Stevenage Circuits Group · Multi-seat Perfectest for layer registration data Ink jet printer for...

Stevenage Circuits Group

Incorporating:

Stevenage Circuits

Tru-Lon Printed CircuitsMarch 2011

The Organisation

� Stevenage Circuits formed 1971

� Tru-Lon integrated into the Stevenage site March 2011

� Group privately owned

� £11m turnover, potential £15m turnover� £11m turnover, potential £15m turnover

� 150 staff / 70,000 square feet

� 24 / 7 working hours since November 2010

� ~£20m worth equipment

� Dedication to investment

� Full range of products including PTFE processing

Key Staff� Stuart Spink CEO� Mark Brown HR Director� Rob Brown Sales and Marketing Director� David Brown Operations Director� Jeremy Rygate Engineering Director� Rosemary Burt Company Secretary� Rosemary Burt Company Secretary� Tim Gee Operations Manager� Jonathan Calver Process Engineering Manager� Beverley Cording Quality Management Systems Manager� Lee Naylor CAM Supervisor� David Wyllie Sales Manager� David FitzGerald Area Sales Manager� John Wood Area Sales Manager� Alaistar Waddell Area Sales Manager

Key Staff

Continued...

Phil Firth Engineering ManagerPaul Estwick Quality Control ManagerPaul Estwick Quality Control ManagerNeil Butler Internal SalesMarc Holloway IT Manager

Qualifications currently held

� Underwriters Laboratories - UL94V0 (Rigid FR4, Flexi-Rigid, Flexible, Rigid Polyimide)

� BS EN ISO 9001:2008 (Quality System Approval)� ISO14001 (Environmental)� ISO14001 (Environmental)� IPC Class 3 manufacture and test (Int. standard)� COSHH (System of controlling hazardous substances)� CECC/IECQ (BS123000)

� D/S, M/L, Flexis, Flexi Rigid� FR4, Reinforced Polyimide, Flex Polyimide� Blind, buried, laser or mechanically drilled� Variety of finishes

CECC

� Certificates:

CECC (cont)

� Capability

Qualifications currently sought

� IPC Class 3 – formal release May 2011

� AS9100 (Aerospace Approval) March 2011

Investment in 2010 / 2011

� Thin core cut sheet laminator

� Loaders / unloaders (LDI, DES, pre-treat lines)

� Orbotech Discovery AOI

� 5 x Orbotech InCAM Front End systems� 5 x Orbotech InCAM Front End systems

� New Class 10,000 clean room

� ESI Laser drill upgrade

� Effluent plant

� Visper Automatic Final Inspection machine

� Total cost ~ £1.5m

Product sectors

� Military

� Aerospace

� Medical

� Telecoms� Telecoms

� Security

� Entertainment

� Sport

� Domestic

� Automotive

UK, Europe and further

Product mix

Rigid 12-22 Layer

Miscellaneous

PTHPTH

Flexible

Flexi-Rigid

Rigid 4-10 Layer

Examples

� Military� 49,500 holes

� 10 levels blind / buried

� Reinforced polyimide� Reinforced polyimide

� Tg 260 deg C

� 4 oz copper

� Controlled depth rout

� Aerospace� D/S Flexi

� 50 micron blind laser drilled vias in 125 micron pads

Examples (cont)

in 125 micron pads

� Super finish (Ni / Pd / Au)

� Flexible solder resist

� 90 micron track / gap

� Medical Implant -2mm x 1mm laser

routed

4 layer rigid, 2 x blind

Examples (cont)

4 layer rigid, 2 x blind vias

Inserted into capsule, then swallowed

4 layer F/RFlexible O/LTrack height 18 microns100 micron track / gap to +/- 6 micronsAdhesiveless flexiTrack pitch to +/- 12 microns

� Telecoms

Edge plated fingersMicrowave - PTFE alternatives

All laser drilled and LDI4 layer, 1-2, 2-3, 3-4, 1-4 drilling

All laser drilled

Examples (cont)

All laser drilled and LDI.6 layer.

