Stobbe LF Barcelona Supply Chain 2005-06-080

8/8/2019 Stobbe LF Barcelona Supply Chain 2005-06-080

1/31

Green Electronics3rd International Conference on Lead-Free ElectronicsBarcelona, June 8, 2005 - p 1 Irina Stobbe

Forschungsschwerpunkt Technologiender Mikroperipherik

Marking of Electronic Components and BoardAssemblies as RoHS Compatible

Information in the Supply Chain and Logistics

Irina Stobbe, Otmar Deubzer, Hansjrg Griese, Herbert Reichl


2/31

Green Electronics3rd International Conference on Lead-Free ElectronicsBarcelona, June 8, 2005 - p 2 Irina Stobbe

Lead-free Labelling / Material Declaration

Labelling itself is NOT a requirement from the RoHS legislative

Why ?

Request in a common standard for marking scheme across the industry, i.e. ina worldwide acceptable solution, which supports the trust in declaration

Ease communication within supply chain at minimum costs

Supporting manufacturing, repair, service (Life Cycle Enhancement)

Supporting material recycling: Announcement of valuable and difficult in

handling materials

Challenges:

Label as small as possible, BUT should contain large amount of information

Higher production and documentation costs, reading effort

Missing comprehensibility for users (uncertainty of how to interpret the labels)

Source: Fujitsu-Siemens


3/31

Green Electronics3rd International Conference on Lead-Free Electronics

Barcelona, June 8, 2005 - p 3 Irina Stobbe

LegislativeRequirements

Market

RoHScompliance

WEEEEcoDesign

User Legis-lation

Process- and Material-orientedRequirements

ReuseServiceSupplychain

Logistics/Quality

Trace-ability

Reco-vering

Supporting decision making on different levels

Requirements to Labelling/Marking?

RemainingLifetime

Recyc-ling


4/31



European Legislative

Directive on Waste Electrical and Electronic Equipment (WEEE) - Producer Responsibility for Take Back of Used Electronics and Recycling Rates Scope: consumer products in 10 categories

Def: Old-old-equipment: no declaration, mostly contains lead

Old equipment: before 2006-07-01 - lead-free declaration for a short time

Directive on the Restriction of the Use of Certain Hazardous Substances in EEE (RoHS) Ban on e.g. Lead, Cr(VI), Hg, Cd in Electronics after July 1, 2006 for 8 from 10 categories from WEEE (subject of changes ) Exemptions are possible and subject of changes (defined in ANNEX, reviewed by TAC)

Directive End of Life of Vehicles (ELV) Bann on Materials and Recycling, (temporarily) exemption for lead

Draft Directive on establishing a framework for EcoDesign of Energy Using Products (EuP) Eco-Design under the umbrella of CE-mark


5/31



No Marking Requirement from RoHS Directive

-Labelling only, if it is explicitly required by directives. That makes necessary thatconformity assessment methods are defined by EU and available.

EU Parliament and Commission have to decide about the commitment requirement

Remain:

Marking should provide convenience, trust !

Rules and definitions like maximum concentration values (MCV) and explanationsshould simplify communication and agreements

Markings about non-existence have a temporarily character:The destination is the restriction of hazardous materials without any exemptions.

Different marking systems are possible, because marking has a temporarilycharacter. Harmonisation is handicapped by different interests of market playersand timelines


6/31



Information for convenience and benefit

Relevant information in the supply chain

Status of technology change processes in the supply chain

Assembly process specification

Component specification (Terminal finish, Maximum processing

temperature, inner materials, MSL) Board specification (other hazardous materials, finishes)

Material data - Information for life cycle, for eco-design / Product

improvement processes Marketing - Functionality

Use phase

Service, Repair, Reuse

Material recycling (WEEE request) Disposal


7/31



Various marking schemes on market

Intertronics (EU)

ZETEX (EU)Future electronics

Schurter

Lattice

Panasonic

Ecliptek

TechSearch InternationalHarwin

C&K components

AEC

examples only

AAT Aston

ANDUS


8/31



Marking schemes : more brand than standard

Lead-free marking:

RoHS marking:

Supertex FairchildBourns

Nu visions

Lattice

SchurterMicro semiconductor

Phoenix ContactNIC Components

Matrix USA Label IDent

examples only


9/31



Technologies for Labelling on Boards

Bar code

Etched in the copper layer

Printed

2D datamatric codelaser etched

Printed label, glued

Printed with branding


10/31



Standards and Technical reports Inter-regional process

JEDEC Standard JESD97, May 2004: Marking, Symbols, and Labels forIdentification of Lead (Pb) Free Assemblies, Components, and Devices

IPC-1066, June 2004: Marking, Symbols and Labels for Identification ofLead-Free and Other Reportable Materials in Lead-Free Assemblies,Components and Devices

JEITA ETR-7021, June 2004; Guidance for the lead-Free Marking ofMaterials, Components and Mounted Boards used in Electronic andElectric Equipment

JEITA ET-7001 (Draft 2005) : The marking for presence and non-presence

of the specified chemical substances in materials, components andmounted boards used in electrical and electronic equipment

EIAJ EDR-7605 (JEITA), Technical Report : Marking guideline of packingfor lead-free semiconductor device (only)

Soldertec- and EFSOT- Questioners, proposals many enterprise specific rules and roadmaps / request in labelling

if compatibility with RoHS and other legal or if lead in it.

IPC-1066 and JEITA ET-7001 now as IEC proposals for world widestandardisation

NEW


11/31



JEITA - Approach

ETR-7021 (2004): Levels of lead-free are defined as phase timeline forreach that

(for components and boards)

Phase 1: contains lead, but lead-free processablePhase 2: Lead-free solder systems and terminationsPhase 3A: No lead in materials at all

(only RoHS exemptions are allowed)

Phase 3: lead-free in all components, solder joints andfinishing materials

ET-7001 (2005): Presence and non-presence, all RoHS materials,no phases !

Materials will be described by their chemical symbol (Pb, Hg, CrVI, Cd,...),alloys by the substances contained or by shortened composition symbols

NEW


12/31



Comparison of Standards or Guidelines (1)

Pb-free means Pb < 0,1wt% in rawmaterials, reference to RoHS,

process ready,

Non-presence means substance < 0,1 (0,01)wt% in the uniform substance or uniformmaterial

Lead-free, Mercury-free,

Tolerance up to maximum concentration

value (MCV) < 0,1 (0,01) wt% in

homogeneous material

Limitation

Without referenceLike RoHS without dataAnnex1, Scope Art. 2 (1)Exemptions

Lead-free per order presumed

SnAgCu A40C5SnZnBi Z80B30

(see IEC 61190-1-3 or ISO 9453)

Phase 1 - LF processable

Phase 2 - LF terminals and solder

Phase 3 3A - RoHS compliance

Phase 4 3 - LF at all

Soldertec/BeCAP

Pb free presumed

IPC : HF =Halogen free

Lead free presumedBoard Substrate

Solder symbol (e1, e2,..) for solder classes

e1 - SnAgCue2 - other SnX, no Bi, no Zne3 - Sne4 - preplated(Ag, Au, NiPd, NiPdAu)e5 - SnZn, SnZnX, no Bie6 - Bie7 - low temp. Solder (only JESD97)

SnAgCu A40C5SnZnBi Z80B30

It displays at the main unit and the wrappingmaterial under the presence/non-presence sign

Solder Material

-

- 2nd level interconnect

-

- Totally Pb-free

No more phases, onlypresence or non-presenceof a (RoHS) substance from Annex I

Lead-free Phases

IPC-1066 / JESD97JEITA ET-7001Category


13/31



Comparison of Standards or Guidelines (2)

Other restrictions like Halogen-free (HF)(only IPC) included

Material declaration makes boards easier torecycle,

all RoHS-Materials

Changes in exemptions are traceable,support to serviceBenefits

For substrates, solder material, conf. finishwith categories

For solder, terminals and board finishes withthe chemical formula

Not required,

Recommended for solder ( z.B. Z80B30) and

finishes

Material

Declaration

Solder symbol

2nd Totallylevel Pb-freeinterc. Label

Presence of other materials from Annex 1(equivalent to RoHS)

[[Hg]], [[(PDPE)]],

>>#7-2006


14/31



Supporting decision making on different levels

Requirements to Labelling/Marking?

