PCB LAYOUT NOTES:

1. Allow clearance for finger sqeeze access from the two sides shown.

2. No tracks or vias in the shaded "KEEP OUT" area.

3. No other track or signal within 0.020" of any contact pad.

4. Do not allow solder paste on the contact pads. It is essential to eliminate any hole in the solder paste-mask (solder stencil) layer. If this is not possible make the contact pads thru-hole with finished hole size of 0.012" or less.

5. To avoid ordering confusion, please specify DNL in your BOM.

6. Leg and alignment holes may be plated and used as vias but ensure minimum finished hole size meets specified tolerances.

0.0935" 0.003 [ 2.3749mm 0.0762]NON-PLATEDTHRU HOLESLEG LATCH HOLES

0.0390" 0.003 [ 0.9906 mm 0.0762]NON-PLATEDTHRU HOLESALIGNMENT PIN HOLES

0.0310" 0.003 [ .7874mm 0.0762]CONDICTIVECONTACT PADSNO SOLDER PASTE

ALLOW A 0.061 x 0.056SQUARE AREA OF CLEARANCE FOR EACH FOOT

FOOTPRINT TO BE LABELED "TC2070-FP" ON LAYOUT / BOM

(SEE NOTE 2. AND SHEET 3FOR VIA EXCEPTIONS)

***Use TC2070-FP (or TC2070-NL-FP) as the PCB “part” name – the cable must not appear on your BOM! Ensure the “part” in the PCB BOM is labelled as “Nothing to Purchase - Do Not Install” otherwise your CM’s will try to buy one cable per PCB assembly!***

TC2070-IDC PLUG-OF-NAILS(TM) CABLEREV DESCRIPTION DATE REV BY

C CORRECTED .225" [5.715mm] LEG SPACING TO .325"[8.255mm]. 12/16/2017 B.EASTMAN

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SHEET 1 OF 3www.TAG-CONNECT.comSCALE 1:5

SIZE FSCM NO. DWG NO.

AREVTC2070-IDCC

[0.04"]1.0mm

(MAX ALLOWABLE COMPONENT HEIGHTUNDER CONNECTOR)

0.13.3 mm

0.12.0 mm

0.26.0 mm

0.13.8 mm

7.5 COMPRESSED LOCATION

0.411.1 mm 0.7

16.5 mm

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14 8

71

2

13

14

END VIEW2x7 0.1" PITCH

IDC CONNECTOR

END VIEW14 PIN

TAG-CONNECT

Note: Dimmensions subject to change.

8"[203.2 mm]

[0.04"]1.0mm

(MAX ALLOWABLE COMPONENT HEIGHTUNDER CONNECTOR)

C TC2070-IDC REV

ADWG NO.FSCM NO.SIZE

2:1SCALE www.TAG-CONNECT.com SHEET 2 OF 3

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Layout Problems to Avoid

OKAY NOT OKAY

Notes:

1) It IS OK to have a conductive via (not filled, not soldermasked) in the center of any of the pads so long as the finished hole is 0.012” or smaller.

2) It’s NOT OK to have a via between two pads without 0.02” between the via and a pad of a different signal.

3) It IS OK to have a small via centered between four pads.

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SHEET 3 OF 3www.TAG-CONNECT.comSCALE 2:1

SIZE FSCM NO. DWG NO.

AREVTC2070-IDCC