1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling

� Security25 micron PTHs in 50 micron tracks with 50

micron gaps

Examples (cont)

Examples (cont)

� Entertainment

6 layer Flexi - Rigid

Photogragh reproduced kind permission of Active Silicon www.activesilicon.co.ukwho specialise in the design, manufacture and supply of specialist digital imaging products and technologies

� Research

6 layer stepped flexible with 1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling

Examples (cont)

OthersStepped boards

Flying leads

Metal backed PTFE

Special Equipment� 4 x Laser drill - UV YAG� 2 x Laser Direct Image (LDI) – 2 mil Track / Gap and Solder Resist� Auto-align outer layer & solder resist printers� Vacuum and High Temp bonding presses for PTFE� Specialist routers (Tru-Lon) for thick metal backing (Brass, Copper,

Aluminium)� Post etch punches and X-ray drill� Post etch punches and X-ray drill� Permanganate and Plasma desmear / clean� Vacuum laminator� Multi-seat Perfectest for layer registration data� Ink jet printer for serialisation / legend� Resin fill machine� Polar TDR Impedance measurement� Struers microesectioning system (auto-profiling and sectioning)

Special Software

� Genesis 2000 CAM stations (10 licences)� InCAM (5 licences) – latest State of the Art CAM software� Softwires PCP 2000 CIM system dedicated to PCB

manufacture� Lab Wizard for chemical analysis� Lab Wizard for chemical analysis� Track Pro for calibration� Pirana for maintenance� In-house software for Capacity Planning� Polar SI 8000 (Impedance modelling)� InStack (Simultaneous Impedance and Build-up modelling)� Q-Pulse for document control

Genesis 2000 CAM

Controlled Impedance

Laser drillESI 5200 UV YAG

Laser drill microsections

� All laser drilled into reinforced polyimide

Blind vias

Buried via

PTH

Laser drill techniquesIllustrations (c) 2004 Electro Scientific Industries, www.esi.com, used with permission.

Blind holes

Stage 1

Stage 2

Through holes

Laser drill SEMs

Photos (c) 2004 Electro Scientific Industries, www.esi.com, used with permission.

Laser direct imaging (LDI)� Orbotech

Outer Layer and Solder Resist exposure

� Bacher - auto registration

Visper Automatic Final Inspection machine

Class 10,000 clean room (Feb 2011)

Materials� Woven Glass Reinforced (Rigid)

� Standard FR4 (Tg 135°C) incl. Halogen free

� FR4 suitable for lead-free assembly

High Tg FR4� High Tg FR4• Withstands higher temperatures (Tg 175°C and

210ºC)

� Stablcor• Low CTE in X/Y, low weight, high stiffness, high

thermal conductivity

� Polyimide• High Tg of 260 °C, low TCE (z), low Df

Materials

� Suitable for lead-free assembly could be:

� >Tg 150°C (Standard FR4 is 135°C)

� >Td 330 °C (Standard FR4 is 300°C)� >Td 330 °C (Standard FR4 is 300°C)

� >T260 15minutes (Standard FR4 is 4 mins)

� IPC define as IPC 4101B/99, 101, 121, 124, 126, 129

Materials (IPC defined for lead-free)

IPCIPCIPCIPC----4101B4101B4101B4101B 99999999 101101101101 121121121121 124124124124 126126126126 129129129129ANSIANSIANSIANSI FR4 FR4 FR4 FR4 FR4 FR4

Fillers > 5%Fillers > 5%Fillers > 5%Fillers > 5% Yes Yes N/A N/A Yes N/A

TgTgTgTg >150°C >110°C >110°C >150°C >170°C >170°C

TdTdTdTd >325°C >310°C >310°C >325°C >340°C >340°C

CTE 50CTE 50CTE 50CTE 50----260260260260°°°°CCCC <3,5% <4% <4% <3,5% <3,0% <3,0%

T260T260T260T260 >30min >30min >30min >30min >30min >30min

T288T288T288T288 >10min >5min >5min >10min >15min >15min

Materials (cont)

� Random Aramid Reinforcment (Rigid)� Epoxy or polyimide based

� Easily laser ablatable� Easily laser ablatable

� Improved, repeatable dimensional stability

� Ideal for sequential build up (SBU)

� Resin only� e.g. RCC (Resin Coated Copper)

� ideal for laser drilling outer layers

� must be attached to a rigid core

Materials (cont)

� High frequency applications� PTFE

• Optimum frequency range 1-90 GHz• Optimum frequency range 1-90 GHz

• Low Dk ~ 2.3

• Low Df ~ 0.001

• Metal backed

� PTFE alternatives• Optimum frequency range 100MHz - 15GHz

• Dk ~ 3.38 / 3.48

• Df ~ 0.0022 / 0.004

Materials (cont)

� Flexible� Polyimide (Kapton™) base and coverlays

� Epoxy, acryllic, pure polyimide adhesives� Epoxy, acryllic, pure polyimide adhesives

� Single, double sided and multilayer structures

� Thin and low weight

Materials (cont)