LegislativeRequirements

Market

RoHScompliance

User Legis-lation

Process- and Material-orientedRequirements

ReuseServiceSupplychain

Logistics/Quality

Trace-ability

Reco-vering

RemainingLifetime

Recyc-ling

WEEEEcoDesign


15/31



High Level Information: Content

Product identification, e.g. part and serial number, Supplier codeetc

See: Request in new product identifications numbers for transferredproducts in the supply chain logistics

Material content information

refer to IEC DPAS 3/750, 3/2005, Handbook of Material Data

Declaration RoHS materials, Halogens (IEC 61249-2-21), conformal coatings (IPC-

CC-830B)

Solder process and solder material, Maximum safe temperature,

Moisture sensitivity level (MSL) Thermal stress

Reuse Disassembly Repair - Recycling information


16/31



Material Data Declaration : Requirements

Legislation :no explicit requirement, but the legislations like EuP, RoHS, WEEE, ELV,etc trigger the implementation of MDD IEC Working group for PAS

Supply Chain :

Customers request for compliance declaration

Design for Environment (DfE):MDD supports DfE with the existing databases

Material data declaration (MDD):

Negative list e.g. RoHS compliance

Extended negative list e.g. Joint Industry Guide

Averaged positive list e.g. Umbrella Specs of ZVEI

Positive list (Full material data declaration)


17/31



Environmental Screening Requirements

TPI (Toxic Potential Indicator)RPI (Recycling Potential Indicator)ERM (Raw Material extraction energy)

Material data are required in design phase for resource consumption,toxicity assessment and raw material extraction energy calculation

Example screening tool : IZM/EE Toolbox:

Product treematerial declaration (PAS)

...

ProductSub-Part 1.1:93 gMaterial A: 12 gMaterial B: 23 g

Material D: 3 gMaterial E: 49 gMaterial F: 1 g

Product Part 1:122 g

Product:357 g

ProductSub-Part 1.2

Product Part 2

Product treeenvironmental screening

...

ProductSub-Part 1.1:970 indicator pointsMaterial A: 820 ind. ptsMaterial B: 15 ind. pts

Material D: 100 ind. ptsMaterial E: 30 ind. ptsMaterial F: 5 ind. pts

Product Part 1:2,260 indicator points

Product:3,160 indicator points

ProductSub-Part 1.2

Product Part 2Environmental Assessment

Environmental screeningindicators, e.g.

Toxic Potential Indicator:

HazardousSubstancesDeclarations(R-phrases)

AllowableWorkplaceConcentration(MAK)

WaterPollutionClassification(WGK)

Ecological Material Rating(points per mass unit)

Projection on Numerical ScaleandAggregation

0

100

TPI/mass unit

Source: Karsten Schischke


18/31



Traceability

Traceability : A process that has the ability to trace the usage and position of aunit using recorded documents (EN ISO 8402, DIN ISO 9001,2000, 7.5.3)

Which component with which charge number is when and in which product forwhich job and which costumer is built?

Advantages of traceability in the inner supply chain:

Transparent production process

Targeted identification of affected assembly

Reduce cost and time in case of failure

Which environmental effect can be reached with traceability:

Enables material flow management, which can be a part of anenvironment management system (EMS) (that means optimization underenvironment conditions)

Waste flow optimisation reduces cost and impact


19/31



Labelling levels for more effective knowledge

( Low Level Labelling single data: yes or no one sign)

High Level Labelling: labelling, that is not directly visible and understandable It needs extra devices and handlings to get the information. These kind of labelling provide more than one information.

Place of real information storing is inside or outside of theproduct.

Reader

Data matrix

Transponder

Life CycleModules

(Memory,Transponder)

Realisation of storing these data: Data matrix (outsourcing the data) Transponder (RFID) (mostly outsourcing the data) LIM (capturing and storing the data)


20/31



Data matrix

Data matrix: A very area efficient 2D (two dimensional)barcode symbology

Featuring:

1. Storage of special identification number, non-changeable

2. Access to company (Web-) DATABASE in order to get allrequired product information for service or recyclingpurposes (outsourced information)

Finderpattern

Alternatingpattern

Data region

=

A unique perimeter pattern helps the barcode scanner determine the cell locations.


21/31



Transponder/RFID

RFID: A system meant to provide data that is saved in a transponder(tag). Generally, RF ID system consists of a tag, an antenna to supportthe tag, reader (interrogator) that communicate with the tag throughair interface.

