SUNLORD PROFILE 2017 - Eurotronix Profile...2006 Completed Sunlord Shenzhen Industrial Park 2007...

SunlordEXPERT IN PASSIVE PARTS

SUNLORD PROFILE 2017


Corporate Overview

Year of Establishment: September, 2000 Year of Establishment: September, 2000

Formation: China-HK Joint Company

Number of Employee: 3312 ( By the end of Dec., 2016)

Milestones:

2006 Completed Sunlord Shenzhen Industrial Park

2007 Listed in Shenzhen Stock Exchange ( Stock Code: 002138)

2008 Merged Shenzhen CSG Electronics Co., Ltd ( SNEC) and2008 Merged Shenzhen CSG Electronics Co., Ltd ( SNEC) and

Micro- Electronics Branch, South Huitong Co., Ltd (XEC)

2011 Established Sunlord USA

2014 Start construction of Sunlord Quzhou Industrial Park2014 Start construction of Sunlord Quzhou Industrial Park

2015 Complete the construction of Sunlord Guiyang and Sunlord Dongguan

Industrial Park

2016 E t bli h d A t ti B i U it2016 Established Automotive Business Unit


Sunlord Industrial Park

Guizhou PlantLocation: Dulaying , Guiyang Guizhou, China

Mfg space: 145K ㎡

Shenzhen Plant Location: Guanlan Bao’an, Shenzhen, China

Mfg space: 121K㎡


Sunlord Industrial Park

Dongguan PlantConstruction Area: 91K ㎡

Location: Tangxia , Dongguan Guangdong, China

Quzhou Plant Construction Area: 59K ㎡

Location: Quzhou, Zhejiang, China


Vision and Quality Policy

Vi iVi i

We are committed to become a worldwide leader in the development, manufacture d t t l l ti f i l t i t d ith t t h

VisionVision

and total solutions of passive electronic components armed with top-notch technology and core competitive advantages through endless pursuit of innovation and globalization strategy.

Quality PolicyQuality Policy

To provide top-quality products and perfect services for customers worldwide through standardization, technological innovation and continuous improvement.


Organization Structure

PresidentPresidentSunny ShiSunny Shi

Executive VP Executive VP William LeeWilliam Lee

GM of Multilayer GM of Multilayer BUBUJack Jack ZengZeng

QualityQuality DDirectorirectorJeff WangJeff Wang

Int’l MarketingInt’l MarketingLeon ZhaoLeon Zhao

MarketingMarketing DDirectorirectorLockyLocky LeeLee

Financial Director Financial Director Gary Gary XuXu

GM of GM of Wiring BUWiring BUYabingYabing YangYang Quality Assurance Quality Assurance ProcurementProcurement

YuanfangYuanfang LiuLiuChina Marketing China Marketing

Leon ZhaoLeon ZhaoCChief hief EngineerEngineer

HaiHai GuoGuo

Quality ControlQuality Control InfrastructureInfrastructureYaohuaYaohua WuWu

Administrative Administrative DirectorDirector

GuochengGuocheng HuHu

GM of GM of Automotive BUAutomotive BUJingxinJingxin HuangHuang


2006 – 2016 Annual Sales

Sales Revenues (mil. USD)2006 2016 CAGR 34%2006-2016 CAGR 34%

300

USD

)

192 05202.92

260

250

enue

s (m

il. U

160.45

192.05

150

200

Sales R

eve

4868

83.88

114.61

100

16.23 21.4536.75

48

0

50

2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016


2016 Business Achievement

2016 Revenue: USD260M Business Chart

Sales by ProductSales by Product Sales by ApplicationSales by Application Sales by LocationSales by Location

China, 65%

Wiring49%

Telecom 42%

USA, 13%Japan/Korea, 9%

EMEA, 10%

Others, 3%

49%

MLCI30%

LTCC

Varistor/NTC2%

PCBCeramic

Consumer25%

OthersSpace5%

Industry18%

Automotive6%

LTCC2% Others

3%

PCB5%9%

Ot e s4%


2016 Top 10 Customer Ranking & Dependency

Volume Spend Top 10 Spend: USD 90.34MVolume Spend p p

Top 10 Dependency : 34%

30

USD

)

20

25

Spen

d (m

il.