� Copper� 2µm - 140µm copper thickness

� Can be used for electrical and thermal � Can be used for electrical and thermal conductivity

� Thick copper can be used for rigidity if placed near outer layers

� Copper / Invar / Copper (used for restraining purposes for TCE matching)

Materials (cont)

� New generation laminates� Hole filling pre-preg with High Tg

� Enhanced Epoxy for Tg > 210 deg C� Enhanced Epoxy for Tg > 210 deg C

� SI glass for optimum signal integrity and precise impedance

� We are constantly examining new materials with our suppliers, who are always prepared to discuss further requirements with our customers

Board types / technologies� M/L up to 24 layers (releasable to BS123000 series)� Sequentially built and Stepped boards� Flexi and flexi rigid� Exotic materials e.g. metal backed PTFE (Copper, Aluminium, Brass)� Buried Resistors using Ohmega-Ply(+/- 15% std, +/-10% special)� Buried Capacitors using 3M’s licence free material� Buried vias (mechanically or laser drilled)� Buried vias (mechanically or laser drilled)� Blind vias (mechanically or laser drilled)� Copper filled blind microvias� Microvias (< 0.15mm diameter)� Resin filled through vias� Laser profiling� Controlled Impedance (+/- 10% std, +/- 5% special)� Edge plated fingers and plated 1/2 holes� Variety of finishes� Embedded fibre optics

Research and Development

� Dedicated Process Engineering Dept.

� Optical Waveguides

� Stretchable PCBs� Stretchable PCBs

� Embedded components

Processes available

� Metalisation by Direct Plate (Shadow) or Electroless� Electrolytic copper plate by Pulse or DC plating� Finishes:

� Ni / Au� Ni / Au� Immersion Tin� HASL (leaded and unleaded subcontract)� Ni / Pd / Au (sub-contract)� Tin / Lead� Silver� Electroplated Hard and Soft Gold

Processes available (cont)�Spray coat green, red and blue solder resist plus other colours available by screen printing�Flexible coverlay

�Laser routed sheet polyimide (or post ablate)�Photoimageable flexible solder resist (brown, black, white)�Photoimageable flexible solder resist (brown, black, white)�Photoimageable dry film

�Extensive conveyorised lines and auto load / unload machines to “de-skill” processes

�Laser structuring (copper pattern and solder resist)

�Complete Engineering back-up from product conception to post delivery

Resin filled vias

Copper filled vias

Copper filled viasExample with stacked vias

Design Rules and Structures� 3 mil track / gap if plated (2 mil track and gap as special)

� 2 mil track / gap if unplated

� 2 mil registration solder resist to copper pattern

� 3 mil minimum webbing solder resist� 3 mil minimum webbing solder resist

� 6 mil PTH to copper track / plane

� 16:1 aspect ratio for PTHs (Thickness : Finished Hole Size)

� 1:1 aspect ratio for blind holes (Thickness : FHS)

� Buried resistors (+/- 15% std, +/-10% special or in parallel)

� Controlled Impedance (+/- 10% std, +/- 5% special)

Copper feature to be at least Layer 0.175mm away from drilled hole

1 Track (75 micron)

2

3

4

5

Standard PTH technology

6

7

8

Pad size at least 0.20mm bigger than drilled hole

Drilled hole diameter 0.15mm minimum.Finished Hole Size (FHS) 0.1mm less.

Aspect ratio (thickness : FHS) 16:1 maximum.

PTH Laser drilled blind vias 1-2, 7-8

Layer Capture pad size to be at least 0.20mm more than drilled hole

Target pads can be 0.2mm diameter1 for 0.1mm hole

2

3

4

Laser drilled blind vias

5

6

7

8

Target pad size to be at least 0.1mm more than drilled hole

Laser vias can exit to surface mount padson outer layers, with very little solder loss. Drill diameter 0.025mm - 0.2mm (0.1mm - 0.15mm typi cal)

Aspect ratio 1:1 max after plating

PTH Buried vias 2-3, 6-7

Layer Pad size to be at least 0.25mm more than drilled hole

1

2

3

4

Buried vias

5

6

7

8

Drilled hole diameter 0.025 - 0.2mmCan be laser drilled

Aspect ratio 16:1 maximum

L a s e r b l in d s e q u e n t ia l b o n d

Buried PTH Laser drilled blind hole 1-2, 7-8(resin filled) as described earlier

Layer

1

2

3

4

Buried PTH Laser drilled blind hole 1-2, 7-8(resin filled) as described earlier

Layer

1

2

3

4

5

Laser blind sequential bond

4

5

6

7

8

PTHs from 1-8 are optional.If not required, outer layers can contain only surf ace mount padsAll vias must exit to pads, so 2-7 holes must have pads on 2 and 7

