System

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System

Overview

Technology

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Established Year 1999

Factory Size 25,000 m2

Employee 1,100

Capacity 60,000 m2/month

Company Profile

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1999

Establish

2001

Nan You Plant

2002

• ISO9001

• UL E232940

2003

• Nan You Plant move to Sha Jing

• 20,000 m2/month

2004

24L Sample

2006

• SongGang Plant

• 40,000 m2/month

• TS16949• 18L MP• HDI • AL PCB

2007 2009 2010 2011

• ISO14001

• 5OZ with UL 32L Sample

• 6oz with UL, 12oz sample

• Rigid-Flex

2014

Start to Manufacture on Q4 for new plant

Milestone

He Shan Plant

2013

JOVE Group

Jove Enterprise Limited(HK Registration)

Shenzhen Jove Enterprise Limited(Headquarter,NanYou)

Shenzhen Jove Enterprise Limited(ShaJing Plant on 2003)

Shenzhen Jove Enterprise LimitedSuzhou Branch (2011)

Shenzhen Jove Enterprise LimitedWuhan Branch (2013)

Shenzhen Jove Enterprise LimitedChengDu Branch (2013)

Shenzhen Jove Enterprise Limited(SongGang Plant on 2006)

Heshan Jove Enterprise Limited(HeShan Plant on 2013)

Jove Group

Group O-chart

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Quality O-chartQualityViceGM

Quality Director

CustomerService

Manager

Plant Quality Manager

QualitySystem Manager

IQC IPQC IPQA FQA MRBPhysical

LabCustomerService

SystemManagement

Shipment

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Annual Operation Plan (Year 2014)

◎ Sales’ goal to 95 millions USD

◎ Quality goal for rate of complaint

≤0.45% by batch,

≤95PPM by quantity;

◎ The rate of total internal scrap: ≤3.4%;

◎ The rate of delivery on time:

≥95% for normal PCB,

100% for VMI PCB.

http://www.eolane.fr/accueil/

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Our Customer

http://aei.com/Default.aspx

http://www.speedy-tech.com.cn/index.aspx

http://www.viessmann.cn/zh

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Market Share

Remark: Statistic data are based on delivery location.

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Sales Turnover

M U

SD

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Marketing Segment

communication

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Product by layer count

2-4L22%

Rigid-Flex10%

6L26%

8L18%

10-12L13%

14-32L11%

One station Service from the three plants after Jiang Men plant starts operation

R&D samples, small volume and quick turn

jobs (High Mix Low Volume)

Quick turn delivery

Prototype quantities: 24 hours to seven days

Production quantities: 3 to 10 daysSha Jing Plant

SongGang Plant

High volume production and high technolog

y pcbs

the most advanced equipments

automation on production folow

informatization on data and recorde controlJiang Men Plant

Low/medium volume production

reliable production

advanced technology

risk predication

excellent service

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R&D samples, small volume and quick turn jobs (High Mix Low Volume)

◎ Capacity: 20,000 square meters/month

◎ R&D samples, small volume (below 5m2) and quick turn jobs

◎ High- mix technology up to 32 layers, HDI and heavy copper thickness

boards to 12 oz

◎ 2000 projects/month

◎ Cam Engineer: 50

Capacity

Mass production

◎ Capacity: 40,000sqm/month

◎ Low/medium volume mass production high-mix technology multilayer

up to 18 layers, HDI and heavy copper thickness to 6 oz

◎ 800 Part No/month

◎ Average 40 square meters/order

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A new factory will be established. ◎ Located on He Shan, Jiang Men city, Guang Dong province, China

◎ Factory area 100,000 square meters

◎ Total Investment: 80 Millions USD

◎ Marketing Direction:

First stage: 2-12 layers mass production

Second stage: focus on HDI, Heavy copper, PTFE, Ceramic,

Rigid-Flex PCB and industry fields

Second stage:

Investment: 50 Millions USD

Capacity: 50K SQM/month

First stage:

Investment: 30 Millions USD

Capacity: 50K SQM/month

Date: Finish factory house on Q3 of 2014

Start to manufacture on Q4 of 2014

2014---2016 Developing Plan

Separate two stages to finish

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Layout Picture of New plant

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Technology

System

Overview

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Technology Roadmap

Item 2014 2015 2016

Multilayer

Rigid PCB 34L 36L 40L

Rigid-flex PCB

12L 14L 16L

Al/Cu metal PCB 4L 8L 8L+

HDI 2+N+2 sample 2+N+2 Low volume 3+N+3 sample

Fine line 3/3mil 2.5/2.5mil 2/2mil

High Heat sink PCB FR4+Al/Cu FR4+Alloy metal FR4+other material

Buried Cu/magnetic Sample Low volume Mass production

Buried capacitor/resistor Sample Low volume Mass production

Heavy copper HDI(4-7OZ) Sample Low volume Mass production

IC substrate Sample Low volume Mass production

Low Dk /High Frequency/ high speed PCB

Sample Low volume Mass production

Mix constructionFR4+Rogers Low volume

FR4+PTFE sampleFR4+PTFE

Low volume

communication & power supply

Frequency conversion

keep current customer, expand

more higher level products

Product develop direction

Market objection

Industrial & Security


Expand to higher level and value added

product, focus on prosperous market in

segmentation

Market objection

Digital communication products


Being pilot solution provider of high

technology Digital communication

products

Market objection

Rigid-Flexible pcb5000 facility being set up in Jiang Men

plant to meet the rapid increasing of

Wearable electronic and Robot

products.


Market objection

Automobile electronic products

Following the trend of electronic and

network in Automotive industry,

choose high technology and high

value-added products.


Market objection

Other market segment

Medical Electronics

Aerospace


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◎ Material: FR-4 (Tg130-170)

ARLON

Rogers

Teflon

Aluminum Based

Polyimide

◎ High layer count (32+ layers)

◎ ROHS & Reach Compliance

◎ Min line/space: 2.5mil/3mil

◎ Min drilling bit 0.15mm, Laser drilling 0.1mm

◎ Back drilling

Supplier Material Type Application

KB KB6160 SS/DS

SHENGYIS1141/S1000/S1000-2 /S1600/S1155

SS/DS/Multilayer

ITEQIT588TC/IT158TC/

IT180TCSS/DS/Multilayer

ISOLA FR406/FR-370HR SS/DS/Multilayer

NELCO N4xxx-13RF-xx SS/DS/Multilayer

Rogers R04350B SS/DS/Multilayer

Bergquist MP06503 SS Al base

Laird T-Lam SS 1KA DS Al/Cu base

Normal material list with UL approval

Products Technology

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Products Technology

◎Surface Treatment:

◇ In-house:

Lead free HAL / OSP / Immersion Ni, Au / Gold finger /

Selected hard gold

◇ Subcontract:

Immersion Silver / Immersion Tin / HAL

◎ Sequential lamination

◎ Buried and blind via and HDI

◎ Heavy Copper PCB’s Up to 6oz with UL,12oz for sample

◎ Controlled Impedance

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Item CapabilityLayer count 32L

Final board thickness 0.3-6mm

Aspect ratio 15:1

Copper thickness 12oz

Impedance Single line +/-8%

Differential line +/-8%

Line/space Inner layer 2.5/2.5mil

Outer layer 3/3mil

Min drill bit

6mil

Hole position tolerance +/-3mil

PTH hole dimension tolerance +/-2mil

NPTH hole dimension tolerance +/-1mil

Solder mask Line to solder PAD 3mil

Registration tolerance +/-1.5mil

Production Capability

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Production Capability

Peel able mask thickness 8-32mil

Carbon ink thickness 0.8-2mil

HAL/LF HAL thicknessSMD:40-2000u”

GND:30-800u”

Immersion Au

Au 1-5u”

Ni 80-200u”

Gold finger thickness 10-50u”

OSP thickness 0.1-0.6um

Immersion Tin 0.8-1.2um

Immersion Ag 0.15-0.45um

Profile Punching +/-4mil

Routing +/-3mil

Lamination Type

FR4(Tg130-170)

Halogen free lamination

Rogers/Teflon/Aluminum base/Polyimide

Product Type---Heavy Copper

Layer: 18LInner/Outer:4ozBoard thickness: 4.0mm

Layer: 4LInner:12oz+1mm Cu baseOuter: 3ozBoard thickness: 2.5mm

Layer: 10LInner/Outer: 6ozBoard thickness: 3.2mm

Layer: 12LInner/Outer: 4ozBoard thickness: 2.85mm

Layer: 14LInner: 3ozOuter: 2ozBoard thickness: 3.3mm

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Product Type---Al base PCB

32Bottom面

TOP面

Rogers +FR4

Product Type---Buried copper & Mix construction

Buried copper Mix construction

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Product Type---Rigid-flex PCB