Featuring:

1. Storage of material contents in transponder memory

2. Data readout by interested party, e.g. service provider, recycler

3. Data modification possible (after service, )4. Problem: Too expensive and not sufficient memory to represent allmaterial-content information information should be outsourced

Reader

RFIDTag

Datapulse

Energy

Computer


22/31



Using a life cycle information unit (LIU/LIM)

Transportation

Test

Use

Design

Manufacturing

Reuse

&Recycling

LIU

Life Cycle Units are integrated in (electronic) products :

records

&

an

alyzes

supports

improves

Repair, Refurbishment,Predictive Maintenance

supports

SFB 281- gov. funded project


23/31



Use of provided information (Scenarios I)

Recycling processes: Optical recognition of the lead-freesign and separation of higher graded lead-free PWBs:Special treatment before the smelting process for higherrecovery rates of precious and other (Sn) metals.Benefit values not calculated yet.

Recycling: calculation of content of goods receipt instead ofmeasurement (chem. analysis), dismantling rulesBenefit: cost for transponder and memory vs. chem.

Analysis, multiple use for logistics

Repair: Knowledge about solder material and finishes

working temperature, temperature compatibility ofcomponentsBenefit: quality

HF / A40C5 / OSP+


24/31



Use of provided information (Scenarios II)

Service / Reuse: Full material and productinformation provide the possibility of reuse andupgrades including the traceability. Benefit: quality,

time, reuse

DB


25/31



EFSOT Material Declaration outsourcing of information

http://www.efsot-europe.infoInternational project on newgeneration environmentalfriendly soldering technologies

ProjectExample


26/31



EFSOT Material Declaration outsourced info

outsourcedinformation inweb-based

datasheets

P bl D t b t t h t t


27/31



c c

Tantalum MnO2 Silver TBBA Sb2O3 Fe/Ni Sn

Material data variation from different manufacturers vs. USpecsinformation spectrum

Problem: Data may be not accurate enough to supporteco design on a material basis


28/31



Declaration of RoHS compliance

Negative List of selected materials, traces < 0,1 % No more information about environmental hotspots

Reduction of hazardous material in components JIG (List A, B, DQ 2-3 exemplary) , Umbrella Specs (Typical values, averaged, DQ 3-4 exemplary)

Application of material based screening tools for EcoDesign

Full material declaration, data quality better than 3 (includesaveraged data)

Provide a life cycle analysis

Full Material data, Energy data, utilization data, data qualitybetter than 4

(Data quality DQ ranges from 1 (bad) to 5 (excellent) in a systematicSPOLD-alike assessment, can be weighted by mass or by toxicity; workin process )

Which data quality suffice . ?


29/31



Summary (1)

Lead free labelling depends on

Definition of lead-free (limit values and unit)

Lead-free in outer connections or in the inner materials too? (relates

to definition of phase 2 or phase 3) RoHS compliance includes exemptions, which could be changed during

the evaluation processes (... and includes five materials more!)- sign needs explanation

Suggestion: Mark lead-containing components with leadand the number and year of RoHS exemption annex

Lead-free labelling is only for supply chain logistics(Floor shops and other), for marketing it is free, what to use;Declaration of solder system and maximum safe temperature areuseful in service or repair

Pb

#7-2006


30/31



Summary (2)

Real challenges in manufacturer management are to organise theenumeration (P/N) of changed components in all accompanyingdocuments

Qualification of processes, layouts, bills of material, customer relateddocuments, assurance documents.

Kind of enumeration depends on historic grown old numbers, placeand data technology; Very different on manufacturers

ISO 9000 and ISO 14000 support the transfer process

Environment improvement due to labelling is possibleonly if manufacturer organizes traceability andprovides energy or material flow management under

environmental issues


31/31



Thanks for your attention ! Questions ?

Marking of Electronic Components and Board Assemblies as RoHSCompatible Information in the Supply Chain and Logistics

Contact:

[email protected]+49 - 30 - 464 03 156

http://www.efsot-europe.info

IPC-1066 / JESD97 JEITA ET-7001#21/2006

G

A30C5

[[Pb, Hg]]

Stobbe LF Barcelona Supply Chain 2005-06-080

Documents

Transcript of Stobbe LF Barcelona Supply Chain 2005-06-080