6

7

8

PTHs from 1-8 are optional.If not required, outer layers can contain only surf ace mount padsAll vias must exit to pads, so 2-7 holes must have pads on 2 and 7

PTH Blind vias 1-4, 5-8Layer

1

2

3

4

5

Blind sequential bond

5

6

7

8

"Double multilayer" with blind holes filling and pl ating overAll vias must exit to pads, so 1-4 and 5-8 holes mu st have pads on 4 and 5

Double laser blind sequential (2 bonds):

Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8

Layer

1

2

3

4

5

6

7

8

D o u b l e l a s e r b l in d s e q u e n t ia l


Layer

1

2

3

4


Layer

1

2

3

4

Double laser blind sequential (3 bonds)

4

5

6

7

8

Etc………

5

6

7

8

Etc………

1 ) L a min a t e a s s u p p l ie d b y ma n u f a c t u r e r

CopperFR4Copper

How a PCB is made…..

2 ) C o a t l a min a t e w i t h p h o t o r e s is t

PhotoresistCopperFR4CopperPhotoresist

3 ) P in t o o l e d n e g a t iv e in n e r l a y e r f i l mFilm


Film

What is clear will end up copper e.g. pads and tracks

4 ) Ex p o s e w i t h U V l ig h t

Film


Film

5 ) R e mo v e f i l m a n d d e v e l o po f f u n e x p o s e d r e s is t


6 ) E t c h o f f c o p p e r n o t p r o t e c t e d b y r e s is t


7 ) S t r ip o f f p h o t o r e s is t

CopperFR4Copper

….. to get an etched inner layer pair e.g. layers 2/3

8 ) B o n d l a y e r s t o f o r m 6 l a y e r b o a r dCopper foil 1

Pre-pregCopper 2LaminateCopper 3Pre-pregCopper 4LaminateCopper 5Pre-pregCopper foil 6

Full copper foil on outer layers

9) Drill and Permanganate DesmearCopper foil 1


1 0 ) D i r e c t me t a l is a t io n p r o c e s sCopper foil 1


Conductive graphite added (only remains on non copper)

1 1 ) C o a t w i t h p h o t o r e s is t

PhotoresistCopper foil 1

Pre-pregCopper 2LaminateCopper 3Pre-pregCopper 4LaminateCopper 5Pre-pregCopper foil 6Photoresist

1 2 ) P in t o o l e d p o s i t i v e o u t e r l a y e r f i l m

Film



FilmWhat is black will end up copper e.g. pads and tracks

1 3 ) Ex p o s e w i t h U V l ig h t

Film



Film

1 4 ) R e mo v e f i l m a n d d e v e l o po f f u n e x p o s e d r e s is t



1 5 ) E l e c t r o p l a t e c o p p e r a n d t inPlated tin

Plated copperCopper foil 1

Pre-pregCopper 2LaminateCopper 3Pre-pregCopper 4LaminateCopper 5Pre-pregCopper foil 6Plated copper

Plated tin

1 6 ) S t r ip o f f p h o t o r e s is t



1 7 ) E t c h a w a y c o p p e r n o t p r o t e c t e d b y t in



1 8 ) S t r ip t in



….. and we have a working PCB!

1 9 ) C o a t w i t h s o l d e r r e s is t

Solder resistCopper 1

Pre-pregCopper 2LaminateCopper 3Pre-pregCopper 4LaminateCopper 5Pre-pregCopper 6Solder resist

2 0 ) P in t o o l e d p o s i t iv e s o l d e r r e s is t f i l mFilm



Film

2 1 ) Ex p o s e w i t h U V l ig h t

Film



Film

2 2 ) R e mo v e f i l m a n d d e v e l o po f f u n e x p o s e d r e s is t



2 3 ) A d d f in is h (e .g . N i / A u ) t o e x p o s e d c o p p e rSurface mount pad

Nickel / Gold

Solder resist

Copper 1

Pre-pregCopper 2LaminateCopper 3Copper 3Pre-pregCopper 4LaminateCopper 5Pre-pregCopper 6

Solder resist

Leaded component pad / via

Thank you for the interest shown

� For further information please:

� Visit our website www.stevenagecircuits.co.uk

� Email:� Email:� [email protected]

� [email protected]

� Phone:� 01438 751800 (Stevenage Circuits)

� 01763 248922 (Tru-Lon)

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