15

Volume

5

10

0


2015~2020 Capacity Expansion Plan

No. Product Lines Capacity (Million pcs)

2,015 2016 2017 2018 2019 20201 MLCI 55,000 66,000 78000 90,000 115,000 120,0002 Varistor/NTC 6,600 8,200 9500 10,000 11,300 13,000

3 Power Inductor 5,500 6,600 7000 8,500 10,000 11,500

4 Transformer 36 96 300 600 900 1,2005 NFC 30 66 120 145 180 190

6 WW Inductor/CMC 1,300 1,560 1860 2,160 2,400 2,640

7 Fingerprint Identification Cover 0 88 145 160 180 180

8 PCB 48 72 90 120 150 1808 PCB 48 72 90 120 150 1809 Others 6 10 15 25 40 50

Capacity (Million pcs) 68,520 82,692 97,030 111,710 140,150 148,940


Main Product Lines for General

LTCC TechnologyLTCC TechnologyLC FilterLC Filter BalunBalun Balance FilterBalance Filter

InductorInductorPower Inductor RF InductorPower Inductor RF Inductor

Circuit ProtectionCircuit ProtectionV i tV i t ESD S PPTCESD S PPTCLC Filter, LC Filter, BalunBalun, Balance Filter, , Balance Filter,

Diplexer, Diplexer, TriplexerTriplexer, Coupler, Antenna, Coupler, Antenna

Power Inductor, RF Inductor, Power Inductor, RF Inductor, Ferrite InductorFerrite Inductor

VaristorVaristor, ESD Suppressor, PPTC, ESD Suppressor, PPTC

NTCNTC ComponentsComponentsEMC ComponentsEMC Components TransformerTransformerppNTC NTC ThermistorThermistor, ,

NTC Temperature SensorNTC Temperature Sensor

ppBead, Common Mode Filter, Bead, Common Mode Filter, ToroidalToroidal Products Products

Tantalum &Niobium Capacitor Tantalum &Niobium Capacitor

Planar Transformer, EP/EE/EF/RQ Wiring Planar Transformer, EP/EE/EF/RQ Wiring TransformerTransformer


Main Product Lines for General

Wireless ChargingWireless ChargingCoilsCoils

ZirconiaZirconia Ceramic Ceramic ProductProduct

NFC ProductsNFC ProductsNFC Sheet Flexible Antenna MultilayerNFC Sheet Flexible Antenna MultilayerCoilsCoils

QiQi, A4WP, Customized , A4WP, Customized Product Product

Back Cover, Fingerprint Identification CoverBack Cover, Fingerprint Identification CoverNFC Sheet, Flexible Antenna, Multilayer NFC Sheet, Flexible Antenna, Multilayer

AntennaAntenna

PDS AntennaPDS AntennaPCBPCB PDS AntennaPDS AntennaHDI, THHDI, TH


New Products Recommendation

Power Inductor: WPN-U/UF SeriesSize: 2 0*1 6*1 0~2 5*2 0*1 2mm

Large Current Planar Transformer: TPP SeriesSize: Max 66mm*24mm*13mm

Thin Type

Size: 2.0 1.6 1.0~2.5 2.0 1.2mmInductance: 0.12uH~4.7uHRated Current: 1.45~6.5A

High VoltageP I d t

Size: Max. 66mm 24mm 13mmPower: Max. 3200W

Wireless Charging Coil:MQQ Series

for Wearable DevicesHigh VoltagePower Inductor:

WPN252012HS SeriesSize: 2.5mm*2.0mm*1.2mmInductance: 4.7 ~10μHM i lt DC30V

MQQ SeriesSize: 6*6*0.6mm- 30*30mm*3.0mmPower: Max. 4WInductance: 4 ~30 μH

Maximum voltage: DC30V

Assembled Choke Coil: WPZ Series

Large CurrentWPC+NFC Antenna: Size: 88mm*46mmApplication: PhoneWPZ Series

Size: 4*4*4 ~ 15*7*5 mmInductance: 65~ 470nHRated Current: 20~140A

Application: PhoneIC: PN547Read-write Distance: 50mm

Chip Bead: PZ0603D SeriesSize: 0.6mm*0.3mm*0.3mmZ 60 1000 h I 200 500 A

DC Power EMI Filter Module: PFM1209 SeriesSize: 12.1mm*9.1mmAttenuation: 15kHz 1GHz

0201 Size

Z: 60~1000 ohm, Ir: 200~500 mAAttenuation: 15kHz~1GHzRated Current: 10~15A


Application Focus ‐ EV/HEV

Power inductorPower inductor RF inductor

LED LightingInfotainment Keyless EntryTransponder 1D&3D Coil

CAN BUS/EthernetParking Assist SystemCMC

CAN BUS/EthernetTransformer

Parking Assist System

Immobilizer Coil

Immobilizer System Pressure Sensor

A/C& Transmission oilImmobilizer Coil Pressure Sensor

Ultra current Inductor & Transformer

Battery Management SystemWireless Charge Coil

Wireless ChargeHigh Power Transformer & Choke Coil

On Board Charger


Product Development Roadmap

0402 t i i

Downsizing

I d

Large CurrentCapability

3D A t C il

Automotive Grade

Hi h li bilit

LTCCTechnology

M d l f

Module

0402 metric size RF inductor & Bead

Low profile power

Iron powder power inductor

Lightning protection inductor

3D Antenna Coil

Power Inductor

CM Choke

High reliability filter

Coupler

Module for surge protection

EMI filter module for power line p p

inductorp

Large energy chip varistor with small size

Transformer

Wireless Charging Coil

LTCC Substratep

Pressure Sensor

Chip Power NTC Thermistor

Coil


Core Technology -- 125 Patents

100GHz Microwave Dielectric Ceramic Material Composition Technology Zero Shrinkage Sintering TechnologyMaterial Composition Technology

Photoimageable Silver Paste Technology Trench TechnologyPhotoimageable Silver Paste Technology Trench Technology

Green sheet Ag pasteGreen sheet Ag paste


Reliability Standards

C & T lConsumer & Telecom:EIA Standard, IEC60068

Industry:MIL-STD-202G, JEDEC Standard

Space:ESCC StandardESCC Standard

A iAutomotive:AEC-Q200


State-of-the-Art Facilities

Sunlord has established “Sunlord-KEYSIGHT” Electronic Measurement joint laboratory with KEYSIGHT technology corporation expert in electronic measurement .

SEM/EDS, X-Ray Diffractometer, DTA/TG etc.

Material Analysis

, y ,

Tegramin System, X-Ray CT System, Probe Station etc.

Failure Analysis

Thermal Shock Chamber, Pressure Cooker Test Chamber,

Reliability Test

Tegramin System, X Ray CT System, Probe Station etc.

High Acceleration Mechanical Shock Test-Bed etc.

Network Analyzer RF Impedance/Material Analyzer B-H

Electrical Test

Network Analyzer, RF Impedance/Material Analyzer, B H Analyzer etc.

Manufacturing

Laser Drilling Machine, Tube furnace with H2, 3D printer etc.


Certificates

OHSAS18001 ISO14001 QC080000 ISO/TS16949


Customer Base


Sales NetworkSales Network

AsiaGermanyFrance

Japan

N. America

Taiwan

KoreaShanghai

Israel

Silicon Valley

France

Turkey

GuiyangDongguan

Hong KongQuzhou

Beijing

Spain

SingaporeMalaysia

ShenzhenHong Kong

India

Factory

HQSunlord Electronics Co., Ltd.Sunlord Industrial Park Guanlan Da Fu Yuan Office

Rep.

Sunlord Industrial Park, Guanlan Da Fu Yuan, Guan Guang Road, Longhua New District, Shenzhen, China

SUNLORD PROFILE 2017 - Eurotronix Profile...2006 Completed Sunlord Shenzhen Industrial Park 2007...

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