2L Rigid-flex PCBBoard thickness: 1.6mm



Product Type---Other

16L blind hole PCB 10L HDI PCB/hole size 0.1mm

Semi-flex. PCB14L backplane PCB/size: 664x800mmBoard thickness: 0.7mm

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Back drilling

Product Type---OtherVia plugged by copper paste Via plugged by silver paste

Via plugged by resin

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Base material: ShengYi and ITEQ and Isola and NelcoPTH solution: Rohm & Haas Plating solution: Rohm & Haas SM: Taiyo and GreencureSurface finish: Atotech solution on Immersion Tin Japanese SN100(Sn/Cu/Ni) on LF HASL

Material

MachineMethod

•Add test coupon (Registration and Micro resistance) on production panel to control quality of critical process.•High process control on PTH and plating process. Backlight: one sample every fly bar to inspect Copper thickness: one sample every fly bar to measure

2 automatic coating machines for inner layer1 OPE punching machine before laminate5 CCD parallel exposure machines 1 CCD fuse machine5 Orbotech AOI machines, total 11 AOI.8 lamination machines, including 1 fast press 11 Schmoll drill machines/10 Mania machines, total 29 machines/154 spindles2 X- RAY CM 800 for inspection after drilling2 automatic PTH lines5 automatic plating lines( including VCP)22 CNC routing machines1 Automatic V-CUT machine37 E-testes: 12 flying probes, including 3 micro resistance testers, 18 E-testers, 3automatic E- tester, 6 Hi-pot testers, 2 automatic visual inspection machine on FQC33 automatic horizontal production lines

1 CMI 900 tester/ 2 CMI 700 testers/ 2 CMI 500 testers2 Ionic contamination testers, one is to test NaCl content,

other is to test content of single ionic1 DSC TG tester/1 ROHS tester/2 Hi-pot testers2 Impedance testers/ 2 Peel strength testers1 Temperature and humidity chamber1 Salt-corrosion box1 Reflow soldering machine1 Atom absorption tester

High Reliability Products

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CCD fuse machine

Key Production Equipment

Automatic coating machine CCD parallel expose machine OPE Pin punching machine

X-ray drilling Tooling holeBURKLE Laminate machine

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Automatic plating lineAutomatic PTH line

SCHMOLL drilling machine

Vertical continue plating line(VCP)

Fast laminate machine


Laser drilling machine

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Gold finger line

Alkaline etching line

CCD exposure machine

Print machine for via plug

Immersion Au line


Acid etching line

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AOI

Automatic E-test

Visual inspection machine(AVI)

Fly probe

Line space tester

Key Inspection Equipment

4wires micro-resistance machine

41Reflow machine

Key Reliability Testing Equipment

Ionic contamination Impedance

DSC Tg tester ROHS tester

Temp/Humidity Chamber

Reliability Testing ◎100% E-TEST ◎100% Visual Inspection ◎Outline measurement ◎Micro section ◎Solder ability (245±5ºC; 3-5 sec) ◎Thermal shocking (288±5ºC,10 sec. 3times) ◎Solder mask peeling testing ◎Peeling intensity testing ◎Impedance testing ◎Ionic contamination testing ◎Reflow test ◎DSC Tg tester ◎ROHS ◎Temp& Humidity test

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Technology

System

Overview

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Certificate

System certificate:◎ ISO9001:2008 ◎ ISO14001:2004

◎ TS16949:2009

Product certificate:◎ UL File NO.: E232940

ROHS+REACH Test Reports: ◎ SGS File NO.:CANEC 0905975001 ◎ SGS File NO.:CANEC 0905975002 ◎ SGS File NO.:CANEC 1002801201 ◎ REACH File NO.:GZ1005046849/CHEM ◎ REACH File NO.:GZ1005046850/CHEM

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ISO9001:2008 certificate ISO14001:2004 certificate

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Environment Protection

◎ ISO 14001 Certified◎ Guangdong Environmental Protection Member◎ All control items meet Class 1 of GB SPEC on Waste Water Discharge

Test report From Government

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TS16949:2009 certificate UL certificate

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System Automation

Quotation

Engineering Review For Gerber File

Information System For Quality Control

Management System

Intelligent Quote

Genesis Panelizer Enginex

Quality Information

System

Paradigm

ERP

Main FunctionProcess Flow Software System

• Quotation Automation

• Quotation Track/Analysis

• Gerber File Review Automation

• Panelization Automation

• Match Automation on Plant Capability and Customer specification

• MI Automation and Standard

• Database

• Process Parameter/Production Record/Quality/Maintenance data• Traceability• Quality Data Analysis

• Manage all processes From order to WIP to delivery• Traceability• Database

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Thanks

Jove , your reliable PCB solution provider

System

Documents

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