nts) (815)315-9250

Rockford Ingenium Testing, LLC (815) 315-9250

Romeoville Radiometrics Midwest Corp. (815) 293-0772

Wheeling D.L.s.electronicsystems,inc. (847)537-6400

Woodridge Zero Ground LLC (866) ZERO-GND

inDianaCrane Naval Surface Warfare Ctr., Crane Div. (812) 854-5107

Fort Wayne Raytheon (260) 429-4335

Indianapolis Raytheon Technical Services Co., EMI Lab (317) 306-8471

Kokomo Delphi Delco Electronic Systems (765) 451-5011

ioWaKimballton Liberty Labs, Inc. (712) 773-2199

Elk Horn World Cal, Inc. (712) 764-2197

KansasLouisburg Rogers Labs, Inc. (913) 837-3214

KentuCKyLexington Lexmark International EMC Lab (606) 232-7650

Lexington Intertek Testing Services (859) 226-1000

Lexington dBi Corporation (859) 253-1178

maryLanDAnnapolis Northrop Grumman Space & Mission Systems (410) 266-1700

Fl

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TEMP

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ESD

Euro

CEr

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Baltimore metLaboratories,inc. (410)354-3300

Beltsville Antenna Research Associates (301) 937-8888

Columbia DRS Advanced Programs (410) 312-5800

Columbia PCTest Engineering Lab (410) 290-6652

Damascus F-Squared Laboratories (301) 253-4500

Elkridge ATEC Industries, Ltd. (443) 459-5080

Frederick theamericanassociationfor

Laboratoryaccreditation(a2La) (301)644-3217

Gaithersburg Washington Laboratories, Ltd. (301) 216-1500

Hunt Valley Trace LaboratoriesEast (410) 584-9099

Patuxent River Naval Air Warfare Ctr., Aircraft Div. (301) 342-1663

Rockville P.J. Mondin, P.E. Consultants (301) 460-5864

Rockville Spectrum Research & Testing Laboratory, Inc. (301)

TDG11

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Transcript of TDG11