STMicro LSM330D 6-Axis MEMS Inertial ModuleC_RM105… · • The LSM330D is a 6-axis MEMS Inertial...

© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LSM330D – 6-Axis MEMS Inertial Module 1

9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France

Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr

August 2012 - Version 1

Written by: Romain FRAUX

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.

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Table of Contents Glossary

1. Overview / Introduction……….……….…………….…........…4 – Executive Summary – Reverse Costing Methodology

2. STMicroelectronics Company Profile……….……....…….....6 – STMicroelectronics Profile – MEMS Inertial Modules Portfolio – LSM330D Characteristics

3. LSM330D Physical Analysis…………...……….............…...13 – Physical Analysis Methodology – LSM330D - Package

Package Characteristics & Markings Package Pin-Out Package Opening

– LSM330D - Accelerometer Accelerometer Cross-section Accelerometer ASIC – Dimensions Accelerometer ASIC – Markings Accelerometer ASIC – Delayering Accelerometer ASIC – Cross-Section Accelerometer MEMS – Dimensions Accelerometer MEMS – Markings Accelerometer MEMS – Bond Pads Opening Accelerometer MEMS – Cap Opening Accelerometer MEMS – Cap Accelerometer MEMS – Sensing Area Accelerometer MEMS – Cross-section

– LSM330D - Gyroscope Gyroscope ASIC – Dimensions Gyroscope ASIC – Markings Gyroscope ASIC – Delayering Gyroscope ASIC – Cross-Section Gyroscope MEMS – Dimensions Gyroscope MEMS – Markings Gyroscope MEMS – Bond Pads Opening Gyroscope MEMS – Cap Opening Gyroscope MEMS – Cap Gyroscope MEMS – Sensing Area Gyroscope MEMS – Cross-section

– ST 3-Axis Accelerometers MEMS Dies Comparison – ST 3-Axis Gyroscopes MEMS Dies Comparison

4. Manufacturing Process Flow…….………………………..…….86 – Global Overview – ASICs Process Flow – Description of the ASICs Wafer Fabrication Unit – MEMSs Process Overview – MEMSs Sensor Process Flow – MEMSs Cap Process Flow – MEMSs Wafer Bonding Process Flow – Description of the MEMSs Wafer Fabrication Unit

5. Cost Analysis………………………….……………………..…..104

– Synthesis of the Cost Analysis – Main Steps of Economic Analysis – Yields Explanation – Yields Hypotheses – Die per wafer & Probe Test – ASIC Front-End : Hypotheses – ASIC Front-End Cost – ASIC Back-End 0 : Probe Test, Backgrinding & Dicing – ASIC Dies Cost – MEMS Front-End : Hypotheses – MEMS Front-End Cost – MEMS Front-End Cost per Process Steps – MEMS Front-End : Equipment Cost per Family – MEMS Front-End : Material Cost per Family – MEMS Back-End 0 : Probe Test & Dicing – MEMS Dies Cost (Front End + Back End 0) – Back-End 1 : Packaging Cost – Back-End 1 : Final test & Calibration Cost – LSM330D Component Cost (FE + BE 0 + BE 1)

6. Estimated Price Analysis….………………….……………......133 – Definition of Prices – Manufacturer Financial Ratios – LSM330D Estimated Manufacturer Price – LSM330D Estimated Selling Price

Contact…….………………………………………...……………….140



Executive Summary

• This full reverse costing study has been conducted to provide insight on technology

data, manufacturing cost and selling price of the STMicroelectronics LSM330D

component.

• The LSM330D is a 6-axis MEMS Inertial Module (3-axis accelerometer + 3-axis

gyroscope) manufactured using a surface micromachining process (THELMA

process).

• They are suitable for further applications (GPS navigation systems, Impact

recognition and logging, Gaming and virtual reality input devices, Motion activated

functions, Intelligent power saving for handheld devices, Vibration monitoring and

compensation, Free-fall detection, 6D orientation detection).

• Compatible with SMD process, the LSM330D is provided in a 3x5.5x1mm LGA 28-pin

package.



Package Characteristics & Markings

• Package type: 28-pin LGA

• Dimensions: 3mm x 5.5mm x 1mm

• Pin pitch: 0.45mm

• Marking:

145

330

Package Top view

Package back view Package side view



ST's Shared dies



Accelerometer MEMS – Cap Opening



Accelerometer MEMS - Cross-Section



Gyroscope ASIC – Cross-Section



Gyroscope MEMS – Bond Pads Opening



MEMS – Cap Opening



ST's 3-Axis Accelerometers MEMS Dies Comparison



Sensor Process Flow (Accelero & Gyro)



Si wafer

• Thinning 300µm

• Isolation oxide (Oxide1) deposit

Si wafer

• Buried Poly (Poly1) deposition

• Ion implantation

• Pattern & etch

Si wafer

• Sacrificial oxide (Oxide 2) deposit

• Pattern & etch

Si wafer

• Structural Layer (Poly 2) deposit

• CMP & ion implant

Sensor Process Flow (Accelero & Gyro) 1/2



ASIC Front-End Cost

Probe Test Cost

Backgrinding & Dicing Cost

• We perform the economic analysis of the ASICs with the IC Price+ software.

• We perform the economic analysis of the MEMSs and the packaging with the MEMS CoSim+ software.

Packaging Cost

Final Test & Calibration Cost

Component Cost

MEMS Front-End Cost

Probe Test Cost

Dicing Cost

Main steps of economic analysis

LSM330D

Back-End 0

Back-End 1

Front-End

Accelerometer Gyroscope

ASIC Front-End Cost

Probe Test Cost

Backgrinding & Dicing Cost

MEMS Front-End Cost

Probe Test Cost

Dicing Cost


http://www.systemplus.fr/index.php?lang=us&page=icprice.php

http://www.systemplus.fr/index.php?lang=us&page=mems-cost.php




ASIC Dies Cost (Front-End + Back-End 0)



LSM330D MEMS Dies Cost (FE + BE 0)



LSM330D Component Cost (FE+BE 0+BE 1)



LSM330D Estimated Selling Price (Medium Yield)


STMicro LSM330D 6-Axis MEMS Inertial ModuleC_RM105… · • The LSM330D is a 6-axis MEMS Inertial...

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